Wafer micro bump preparation equipment and method based on visual positioning and detection

Abstract

The invention relates to the technical field of welding, in particular to wafer micro-bump preparation equipment and method based on visual positioning and detection, and the preparation equipment comprises a platform which is provided with a visual positioning detection device, a laser solder ball welding device and a temperature control device; the temperature control device comprises a heating module, a positioning and supporting module, a cooling module and a control module. Through accurate temperature control in the preheating stage, micro bump preparation can be carried out on a wafer product at a proper temperature. According to the preparation method provided by the invention, the wafer product can be subjected to micro bump preparation at a proper temperature through accurate temperature control in the preheating stage. The appropriate preheating temperature is beneficial for improving the mobility of the solder balls and the binding force of the solder balls and wafer products, so that the micro-bumps are more regular in shape and more uniform in size. The method effectively solves the problems of poor thermal stress and wettability of wafer micro bumps prepared by adopting a laser welding mode.

Description

Technical Field

[0001] The present invention relates to the field of welding technology, and in particular to a wafer micro-bump preparation device and method based on visual positioning and detection. Background Art

[0002] With the rapid development of electronic information technology, electronic products are constantly moving towards miniaturization, high performance and multifunctionality. In the field of microelectronic packaging, wafer microbumps are key structures for electrical connection and mechanical support between chips and external circuits or substrates. Traditional wafer microbump preparation methods, such as ball implantation, electroplating, and evaporation, have gradually exposed many limitations.

[0003] The precise placement of solder balls during the ball implantation process relies on a relatively complex mechanical structure and process control, which makes it difficult to meet the increasingly narrowing requirements for bump spacing and size, and is prone to deviations and defects when processing tiny solder balls. The electroplating method requires special electroplating equipment and chemical reagents, and the process is relatively cumbersome and pollutes the environment to a certain extent. At the same time, it may face difficulties in preparing high-melting-point metal or alloy bumps, and its cost also increases with the improvement of process precision requirements. The evaporation method requires a high vacuum environment and a complex mask production process. The equipment cost is high, the production efficiency is low, and the flexibility is insufficient when preparing bumps of complex shapes and compositions. At the same time, laser technology has made great progress in the field of material processing. Lasers have the characteristics of high energy density, good directionality and precise control, and can achieve rapid heating and cooling in a very small area, providing a very potential means for micro-machining.

[0004] However, laser welding is a process of rapid heating and cooling. The material is heated up from room temperature to above the melting point in a very short time, and then quickly cooled and solidified. This rapid thermal cycle will cause a large temperature gradient inside the material, thereby inducing thermal stress. Thermal stress can easily cause micro-bumps to produce defects such as cracks and deformations, reducing the mechanical strength and reliability of the micro-bumps. For brittle materials such as wafers, excessive stress may even cause cracks in the wafer itself, seriously affecting the performance and yield of the chip. At the same time, the surface tension of the bump material is difficult to adjust quickly during the rapid heating process of laser welding, making the wettability of the liquid bump material on the wafer surface worse. The poor wettability will increase the contact angle between the micro-bump and the wafer, and the solder joints formed will be irregular and incomplete, thereby reducing the actual connection area, increasing the contact resistance, and affecting the electrical performance. In severe cases, it may cause welding defects such as cold solder joints, making the signal transmission of the chip unstable.

[0005] Therefore, how to solve the problem of thermal stress and poor wettability in preparing wafer micro-bumps by laser welding is an urgent problem that technicians in this field need to solve. Summary of the invention

[0006] In order to solve the problems of thermal stress and poor wettability in preparing wafer micro-bumps by laser welding, the present application provides a wafer micro-bump preparation device and method based on visual positioning and detection.

[0007] The wafer micro-bump preparation device and method based on visual positioning and detection provided in this application adopt the following technical solutions: First aspect A wafer micro-bump preparation device based on visual positioning and detection comprises a platform, a mounting frame is fixedly connected to the platform, a first slide rail is arranged on the mounting frame along a first direction, a mounting plate is slidably connected to the first slide rail, a visual positioning detection device and a laser solder ball welding device are installed on the mounting plate, a second slide rail is arranged on the platform along a second direction, the first direction is perpendicular to the second direction, a mounting seat is slidably connected to the second slide rail, a temperature control device thermally connected to a wafer product is installed on the mounting seat; the temperature control device comprises a mounting box, a heating module is installed inside the mounting box, a positioning support module is installed on the top of the heating module corresponding to the wafer product, the heating module is connected to a cooling module, and a control module is electrically connected between the heating module and the cooling module.

[0008] Furthermore, the installation box includes a bottom box, a partition is installed inside the bottom box, the partition divides the bottom box into an execution area and a control area, the heating module is fixedly installed on the bottom box at a position inside the execution area, and the control module is fixedly installed on the bottom box at a position inside the control area; a first box cover is installed on the bottom box corresponding to the execution area, and a second box cover is installed on the bottom box corresponding to the control area.

[0009] Furthermore, the heating module includes an insulation bracket, which is fixedly installed inside the installation box, an insulation board is installed on the insulation bracket, a heat conduction platform is fixedly installed on the insulation board, an electric heating wire is fixedly installed inside the heat conduction platform, the electric heating wire is electrically connected to the control module, and the positioning support module is fixedly installed on the top of the heat conduction platform.

[0010] Furthermore, the positioning support module includes a fixing plate, which is fixedly installed on the top surface of the heat conduction platform, a positioning piece is fixedly connected to the fixing plate, a positioning portion is provided on the wafer product corresponding to the positioning piece, and at least three supporting balls are fixedly connected to the fixing plate, and the supporting balls are in point contact with the surface of the wafer product.

[0011] Furthermore, the cooling module includes an air guide sleeve, which is arranged on the outside of the heat insulation board and the heat conduction platform, the bottom of the air guide sleeve is fixedly installed on the bottom of the heat insulation board, the top of the air guide sleeve extends toward the top of the heat conduction platform, the top of the air guide sleeve is fixedly installed with an air guide cover, the top of the air guide cover extends toward the top of the heat conduction platform, the bottom of the air guide sleeve is fixedly installed with a cold air pipe, the outside of the cold air pipe is fixedly connected with a plurality of cold air nozzles that are evenly distributed in an annular shape and communicated with the air guide sleeve, the cold air pipe is connected to a refrigeration device, and the refrigeration device is electrically connected to the control module.

[0012] Furthermore, the control module includes a temperature sensor and an over-temperature protector, the temperature sensor and the over-temperature protector are fixedly mounted on the heat-conducting table, the temperature sensor and the over-temperature protector are electrically connected to a controller, and the controller is electrically connected to the heating wire.

[0013] Furthermore, a first vertically arranged telescopic member is fixedly installed inside the installation box, a connecting frame is fixedly connected to the first telescopic member, at least three vertically arranged top rods are fixedly connected to the connecting frame corresponding to the wafer product, the top rods can slide through the heating module and the positioning support module, a buffer pad is fixedly installed on the top of the top rod, a buffer block is fixedly connected to the connecting frame, and a buffer is fixedly installed on the installation box corresponding to the buffer block.

[0014] Furthermore, the fixed plate is provided with a plurality of annularly evenly distributed air guide holes, a temperature control cavity is provided on the top of the heat conducting platform corresponding to the air guide holes, a first temperature control tube connected to the temperature control cavity is fixedly and sealedly connected to the heat conducting platform, the first temperature control tube is connected to an air pump, and a second temperature control tube is connected to the output end of the air pump, a plurality of annularly evenly distributed elbow nozzles are sealed and rotatably connected to the top of the heat conducting platform near its outer edge, an annular temperature control channel sealedly connected to the nozzle is provided inside the heat conducting platform, and the second temperature control tube is sealedly connected to the annular temperature control channel.

[0015] Furthermore, the outer side of the elbow nozzle is fixedly connected to a driven gear, the outer side of the heat conduction platform is rotatably connected to a driving ring gear meshing with the driven gear, the driving ring gear is hingedly connected to a second telescopic member, and the second telescopic member is hingedly connected to the mounting box.

[0016] Second aspect A method for preparing wafer micro-bumps based on visual positioning and detection comprises the following steps: S1. Place the wafer product with micro-bumps to be prepared on a temperature control device, and position and support the wafer product through a positioning support module; S2, preheating the wafer product through a heating module; S3. After reaching the set preheating temperature, use the visual positioning detection device to obtain the precise positioning coordinates of the wafer product; S4, preparing micro bumps on the wafer product according to the precise positioning coordinates of the wafer product by using a laser solder ball welding device; S5. After the micro-bumps are prepared, the wafer product is cooled by a cooling module; S6. After the wafer product is cooled, the wafer product is removed from the temperature control device to complete the preparation of wafer micro-bumps.

[0017] Beneficial effects achieved: The present application can prepare micro-bumps on wafer products at a suitable temperature through precise temperature control in the preheating stage. The appropriate preheating temperature helps to improve the fluidity of the solder balls and the bonding strength with the wafer products, making the shape of the micro-bumps more regular and the size more uniform. At the same time, effective control in the cooling stage can avoid problems such as stress concentration caused by rapid cooling of the micro-bumps, thereby improving the quality and stability of the micro-bumps, and effectively solving the problems of thermal stress and poor wettability in the preparation of wafer micro-bumps by laser welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0019] Figure 2 It is a schematic diagram of the three-dimensional structure of a temperature control device in an embodiment of the present application.

[0020] Figure 3 It is a schematic diagram of the structural decomposition of a temperature control device in one embodiment of the present application.

[0021] Figure 4 It is a schematic diagram of the internal structure of a temperature control device in one embodiment of the present application.

[0022] Figure 5 It is a schematic diagram of the structural decomposition of a heating module in one embodiment of the present application.

[0023] Figure 6 yes Figure 4 Schematic diagram of the enlarged structure of Part I.

[0024] Figure 7 yes Figure 5 Schematic diagram of the enlarged structure of Part II.

[0025] Figure 8 It is a schematic diagram of the structural decomposition of a cooling module in one embodiment of the present application.

[0026] Fig. 9 It is a schematic diagram of the installation structure of the first telescopic member in an embodiment of the present application.

[0027] Fig.10 It is a schematic diagram of the working principle of the air pump in one embodiment of the present application.

[0028] Explanation of reference numerals: 1000, wafer product; 1001, positioning unit; 3000, platform; 3001, mounting frame; 3002, mounting seat; 3003, first slide rail; 3004, mounting plate; 3005, second slide rail; 4000, visual positioning detection device; 5000, laser solder ball welding device; 6000, temperature control device; 6100, installation box; 6101, bottom box; 6102, partition; 6103, execution area; 6104, control area; 6105, first box cover; 6106, second box cover; 6200, heating module; 6201, thermal insulation bracket; 6202, thermal insulation board; 6203, heat conduction platform; 6204, heating wire; 6300, positioning support module; 6301, fixing plate; 6302, fixing Positioning part; 6303, supporting ball; 6304, air guide hole; 6305, temperature control chamber; 6306, first temperature control tube; 6307, vacuum pump; 6308, second temperature control tube; 6309, elbow nozzle; 6310, annular temperature control channel; 6311, driven gear; 6312, active gear ring; 6313, second telescopic part; 6400, cooling module; 6401, air guide sleeve; 6402, air guide cover; 6403, cold air pipe; 6404, cold air nozzle; 6500, control module; 6501, temperature sensor; 6502, over-temperature protector; 6503, controller; 6600, first telescopic part; 6601, connecting frame; 6602, ejector rod; 6603, buffer pad; 6604, buffer block; 6605, buffer. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-10 This application is described in further detail.

[0030] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0031] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] The embodiments of the present application disclose a wafer micro-bump preparation device and method based on visual positioning and detection.

[0033] Example 1 Please refer to Figures 1 to 10 In one embodiment of the present application, a wafer micro-bump preparation device based on visual positioning and detection includes a platform 3000, and the platform 3000 is made of marble. Marble has been aged by nature, and its internal stress is almost zero, so its material is stable, its organizational structure is precise, its texture is uniform, it will not be deformed by conventional factors, and its flatness tolerance can reach a very high standard. It can be used as a high-precision reference surface, which is conducive to ensuring the accuracy and consistency of welding work.

[0034] During the working process, the platform 3000 made of marble has high compressive strength and can withstand greater pressure and impact force when the equipment is running, which is conducive to ensuring structural stability and providing solid support for welding operations. At the same time, it also has good wear resistance and corrosion resistance, smooth surface, small roughness, and is not easy to wear after long-term use, thereby reducing the reduction of accuracy and equipment failure caused by wear. In addition, the platform 3000 made of marble has no magnetic reaction. As a non-metallic material, it will not produce magnetic interference, which is very important for welding microelectronic components and other objects that are sensitive to magnetism, and is conducive to ensuring welding quality.

[0035] Please refer to Figures 1 to 10 In one embodiment of the present application, a mounting frame 3001 is fixedly connected to the platform 3000, and the mounting frame 3001 is arranged in an arch shape. A first slide rail 3003 is arranged on the mounting frame 3001 along a first direction, and a mounting plate 3004 is slidably connected to the first slide rail 3003. A visual positioning detection device 4000 and a laser solder ball welding device 5000 are installed on the mounting plate 3004. A second slide rail 3005 is arranged on the platform 3000 along a second direction, and the first direction is perpendicular to the second direction. A mounting seat 3002 is slidably connected to the second slide rail 3005, and a temperature control device 6000 thermally connected to the wafer product 1000 is installed on the mounting seat 3002.

[0036] During operation, after the wafer product 1000 is placed on the temperature control device 6000, the visual positioning detection device 4000 will take pictures through camera vision to obtain the precise positioning coordinates of the wafer product 1000, and by controlling the mounting plate 3004 and the mounting seat 3002 to move relative to each other in the first direction and the second direction respectively, the laser solder ball welding device 5000 can prepare wafer micro-bumps on the wafer product 1000 by laser spraying according to the precise positioning coordinates of the wafer product 1000; when the wafer product 1000 is placed on the temperature control device 6000 for the preparation of wafer micro-bumps, the temperature control device 6000 can be used to preheat the wafer product 1000 before laser spraying. Preheating can increase the overall temperature of the wafer product 1000, so that the physical properties of the wafer product 1000 can reach a relatively stable state before laser spraying. When laser ball spraying is performed, the thermal expansion of the welding material can be made more uniform, which can effectively reduce the internal stress caused by temperature changes, thereby reducing the deformation and defects of the wafer and improving product quality. At the same time, the preheated wafer product 1000 can make the liquid bump material on the wafer surface more wettable. Because proper preheating can reduce the speed of material solidification, the material can remain in a molten state for a longer time under the same laser energy. This can produce micro-bumps with more uniform size and better sphericity when laser ball spraying is used to make micro-bumps, thereby improving the connection strength between the micro-bumps and the wafer product 1000 and enhancing the reliability of the entire electronic package.

[0037] In a specific embodiment of the present application, the laser solder ball welding device 5000 can adopt the application number 202411535084.9 and the invention name of a laser heating soft solder welding device. The laser heating soft solder welding device uses a laser to directly heat the spherical solder. The spherical solder is directly heated, melted and re-solidified on the surface of the pad. There is no need to pre-place solder (flux) on the surface of the pad, which not only reduces the equipment and process of applying flux, but also ensures the welding quality and reduces the equipment and process of cleaning flux.

[0038] Please refer to Figures 1 to 10 In one embodiment of the present application, the temperature control device 6000 includes an installation box 6100, which provides a stable installation foundation for other components of the entire temperature control device, such as the heating module 6200, the positioning support module 6300, the cooling module 6400, and the control module 6500, etc., to ensure that each component can be reasonably arranged and installed according to the design requirements, and to ensure the structural stability of the entire temperature control device. At the same time, it can also play a certain protective role, protecting the internal components from the influence of external environmental factors, and helping to maintain a relatively stable and clean operating environment inside the device.

[0039] Please refer to Figures 1 to 10 In one embodiment of the present application, a heating module 6200 is installed inside the installation box 6100. The heating module 6200 is the core component for preheating the wafer product 1000. It can generate heat and transfer the heat to the wafer product 1000, so that the temperature of the wafer product 1000 is increased to a preheating temperature range that meets the requirements of the laser ball spraying process, ensuring that the performance of the material is close to an ideal state during the subsequent laser ball spraying process, which is beneficial to ensuring the effect and quality of preparing micro-bumps, and effectively solving the problems of thermal stress and poor wettability in preparing wafer micro-bumps by laser welding.

[0040] Please refer to Figures 1 to 10 In one embodiment of the present application, a positioning support module 6300 is installed on the top of the heating module 6200 corresponding to the wafer product 1000. The positioning support module 6300 is responsible for accurately positioning and firmly supporting the wafer product 1000, ensuring that the wafer is in a suitable position during the preheating process to prevent it from shifting, shaking, etc. This is very important for ensuring the uniformity of heating and the stability of the entire micro-bump preparation process. Only when the wafer position is accurately fixed can each part be heated evenly and the positional relationship between each micro-bump can be ensured to be stable and reliable.

[0041] Please refer to Figures 1 to 10 In one embodiment of the present application, the heating module 6200 is connected to the cooling module 6400, and the cooling module 6400 can take away the excess heat on the wafer product 1000 to cool down the wafer product 1000. On the one hand, the wafer product 1000 can be quickly cooled after the micro-bump preparation is completed, thereby shortening the natural cooling time of the wafer product 1000 and improving the work efficiency of the micro-bump preparation of the wafer product 1000. On the other hand, the temperature of the wafer product 1000 can also be effectively adjusted, so that the temperature of the wafer product 1000 is maintained in a suitable temperature range when preparing the micro-bumps, ensuring the stability of the preheating temperature.

[0042] Please refer to Figures 1 to 10 In one embodiment of the present application, the heating module 6200 and the cooling module 6400 are electrically connected to a control module 6500. The control module 6500 can electrically connect and control the heating module 6200 and the cooling module 6400, so that the heating power of the heating module and the cooling intensity of the cooling module can be accurately adjusted according to the preset temperature parameters and the real-time monitored temperature of the wafer product 1000 and other related information, thereby realizing automatic and precise control of the temperature of the wafer product 1000.

[0043] Please refer to Figures 1 to 10In one embodiment of the present application, the installation box 6100 includes a bottom box 6101, a partition 6102 is installed inside the bottom box 6101, the partition 6102 divides the bottom box 6101 into an execution area 6103 and a control area 6104, the heating module 6200 is fixedly installed on the bottom box 6101 at a position inside the execution area 6103, and the control module 6500 is fixedly installed on the bottom box 6101 at a position inside the control area 6104; a first box cover 6105 is installed on the bottom box 6101 corresponding to the execution area 6103, and a second box cover 6106 is installed on the bottom box 6101 corresponding to the control area 6104.

[0044] During operation, the bottom box 6101, as the basic part of the entire installation box 6100, provides space for accommodating other components. The partition 6102 divides the interior of the bottom box 6101 into an execution area 6103 and a control area 6104, so that the heating module 6200 and the control module 6500 can be arranged separately in physical space. The execution area 6103 is mainly used to place the heating module 6200 directly related to the temperature control execution of the wafer product 1000. Since the heating module may generate heat, electromagnetic interference, etc. during operation. Separating it from the control module 6500 can prevent these factors from affecting the normal operation of the control module, ensuring that the control module can accurately control the heating and cooling process. Through physical isolation, the potential harm to the control module caused by factors such as heat, vibration or electromagnetic radiation generated by the operation of the heating module is reduced, so that the control module can work in a relatively stable environment, thereby improving the stability and reliability of the entire temperature control device.

[0045] Please refer to Figures 1 to 10 In one embodiment of the present application, the heating module 6200 includes an insulating bracket 6201, which is fixedly installed inside the installation box 6100. An insulating plate 6202 is installed on the insulating bracket 6201. A heat-conducting platform 6203 is fixedly installed on the insulating plate 6202. A heating wire 6204 is fixedly installed inside the heat-conducting platform 6203. The heating wire 6204 is electrically connected to the control module 6500. The positioning support module 6300 is fixedly installed on the top of the heat-conducting platform 6203.

[0046] Specifically, the control module 6500 delivers appropriate current to the heating wire 6204 according to the preset temperature parameters and the relevant temperature feedback information monitored in real time. Since the heating wire 6204 has resistance, when current passes through, according to Joule's law (electrical energy is converted into heat energy, the formula is , where Q represents heat, I represents current, R represents resistance, and t represents time). The heating wire 6204 generates heat. The heating wire 6204 is located inside the heat-conducting platform 6203. The heat-conducting platform 6203 is usually made of a material with good thermal conductivity (such as metal materials). The heat generated by the heating wire 6204 is quickly transferred to the heat-conducting platform 6203. Then, the heat is further transferred from the heat-conducting platform 6203 to the positioning support module 6300 fixedly installed on the top of the heat-conducting platform 6203. The wafer product 1000 is placed on the positioning support module 6300, and finally the heat is transferred to the wafer product 1000 to increase its temperature and achieve the purpose of preheating.

[0047] During the preheating process of the wafer product 1000, the thermal insulation bracket 6201 and the thermal insulation plate 6202 effectively prevent heat from being transferred in unnecessary directions. On the one hand, it can prevent heat from being lost to the surrounding environment, reduce energy loss, and allow more heat to be used for preheating the wafer product 1000, saving energy; on the other hand, it can prevent heat from having adverse effects on the installation box 6100 and other components in the box, ensuring that all components of the entire temperature control device can work normally under a suitable temperature environment, extending the service life of the device, and reducing the need for repairs or replacement of parts due to failures caused by overheating.

[0048] Please refer to Figures 1 to 10 In a specific embodiment of the present application, a spiral heating wire installation groove is provided on the heat conducting platform 6203, and the heating wire 6204 is spirally coiled inside the heat conducting platform 6203 through the heating wire installation groove. The spiral heating wire installation groove is provided on the heat conducting platform 6203, providing a precise installation path for the heating wire 6204. The heating wire 6204 can be coiled along this pre-designed installation groove, so that the heating wire can be stably fixed inside the heat conducting platform.

[0049] During operation, the heating wire 6204 is coiled in a spiral shape, which allows the heating wire 6204 to have a larger surface area within a limited space. Since the heating wire 6204 and the heat-conducting platform 6203 are tightly fitted through the mounting groove, the contact area of ​​heat conduction is effectively increased. The efficiency of heat conduction is proportional to the contact area. A larger contact area means that heat can be transferred from the heating wire to the heat-conducting platform more quickly and efficiently. At the same time, the spiral installation method also allows heat to be better diffused inside the heat-conducting platform, reducing heat loss during the transfer process. The heating wire 6204 is installed inside the heat-conducting platform 6203 through the mounting groove. In this way, the heating wire 6204 is fixed in the mounting groove, and it will not be easily displaced due to vibration, movement or other external factors of the equipment, which also enhances the structural stability of the heating wire 6204.

[0050] Please refer to Figures 1 to 10In a specific embodiment of the present application, the thermal insulation bracket 6201 includes a main body made of ceramic material, the lower end of the main body is fixedly connected to a mounting plate with a mounting hole, the upper end of the main body is fixedly connected to a mounting column with a thread, and the thermal insulation board 6202 is made of ceramic fiber board, and the thermal insulation board 6202 is fixedly embedded with a mounting nut corresponding to the mounting column.

[0051] During operation, since the main body of the thermal insulation bracket is made of ceramic material, the internal structure of the ceramic material is tight, the chemical bonds between atoms are strong, and heat conduction is mainly achieved through lattice vibration and a small amount of electronic conduction. Due to the characteristics of its crystal structure, the efficiency of lattice vibration in transferring heat is low, and the electrons in the ceramic are usually bound around the atoms, and the heat conduction of the electrons is also limited, thereby effectively blocking the heat from the heating module to the inside of the installation box 6100. At the same time, the thermal insulation board 6202 made of ceramic fiberboard contains a large number of air gaps in its fiber structure. Air is an excellent thermal insulation medium with a very low thermal conductivity coefficient. When heat is transferred to the thermal insulation board, these air gaps slow down the speed of heat propagation. Coupled with the low thermal conductivity of the ceramic fiber itself, the thermal insulation board can effectively reduce the transfer of heat, further enhancing the thermal insulation performance of the entire thermal insulation structure.

[0052] Please refer to Figures 1 to 10 In one embodiment of the present application, the positioning support module 6300 includes a fixed plate 6301, which is fixedly installed on the top surface of the heat conduction platform 6203. A positioning piece 6302 is fixedly connected to the fixed plate 6301. A positioning portion 1001 is provided on the wafer product 1000 corresponding to the positioning piece 6302. At least three support balls 6303 are fixedly connected to the fixed plate 6301. The support balls 6303 are in point contact with the surface of the wafer product 1000. The point contact can reduce the contact area, thereby minimizing the impact of factors such as friction between the support structure and the wafer surface on the wafer product 1000 while ensuring the support stability, which is beneficial to ensuring the surface quality of the wafer product 1000.

[0053] Please refer to Figures 1 to 10 In a specific embodiment of the present application, the positioning member 6302 is configured as a positioning pin, and the positioning portion 1001 is configured as a positioning groove corresponding to the positioning pin, and the cooperation of the positioning pin and the positioning groove is a typical high-precision positioning method. The positioning pin has a certain shape and size, usually cylindrical, and its diameter accuracy can be controlled within a very small tolerance range. When the positioning pin is inserted into the positioning groove, due to the complementary shapes of the two, accurate in-plane positioning can be achieved. This positioning method can effectively limit the translation and rotational freedom of the wafer product 1000 in the plane, ensuring that the position of the wafer on the heat conduction platform 6203 is fixed and accurate.

[0054] It is understandable that in other embodiments of the present application, the positioning member 6302 and the positioning portion 1001 can also be set as other structures that are convenient for positioning, such as setting the positioning member 6302 as a boss with a positioning plane, and setting the positioning portion 1001 as a cut surface that fits the positioning plane.

[0055] Please refer to Figures 1 to 10 In one embodiment of the present application, the cooling module 6400 includes an air guide sleeve 6401, which is sleeved on the outside of the heat insulation board 6202 and the heat conduction platform 6203, the bottom of the air guide sleeve 6401 is fixedly installed on the bottom of the heat insulation board 6202, the top of the air guide sleeve 6401 extends toward the top of the heat conduction platform 6203, the top of the air guide sleeve 6401 is fixedly installed with an air guide cover 6402, the top of the air guide cover 6402 extends toward the top of the heat conduction platform 6203, the bottom of the air guide sleeve 6401 is fixedly installed with a cold air pipe 6403, the outer side of the cold air pipe 6403 is fixedly connected with a plurality of annularly evenly distributed cold air nozzles 6404 that are connected to the air guide sleeve 6401, the cold air pipe 6403 is connected to a refrigeration device, and the refrigeration device is electrically connected to the control module 6500.

[0056] During operation, the cold air can be evenly covered around the heat transfer platform 6203 and the wafer product 1000 through the guiding structure composed of the annularly evenly distributed cold air nozzles 6404, the air guide sleeve 6401, and the air guide cover 6402. This avoids local overcooling or uneven cooling, ensuring that the entire surface of the wafer product 1000 and all parts of the heat transfer platform can be cooled more evenly. At the same time, the cold air is directly sprayed into the air guide sleeve 6401 through the cold air nozzle 6404, and the air guide cover 6402 guides the cold air to flow to the heat transfer platform 6203 and the wafer product 1000, reducing the energy loss of the cold air during the transmission process, so that the cold air can quickly exchange heat with the heat transfer platform 6203 and the wafer product 1000, and improving the cooling efficiency. Especially in the process links that require rapid cooling, efficient cooling can shorten the process cycle and help improve production efficiency.

[0057] Please refer to Figures 1 to 10 In one embodiment of the present application, the control module 6500 includes a temperature sensor 6501 and an over-temperature protector 6502, the temperature sensor 6501 and the over-temperature protector 6502 are fixedly mounted on the heat conducting platform 6203, the temperature sensor 6501 and the over-temperature protector 6502 are electrically connected to a controller 6503, and the controller 6503 is electrically connected to the heating wire 6204.

[0058] During operation, after the controller 6503 receives the temperature signal from the temperature sensor 6501, it will compare it with the preset temperature parameters. If the temperature is lower than the preset value, the controller 6503 will send a signal to the heating wire 6204 to increase the current of the heating wire 6204 so that it generates more heat to increase the temperature of the heat conducting platform 6203 and the wafer product 1000; on the contrary, if the temperature is higher than the preset value, the controller 6503 will reduce the current of the heating wire 6204, reduce the heating power, and even completely stop heating when the temperature is too high and the over-temperature protector 6502 is triggered.

[0059] Please refer to Figures 1 to 10 In one embodiment of the present application, a first telescopic member 6600 is fixedly installed vertically inside the installation box 6100, a connecting frame 6601 is fixedly connected to the first telescopic member 6600, at least three vertically arranged top rods 6602 are fixedly connected to the connecting frame 6601 corresponding to the wafer product 1000, the top rods 6602 can slide through the heating module 6200 and the positioning support module 6300, a buffer pad 6603 is fixedly installed on the top of the top rod 6602, a buffer block 6604 is fixedly connected to the connecting frame 6601, and a buffer 6605 is fixedly installed on the installation box 6100 corresponding to the buffer block 6604.

[0060] During operation, by installing a buffer pad 6603 on the top of the ejector rod 6602, when the ejector rod lifts the wafer product 1000 upward, the buffer pad 6603 first contacts the wafer product 1000. The buffer pad 6603 is usually made of an elastic material (such as rubber, etc.), which can buffer the impact force exerted by the ejector rod 6602 on the wafer product 1000 at the moment of contact, thereby avoiding damage to the wafer product 1000 due to rigid contact. At the same time, the buffer block 6604 fixedly connected to the connecting frame 6601 will cooperate with the buffer 6605 fixedly installed on the installation box 6100 during the movement of the connecting frame 6601. When the connecting frame 6601 moves upward to the extreme position, the buffer block 6604 will approach and contact the buffer 6605. The buffer 6605 uses the internal elastic elements (such as springs, hydraulic damping, etc.) to absorb the excess kinetic energy of the connecting frame 6601, slow down the movement speed of the connecting frame 6601, and prevent the connecting frame 6601 from vibrating violently or being damaged due to collision with the installation box 6100, thereby ensuring the stability of the entire structure and the service life of related components.

[0061] Please refer to Figures 1 to 10In a specific embodiment of the present application, the first telescopic member 6600 is configured as a lifting electric cylinder. The lifting electric cylinder can accurately control the lifting height error of the ejector rod 6602 within ±0.01mm by virtue of the synergistic effect of the motor and the high-precision encoder. Compared with traditional hydraulic or pneumatic lifting devices, the risk of collision caused by height deviation can be avoided when the wafer product 1000 is taken and placed, thereby greatly improving the operation accuracy.

[0062] Please refer to Figures 1 to 10 In one embodiment of the present application, a plurality of annularly evenly distributed air guide holes 6304 are provided on the fixed plate 6301, a temperature control cavity 6305 is provided on the top of the heat conducting platform 6203 corresponding to the air guide holes 6304, a first temperature control tube 6306 connected to the temperature control cavity 6305 is fixedly and sealedly connected to the heat conducting platform 6203, the first temperature control tube 6306 is connected to an air pump 6307, an output end of the air pump 6307 is connected to a second temperature control tube 6308, a plurality of annularly evenly distributed elbow nozzles 6309 are sealed and rotatably connected to the top of the heat conducting platform 6203 near its outer edge, an annular temperature control channel 6310 sealedly connected to the elbow nozzle 6309 is provided inside the heat conducting platform 6203, and the second temperature control tube 6308 is sealedly connected to the annular temperature control channel 6310.

[0063] In the course of work, Fig.10 As shown, after the air pump 6307 is started, the temperature control cavity 6305 on the top of the heat conduction platform 6203 will be evacuated through the first temperature control tube 6306. Since a plurality of annularly evenly distributed air guide holes 6304 are provided on the fixed plate 6301, the gas can enter the temperature control cavity 6305 from the air guide holes 6304 and then be evacuated by the air pump 6307. The evacuated gas is transported to the annular temperature control channel 6310 through the second temperature control tube 6308 via the output end of the air pump 6307, and the annular temperature control channel 6310 is sealed and connected to a plurality of annularly evenly distributed elbow nozzles 6309, and the gas will eventually be ejected from these elbow nozzles 6309.

[0064] In the process of extracting gas, the extracted gas will form negative pressure at the bottom of the wafer product 1000, thereby adsorbing the wafer product 1000 on the support ball 6303. At the same time, the gas ejected from the elbow nozzles 6309 will form positive pressure on the top of the wafer product 1000, thereby pressing the wafer product 1000 against the support ball 6303, thereby fixing the wafer product 1000.

[0065] During the heating process, the flowing gas will take away the heat from the heat transfer platform 6203 when passing through the annular temperature control channel 6310 and the temperature control chamber 6305, and spray it on the top of the wafer product 1000 through the elbow nozzle 6309. In this way, the wafer product 1000 can be preheated at the top and bottom of the wafer product 1000 at the same time, which can not only improve the preheating efficiency, but also improve the temperature uniformity. The uniform temperature distribution and efficient preheating process are helpful to improve the quality of the wafer product 1000.

[0066] During the cooling process, the low-temperature cold air produced by the refrigeration equipment is sprayed into the interior of the air guide sleeve 6401 through the cold air pipe 6403 and the cold air nozzle 6404 connected to the refrigeration equipment. After the cold air rises along the air guide sleeve 6401, it will flow toward the top of the heat conduction platform 6203 under the action of the air guide cover 6402. The cold air on the top of the heat conduction platform 6203 will be sucked into the temperature control cavity 6305, and finally sprayed on the top of the wafer product 1000 through the elbow nozzle 6309. In this way, the heat and temperature of the inside and outside of the heat conduction platform 6203 can be dissipated and cooled at the same time, thereby further improving the cooling efficiency.

[0067] In summary, through the design of the annularly evenly distributed air guide holes 6304 and the elbow nozzle 6309, the gas can be evenly distributed around the wafer product 1000. The gas ejected from the elbow nozzle 6309 can cover the wafer product 1000 in all directions, and whether in the heating or cooling process, it can ensure that the gas temperature and flow rate contacted by various parts of the wafer product 1000 are relatively consistent, avoiding the situation where the local temperature is too high or too low, so that the wafer product 1000 is heated or cooled evenly as a whole, which helps to improve product quality and reduce internal stress, deformation and other problems caused by uneven temperature.

[0068] Please refer to Figures 1 to 10 In one embodiment of the present application, the outer side surface of the elbow nozzle 6309 is fixedly connected to a driven gear 6311, and the outer side surface of the heat conduction platform 6203 is rotatably connected to a driving ring gear 6312 meshing with the driven gear 6311, and the driving ring gear 6312 is hingedly connected to a second telescopic member 6313, and the second telescopic member 6313 is hingedly connected to the installation box 6100.

[0069] Specifically, when the second telescopic member 6313 performs telescopic movement, since one end of the second telescopic member 6313 is hinged on the mounting box 6100 and the other end is hinged on the active gear ring 6312, the active gear ring 6312 is pushed or pulled to rotate around the outer side of the heat conduction platform 6203. The active gear ring 6312 is meshed with the driven gear 6311 fixedly connected to the outer side of the elbow nozzle 6309. According to the gear transmission principle, the rotation of the active gear ring 6312 will drive the driven gear 6311 to rotate, thereby causing the elbow nozzle 6309 to rotate around its own axis. In this way, all the elbow nozzles 6309 can be synchronously controlled to rotate through the second telescopic member 6313. When the elbow nozzle 6309 rotates to the extreme position toward the outer edge of the heat conduction platform 6203, the wafer product 1000 can be conveniently taken and placed. When the elbow nozzle 6309 rotates to the extreme position toward the center of the heat conduction platform 6203, the wafer product 1000 can be conveniently fixed and temperature controlled.

[0070] Please refer to Figures 1 to 10 In a specific embodiment of the present application, the second telescopic member 6313 is configured as a cylinder, which can not only provide greater force, but also has excellent cost-effectiveness. The cylinder structure is relatively simple and the manufacturing process is mature, so its procurement cost and maintenance cost are at a low level. In large-scale wafer production and processing scenarios, it can significantly reduce the overall manufacturing cost and subsequent maintenance cost of the equipment, saving expenses for enterprises.

[0071] Example 2 A method for preparing wafer micro-bumps based on visual positioning and detection comprises the following steps: S1. Place the wafer product 1000 with micro-bumps to be prepared on the temperature control device 6000, and position and support the wafer product 1000 through the positioning support module 6300.

[0072] First, the wafer product 1000 is placed on the positioning support module 6300 of the temperature control device 6000. The positioning support module 6300 achieves precise positioning and stable support of the wafer product 1000 in the plane through the positioning parts (such as positioning pins) on the fixed plate 6301 and the positioning parts (such as positioning grooves) on the wafer product 1000, and the point contact between at least three support balls 6303 and the surface of the wafer product 1000. This ensures that the wafer product 1000 is fixed in position during subsequent preheating, micro-bump preparation and other operations, providing a basis for precise processing.

[0073] S2. Preheat the wafer product 1000 through the heating module 6200, and the preheating temperature is set at 100°C-150°C.

[0074] When the heating module 6200 starts working, the heating wire 6204 is energized to generate heat. The heat is transferred to the wafer product 1000 on the positioning support module 6300 through the heat conduction platform 6203. Thus, the wafer product 1000 is preheated to the set temperature. At the same time, the temperature sensor 6501 in the control module 6500 monitors the temperature of the heat conduction platform 6203 in real time and feeds back the signal to the controller 6503. The controller 6503 adjusts the current of the heating wire 6204 according to the feedback signal to achieve precise control of the preheating temperature.

[0075] S3. After reaching the set preheating temperature, use the visual positioning detection device 4000 to obtain the precise positioning coordinates of the wafer product 1000.

[0076] When the wafer product 1000 reaches the set preheating temperature, the visual positioning detection device 4000 starts working. It uses the principle of optical imaging to obtain image information of the wafer product 1000 through a camera and other equipment. Then, the image is analyzed using an image processing algorithm to identify the feature points or marks on the wafer product 1000, thereby determining the precise positioning coordinates of the wafer product 1000. These coordinates will serve as a precise position reference for subsequent micro-bump preparation to ensure that the micro-bumps can be accurately prepared at the desired position.

[0077] S4. Micro-bumps are prepared on the wafer product 1000 according to the precise positioning coordinates of the wafer product 1000 by using the laser solder ball welding device 5000.

[0078] The laser solder ball welding device 5000 focuses the laser beam precisely on the designated position of the wafer product 1000 according to the precise positioning coordinates obtained by the visual positioning detection device 4000. At this position, the solder ball is melted and solidified by laser heating to form a micro-bump. The laser energy, pulse width, frequency and other parameters can be precisely controlled according to the requirements of the size, shape and material of the micro-bump to ensure that the quality and performance of the micro-bump meet the standards.

[0079] S5. After the micro-bumps are prepared, the wafer product 1000 is cooled by the cooling module 6400.

[0080] After the micro-bumps are prepared, the cooling module 6400 is started. The cold air in the cold air pipe 6403 is sprayed into the cooling channel formed by the air guide sleeve 6401 and the air guide cover 6402 through the annularly evenly distributed cold air nozzles 6404. The cold air surrounds the heat conduction platform 6203 and the wafer product 1000, takes away the heat, and quickly cools the wafer product 1000. The control module 6500 can also adjust the cooling capacity of the refrigeration equipment according to the feedback signal of the temperature sensor 6501 or the preset cooling temperature parameters to achieve precise control of the cooling process.

[0081] S6. After the wafer product 1000 is cooled, the wafer product 1000 is removed from the temperature control device 6000, and the preparation of the wafer micro-bumps is completed.

[0082] When the wafer product 1000 is cooled to a suitable temperature, the first telescopic part 6600 inside the installation box 6100 drives the connecting frame 6601 and the push rod 6602 to rise, and the buffer pad 6603 on the top of the push rod 6602 contacts the wafer product 1000, and the wafer product 1000 is lifted from the temperature control device 6000. Then the wafer product 1000 can be easily removed, completing the preparation process of wafer micro-bumps.

[0083] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer micro-bump preparation device based on visual positioning and detection, characterized in that: The invention comprises a platform (3000), a mounting frame (3001) is fixedly connected to the platform (3000), a first slide rail (3003) is arranged on the mounting frame (3001) along a first direction, a mounting plate (3004) is slidably connected to the first slide rail (3003), a visual positioning detection device (4000) and a laser solder ball welding device (5000) are installed on the mounting plate (3004), a second slide rail (3005) is arranged on the platform (3000) along a second direction, the first direction is perpendicular to the second direction, and a mounting seat is slidably connected to the second slide rail (3005). (3002), a temperature control device (6000) thermally connected to the wafer product (1000) is installed on the mounting seat (3002); the temperature control device (6000) includes a mounting box (6100), a heating module (6200) is installed inside the mounting box (6100), a positioning support module (6300) is installed on the top of the heating module (6200) corresponding to the wafer product (1000), the heating module (6200) is connected to a cooling module (6400), and the heating module (6200) and the cooling module (6400) are electrically connected to a control module (6500).

2. The wafer micro-bump preparation device based on visual positioning and detection according to claim 1, characterized in that: The installation box (6100) comprises a bottom box (6101), a partition (6102) is installed inside the bottom box (6101), and the partition (6102) divides the bottom box (6101) into an execution area (6103) and a control area (6104); the heating module (6200) is fixedly installed on the bottom box (6101) at a position inside the execution area (6103); the control module (6500) is fixedly installed on the bottom box (6101) at a position inside the control area (6104); a first box cover (6105) is installed on the bottom box (6101) corresponding to the execution area (6103), and a second box cover (6106) is installed on the bottom box (6101) corresponding to the control area (6104).

3. The wafer micro-bump preparation device based on visual positioning and detection according to claim 1, characterized in that: The heating module (6200) comprises a heat insulating bracket (6201), wherein the heat insulating bracket (6201) is fixedly mounted inside the mounting box (6100), a heat insulating plate (6202) is mounted on the heat insulating bracket (6201), a heat conducting platform (6203) is fixedly mounted on the heat insulating plate (6202), a heating wire (6204) is fixedly mounted inside the heat conducting platform (6203), and the heating wire (6204) is electrically connected to the control module (6500), and the positioning support module (6300) is fixedly mounted on the top of the heat conducting platform (6203).

4. The wafer micro-bump preparation device based on visual positioning and detection according to claim 3, characterized in that: The positioning support module (6300) includes a fixing plate (6301), the fixing plate (6301) is fixedly mounted on the top surface of the heat conducting platform (6203), a positioning piece (6302) is fixedly connected to the fixing plate (6301), a positioning portion (1001) is provided on the wafer product (1000) corresponding to the positioning piece (6302), at least three supporting balls (6303) are fixedly connected to the fixing plate (6301), and the supporting balls (6303) are in point contact with the surface of the wafer product (1000).

5. The wafer micro-bump preparation device based on visual positioning and detection according to claim 3, characterized in that: The cooling module (6400) comprises an air guide sleeve (6401), wherein the air guide sleeve (6401) is sleeved on the outside of the heat insulation board (6202) and the heat conduction platform (6203), the bottom of the air guide sleeve (6401) is fixedly mounted on the bottom of the heat insulation board (6202), the top of the air guide sleeve (6401) extends toward the top of the heat conduction platform (6203), and the top of the air guide sleeve (6401) is fixedly mounted with an air guide cover (6401). 2), the top of the air guide cover (6402) extends toward the top of the heat conduction platform (6203), a cold air pipe (6403) is fixedly installed on the bottom of the air guide sleeve (6401), the outer side of the cold air pipe (6403) is fixedly connected with a plurality of cold air nozzles (6404) evenly distributed in an annular shape and connected to the air guide sleeve (6401), the cold air pipe (6403) is connected to a refrigeration device, and the refrigeration device is electrically connected to the control module (6500).

6. The wafer micro-bump preparation device based on visual positioning and detection according to claim 3, characterized in that: The control module (6500) comprises a temperature sensor (6501) and an over-temperature protector (6502); the temperature sensor (6501) and the over-temperature protector (6502) are fixedly mounted on the heat conducting platform (6203); the temperature sensor (6501) and the over-temperature protector (6502) are electrically connected to a controller (6503); and the controller (6503) is electrically connected to the heating wire (6204).

7. The wafer micro-bump preparation device based on visual positioning and detection according to claim 4, characterized in that: A vertically arranged first telescopic member (6600) is fixedly installed inside the installation box (6100), a connecting frame (6601) is fixedly connected to the first telescopic member (6600), at least three vertically arranged top rods (6602) are fixedly connected to the connecting frame (6601) corresponding to the wafer product (1000), the top rods (6602) can slide through the heating module (6200) and the positioning support module (6300), a buffer pad (6603) is fixedly installed on the top of the top rod (6602), a buffer block (6604) is fixedly connected to the connecting frame (6601), and a buffer (6605) is fixedly installed on the installation box (6100) corresponding to the buffer block (6604).

8. The wafer micro-bump preparation device based on visual positioning and detection according to claim 4, characterized in that: The fixed plate (6301) is provided with a plurality of annularly evenly distributed air guide holes (6304); a temperature control cavity (6305) is provided on the top of the heat conducting platform (6203) corresponding to the air guide holes (6304); a first temperature control tube (6306) in communication with the temperature control cavity (6305) is fixedly and sealedly connected to the heat conducting platform (6203); the first temperature control tube (6306) is connected to an air extraction pump (6307); the output end of the air extraction pump (6307) is connected to a second temperature control tube (6308); a plurality of annularly evenly distributed elbow nozzles (6309) are sealed and rotatably connected to the top of the heat conducting platform (6203) near its outer edge; an annular temperature control channel (6310) in sealed communication with the elbow nozzle (6309) is provided inside the heat conducting platform (6203); the second temperature control tube (6308) is in sealed communication with the annular temperature control channel (6310).

9. The wafer micro-bump preparation device based on visual positioning and detection according to claim 8, characterized in that: The outer side surface of the elbow nozzle (6309) is fixedly connected to a driven gear (6311), and the outer side surface of the heat conduction platform (6203) is rotatably connected to a driving ring gear (6312) meshing with the driven gear (6311), and a second telescopic member (6313) is hingedly connected to the driving ring gear (6312), and the second telescopic member (6313) is hingedly connected to the installation box (6100).

10. A method for preparing wafer micro-bumps based on visual positioning and detection, characterized in that: The following steps are involved: S1, placing a wafer product (1000) on which micro-bumps are to be prepared on a temperature control device (6000), and positioning and supporting the wafer product (1000) through a positioning support module (6300); S2, preheating the wafer product (1000) by means of a heating module (6200); S3, after reaching the set preheating temperature, using the visual positioning detection device (4000) to obtain the precise positioning coordinates of the wafer product (1000); S4, preparing micro bumps on the wafer product (1000) according to the precise positioning coordinates of the wafer product (1000) using a laser solder ball welding device (5000); S5. After the micro-bumps are prepared, the wafer product (1000) is cooled by a cooling module (6400); S6. After the wafer product (1000) is cooled, the wafer product (1000) is removed from the temperature control device (6000), and the preparation of wafer micro-bumps is completed.

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