A production process and batching tank for copper-titanium etching solution for integrated circuits

Abstract

The invention discloses a production process of copper-titanium etching liquid for integrated circuits and a batching tank, comprising a batching tank and a stirring rod, wherein the stirring rod is rotatably connected to the end of the batching tank, a sleeve is sleeved on the surface of the stirring rod, and a traction rod penetrating the stirring rod is fixed on the inner wall of the sleeve, a plurality of groups of guide plates are fixed to both ends of the traction rod, and the surfaces of the guide plates are all fitted with guide rings fixed on the inner wall of the batching tank, and a plurality of groups of auxiliary leaves are fixed on the surface of the sleeve; the guide plates slide along the surfaces of the guide rings, so that the guide plates drive the sleeves to slide on the surface of the stirring rod, which facilitates the adjustment of the stirring position of the auxiliary leaves and improves the stirring efficiency; at the same time, the rotating rod drives the stirring leaves to rotate, so that the stirring leaves increase the stirring position in the batching tank and improve the uniformity of stirring; the sleeve ring is sleeved on the surface of the sleeve, so that the sleeve ring and the support frame support the sleeve, and the stability of the sleeve rotation is increased.

Description

Technical Field

[0001] The invention belongs to the technical field of batching tanks, and in particular relates to a production process and a batching tank for copper-titanium etching solution for integrated circuits. Background Art

[0002] In the production process of copper-titanium etching solution for integrated circuits, the batching tank is a key equipment used to mix and prepare various chemical raw materials. The main function of the batching tank in the production process is to mix different chemical raw materials in a certain proportion to ensure that the composition of the etching solution is accurate. The existing batching tanks can basically meet the daily use needs, but there are still some shortcomings that need to be improved.

[0003] During the batching process, the raw materials are added to the batching tank, and the stirring blades in the batching tank stir the raw materials in the batching tank. However, during the stirring process, since the position of the stirring blades may be fixed, the stirring position may be relatively single during the stirring process, which may affect the stirring time. For this reason, we proposed a production process for copper-titanium etching solution for integrated circuits and a batching tank to solve the above problems. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the present invention provides a production process and a mixing tank for copper-titanium etching solution for integrated circuits. After the auxiliary blades are driven up and down by the sleeve, the stirring position can be easily adjusted to increase the stirring effect.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A copper-titanium etching liquid batching tank for integrated circuits comprises a batching tank and a stirring rod, wherein the end of the batching tank is rotatably connected to the stirring rod, a sleeve is sleeved on the surface of the stirring rod, and a traction rod penetrating the stirring rod is fixed on the inner wall of the sleeve, a plurality of groups of guide plates are fixed on both side ends of the traction rod, and a guide ring fixed on the inner wall of the batching tank is attached to the surface of the guide plate, and a plurality of groups of auxiliary leaves are fixed on the surface of the sleeve.

[0007] As a preferred technical solution of the present invention, the sleeve is slidably connected with a rotating block, and the rotating block is rotatably connected to a fixed frame, the fixed frame is fixed on the batching tank, a second gear is fixed on the surface of the rotating block, and the first gear is meshed around the second gear, a rotating rod is fixed in the middle of the first gear, and a plurality of groups of stirring blades are fixed on the surface of the rotating rod, and the rotating rods are connected to the fixed frame through support rods.

[0008] As a preferred technical solution of the present invention, a traction ring is sleeved on one side of the rotating block close to the fixing frame, and fixing rings are fixed around the traction ring, and the fixing rings are all fixed on the fixing frame.

[0009] As a preferred technical solution of the present invention, a positioning groove configured as a rectangular groove is opened in the middle of the rotating block, and a positioning block configured as a rectangular block is inserted in the middle of the positioning groove, and the positioning block configured as a rectangular block matches the positioning groove configured as the rectangular groove, and the end of the positioning block is fixed on the sleeve.

[0010] As a preferred technical solution of the present invention, the ends of the fixing frames are all fixed with limiting sleeves, and the limiting sleeves are all sleeved on the surface of the rotating rod.

[0011] As a preferred technical solution of the present invention, a guide block is fixed on the inner wall of the end of the sleeve, and the surface of the guide block is sleeved with a guide groove opened on the stirring rod.

[0012] As a preferred technical solution of the present invention, a collar is sleeved on the middle of the sleeve, and a support frame is fixed around the collar, and the end of the support frame is fixed on the inner wall of the batching tank.

[0013] As a preferred technical solution of the present invention, the guide rings are all configured as wave-shaped blocks, and the guide plates are all configured as cylindrical shapes.

[0014] A production process of copper-titanium etching solution for integrated circuits comprises the following steps:

[0015] S1. Add pure water into the batching tank, add potassium persulfate and hydrogen peroxide while stirring, and stir at a speed of 100-200r / min for 2-4h.

[0016] S2. Add sulfuric acid, nitric acid and acetic acid to the batching tank in sequence, stir at a speed of 60-80 r / min for 2 h to obtain a mixture.

[0017] S3, passing the mixture through a filter and filtering it for more than 2 times, then adding an adsorbent, stirring at a constant speed for 20-40 minutes to obtain the copper-titanium etching solution for integrated circuits,

[0018] S4. Filtration parameters: The pore size of the microfiltration membrane of the filter is 0.03-0.10um.

[0019] Compared with the prior art, the present invention can achieve the following beneficial effects:

[0020] 1. The production process and batching tank of copper-titanium etching liquid for integrated circuits are provided with a sleeve, a guide ring, a guide plate and a traction rod. When the stirring rod is rotated, the stirring rod drives the sleeve to rotate through the traction rod, and when the sleeve is rotated, the sleeve drives the guide plate to slide on the surface of the guide ring. The guide plate slides along the surface of the guide ring, so that the guide plate drives the sleeve to slide on the surface of the stirring rod, which is convenient for adjusting the stirring position of the auxiliary blade and improving the stirring efficiency.

[0021] 2. The production process of copper-titanium etching liquid for integrated circuits and the batching tank are provided with a first gear, a stirring blade, a rotating rod and a second gear. When the second gear rotates, the second gear is meshed with the first gear, and the first gear drives the rotating rod to rotate, so that the rotating rod drives the stirring blade to rotate, so that the stirring blade increases the stirring position in the batching tank and improves the uniformity of stirring.

[0022] 3. The production process of copper-titanium etching solution for integrated circuits and the batching tank are provided with a support frame and a sleeve ring, the sleeve ring is supported in the batching tank by the support frame, and the sleeve ring is sleeved on the surface of the sleeve, so that the sleeve ring and the support frame support the sleeve, thereby increasing the stability of the sleeve rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a front cross-sectional structural schematic diagram of the present invention;

[0024] Figure 2 It is a schematic diagram of a top cross-sectional structure of a stirring rod and a sleeve of the present invention;

[0025] Figure 3 It is a schematic diagram of a top cross-sectional structure of the present invention;

[0026] Figure 4 It is a schematic diagram of a top cross-sectional structure of a fixing frame and a supporting rod of the present invention;

[0027] Figure 5 It is a schematic diagram of a top cross-sectional structure of a guide block and a guide groove of the present invention;

[0028] Figure 6 It is a schematic diagram of the three-dimensional cross-sectional structure of the liquid dispensing tank and the guide plate of the present invention;

[0029] Figure 7 It is a schematic structural diagram of the limiting sleeve and the rotating rod of the present invention;

[0030] Figure 8 For the present invention Figure 1 A is an enlarged schematic diagram of the cross-sectional structure;

[0031] Fig. 9 For the present invention Figure 1 Enlarged cross-sectional structural diagram at point B in the middle.

[0032] Among them: 1. batching tank; 2. stirring rod; 3. traction rod; 4. sleeve; 5. guide ring; 6. support frame; 7. sleeve ring; 8. guide plate; 9. first gear; 10. support rod; 11. fixed frame; 12. stirring blade; 13. rotating rod; 14. guide groove; 15. guide block; 16. auxiliary blade; 17. fixed ring; 18. rotating block; 19. traction ring; 20. positioning groove; 21. positioning block; 22. second gear; 23. limit sleeve. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, and purpose and efficacy of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work all belong to the protection scope of the present invention. The experimental methods in the following embodiments are conventional methods unless otherwise specified, and the materials and reagents used in the following embodiments are all commercially available unless otherwise specified.

[0034] Example

[0035] like Figure 1-9 The thermal conductivity control device of a polymer sheet for marine ships shown in the figure comprises a batching tank 1 and a stirring rod 2, wherein the end of the batching tank 1 is rotatably connected with the stirring rod 2, a sleeve 4 is sleeved on the surface of the stirring rod 2, and a traction rod 3 penetrating the stirring rod 2 is welded on the inner wall of the sleeve 4, a plurality of groups of guide plates 8 are fixed to both ends of the traction rod 3, and a guide ring 5 welded on the inner wall of the batching tank 1 is attached to the surface of the guide plate 8, the guide ring 5 is configured as a wavy block, and the guide plate 8 is configured as a cylindrical shape, a plurality of groups of auxiliary leaves 16 are welded on the surface of the sleeve 4, and when in use, the operator starts the motor to drive the stirring rod 2 to rotate, and the stirring rod 2 is rotating. During rotation, the stirring rod 2 drives the sleeve 4 to rotate through the traction rod 3. When the sleeve 4 rotates, the sleeve 4 drives the guide plate 8 to rotate, and when the guide plate 8 rotates, the guide plate 8 slides along the surface of the guide ring 5, so that the guide plate 8 drives the sleeve 4 to slide on the surface of the stirring rod 2, and when the sleeve 4 slides on the surface of the stirring rod 2, the traction rod 3 fixed on the inner wall of the sleeve 4 slides in the waist-shaped hole opened in the middle of the stirring rod 2, so that the sleeve 4 can stably slide on the surface of the stirring rod 2, and when the sleeve 4 moves up and down, the sleeve 4 drives the auxiliary blade 16 to move up and down to adjust the stirring position of the auxiliary blade 16.

[0036] In other embodiments, the sleeve 4 is slidably connected with a rotating block 18, and the rotating block 18 is rotatably connected to the fixed frame 11. A traction ring 19 is sleeved on one side of the rotating block 18 close to the fixed frame 11, and the traction ring 19 is welded with a fixing ring 17 around it. The fixing ring 17 is welded to the fixed frame 11, and the fixed frame 11 is welded to the batching tank 1. A second gear 22 is welded on the surface of the rotating block 18, and the second gear 22 is meshed with a first gear 9 around it. A rotating rod 13 is welded to the middle of the first gear 9, and a plurality of groups of stirring blades 12 are welded on the surface of the rotating rod 13. The rotating rod 13 is connected to the fixed frame 11 through a support rod 10. A limiting sleeve 23 is welded at the end of the fixed frame 11, and the limiting sleeve 23 is sleeved on the surface of the rotating rod 13. When the sleeve 4 rotates, the sleeve 4 drives the positioning groove 20 to move through the positioning block 21. The positioning groove 20 drives the rotating block 18 to move, and when the rotating block 18 rotates, the rotating block 18 drives the second gear 22 to move, and after the second gear 22 and the first gear 9 are meshed with each other, the first gear 9 is rotated, and when the first gear 9 is rotating, the rotating rod 13 drives the rotating rod 13 to rotate, so that the rotating rod 13 rotates in the limiting sleeve 23, and the rotating rod 13 is fixed to the fixing frame 11 through the supporting rod 10, so that the supporting rod 10 supports the rotating rod 13 through the limiting sleeve 23, thereby increasing the rotation stability of the rotating rod 13, and when the rotating rod 13 rotates, the rotating rod 13 drives the stirring blade 12 to rotate, and after the stirring blade 12 rotates, the stirring blade 12 increases the stirring effect of the raw materials in the batching tank 1, so that the stirring blade 12 increases the stirring position in the batching tank 1, thereby improving the uniformity of stirring;

[0037] When the guide plate 8 slides on the surface of the guide ring 5 and the sleeve 4 moves up and down on the surface of the stirring rod 2, the sleeve 4 drives the positioning block 21 to move, and the positioning block 21 moves up and down in the positioning groove 20, so that the sleeve 4 can drive the rotating block 18 to rotate through the positioning block 21 during the up and down movement of the sleeve 4, and when the rotating block 18 rotates, the rotating block 18 rotates in the traction ring 19, and the traction ring 19 is fixed to the fixing frame 11 through the fixing ring 17, so that the fixing frame 11 fixes the guide plate 8 through the traction ring 19, thereby increasing the stability of the rotation of the rotating block 18.

[0038] In other embodiments, a positioning groove 20 configured as a rectangular groove is opened in the middle of the rotating block 18, and a positioning block 21 configured as a rectangular block is inserted in the middle of the positioning groove 20, and the positioning block 21 configured as a rectangular block matches the positioning groove 20 configured as a rectangular groove, and the end of the positioning block 21 is fixed on the sleeve 4, and the rectangular groove configured by the positioning groove 20 matches the rectangular block configured by the positioning block 21, so that the surface of the positioning block 21 and the inner wall of the positioning groove 20 fit together, and the surface of the positioning block 21 and the inner wall of the positioning groove 20 fit together, so that the stability of the positioning block 21 moving up and down in the positioning groove 20 is increased, and when the positioning block 21 rotates, the right angles around the positioning block 21 can abut against the right-angled inner walls around the positioning groove 20, so that the positioning block 21 pushes the rotating block 18 to rotate through the positioning groove 20.

[0039] In other embodiments, a guide block 15 is welded to the inner wall of the end of the sleeve 4, and the surface of the guide block 15 is sleeved with a guide groove 14 opened on the stirring rod 2. When the sleeve 4 moves up and down on the surface of the stirring rod 2, the sleeve 4 drives the guide block 15 configured as a rectangular block to slide in the guide groove 14 configured as a rectangular groove, so that the guide block 15 and the guide groove 14 pull the sleeve 4 in the direction of movement on the surface of the stirring rod 2, thereby increasing the stability of the sleeve 4 sliding on the surface of the stirring rod 2.

[0040] In other embodiments, a collar 7 is sleeved on the middle of the sleeve 4, and a support frame 6 is welded around the collar 7, and the end of the support frame 6 is fixed on the inner wall of the batching tank 1. When the sleeve 4 rotates, the outer side of the sleeve 4 rotates in the middle of the collar 7, and the collar 7 is fixed to the inner wall of the batching tank 1 through the support frame 6, so that the collar 7 restricts the middle of the sleeve 4, thereby preventing the sleeve 4 from shaking randomly when rotating, and improving the stability of the rotation of the sleeve 4.

[0041] A production process of copper-titanium etching solution for integrated circuits comprises the following steps:

[0042] S1, initial raw material mixing and stirring stage

[0043] First, carefully add an appropriate amount of pure water into the batching tank. During this process, stirring should be performed at the same time, and potassium persulfate and hydrogen peroxide should be added. The stirring speed needs to be controlled within the range of 100-200r / min. Stirring should be continued at this speed for 2-4h. This stage is the starting part of the entire production process. It is very important to evenly mix potassium persulfate and hydrogen peroxide in pure water. The appropriate speed and stirring time can ensure that the two substances are fully dispersed in pure water to prepare for subsequent reactions.

[0044] S2, multiple acids added to the mixing stage

[0045] Next, sulfuric acid, nitric acid, and acetic acid are added to the batching tank in order. At this time, the stirring speed is adjusted to 60-80r / min, and stirring is continued for 2 hours to obtain a mixture. The order of adding sulfuric acid, nitric acid, and acetic acid is carefully designed, and stirring is performed at a specific speed for a specific time in order to allow these acids to fully react and mix evenly with the previously mixed solution. Each acid has a specific role in the corrosive solution, and they work together to achieve the corrosion function on copper and titanium.

[0046] S3, Filtration and Adsorption Stage

[0047] Then, the mixture obtained in the previous step is passed through a filter for filtering, and the number of filtering times needs to be 2 times or more. After multiple filtering, an adsorbent is added, and the rotation speed is kept unchanged (60-80r / min) and stirring is continued for 20-40min, so that a copper-titanium etching solution for integrated circuits is obtained. The purpose of multiple filtering is to remove impurity particles in the mixture, and the purpose of adding an adsorbent and stirring is to further adsorb impurities that may exist therein or substances that have an adverse effect on the etching effect, so as to ensure the purity and etching effect of the etching solution;

[0048] S4, filtering parameter setting stage

[0049] Finally, for the filtering operation, the pore size of the microfiltration membrane of the filter is set to 0.03-0.10u. The setting of this pore size range is very critical. It can effectively filter out those tiny particles that do not meet the requirements and ensure the quality and performance of the etching solution. If the pore size is too large, some impurities may pass through and affect the purity of the etching solution; if the pore size is too small, it may cause the filtration speed to be too slow, affecting production efficiency.

[0050] The above shows and describes the basic principles of the present invention; the main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A copper-titanium etching solution batching tank for integrated circuits, comprising a batching tank (1) and a stirring rod (2), wherein the end of the batching tank (1) is rotatably connected to the stirring rod (2), and characterized in that: The surface of the stirring rod (2) is sleeved with a sleeve (4), and a traction rod (3) penetrating the stirring rod (2) is fixed to the inner wall of the sleeve (4), and a plurality of guide plates (8) are fixed to both ends of the traction rod (3), and the surfaces of the guide plates (8) are fitted with guide rings (5) fixed to the inner wall of the batching tank (1), and a plurality of auxiliary leaves (16) are fixed to the surface of the sleeve (4).

2. The copper-titanium etching solution preparation tank for integrated circuits according to claim 1, characterized in that: The sleeve (4) is slidably connected to a rotating block (18), and the rotating block (18) is rotatably connected to a fixed frame (11). The fixed frame (11) is fixed on the mixing tank (1). A second gear (22) is fixed on the surface of the rotating block (18), and a first gear (9) is meshed around the second gear (22). A rotating rod (13) is fixed in the middle of the first gear (9), and a plurality of groups of stirring blades (12) are fixed on the surface of the rotating rod (13). The rotating rods (13) are connected to the fixed frame (11) through a support rod (10).

3. The copper-titanium etching solution preparation tank for integrated circuits according to claim 2, characterized in that: A traction ring (19) is sleeved on one side of the rotating block (18) close to the fixing frame (11), and fixing rings (17) are fixed around the traction ring (19), and the fixing rings (17) are fixed on the fixing frame (11).

4. The copper-titanium etching solution preparation tank for integrated circuits according to claim 2, characterized in that: The rotating block (18) has a positioning groove (20) in the middle thereof, and a positioning block (21) in the middle thereof is inserted into the positioning groove (20). The positioning block (21) in the middle thereof matches the positioning groove (20) in the middle thereof, and the end of the positioning block (21) is fixed on the sleeve (4).

5. The copper-titanium etching solution preparation tank for integrated circuits according to claim 2, characterized in that: The ends of the fixing frame (11) are all fixed with limiting sleeves (23), and the limiting sleeves (23) are all sleeved on the surface of the rotating rod (13).

6. The copper-titanium etching solution preparation tank for integrated circuits according to claim 1, characterized in that: A guide block (15) is fixed to the inner wall of the end of the sleeve (4), and a guide groove (14) provided on the stirring rod (2) is sleeved on the surface of the guide block (15).

7. The copper-titanium etching solution preparation tank for integrated circuits according to claim 1, characterized in that: A collar (7) is sleeved on the middle of the sleeve (4), and a support frame (6) is fixed around the collar (7), and the end of the support frame (6) is fixed on the inner wall of the batching tank (1).

8. The copper-titanium etching solution preparation tank for integrated circuits according to claim 1, characterized in that: The guide rings (5) are all configured as wave-shaped blocks, and the guide plates (8) are all configured as cylindrical shapes.

9. A production process of copper-titanium etching solution for integrated circuits, characterized in that: The production process and batching tank of copper-titanium etching solution for integrated circuits according to claims 1-8 comprise the following steps: S1. Add pure water into the batching tank, add potassium persulfate and hydrogen peroxide under stirring, and stir at a speed of 100-200r / min for 2-4h; S2, then add sulfuric acid, nitric acid and acetic acid to the batching tank in sequence, stir at a speed of 60-80r / min for 2h to obtain a mixture; S3, passing the mixture into a filter and filtering it for more than 2 times, then adding an adsorbent, stirring at a constant speed for 20-40 minutes to obtain the copper-titanium etching solution for integrated circuits; S4. Filtration parameters: The pore size of the microfiltration membrane of the filter is 0.03-0.10um.

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