A kind of intelligent wireless chip gluing process

Abstract

The invention discloses a smart wireless chip gluing process, comprising the following steps: step one, using a robot arm one to place a chip body on a gluing device for gluing operation; step two, using a robot arm two to transfer the chip body after gluing to a burning device for burning and drying, and after drying, the chip body is removed by a robot arm three for collection; the gluing device in step one comprises a liquid storage mechanism, a mounting plate is symmetrically mounted on the upper end of the liquid storage mechanism, a conveying mechanism is arranged between the two mounting plates, the two ends of the conveying mechanism respectively extend to the outside of the mounting plate, a transmission belt is arranged on the conveying mechanism, a fixing mechanism is arranged to facilitate fixing the chip body, and when gluing, the upper port of the guide groove one is aligned with the lower port of the guide groove two, so as to facilitate the outflow of excess glue, and after gluing, the chip body is pushed out of the card slot under the action of a spring one, so as to facilitate the robot arm two to take away the chip body.

Description

Technical Field

[0001] The invention relates to the technical field of chips, and in particular to a smart wireless chip gluing process. Background Art

[0002] A chip is a group of integrated circuits that work together and are sold as a product. It is responsible for connecting the core of the computer, the microprocessor, to the rest of the machine, and is an important component that determines the motherboard level; a chip burner is a tool that writes data to a programmable integrated circuit, and is mainly used for programming chips such as single-chip microcomputer memories. Most of the existing intelligent devices are equipped with special chips for storing relevant information and working information of the device. Generally, these chips need to be burned into the chip by a chip burning device before leaving the factory; the burning process is to first apply glue to the unburned chip, and then move the unburned chip after glue application to the burner, and the burner burns the chip, but when the existing glue coating equipment is applied, the glue is often applied in a thick layer on the chip body, which affects the subsequent burning operation, and the glue recovery rate is low, the loss is large, and the economic benefits are reduced. Summary of the invention

[0003] In order to overcome the above technical problems, the purpose of the present invention is to provide an intelligent wireless chip gluing process, wherein the output end of the stirring motor passes through the mounting block 2 to the inside of the chamber of the gluing tube and is connected to the stirring shaft rod, thereby solving the problem that the glue in the gluing tube condenses and the fluidity of the glue deteriorates, which is not conducive to gluing;

[0004] The cross-sections of the guide plate and the baffle are both isosceles triangle structures. The recovery trough is located between the load-bearing plate and the baffle, and the guide plate is located between the two baffles. When the glue flows onto the guide plate, it flows to the recovery trough for collection under the action of the inclined surface. The two baffles block the glue so that it only flows on the inclined surface of the guide plate, which has a higher collection rate and a better recovery effect.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A smart wireless chip gluing process comprises the following steps:

[0007] Step 1: Use robot 1 to place the chip body on the glue coating device for glue coating operation;

[0008] Step 2: Use robot 2 to transfer the chip body after glue coating to the burning equipment for burning and drying. After drying, robot 3 will take it off and collect it;

[0009] The glue coating equipment in step one includes a liquid storage mechanism, a mounting plate is symmetrically installed on the upper end of the liquid storage mechanism, a conveying mechanism is arranged between the two mounting plates, both ends of the conveying mechanism extend to the outside of the mounting plates respectively, a transmission belt is arranged on the conveying mechanism, and a plurality of fixing mechanisms arranged at equal distances are installed on the outer surface of the conveying mechanism, the fixing mechanism is located between the two mounting plates, and a glue coating mechanism is fixedly installed at a position close to one side of the upper end of the mounting plate, and a driving motor for driving the conveying mechanism to rotate is arranged at the rear end of one of the mounting plates.

[0010] As a further solution of the present invention: the gluing device performs the gluing operation on the chip body as follows:

[0011] The chip body is placed on the fixing mechanism of the glue coating device, and then the driving motor is started to drive the conveying mechanism to convey the chip body, and then the glue coating mechanism sprays glue on the chip body, and the excess glue flows into the liquid storage mechanism for collection.

[0012] As a further solution of the present invention: the conveying mechanism includes two symmetrically installed rotating wheels, a rotating shaft is arranged inside the rotating wheel, both ends of the rotating shaft extend to the outside of the rotating wheel, a transmission belt and a conveying belt are connected between the two rotating shafts, the conveying belt is located between two mounting plates, and the transmission belt is located in front of the mounting plates, and the rear end of one of the rotating shafts is connected to the output end of the driving motor.

[0013] As a further scheme of the present invention: the glue coating mechanism includes a fixed seat, a stirring motor, a water pump, a mounting block one, a mounting block two, a glue coating tube and a nozzle, the fixed seat is located at the upper end of the two mounting plates, the mounting block one is fixedly mounted on the upper end of the fixed seat, the mounting block two is fixedly mounted on one side of the mounting block one, a glue coating tube is threadedly connected to one side of the mounting block two, a plurality of nozzles arranged at equal distances are arranged on the lower surface of the glue coating tube, the two ends of the water pump are respectively connected to the liquid storage mechanism and the glue coating tube, a chamber is arranged inside the glue coating tube, a stirring shaft is arranged in the chamber, the stirring motor is mounted on the mounting block one, and the output end of the stirring motor passes through the mounting block two to the inside of the chamber of the glue coating tube and is connected to the stirring shaft.

[0014] As a further solution of the present invention: the liquid storage mechanism includes a liquid storage box, a load-bearing plate, a baffle and a guide plate, the upper end of the liquid storage box is symmetrically installed with a load-bearing plate and a baffle, the baffle is located between two load-bearing plates, the guide plate is located between two baffles, the cross-sections of the guide plate and the baffle are both isosceles triangle structures, and the upper end of the liquid storage box is symmetrically opened with recovery grooves, which are located between the load-bearing plate and the baffle.

[0015] As a further solution of the present invention: the fixing mechanism comprises a bottom plate 1, a side plate 1, a spring 1, a guide groove 1, a fixing component and a guide groove 2. The upper end of the bottom plate 1 is symmetrically provided with a side plate 1, a fixing component is provided between the two side plates 1, and a plurality of springs 1 arranged in a ring array are connected between the lower end of the fixing component and the upper end of the bottom plate 1. The spring 1 is a linear spring. The side plate 1 is provided with a guide groove 1, and the guide groove 2 is provided on the fixing component. The thickness and density of the linear spring remain unchanged from top to bottom, and the elastic coefficient is a fixed value, so that after the chip body is placed on the fixing component, when the spring 1 is compressed, a more stable and linear dynamic response can be obtained, which is beneficial for the user to better select the elastic coefficient of the spring 1 according to actual needs, so that after the chip body is placed on the fixing component, the upper port of the guide groove 1 is aligned with the lower port of the guide groove 2, so as to facilitate the outflow of excess glue.

[0016] As a further scheme of the present invention: the fixed assembly comprises side plate two, bottom plate two, auxiliary push plate, connecting block, rotating rod, sliding rod, fixed push plate, pushing rod and driving member, the number of side plates two is two, and the two side plates two are fixedly installed on the upper ends of the two side plates one respectively, the bottom plate two is located between the two side plates two near the bottom position, the auxiliary push plate, connecting block and sliding rod are symmetrically installed between the two side plates two near the top position, the connecting block is located between the auxiliary push plate and the sliding rod, the sliding rod is symmetrically installed on the sliding rod, the rotating rod is rotatably installed between the sliding plate and the connecting block, and a spring two is installed between the sliding plate and the inner side wall of the side plate two, the spring two is a nonlinear coil spring, a fixed push plate is arranged on the side of the auxiliary push plate away from the connecting block, a push rod is connected to one side of the fixed push plate, and a driving member is connected to one side of the push rod, a sliding groove compatible with the fixed push plate is arranged on the side plate two, a guide groove two is arranged on the side plate two, and a rotating groove compatible with the driving member is arranged on the mounting plate.

[0017] As a further solution of the present invention: the driving member is an electric telescopic rod, a gas cylinder or an oil cylinder, preferably an electric telescopic rod, which is easier to control, and the two ends of the water pump are respectively connected to the liquid storage box and the glue coating pipe.

[0018] Beneficial effects of the present invention:

[0019] The cross-sections of the guide plate and the baffle are both isosceles triangle structures. The recovery tank is located between the load-bearing plate and the baffle, and the guide plate is located between the two baffles. When the glue flows onto the guide plate, it flows to the recovery tank for collection under the action of the inclined surface. The two baffles block the glue so that it only flows on the inclined surface of the guide plate, which has a higher collection rate and a better recovery effect.

[0020] The inside of the glue coating tube is provided with a chamber, and a stirring shaft is arranged in the chamber. The stirring motor is installed on the mounting block 1, and the output end of the stirring motor passes through the mounting block 2 to the inside of the chamber of the glue coating tube and is connected with the stirring shaft, so as to avoid the glue in the glue coating tube from condensing and the fluidity of the glue from becoming poor, which is not conducive to glue coating;

[0021] The fixing mechanism is provided to facilitate fixing the chip body, and when applying glue, the upper port of the guide groove 1 is aligned with the lower port of the guide groove 2, which is convenient for excess glue to flow out. After applying glue, the chip body is pushed out of the card slot under the action of the spring 1, which is convenient for the robot 2 to take away the chip body;

[0022] The arranged liquid storage mechanism has the functions of storing and recycling liquid, thereby improving the effective utilization rate of resources, reducing the cost of gluing, and increasing the economic benefit. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the glue coating equipment in the present invention;

[0025] Figure 2 It is a front cross-sectional view of the conveying mechanism and the fixing mechanism in the present invention;

[0026] Figure 3 is a top view of the fixing mechanism and the conveying belt in the present invention;

[0027] Figure 4 It is a schematic diagram of the overall structure of the liquid storage mechanism in the present invention;

[0028] Figure 5 is a front cross-sectional view of the fixing mechanism in the present invention;

[0029] Figure 6 is a top view of the fixing mechanism in the present invention;

[0030] Figure 7 It is a side view of the side plate 1 and the guide groove 1 in the present invention.

[0031] In the figure: 1. liquid storage mechanism; 2. mounting plate; 3. glue coating mechanism; 4. conveying mechanism; 5. transmission belt; 6. fixing mechanism; 41. rotating wheel; 42. conveying belt; 43. rotating shaft; 11. liquid storage box; 12. load-bearing plate; 13. baffle; 14. guide plate; 61. bottom plate one; 62. side plate one; 63. spring one; 64. guide groove one; 65. fixing component; 66. guide groove two; 651. side plate two; 652. bottom plate two; 653. auxiliary push plate; 654. connecting block; 655. rotating rod; 656. sliding rod; 657. fixed push plate; 658. push rod; 659. driving member; 31. fixing seat; 32. stirring motor; 33. mounting block one; 34. mounting block two; 35. glue coating tube; 36. nozzle. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-7 As shown, a smart wireless chip gluing process includes the following steps:

[0034] Step 1: Use robot 1 to place the chip body on the glue coating device for glue coating operation;

[0035] Step 2: Use robot 2 to transfer the chip body after glue coating to the burning equipment for burning and drying. After drying, robot 3 will take it off and collect it;

[0036] The glue coating equipment in step one includes a liquid storage mechanism 1, a mounting plate 2 is symmetrically installed on the upper end of the liquid storage mechanism 1, a conveying mechanism 4 is arranged between the two mounting plates 2, both ends of the conveying mechanism 4 extend to the outside of the mounting plate 2 respectively, a transmission belt 5 is arranged on the conveying mechanism 4, and a plurality of fixing mechanisms 6 arranged at equal distances are installed on the outer surface of the conveying mechanism 4, the fixing mechanism 6 is located between the two mounting plates 2, and a glue coating mechanism 3 is fixedly installed at a position close to one side of the upper end of the mounting plate 2, and a driving motor for driving the conveying mechanism 4 to rotate is provided at the rear end of one of the mounting plates 2.

[0037] The gluing equipment performs the following gluing operations on the chip body:

[0038] The chip body is placed on the fixing mechanism 6 of the glue coating device, and then the driving motor is started to drive the conveying mechanism 4 to convey the chip body, and then the glue coating mechanism 3 sprays glue on the chip body, and the excess glue flows into the liquid storage mechanism 1 for collection.

[0039] The conveying mechanism 4 includes two symmetrically installed rotating wheels 41, a rotating shaft 43 is arranged inside the rotating wheel 41, both ends of the rotating shaft 43 extend to the outside of the rotating wheel 41, a transmission belt 5 and a conveying belt 42 are connected between the two rotating shafts 43, the conveying belt 42 is located between the two mounting plates 2, the transmission belt 5 is located in front of the mounting plate 2, and the rear end of one of the rotating shafts 43 is connected to the output end of the driving motor.

[0040] The glue coating mechanism 3 includes a fixed seat 31, a stirring motor 32, a water pump, a mounting block 1 33, a mounting block 2 34, a glue coating tube 35 and a nozzle 36. The fixed seat 31 is located at the upper end of the two mounting plates 2, the mounting block 1 33 is fixedly mounted on the upper end of the fixed seat 31, the mounting block 2 34 is fixedly mounted on one side of the mounting block 1 33, a glue coating tube 35 is screwed on one side of the mounting block 2 34, a plurality of nozzles 36 arranged at equal distances are arranged on the lower surface of the glue coating tube 35, the two ends of the water pump are respectively connected to the liquid storage mechanism 1 and the glue coating tube 35, a chamber is arranged inside the glue coating tube 35, a stirring shaft is arranged in the chamber, the stirring motor 32 is mounted on the mounting block 1 33, and the output end of the stirring motor 32 passes through the mounting block 2 34 to the inside of the chamber of the glue coating tube 35 and is connected to the stirring shaft.

[0041] The liquid storage mechanism 1 comprises a liquid storage box 11, a load-bearing plate 12, a baffle 13 and a guide plate 14. The load-bearing plate 12 and the baffle 13 are symmetrically installed on the upper end of the liquid storage box 11, respectively. The baffle 13 is located between the two load-bearing plates 12, and the guide plate 14 is located between the two baffles 13. The cross-sections of the guide plate 14 and the baffle 13 are both isosceles triangle structures. The upper end of the liquid storage box 11 is symmetrically provided with recovery grooves, which are located between the load-bearing plate 12 and the baffle 13.

[0042] The fixing mechanism 6 comprises a bottom plate 61, a side plate 62, a spring 63, a guide groove 64, a fixing assembly 65 and a guide groove 66. The upper end of the bottom plate 61 is symmetrically provided with a side plate 62, a fixing assembly 65 is provided between the two side plates 62, a plurality of springs 63 arranged in a circular array are connected between the lower end of the fixing assembly 65 and the upper end of the bottom plate 61, and the spring 63 is a linear spring. The side plate 62 is provided with a guide groove 64, and the guide groove 64 is downwardly extending. Inclined at an angle of 45 degrees, the guide groove 1 66 is arranged on the fixed component 65, the thickness and density of the linear spring remain unchanged from top to bottom, and the elastic coefficient is a fixed value, so that when the spring 1 63 is compressed after the chip body is placed on the fixed component 65, a more stable and linear dynamic response can be obtained, which is beneficial for the user to better select the elastic coefficient of the spring 1 63 according to actual needs, so that after the chip body is placed on the fixed component 65, the upper port of the guide groove 1 64 is aligned with the lower port of the guide groove 2 66, so as to facilitate the outflow of excess glue.

[0043] The fixing assembly 65 comprises a side plate 651, a bottom plate 652, an auxiliary push plate 653, a connecting block 654, a rotating rod 655, a sliding rod 656, a fixed push plate 657, a push rod 658 and a driving member 659. There are two side plates 651, and the two side plates 651 are fixedly mounted on the upper ends of the two side plates 62. The bottom plate 652 is located between the two side plates 651 near the bottom. The auxiliary push plate 653, the connecting block 654 and the sliding rod 656 are symmetrically mounted between the side plates 651 near the top. The connecting block 654 is located between the auxiliary push plate 653 and the sliding rod 656. A slide plate is installed, and a rotating rod 655 is rotatably installed between the slide plate and the connecting block 654. A spring 2 is installed between the slide plate and the inner wall of the second side plate 651. The spring 2 is a nonlinear coil spring. A fixed push plate 657 is arranged on the side of the auxiliary push plate 653 away from the connecting block 654. A push rod 658 is connected to one side of the fixed push plate 657. A driving member 659 is connected to one side of the push rod 658. A sliding groove matched with the fixed push plate 657 is arranged on the second side plate 651. A guide groove 2 66 is arranged on the second side plate 651. The guide groove 2 66 is inclined downward at an angle of 45 degrees. A rotating groove matched with the driving member 659 is arranged on the mounting plate 2.

[0044] The driving member 659 is an electric telescopic rod, a gas cylinder or an oil cylinder, preferably an electric telescopic rod, which is easier to control. The two ends of the water pump are respectively connected to the liquid storage box 11 and the glue coating pipe 35.

[0045] Working principle of the present invention:

[0046] The chip body is placed between the fixed push plate 657 and the auxiliary push plate 653, so the number of chip bodies on each fixing mechanism 6 is two. Before placing the chip body, the second spring is in a natural state, and the fixed push plate 657 does not contact the second side plate 651. First, one end of the chip body is brought into contact with the auxiliary push plate 653, and the auxiliary push plate 653 is pushed. The two slides slide away from each other on the slide bar 656, squeezing the second spring, and then the fixed push plate 657 is brought into contact with the other end of the chip body. A card slot for the chip body is also provided on the second side plate 651. The driving member 659 is started to push the fixed push plate 657, and the chip body slides in the card slot until the chip body is clamped between the fixed push plate 657 and the auxiliary push plate 653.

[0047] Start the driving motor to drive the conveying mechanism 4 to convey the fixing mechanism 6, that is, to convey the chip body, start the water pump to extract the glue in the liquid storage box 11 into the glue coating tube 35, and start the stirring motor 32 to drive the stirring shaft to rotate to avoid the glue in the glue coating tube 35 from condensing, which is not conducive to gluing. The glue is sprayed from the nozzle 36 to the upper surface of the chip body. Due to the increase in the weight of the two chip bodies, the spring 1 63 is compressed, and the upper port of the guide groove 1 64 is aligned with the lower port of the guide groove 2 66. The excess glue flows out to the upper end of the guide plate 14, flows along the inclined surface of the guide plate 14 to the recovery tank, and then is collected in the liquid storage box 11. After the gluing is completed, start the driving member 659 again to pull back the fixed push plate 657, and the auxiliary push plate 653 pushes the chip body out of the card slot under the action of the spring 2, and the robot 2 takes the chip body away.

[0048] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, and a specific direction structure and operation, and therefore, cannot be understood as a limitation on the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0049] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A smart wireless chip gluing process, characterized in that: The following steps are involved: Step 1, fixing the chip body: adding the chip body to the glue coating device, fixing the chip body by the fixing mechanism (6), and placing the chip body between the fixed push plate (657) and the auxiliary push plate (653); Step 2: transporting the chip body: starting the driving motor to drive the transport mechanism (4) to transport the fixing mechanism (6) and the chip body together; Step 3: Apply glue to the chip body: start the water pump to extract the glue liquid in the liquid storage box (11) into the glue coating tube (35), and the glue liquid is sprayed out from the nozzle (36) to apply glue to the chip body transported to the bottom of the nozzle (36); Step 4: Take out the chip body: After the glue coating is completed, the chip body in the fixing mechanism (6) is taken out by the second robot; Step 5: Recycling the glue liquid: Excess glue liquid flows from the fixing mechanism (6) to the liquid storage mechanism (1) and is collected.

2. The intelligent wireless chip gluing process according to claim 1, characterized in that: The number of chip bodies on each of the fixing mechanisms (6) is two.

3. The intelligent wireless chip gluing process according to claim 1, characterized in that: Before the chip body is placed, the second spring in the fixing mechanism (6) is in a natural state.

4. The intelligent wireless chip gluing process according to claim 1, characterized in that: Before the chip body is placed, the upper end of the guide groove 1 (64) in the fixing mechanism (6) is located below the lower end of the guide groove 2 (66).

5. The intelligent wireless chip gluing process according to claim 1, characterized in that: After the chip body is placed, the spring 1 (63) in the fixing mechanism (6) is in a compressed state, and the upper end of the guide groove 1 (64) is aligned with the lower end of the guide groove 2 (66).

6. The intelligent wireless chip gluing process according to claim 1, characterized in that: The excess glue liquid flows from the fixing mechanism (6) to the liquid storage mechanism (1) and is collected, which means that the excess glue liquid flows out to the upper end of the guide plate (14) in the liquid storage mechanism (1), flows along the inclined surface of the guide plate (14) to the recovery tank, and is then collected in the liquid storage box (11).

7. The intelligent wireless chip gluing process according to claim 1, characterized in that: A stirring shaft rod for homogenizing the glue liquid is arranged in the glue coating tube (35).

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