Surface polishing method for hardware tableware

Abstract

The invention belongs to the technical field of hardware tableware processing, and particularly relates to a hardware tableware surface polishing method which comprises the following steps: S1, preparing a low-concentration chemical polishing solution, and mixing with a suspended abrasive to obtain a mixed polishing solution; s2, the hardware tableware is soaked in the mixed polishing solution; s3, ultrasonic oscillation is conducted on the mixed polishing solution through an ultrasonic transmitter; s4, arranging an ultrasonic receiver in the solution pool, receiving part of ultrasonic waves reflected in the pool, and comparing the ultrasonic reflection spectrum of the position of the hardware tableware to obtain a defect area coordinate of the polishing degree of the hardware tableware; s5, a fluid polishing device is called, high-pressure fluid mixed with the same suspension abrasive is used for impacting the polishing defect area of the hardware tableware, the consumption of chemical agents is reduced through mixed use of multiple technological methods, the polishing effect is reinforced in a targeted and fixed-point mode in the mode that the coordinates of the rough defect area are recognized through ultrasonic waves, the overall time is shortened, and the polishing efficiency is improved. The polishing efficiency is improved, and the polishing effect and quality of the hardware tableware are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of hardware tableware processing, and in particular relates to a surface polishing method for hardware tableware. Background Art

[0002] Hardware cutlery, including knives, forks and spoons, is usually made of stainless steel, silver or other alloys. In order to improve its beauty and durability, polishing is an indispensable step in the manufacturing process.

[0003] Traditional polishing methods for hardware tableware mainly include mechanical polishing, chemical polishing and electrochemical polishing. Although the above three traditional polishing methods can meet the needs of hardware tableware manufacturing to a certain extent, their respective problems limit their further application and development.

[0004] First of all, mechanical polishing usually requires repeated grinding by hand or automated equipment. Manual grinding takes a long time for complex geometric shapes or high-requirement surface finish. In addition, the disadvantage of automated polishing equipment is that the high-speed grinding method is limited by the calibration accuracy of the equipment for tableware of different sizes. Any slight deviation will damage the product details, resulting in a low yield rate in mass production.

[0005] Secondly, chemical polishing or electroplating polishing of hardware tableware also leads to high costs because it takes a long time and is costly to complete the complete polishing process.

[0006] In summary, there is an urgent need for a method for polishing hardware tableware with controllable cost, high precision and good quality. Summary of the invention

[0007] In order to solve the above problems existing in the prior art, the present invention provides a surface polishing method for hardware tableware, which solves the problem that the burrs or oxides on the surface of the hardware tableware to be polished are of different sizes and need to be specifically processed.

[0008] The purpose of the present invention can be achieved by the following technical solution: A surface polishing method for hardware tableware comprises the following steps:

[0009] S1: preparing a mixed polishing liquid, preparing a low-concentration chemical polishing liquid and mixing it with a suspended abrasive to obtain a mixed polishing liquid;

[0010] S2: Soaking, soaking the hardware tableware in the mixed polishing liquid, and corroding and polishing through the low concentration of chemical polishing liquid components;

[0011] S3: Oscillation polishing, using an ultrasonic transmitter to ultrasonically oscillate the mixed polishing liquid;

[0012] S4: Identify the defective area on the tableware surface, set an ultrasonic receiver in the solution pool, receive the ultrasonic waves reflected in part of the pool, compare the ultrasonic reflection spectrum of the hardware tableware position, and obtain the coordinates of the defective area of ​​the hardware tableware polishing degree;

[0013] S5: For fine polishing of the defective areas on the surface of the tableware, a fluid polishing device is used to impact the polishing defective areas of the hardware tableware with a high-pressure fluid mixed with the same suspended abrasive to accelerate the completion of polishing.

[0014] Preferably, in S4, when the number of polishing defect areas of the hardware tableware obtained is less than three, the hardware tableware is raised to a liquid level that is out of the mixed polishing liquid, and then the fluid polishing step of step S5 is connected.

[0015] Preferably, in S3, the ultrasonic transmitter is disposed in the solution pool and faces the location of the hardware tableware, and the ultrasonic receivers are respectively disposed on the side walls and the bottom surface of the solution pool.

[0016] Preferably, in S4, the method for comparing the ultrasonic reflection spectrum is:

[0017] Put the same type of hardware tableware that has been polished to the standard in the same solution environment, obtain the ultrasonic reflection signal at this time through each ultrasonic receiver, establish the spectrum tolerance range by obtaining multiple sets of standard data, and obtain the ultrasonic reflection spectrum and allowable tolerance of each angle of the corresponding hardware tableware when it is polished to the standard;

[0018] In the actual polishing process, the polishing defect area of ​​the hardware tableware can be obtained by comparing the ultrasonic reflection map obtained in real time.

[0019] Preferably, the same solution environment includes the same solution formula and solution volume of the mixed polishing solution.

[0020] Preferably, after S5, the method further includes S6: adding chemical polishing liquid, and a method for determining whether to add chemical polishing liquid:

[0021] The same type of unpolished hardware tableware is placed in a solution pool to which chemical polishing liquid needs to be added, and the ultrasonic reflection signal at this time is obtained by each ultrasonic receiver. The spectrum tolerance range is established by obtaining multiple sets of standard data, and the standard ultrasonic reflection spectrum of each angle of the corresponding unpolished hardware tableware when polishing liquid needs to be added is obtained;

[0022] In actual polishing processing, the ultrasonic reflection spectrum obtained in real time is compared with the standard ultrasonic reflection spectrum to determine whether chemical polishing liquid needs to be added.

[0023] Preferably, S6 also includes replacing the suspended abrasive.

[0024] Preferably, it further comprises a controller, which is electrically connected to the ultrasonic transmitter and the ultrasonic receiver respectively, and controls the ultrasonic transmitter to perform ultrasonic oscillation and receive feedback signals from the ultrasonic receiver.

[0025] The beneficial effects of the present invention are:

[0026] In the polishing method of hardware tableware, ultrasonic waves are used to perform oscillatory polishing on the mixture of hardware tableware, chemical polishing liquid and suspended abrasive in the solution pool. The cavitation effect induced by ultrasonic waves not only promotes the chemical reaction speed of the chemical polishing liquid, but also greatly improves the grinding efficiency of the suspended abrasive. The ideal polishing effect is achieved in a relatively short time, the polishing time of tableware is reduced, the polishing efficiency is improved, and the polishing effect and quality of hardware tableware are improved.

[0027] Moreover, through the cooperation of the ultrasonic transmitter and the ultrasonic receiver, the ultrasonic transmitter is not only used to vibrate and polish the hardware tableware, but also to grasp the polishing degree of the surface of the hardware tableware through the feedback signal of the ultrasonic receiver, thereby realizing the intelligent control of the polishing degree of the hardware tableware.

[0028] In addition, the combination of suspended abrasives and ultrasonic waves with chemical polishing liquid can reduce the consumption of chemical polishing liquid, and through ultrasonic waves, the approximate coordinates of the defect area can be identified to strengthen the polishing effect in a targeted manner, thereby shortening the overall time. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0030] Figure 1 These are the method steps of the present invention. DETAILED DESCRIPTION

[0031] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0032] See also Figure 1 This embodiment provides a surface polishing method for hardware tableware, comprising the following steps:

[0033] S1: Prepare a mixed polishing liquid, prepare a low-concentration chemical polishing liquid and mix it with a suspended abrasive to obtain a mixed polishing liquid. The preparation method and combination method of the low-concentration chemical polishing liquid are that the specific chemical polishing liquid formula is proportioned and produced according to the specific polishing needs. Polishing needs include the specific type and material of the hardware tableware to be processed, as well as the required degree of polishing. However, during preparation, since polishing is not only performed using chemical polishing liquid, when preparing the chemical polishing liquid, compared to the same polishing requirements, the concentration of the chemical polishing liquid required for polishing using only chemical polishing liquid will be lower. The specific proportioning method is proportioned according to the proportioning method of the chemical polishing liquid in the actual polishing. The shape and material of the suspended abrasive used need to be designed according to the specific type and material of the hardware tableware to be polished, as well as the required degree of polishing, to meet the specific polishing needs;

[0034] S2: Soaking: Soak the tableware in the mixed polishing liquid, and use the low-concentration chemical polishing liquid components to corrode and polish. Before soaking, clean the surface of the tableware to prevent the residual materials on the tableware from interfering with the subsequent polishing of the tableware, and then dry it;

[0035] Put the cleaned and dried hardware tableware into the mixed chemical polishing liquid;

[0036] The tableware is corroded and polished according to the processing needs to determine the polishing time of the tableware, and then the hardware tableware after corrosion and polishing is dried.

[0037] S3: Oscillation polishing, using a high-power ultrasonic transmitter to ultrasonically oscillate the mixed polishing liquid. The high-frequency vibration generated by the ultrasonic transmitter is transmitted to the surface of the workpiece through the liquid medium, and the cavitation effect is used to remove the defects on the surface of the hardware tableware. In the specific polishing process, the time and power of the ultrasonic transmitter are limited according to the needs of polishing to prevent over-polishing or inadequate polishing. Specifically, it needs to be determined according to the specific material, initial surface state and required final finish of the hardware tableware. Different metal materials (such as stainless steel, silver, etc.) react differently to ultrasound, so the optimal emission time and polishing power of the ultrasound used will also be different. Generally speaking, harder materials may require higher power and longer time to achieve the ideal polishing effect; for softer metals, it is necessary to choose the power and time more carefully to prevent surface damage caused by over-polishing. Moreover, if there are more burrs or high roughness on the surface of the hardware tableware, a higher starting power may be required to quickly remove these obvious defects. As the surface gradually becomes smoother, the power can be appropriately reduced, so in the process of polishing the hardware tableware, it is necessary to observe or make specific judgments based on the ultrasonic feedback data. For example, before actual polishing, a short-term multiple polishing test is used, and after a polishing process, the sample is taken out to carefully check the surface quality. If the expected effect is not achieved, the process can be repeated by slightly increasing the power or extending the polishing time until a proportional relationship value is adjusted, and in subsequent polishing, targeted adjustments can be made according to the characteristics of the specific tableware.

[0038] When using an ultrasonic transmitter to polish the surface of tableware, with the help of ultrasonic oscillation, the suspended abrasive can be evenly distributed in the entire solution pool, ensuring that every corner of the tableware can be effectively treated. When chemical polishing is used to polish hardware tableware, the solution pool is a container for holding chemical polishing liquid and a certain amount of hardware tableware for chemical corrosion. What is referred to here is also a container for holding hardware tableware and mixed polishing liquid, and it does not interfere with ultrasonic oscillation.

[0039] S4: Identify the defective areas on the tableware surface. In order to better understand the polishing results of the hardware tableware, ultrasonic receivers are set on the side walls and bottom of the solution pool. The ultrasonic transmitter is set in the solution pool and faces the location of the hardware tableware. The ultrasonic receiver is used to receive part of the ultrasonic waves reflected in the pool. Then, by comparing the ultrasonic reflection map of the location of the hardware tableware, the coordinates of the defective area of ​​the polishing degree of the hardware tableware are obtained.

[0040] Since ultrasound will interact with the surface of the tableware during propagation, it will reflect, scatter and absorb to varying degrees according to factors such as surface flatness and material properties. Ultrasonic receivers arranged around and at the bottom of the solution pool collect the reflected signals. By analyzing the changes in these signals (such as time delay, amplitude change, etc.), the status information of the surface of the tableware can be inferred, such as whether there are defects, surface roughness, etc. By analyzing the data of these reflected waves, an "image" of the surface of the tableware can be constructed, that is, an ultrasonic reflection map.

[0041] S5: For fine polishing of the defective areas on the surface of the tableware, a fluid polishing device is called to impact the polishing defective areas of the hardware tableware with a high-pressure fluid mixed with the same kind of suspended abrasives to accelerate the completion of polishing. The fluid polishing device here is a device that fixes the hardware tableware and uses a specific fluid to flush a specific position of the hardware tableware, and it includes at least one workpiece clamping fixture for the hardware tableware workpiece and a fluid flushing fixture. The tooling clamping fixture of the fluid polishing device performs at least one clamping and fixing on the hardware tableware. During the flushing process, the hardware tableware can be stably clamped to ensure the accuracy of the subsequent fluid flushing, and the clamping structure of the fluid polishing device for the hardware tableware must be corrosion-resistant. The fluid polishing device includes a clamping structure for clamping the hardware tableware, and the clamping structure can cope with the impact of the high-pressure fluid to ensure the accuracy of the subsequent high-pressure fluid impact position.

[0042] The high-pressure fluid here is the aforementioned mixed polishing liquid, and because the suspended abrasive needs to be flushed through a fluid polishing device, the size of the suspended abrasive should conform to the size of the fluid flushing device so that the suspended abrasive is flushed out along with the chemical polishing liquid.

[0043] When using ultrasound to oscillate polish the metal tableware, since the particles on the surface of the metal tableware are of different sizes, in order to avoid over-polishing, it cannot be polished for a long time. In addition, in order to improve the accuracy of ultrasonic detection of the surface of the metal tableware and reduce the interference of the polishing liquid and suspended abrasive in the solution pool on the ultrasonic results, the metal tableware is raised to a liquid level that is separated from the mixed polishing liquid. When the detection map reflected by the ultrasonic detection shows that there are less than three defective areas of the polishing degree of the metal tableware, the fluid polishing step of step S5 is connected to perform targeted polishing on the defective areas on the surface of the metal tableware.

[0044] By using ultrasonic waves to oscillate and polish a mixture of hardware cutlery, polishing liquid and suspended abrasives, the cavitation effect induced by ultrasonic waves not only promotes the chemical reaction rate of the chemical polishing liquid, but also greatly improves the grinding efficiency of the suspended abrasives. This means that the ideal polishing effect can be achieved in a relatively short time, reducing the polishing time and thus improving the polishing efficiency.

[0045] Here, the ultrasonic transmitter and the ultrasonic receiver are coordinated to realize that the ultrasonic transmitter is not only used to vibrate and polish the hardware tableware, but also to grasp the polishing degree of the surface of the hardware tableware through the feedback signal of the ultrasonic receiver, thereby realizing the intelligent control of the polishing degree of the hardware tableware.

[0046] Moreover, since the suspended abrasive and ultrasonic waves are combined with chemical polishing liquid, the consumption of chemical polishing liquid can be reduced, and the polishing effect can be strengthened at specific points by ultrasonically identifying the approximate coordinates of the defect area, thereby shortening the overall time.

[0047] In one embodiment, in step S4, the method for comparing the ultrasonic reflection spectrum is:

[0048] Put the same amount and type of hardware cutlery that has been polished to the standard in the same solution environment, obtain the ultrasonic reflection signal at this time through each ultrasonic receiver, establish the spectrum tolerance range by obtaining multiple sets of standard data, and obtain the ultrasonic reflection spectrum and allowable tolerance of each angle when the corresponding hardware cutlery is polished to the standard. The same solution environment here includes the same solution formula and volume. Since the standard parts are placed first to allow the ultrasonic wave to establish the spectrum, and then the workpiece to be processed is placed for processing, so in the test of establishing the spectrum tolerance range, it should be ensured that the position of the workpiece to be processed and the placement position of the standard polished workpiece must be strictly controlled to ensure that the established spectrum tolerance range can be applied;

[0049] In the actual polishing process, the polishing defect area of ​​the hardware tableware can be obtained by comparing the ultrasonic reflection map obtained in real time.

[0050] In one embodiment, since the chemical polishing liquid will be consumed, it is necessary to appropriately add or replace the chemical polishing liquid as needed during the polishing process. The same applies to the suspended abrasive. Since the suspended abrasive will collide with the surface of the hardware tableware during the polishing process, the suspended abrasive needs to be replaced when the wear degree of the suspended abrasive will affect the polishing effect of the hardware tableware. The polishing effect of the hardware tableware is ensured by replacing or adding the suspended abrasive.

[0051] The loss of chemical polishing liquid is generally a reduction in quantity, so the method to determine the need to add chemical polishing liquid is:

[0052] The same type and number of unpolished hardware tableware are placed in a solution pool to which chemical polishing liquid needs to be added, and the ultrasonic reflection signal at this time is obtained by each ultrasonic receiver. The spectrum tolerance range is established by obtaining multiple sets of standard data, and the standard ultrasonic reflection spectrum of each angle of the unpolished hardware tableware when polishing liquid needs to be added is obtained;

[0053] In actual polishing processing, the ultrasonic reflection spectrum obtained in real time is compared with the standard ultrasonic reflection spectrum to determine whether chemical polishing liquid needs to be added. The operator can determine whether chemical polishing liquid needs to be added by observing the remaining amount of chemical polishing liquid.

[0054] In order to save the cost of ultrasonic transmitters, the ultrasonic transmitters used can be limited to one group, and the ultrasonic transmitter can limit the emission time of the ultrasonic power for the polishing function of the hardware tableware and the pre-conditioning between each other, so that a group of ultrasonic detectors can achieve the required functions, and a controller is used. The controller is electrically connected to the ultrasonic transmitter and the ultrasonic receiver respectively, and the controller controls the emission of the ultrasonic transmitter and the reception of the feedback signal of the ultrasonic receiver respectively. The controller controls the working mode of the ultrasonic transmitter according to the set program, processes the signal fed back by the ultrasonic receiver, and performs signal analysis to obtain the ultrasonic reflection spectrum, so as to realize the aforementioned analysis of the defect distribution on the surface of the hardware tableware and whether the suspended abrasive needs to be added according to the ultrasonic reflection spectrum.

[0055] Moreover, the controller controls the ultrasonic transmitter to transmit the frequency band used for oscillation polishing and the frequency band used for detection function at a specific time according to the set program, and different frequency bands are maintained for different time periods. The power and time of the specific frequency band used for oscillation polishing and the frequency band used for detection function are defined according to specific polishing needs and then set into a control program. The controller controls the ultrasonic transmitter and the ultrasonic receiver according to the control program.

[0056] Naturally, the frequency band used for oscillation polishing and the frequency band used for detection function cannot interfere with each other. Therefore, when switching between frequency bands, it is necessary to control the switching time between adjacent frequency bands and the mutual non-interference of work. A working window switching is preset in the ultrasonic transmitter to achieve mutual non-interference between the work of each working window, and the ultrasonic receiver only receives frequency bands of specific frequencies, that is, only receives frequency bands used for detection function, thereby reducing the interference of the frequency band used for oscillation polishing emitted by the ultrasonic transmitter to the ultrasonic receiver.

[0057] Moreover, because the time for polishing the hardware tableware through this solution also depends on multiple factors, including but not limited to the material of the hardware tableware, the initial surface state, the desired final surface quality, and the specific ultrasonic parameters used (such as frequency, power, etc.), but the polishing time is ultimately counted in minutes, so different functions are achieved by controlling the ultrasonic transmitter to intermittently transmit different frequency bands to ensure that there is no interference between the frequency bands. When the ultrasonic reflection spectrum data is subsequently analyzed, the data needs to be processed in batches to realize the batch processing of the feedback signal, so the signal processing between the ultrasonic transmitter and the signal receiver uses a control system to control the signal, realize the control of the ultrasonic transmission signal and the subsequent processing of the data.

[0058] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A surface polishing method for hardware tableware, characterized in that: The following steps are involved: S1: preparing a mixed polishing liquid, preparing a low-concentration chemical polishing liquid and mixing it with a suspended abrasive to obtain a mixed polishing liquid; S2: Immersion polishing: soak the hardware tableware in the mixed polishing liquid and corrode and polish it with a low concentration of chemical polishing liquid; S3: Oscillation polishing, using an ultrasonic transmitter to ultrasonically oscillate the mixed polishing liquid; S4: Identify the defective area on the tableware surface, set an ultrasonic receiver in the solution pool, receive the ultrasonic waves reflected in part of the pool, compare the ultrasonic reflection spectrum of the hardware tableware position, and obtain the coordinates of the defective area of ​​the hardware tableware polishing degree; S5: For fine polishing of the defective areas on the surface of the tableware, a fluid polishing device is used to impact the polishing defective areas of the hardware tableware with a high-pressure fluid mixed with the same suspended abrasive to accelerate the completion of polishing.

2. The surface polishing method of hardware tableware according to claim 1, characterized in that: In S4, when the number of polishing defect areas of the hardware tableware obtained is less than three, the hardware tableware is raised to a liquid level that is out of the mixed polishing liquid, and then the fluid polishing step of step S5 is connected.

3. The surface polishing method of hardware tableware according to claim 2, characterized in that: In S3, the ultrasonic transmitter is arranged in the solution pool and faces the location of the hardware tableware, and the ultrasonic receivers are respectively arranged on the side walls and the bottom surface of the solution pool.

4. The surface polishing method of hardware tableware according to claim 2, characterized in that: In S4, the method for comparing the ultrasonic reflection spectrum is: Put the same type of hardware tableware that has been polished to the standard in the same solution environment, obtain the ultrasonic reflection signal at this time through each ultrasonic receiver, establish the spectrum tolerance range by obtaining multiple sets of standard data, and obtain the ultrasonic reflection spectrum and allowable tolerance of each angle of the corresponding hardware tableware when it is polished to the standard; In the actual polishing process, the polishing defect area of ​​the hardware tableware can be obtained by comparing the ultrasonic reflection map obtained in real time.

5. The surface polishing method of hardware tableware according to claim 4, characterized in that: The same solution environment includes the same solution formula and solution volume of the mixed polishing solution.

6. The surface polishing method of hardware tableware according to claim 4, characterized in that: S5 also includes S6: adding chemical polishing liquid, and a method for determining whether to add chemical polishing liquid: The same type of unpolished hardware tableware is placed in a solution pool to which chemical polishing liquid needs to be added, and the ultrasonic reflection signal at this time is obtained by each ultrasonic receiver. The spectrum tolerance range is established by obtaining multiple sets of standard data, and the standard ultrasonic reflection spectrum of each angle of the corresponding unpolished hardware tableware when polishing liquid needs to be added is obtained; In actual polishing processing, the ultrasonic reflection spectrum obtained in real time is compared with the standard ultrasonic reflection spectrum to determine whether chemical polishing liquid needs to be added.

7. The surface polishing method of hardware tableware according to claim 6, characterized in that: The S6 also includes replacement suspension abrasives.

8. The surface polishing method of hardware tableware according to claim 1, characterized in that: The device also includes a controller, which is electrically connected to the ultrasonic transmitter and the ultrasonic receiver respectively. The controller controls the ultrasonic transmitter to perform ultrasonic oscillation and receives feedback signals from the ultrasonic receiver.

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