Semiconductor diode forming device

Abstract

The present invention discloses a semiconductor diode forming device, wherein a conveyor belt with a plurality of limit seats is arranged on the outer wall of the supporting shell, the limit seats are arranged at equal intervals along the length direction of the conveyor belt, a slot with a stopper connected internally and slidably is provided at the bottom of the placement slot, an arc-shaped contact block is fixedly installed at the bottom of the stopper, a pressing block matching the arc-shaped contact block is fixedly installed on both sides of the conveyor belt and on the outer wall of the supporting shell respectively, a limit folding block matching the placement slot is installed at one end of the first slide away from the bidirectional screw rod, a support shaft with a limit fan blade rotatably installed is fixedly installed between the pressing block and the limit folding block and on the outer wall of the supporting shell, and two limit fan blades symmetrically arranged about the conveyor belt push and contact with the diode pin. The present invention greatly improves the position accuracy of the diode, avoids the position displacement of the diode during the transmission process, and thus improves the processing quality.

Description

Technical Field

[0001] The invention relates to the technical field of diode processing, and in particular to a semiconductor diode forming device. Background Art

[0002] Semiconductor diodes are generally composed of PN junctions and pins, and the pins are located at both ends of the PN junction. Some specifications of diodes require one end of the pin to be bent and formed. In the existing production line, the cut diodes need to be transported and clamped and bent one by one by a bending device.

[0003] After searching, the Chinese patent publication number CN115172239B discloses a semiconductor diode forming device, including a workbench, a feeding mechanism and a cutting and bending integrated mechanism, the feeding mechanism is fixedly arranged above the workbench; the feeding mechanism includes a feeding table, a guide plate and a feeder; the upper end surface of the feeding table is arranged horizontally; there are two guide plates, and the two guide plates are arranged on both sides of the feeding table respectively, each guide plate is provided with a first guide groove that cooperates with the diode material belt, and a guide member for guiding the diode material belt into the first guide groove is provided at the feed end of the guide plate; a vacant position is provided in the middle of each guide plate, and the feeder is arranged at the vacant position of the guide plate and spans above the feeding table. This application can ensure the smooth transportation of the diode material belt through the cooperation of the guide plate and the feeder, and a guide member is provided at the feed end of the guide plate to prevent the diode material belt from getting stuck at the feed end of the guide plate.

[0004] The above device transports the diode via a guide plate and a feeder, and cuts and bends the diode via an integrated cutting and bending mechanism. However, the diode is prone to displacement during the transmission process, resulting in inconsistent bending degrees of the pins at both ends of the diode, affecting the processing quality of the diode. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor diode forming device, which realizes the position limitation of the semiconductor diode, greatly improves the position accuracy of the diode, avoids the situation where the position deviation of the diode during transmission causes the pins at both ends to be bent to different degrees, thereby improving the processing quality.

[0006] To achieve the above object, the technical solution adopted by the present invention is: a semiconductor diode forming device, comprising: a base, a conveying track for transmitting diodes is arranged on one side of the base, a supporting shell is fixedly installed on the top of the base, and a conveying belt with a plurality of limit seats is arranged on the outer wall of the supporting shell, the limit seats are arranged at equal intervals along the length direction of the conveying belt, and a bending mechanism is arranged on both sides of the conveying belt; A placement groove for accommodating the diode is provided on the top of the limiting seat, and an opening is provided on the left and right side walls of the placement groove, and a pin limiting groove is provided on the side wall of the opening close to the conveying track, and a slot with a stopper slidably connected inside is provided at the bottom of the placement groove, and an arc-shaped contact block is fixedly installed at the bottom of the stopper, and a pressing block matching with the arc-shaped contact block is fixedly installed on both sides of the conveyor belt and on the outer wall of the supporting shell, respectively. When the limiting seat is located above the pressing block, the pressing block can lift the stopper so that the stopper closes the opening of the pin limiting groove; A bearing seat is symmetrically arranged at the bottom of one end of the conveying track close to the conveyor belt, and a sliding rod and a bidirectional screw rod are arranged between the two bearing seats, the bidirectional screw rod located below the sliding rod is rotatably connected to the bearing seat, two nuts are located on the outer wall of the bidirectional screw rod and symmetrically with respect to the conveyor belt, and the nut is fixedly connected to a first slide mounted on the sliding rod, and a limiting folding block corresponding to the placement groove is installed at the end of the first slide rod away from the bidirectional screw rod, a support shaft with a rotatably installed limiting fan blade is located between the pressure block and the limiting folding block and fixedly installed on the outer wall of the supporting shell, and the two limiting fan blades symmetrically arranged with respect to the conveyor belt are in contact with the diode pin push-up, thereby pushing the diode pin from the opening into the pin limiting groove.

[0007] The further improved scheme in the above technical scheme is as follows: 1. In the above scheme, the bending mechanism includes: a first connecting frame, a bottom pressure plate, a driving bin and a pressing knife located inside the driving bin, the first connecting frame installed on the outer wall of the supporting shell is located below the driving bin, and the bottom pressure plate is fixedly installed on the top of the first connecting frame, and the bottom pressure plate is located below the diode pin, and the driving bin is used to drive the pressing knife to press down and bend the diode pin along the side wall of the bottom pressure plate.

[0008] 2. In the above scheme, a first slide groove is provided on one side of the drive bin relative to the first connecting frame, a second slide groove is provided inside the first slide groove and on the outer wall of the pressing knife, a first support plate is fixedly installed above the second slide groove, a third support plate is movably clamped in the second slide groove, a hydraulic rod is provided between the first support plate and the third support plate, the movable end of the hydraulic rod is fixedly connected to the third support plate, a pressure plate cooperating with the bottom pressure plate is provided below the third support plate, and a plurality of pressure rods are provided between the pressure plate and the third support plate.

[0009] 3. In the above scheme, a second support plate slidably connected to the limit rod is fixedly installed on the outer wall of the drive bin, and the bottom of the limit rod is fixedly connected to the pressure plate, and a spring is located between the pressure plate and the second support plate and sleeved on the outer wall of the limit rod.

[0010] 4. In the above scheme, a servo motor for driving the bidirectional screw to rotate is fixedly mounted on the outer wall of one of the bearing seats.

[0011] 5. In the above solution, a second slide is sleeved on the outer wall of the support shaft, and one end of the second slide away from the support shaft is fixedly connected to the first slide.

[0012] 6. In the above solution, a guide groove for receiving the diode is provided at the rear end of the conveyor belt in the transmission direction and on one side of the base.

[0013] 7. In the above solution, the pressing block is in the shape of a trapezoid, and a guiding inclined surface cooperating with the arc-shaped contact block is formed at both ends of the upper part of the pressing block.

[0014] 8. In the above solution, a bearing is provided between the limiting fan blade and the support shaft.

[0015] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The semiconductor diode forming device of the present invention transmits the diode on a conveying track, and the diode is transferred from the conveying track to the conveyor belt, and the diode falls into the placement groove of the limit seat, and the pin of the diode can be exposed from the opening, and the two first slides are driven to move synchronously toward each other by driving the bidirectional lead screw to rotate forward, so that the two synchronously moving limit folding blocks push the semiconductor diode to the middle position of the placement groove, and during the transmission process of the conveyor belt, the semiconductor diode located in the placement groove of the limit seat will push the limit fan blade, and the limit fan blade has a reaction force on the semiconductor diode, thereby pushing the semiconductor diode into the pin limit groove to achieve the position limitation of the semiconductor diode, and the limit seat continues to move, so that the arc contact block moves along the pressure block, thereby lifting the block and closing the pin limit groove, thereby avoiding the situation that the diode rolls out of the pin limit groove, greatly improving the position accuracy of the diode, and avoiding the situation that the position offset of the diode during the transmission process causes the pins at both ends to be bent to different degrees, thereby improving the processing quality.

[0016] 2. The semiconductor diode forming device of the present invention has a first connecting frame installed on the outer wall of the supporting shell and located below the driving chamber, and a bottom pressing plate is fixedly installed on the top of the first connecting frame, and the bottom pressing plate is located below the diode pins. The driving chamber is used to drive the pressing knife to press down and bend the diode pins along the side wall of the bottom pressing plate. A second sliding groove is arranged inside the first sliding groove and on the outer wall of the pressing knife. A hydraulic rod is arranged between the first support plate and the third support plate, and a pressing plate cooperating with the bottom pressing plate is arranged below the third support plate, and a A number of pressing rods initially limit the diodes through the grooves of the conveyor belt and drive the diodes to move. When they move to the bottom of the pressure plate, the pins of the several diodes are simultaneously located between the pressure plate and the bottom pressure plate. The pressing knife is driven downward by the driving bin and the hydraulic rod drives the pressure plate downward. During the downward movement, the pressure plate fixes the diode pins in advance, and then the diode pins are bent along the side wall of the bottom pressure plate by the pressing knife. This not only improves the position accuracy of the pins and improves the processing effect, but also allows multiple diodes to be bent at the same time, greatly improving the overall processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attached Figure 1 It is a schematic structural diagram of a semiconductor diode forming device of the present invention; Attached Figure 2 It is a structural schematic diagram of a bending mechanism in a semiconductor diode forming device of the present invention; Attached Figure 3 It is a partial structural schematic diagram of the semiconductor diode forming device of the present invention; Attached Figure 4 The local structure of the semiconductor diode forming device of the present invention is decomposed Figure 1 ; Attached Figure 5 The local structure of the semiconductor diode forming device of the present invention is decomposed Figure 2 .

[0018] In the above drawings: 101, drive bin; 102, first slide; 103, first support plate; 104, second support plate; 105, limit rod; 106, spring; 107, bottom pressure plate; 108, first connecting frame; 109, pressure plate; 110, hydraulic rod; 111, third support plate; 112, pressure rod; 113, pressure knife; 114, second slide; 201, limit seat; 202, pressure block; 203, stop block; 204, arc contact block; 205, placement slot; 206, slot; 207, pin limit slot; 208, opening; 301, bearing seat; 302, slide rod; 303, first slide; 304, bidirectional screw rod; 305, servo motor; 306, nut; 307, limit fan blade; 309, limit folding block; 310, second slide; 311, bearing; 312, support shaft; 4, conveyor track; 5, base; 6, guide groove; 7, support shell; 8, conveyor belt; 9, guide slope; 10, support frame. Implementation

[0019] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0020] Embodiment 1: A semiconductor diode forming device comprises: a base 5, a conveying track 4 for conveying diodes is arranged on one side of the base 5, a supporting shell 7 is fixedly installed on the top of the base 5, and a conveying belt 8 with a plurality of limit seats 201 is arranged on the outer wall of the supporting shell 7, the limit seats 201 are arranged at equal intervals along the length direction of the conveying belt 8, and a bending mechanism is arranged on both sides of the conveying belt 8; The semiconductor diode is transported along the conveyor track to the conveyor belt position. When the semiconductor diode reaches the tail end of the conveyor track and leaves the conveyor track, it just falls into the opening of a certain limit seat being transported by the conveyor belt. As the conveyor belt is transported, the pins at both ends of the semiconductor diode are driven by the limit fan blades to enter the placement groove, and the pins pass through the pin limit groove; A placement groove 205 for accommodating a diode is provided on the top of the limiting seat 201, and an opening 208 is provided on the left and right side walls of the placement groove 205, and a pin limiting groove 207 is provided on the side wall of the opening 208 close to the conveying track 4, and a slot 206 with a stopper 203 slidably connected inside is provided at the bottom of the placement groove 205, and an arc-shaped contact block 204 is fixedly installed at the bottom of the stopper 203, and a pressing block 202 cooperating with the arc-shaped contact block 204 is fixedly installed on both sides of the conveyor belt 8 and on the outer wall of the supporting shell 7, respectively. When the limiting seat 201 is located above the pressing block 202, the pressing block 202 can lift the stopper 203, so that the stopper 203 closes the opening of the pin limiting groove 207; A bearing seat 301 is symmetrically arranged at the bottom of one end of the conveying track 4 close to the conveyor belt 8, and a sliding rod 302 and a bidirectional screw rod 304 are arranged between the two bearing seats 301, the bidirectional screw rod 304 located below the sliding rod 302 is rotatably connected to the bearing seat 301, and two nuts 306 are arranged on the outer wall of the bidirectional screw rod 304 and symmetrically with respect to the conveyor belt 8, and the nut 306 is fixedly connected with a first sliding rack 303 sleeved on the sliding rod 302, and a limiting folding block 309 corresponding to the placement groove 205 is installed at one end of the first sliding rack 303 away from the bidirectional screw rod 304, and a support shaft 312 on which a limiting fan blade 307 is rotatably installed is located between the pressure block 202 and the limiting folding block 309 and fixedly installed on the outer wall of the supporting shell 7, and the two limiting fan blades 307 symmetrically arranged with respect to the conveyor belt 8 are in contact with the diode pin push-up, thereby pushing the diode pin from the opening 208 into the pin limiting groove 207; When the semiconductor diode falls into the opening, there may be a certain displacement, resulting in it not being able to enter the placement slot smoothly. The servo motor drives the bidirectional screw to rotate, further clamping the two limit blocks inward and contacting the two sides of the PN junction, so that it moves to the middle position in the opening and aligns with the placement slot. When the two limit blocks return to their positions and the limit seat continues to move, the pin contacts the limit fan blade. In the process of pushing the limit fan blade to rotate, it can smoothly enter the placement slot under the reaction of the driving force.

[0021] The above-mentioned bending mechanism includes: a first connecting frame 108, a bottom pressure plate 107, a driving bin 101 and a pressing knife 113 located inside the driving bin 101. The first connecting frame 108 installed on the outer wall of the above-mentioned supporting shell 7 is located below the above-mentioned driving bin 101, and the above-mentioned bottom pressure plate 107 is fixedly installed on the top of the above-mentioned first connecting frame 108. This bottom pressure plate 107 is located below the diode pin. The above-mentioned driving bin 101 is used to drive the pressing knife 113 to press down and bend the diode pin along the side wall of the bottom pressure plate 107.

[0022] A first slide groove 102 is provided on one side of the driving bin 101 relative to the first connecting frame 108, a second slide groove 114 is provided inside the first slide groove 102 and on the outer wall of the pressing knife 113, a first support plate 103 is fixedly installed above the second slide groove 114, a third support plate 111 is movably engaged in the second slide groove 114, a hydraulic rod 110 is provided between the first support plate 103 and the third support plate 111, a movable end of the hydraulic rod 110 is fixedly connected to the third support plate 111, a pressing plate 109 cooperating with the bottom pressing plate 107 is provided below the third support plate 111, and a plurality of pressing rods 112 are provided between the pressing plate 109 and the third support plate 111; While the diode is initially limited by the groove of the conveyor belt, the diode is driven to move. When it moves to the bottom of the pressure plate, the pins of several diodes are simultaneously located between the pressure plate and the bottom pressure plate. The pressure cutter is driven downward by the driving bin and the pressure plate is driven downward by the hydraulic rod. During the downward movement, the pressure plate fixes the diode pins in advance, and then the diode pins are bent along the side wall of the bottom pressure plate by the pressure cutter. This not only improves the position accuracy of the pins and the processing effect, but also allows multiple diodes to be bent at the same time, greatly improving the overall processing efficiency.

[0023] A second support plate 104 slidably connected to a limiting rod 105 is fixedly installed on the outer wall of the driving bin 101, and the bottom of the limiting rod 105 is fixedly connected to the pressure plate 109, between which a spring 106 is sleeved on the outer wall of the limiting rod 105.

[0024] When the pressing knife and the bottom pressure plate are used to clamp and bend the pins, during the downward movement of the pressing knife, the pressing rod is driven by the first support plate to press the pressure plate located on the outer wall of the driving bin, and the spring is stretched until the pressure plate is pressed on the pin located on the bottom pressure plate to press and fix it. At this time, the pressing knife does not touch the pin position. After the pressure plate is pressed into place, the hydraulic rod simultaneously releases pressure, and the pressing knife continues to press down to bend, thereby achieving correction before bending and pressing during bending, ensuring bending accuracy and bending effect.

[0025] A second slide 310 is sleeved on the outer wall of the support shaft 312 , and one end of the second slide 310 away from the support shaft 312 is fixedly connected to the first slide 303 .

[0026] A guide groove 6 for receiving the diode is provided at the rear end of the conveyor belt 8 in the transmission direction and on one side of the base 5 .

[0027] The pressing block 202 is in a trapezoidal shape, and a guiding inclined surface 9 is formed at both ends of the upper portion of the pressing block 202 to match the arc-shaped contact block 204 .

[0028] A bearing 311 is disposed between the limiting blade 307 and the support shaft 312 .

[0029] The conveyor track 4 is located above the conveyor belt 8 .

[0030] Embodiment 2: A semiconductor diode forming device comprises: a base 5, a conveying track 4 for conveying diodes is arranged on one side of the base 5, a supporting shell 7 is fixedly installed on the top of the base 5, and a conveying belt 8 with a plurality of limit seats 201 is arranged on the outer wall of the supporting shell 7, the limit seats 201 are arranged at equal intervals along the length direction of the conveying belt 8, and a bending mechanism is arranged on both sides of the conveying belt 8; A placement groove 205 for accommodating a diode is provided on the top of the limiting seat 201, and an opening 208 is provided on the left and right side walls of the placement groove 205, and a pin limiting groove 207 is provided on the side wall of the opening 208 close to the conveying track 4, and a slot 206 with a stopper 203 slidably connected inside is provided at the bottom of the placement groove 205, and an arc-shaped contact block 204 is fixedly installed at the bottom of the stopper 203, and a pressing block 202 cooperating with the arc-shaped contact block 204 is fixedly installed on both sides of the conveyor belt 8 and on the outer wall of the supporting shell 7, respectively. When the limiting seat 201 is located above the pressing block 202, the pressing block 202 can lift the stopper 203, so that the stopper 203 closes the opening of the pin limiting groove 207; During the transmission process of the conveyor belt, the semiconductor diode located in the placement groove of the limit seat will push the limit fan blade, and the limit fan blade has a reaction force on the semiconductor diode, thereby pushing the semiconductor diode into the pin limit groove to achieve the position limitation of the semiconductor diode. As the limit seat continues to move, the arc contact block moves along the pressing block, thereby lifting the stop block and closing the pin limit groove, thereby avoiding the situation where the diode rolls out of the pin limit groove, greatly improving the position accuracy of the diode, and avoiding the situation where the position of the diode is offset during the transmission process, resulting in different bending degrees of the pins at both ends, thereby improving the processing quality; A bearing seat 301 is symmetrically arranged at the bottom of one end of the conveying track 4 close to the conveyor belt 8, and a sliding rod 302 and a bidirectional screw rod 304 are arranged between the two bearing seats 301, the bidirectional screw rod 304 located below the sliding rod 302 is rotatably connected to the bearing seat 301, and two nuts 306 are arranged on the outer wall of the bidirectional screw rod 304 and symmetrically with respect to the conveyor belt 8, and the nut 306 is fixedly connected with a first sliding rack 303 sleeved on the sliding rod 302, and a limiting folding block 309 corresponding to the placement groove 205 is installed at one end of the first sliding rack 303 away from the bidirectional screw rod 304, and a support shaft 312 on which a limiting fan blade 307 is rotatably installed is located between the pressure block 202 and the limiting folding block 309 and fixedly installed on the outer wall of the supporting shell 7, and the two limiting fan blades 307 symmetrically arranged with respect to the conveyor belt 8 are in contact with the diode pin push-up, thereby pushing the diode pin from the opening 208 into the pin limiting groove 207; Driving the bidirectional lead screw to rotate forward drives the two first slides to move synchronously toward each other, so that the two limiting folding blocks moving synchronously push the semiconductor diode to the middle position of the placement slot. Under this structure, the semiconductor diode can be effectively prevented from being dislocated. Then, the arc contact block contacts the pressure block. When it contacts the top of the pressure block, the stop block is lifted up as a resistance to prevent the semiconductor diode from shifting. Multiple semiconductor diodes can be limited at the same time through the longer pressure block, so that the bending mechanism can be used to simultaneously bend multiple semiconductor diodes. Under this structure, multiple semiconductor diodes are limited at the same time and their stability is guaranteed, thereby realizing the synchronous forming processing of multiple semiconductor diodes, reducing the reciprocating frequency of the bending mechanism, and playing a role in energy saving and extending the service life of the machinery.

[0031] The above-mentioned bending mechanism includes: a first connecting frame 108, a bottom pressure plate 107, a driving bin 101 and a pressing knife 113 located inside the driving bin 101. The first connecting frame 108 installed on the outer wall of the above-mentioned supporting shell 7 is located below the above-mentioned driving bin 101, and the above-mentioned bottom pressure plate 107 is fixedly installed on the top of the above-mentioned first connecting frame 108. This bottom pressure plate 107 is located below the diode pin. The above-mentioned driving bin 101 is used to drive the pressing knife 113 to press down and bend the diode pin along the side wall of the bottom pressure plate 107.

[0032] A first slide groove 102 is provided on one side of the driving bin 101 relative to the first connecting frame 108, a second slide groove 114 is provided inside the first slide groove 102 and on the outer wall of the pressing knife 113, a first support plate 103 is fixedly installed above the second slide groove 114, a third support plate 111 is movably engaged in the second slide groove 114, a hydraulic rod 110 is provided between the first support plate 103 and the third support plate 111, a movable end of the hydraulic rod 110 is fixedly connected to the third support plate 111, a pressing plate 109 cooperating with the bottom pressing plate 107 is provided below the third support plate 111, and a plurality of pressing rods 112 are provided between the pressing plate 109 and the third support plate 111; A servo motor 305 for driving the bidirectional screw rod 304 to rotate is fixedly mounted on the outer wall of one of the bearing seats 301 .

[0033] A second slide 310 is sleeved on the outer wall of the support shaft 312 , and one end of the second slide 310 away from the support shaft 312 is fixedly connected to the first slide 303 .

[0034] A guide groove 6 for receiving the diode is provided at the rear end of the conveyor belt 8 in the transmission direction and on one side of the base 5 .

[0035] The pressing block 202 is in a trapezoidal shape, and a guiding inclined surface 9 is formed at both ends of the upper portion of the pressing block 202 to match the arc-shaped contact block 204 .

[0036] The driving compartment 101 and the base 5 are fixedly connected via a supporting frame 10 .

[0037] A driving mechanism for driving the conveyor belt 8 is disposed inside the supporting shell 7 .

[0038] The working principle is: During the processing, the semiconductor diode is transported along the conveyor track to the conveyor belt position. When the semiconductor diode reaches the tail end of the conveyor track and leaves the conveyor track, it just falls into the opening of a certain limit seat being transported by the conveyor belt. As the conveyor belt is transported, the pins at both ends of the semiconductor diode are driven by the limit fan blades to enter the placement groove, and the pins pass through the pin limit groove; Among them, when the semiconductor diode falls into the opening, there may be a certain displacement, resulting in failure to smoothly enter the placement groove. The servo motor drives the bidirectional screw to rotate, further clamping the two limit folding blocks inward, contacting the two sides of the PN junction, so that it moves to the middle position in the opening and aligns with the placement groove. When the two limit folding blocks return to their positions and the limit seat continues to move, the pin contacts the limit fan blade. In the process of pushing the limit fan blade to rotate, under the reaction of the driving force, it can smoothly enter the placement groove. Under this structure, the semiconductor diode can be effectively prevented from being dislocated. Then, the arc contact block contacts the pressing block. When it contacts the top of the pressing block, the stopper is lifted as a stopper to prevent the semiconductor diode from shifting. Multiple semiconductor diodes can be simultaneously limited by a longer pressing block, so that the bending mechanism can be used to simultaneously bend multiple semiconductor diodes. Under this structure, the simultaneous limiting of multiple semiconductor diodes is achieved, and their stability is guaranteed, the synchronous forming processing of multiple semiconductor diodes is achieved, the reciprocating frequency of the bending mechanism is reduced, and the effect of energy saving and extending the service life of the machine is achieved. When the pressing knife and the bottom pressure plate are used to clamp and bend the pins, during the downward movement of the pressing knife, the pressing rod is driven by the first support plate to press the pressure plate located on the outer wall of the driving bin, and the spring is stretched until the pressure plate is pressed on the pin located on the bottom pressure plate to press and fix it. At this time, the pressing knife does not touch the pin position. After the pressure plate is pressed into place, the hydraulic rod simultaneously releases pressure, and the pressing knife continues to press down to bend, thereby achieving correction before bending and pressing during bending, ensuring bending accuracy and bending effect.

[0039] When the semiconductor diode forming device is used, the diode is transmitted on the conveying track, and the diode is transferred from the conveying track to the conveyor belt, and the diode falls into the placement groove of the limit seat, and the pin of the diode can be exposed from the opening, and the two first slides are driven to move synchronously toward each other by driving the bidirectional lead screw to rotate forward, so that the two synchronously moving limit folding blocks push the semiconductor diode to the middle position of the placement groove, and during the transmission process of the conveyor belt, the semiconductor diode located in the placement groove of the limit seat will push the limit fan blade, and the limit fan blade has a reaction force on the semiconductor diode, thereby pushing the semiconductor diode into the pin limit groove to achieve the position limitation of the semiconductor diode, and the limit seat continues to move, so that the arc contact block moves along the pressure block, thereby lifting the block and closing the pin limit groove, thereby avoiding the situation that the diode rolls out of the pin limit groove, greatly improving the position accuracy of the diode, and avoiding the situation that the position offset of the diode during the transmission process causes the pins at both ends to be bent to different degrees, thereby improving the processing quality; In addition, while the diode is initially limited by the groove of the conveyor belt, it drives the diode to move. When it moves to the bottom of the pressure plate, the pins of several diodes are simultaneously located between the pressure plate and the bottom pressure plate. The pressure cutter is driven downward by the driving bin and the pressure plate is driven downward by the hydraulic rod. During the downward movement, the pressure plate fixes the diode pins in advance, and then the diode pins are bent along the side wall of the bottom pressure plate by the pressure cutter. This not only improves the position accuracy of the pins and improves the processing effect, but also allows multiple diodes to be bent at the same time, greatly improving the overall processing efficiency.

[0040] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor diode forming device, comprising: A base (5), characterized in that: a conveying track (4) for transmitting diodes is arranged on one side of the base (5), a supporting shell (7) is fixedly installed on the top of the base (5), and a conveyor belt (8) having a plurality of limit seats (201) is arranged on the outer wall of the supporting shell (7), the limit seats (201) are arranged at equal intervals along the length direction of the conveyor belt (8), and a bending mechanism is arranged on both sides of the conveyor belt (8); The top of the limiting seat (201) is provided with a placement groove (205) for accommodating a diode, and an opening (208) is provided on the left and right side walls of the placement groove (205), and a pin limiting groove (207) is provided on the side wall of the opening (208) close to the conveying track (4), and a slot (206) with a stopper (203) slidably connected thereto is provided at the bottom of the placement groove (205), an arc-shaped contact block (204) is fixedly installed at the bottom of the stopper (203), and a pressing block (202) cooperating with the arc-shaped contact block (204) is fixedly installed on both sides of the conveying belt (8) and on the outer wall of the supporting shell (7), respectively; when the limiting seat (201) is located above the pressing block (202), the pressing block (202) can lift up the stopper (203), so that the stopper (203) closes the opening of the pin limiting groove (207); A bearing seat (301) is symmetrically arranged at the bottom of one end of the conveying track (4) close to the conveyor belt (8), and a sliding rod (302) and a bidirectional screw rod (304) are arranged between the two bearing seats (301). The bidirectional screw rod (304) located below the sliding rod (302) is rotatably connected to the bearing seat (301). Two nuts (306) are symmetrically arranged on the outer wall of the bidirectional screw rod (304) with respect to the conveyor belt (8), and the nuts (306) are fixedly connected to a first slide bracket (303) sleeved on the sliding rod (302). ), a limiting folding block (309) corresponding to the placement groove (205) is installed at one end of the first slide (303) away from the bidirectional screw rod (304), and a support shaft (312) on which a limiting fan blade (307) is rotatably installed is fixedly installed between the pressure block (202) and the limiting folding block (309) and on the outer wall of the supporting shell (7), and two limiting fan blades (307) symmetrically arranged with respect to the conveyor belt (8) are in push-top contact with the diode pin, thereby pushing the diode pin from the opening (208) into the pin limiting groove (207).

2. The semiconductor diode forming device according to claim 1, characterized in that: The bending mechanism comprises: a first connecting frame (108), a bottom pressure plate (107), a driving chamber (101), and a pressing knife (113) located inside the driving chamber (101); the first connecting frame (108) mounted on the outer wall of the supporting shell (7) is located below the driving chamber (101), and the bottom pressure plate (107) is fixedly mounted on the top of the first connecting frame (108); the bottom pressure plate (107) is located below the diode pins; the driving chamber (101) is used to drive the pressing knife (113) to press down and bend the diode pins along the side wall of the bottom pressure plate (107).

3. The semiconductor diode forming device according to claim 2, characterized in that: The driving bin (101) is provided with a first slide groove (102) on one side relative to the first connecting frame (108), a second slide groove (114) is arranged inside the first slide groove (102) and on the outer wall of the pressing knife (113), a first support plate (103) is fixedly installed above the second slide groove (114), a third support plate (111) is movably engaged in the second slide groove (114), a hydraulic rod (110) is arranged between the first support plate (103) and the third support plate (111), a movable end of the hydraulic rod (110) is fixedly connected to the third support plate (111), a pressing plate (109) cooperating with the bottom pressing plate (107) is arranged below the third support plate (111), and a plurality of pressing rods (112) are arranged between the pressing plate (109) and the third support plate (111).

4. The semiconductor diode forming device according to claim 3, characterized in that: A second support plate (104) slidably connected to a limit rod (105) is fixedly mounted on the outer wall of the drive bin (101), and the bottom of the limit rod (105) is fixedly connected to the pressure plate (109). A spring (106) is sleeved on the outer wall of the limit rod (105) and is located between the pressure plate (109) and the second support plate (104).

5. The semiconductor diode forming device according to claim 1, characterized in that: A servo motor (305) for driving the bidirectional screw rod (304) to rotate is fixedly mounted on the outer wall of one of the bearing seats (301).

6. The semiconductor diode forming device according to claim 1, characterized in that: A second slide frame (310) is sleeved on the outer wall of the support shaft (312), and one end of the second slide frame (310) away from the support shaft (312) is fixedly connected to the first slide frame (303).

7. The semiconductor diode forming device according to claim 1, characterized in that: A guide groove (6) for receiving a diode is provided at the rear end of the conveying belt (8) in the transmission direction and on one side of the base (5).

8. The semiconductor diode forming device according to claim 1, characterized in that: The pressing block (202) is in the shape of a trapezoid, and a guiding inclined surface (9) cooperating with the arc-shaped contact block (204) is formed at both ends of the upper part of the pressing block (202).

9. The semiconductor diode forming device according to claim 1, characterized in that: A bearing (311) is provided between the position-limiting blade (307) and the support shaft (312).

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