Unsupported overhang structure scanning path planning method, electronic device and storage medium

Abstract

The present application relates to the field of 3D printing technology, and aims to solve the technical problem that the existing 3D printing technology needs to add support to form the overhanging surface, and provides a scanning path planning method, electronic device and storage medium for an unsupported overhanging structure. Among them, the scanning path planning method for an unsupported overhanging structure includes: setting the unsupported overhanging structure into multiple forming layers, setting the parameters of each forming layer, and dividing the scanning surface of each forming layer into a connecting scanning area and an overhanging scanning area; forming a corresponding first entity part by a first scanning method; setting the scanning path of the overhanging scanning area, from the connecting boundary connected to the first entity part toward the outside, forming a corresponding second entity part by a second scanning method in the overhanging scanning area, and the starting end and the ending end of the scanning path of the second scanning method are both located at the connecting boundary connecting the overhanging scanning area and the first entity part. The beneficial effect of the present application is that an unsupported overhanging structure can be formed without support.

Description

Technical Field

[0001] The present application relates to the field of 3D printing technology, and more specifically, to a scanning path planning method for an unsupported overhanging structure, an electronic device, and a storage medium. Background Art

[0002] Laser powder bed fusion additive manufacturing, namely SLM (selective laser melting) printing technology, is an additive manufacturing technology that uses laser to melt layer-by-layer metal powder and then solidify it to form a printed part.

[0003] Traditional laser powder bed fusion additive manufacturing has the problem of too many auxiliary supports when manufacturing parts with cavities and suspended structures. Printing and adding auxiliary supports not only increases the time to print parts, but also increases the complexity of the part post-processing process. Reducing the auxiliary supports of printed parts or printing without supports is one of the difficult problems faced by laser powder bed fusion additive manufacturing. Summary of the invention

[0004] The present application provides a scanning path planning method for an unsupported overhang structure, an electronic device and a storage medium to solve the technical problem that the existing SLM technology needs to add supports when forming overhang surfaces.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, the present application provides a scanning path planning method for an unsupported overhanging structure, comprising: setting the unsupported overhanging structure into multiple molding layers, setting parameters of each molding layer, and dividing the scanning surface of each molding layer into a connecting scanning area and an overhanging scanning area, wherein the overhanging scanning area of ​​the same molding layer extends from the first end of the corresponding connecting scanning area, and two adjacent molding layers are stacked up and down on each other; setting the scanning path of the connecting scanning area to form a corresponding first entity part through a first scanning method; setting the scanning path of the overhanging scanning area to set a minimum identifiable area size of the overhanging scanning area, and forming a corresponding second entity part through a second scanning method within the overhanging scanning area with the minimum area extending from a connecting boundary connected to the first entity part toward the outside through a second scanning method, and the starting end and the ending end of the scanning path of the second scanning method are both located at the connecting boundary connecting the overhanging scanning area and the first entity part.

[0007] When the second laser scans the overhang scanning area, the connection boundary coincides with the outer edge of the first entity part, and the starting end and the ending end of the scanning path of the second laser are both located at the connection boundary, so that the metal printing powder melted at the starting end is connected to the first entity part, and the metal printing powder melted at the ending end is connected to the first entity part. In this way, the part of the molten pool corresponding to the starting end and the part corresponding to the ending end formed in the overhang scanning area are firmly connected to the first entity part and firmly supported by the first entity part, and the other parts of the molten pool that are suspended relative to the first molding layer are stably kept in a suspended state at the starting end and the ending end, which greatly reduces the problems of sagging, collapse, deformation or warping of the molten pool, and ensures the forming quality of the second entity part. In addition, in this embodiment, there is no need to set the bottom support structure of the unsupported overhang structure during printing, and then there is no need to remove the support structure later, which improves the printing efficiency. In addition, the scanning path planning method of the unsupported overhang structure of this embodiment can also form structures such as conformal waterways, internal flow channels and porous structures that cannot be post-processed to support, and ensure their forming quality, and has a wide range of applications.

[0008] In one possible implementation:

[0009] Determine whether the overhanging scanning area of ​​the previous molding layer exceeds the connection boundary of the corresponding end of the molding layer of the next layer and is suspended; if so, set the overhanging scanning area of ​​the previous molding layer to be molded in the second scanning method; if not, set the overhanging scanning area of ​​the previous molding layer to be molded in the first scanning method.

[0010] In one possible implementation:

[0011] The first scanning mode includes strip scanning; the second scanning mode includes successive offset scanning, wherein the successive offset scanning is offset outward from a connection boundary between the overhanging scanning area and the first entity part.

[0012] In one possible implementation:

[0013] The first end of the connection scanning area of ​​the previous molding layer is located on the inner side of the second end of the previous molding layer; the overhanging scanning area includes a connected transition scanning area and a suspended scanning area, the transition scanning area is located between the connection boundary of the corresponding end of the next molding layer and the first end of the connection scanning area, and the suspended scanning area is located at the connection boundary of the corresponding end of the next molding layer and is suspended.

[0014] In one possible implementation:

[0015] The scanning path of the overhanging scanning area includes a scanning line group, and the scanning line group includes multiple scanning lines. The starting ends and the ending ends of the multiple scanning lines are both located at the connecting boundary where the overhanging scanning area is connected to the first physical part, and the multiple scanning lines are arranged in sequence from the middle of the connecting boundary toward the third end of the overhanging scanning area.

[0016] In one possible implementation:

[0017] The scanning lines of the scanning line group all have a starting segment, an extension segment and an ending segment; the starting segment extends from the connecting boundary to the overhanging scanning area; the ending segment extends from the overhanging scanning area to the connecting boundary, and the starting segment and the ending segment are arranged at intervals along the length of the connecting boundary; the extension segment is located in the overhanging scanning area and is connected between the ending segment and the starting segment.

[0018] In one possible implementation:

[0019] The distance between two adjacent scanning lines is s, the width of the overhanging scanning area is w, and 0.1w≤s≤0.3w.

[0020] In one possible implementation:

[0021] The forming of the corresponding second entity part by a second scanning method in the overhanging scanning area from the connection boundary connected to the first entity part toward the outside of the minimum area includes: performing multiple laser scans in the overhanging scanning area, and the scanning paths of two adjacent laser scans are different.

[0022] In a second aspect, the present application provides an electronic device, comprising a processor and a memory, wherein the memory is used to store instructions, and the processor is used to call the instructions in the memory so that the electronic device executes the unsupported suspended structure scanning path planning method as described above.

[0023] In a third aspect, the present application provides a storage medium, wherein at least one instruction is stored in the storage medium, and when the at least one instruction is executed by a processor, the scanning path planning method for an unsupported suspended structure as described above is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A flowchart of a scanning path planning method for an unsupported overhanging structure according to an embodiment of the present application;

[0026] Figure 2 This is a schematic structural diagram of an unsupported suspension structure according to an embodiment of the present application;

[0027] Figure 3 This is one of the partial structural schematic diagrams of the unsupported suspension structure of one embodiment of the present application;

[0028] Figure 4 This is a second schematic diagram of a partial structure of an unsupported suspension structure according to an embodiment of the present application;

[0029] Figure 5 One of the schematic diagrams of the overhang scanning area according to an embodiment of the present application;

[0030] Figure 6 This is a second schematic diagram of a suspended scanning area according to an embodiment of the present application;

[0031] Figure 7 Schematic diagram of a scanning path planning method for an unsupported suspended structure according to an embodiment of the present application.

[0032] Description of main component symbols:

[0033] Unsupported overhanging structure 100 First molding layer 10 Second molding layer 20 First entity part 21 Second entity part 22 Connect Scan Area Q1 Overhang scanning area Q2 Transition scanning area Q3 Suspended scanning area Q4 Connecting Boundaries E1 First end E2 The second end E3 The third end E4 Overhang P Scan line group 30 Scan Line 40 Start segment 41 Extension 42 Ending 43 Electronic devices 200 Memory 201 processor 202 Computer Programs 203 DETAILED DESCRIPTION

[0034] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific implementations. It should be noted that the implementations of the present application and the features in the implementations can be combined with each other without conflict.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present application. The described implementations are only part of the implementations of the present application, rather than all the implementations.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0037] It should be further noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0038] In this application, "at least one" means one or more, and "more" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.

[0039] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0040] To facilitate understanding, some illustrations of concepts related to the embodiments of the present application are given by way of example for reference.

[0041] 3D printing equipment, also known as three-dimensional printers, is a rapid prototyping process equipment, usually using digital technology to print materials. 3D printing equipment is often used to manufacture models or parts in the fields of mold manufacturing, industrial design, etc.

[0042] See also Figure 1 and Figure 2 , Figure 1 The flowchart of the scanning path planning method of the unsupported overhang structure provided in the embodiment of the present application is a diagram of an unsupported overhang structure 100 to be formed, and the unsupported overhang structure 100 has an overhang surface P. The scanning path planning method of the unsupported overhang structure of the present embodiment includes the following steps:

[0043] Step 101: Set the unsupported overhang structure 100 into multiple molding layers 50, set the parameters of each molding layer 50, and divide the scanning surface of each molding layer 50 into a connecting scanning area Q1 and a overhang scanning area Q2. The overhang scanning area Q2 of the same molding layer 50 extends from the first end E2 of the corresponding connecting scanning area Q1, and two adjacent molding layers 50 are stacked up and down.

[0044] In some embodiments, the target model of the unsupported overhang structure 100 is imported into a 3D printing device, which slices the target model and obtains a molding layer 50 corresponding to the target model. For example, the target model may correspond to a plurality of molding layers 50, and the plurality of molding layers 50 may be stacked layer by layer in a vertical direction, so that the model molding process can be performed layer by layer from bottom to top.

[0045] In this embodiment, the specific scanning process of the multi-layer molding layer 50 is described with the adjacent first molding layer 10 and the second molding layer 20. The second molding layer 20 is stacked on the first molding layer 10. The first molding layer 10 can be the bottom molding layer 50, or it can be one molding layer 50 among the multi-layer molding layers 50.

[0046] Step 102: Set the scanning path of the connection scanning area Q1, and form the corresponding first entity part 21 through the first scanning method. The connection scanning area Q1 of the current molding layer 50 is supported on the printing surface or on the next molding layer 50, so that the molten pool formed by the metal powder therein can be stably supported during the scanning process of the first laser. Therefore, the scanning path of the first scanning method can adopt a known laser scanning method, such as strip scanning, etc., to improve the scanning efficiency.

[0047] Step 103: Set the scanning path of the overhanging scanning area Q2, set the minimum area size that can be recognized by the overhanging scanning area Q2, and form the corresponding second entity part 22 in the overhanging scanning area Q2 through a second scanning method from the connecting boundary E1 connected to the first entity part 21 toward the outside with the minimum area. The starting end and the ending end of the scanning path of the second scanning method are both located at the connecting boundary E1 connecting the overhanging scanning area Q2 and the first entity part 21.

[0048] When the overhang scanning area Q2 of the molding layer 50 is relatively large, it is necessary to divide the overhang scanning area Q2 into a plurality of minimum areas, and perform scanning in each minimum area in a second scanning manner to form a corresponding second entity portion 22 .

[0049] See also Figure 3 and Figure 4When the overhang scanning area Q2 is scanned in the second scanning mode, the connection boundary E1 coincides with the outer edge of the first entity part 21, and the starting end and the ending end of the scanning path of the second laser are both located at the connection boundary E1, so that the metal printing powder melted at the starting end is connected to the first entity part 21, and the metal printing powder melted at the ending end is connected to the first entity part 21. In this way, the part of the molten pool corresponding to the starting end and the part corresponding to the ending end formed by the overhang scanning area Q2 are both firmly connected to the first entity part 21 and firmly supported by the first entity part 21, and the other parts of the molten pool suspended relative to the first molding layer 10 are stably kept in a suspended state at the starting end and the ending end, which greatly reduces the problems of sagging, collapse, deformation or warping of the molten pool, and ensures the forming quality of the second entity part 22. In addition, in this embodiment, there is no need to set the bottom support structure of the unsupported overhang structure 100 during printing, and thus there is no need to remove the support structure later, thereby improving the printing efficiency. In addition, the scanning path planning method for the unsupported suspended structure of this embodiment can also form conformal waterways, internal flow channels, porous structures and other structures that cannot be post-processed to remove supports, and ensure their forming quality, and has a wide range of applications.

[0050] In addition, the unsupported overhang structure 100 formed by the unsupported overhang structure scanning path planning method of this embodiment has an inclination angle of the bottom surface that is less than 45° and can be as low as 15°. The unsupported overhang structure 100 can be formed without support, and the inclination angle of the bottom surface (overhang surface P) of the formed unsupported overhang structure 100 is relatively low.

[0051] In some embodiments, it is determined whether the overhanging scanning area Q2 of the upper molding layer 50 exceeds the connection boundary E1 of the corresponding end of the lower molding layer 50 and is suspended; if so, the overhanging scanning area Q2 of the upper molding layer 50 is set to be molded in the second scanning method; if not, the overhanging scanning area Q2 of the upper molding layer 50 is set to be molded in the first scanning method.

[0052] When the first molding layer 10 is the bottom molding layer 50, or the first molding layer 10 has no suspended area relative to the molding layer 50 below it, the first scanning method of the first molding layer 10 can be scanned by a known scanning method to improve the scanning efficiency; when the first molding layer 10 has a suspended area relative to the molding layer 50 below it, the suspended scanning area Q2 of the first molding layer 10 can be formed by the steps described above. In some embodiments, the first scanning method is performed with a first scanning strategy, and the second scanning method is performed with a second scanning strategy. Among them, the first scanning strategy can adopt a known scanning strategy. In the second scanning strategy, the scanning speed is 1000mm / s to 3000mm / s, and the laser power is 50W to 200W.

[0053] In this embodiment, the second scanning mode includes a successive offset scanning, and the successive offset scanning is offset outward from a connection boundary E1 where the overhang scanning area Q2 is connected to the first entity portion 21 .

[0054] In some embodiments, see Figure 5 and Figure 6 The scanning path of the overhanging scanning area Q2 includes a scanning line group 30, and the scanning line group 30 includes a plurality of scanning lines 40. The starting ends and the ending ends of the plurality of scanning lines 40 are both located at a connection boundary E1 where the overhanging scanning area Q2 is connected to the first entity portion 21. The plurality of scanning lines 40 are spaced apart in sequence from the middle of the connection boundary E1 toward the overhanging scanning area Q2 and away from the third end E4 of the connection scanning area Q1.

[0055] The scanning and forming at the overhanging scanning area Q2 can be gradually completed by multiple scanning lines 40. By limiting the scanning lines 40 to scan in sequence from the connection boundary E1 toward the third end E4 at intervals, the second entity part 22 can be formed by expanding outward from the middle of the connection boundary E1 in sequence. In this forming process, the middle of the second entity part 22 is first connected to the first entity part 21. When the edge of the second entity part 22 is subsequently formed, the middle of the second entity part 22 can also play a partial supporting role for the edge of the second entity part 22, thereby further ensuring the forming quality of the second entity part 22 relative to the overhanging area of ​​the first molding layer 10 and reducing the possibility of its collapse or deformation.

[0056] In some embodiments, see Figure 6 The scanning line 40 includes a starting segment 41, an extension segment 42 and an end segment 43. The starting segment 41 extends from the connection boundary E1 to the overhang scanning area Q2, and the end segment 43 extends from the overhang scanning area Q2 to the connection boundary E1. The extension segment 42 is located in the overhang scanning area Q2 and is connected between the end segment 43 and the starting segment 41.

[0057] In this embodiment, the connection boundary E1 is a straight line, and the cross section of the second entity portion 22 is a rectangular structure. In other embodiments, the connection boundary E1 can also be set as a curve or a special-shaped line, and the cross section of the second entity portion 22 can also be set as a polygon, a semicircle, a special shape, etc.

[0058] In some embodiments, see Figure 4 The connection boundary E1 of the connecting scanning area Q1 is located on the inner side of the second end E3 of the first molding layer 10; the overhanging scanning area Q2 includes a connected transition scanning area Q3 and a suspended scanning area Q4, the transition scanning area Q3 is located between the second end E3 and the connection boundary E1 of the connecting scanning area Q1, and the suspended scanning area Q4 is located on the outer side of the first molding layer 10 and is suspended.

[0059] The area of ​​the suspended scanning area Q4 suspended relative to the first molding layer 10 is the part that is not supported by the first molding layer 10 in the vertical direction, and at least part of the suspended scanning area Q2 is a suspended area, that is, the suspended scanning area Q2 can be completely suspended relative to the first molding layer 10, or part of the suspended scanning area Q2 can be completely suspended relative to the first molding layer 10. The projection of the connection scanning area Q1 on the first molding layer 10 does not exceed the second end E3 of the first molding layer 10 at all.

[0060] Obviously, this embodiment does not limit the specific shape and number of the overhang scanning area Q2, nor does it limit the specific shape of the connection boundary E1. For example, the connection boundary E1 can be a straight line, a curve, or a special-shaped line.

[0061] After the connection boundary E1 of the connection scanning area Q1 is offset to the inner side of the first molding layer 10, the molten pool formed by the starting end and the ending end of the scanning line 40 of the second scanning mode is also supported by the first molding layer 10, thereby improving the stability of the support of the part corresponding to the starting end and the part corresponding to the ending end of the molten pool, further improving the stability of the molten pool located in the suspended scanning area Q4, and improving the forming quality of the second solid part 22 formed thereby.

[0062] In some embodiments, the laser energy density of the transition scanning area Q3 is higher than the laser energy density of the suspended scanning area Q4 and lower than the laser energy density of the connection scanning area Q1 .

[0063] By reducing the laser energy density of the suspended scanning area Q4, it is possible to avoid excessive heat input in the suspended scanning area Q4, and to avoid excessive heat accumulation in this area to cause sagging or warping deformation, so as to improve the forming strength of the second solid part 22 while ensuring the forming effect, ensure the forming quality, and enable the second solid part 22 to withstand the force exerted on it by the scraper during the subsequent powder spreading process and keep its shape intact during subsequent processing.

[0064] In addition, by setting different scanning paths in each scanning mode, the heat accumulation effect at the same position of the overhanging scanning area Q2 can be reduced, so as to avoid the second solid part 22 from warping and deformation due to heat accumulation, thereby ensuring the forming quality of the second solid part 22 and enabling the second solid part 22 to be stably and reliably formed without support.

[0065] Different scanning strategies and scanning angles are set for each scan. By adjusting the scanning strategies and scanning angles, the heat accumulation effect of the unsupported overhang structure 100 is controlled to prevent the unsupported overhang structure 100 from warping and deformation due to heat accumulation. During the laser 3D printing process, the scanning path planning of the offset unsupported overhang structure 100 is like a "bridge" that stably connects the two ends of the unsupported overhang structure 100, thereby avoiding sagging, collapse, deformation, warping and other deformations of the unsupported overhang structure 100.

[0066] For example, the total number of laser scans can be set to two, three, four, five, six, seven, etc.

[0067] In some embodiments, in step S103 , multiple laser scans are performed in the overhang scanning area Q2 in a second scanning mode, and the scanning paths of two adjacent second scanning modes are different.

[0068] In this way, by performing multiple laser scans on the suspended scanning area Q2, it can be ensured that the suspended scanning area Q4 can still achieve the formation of metal printing powder at a low laser energy density, thereby ensuring the forming quality of the second solid part 22. By making the scanning paths of two adjacent laser scans different, it is possible to avoid excessive heat accumulation in the same area, thereby ensuring uniform heat distribution in the suspended scanning area Q4.

[0069] The scanning pitch of the first scanning method is greater than the scanning pitch of the second scanning method. By shortening the scanning pitch of the second scanning method, the compactness of the second entity part 22 formed can be ensured under the premise that the second scanning method adopts a lower laser energy density.

[0070] In some embodiments, during the scanning process of the second scanning method, the laser energy density of the second laser may gradually decrease, gradually increase, or remain the same along the scanning path of the second laser. Obviously, the second scanning strategy and the change of the laser energy density of the second laser may be appropriately adjusted according to various parameters such as the actual overhang angle of the unsupported overhang structure 100, the area, width, and weight of the overhang scanning area Q2.

[0071] In this embodiment, referring to the figure, the interval between two adjacent scanning lines 40 is s, the width of the overhanging scanning area Q2 is w, and 0.1w≤s≤0.3w.

[0072] If the spacing s is too small, it is easy to cause the local temperature of the overhang scanning area Q2 to be too high. If the spacing s is too large, it is easy to cause problems such as unstable forming quality and insufficient internal connection strength of the second entity part 22. By limiting the size of the spacing s, it can be ensured that the local temperature in the overhang scanning area Q2 will not be too high, the heat accumulation effect can be avoided, the possibility of warping deformation can be reduced, and the forming quality of the second entity part 22 can be guaranteed.

[0073] Figure 7 This is a schematic diagram of an embodiment of an electronic device of the present application.

[0074] The electronic device 200 includes a memory 201, a processor 202, and a computer program 203 stored in the memory 201 and executable on the processor 202. When the processor 202 executes the computer program 203, the steps in the above-mentioned laser additive manufacturing control method embodiment are implemented, for example Figure 1 Steps S101 to S104 are shown.

[0075] Exemplarily, the computer program 203 may also be divided into one or more modules / units, which are stored in the memory 201 and executed by the processor 202. The one or more modules / units may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the execution process of the computer program 203 in the electronic device 200.

[0076] The electronic device 200 may be a computing device such as a desktop computer, a notebook, a PDA, an industrial computer, a tablet computer, a server, etc. Those skilled in the art will appreciate that the schematic diagram is merely an example of the electronic device 200 and does not constitute a limitation on the electronic device 200. The electronic device 200 may include more or fewer components than shown in the figure, or may combine certain components, or different components. For example, the electronic device 200 may also include input and output devices, network access devices, buses, etc.

[0077] The processor 202 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor, a single-chip microcomputer, or the processor 202 may also be any conventional processor, etc.

[0078] The memory 201 can be used to store computer programs 203 and / or modules / units. The processor 202 implements various functions of the electronic device 200 by running or executing the computer programs and / or modules / units stored in the memory 201 and calling the data stored in the memory 201. The memory 201 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data (such as audio data) created according to the use of the electronic device 200, etc. In addition, the memory 201 can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other non-volatile solid-state storage devices.

[0079] If the module / unit integrated in the electronic device 200 is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0080] In the several embodiments provided in this application, it should be understood that the disclosed electronic device and method can be implemented in other ways. For example, the electronic device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and there may be other division methods in actual implementation.

[0081] In addition, each functional unit in each embodiment of the present application may be integrated into the same processing unit, each unit may exist physically separately, or two or more units may be integrated into the same unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0082] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A scanning path planning method for an unsupported overhang structure, used for printing an unsupported overhang structure, characterized in that: include: The unsupported overhanging structure is set to be a plurality of forming layers, parameters of each forming layer are set, and a scanning surface of each forming layer is divided into a connection scanning area and an overhang scanning area, wherein the overhang scanning area of ​​the same forming layer extends from a first end of the corresponding connection scanning area, and two adjacent forming layers are stacked up and down; Setting a scanning path of the connected scanning area to form a corresponding first entity part by a first scanning method; A scanning path of the overhanging scanning area is set, and a minimum area size that can be identified by the overhanging scanning area is set, so that the corresponding second entity part is formed outward within the overhanging scanning area through a second scanning method with the minimum area extending from the connection boundary connected to the first entity part, and the starting end and the ending end of the scanning path of the second scanning method are both located at the connection boundary connecting the overhanging scanning area and the first entity part.

2. The scanning path planning method for an unsupported suspended structure according to claim 1, characterized in that: Determine whether the overhang scanning area of ​​the upper molding layer exceeds the connection boundary of the corresponding end of the molding layer of the next layer and is suspended; If yes, setting the overhang scanning area of ​​the last molding layer to be molded in the second scanning mode; If not, the overhang scanning area of ​​the previous molding layer is set to be molded in the first scanning manner.

3. The scanning path planning method for an unsupported suspended structure according to claim 1, characterized in that: The first scanning mode includes strip scanning; The second scanning mode includes a successive offset scanning, and the successive offset scanning is offset outward from a connection boundary connecting the overhanging scanning area and the first entity part.

4. The scanning path planning method for an unsupported suspended structure according to claim 1, characterized in that: The first end of the connection scanning area of ​​the last molding layer is located inside the second end of the previous molding layer; The suspended scanning area includes a connected transition scanning area and a suspended scanning area. The transition scanning area is located between the connection boundary of the corresponding end of the next molding layer and the first end of the connection scanning area. The suspended scanning area is located at the connection boundary of the corresponding end of the next molding layer and is suspended.

5. The scanning path planning method for an unsupported suspended structure according to claim 1, characterized in that: The scanning path of the overhanging scanning area includes a scanning line group, and the scanning line group includes multiple scanning lines. The starting ends and the ending ends of the multiple scanning lines are both located at the connecting boundary where the overhanging scanning area is connected to the first physical part, and the multiple scanning lines are arranged in sequence from the middle of the connecting boundary toward the third end of the overhanging scanning area away from the connecting scanning area.

6. The scanning path planning method for an unsupported suspended structure according to claim 5, characterized in that: The scanning lines of the scanning line group all have a starting segment, an extending segment and an ending segment; The starting section extends from the connection boundary into the overhang scanning area; The end segment extends from the overhang scanning area to the connection boundary, and the start segment and the end segment are arranged at intervals along the length of the connection boundary; The extension section is located in the overhang scanning area and is connected between the end section and the start section.

7. The scanning path planning method for an unsupported suspended structure according to claim 5, characterized in that: The distance between two adjacent scanning lines is s, the width of the overhanging scanning area is w, and 0.1w≤s≤0.3w.

8. The scanning path planning method for an unsupported suspended structure according to claim 1, characterized in that: The forming of the corresponding second entity part by a second scanning method in the overhanging scanning area from the connection boundary connected to the first entity part toward the outside of the minimum area comprises: Multiple laser scans are performed in the overhang scanning area, and the scanning paths of two adjacent laser scans are different.

9. An electronic device, characterized in that: The electronic device comprises a processor and a memory, wherein the memory is used to store instructions, and the processor is used to call the instructions in the memory, so that the electronic device executes the scanning path planning method for an unsupported suspended structure as described in any one of claims 1 to 8.

10. A storage medium, characterized in that: The storage medium stores at least one instruction, and when the at least one instruction is executed by the processor, the scanning path planning method for the unsupported suspended structure according to any one of claims 1 to 8 is implemented.

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