Brain electrode device and preparation method thereof

Abstract

The invention discloses a brain electrode device and a preparation method thereof.The brain electrode device comprises a signal processing structure and a brain electrode structure, the signal processing structure is connected with the brain electrode structure, the brain electrode structure is used for collecting brain electrical signals, and the signal processing structure comprises a circuit board and a flexible connection structure; the output end of the flexible connection structure is detachably connected with the circuit board, the input end of the flexible connection structure is electrically connected with the brain electrode structure, the circuit board forms at least one U-shaped structure, and the flexible connection structure is folded. According to the embodiment of the invention, in the signal processing structure of the brain electrode device, the space occupation of the signal processing structure in the brain electrode device can be reduced by forming the folded circuit board of at least one U-shaped structure and the folded flexible connection structure, so that the internal structure layout of the brain electrode device is compact, and the reliability of the brain electrode device is improved. The size of the device is reduced, and carrying inconvenience caused by overlarge size is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of brain electrodes, and in particular to a brain electrode device and a preparation method thereof. Background Art

[0002] Brain-computer interface is a multidisciplinary cross-technology involving neuroscience, signal detection and signal processing. It has important research significance and huge application potential in the fields of biomedicine, neurorehabilitation and intelligent robots. It establishes a direct communication and control channel between the human brain and a computer or other electronic device, collects EEG signals from the cerebral cortex, and converts them into signals that can be recognized by the computer through amplification, filtering, A / D conversion and other processing. Then, the signal is pre-processed to extract characteristic signals, and these characteristics are used for pattern recognition. Finally, they are converted into specific instructions to control external devices to achieve control of external devices. In order to reduce the harm of the wound to the patient and avoid infection caused by the long-term implantation of the brain-computer interface, a semi-implantable brain-computer interface can be used, but the current brain-computer interface is large in size and not convenient for the implantee to carry. Summary of the invention

[0003] In view of the above problems in the prior art, the present invention discloses a brain electrode device and a preparation method thereof, which can reduce the space occupied by the circuit board and the flexible connection structure in the brain electrode device, thereby making the internal layout of the brain electrode device compact and reducing the volume of the device. The technical solution disclosed in the present invention is as follows:

[0004] According to one aspect of the disclosed embodiment of the present invention, there is provided a brain electrode device, the brain electrode device comprising a signal processing structure and a brain electrode structure, the signal processing structure is connected to the brain electrode structure, and the brain electrode structure is used to collect brain electrical signals;

[0005] The signal processing structure includes a circuit board and a flexible connection structure, the output end of the flexible connection structure is detachably connected to the circuit board, the input end of the flexible connection structure is electrically connected to the brain electrode structure, the circuit board forms at least one U-shaped structure, and the flexible connection structure is folded.

[0006] Optionally, the circuit board includes a signal transmission circuit board, at least two signal processing circuit boards and at least two flexible circuit boards, the at least two signal processing circuit boards are arranged relative to each other, the signal transmission circuit board and the at least two signal processing circuit boards are folded to form at least one U-shaped structure, the output end of the flexible connection structure and the at least two signal processing circuit boards are detachably connected, and the signal transmission circuit board is electrically connected to the at least two signal processing circuit boards through the at least two flexible circuit boards; each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the EEG signal.

[0007] Optionally, the at least two signal processing circuit boards include a first signal processing circuit board and a second signal processing circuit board, the first signal processing circuit board and the second signal processing circuit board are arranged opposite to each other on both sides of the signal transmission circuit board, and the output end of the flexible connection structure and the target signal processing circuit board are detachably connected; the target signal processing circuit board is the first signal processing circuit board or the second signal processing circuit board.

[0008] Optionally, each of the signal processing circuit boards is provided with a first transmission interface, the output end of the flexible connection structure is provided with a second transmission interface, and the signal transmission circuit board is provided with a third transmission interface, the output end of the flexible connection structure is detachably connected to the target signal processing circuit board through the second transmission interface and the first transmission interface, and the signal transmission circuit board is communicatively connected to an external analysis device through the third transmission interface;

[0009] The target signal processing circuit board is any one of the at least two signal processing circuit boards.

[0010] Optionally, the brain electrode structure includes a fixed structure and a contact electrode structure, the input end of the flexible connection structure is fixedly connected to the fixed structure, the contact electrode structure is in contact with the cerebral cortex to collect the brain electrical signal, and the fixed structure is electrically connected to the contact electrode structure;

[0011] The contact electrode structure includes a plurality of sub-contact electrode structures, and through holes are arranged between adjacent sub-contact electrode structures.

[0012] Optionally, the brain electrode device further comprises a shell and a supporting structure, the signal processing structure is arranged in the shell through the supporting structure, and one end of the shell is fixedly connected to the skull;

[0013] The shell and the skull form a closed space, and the signal processing structure and the brain electrode structure are arranged in the closed space; the shell is filled with adhesive.

[0014] Optionally, the shell includes a fixed base and a cover body, the fixed base is fixedly connected to the skull, and the fixed base and the cover body are detachably connected;

[0015] The fixed base includes a first part, a second part and a fixing part, the fixing part is fixedly connected to the skull, the second part is detachably connected to the cover body, the first part is located between the second part and the fixing part and close to the fixing part, and the cross-sectional area of ​​the first part is smaller than that of the second part.

[0016] Optionally, an opening is provided at the bottom of the shell, and the brain electrode structure passes through the opening; the brain electrode structure includes a fixing structure and a contact electrode structure, the fixing structure is arranged inside the shell, and the contact electrode structure is arranged outside the shell; the opening is filled with cured silicone.

[0017] According to another aspect of the disclosed embodiment of the present invention, a method for preparing the above-mentioned brain electrode device is provided, wherein the brain electrode device further comprises a shell, the bottom of the shell is provided with an opening, the brain electrode structure comprises a fixing structure and a contact electrode structure, and the method comprises:

[0018] Prepare the brain electrode structure, which is used to collect brain electrical signals;

[0019] connecting the signal processing structure to the fixed structure, the contact electrode structure extending from the opening;

[0020] Preparation of curing silicone and adhesives;

[0021] The opening is sealed by using the cured silicone to obtain a sealed brain electrode device;

[0022] The adhesive is injected into the sealed brain electrode device and then cured.

[0023] Optionally, injecting the adhesive into the sealed brain electrode device and performing a curing process includes:

[0024] Activating the brain electrode device;

[0025] The adhesive is injected into the activated brain electrode device, and then vacuumed and cured.

[0026] The brain electrode device and the preparation method thereof provided by the present invention have the following technical effects:

[0027] The brain electrode device provided by the present invention includes a signal processing structure and a brain electrode structure, the signal processing structure and the brain electrode structure are connected, and the brain electrode structure is used to collect brain electrical signals; the signal processing structure includes a circuit board and a flexible connection structure, the output end of the flexible connection structure and the circuit board are detachably connected, the input end of the flexible connection structure and the brain electrode structure are electrically connected, the circuit board forms at least one U-shaped structure, and the flexible connection structure is folded. Therefore, in the signal processing structure of the brain electrode device, the space occupied by the signal processing structure in the brain electrode device can be reduced by the circuit board with at least one U-shaped structure and the flexible connection structure with a folded arrangement, so that the internal structure layout of the brain electrode device is compact, the volume of the device is reduced, and the volume is too large to be convenient for carrying.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a schematic diagram of a disassembled structure of a brain electrode device according to an exemplary embodiment;

[0031] Figure 2 is a schematic diagram of a signal processing structure according to an exemplary embodiment;

[0032] Figure 3 is a flattened schematic diagram of a circuit board structure according to an exemplary embodiment;

[0033] Figure 4 is a schematic diagram of a folding circuit board structure according to an exemplary embodiment;

[0034] Figure 5 is a schematic diagram of a flexible connection structure according to an exemplary embodiment;

[0035] Figure 6 is a schematic folding diagram of another circuit board structure according to an exemplary embodiment;

[0036] Figure 7 is a schematic diagram of a brain electrode structure according to an exemplary embodiment;

[0037] Figure 8 is a schematic diagram of an assembly structure of a signal processing structure and a brain electrode structure according to an exemplary embodiment;

[0038] Fig. 9 is a schematic diagram of a brain electrode device according to an exemplary embodiment;

[0039] Fig.10 is a bottom view schematic diagram of a brain electrode device according to an exemplary embodiment;

[0040] Among them, the figure markings are as follows: 1-signal processing structure; 2-circuit board; 21-first signal processing circuit board; 22-second signal processing circuit board; 23-flexible circuit board; 24-first transmission interface; 25-signal transmission circuit board; 26-third transmission interface; 27-amplifier chip; 28-reference line; 29-third signal processing circuit board; 3-flexible connection structure; 31-input end; 32-output end; 33-second transmission interface; 4-brain electrode structure; 41-fixing structure; 42-contact electrode structure; 43-through hole; 5-shell; 51-fixed base; 52-cover; 53-first part; 54-second part; 55-fixed part; 56-opening; 57-baffle; 6-support structure. DETAILED DESCRIPTION

[0041] In order to enable ordinary persons in the art to better understand the technical solutions disclosed in the present invention, the technical solutions in the embodiments disclosed in the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary persons in the art without making creative work are within the scope of protection of the present invention.

[0042] It should be noted that the "one embodiment" or "embodiment" referred to in the description of the embodiment of the present invention refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present application. It should be understood that in the description and claims of the embodiment of the present application and the above-mentioned drawings, the orientation or position relationship indicated by the terms "upper", "lower", "top", "bottom", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments disclosed in the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or device.

[0043] See also Figure 1 , Figure 1 is a schematic diagram of a disassembled structure of a brain electrode device according to an exemplary embodiment. Figure 1As shown, the brain electrode device includes a signal processing structure 1 and a brain electrode structure 4, the signal processing structure 1 and the brain electrode structure 4 are connected, and the brain electrode structure 4 is used to collect brain electrical signals; the signal processing structure 1 includes a circuit board 2 and a flexible connection structure 3, the output end 32 of the flexible connection structure 3 and the circuit board 2 are detachably connected, the input end 31 of the flexible connection structure 3 and the brain electrode structure 4 are electrically connected, the circuit board 2 forms at least one U-shaped structure, and the flexible connection structure 3 is folded.

[0044] In a specific embodiment, the brain electrode device can collect brain electrical signals through the brain electrode structure 4, and transmit and process the brain electrical signals through the signal processing structure 1, and then transmit the processed brain electrical signals to an external device (such as an analysis and display device, etc.) for corresponding processing. Specifically, the brain electrode device can be semi-implanted, and part of the brain electrode structure 4 is implanted to collect brain electrical signals, and the signal processing structure 1 can be fixed on the skull to process the brain electrical signals accordingly. The flexible connection structure 3 can be a flexible printed circuit (FPC), and the input end 31 of the flexible connection structure 3 and the brain electrode structure 4 are electrically connected by welding. Correspondingly, the connection part between the input end 31 of the flexible connection structure 3 and the brain electrode structure 4 can be a pad, which can be specifically welded by a flip-chip welding process using solder paste. A plurality of array solder joints can be provided on the pad, a plurality of array electrode points can be provided on the brain electrode structure 4, and a plurality of lines can be provided on the circuit board 2, and the solder joints, electrode points and lines correspond to each other.

[0045] Specifically, the circuit board 2 forms at least one U-shaped structure, that is, the circuit board 2 is folded in the brain electrode device, and the flexible connection structure 3 is folded, so that the space occupied by the signal processing structure 1 in the brain electrode device can be reduced, and the occupied space of the brain electrode device can be reduced while ensuring a high number of channels. Figure 5 The flexible connection structure 3 is foldable in the vertical and horizontal directions, and the output end 32 of the flexible connection structure 3 is detachably connected to the circuit board 2. The circuit board 2 can be replaced by pulling out the folded flexible connection structure 3 from the brain electrode device.

[0046] Optional, such as Figure 2-4As shown, the above-mentioned circuit board 2 includes a signal transmission circuit board 25, at least two signal processing circuit boards and at least two flexible circuit boards 23. The at least two signal processing circuit boards are arranged relatively to each other. The signal transmission circuit board 25 and the at least two signal processing circuit boards are folded to form at least one U-shaped structure. The output end 32 of the flexible connection structure 3 and the at least two signal processing circuit boards are detachably connected. The signal transmission circuit board 25 is electrically connected to the at least two signal processing circuit boards through the at least two flexible circuit boards 23, and the signal transmission circuit board 25 can also be electrically connected through the flexible circuit boards 23; each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the EEG signal.

[0047] In a specific embodiment, the circuit board 2 may include one or more signal transmission circuit boards 25. Specifically, at least two signal processing circuit boards are arranged opposite to each other on both sides of the corresponding signal transmission circuit board 25. Each signal processing circuit board corresponds to a flexible circuit board 23. Each signal processing circuit board is connected to the corresponding signal transmission circuit board 25 through the corresponding flexible circuit board 23 to form a U-shaped structure. Optionally, multiple signal processing circuit boards can be connected through one signal transmission circuit board 25 and multiple flexible circuit boards, and multiple U-shaped structure circuit boards can be stacked by connecting multiple signal transmission circuit boards 25.

[0048] Optional, such as Figure 2-5 As shown, each signal processing circuit board is provided with a first transmission interface 24, the output end 32 of the flexible connection structure 3 is provided with a second transmission interface 33, and the signal transmission circuit board 25 is provided with a third transmission interface 26. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board through the second transmission interface 33 and the first transmission interface 24, and the signal transmission circuit board 25 is communicatively connected with an external analysis device through the third transmission interface 26; the target signal processing circuit board is any one of the at least two signal processing circuit boards.

[0049] In a specific embodiment, the flexible circuit board 23 is bent so that the signal transmission circuit board 25 and each signal processing circuit board are arranged in an L shape. The first transmission interface 24 and the amplifier chip 27 can be respectively arranged on both sides of each signal processing circuit board, and the first transmission interface 24 and the amplifier chip 27 are arranged correspondingly. Specifically, the first transmission interface 24 can be arranged on one side of the signal processing circuit board facing the signal transmission circuit board 25, and the amplifier chip 27 is arranged on the other side.

[0050] Specifically, the output end 32 of the flexible connection structure 3 can be detachably connected to any signal processing circuit board, and the detachable connection between any signal processing circuit board and the flexible connection structure 3 is realized by plugging the first transmission interface 24 and the second transmission interface 33. The flexible connection structure 3 has an L-shaped structure as a whole, and the output end 32 of the flexible connection structure 3 is folded so that the second transmission interface 33 is arranged opposite to each other, so as to be correspondingly engaged with the third transmission interface 26 of the signal processing circuit board, and the first transmission interface 24 on the signal processing circuit board and the second transmission interface 33 on the flexible connection structure 3 are arranged one by one. The signal transmission circuit board 25 is connected to the external device through the third transmission interface 26 to transmit the EEG signal processed by the signal processing circuit board to the external device. Specifically, the first transmission interface 24 and the second transmission interface 33 can be Molex interfaces, and the third transmission interface 26 can be an HDMI interface.

[0051] In some embodiments, Figure 4 As shown, the at least two signal processing circuit boards include a first signal processing circuit board 21 and a second signal processing circuit board 22. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 through corresponding flexible circuit boards 23 respectively. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite to each other on both sides of the signal transmission circuit board 25. The output end 32 of the flexible connection structure 3 and the target signal processing circuit board are detachably connected; the target signal processing circuit board is the first signal processing circuit board 21 or the second signal processing circuit board 22.

[0052] Specifically, a U-shaped structure is formed between each signal processing circuit board and the signal transmission circuit board 25 by bending the flexible circuit board 23. The two signal processing circuit boards are arranged opposite to each other on both sides of the signal transmission circuit board 25. The first transmission interface 24 can be respectively arranged on the opposite sides of the two signal processing circuit boards, and the amplifier chip 27 is respectively arranged on the other side. The output end 32 of the flexible connection structure 3 can be detachably connected to one of the signal processing circuit boards through the first transmission interface 24 and the second transmission interface 33.

[0053] In some embodiments, Figure 6As shown, the at least two signal processing circuit boards include a first signal processing circuit board 21, a second signal processing circuit board 22 and a third signal processing circuit board 29. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 through the flexible circuit board 23, respectively. The third signal processing circuit board 29 is electrically connected to the first signal processing circuit board 21 through the flexible circuit board 23. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite to each other on both sides of the signal transmission circuit board 25. The third signal processing circuit board 29 is located between the first signal processing circuit board 21 and the second signal processing circuit board 22, and is arranged parallel to the first signal processing circuit board 21 and the second signal processing circuit board 22. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board; the target signal processing circuit board is the first signal processing circuit board 21 or the second signal processing circuit board 22 or the third signal processing circuit board 29.

[0054] Specifically, the signal transmission circuit board 25 is folded with the first signal processing circuit board 21 and the second signal processing circuit board 22 through the connection of the flexible circuit board 23 to form a U-shaped structure, and the third signal processing circuit board 29 is connected with the first signal processing circuit board 21 through the connection of the flexible circuit board 23 to form a U-shaped structure, and the number of the second transmission interfaces 33 on the flexible connection structure 3 can be set accordingly according to the number of signal processing circuit boards. Optionally, the third signal processing circuit board 29 can also be electrically connected to the second signal processing circuit board 22 through the flexible circuit board 23.

[0055] In the above embodiment, when the channel demand is higher, more signal processing circuit boards and interfaces need to be added. Without increasing the size of a single signal processing circuit board (for example, two amplifier chips are arranged on one processing circuit board), the added signal processing circuit board 29 is further folded and arranged end to end through a flexible circuit board 23, and is folded and arranged between two signal processing circuit boards 21 and 22 connected to the signal transmission circuit board 25 and arranged opposite to each other, so as to save space and avoid major design changes to the existing circuit board structure.

[0056] In an optional embodiment, if Figure 7 As shown, the brain electrode structure 4 includes a fixed structure 41 and a contact electrode structure 42. The input end 31 of the flexible connection structure 3 is fixedly connected to the fixed structure 41. The contact electrode structure 42 contacts the cerebral cortex in the skull to collect brain electrical signals. The fixed structure 41 and the contact electrode structure 42 are electrically connected. The contact electrode structure 42 includes a plurality of sub-contact electrode structures, and through holes 43 are provided between adjacent sub-contact electrode structures.

[0057] Specifically, the fixed structure 41 may be a pad, which is flip-chip welded to the input end 31 of the flexible connection structure 3. Each sub-contact electrode structure 42 may be a flexible electrode point. The pad includes a plurality of solder points. Each sub-contact electrode structure corresponds to a solder point one by one and corresponds to a signal channel in the circuit board 2. Each sub-contact electrode structure is electrically connected to the corresponding solder point by flip-chip welding with the aid of solder paste. The plurality of sub-contact electrode structures are distributed in an array, and through holes 43 may be provided between adjacent flexible electrode points, which can increase the adhesion between the contact electrode structure 42 and the cerebral cortex and facilitate the discharge of brain fluid under the cerebral cortex.

[0058] In an optional embodiment, if Figure 1 and Figure 9-10 As shown, the brain electrode device also includes a shell 5 and a supporting structure 6. The signal processing structure 1 is arranged in the shell 5 through the supporting structure 6. One end of the shell 5 is fixedly connected to the skull. The shell 5 and the skull form a closed space. The signal processing structure 1 and the brain electrode structure 4 are arranged in the closed space. The shell 5 is filled with adhesive.

[0059] Specifically, the shell 5 may be a metal shell 5, and the metal material may be titanium, etc. The signal processing structure 1 may be disposed in the shell 5, and the support structure 6 may be used to stably dispose the signal processing structure 1 in the shell 5, for example, vertically. The support structure 6 may include an upper and lower support structure 6, which are respectively connected to both ends of the signal processing structure 1 in the vertical direction, so that the signal processing structure 1 is stably disposed in the shell 5. One end of the shell 5 and the skull may be fixedly connected by a fastener, and specifically, the fastener may include but is not limited to a screw.

[0060] In the above embodiment, by providing a sealed shell 5, the brain electrode structure 4 can be placed in a closed space, thereby avoiding environmental contamination of the brain and improving the reliability of the brain electrode device.

[0061] Specifically, the ground wire on the circuit board 2 can be connected to the housing 5, and the reference wire 28 is led out from the housing 5. During use, the reference wire 28 is connected to the dura mater.

[0062] Optional, such as Fig.10 As shown, the bottom of the housing 5 is provided with an opening 56, and the brain electrode structure 4 passes through the opening 56; the fixing structure 41 is arranged inside the housing 5, and the contact electrode structure 42 is arranged outside the housing 5; the opening 56 is filled with curing silicone. Specifically, the fixing structure 41 is welded to the input end 31 of the flexible connection structure 3 inside the housing 5, and the contact electrode structure 42 is implanted in the brain.

[0063] Optional, such as Figure 1 and Figure 9-10As shown, the shell 5 includes a fixed base 51 and a cover body 52, the fixed base 51 is fixedly connected to the skull, and the fixed base 51 and the cover body 52 are detachably connected; the fixed base 51 includes a first part 53, a second part 54 and a fixed part 55, the fixed part 55 is fixedly connected to the skull, and the second part 54 is detachably connected to the cover body 52, the first part 53 is located between the second part 54 and the fixed part 55, and is close to the fixed part 55, and the cross-sectional area of ​​the first part 53 is smaller than that of the second part 54.

[0064] Specifically, the fixing portion 55 can be adjusted according to the shape of the skull to fit the shape of the skull and fix it. The thickness of the fixing portion 55 can be set according to the actual application requirements, for example, it can be set to 0.5mm to 1mm; the fixing portion 55 is provided with a mounting hole, which can be fixed to the skull by fasteners. During the implantation of the brain electrode device, the contact electrode structure 42 and the fixing portion 55 are implanted in the brain, and the fixing portion 55 is fixed to the skull, and the remaining structures are not implanted. The second portion 54 can be set as a narrow and long channel structure. While accommodating the pad end of the flexible connection structure 3 and the brain electrode structure 4, the implantation wound of the brain is reduced, which is conducive to sealing and reducing space, and can also reduce the probability of infection and harm to the patient.

[0065] Specifically, the cover 52 and the fixed base 51 can be fixedly connected by fasteners, and the fasteners include but are not limited to screws. Optionally, the cover 52 may include a detachable baffle 57, which is arranged corresponding to the third transmission interface 26 on the signal transmission circuit board 25 and can be arranged above the third transmission interface 26, so that the third transmission interface 26 can be exposed by opening the baffle 57, and then connected to an external device through a connecting line. When the connection is not needed, the baffle 57 is closed to protect the third transmission interface 26.

[0066] In actual application, the signal processing structure 1 and the fixing structure 41 of the brain electrode structure 4 are electrically connected by soldering with solder paste through a flip-chip welding process, and the whole is installed inside the shell 5. The bottom of the shell 5 has an opening 56, and the contact electrode structure 42 of the brain electrode structure 4 extends from the opening 56 of the shell 5 and is located outside the shell 5. During the use of the brain electrode device, the contact electrode structure 42 needs to be implanted in the brain, and the device is fixed on the skull through the bottom of the shell 5. Other structures are located outside the brain. Therefore, it is necessary to close the bottom opening 56 and seal the shell 5 to prevent body fluids from entering the device from the opening 56 of the shell 5 during use, corroding the internal electronic components and causing failure.

[0067] Specifically, the opening 56 of the brain electrode device can be sealed by curing silicone. Furthermore, a filling adhesive can be injected into the shell 5 (between the signal processing structure 1, the support structure 6 and the shell 5) to seal the gaps between the components inside the device, which can further protect the electronic components and extend the service life of the components.

[0068] The following introduces specific embodiments of the present application based on the above technical solution.

[0069] Example 1

[0070] See also Figure 1-5 and Figure 7-10 Embodiment 1 provides a brain electrode device, including a signal processing structure 1 and a brain electrode structure 4, the signal processing structure 1 and the brain electrode structure 4 are connected, and the brain electrode structure 4 is used to collect brain electrical signals; the signal processing structure 1 includes a circuit board 2 and a flexible connection structure 3, the output end 32 of the flexible connection structure 3 and the circuit board 2 are detachably connected, the input end 31 of the flexible connection structure 3 and the brain electrode structure 4 are electrically connected, the circuit board 2 forms at least one U-shaped structure, and the flexible connection structure 3 is folded.

[0071] Specifically, the circuit board 2 forms at least one U-shaped structure, that is, the circuit board 2 is folded in the brain electrode device, and the flexible connection structure 3 is folded, so that the space occupied by the signal processing structure 1 in the brain electrode device can be reduced, and the occupied space of the brain electrode device can be reduced while ensuring a high number of channels. Figure 5 The flexible connection structure 3 is foldable in the vertical and horizontal directions, and the output end 32 of the flexible connection structure 3 is detachably connected to the circuit board 2. The circuit board 2 can be replaced by pulling out the folded flexible connection structure 3 from the brain electrode device.

[0072] Optional, such as Figure 2-4 As shown, the above-mentioned circuit board 2 includes a signal transmission circuit board 25, at least two signal processing circuit boards and at least two flexible circuit boards 23. The at least two signal processing circuit boards are arranged relatively to each other. The signal transmission circuit board 25 and the at least two signal processing circuit boards are folded to form at least one U-shaped structure. The output end 32 of the flexible connection structure 3 and the at least two signal processing circuit boards are detachably connected. The signal transmission circuit board 25 is electrically connected to the at least two signal processing circuit boards through the at least two flexible circuit boards 23, and the signal transmission circuit board 25 can also be electrically connected through the flexible circuit boards 23; each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the EEG signal.

[0073] Optional, such as Figure 2-5As shown, each signal processing circuit board is provided with a first transmission interface 24, the output end 32 of the flexible connection structure 3 is provided with a second transmission interface 33, and the signal transmission circuit board 25 is provided with a third transmission interface 26. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board through the second transmission interface 33 and the first transmission interface 24, and the signal transmission circuit board 25 is communicatively connected with an external analysis device through the third transmission interface 26; the target signal processing circuit board is any one of the at least two signal processing circuit boards.

[0074] In a specific embodiment, the flexible circuit board 23 is bent so that the signal transmission circuit board 25 and each signal processing circuit board are arranged in an L shape. The first transmission interface 24 and the amplifier chip 27 can be respectively arranged on both sides of each signal processing circuit board, and the first transmission interface 24 and the amplifier chip 27 are arranged correspondingly. Specifically, the first transmission interface 24 can be arranged on one side of the signal processing circuit board facing the signal transmission circuit board 25, and the amplifier chip 27 is arranged on the other side.

[0075] Specifically, the output end 32 of the flexible connection structure 3 can be detachably connected to any signal processing circuit board, and the detachable connection between any signal processing circuit board and the flexible connection structure 3 is realized by plugging the first transmission interface 24 and the second transmission interface 33. The flexible connection structure 3 has an L-shaped structure as a whole, and the output end 32 of the flexible connection structure 3 is folded so that the second transmission interface 33 is arranged opposite to each other, so as to be correspondingly engaged with the third transmission interface 26 of the signal processing circuit board, and the first transmission interface 24 on the signal processing circuit board and the second transmission interface 33 on the flexible connection structure 3 are arranged one by one. The signal transmission circuit board 25 is connected to the external device through the third transmission interface 26 to transmit the EEG signal processed by the signal processing circuit board to the external device. Specifically, the first transmission interface 24 and the second transmission interface 33 can be Molex interfaces, and the third transmission interface 26 can be an HDMI interface.

[0076] In some embodiments, Figure 4 As shown, the at least two signal processing circuit boards include a first signal processing circuit board 21 and a second signal processing circuit board 22. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 through corresponding flexible circuit boards 23 respectively. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite to each other on both sides of the signal transmission circuit board 25. The output end 32 of the flexible connection structure 3 and the target signal processing circuit board are detachably connected; the target signal processing circuit board is the first signal processing circuit board 21 or the second signal processing circuit board 22.

[0077] Specifically, a U-shaped structure is formed between each signal processing circuit board and the signal transmission circuit board 25 by bending the flexible circuit board 23. The two signal processing circuit boards are arranged opposite to each other on both sides of the signal transmission circuit board 25. The first transmission interface 24 can be respectively arranged on the opposite sides of the two signal processing circuit boards, and the amplifier chip 27 is respectively arranged on the other side. The output end 32 of the flexible connection structure 3 can be detachably connected to one of the signal processing circuit boards through the first transmission interface 24 and the second transmission interface 33.

[0078] In an optional embodiment, if Figure 7 As shown, the brain electrode structure 4 includes a fixed structure 41 and a contact electrode structure 42. The input end 31 of the flexible connection structure 3 is fixedly connected to the fixed structure 41. The contact electrode structure 42 contacts the cerebral cortex in the skull to collect brain electrical signals. The fixed structure 41 and the contact electrode structure 42 are electrically connected. The contact electrode structure 42 includes a plurality of sub-contact electrode structures, and through holes 43 are provided between adjacent sub-contact electrode structures.

[0079] Specifically, the fixed structure 41 may be a pad, which is flip-chip welded to the input end 31 of the flexible connection structure 3. Each sub-contact electrode structure 42 may be a flexible electrode point. The pad includes a plurality of solder points. Each sub-contact electrode structure corresponds to a solder point one by one and corresponds to a signal channel in the circuit board 2. Each sub-contact electrode structure is electrically connected to the corresponding solder point by flip-chip welding with the aid of solder paste. The plurality of sub-contact electrode structures are distributed in an array, and through holes 43 may be provided between adjacent flexible electrode points, which can increase the adhesion between the contact electrode structure 42 and the cerebral cortex and facilitate the discharge of brain fluid under the cerebral cortex.

[0080] In an optional embodiment, if Figure 1 and Figure 9-10 As shown, the brain electrode device also includes a shell 5 and a supporting structure 6. The signal processing structure 1 is arranged in the shell 5 through the supporting structure 6. One end of the shell 5 is fixedly connected to the skull. The shell 5 and the skull form a closed space. The signal processing structure 1 and the brain electrode structure 4 are arranged in the closed space. The shell 5 is filled with adhesive.

[0081] Optional, such as Fig.10 As shown, the bottom of the housing 5 is provided with an opening 56, and the brain electrode structure 4 passes through the opening 56; the fixing structure 41 is arranged inside the housing 5, and the contact electrode structure 42 is arranged outside the housing 5; the opening 56 is filled with curing silicone. Specifically, the fixing structure 41 is welded to the input end 31 of the flexible connection structure 3 inside the housing 5, and the contact electrode structure 42 is implanted in the brain.

[0082] Optional, such as Figure 1 and Figure 9-10As shown, the shell 5 includes a fixed base 51 and a cover body 52, the fixed base 51 is fixedly connected to the skull, and the fixed base 51 and the cover body 52 are detachably connected; the fixed base 51 includes a first part 53, a second part 54 and a fixed part 55, the fixed part 55 is fixedly connected to the skull, and the second part 54 is detachably connected to the cover body 52, the first part 53 is located between the second part 54 and the fixed part 55, and is close to the fixed part 55, and the cross-sectional area of ​​the first part 53 is smaller than that of the second part 54.

[0083] Optionally, the cover body 52 may include a removable baffle 57, which is arranged corresponding to the third transmission interface 26 on the signal transmission circuit board 25, and can be arranged above the third transmission interface 26, so that the third transmission interface 26 can be exposed by opening the baffle 57, and then connected to an external device through a connecting line. When the connection is not needed, the baffle 57 is closed to protect the third transmission interface 26.

[0084] Specifically, the opening 56 of the brain electrode device can be sealed by curing silicone. Furthermore, a filling adhesive can be injected into the shell 5 (between the signal processing structure 1, the support structure 6 and the shell 5) to seal the gaps between the components inside the device, which can further protect the electronic components and extend the service life of the components.

[0085] Example 2

[0086] The difference between Example 2 and Example 1 lies in the arrangement of the circuit board 2. The similarities with Example 1 will not be repeated here. The differences between Example 2 and Example 1 are described as follows:

[0087] like Figure 6 As shown, the at least two signal processing circuit boards include a first signal processing circuit board 21, a second signal processing circuit board 22 and a third signal processing circuit board 29. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 through corresponding flexible circuit boards 23, respectively. The third signal processing circuit board 29 is electrically connected to the first signal processing circuit board 21 through the flexible circuit board 23. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite to each other on both sides of the signal transmission circuit board 25. The third signal processing circuit board 29 is located between the first signal processing circuit board 21 and the second signal processing circuit board 22, and is arranged in parallel with the first signal processing circuit board 21 and the second signal processing circuit board 22. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board; the target signal processing circuit board is the first signal processing circuit board 21, the second signal processing circuit board 22 or the third signal processing circuit board 29. Optionally, the third signal processing circuit board 29 can also be electrically connected to the second signal processing circuit board 22 through the flexible circuit board 23.

[0088] It can be known from the technical solutions provided in the above embodiments of this specification that the brain electrode device in this specification includes a signal processing structure and a brain electrode structure, the signal processing structure and the brain electrode structure are connected, the brain electrode structure is used to collect brain electrical signals, the signal processing structure includes a circuit board and a flexible connection structure, the output end of the flexible connection structure and the circuit board are detachably connected, the input end of the flexible connection structure and the brain electrode structure are electrically connected, the circuit board forms at least one U-shaped structure, and the flexible connection structure is folded. Therefore, in the signal processing structure of the brain electrode device, by having a folded circuit board with at least one U-shaped structure and a folded flexible connection structure, the space occupied by the signal processing structure in the brain electrode device can be reduced, so that the internal structure layout of the brain electrode device is compact, the volume of the device is reduced, and the volume is avoided to be too large to be convenient for carrying.

[0089] The embodiment of the present application also provides a method for preparing the above-mentioned brain electrode device, wherein the brain electrode device further comprises a housing 5, the bottom of the housing 5 is provided with an opening 56, the brain electrode structure 4 comprises a fixing structure 41 and a contact electrode structure 42, and the above-mentioned method may include:

[0090] Prepare a brain electrode structure 4, the brain electrode structure 4 is used to collect brain electrical signals;

[0091] Connect the signal processing structure 1 to the fixed structure 41, and the contact electrode structure 42 extends from the opening 56;

[0092] Preparation of curing silicone and adhesives;

[0093] The opening 56 is sealed by curing the silicone to obtain a sealed brain electrode device;

[0094] The adhesive is injected into the sealed brain electrode device and cured.

[0095] In a specific embodiment, the opening 56 is sealed by curing silicone, and the configured curing silicone is removed from bubbles through a vacuum machine and poured into a mold. Then, the bottom of the shell 5 (i.e., the above-mentioned fixing portion 55) is pressed into the mold so that the electrode wire is also covered by the curing silicone; further curing is performed based on a preset temperature and a preset time. Specifically, the curing can be performed in an oven. The first preset temperature and the first preset time can be set according to actual needs. The first preset temperature can be set to 80°C to 120°C, and the first preset time can be set to 4 hours to 12 hours. For example, the temperature is set to 120°C and the time is set to 4 hours.

[0096] Specifically, the curing silicone can be obtained by configuring and mixing the silicone and the curing agent in a first preset ratio. The preset ratio can be set according to actual application requirements. For example, the ratio of silicone and the curing agent can be set to 10:1.

[0097] In a specific embodiment, after the opening 56 of the housing 5 is sealed by the silica gel, the prepared adhesive is injected into the housing 5 by a syringe or the like, and cured based on the second preset temperature and the second preset time. The second preset temperature and the second preset time can be set according to actual needs, the second preset temperature can be set to 60°C to 80°C, and the second preset time can be set to 4 hours to 8 hours, for example, the temperature is set to 80°C and the time is set to 4 hours.

[0098] Specifically, the adhesive can be epoxy resin glue, and the epoxy resin glue and the curing agent are configured according to the second preset ratio to obtain the configured adhesive. The second preset ratio can be set according to the actual application requirements, for example. In actual applications, the epoxy resin glue and the curing agent can be poured into a centrifuge tube according to the second preset ratio for configuration, and then vibrated evenly with a mixer after configuration, and then poured into a centrifuge tube after mixing, and a centrifuge is used to remove bubbles; the parameters during the configuration process can be set according to the actual application requirements, for example, during the process of removing bubbles, the corresponding speed of the centrifuge can be set to 2000 rpm to 3000 rpm, and the centrifugation time can be set to 5 minutes to 10 minutes, and the speed can be set to 3000 rpm, and the centrifugation time can be set to 5 minutes.

[0099] Optionally, the step of injecting the adhesive into the sealed brain electrode device and performing a curing process may include:

[0100] Activate the brain electrode device;

[0101] The adhesive is injected into the activated brain electrode device, and then vacuumed and cured.

[0102] In a specific embodiment, before injecting the adhesive, the signal processing structure 1, the support structure 6 and the housing 5 can be activated to clean the surface of the structure, thereby enhancing the bonding force between the adhesive and the inner wall of the housing 5, the circuit board 2 and the brain electrode structure 4. Specifically, oxygen plasma can be used to activate the above structures, and the processing time and power can be set according to actual application requirements. For example, the processing time can be set to 5 minutes to 30 minutes, and the power can be set to 200W to 500W.

[0103] In a specific embodiment, after the oxygen plasma activation treatment is completed, the above-mentioned epoxy resin glue is filled within a certain period of time (such as within 30 minutes to 120 minutes). After filling, it can be placed in a vacuum kettle for vacuum treatment, thereby ensuring that the epoxy resin can completely fill the pores in the shell 5 and preventing bubbles from being generated in the epoxy resin.

[0104] Regarding the structures in the above embodiments, the specific configuration of each structure has been described in detail in the embodiments of the device, and will not be elaborated here.

[0105] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0106] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A brain electrode device, characterized in that: The brain electrode device comprises a signal processing structure and a brain electrode structure, the signal processing structure is connected to the brain electrode structure, and the brain electrode structure is used to collect brain electrical signals; The signal processing structure includes a circuit board and a flexible connection structure, the output end of the flexible connection structure is detachably connected to the circuit board, the input end of the flexible connection structure is electrically connected to the brain electrode structure, the circuit board forms at least one U-shaped structure, and the flexible connection structure is folded.

2. The brain electrode device according to claim 1, characterized in that The circuit board includes a signal transmission circuit board, at least two signal processing circuit boards and at least two flexible circuit boards. The at least two signal processing circuit boards are arranged relatively to each other. The signal transmission circuit board and the at least two signal processing circuit boards are folded to form at least one U-shaped structure. The output end of the flexible connection structure and the at least two signal processing circuit boards are detachably connected. The signal transmission circuit board is electrically connected to the at least two signal processing circuit boards through the at least two flexible circuit boards; each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the electroencephalogram signal.

3. The brain electrode device according to claim 2, characterized in that The at least two signal processing circuit boards include a first signal processing circuit board and a second signal processing circuit board, the first signal processing circuit board and the second signal processing circuit board are arranged opposite to each other on both sides of the signal transmission circuit board, and the output end of the flexible connection structure and the target signal processing circuit board are detachably connected; the target signal processing circuit board is the first signal processing circuit board or the second signal processing circuit board.

4. The brain electrode device according to claim 2, characterized in that Each of the signal processing circuit boards is provided with a first transmission interface, the output end of the flexible connection structure is provided with a second transmission interface, the signal transmission circuit board is provided with a third transmission interface, the output end of the flexible connection structure is detachably connected to the target signal processing circuit board through the second transmission interface and the first transmission interface, and the signal transmission circuit board is communicatively connected with an external analysis device through the third transmission interface; The target signal processing circuit board is any one of the at least two signal processing circuit boards.

5. The brain electrode device according to claim 1, characterized in that The brain electrode structure includes a fixed structure and a contact electrode structure, the input end of the flexible connection structure is fixedly connected to the fixed structure, the contact electrode structure is in contact with the cerebral cortex to collect the brain electrical signal, and the fixed structure is electrically connected to the contact electrode structure; The contact electrode structure includes a plurality of sub-contact electrode structures, and through holes are arranged between adjacent sub-contact electrode structures.

6. The brain electrode device according to claim 1, characterized in that The brain electrode device further comprises a shell and a supporting structure, the signal processing structure is arranged in the shell through the supporting structure, and one end of the shell is fixedly connected to the skull; The shell and the skull form a closed space, and the signal processing structure and the brain electrode structure are arranged in the closed space; the shell is filled with adhesive.

7. The brain electrode device according to claim 6, characterized in that The housing comprises a fixed base and a cover body, wherein the fixed base is fixedly connected to the skull, and the fixed base is detachably connected to the cover body; The fixed base includes a first part, a second part and a fixing part, the fixing part is fixedly connected to the skull, the second part is detachably connected to the cover body, the first part is located between the second part and the fixing part and close to the fixing part, and the cross-sectional area of ​​the first part is smaller than that of the second part.

8. The brain electrode device according to claim 6, characterized in that The bottom of the shell is provided with an opening, and the brain electrode structure passes through the opening; the brain electrode structure includes a fixing structure and a contact electrode structure, the fixing structure is arranged inside the shell, and the contact electrode structure is arranged outside the shell; the opening is filled with curing silicone.

9. A method for preparing the brain electrode device according to any one of claims 1 to 8, characterized in that: The brain electrode device further comprises a shell, the bottom of the shell is provided with an opening, the brain electrode structure comprises a fixing structure and a contact electrode structure, and the method comprises: Prepare the brain electrode structure, which is used to collect brain electrical signals; connecting the signal processing structure to the fixed structure, the contact electrode structure extending from the opening; Preparation of curing silicone and adhesives; The opening is sealed by using the cured silicone to obtain a sealed brain electrode device; The adhesive is injected into the sealed brain electrode device and then cured.

10. The method according to claim 9, characterized in that The step of injecting the adhesive into the sealed brain electrode device and performing a curing process comprises: Activating the brain electrode device; The adhesive is injected into the activated brain electrode device, and then vacuumed and cured.

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