Coga post transfer positioning welding integrated tooling

Abstract

The application discloses a CCGA soldering post transfer positioning and welding integrated tool, which comprises an assembly plate, a plurality of soldering posts and a device body arranged on the assembly plate, and an array hole is arranged at the top of the assembly plate and matched with the plurality of soldering posts, and relates to the technical field of CCGA device processing. The CCGA soldering post transfer positioning and welding integrated tool provides convenient conditions for the installation of the soldering post through the cooperation of the assembly plate, the array hole, the clamping piece and the baffle, and the clamping piece provides convenient conditions for the convenient disassembly of the baffle. The Mark positioning point provides a reference basis for the positioning and calibration of the device body assembly, and the positioning assembly can further position the device body. The positioning of the device body provides stability guarantee, ensures the welding quality, and the device body and the soldering post can be directly taken out after welding, which is simple and rapid in operation, and provides reliable support for the batch processing of CCGA planting posts.

Description

Technical Field

[0001] This invention relates to the field of CCGA device processing technology, specifically to an integrated tooling for CCGA post transfer, positioning, and welding. Background Technology

[0002] Ceramic Column Grid Array (CCGA) is a ceramic column grid array packaging technology. Compared to traditional PBGA, CCGA offers advantages such as superior electrothermal performance, strong hermeticity, excellent moisture resistance, and high reliability. By replacing ball grids with column grids, it significantly alleviates thermal fatigue issues caused by the mismatch in thermal expansion coefficients between the alumina ceramic chip carrier and the epoxy resin glass cloth printed circuit board, thereby improving its assembly reliability. CCGA can implement many logic and microprocessor functions. Its packaging form determines its high temperature resistance, high voltage resistance, and high reliability, making it suitable for larger sizes and more I / O applications. Therefore, it holds a very important position in the manufacturing of military, aerospace, and aviation electronic products.

[0003] CCGA pillars need to be soldered onto the device package pads. The traditional pillar-planting process is quite complex, often requiring pre-fixation of the device to be pillared. After reflow soldering, the pre-fixation structure needs to be removed to obtain the CCGA with the pillars installed. This process is complex, inefficient, and difficult to automate. Therefore, a CCGA pillar transfer positioning and welding integrated tooling is proposed to achieve fast, simple, and easy-to-operate device pillar planting. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an integrated tooling for the transfer and positioning welding of CCGA welding columns, which solves the problems of traditional CCGA column installation tooling having many parts, complex operation procedures, and being unable to adapt to the pace of mass production.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: CCGA welding column transfer positioning welding integrated tooling, including an assembly plate, and a plurality of welding columns and device bodies disposed on the assembly plate. The top of the assembly plate is provided with an array of holes that cooperate with the plurality of welding columns, and the bottom of the assembly plate is also fixed with a baffle by a snap-fit ​​component.

[0006] Mark positioning points are provided at the four corners of the top of the assembly plate;

[0007] The top of the assembly plate is also provided with positioning components around its perimeter, which are used in conjunction with the device body.

[0008] The present invention is further configured such that: the array hole includes a guide hole and a positioning hole connected in sequence from top to bottom, the guide hole is flared and the guiding angle of the guide hole is greater than or equal to forty-five degrees;

[0009] Both the guide hole and the positioning hole are used in conjunction with the welding column.

[0010] The present invention is further configured such that: the snap-fit ​​component includes a sealing plate and two single-opening guide rails, the sealing plate is disposed between the open ends of the two single-opening guide rails, and a plurality of first springs are fixedly installed on the top of the sealing plate.

[0011] The present invention is further configured such that: a blind groove is provided at the bottom of the assembly plate, the sealing plate is slidably installed inside the blind groove, and the top end of the first spring is fixedly connected to the top of the inner cavity of the blind groove.

[0012] The present invention is further configured such that: both single-opening guide rail frames are fixedly installed at the bottom of the assembly plate, the baffle is slidably installed between the two single-opening guide rail frames, and the baffle is positioned directly below a plurality of array holes, with the front of the baffle slidingly contacting the back of the sealing plate.

[0013] The present invention is further configured such that: the positioning component includes a push plate, two first single-ended lead screws are threadedly installed through one side of the push plate, a fixing plate is sleeved on the outer periphery of one end of the two first single-ended lead screws, a limit ring is sleeved and fixedly installed on the outer periphery of one end of the first single-ended lead screw, a knob is fixedly connected to one end of the first single-ended lead screw, the fixing plate is disposed between the knob and the limit ring, an assembly groove is provided on one side of the top of the push plate, and an inclined slope is provided on one side of the top of the push plate.

[0014] The present invention is further configured such that: the fixing plate is fixedly installed on the top of the assembly plate by bolts, and the inclined slope is used in conjunction with one side of the bottom of the device body;

[0015] The bottom of the push plate is in sliding contact with the top of the assembly plate, and guide strips are fixedly installed on the top of the assembly plate and on both sides of the push plate.

[0016] The present invention is further configured such that: a positioning plate is slidably installed inside the assembly groove, a second single-ended lead screw is fixedly installed on one side of the positioning plate, one end of the second single-ended lead screw passes through the push plate and is threaded with an adjusting nut, and a second spring is sleeved on the outer periphery of the second single-ended lead screw, and the two ends of the second spring are respectively in contact with the positioning plate and the opposite side of the assembly groove;

[0017] The other side of the positioning plate is in contact with one side of the outer periphery of the device body.

[0018] This invention provides an integrated tooling for transferring and positioning CCGA welding columns. It offers the following advantages:

[0019] This invention provides convenient conditions for the installation of welding posts through the coordinated arrangement of assembly plates, array holes, snap-fit ​​components, and baffles. The snap-fit ​​components facilitate the easy assembly and disassembly of the baffles. With the setting of Mark positioning points, a reference basis is provided for the positioning calibration of the device body assembly. Furthermore, the positioning components can achieve further positioning of the device body, providing stability assurance for the positioning of the device body while ensuring welding quality. After welding, the device body and welding posts can be directly removed. The operation is simple and quick, providing reliable support for the mass production of CCGA welding posts. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the external structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the external structure of the present invention after the welding post and device body have been removed;

[0022] Figure 3 This is a schematic diagram of the external structure of the present invention from an upward perspective;

[0023] Figure 4 This is a cross-sectional view of the structure of the present invention;

[0024] Figure 5 This is a schematic diagram showing the connection between the assembly plate and the snap-fit ​​structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the positioning component of the present invention.

[0026] In the picture:

[0027] 1. Assembly plate; 101. Array hole; 1011. Guide hole; 1012. Positioning hole; 102. Blind slot;

[0028] 2. Welding column;

[0029] 3. Device body;

[0030] 4. Snap-fit ​​component; 401. Sealing plate; 402. Single-opening guide rail frame; 403. First spring;

[0031] 5. Baffle;

[0032] 6. Mark positioning point;

[0033] 7. Positioning assembly; 701. Push plate; 702. First single-ended lead screw; 703. Fixing plate; 704. Limiting ring; 705. Knob; 706. Assembly slot; 707. Inclined slope; 708. Guide bar; 709. Positioning plate; 7010. Second single-ended lead screw; 7011. Adjusting nut; 7012. Second spring. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0035] Please see Figure 1-6 The present invention provides the following technical solutions:

[0036] Example 1: CCGA welding column transfer positioning welding integrated tooling, including assembly plate 1, and several welding columns 2 and device body 3 set on assembly plate 1.

[0037] As a preferred embodiment, in order to facilitate the positioning of the welding column 2, the top of the assembly plate 1 is provided with an array of holes 101 that cooperate with several welding columns 2. Specifically, the array of holes 101 includes, from top to bottom, a guide hole 1011 and a positioning hole 1012 that are connected together. The guide hole 1011 is flared and the guide angle of the guide hole 1011 is greater than or equal to forty-five degrees. Both the guide hole 1011 and the positioning hole 1012 are used in conjunction with the welding column 2.

[0038] It should be noted that when two adjacent guide holes 1011 are tangent, the maximum guide angle is reached, and the maximum depth of the guide hole 1011 is less than or equal to one-third of the height of the weld post 2, while the maximum depth of the positioning hole 1012 is greater than or equal to two-thirds of the height of the weld post 2.

[0039] As a preferred embodiment, to prevent the welding column 2 from falling off, a baffle 5 is also fixedly attached to the bottom of the assembly plate 1 by a snap-fit ​​component 4. Specifically, to facilitate the easy installation and removal of the baffle 5, the snap-fit ​​component 4 includes a sealing plate 401 and two single-opening guide rail frames 402. The sealing plate 401 is positioned between the open ends of the two single-opening guide rail frames 402. Both single-opening guide rail frames 402 are fixedly installed at the bottom of the assembly plate 1, and several first springs 403 are fixedly installed on the top of the sealing plate 401. A blind groove 102 is provided at the bottom of the assembly plate 1. 401 is slidably installed inside the blind groove 102, and the top of the first spring 403 is fixedly connected to the top of the inner cavity of the blind groove 102. The baffle 5 is slidably installed between the two single-opening guide rails 402, and the baffle 5 is set directly below the array holes 101. The baffle 5 is used to limit the bottom of the welding column 2. The front of the baffle 5 slides in contact with the back of the sealing plate 401. The sealing plate 401 is used to limit the opening ends of the two single-opening guide rails 402, ensuring that the baffle 5 can be stably positioned between the two single-opening guide rails 402.

[0040] As a preferred solution, to achieve efficient automated processing, Mark positioning points 6 are provided at the four corners of the top of the assembly plate 1. These Mark positioning points 6 are used in conjunction with the automated equipment's identification device to print solder paste on the pads of the component body 3 and, after contacting the solder pillars 2, achieve quasi-positioning of the component body 3. Furthermore, to facilitate the assembly of the component body 3, as shown in the attached... Figure 1 and attached Figure 2 As shown, one corner of the outer periphery of the assembly board 1 is set as a slope to provide orientation for the mounting of the device body 3.

[0041] In this embodiment, after the welding and fixing of the device body 3 and the welding post 2 are completed, the welded device body 3 and welding post 2 can be directly removed, making the operation simple and quick.

[0042] Example 2: This example is an improvement on the previous example. The integrated welding fixture for CCGA welding column transfer and positioning also includes positioning components 7 arranged around the top of the assembly plate 1. The positioning components 7 are used in conjunction with the device body 3. Specifically, the positioning components 7 include a push plate 701. The bottom of the push plate 701 slides in contact with the top of the assembly plate 1. Two first single-ended lead screws 702 are threaded through and installed on one side of the push plate 701. A fixing plate 703 is sleeved on the outer periphery of one end of the two first single-ended lead screws 702. The fixing plate 703 is fixedly installed on the top of the assembly plate 1 by bolts. The top of the assembly plate 1 is located at the push plate 701. Guide strips 708 are fixedly installed on both sides of the plate 701. A limit ring 704 is also sleeved and fixedly installed on the outer periphery of one end of the first single-ended lead screw 702. A knob 705 is fixedly connected to one end of the first single-ended lead screw 702. A fixing plate 703 is set between the knob 705 and the limit ring 704. An inclined slope 707 is provided on one side of the top of the push plate 701. The inclined slope 707 is used in conjunction with one side of the bottom of the device body 3 to ensure that the numerical height between the device body 3 and the assembly plate 1 is 0.2mm-0.5mm, so as to facilitate the reflow soldering fixation between the device body 3 and the welding column 2.

[0043] As a preferred embodiment, in order to ensure the relative stability of the position of the device body 3 and further improve the welding quality between the device body 3 and the welding column 2, an assembly groove 706 is provided on one side of the top of the push plate 701. A positioning plate 709 is slidably installed inside the assembly groove 706. A second single-ended lead screw 7010 is fixedly installed on one side of the positioning plate 709. The other side of the positioning plate 709 is in contact with one side of the outer periphery of the device body 3. One end of the second single-ended lead screw 7010 passes through the push plate 701 and is threaded with an adjusting nut 7011. A second spring 7012 is sleeved on the outer periphery of the second single-ended lead screw 7010. The two ends of the second spring 7012 are in contact with the opposite sides of the positioning plate 709 and the assembly groove 706, respectively.

[0044] The advantage of Example 2 over Example 1 is that it can also achieve convenient positioning of the device body 3 and provide a stable and reliable processing environment for the batch implantation of the device body 3.

[0045] When in use, the welding column 2 is passed through the guide hole 1011 and enters the positioning hole 1012, and the bottom end of the welding column 2 rests on the top of the baffle 5;

[0046] After printing solder paste on the pads of the device body 3, the device body 3 is placed on several solder pillars 2 so that the solder paste comes into contact with the solder pillars 2. During the process, an automated device is used to identify the Mark positioning point 6 to perform quasi-positioning of the pads of the device body 3 and the solder pillars 2.

[0047] Simultaneously rotate the two knobs 705 on the same positioning component 7 to drive the push plate 701 on the assembly plate 1 to move until the inclined slope 707 contacts one side of the bottom of the device body 3. After the adjustment of the four positioning components 7 is completed, press the device body 3 vertically downward to perform secondary positioning of the device body 3. Loosen the adjusting nut 7011. Under the elastic force of the second spring 7012, the second spring 7012 pushes the positioning plate 709 to move in the assembly groove 706 until the positioning plate 709 contacts one side of the device body 3. Repeat the operation until the four positioning plates 709 contact the outer periphery of the device body 3 respectively to complete the positioning. At this time, the device body 3 is no longer pressed vertically downward.

[0048] The device is fed into the reflow soldering device to solder the device body 3 to the solder column 2. After the soldering is completed, the device body 3 can be directly removed, and the solder column 2 can be separated from the assembly plate 1 together.

[0049] As an extension, in order to efficiently load several welding columns 2 into the assembly plate 1, a sieve plate or other automatic column insertion method can be used to efficiently assemble the welding columns 2.

[0050] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A CCGA welding column transfer and positioning integrated welding fixture, comprising an assembly plate (1), and a plurality of welding columns (2) and a device body (3) disposed on the assembly plate (1), characterized in that: The top of the assembly plate (1) is provided with an array hole (101) for use with a plurality of welding columns (2), and the bottom of the assembly plate (1) is also fixed with a baffle (5) by a snap-fit ​​component (4). Mark positioning points (6) are provided at the four corners of the top of the assembly plate (1). The top of the assembly plate (1) is also provided with positioning components (7), which are used in conjunction with the device body (3); The positioning component (7) includes a push plate (701), on one side of which two first single-ended lead screws (702) are threaded and threaded. A fixing plate (703) is sleeved on the outer periphery of one end of the two first single-ended lead screws (702). A limit ring (704) is also sleeved and fixedly installed on the outer periphery of one end of the first single-ended lead screw (702). A knob (705) is fixedly connected to one end of the first single-ended lead screw (702). The fixing plate (703) is located between the knob (705) and the limit ring (704). An assembly groove (706) is opened on one side of the top of the push plate (701), and an inclined slope (707) is provided on one side of the top of the push plate (701). The fixing plate (703) is fixedly installed on the top of the assembly plate (1) by bolts, and the inclined slope (707) is used in conjunction with one side of the bottom of the device body (3); The bottom of the push plate (701) is in sliding contact with the top of the assembly plate (1), and guide strips (708) are fixedly installed on the top of the assembly plate (1) and on both sides of the push plate (701). A positioning plate (709) is slidably installed inside the assembly groove (706). A second single-ended lead screw (7010) is fixedly installed on one side of the positioning plate (709). One end of the second single-ended lead screw (7010) passes through the push plate (701) and is threaded with an adjusting nut (7011). A second spring (7012) is sleeved on the outer periphery of the second single-ended lead screw (7010). The two ends of the second spring (7012) are in contact with the positioning plate (709) and the opposite side of the assembly groove (706), respectively. The other side of the positioning plate (709) is in contact with one side of the outer periphery of the device body (3).

2. The integrated welding fixture for CCGA welding column transfer and positioning according to claim 1, characterized in that: The array hole (101) includes, from top to bottom, a guide hole (1011) and a positioning hole (1012) that are connected together. The guide hole (1011) is flared and the guiding angle of the guide hole (1011) is greater than or equal to forty-five degrees. The guide hole (1011) and the positioning hole (1012) are used in conjunction with the welding column (2).

3. The integrated welding fixture for CCGA welding column transfer and positioning according to claim 1, characterized in that: The snap-fit ​​component (4) includes a sealing plate (401) and two single-opening guide rails (402). The sealing plate (401) is disposed between the open ends of the two single-opening guide rails (402), and a plurality of first springs (403) are fixedly installed on the top of the sealing plate (401).

4. The integrated welding fixture for CCGA welding column transfer and positioning according to claim 3, characterized in that: The bottom of the assembly plate (1) is provided with a blind groove (102), the sealing plate (401) is slidably installed inside the blind groove (102), and the top of the first spring (403) is fixedly connected to the top of the inner cavity of the blind groove (102).

5. The integrated welding fixture for CCGA welding column transfer and positioning according to claim 4, characterized in that: Both single-opening guide rails (402) are fixedly installed at the bottom of the assembly plate (1). The baffle (5) is slidably installed between the two single-opening guide rails (402) and is located directly below a plurality of array holes (101). The front of the baffle (5) is in sliding contact with the back of the sealing plate (401).

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