Chip taking and placing mechanism, control method and device thereof and medium

Abstract

The invention provides a chip taking and placing mechanism, a control method and device thereof, and a medium, and the mechanism comprises a supporting frame, the upper side of which is provided with a top plate; the rotating motor is fixed to the top plate, the rotating disc is connected to the rotating motor, the outer edge of the rotating disc is provided with a plurality of chip suction heads which are arranged at equal intervals, and trigger devices are arranged above the chip suction heads; the feeding assembly, the fourth lifting mechanism, the electrical performance detection assembly, the fifth lifting mechanism and the discharging assembly are sequentially arranged. The feeding assembly comprises a first lifting mechanism and a first CCD device. The discharging assembly comprises a second lifting mechanism. The electrical performance detection assembly comprises a detection card and a third lifting mechanism for driving the detection card to move; and the controller is in communication connection with the rotating motor, the triggering device, the feeding assembly, the discharging assembly, the electrical performance detection assembly, the fourth lifting mechanism and the fifth lifting mechanism. According to the technical scheme of the embodiment of the invention, the chip taking, transferring and detecting steps can be completed through one chip taking and placing mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of chip transport, and in particular to a chip taking and placing mechanism and a control method, device and medium thereof. Background Art

[0002] The chip production process involves chip material collection, transportation and chip testing.

[0003] In the prior art, the chip is located below the first chip pick-and-place mechanism, which loads the chip, and then transfers the chip to the testing equipment and unloads the chip through the first chip pick-and-place mechanism. After the testing equipment completes the testing of the chip, the second chip pick-and-place mechanism loads the chip that has completed the testing and transfers it to the designated location, and then unloads the chip. However, this method requires multiple devices to complete the chip picking, transfer and testing steps, resulting in a long transfer time between devices, low efficiency, and an increase in the equipment cost required for chip production, and a large equipment footprint. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a chip pick-and-place mechanism and a control method, device, and medium thereof, which can complete the steps of picking, transporting, and detecting chips through a chip pick-and-place mechanism, thereby reducing the flow time of chips between devices, improving chip production efficiency, reducing the equipment cost required for chip production, and saving installation space.

[0005] In a first aspect, an embodiment of the present invention provides a chip pick-and-place mechanism, comprising: A supporting frame, wherein a top plate is disposed on an upper side of the supporting frame; A rotating motor and a turntable, wherein the rotating motor is fixed to the top plate, the turntable is connected to the rotating motor, the rotating motor is used to drive the turntable to rotate, a plurality of chip suction heads with equal spacing are arranged on the outer edge of the turntable, a trigger device is arranged above the chip suction head, and the trigger device is electrically connected to the chip suction head; A loading assembly and a unloading assembly, wherein the loading assembly and the unloading assembly are fixed to the support frame and are located above the chip suction head, the loading assembly comprises a first lifting mechanism and a first CCD device, the shooting direction of the first CCD device is aligned below the first lifting mechanism, and the unloading assembly comprises a second lifting mechanism, and the first lifting mechanism and the second lifting mechanism can be lowered and abut against the trigger device; An electrical performance detection component, the electrical performance detection component is fixed to the top plate and is located between the loading component and the unloading component. The electrical performance detection component includes a third lifting mechanism and a detection card. The detection card is located at the lower end of the third lifting mechanism. Under the drive of the third lifting mechanism, the detection card moves in a vertical direction. A fourth lifting mechanism and a fifth lifting mechanism, the top ends of the fourth lifting mechanism and the fifth lifting mechanism are both fixed to the top plate, the fourth lifting mechanism is arranged between the loading assembly and the electrical performance detection assembly, and the fifth lifting mechanism is arranged between the electrical performance detection assembly and the unloading assembly; A controller is communicatively connected to the rotating motor, the trigger device, the loading assembly, the unloading assembly, the electrical property detection assembly, the fourth lifting mechanism and the fifth lifting mechanism.

[0006] According to some embodiments of the present invention, it also includes multiple solenoid valves and multiple flow meters, multiple chip suction heads are connected to the vacuum pump, each of the trigger devices is electrically connected to one solenoid valve and one flow meter, the solenoid valve is located between one chip suction head and the vacuum pump, the flow meter is located inside the chip suction head, the flow meter is used to detect the gas flow of the chip suction head, and multiple flow meters are communicatively connected to the controller.

[0007] According to some embodiments of the present invention, the material unloading assembly includes a second CCD device, and a shooting direction of the second CCD device is aligned below the second lifting mechanism.

[0008] In a second aspect, an embodiment of the present invention provides a control method for a chip pick-and-place mechanism, which is applied to the chip pick-and-place mechanism described in the first aspect, wherein the plurality of chip suction heads include at least a first chip suction head, and the method includes: The controller sends a rotation signal to the rotary motor, and the rotary motor drives the turntable to rotate, so that the first chip suction head rotates to the bottom of the loading assembly, and the first chip is placed under the first chip suction head; The controller controls the loading component to perform CCD detection on the first chip to obtain a first CCD detection result, and sends the first CCD detection result to the controller. After the controller controls the first chip suction head to suck the first chip, the controller sends the rotation signal to the rotating motor again; When the first chip suction head rotates to the bottom of the fourth lifting mechanism, when the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the trigger device of the first chip suction head, so that the first chip suction head puts down the first chip, or, when the first CCD detection result indicates that the CCD detection passes, controls the first chip suction head to rotate to the bottom of the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain a first electrical performance detection result, and sends the first electrical performance detection result to the controller; The controller rotates the first chip suction head to the bottom of the fifth lifting mechanism. When the first electrical property test result indicates that the electrical property test fails, the controller controls the fifth lifting mechanism to trigger the trigger device of the first chip suction head so that the first chip suction head puts down the first chip. Alternatively, when the first electrical property test result indicates that the electrical property test passes, the controller controls the first chip suction head to rotate to the bottom of the unloading component, and the unloading component completes the unloading of the first chip.

[0009] According to some embodiments of the present invention, the plurality of chip suction heads further include a second chip suction head, the second chip suction head being located behind the first chip suction head, and after the rotation signal is sent to the rotating motor again, the method further includes: When the second chip suction head rotates to the bottom of the loading assembly, a second chip is placed under the second chip suction head; The controller controls the loading component to perform CCD detection on the second chip to obtain a second CCD detection result; When the second CCD detection result indicates that the CCD detection has passed and the second chip suction head rotates to the bottom of the electrical property detection component, a second electrical property detection result of the second chip is determined based on the electrical property detection component; The second chip is cut based on the second electrical property test result.

[0010] According to some embodiments of the present invention, after the first chip suction head rotates to the bottom of the fourth lifting mechanism, the method further includes: The controller acquires a first queue, wherein the first queue at least stores the first CCD detection result and the second CCD detection result; The controller obtains the first CCD detection result from the first queue, controls the fourth lifting mechanism based on the first CCD detection result, and removes the first CCD detection result from the first queue; When the second chip suction head rotates to the bottom of the fourth lifting mechanism, the controller obtains the second CCD detection result from the first queue, controls the fourth lifting mechanism based on the second CCD detection result, and removes the second CCD detection result from the first queue.

[0011] According to some embodiments of the present invention, after the controller rotates the first chip suction head to below the fifth lifting mechanism, the method further includes: The controller acquires a second queue, wherein the second queue at least stores the first electrical property detection result and the second electrical property detection result; The controller obtains the first electrical property detection result from the second queue, controls the fifth lifting mechanism based on the first electrical property detection result, and removes the first electrical property detection result from the second queue; When the second chip suction head rotates to the bottom of the fifth lifting mechanism, the second electrical property test result is obtained from the second queue, and the fifth lifting mechanism is controlled based on the second electrical property test result to remove the second electrical property test result from the second queue.

[0012] According to some embodiments of the present invention, it further comprises a plurality of solenoid valves and a plurality of flow meters, a plurality of the chip suction heads are connected to the air pump, each of the trigger devices is electrically connected to one of the solenoid valves and one of the flow meters, the solenoid valve is located between one of the chip suction heads and the air pump, the flow meter is located inside the chip suction head, a plurality of the flow meters are communicatively connected to the controller, the unloading assembly comprises a second CCD device, and the shooting direction of the second CCD device is aligned below the second lifting mechanism; Controlling the first chip suction head to rotate to the bottom of the unloading assembly, and the unloading assembly completes unloading of the first chip, including: The controller controls the first chip to rotate to the bottom of the blanking assembly, and places a first chip fixture under the first chip; Controlling the second CCD device to perform CCD detection on the first chip fixture to obtain a first CCD positioning result, and sending the first CCD positioning result to the controller; When the first CCD positioning result indicates that the positioning detection of the first chip fixture has passed, the controller controls the second lifting mechanism to move downward so that the second lifting mechanism triggers the trigger device, the trigger device controls the solenoid valve and the flow meter to close, and the first chip suction head puts down the first chip.

[0013] In a third aspect, an embodiment of the present invention provides a control device for a chip placement mechanism, comprising at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the control method for the chip placement mechanism as described in the second aspect above.

[0014] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the control method of the chip placement mechanism as described in the second aspect above.

[0015] The chip picking and placing mechanism according to the embodiment of the present invention has at least the following beneficial effects: a supporting frame, a top plate is arranged on the upper side of the supporting frame; a rotating motor and a turntable, the rotating motor is fixed to the top plate, the turntable is connected to the rotating motor, the rotating motor is used to drive the turntable to rotate, a plurality of chip suction heads with equal spacing are arranged on the outer edge of the turntable, a trigger device is arranged above the chip suction head, and the trigger device is electrically connected to the chip suction head; a loading component and a unloading component, the loading component and the unloading component are fixed to the supporting frame and are located above the chip suction head, the loading component includes a first lifting mechanism and a first CCD device, the shooting direction of the first CCD device is aligned with the bottom of the first lifting mechanism, the unloading component includes a second lifting mechanism, the first lifting mechanism and the second lifting mechanism can be lowered and Abutting the trigger device; an electrical performance detection component, the electrical performance detection component is fixed to the top plate, located between the loading component and the unloading component, the electrical performance detection component includes a third lifting mechanism and a detection card, the detection card is located at the lower end of the third lifting mechanism, and under the drive of the third lifting mechanism, the detection card moves in the vertical direction; a fourth lifting mechanism and a fifth lifting mechanism, the top ends of the fourth lifting mechanism and the fifth lifting mechanism are both fixed to the top plate, the fourth lifting mechanism is arranged between the loading component and the electrical performance detection component, and the fifth lifting mechanism is arranged between the electrical performance detection component and the unloading component; a controller, the controller is communicatively connected to the rotating motor, the trigger device, the loading component, the unloading component, the electrical performance detection component, the fourth lifting mechanism and the fifth lifting mechanism. According to the technical solution of the embodiment of the present invention, the steps of picking up, transporting and detecting the chip can be completed by a chip picking and placing mechanism, the circulation time of the chip between the equipment can be reduced, the chip production efficiency can be improved, the equipment cost required for chip production can be reduced, and the installation space can be saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a structural diagram of the interior of a support frame provided by an embodiment of the present invention; Figure 2 is a structural diagram of a chip pick-and-place mechanism provided by another embodiment of the present invention; Figure 3 is a structural diagram of a chip pick-and-place head provided by another embodiment of the present invention; Figure 4 is a flow chart of a control method of a chip pick-and-place mechanism provided by another embodiment of the present invention; Figure 5 It is a structural diagram of a control device of a chip pick-and-place mechanism provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0018] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0021] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0022] The chip picking and placing mechanism according to the embodiment of the present invention has at least the following beneficial effects: a supporting frame, a top plate is arranged on the upper side of the supporting frame; a rotating motor and a turntable, the rotating motor is fixed to the top plate, the turntable is connected to the rotating motor, the rotating motor is used to drive the turntable to rotate, a plurality of chip suction heads with equal spacing are arranged on the outer edge of the turntable, a trigger device is arranged above the chip suction head, and the trigger device is electrically connected to the chip suction head; a loading component and a unloading component, the loading component and the unloading component are fixed to the supporting frame and are located above the chip suction head, the loading component includes a first lifting mechanism and a first CCD device, the shooting direction of the first CCD device is aligned with the bottom of the first lifting mechanism, the unloading component includes a second lifting mechanism, the first lifting mechanism and the second lifting mechanism can be lowered and Abutting the trigger device; an electrical performance detection component, the electrical performance detection component is fixed to the top plate, located between the loading component and the unloading component, the electrical performance detection component includes a third lifting mechanism and a detection card, the detection card is located at the lower end of the third lifting mechanism, and under the drive of the third lifting mechanism, the detection card moves in the vertical direction; a fourth lifting mechanism and a fifth lifting mechanism, the top ends of the fourth lifting mechanism and the fifth lifting mechanism are both fixed to the top plate, the fourth lifting mechanism is arranged between the loading component and the electrical performance detection component, and the fifth lifting mechanism is arranged between the electrical performance detection component and the unloading component; a controller, the controller is communicatively connected to the rotating motor, the trigger device, the loading component, the unloading component, the electrical performance detection component, the fourth lifting mechanism and the fifth lifting mechanism. According to the technical solution of the embodiment of the present invention, the steps of picking up, transporting and detecting the chip can be completed by a chip picking and placing mechanism, the circulation time of the chip between the equipment can be reduced, the chip production efficiency can be improved, the equipment cost required for chip production can be reduced, and the installation space can be saved.

[0023] First, refer to Figures 1 to 3 , the chip fetching and placing mechanism provided in the embodiment of the present application includes: A support frame 10, wherein a top plate 20 is disposed on the upper side of the support frame 10; A rotating motor 30 and a turntable 40, wherein the rotating motor 30 is fixed to the top plate 20, and the turntable 40 is connected to the rotating motor 30, and the rotating motor 30 is used to drive the turntable 40 to rotate. A plurality of chip suction heads 41 with equal spacing are arranged on the outer edge of the turntable 40, and a trigger device 42 is arranged above the chip suction head 41, and the trigger device 42 is electrically connected to the chip suction head 41; A loading assembly 50 and a unloading assembly 60, which are fixed to the support frame 10 and are located above the chip suction head 41. The loading assembly 50 includes a first lifting mechanism and a first CCD device, and the shooting direction of the first CCD device is aligned below the first lifting mechanism. The unloading assembly 60 includes a second lifting mechanism 61, and the first lifting mechanism and the second lifting mechanism 61 can be lowered and abut against the trigger device 42; The electrical performance detection assembly is fixed to the top plate 20 and is located between the loading assembly 50 and the unloading assembly 60. The electrical performance detection assembly includes a third lifting mechanism 70 and a detection card. The detection card is located at the lower end of the third lifting mechanism 70. Under the drive of the third lifting mechanism 70, the detection card moves in a vertical direction. The fourth lifting mechanism 80 and the fifth lifting mechanism 90, the top ends of the fourth lifting mechanism 80 and the fifth lifting mechanism 90 are fixed to the top plate 20, the fourth lifting mechanism 80 is arranged between the loading assembly 50 and the electrical performance detection assembly, and the fifth lifting mechanism 90 is arranged between the electrical performance detection assembly and the unloading assembly 60; The controller is communicatively connected to the rotating motor 30 , the trigger device 42 , the loading assembly 50 , the unloading assembly 60 , the electrical performance detection assembly, the fourth lifting mechanism 80 and the fifth lifting mechanism 90 .

[0024] It should be noted that the turntable 40 is provided with chip suction heads 41 at equal intervals, and the rotary motor 30 drives the turntable 40 to rotate at a preset angle, and each station passes through the detection equipment and the descending mechanism in sequence. After the rotary motor 30 obtains the rotation signal, it rotates at a preset angle, and the preset angle is associated with the station setting spacing. The rotary motor 30 rotates and drives the turntable 40 to rotate at a preset angle, so that two adjacent chip suction heads 41 pass through the loading assembly 50, the fourth lifting mechanism 80, the electrical performance detection equipment, the fifth lifting mechanism 90 and the unloading assembly 60 in the rotation direction of the turntable 40.

[0025] It should be noted that how to absorb the chip by the chip suction head 41 is an existing technology. The chip is placed under the chip suction head 41, and the first lifting mechanism can move in the vertical direction. The first lifting mechanism descends so that the first lifting mechanism abuts against the trigger device 42. The trigger device 42 generates an electrical signal and sends it to the chip suction head 41. The chip suction head 41 absorbs the chip to complete the loading. In order to realize the automated chip material transportation and detection, the conveyor belt can be located below the loading assembly 50 to transport the chip to the bottom of the chip suction head 41 located below the loading assembly 50.

[0026] It should be noted that the first CCD device is used to take a picture of the upper surface of the chip to obtain an image, and perform defect detection on the upper surface of the chip based on the image. How to detect the upper surface of the chip by taking a picture of the upper surface of the chip is a prior art, and this application does not make any improvements based on the defect detection of the chip surface image, so it will not be elaborated here.

[0027] It should be noted that the first CCD device obtains the offset angle of the unloaded chip based on the image captured of the chip, and sends the chip angle to an external device. The external device corrects the chip based on the chip angle to achieve neat placement during unloading, which facilitates subsequent chip transportation.

[0028] It should be noted that the surface of the probe card includes a plurality of contacts. Driven by the third lifting mechanism 70, the probe card moves downward, and the contacts of the probe card are in electrical contact with the contacts of the chip. If they are connected to each other, the test is passed, and if they are not connected, the test is not passed, thereby realizing the electrical performance detection of the chip. How to realize the electrical performance detection of the chip based on the probe card is a prior art. This application does not make any improvements to the electrical performance detection of the chip, and will not be elaborated here.

[0029] It should be noted that the fourth lifting mechanism 80 is used to unload chips that have not passed the upper surface visual inspection, that is, chips that have not passed the upper surface inspection do not need to be tested for electrical properties; the fifth lifting mechanism 90 is used to unload chips that have not passed the electrical properties inspection, that is, the fourth lifting mechanism 80, the fifth lifting mechanism 90 and the second lifting mechanism 61 are used to implement classification based on chip inspection results. The chips unloaded by the fourth lifting mechanism 80 are chips with defects on the upper surface, the chips unloaded by the fifth lifting mechanism 90 are chips that have passed the visual test but failed the electrical properties test, and the chips unloaded by the second lifting mechanism 61 are chips that have passed both the visual test and the electrical properties test.

[0030] It should be noted that an additional lifting mechanism can be set between the unloading component 60 and the loading component 50. The lifting mechanism located between the unloading component 60 and the loading component 50 is used to unload the chip suction head 41 passing through the unloading component 60 again to ensure that the chip suction head 41 entering under the loading component 50 does not suck up the chip.

[0031] It should be noted that the unloading component 60 unloads the chips that have passed the visual test and the electrical performance test, and has two unloading logics. The first unloading logic is that every time the turntable 40 rotates once, the second lifting mechanism 61 unloads the chip suction head 41 located below the unloading component 60; the second unloading logic is that the second lifting mechanism 61 only unloads the chip suction head 41 that is located below the unloading component 60 and has sucked chips, and there is no operation on the chip suction head 41 that has not sucked chips.

[0032] It should be noted that the controller sends signals to control the rotating motor 30, the trigger device 42, the loading assembly 50, the unloading assembly 60, the electrical performance detection assembly, the fourth lifting mechanism 80 and the fifth lifting mechanism 90 to operate.

[0033] Through the technical solution of this embodiment, the chip pick-and-place mechanism is started, and the rotating motor 30 drives the first chip suction head 41 to rotate to the bottom of the loading assembly 50 through the turntable 40. The first chip is located below the first chip suction head 41. The first CCD device takes a picture of the upper surface of the first chip and obtains an image, and performs visual inspection based on the image. If there is no defect on the upper surface of the chip, it passes the visual inspection, and if there is a defect on the upper surface of the chip, it fails the visual inspection. The rotating motor 30 drives the first chip to rotate to the bottom of the fourth lifting mechanism 80. The fourth lifting mechanism 80 operates the first chip based on the visual inspection result. If the first chip passes the visual inspection, the fourth lifting mechanism 80 does not operate the first chip. If the first chip fails the visual inspection, the fourth lifting mechanism 80 performs a material unloading operation on the first chip. The rotating motor 30 drives the first chip that passes the visual inspection to rotate to the bottom of the electrical performance test assembly. The electrical performance test assembly performs an electrical performance test on the first chip through a detection card. If the first chip and the detection card are connected to each other, it passes the electrical performance test. If they are not connected, it fails the electrical performance test. The rotating motor 30 drives the first chip to rotate to the bottom of the fifth lifting mechanism 90. The fifth lifting mechanism 90 operates the first chip based on the electrical performance test results. If the first chip passes the electrical performance test, the fifth lifting mechanism 90 does not operate on the first chip. If the first chip fails the electrical performance test, the fifth lifting mechanism 90 performs a material unloading operation on the first chip. The rotating motor 30 drives the first chip that has passed the visual inspection and electrical performance inspection to rotate to the bottom of the second lifting mechanism 61. The second lifting mechanism 61 unloads the first chip. Through the rotating motor 30, the turntable 40, the first CCD device and the electrical performance testing assembly of the present application, the detection of multi-station chips is realized, and after the chip is sucked by a chip suction head 41, the chip can be taken and tested without the need for a lowering operation, and the chips are classified based on the test results, which reduces the flow time between chip devices, improves chip production efficiency, reduces the equipment cost required for chip production, and saves installation space.

[0034] In addition, in one embodiment, referring to Figure 3 , also includes multiple solenoid valves 43 and multiple flow meters 44, multiple chip suction heads 41 are connected to the vacuum pump, each trigger device 42 is electrically connected to a solenoid valve 43 and a flow meter 44, the solenoid valve 43 is located between a chip suction head 41 and the vacuum pump, the flow meter 44 is located inside the chip suction head 41, the flow meter 44 is used to detect the gas flow of the chip suction head 41, and the multiple flow meters 44 are all communicatively connected to the controller.

[0035] It should be noted that one end of the chip suction head 41 is used to suck the chip, and the other end is connected to the vacuum pump through an air pipe. The vacuum pump works continuously, and the solenoid valve 43 is used to open and close the air pipe channel between the vacuum pump and the chip suction head 41.

[0036] It should be noted that the chip suction head 41 has not sucked the chip, the lifting mechanism abuts against the trigger device 42, the trigger device 42 generates an electrical signal and sends it to the solenoid valve 43 and the flow meter 44, the solenoid valve 43 and the flow meter 44 are turned on, and the vacuum pump draws air through the opened solenoid valve 43. The flow meter 44 detects the gas flow passing through the chip suction head 41. When the gas flow is lower than the preset threshold, the chip is sucked by the chip suction head 41 and forms a closed space, that is, the chip suction head 41 has completed chip loading; the chip suction head 41 has sucked the chip, the trigger device 42 generates an electrical signal and sends it to the solenoid valve 43 and the flow meter 44, the solenoid valve 43 and the flow meter 44 are closed, and the chip suction head 41 puts down the chip to realize chip unloading.

[0037] It should be noted that during the opening process of the solenoid valve 43, the flow meter 44 continuously monitors the gas flow. When the gas flow suddenly increases, that is, the chip falls off the chip suction head 41, the chip placement mechanism sounds an alarm, and the operator checks the chip placement equipment and the chip.

[0038] In addition, in one embodiment, referring to Figure 1 The unloading assembly 60 includes a second CCD device, and the shooting direction of the second CCD device is aligned below the second lifting mechanism 61.

[0039] It should be noted that the chip is placed on the chip fixture through the chip placement device to facilitate subsequent material collection and transportation. The second CCD device is used to perform positioning detection on the chip fixture. If the chip fixture is located at the specified position, the chip is unloaded into the chip fixture through the second lifting mechanism 61. If the chip fixture fails the positioning detection, the offset angle of the chip fixture is determined based on the image obtained by the second CCD device of the chip fixture, and sent to the external device, and the angle of the chip fixture is corrected by the external device.

[0040] It should be noted that those skilled in the art know how to obtain the angle of the chip fixture based on a visual device and correct the chip fixture based on the obtained angle. How to obtain the angle of the chip fixture based on a visual device and how to correct the chip fixture are prior arts, and this application does not make any improvements, so they will not be elaborated here.

[0041] In addition, an embodiment of the present invention provides a control method for a chip pick-and-place mechanism, which is applied to Figures 1 to 3 The chip placement mechanism of the embodiment shown in FIG. Figure 4 The method includes but is not limited to the following steps: S10, the controller sends a rotation signal to the rotary motor, and the rotary motor drives the turntable to rotate, so that the first chip suction head rotates to the bottom of the loading assembly, and the first chip is placed under the first chip suction head; S20, the controller controls the loading component to perform CCD detection on the first chip to obtain a first CCD detection result, and sends the first CCD detection result to the controller. After the controller controls the first chip suction head to suck the first chip, it sends a rotation signal to the rotating motor again; S30, when the first chip suction head rotates to the bottom of the fourth lifting mechanism, when the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the trigger device of the first chip suction head so that the first chip suction head puts down the first chip, or, when the first CCD detection result indicates that the CCD detection passes, controls the first chip suction head to rotate to the bottom of the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain a first electrical performance detection result, and sends the first electrical performance detection result to the controller; S40, the controller rotates the first chip suction head to the bottom of the fifth lifting mechanism. When the first electrical performance test result indicates that the electrical performance test fails, the controller controls the fifth lifting mechanism to trigger the trigger device of the first chip suction head to make the first chip suction head put down the first chip. Alternatively, when the first electrical performance test result indicates that the electrical performance test passes, the controller controls the first chip suction head to rotate to the bottom of the unloading component, and the unloading component completes the unloading of the first chip.

[0042] It should be noted that the chip pick-and-place mechanism is based on the technical principle of the rotary motor driving the chip through the turntable and the chip suction head to carry out material transfer and detection operations. Figures 1 to 3 The description of the illustrated embodiment will not be repeated here.

[0043] It should be noted that after receiving the rotation signal, the rotary motor rotates a preset angle so that the chip suction head that has completed chip loading moves toward the direction of the fourth lifting mechanism, and the first chip suction head rotates to the bottom of the loading assembly.

[0044] It should be noted that the first chip suction head rotates to the bottom of the loading assembly, the first chip is located under the first chip suction head, the controller sends a signal to the first CCD device, the first CCD device takes a picture of the first chip and acquires an image; after the first CCD device acquires the upper surface image of the first chip, the controller sends a signal to the first trigger device, the first trigger device sends an electrical signal to the first chip suction head, and the first chip suction head loads the first chip.

[0045] It should be noted that, because the workstations are arranged at equal intervals, after the controller sends a rotation signal to the rotary motor n times, n is an integer greater than or equal to 1 and less than the number of chip pick-and-place heads, that is, the rotary motor drives the turntable to rotate n times at a preset angle, and the first chip suction head rotates from the bottom of the loading component to the bottom of the fourth lifting mechanism, and the fourth lifting mechanism operates the first chip pick-and-place head based on the first CCD detection result. After the controller sends a rotation signal to the rotary motor m times, m is an integer greater than or equal to 1 and less than the number of chip pick-and-place heads, the first chip pick-and-place head rotates from the fourth lifting mechanism to the bottom of the electrical performance test component, and the electrical performance test component performs electrical performance detection on the first chip that passes the CCD detection based on the first CCD detection result.

[0046] It should be noted that after the controller sends a rotation signal to the rotating motor p times, the first chip pick-and-place head rotates from the bottom of the electrical performance test assembly to the bottom of the fifth lifting mechanism, and the fifth lifting mechanism operates the first chip pick-and-place head based on the first electrical performance test result. After the controller sends a rotation signal to the rotating motor q times, q is an integer greater than or equal to 1 and less than the number of chip pick-and-place heads, the first chip pick-and-place head rotates from the fifth lifting mechanism to the bottom of the second lifting mechanism, and the second lifting mechanism unloads the chips that have passed the CCD test and the electrical performance test.

[0047] In addition, in one embodiment, the plurality of chip suction heads further include a second chip suction head, and the second chip suction head is located behind the first chip suction head. After sending a rotation signal to the rotating motor again, step S20 specifically includes but is not limited to the following steps: S210, when the second chip suction head rotates to the bottom of the loading assembly, the second chip is placed under the second chip suction head; S220, the controller controls the loading component to perform CCD detection on the second chip to obtain a second CCD detection result; S230, when the second CCD detection result indicates that the CCD detection has passed and the second chip suction head is rotated to the bottom of the electrical performance detection component, a second electrical performance detection result of the second chip is determined based on the electrical performance detection component; S240, completing the cutting of the second chip based on the second electrical property detection result.

[0048] It should be noted that a plurality of chip suction heads are arranged on the turntable, and the chip suction heads are connected to the Figure 4 The first chip suction head of the illustrated embodiment performs the same operation.

[0049] It should be noted that the first chip suction head and the second chip suction head successively pass through the loading component, the fourth lifting mechanism, the electrical performance testing component, the fifth lifting mechanism and the unloading component. After the first chip suction head is located in a component and performs related operations, the second chip suction head enters under the component, and the component performs the same operation on the second chip suction head as the first chip suction head.

[0050] In addition, in one embodiment, after the first chip suction head rotates to the bottom of the fourth lifting mechanism, step S30 specifically includes but is not limited to the following steps: S310, the controller obtains a first queue, wherein the first queue at least stores a first CCD detection result and a second CCD detection result; S320, the controller obtains the first CCD detection result from the first queue, controls the fourth lifting mechanism based on the first CCD detection result, and removes the first CCD detection result from the first queue; S330, when the second chip suction head rotates to the bottom of the fourth lifting mechanism, the controller obtains the second CCD detection result from the first queue, controls the fourth lifting mechanism based on the second CCD detection result, and removes the second CCD detection result from the first queue.

[0051] It should be noted that the loading component sends the CCD detection results to the controller in the detection order, that is, the arrangement order of the chips, and the controller stores the CCD detection results in the first queue in sequence. The chips rotate to the bottom of the fourth lifting mechanism according to the arrangement order, that is, the controller obtains the CCD detection results in sequence according to the arrangement order of the chips, controls the fourth lifting mechanism based on the CCD detection results, and removes the CCD detection results.

[0052] In addition, in one embodiment, after the first chip suction head of the controller rotates to the bottom of the fifth lifting mechanism, step S30 specifically includes but is not limited to the following steps: S410, the controller obtains a second queue, wherein the second queue stores at least a first electrical performance detection result and a second electrical performance detection result; S420, the controller obtains the first electrical performance detection result from the second queue, controls the fifth lifting mechanism based on the first electrical performance detection result, and removes the first electrical performance detection result from the second queue; S430, when the second chip suction head rotates to the bottom of the fifth lifting mechanism, the second electrical property test result is obtained from the second queue, and the fifth lifting mechanism is controlled based on the second electrical property test result to remove the second electrical property test result from the second queue.

[0053] It should be noted that the electrical performance detection component sends the electrical performance detection results to the controller in the detection order, that is, the arrangement order of the chips, and the controller stores the electrical performance detection results in the second queue in sequence. The chips rotate to the bottom of the fifth lifting mechanism according to the arrangement order, that is, the controller obtains the electrical performance detection results in sequence according to the arrangement order of the chips, controls the fifth lifting mechanism based on the electrical performance detection results, and removes the electrical performance detection results.

[0054] In addition, in one embodiment, it also includes a plurality of solenoid valves and a plurality of flow meters, a plurality of chip suction heads are connected to the air pump, each trigger device is electrically connected to a solenoid valve and a flow meter, the solenoid valve is located between a chip suction head and the air pump, the flow meter is located inside the chip suction head, the plurality of flow meters are communicatively connected to the controller, the unloading assembly includes a second CCD device, and the shooting direction of the second CCD device is aligned below the second lifting mechanism; Step S40 specifically includes but is not limited to the following steps: controlling the first chip suction head to rotate to the bottom of the unloading assembly, and the unloading assembly completes unloading of the first chip, including: S510, the controller controls the first chip to rotate to the bottom of the blanking assembly, and places a first chip fixture under the first chip; S520, controlling the second CCD device to perform CCD detection on the first chip fixture to obtain a first CCD positioning result, and sending the first CCD positioning result to the controller; S530, when the first CCD positioning result indicates that the positioning detection of the first chip fixture has passed, the controller controls the second lifting mechanism to move downward so that the second lifting mechanism triggers the trigger device, the trigger device controls the solenoid valve and the flow meter to close, and the first chip suction head puts down the first chip.

[0055] It should be noted that this embodiment provides a material unloading step including a solenoid valve and a flow meter. Persons skilled in the art should be able to know the material loading step including a solenoid valve and a flow meter. The technical principle of material loading and unloading of the chip suction head based on the solenoid valve and the flow meter can refer to the above Figure 3 The description of the illustrated embodiment will not be repeated here.

[0056] It should be noted that the chip is loaded and unloaded together through the flow meter, solenoid valve and chip suction head. To facilitate the subsequent transfer operation of the chip, the chip is placed on a chip fixture with a fixed angle through the chip placement mechanism of the present application.

[0057] In addition, in order to better illustrate the technical solution of this embodiment, the following specific example is provided. The control method of the chip pick-and-place mechanism includes but is not limited to the following steps: S610, start the chip pick-and-place mechanism, the controller sends a rotation signal to the rotary motor, and the rotary motor rotates a preset angle to rotate the first chip suction head to the bottom of the loading assembly, and place the first chip under the first chip suction head; S620, the controller controls the loading assembly to perform CCD detection on the first chip to obtain a first CCD detection result, and sends the first CCD detection result to the controller. The controller stores the first CCD detection result in a first queue. The controller sends a signal to the first lifting mechanism, and the first lifting mechanism abuts against a trigger device located above the first chip pick-up and place head, so that the trigger device sends an electrical signal to start the solenoid valve and the flow meter, so that the first chip suction head sucks the first chip, and sends a rotation signal to the rotating motor again, so that the second chip suction head rotates to the bottom of the loading assembly, and the second chip is placed under the second chip suction head. The second chip suction head loads the second chip, and the loading assembly performs the same operation on the second chip as the first chip; S630, when the first chip suction head rotates to the bottom of the fourth lifting mechanism, the controller obtains the first CCD detection result from the first queue, and when the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the trigger device of the first chip suction head, so that the first chip suction head puts down the first chip, or, when the first CCD detection result indicates that the CCD detection passes, the first chip suction head is controlled to rotate to the bottom of the electrical performance detection component, the electrical performance detection component is controlled to perform electrical performance detection on the first chip to obtain a first electrical performance detection result, and the first electrical performance detection result is sent to the controller, the controller stores the first electrical performance detection result in the second queue, and sends a rotation signal to the rotating motor again, so that the second chip suction head rotates to the bottom of the electrical performance detection component; S640, the controller rotates the first chip suction head to the bottom of the fifth lifting mechanism. When the first electrical performance test result indicates that the electrical performance test fails, the controller controls the fifth lifting mechanism to trigger the trigger device of the first chip suction head to make the first chip suction head put down the first chip. Alternatively, when the first electrical performance test result indicates that the electrical performance test passes, the controller controls the first chip suction head to rotate to the bottom of the unloading component. The unloading component completes the unloading of the first chip. After the unloading is completed, the controller sends a rotation signal to the rotating motor to rotate the second chip suction head to the bottom of the unloading component.

[0058] like Figure 5 As shown, Figure 5 : is a structural diagram of a control device for a chip pick-and-place mechanism provided by an embodiment of the present invention. The present invention also provides a control device for a chip pick-and-place mechanism, comprising: The processor 701 may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory 702 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 702 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 702, and the processor 701 calls and executes the control method of the chip pick-and-place mechanism of the embodiment of this application; Input / output interface 703, used to implement information input and output; Communication interface 704, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.); A bus 705 that transmits information between various components of the device (e.g., the processor 701, the memory 702, the input / output interface 703, and the communication interface 704); The processor 701 , the memory 702 , the input / output interface 703 and the communication interface 704 are connected to each other in communication within the device via a bus 705 .

[0059] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the control method of the chip placement mechanism is implemented.

[0060] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0061] It will be appreciated by those skilled in the art that all or some of the steps and systems in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0062] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A chip pick-and-place mechanism, characterized in that: include: A supporting frame, wherein a top plate is disposed on an upper side of the supporting frame; A rotating motor and a turntable, wherein the rotating motor is fixed to the top plate, the turntable is connected to the rotating motor, the rotating motor is used to drive the turntable to rotate, a plurality of chip suction heads with equal spacing are arranged on the outer edge of the turntable, a trigger device is arranged above the chip suction head, and the trigger device is electrically connected to the chip suction head; A loading assembly and a unloading assembly, wherein the loading assembly and the unloading assembly are fixed to the support frame and are located above the chip suction head, the loading assembly comprises a first lifting mechanism and a first CCD device, the shooting direction of the first CCD device is aligned below the first lifting mechanism, and the unloading assembly comprises a second lifting mechanism, and the first lifting mechanism and the second lifting mechanism can be lowered and abut against the trigger device; An electrical performance detection component, the electrical performance detection component is fixed to the top plate and is located between the loading component and the unloading component. The electrical performance detection component includes a third lifting mechanism and a detection card. The detection card is located at the lower end of the third lifting mechanism. Under the drive of the third lifting mechanism, the detection card moves in a vertical direction. A fourth lifting mechanism and a fifth lifting mechanism, the top ends of the fourth lifting mechanism and the fifth lifting mechanism are both fixed to the top plate, the fourth lifting mechanism is arranged between the loading assembly and the electrical performance detection assembly, and the fifth lifting mechanism is arranged between the electrical performance detection assembly and the unloading assembly; A controller is communicatively connected to the rotating motor, the trigger device, the loading assembly, the unloading assembly, the electrical property detection assembly, the fourth lifting mechanism and the fifth lifting mechanism.

2. The chip pick-and-place mechanism according to claim 1, characterized in that: It also includes multiple solenoid valves and multiple flow meters. The multiple chip suction heads are all connected to the vacuum pump. Each of the trigger devices is electrically connected to one solenoid valve and one flow meter. The solenoid valve is located between one chip suction head and the vacuum pump. The flow meter is located inside the chip suction head. The flow meter is used to detect the gas flow of the chip suction head. The multiple flow meters are all communicatively connected to the controller.

3. The chip pick-and-place mechanism according to claim 1, characterized in that: The material unloading assembly includes a second CCD device, and the shooting direction of the second CCD device is aligned below the second lifting mechanism.

4. A control method for a chip pick-and-place mechanism, characterized in that: The chip pick-and-place mechanism according to any one of claims 1 to 3, wherein the plurality of chip suction heads include at least a first chip suction head, and the method comprises: The controller sends a rotation signal to the rotary motor, and the rotary motor drives the turntable to rotate, so that the first chip suction head rotates to the bottom of the loading assembly, and the first chip is placed under the first chip suction head; The controller controls the loading component to perform CCD detection on the first chip to obtain a first CCD detection result, and sends the first CCD detection result to the controller. After the controller controls the first chip suction head to suck the first chip, the controller sends the rotation signal to the rotating motor again; When the first chip suction head rotates to the bottom of the fourth lifting mechanism, when the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the trigger device of the first chip suction head, so that the first chip suction head puts down the first chip, or, when the first CCD detection result indicates that the CCD detection passes, controls the first chip suction head to rotate to the bottom of the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain a first electrical performance detection result, and sends the first electrical performance detection result to the controller; The controller rotates the first chip suction head to the bottom of the fifth lifting mechanism. When the first electrical property test result indicates that the electrical property test fails, the controller controls the fifth lifting mechanism to trigger the trigger device of the first chip suction head so that the first chip suction head puts down the first chip. Alternatively, when the first electrical property test result indicates that the electrical property test passes, the controller controls the first chip suction head to rotate to the bottom of the unloading component, and the unloading component completes the unloading of the first chip.

5. The control method of the chip pick-and-place mechanism according to claim 4, characterized in that: The plurality of chip suction heads further include a second chip suction head, and the second chip suction head is located behind the first chip suction head. After the rotation signal is sent to the rotating motor again, the method further includes: When the second chip suction head rotates to the bottom of the loading assembly, a second chip is placed under the second chip suction head; The controller controls the loading component to perform CCD detection on the second chip to obtain a second CCD detection result; When the second CCD detection result indicates that the CCD detection has passed and the second chip suction head rotates to the bottom of the electrical property detection component, a second electrical property detection result of the second chip is determined based on the electrical property detection component; The second chip is cut based on the second electrical property test result.

6. The control method of the chip pick-and-place mechanism according to claim 5, characterized in that: After the first chip suction head rotates to the bottom of the fourth lifting mechanism, the method further includes: The controller acquires a first queue, wherein the first queue at least stores the first CCD detection result and the second CCD detection result; The controller obtains the first CCD detection result from the first queue, controls the fourth lifting mechanism based on the first CCD detection result, and removes the first CCD detection result from the first queue; When the second chip suction head rotates to the bottom of the fourth lifting mechanism, the controller obtains the second CCD detection result from the first queue, controls the fourth lifting mechanism based on the second CCD detection result, and removes the second CCD detection result from the first queue.

7. The control method of the chip pick-and-place mechanism according to claim 6, characterized in that: After the controller rotates the first chip suction head to below the fifth lifting mechanism, the method further includes: The controller acquires a second queue, wherein the second queue at least stores the first electrical property detection result and the second electrical property detection result; The controller obtains the first electrical property detection result from the second queue, controls the fifth lifting mechanism based on the first electrical property detection result, and removes the first electrical property detection result from the second queue; When the second chip suction head rotates to the bottom of the fifth lifting mechanism, the second electrical property test result is obtained from the second queue, and the fifth lifting mechanism is controlled based on the second electrical property test result to remove the second electrical property test result from the second queue.

8. The control method of the chip pick-and-place mechanism according to claim 4, characterized in that: It also includes a plurality of solenoid valves and a plurality of flow meters, wherein the plurality of chip suction heads are all connected to the air pump, each of the trigger devices is electrically connected to one of the solenoid valves and one of the flow meters, the solenoid valve is located between one of the chip suction heads and the air pump, the flow meter is located inside the chip suction head, and the plurality of flow meters are all communicatively connected to the controller, and the unloading assembly includes a second CCD device, and the shooting direction of the second CCD device is aligned below the second lifting mechanism; Controlling the first chip suction head to rotate to the bottom of the unloading assembly, and the unloading assembly completes unloading of the first chip, including: The controller controls the first chip to rotate to the bottom of the blanking assembly, and places a first chip fixture under the first chip; Controlling the second CCD device to perform CCD detection on the first chip fixture to obtain a first CCD positioning result, and sending the first CCD positioning result to the controller; When the first CCD positioning result indicates that the positioning detection of the first chip fixture has passed, the controller controls the second lifting mechanism to move downward so that the second lifting mechanism triggers the trigger device, the trigger device controls the solenoid valve and the flow meter to close, and the first chip suction head puts down the first chip.

9. A control device for a chip pick-and-place mechanism, characterized in that: It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the control method of the chip placement mechanism as described in any one of claims 5 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the control method of the chip pick-and-place mechanism according to any one of claims 5 to 8.

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