A production process of wood grain decorative board and wood grain decorative board

Through the process of forming a high-temperature resistant ink layer and adhesive layer on the transparent plastic layer, the existing decorative boards are solved, and the water, corrosion and easy cleaning performance of decorative boards in the fields of interior and exterior decorative boards of smart home appliances, smart homes and new energy vehicles is achieved.

CN119773399APending Publication Date: 2025-04-08JIANGSU HAITAO INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202510063752.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-15
Publication Date
2025-04-08

AI Technical Summary

Technical Problem

Existing decorative panels are not resistant to corrosion, difficult to clean and fade when used in flat or regular appearance surfaces, and are difficult to meet the needs of smart home appliances, smart homes and new energy vehicles' interior and exterior decorative panels.

Method used

A wood grain decorative panel production process is adopted, including forming an ink layer on a transparent plastic layer, and forming an adhesive layer and a base layer on the ink layer. A high-temperature resistant ink layer and an adhesive layer are formed through preheating, printing, heating and curing processes, ensuring the water resistance, corrosion resistance and color-fading properties of the decorative panel.

Benefits of technology

It has realized the extensive design and use of decorative panels in the fields of smart home appliances, smart homes and new energy vehicles, and has the advantages of flexible appearance design and structure, water-resistant corrosion resistance, easy to clean and no fading.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a production process of a wood grain decorative board and the wood grain decorative board, and relates to the technical field of decorative board production. The production process comprises the following steps: providing a plastic layer; forming an ink layer on the plastic layer; forming a base layer on the ink layer; the wood grain decorative board has the characteristics of flexible structural design, corrosion resistance, easy cleaning, and no fading, so that the process can be widely used in smart home appliance panels, smart home decorative panels, and new energy vehicle interior and exterior decorative panels.
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Description

Technical Field

[0001] The invention relates to the technical field of decorative boards, and in particular to a manufacturing process of a wood grain decorative board. Background Art

[0002] The decorative panels in the prior art can only be designed and used on flat or regular shaped surfaces, and the surfaces have problems such as corrosion resistance, difficulty in cleaning, and fading. It is urgent to propose a new manufacturing process for decorative panels to solve the above problems. Summary of the invention

[0003] The purpose of the present invention is to overcome the defects of the prior art and provide a production process of a wood grain decorative panel, so that the wood grain decorative panel can be widely designed and used in the fields of smart home appliances, smart homes, and new energy vehicle interior and exterior decorative panels, and has good three-dimensional effects and the advantages of corrosion resistance, easy cleaning, and no fading.

[0004] In order to achieve the above and other purposes, the present invention is implemented by including the following technical solutions: The present invention provides a manufacturing process of a wood grain decorative board, and the manufacturing process includes the following steps:

[0005] A plastic layer is provided; an ink layer is formed on the plastic layer; and a base layer is formed on the ink layer; wherein the plastic layer is a transparent film, and the plastic layer is any one or more combinations of PET, PC, ABS, PMMA, and PP, and the raw materials of the ink layer include: 20-30% of film-forming material, 40-45% of solvent, 7-10% of filler, 6-8% of curing agent, and 5-6% of pigment.

[0006] In one embodiment, the manufacturing process includes forming an adhesive layer between the base layer and the ink layer, and the film-forming substance includes any one of polyurethane resin and polyester resin.

[0007] In one embodiment, the plastic layer undergoes a preheating process, the temperature of the preheating process is 100-120° C., and the time of the preheating process is 15-30 minutes.

[0008] In one embodiment, the ink layer is printed on the back side of the plastic layer, and the adhesive layer is printed on the side of the ink layer away from the plastic layer. The printing includes screen printing and / or color inkjet printing, and the printing includes a heating, drying and curing process.

[0009] In one embodiment, the plastic layer after the ink layer is formed further includes blanking, punching and auxiliary positioning processes.

[0010] In one embodiment, the adhesive layer covers the ink layer.

[0011] In one embodiment, the edges of the base layer and the plastic layer form a bonding boundary using the adhesive layer.

[0012] In one embodiment, the base layer is formed by an injection molding process.

[0013] In one embodiment, the plastic layer is located in a mold cavity of an injection molding mold, and a surface of the mold has convex and concave patterns that are similar to or consistent with the patterns of the ink layer.

[0014] Another aspect of the present invention further provides a wood grain decorative board produced by the production process described above.

[0015] Beneficial effects: The ink layer provided in the present invention is located between the base layer and the plastic layer, and the decorative plate produced has flexible appearance design structure, water resistance and corrosion resistance, is easy to clean and will not fade. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a partial cross-sectional view of a decorative panel according to an embodiment of the present invention.

[0017] Figure 2 Shown is a physical picture of the decorative panel manufactured in Example 1 of the present invention. DETAILED DESCRIPTION

[0018] See also Figure 1 to Figure 2 The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0019] The decorative panel of the present invention can be used as interior and exterior decorative panels of automobiles, smart home appliance panels, decorative panels for smart homes, decorative panels on water cup covers, and the like.

[0020] like Figure 1 and Figure 2 As shown, the present invention provides a wood grain decorative board, which includes a transparent plastic layer 1, and the material of the plastic layer 1 can be any one or more combinations of PET, PC, ABS, PMMA, and PP. The thickness of the plastic layer 1 can be 75 to 500 μm.

[0021] The wood grain decorative board includes an ink layer 2, which is a high temperature resistant ink. Specifically, the ink layer 2 may include: 20-30% film-forming substance, 40-45% solvent, 7-10% filler, 6-8% curing agent, and 5-6% pigment. The ink layer 2 is located on the plastic layer 1.

[0022] In some embodiments, the film-forming material includes alkyd resin, acrylic resin, polyurethane resin, epoxy resin, polyester resin, and the like.

[0023] Specifically, the film-forming substance is polyurethane resin or polyester resin, the solvent can be any one of naphtha and trimethylbenzene or a combination of the two, the filler can be silicon dioxide, and the curing agent can be an isocyanate curing agent.

[0024] The wood grain decorative board comprises an adhesive layer 3, and the adhesive layer 3 is located on the ink layer 2. The adhesive layer 3 can be an organic silicon adhesive.

[0025] The wood grain decorative board comprises a base layer 4 , and the base layer 4 is made of any one or a combination of two of ABS, PC, ABS, PP, and PMMA. The base layer 4 is located on the adhesive layer 3 .

[0026] In some embodiments, the base layer 4 may also be made of metal, wood, rock, or glass. The base layer 4 may be a formed structural member, and the base layer 4 may be formed by 3D printing or by in-film injection molding.

[0027] The present invention also provides a process for manufacturing a wood grain decorative board. In some embodiments, the manufacturing process includes the following steps:

[0028] S1, providing a plastic layer 1;

[0029] S2, forming an ink layer 2 on the plastic layer 1;

[0030] S3, forming an adhesive layer 3 on the ink layer 2;

[0031] S4, forming a base layer 4 on the adhesive layer 3;

[0032] In step S1, the plastic layer 1 may be a transparent plastic film, the shrinkage rate of the plastic layer 1 may be 0.3-0.7%, and the plastic layer 1 may be preheated before forming the ink layer 2, the preheating temperature may be 100-120°C, and the preheating time may be 15-30 minutes. The preheating may keep the plastic layer 1 stable in the subsequent process, and prevent the problem of poor wood grain visual effect caused by shrinkage.

[0033] In step S2, the ink layer 2 can be formed on the back of the plastic layer 1. The ink layer 2 can be formed on the back of the plastic layer 1 by screen printing and / or color inkjet printing. The printing can form a wood grain pattern.

[0034] In step S3, the adhesive layer 3 can bond the ink layer 2 and the base layer 4. The adhesive layer 3 can completely cover the ink layer 2 so that the ink layer 2 is wrapped. In some embodiments, the adhesive layer 3 can be a hot melt adhesive.

[0035] In step S3, after the adhesive layer 3 is formed, heating and drying can be performed for curing. The temperature of the heating and drying curing is 60 to 90°C. The time of the heating and drying curing can be 10 to 40 minutes. The heating and drying curing can cure the ink to prevent the ink from being dispersed during the injection molding process and unable to form a wood grain pattern. In some embodiments, when the base layer 4 is not formed by in-film injection molding, the heated and cured plastic layer 1 can be subjected to a hot pressing process. The hot pressing process can form a concave and convex groove pattern by hot pressing, so that the plastic layer 1 has a good three-dimensional effect.

[0036] In some embodiments, the ink layer 2 can be formed by performing a UV transfer process on the plastic layer 1. The UV transfer process can use UV ink to apply to the surface of the plastic layer 1 and then use a steel plate etched with concave and convex grooves to press and solidify it, so that the surface of the plastic layer 1 forms a good three-dimensional texture effect.

[0037] The raw material of the ink layer 2 can be purchased from the IPX model of Zhejiang Caihuang Fine Chemical Co., Ltd. or the HDF ink of Shenzhen Yitongsheng Printing Equipment Co., Ltd.

[0038] In step S3, the plastic layer 1 after being heated and cured can also be subjected to an auxiliary positioning process, and the auxiliary positioning process includes punching positioning holes or printing positioning lines. Punching positioning holes can make the plastic layer 1 have positioning holes, and the positioning holes or positioning lines are convenient for positioning with the mold during injection molding, so that the wood grain pattern and the wood grain in the mold remain similar or consistent. In the case of high requirements for the appearance of the decorative board, positioning holes can be selected for positioning.

[0039] The plastic layer 1 after punching or printing the positioning lines can also be blanked and cut to form a specific shape to meet the needs of different product structure designs. In some embodiments, the plastic layer 1 is punched into a circle.

[0040] In step S4, the formation of the base layer 4 can be achieved by film injection molding. In the injection molding process, the glue inlet is located below the plastic layer 1. The plastic layer 1 is positioned through the positioning hole and is close to the mold. The temperature of the material body during the injection molding of the base layer 4 can be 200-300°C. The mold for the injection molding of the base layer 4 can be etched or laser engraved with concave and convex grooves, so that the concave and convex feeling of wood grain texture can be formed. During injection molding, the plastic layer 1 can be close to the bottom of the grooves engraved by the laser on the mold. The initial temperature of the mold is 50-70°C, for example 60°C. This can enhance the adhesion between the base layer 4 and the plastic layer 1 and avoid the formation of gaps.

[0041] During the injection molding, the injection pressure may be 60 to 140 MPa, and the holding time may be 1 to 10 seconds.

[0042] During the injection molding, the adhesive layer 3 can be melted to bond the plastic layer 1 and the base layer 4 together. The front side of the plastic layer 1 can also be printed with a simulated texture coating, so that the surface of the plastic layer 1 has a smooth and delicate touch. The simulated texture coating can withstand high temperatures of 200 to 300° C. The simulated texture coating can be performed in step S1 or after the injection molding is completed in step S4.

[0043] The components of the simulated texture coating may include turpentine, pine alcohol, rosin, frankincense, ethyl cellulose, acid-resistant titanium oxide, alkali-resistant zirconium oxide, boron oxide, lead oxide, silicon dioxide, zinc oxide, sodium oxide, cesium oxide, lithium oxide, aluminum oxide, potassium oxide, cadmium sulfide, uranium salts, cadmium sulfide, lead chromate, cobalt aluminate, iridium oxide, iron chromate, tin oxide, calcium oxide, kaolin, chromium oxide, iron oxide, manganese salts, etc.

[0044] The technical solution of the present invention is further illustrated by examples below.

[0045] Example 1

[0046] Preheat the PET transparent film at 110°C for 20 min;

[0047] A color wood grain pattern is sprayed on the back of the PET transparent film by using a color inkjet device, and then a high temperature resistant ink and adhesive are screen printed. After curing at 90°C for 60 minutes, a positioning line is printed, the film shape is punched out, and the film after cutting is hot-pressed into a PET film with the same shape as the base layer. The positioning line printed on the back is kept flush with the positioning line on the parting surface of the injection mold cavity, so that the convex and concave patterns etched or laser engraved on the surface of the injection mold cavity and the wood grain patterns of the film ink layer are similar or consistent;

[0048] The ABS base layer was started to be injected, the injection pressure was 100 MPa, the holding time was 5 seconds, and the injection cycle was 40 seconds.

[0049] Example 2

[0050] Preheat the PC transparent film at 120°C for 30 minutes;

[0051] A color inkjet device is used to spray a color wood grain pattern on the back of the PC transparent film, and then a high temperature resistant ink is screen printed. Because the PC film and the base layer are made of the same PC material, the adhesion can be ensured without printing an adhesive during the injection molding process. The film is cured at 100°C for 30 minutes, and positioning holes are punched, the film shape is cut, and the PC film after cutting is placed on the surface of the molding mold with surface etching or laser engraving by applying the positioning holes to make it consistent with the S1 printed wood grain pattern. The film is then heated and baked to soften it, and then pressed to form a PC film with a three-dimensional pattern consistent with the S4 base layer shape amplitude, and then placed in the injection mold cavity, and its surface is laser engraved with concave and convex groove patterns;

[0052] The machine was adjusted to start injection molding of the PC base layer. The injection pressure was 80 MPa and the holding time was 10 min.

[0053] Example 3

[0054] Preheat the PC transparent film at 110°C for 30 minutes;

[0055] A color inkjet device is used to spray a colored wood grain pattern on the back of the PC transparent film, and then the adhesive is screen-printed. After curing at 100°C for 15 minutes, positioning holes are punched, the film shape is cut, and the cut PC film is placed on the surface of the etched or laser-engraved molding mold surface using the positioning holes to make it consistent with the printed wood grain pattern. The film is then heated and baked to soften it, and then pressed to form a PC film with a three-dimensional pattern consistent with the shape of the base layer.

[0056] The formed PC film is bonded to the base layer by heating and pressurizing, and the PC film is realized by additionally spraying a corresponding tactile coating.

[0057] Example 4

[0058] Preheat the PC transparent film at 110°C for 30 minutes;

[0059] A color inkjet device is used to spray a color wood grain pattern on the back of the PC transparent film, and after curing at 100°C for 15 minutes, positioning holes are punched, the film shape is cut, and then the PC film after cutting is placed on the surface of the etched or laser engraved molding die using the positioning holes. After the texture on the molding die is consistent with the printed wood grain texture, the film is heated and baked to soften it, and then pressed to form a PC film with a three-dimensional texture consistent with the shape of the base layer.

[0060] A positioning jig for placing the base layer is installed on the hot press, the base layer is placed on the jig, a layer of hot melt adhesive film is spread on the surface of the base layer, and then the PC film with three-dimensional patterns is positioned through the positioning holes on the positioning jig and the shape of the base layer. The pressure is 3MPa, the temperature is 100 degrees, the pressure holding time is 15 seconds, and the hot press is started to heat and pressurize it for bonding.

[0061] evaluate:

[0062] (1) Adhesion test: The adhesion between the plastic layer and the substrate layer is evaluated using a 100-grid peel test.

[0063] (2) Heat resistance test: Based on different materials, the coating samples are exposed to a 100°C environment in a high temperature box to evaluate their performance under high temperature;

[0064] (3) For the cold resistance test, a low temperature box is used to place the sample at -25°C to test its performance in a low temperature environment.

[0065] The specific evaluation results are shown in Table 1.

[0066] Table 1 Performance test data table of the embodiment

[0067]

[0068] Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value. The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology can modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A process for producing a wood grain decorative board, characterized in that: The manufacturing process comprises the following steps: providing a plastic layer; forming an ink layer on the plastic layer; forming a base layer on the ink layer; The plastic layer is a transparent film, and the plastic layer is any one or more combinations of PET, PC, ABS, PMMA, and PP. The raw materials of the ink layer include: 20-30% film-forming material, 40-45% solvent, 7-10% filler, 6-8% curing agent, and 5-6% pigment.

2. The manufacturing process according to claim 1, characterized in that: The manufacturing process includes forming an adhesive layer between the base layer and the ink layer, and the film-forming substance includes any one of polyurethane resin and polyester resin.

3. The manufacturing process according to claim 1, characterized in that: The plastic layer undergoes a preheating process, the temperature of the preheating process is 100-120°C, and the time of the preheating process is 15-30 minutes.

4. The manufacturing process according to claim 2, characterized in that: The ink layer is printed on the back of the plastic layer, and the adhesive layer is printed on the side of the ink layer away from the plastic layer. The printing includes screen printing and / or color inkjet printing, and the printing includes a heating, drying and curing process.

5. The manufacturing process according to claim 1, characterized in that: The plastic layer after forming the ink layer also includes blanking, punching and auxiliary positioning processes.

6. The manufacturing process according to claim 2, characterized in that: The adhesive layer covers the ink layer.

7. The manufacturing process according to claim 2, characterized in that: The edges of the base layer and the plastic layer form a bonding boundary using the adhesive layer.

8. The manufacturing process according to claim 1, characterized in that: The base layer is formed by an injection molding process.

9. The manufacturing process according to claim 8, characterized in that: The plastic layer is located in a mold cavity of an injection molding mold, and a surface of the mold has convex and concave groove patterns that are similar to or consistent with the patterns of the ink layer.

10. A wood grain decorative board produced according to the production process of any one of claims 1 to 9.