Automatic glue sealing machine for semiconductor chip

Abstract

The invention relates to the technical field of semiconductors, in particular to an automatic glue sealing machine for a semiconductor chip, and provides the automatic glue sealing machine for the semiconductor chip aiming at solving the problems that the existing semiconductor chip edge sealing equipment cannot be matched with a production line for use and the production efficiency is low. When the cylindrical cam rotates, a structure that the positioning plate moves upwards and then the clamping plate moves inwards can be formed. A second circular ring capable of rotating is further arranged at the upper end of the operation table, a rubberizing mechanism is arranged at the upper end of the second circular ring, a pressing wheel matched with the film is further arranged on the first driving plate, and when the second circular ring rotates, a structure that the second driving plate moves towards the inner side to enable the pressing wheel to extrude the film to make contact with the side end face of the semiconductor chip can be formed. When the second circular ring continuously rotates, a structure that the film is uniformly glued along the four side end surfaces of the semiconductor chip can be formed; the semiconductor chip edge banding machine can carry out edge banding operation on a semiconductor chip on a production line, replaces manual operation, reduces cost and improves productivity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an automatic glue sealing machine for semiconductor chips. Background Art

[0002] Semiconductor thermoelectric chips are devices that can realize the mutual conversion of thermal energy and electrical energy based on the thermoelectric effect. They are widely used in temperature control, thermal management and waste heat recovery. For example, thermoelectric coolers are often used in small electronic devices, portable cooling systems, medical equipment, etc.; while thermoelectric generators are used in energy recovery systems, automobiles, aerospace and other high-efficiency fields. Semiconductor thermoelectric chips have been widely used in many modern technologies due to their compact structure, no moving parts, no pollution and high reliability. However, thermoelectric chips face more stringent problems such as thermal expansion, material thermal conductivity, and environmental impact during operation. Especially in the thermal management and electrical connection of the edge, the choice of edge sealing technology is crucial. The edges of thermoelectric chips are generally fragile and easily affected by the external environment (such as moisture, corrosion, etc.), and edge sealing treatment is required. At present, when sealing the edges of semiconductor chips, it is usually done manually with semi-automatic equipment, which cannot be used in combination with production lines, thereby reducing production efficiency; for this purpose, a semiconductor chip automatic sealing machine is designed to solve the above-mentioned problems; for this purpose, a semiconductor chip automatic sealing machine is designed to solve the above-mentioned problems. Summary of the invention

[0003] In view of the fact that current semiconductor chip edge sealing equipment cannot be used in conjunction with a production line and has low production efficiency, the present invention provides an automatic semiconductor chip sealing machine that can perform edge sealing operations on semiconductor chips on a production line, thereby replacing manual operations, reducing costs, and improving productivity, effectively solving the problems mentioned in the above background technology.

[0004] In order to solve the above problems, the technical solution adopted by the present invention is: A semiconductor chip automatic glue sealing machine comprises an operating table, wherein a conveying rack is provided at the upper end of the operating table, semiconductor chips are placed on the conveying rack, a positioning plate is provided in the middle of the conveying rack, a plurality of clamping plates matching with the semiconductor chips are provided on the positioning plate, a rotatable cylindrical cam is also provided on the operating table, and when the cylindrical cam rotates, a structure is formed in which the clamping plates move inward after the positioning plate moves upward; a rotatable second ring is also provided at the upper end of the operating table, a glue sticking mechanism is provided at the upper end of the second ring, the glue sticking mechanism comprises a first driving plate, a film is provided on the first driving plate, and a pressure wheel matching with the film is also provided on the first driving plate, when the second ring rotates, a structure is formed in which the second driving plate moves inward so that the pressure wheel squeezes the film to contact the side end face of the semiconductor chip, and when the second ring continues to rotate, a structure is formed in which the film is evenly glued along the four side end faces of the semiconductor chip.

[0005] The lower end surface of the operating table is fixedly connected to a first motor, the cylindrical cam is fixedly connected to the output end of the first motor, the upper end surface of the operating table is fixedly connected to a telescopic rod, the upper end of the telescopic rod is fixedly connected to a support plate, the positioning plate is fixedly connected to the upper end of the support plate, and the left end surface of the support plate is fixedly connected to a long pin that matches the cylindrical cam.

[0006] The lower end surface of the positioning plate is rotatably connected to a first disc, and four evenly distributed first connecting rods are hinged at non-center points on the lower end surface of the first disc. The clamping plates are respectively slidably connected to the inner wall of the positioning plate, and the outer ends of the first connecting rods are respectively hinged to the corresponding clamping plates.

[0007] A first spur gear is coaxially fixed to the lower end of the first disc, a first spur rack slidably connected to the support plate is meshed on the outer surface of the first spur gear, a first sliding pin is fixed to the inner wall of the right end of the first spur rack, a first guide plate is fixed to the upper surface of the operating table, and an inner vertical groove, a first inclined groove and an outer vertical groove matching the first sliding pin are provided on the first guide plate.

[0008] The upper end of the operating table is also fixedly connected to a first circular ring, the second circular ring is rotatably connected to the upper end surface of the first circular ring, the first driving plate is slidably connected to the upper end surface of the second circular ring, the lower end surface of the first driving plate is fixedly connected to a driving pin, and the upper end surface of the first circular ring is provided with a V-shaped groove and a circular ring groove matching the driving pin.

[0009] The film is detachably mounted on the first driving plate, the inner wall of the first driving plate is slidably connected to an extension plate, both sides of the inner wall at the bottom end of the first driving plate are respectively fixed with first springs that match the extension plate, the pressure wheel is rotatably connected to the extension plate, and a plurality of adsorption holes are provided on the outer surface of the pressure wheel.

[0010] The front and rear end surfaces of the extension plate are respectively fixed with L-shaped support rods, the inner end surfaces of the two L-shaped support rods are fixed with a vertical plate, an L-shaped connecting rod that can move up and down is slidably connected to the vertical plate, and a blade is fixed to the lower end of the L-shaped connecting rod.

[0011] A U-shaped frame is fixedly connected to the upper end surface of the first circular ring, a U-shaped seat is fixedly connected to the inner wall at the top end of the U-shaped frame, a second driving plate is slidably connected to the inner wall of the U-shaped seat, two second springs matching with the second driving plate are also fixedly connected to the inner wall at the top end of the U-shaped frame, the L-shaped connecting rod is slidably connected to the inner wall of the second driving plate, second sliding pins are respectively fixedly connected to the front and rear end surfaces of the second driving plate, second guide plates are respectively fixedly connected to the front and rear sides of the upper end surface of the first driving plate, and the second guide plate is respectively provided with inclined surfaces and transverse surfaces matching with the second sliding pins.

[0012] An incomplete spur gear is coaxially fixed to the lower end of the cylindrical cam, a small idler wheel matching the incomplete spur gear is rotatably connected to the upper surface of the operating table, a large idler wheel is coaxially fixed to the upper end of the small idler wheel, and a gear ring meshing with the large idler wheel is fixed to the outer surface of the second ring.

[0013] A convex locking wheel is coaxially fixedly connected to the upper end of the incomplete spur gear, and a concave locking wheel matched with the convex locking wheel is coaxially fixedly connected to the upper end of the small idler wheel.

[0014] The present invention has a novel and ingenious structure and has the following advantages compared with the prior art: When in use, when the roller rotates, it can drive the semiconductor chip to move, thereby conveying the semiconductor chip to a specified position; when the semiconductor chip reaches the specified position, that is, reaches the position directly above the positioning plate, by setting a rotatable cylindrical cam, the positioning plate can be driven to move upward, and when the positioning plate moves upward, the semiconductor chip can be lifted up and moved upward, and when the positioning plate and the semiconductor chip move upward to the specified position, the corresponding clamping plate can move inward to clamp and fix the semiconductor chip, so that the semiconductor chip is calibrated and fixed in the middle position of the positioning plate, and when the positioning plate moves upward to the specified position, the semiconductor chip can be moved to the center of the second ring, that is, when the glue sticking mechanism is working, the four side ends of the semiconductor chip can be fixed. The second ring is used for gluing the chip; when the second ring rotates, the ... BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a first isometric view of an automatic semiconductor chip sealing machine of the present invention.

[0016] Figure 2 This is a second isometric view of an automatic semiconductor chip sealing machine of the present invention.

[0017] Figure 3 The present invention is a schematic diagram of the structure of a conveyor frame of an automatic semiconductor chip sealing machine.

[0018] Figure 4 The present invention is a schematic diagram of the installation of a cylindrical cam of an automatic semiconductor chip sealing machine.

[0019] Figure 5 The present invention is a schematic diagram of the installation of a first guide plate of an automatic semiconductor chip sealing machine.

[0020] Figure 6The present invention is a schematic diagram of the installation of a first connecting rod of an automatic semiconductor chip sealing machine.

[0021] Figure 7 The figure is a schematic diagram of the installation of the second ring of the automatic semiconductor chip sealing machine of the present invention.

[0022] Figure 8 The present invention is a schematic diagram of the installation of a cam lock wheel of an automatic semiconductor chip sealing machine.

[0023] Fig. 9 The present invention is a schematic diagram of the installation of an incomplete spur gear of an automatic semiconductor chip sealing machine.

[0024] Fig.10 The first circular ring structure schematic diagram of an automatic semiconductor chip sealing machine of the present invention.

[0025] Fig.11 The present invention is a schematic diagram of the installation of a driving pin of an automatic semiconductor chip sealing machine.

[0026] Fig.12 The present invention is a schematic diagram of the structure of a gluing mechanism of an automatic gluing machine for semiconductor chips.

[0027] Fig.13 The present invention is a schematic diagram of the installation of a pressure wheel of an automatic semiconductor chip sealing machine.

[0028] Fig.14 The present invention is a cross-sectional view of a first driving board of an automatic semiconductor chip sealing machine.

[0029] Fig.15 The figure is a schematic diagram of the installation of an L-shaped connecting rod of an automatic semiconductor chip sealing machine according to the present invention.

[0030] Fig.16 The present invention is a schematic diagram of the installation of a vertical plate of an automatic semiconductor chip sealing machine.

[0031] Fig.17 The present invention is a cross-sectional view of a second driving board of an automatic semiconductor chip sealing machine.

[0032] Numbers in the figure: 1-operating table, 2-supporting leg, 3-first motor, 4-cylindrical cam, 5-long pin, 6-telescopic rod, 7-support plate, 8-first spur gear, 9-first spur rack, 10-first guide rod, 11-first sliding pin, 12-first guide plate, 13-inner vertical groove, 14-first inclined groove, 15-outer vertical groove, 16-transmission frame, 17-roller, 18-first disc, 19-first connecting rod, 20-positioning plate, 21-clamp, 22-convex locking wheel, 23-concave locking wheel, 24-incomplete spur gear, 25-small idler wheel, 26-large idler wheel, 27-gear ring, 28-first circular ring, 29-second circular ring, 30-V-shaped groove, 31-circular groove, 32-driving pin, 33-first driving plate, 34-extension plate, 35-anti-slip plate, 36-first spring, 37-adhesive tape, 38-pressure wheel, 39-adsorption hole, 40-U-shaped frame, 41-second sliding pin, 42-second guide plate, 43-inclined surface, 44-transverse surface, 45-U-shaped seat, 46-second spring, 47-second driving plate, 48-L-shaped connecting rod, 49-blade, 50-vertical plate, 51-L-shaped support rod, 52-second guide rod. DETAILED DESCRIPTION

[0033] The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described in conjunction with the accompanying drawings, but the present invention is not limited to these embodiments.

[0034] like Figure 1-Figure 17 As shown, the present invention provides an automatic glue sealing machine for semiconductor chips, comprising an operating table 1, wherein a conveying frame 16 is provided at the upper end of the operating table 1, and semiconductor chips are placed on the conveying frame 16, a positioning plate 20 is provided in the middle of the conveying frame 16, and a plurality of clamping plates 21 matching with the semiconductor chips are provided on the positioning plate 20, and a rotatable cylindrical cam 4 is also provided on the operating table 1, and when the cylindrical cam 4 rotates, a structure can be formed in which the clamping plates 21 move inward after the positioning plate 20 moves upward; a rotatable second ring 29 is also provided at the upper end of the operating table 1, and a glue sticking mechanism is provided at the upper end of the second ring 29, and the glue sticking mechanism comprises a first driving plate 33, and a film is provided on the first driving plate 33, and a pressure wheel 38 matching with the film is also provided on the first driving plate 33, and when the second ring 29 rotates, a structure can be formed in which the second driving plate 47 moves inward so that the pressure wheel 38 squeezes the film to contact the side end face of the semiconductor chip, and when the second ring 29 continues to rotate, a structure can be formed in which the film is evenly glued along the four side end faces of the semiconductor chip.

[0035] like Figure 1-Figure 7 , Fig.13As shown, a plurality of supporting legs 2 are fixedly connected to the lower end surface of the operating table 1, and the operating table 1 and the supporting legs 2 are used to support the entire device; a plurality of rotatable rollers 17 are provided at the inner end of the conveying frame 16, and the semiconductor chip is placed on the rollers 17. When the rollers 17 rotate, the semiconductor chip can be driven to move, thereby conveying the semiconductor chip to the specified position; when the semiconductor chip reaches the specified position, that is, when it reaches the position directly above the positioning plate 20, the positioning plate 20 can be driven to move upward by setting a rotatable cylindrical cam 4, and the positioning plate 20 can be lifted up and moved upward when the positioning plate 20 moves upward. When the positioning plate 20 and the semiconductor chip move upward to the specified position, the corresponding clamping plate 21 can move inward to clamp and fix the semiconductor chip, so that the semiconductor chip is calibrated and fixed in the middle of the positioning plate 20, and the positioning plate 2 0 moves upward to the specified position, the semiconductor chip can be moved to the center of the second ring 29, that is, the four side end faces of the semiconductor chip can be glued when the glue sticking mechanism is working; through the cooperation of the set glue sticking mechanism, namely the second driving plate 47, the pressure wheel 38, the film and other components, when the second ring 29 rotates, the second driving plate 47, the pressure wheel 38, the film and the like can be moved inward synchronously, when the pressure wheel 38 and the film move inward to the specified position, the pressure wheel 38 can squeeze the film so that the film contacts the outer end face of the semiconductor chip, when the second ring 29 continues to rotate, it can drive the glue sticking mechanism to move in a circle, so that the film is glued along the four end faces of the semiconductor chip, and under the pressure of the pressure wheel 38, the film can be squeezed during gluing, so that the film fits more closely to the outer surface of the semiconductor chip.

[0036] The lower end surface of the operating platform 1 is fixedly connected to the first motor 3, the cylindrical cam 4 is fixedly connected to the output end of the first motor 3, the upper end surface of the operating platform 1 is fixedly connected to the telescopic rod 6, the upper end of the telescopic rod 6 is fixedly connected to the support plate 7, the positioning plate 20 is fixedly connected to the upper end of the support plate 7, and the left end surface of the support plate 7 is fixedly connected to a long pin 5 that cooperates with the cylindrical cam 4.

[0037] like Figure 4-Figure 5As shown, the function of the first motor 3 is to provide a rotating force for the cylindrical cam 4. The motor is a prior art and will not be described in detail. The telescopic rod 6 can limit the support plate 7, and the long pin 5 can only move up and down. The four end corners of the upper end surface of the support plate 7 are respectively fixed with first guide rods 10, and the positioning plate 20 is fixed to the upper end surface of the four first guide rods 10, which is equivalent to the positioning plate 20 being fixed to the upper end surface of the support plate 7. When the support plate 7 moves up and down, the positioning plate 20 can be driven to move up and down. It will not be described in detail. Through the engagement of the cylindrical cam 4 and the long pin 5, when the cylindrical cam 4 rotates, it can drive the long pin 5 to move up and down. It moves up and down intermittently, that is, when the cylindrical cam 4 rotates, it can drive the long pin 5, the support plate 7, and the positioning plate 20 to move upward to the top and then stop intermittently, at which time it can provide working time for the gluing mechanism, that is, the gluing mechanism starts working to perform gluing on the semiconductor chip. When the cylindrical cam 4 continues to rotate, it can make the long pin 5, the support plate 7, and the positioning plate 20 move downward to the bottom and stop intermittently, so that the semiconductor chip after gluing and sealing can be placed on the conveying rack 16 and continued to be transported forward, and it will wait for the next semiconductor chip with glue to arrive at the position directly above the positioning plate 20.

[0038] The lower end surface of the positioning plate 20 is rotatably connected to the first disk 18, and four evenly distributed first connecting rods 19 are hinged at the non-center of the lower end surface of the first disk 18. The clamping plates 21 are respectively slidably connected to the inner wall of the positioning plate 20, and the outer ends of the first connecting rods 19 are respectively hinged to the corresponding clamping plates 21.

[0039] like Figure 5-Figure 6 As shown, a rotating shaft is fixedly connected to the inner wall at the center of the first disk 18, and the rotating shaft is rotatably connected to the positioning plate 20. The rotating shaft limits the first disk 18 to rotate only at the lower end of the positioning plate 20; the clamping plates 21 are respectively slidably connected to the front, back, left and right inner walls of the positioning plate 20, so that the four clamping plates 21 can move inward or outward. When the first disk 18 rotates, it can drive the inner ends of the four first connecting rods 19 to move circumferentially, and the outer ends of the first connecting rods 19 will drive the corresponding clamping plates 21 to move inward, so that the clamping plates 21 move inward to clamp and fix the semiconductor chip after calibration. When the first disk 18 rotates in the opposite direction to reset, the first connecting rod 19 can drive the corresponding clamping plates 21 to move outward, and the clamping plates 21 no longer clamp and fix the semiconductor chip when they move outward.

[0040] A first spur gear 8 is coaxially fixed to the lower end of the first disc 18, a first spur rack 9 slidably connected to the support plate 7 is meshed on the outer surface of the first spur gear 8, a first sliding pin 11 is fixed to the inner wall of the right end of the first spur rack 9, a first guide plate 12 is fixed to the upper end surface of the operating table 1, and an inner vertical groove 13, a first inclined groove 14 and an outer vertical groove 15 matching the first sliding pin 11 are formed on the first guide plate 12.

[0041] like Figure 5As shown, a rotating shaft is fixedly connected to the inner wall of the center of the first spur gear 8 and the first disc 18, and the rotating shaft is rotatably connected to the inner wall of the support plate 7. The first spur rack 9 can be slidably connected to the upper end surface of the support plate 7. When the first spur rack 9 moves left and right, it can drive the first spur gear 8 and the first disc 18 to rotate. When the first disc 18 rotates, it can drive the clamping plate 21 to move inward or outward; the first sliding pin 11, the first guide plate 12, the inner vertical groove 13, the first inclined groove 14, and the outer vertical groove 15 are installed and shaped as shown in FIG. Figure 5 As shown, when the support plate 7, the first straight rack 9, and the first sliding pin 11 move upward, the first sliding pin 11 moves upward and meshes with the inner vertical groove 13, so that the first sliding pin 11 can be at the innermost end and move vertically upward, that is, the corresponding first straight rack 9 will follow the support plate 7 to move vertically upward, and the first straight rack 9 will not move to the left or backward, that is, the clamping plate 21 moves upward in an open state, and when the support plate 7, the first straight rack 9, and the first sliding pin 11 continue to move upward, the first sliding pin 11 can enter the inner wall of the first inclined groove 14. , the first sliding pin 11 can move upward and rightward at the same time under the meshing of the first inclined groove 14, and when the first sliding pin 11 moves to the right, it can drive the first spur rack 9 to move to the right, and when the first spur rack 9 moves to the right, it can drive the first spur gear 8 and the first disc 18 to rotate, that is, drive the clamping plate 21 to move inward, when the support plate 7, the first spur rack 9, the first sliding pin 11, etc. continue to move upward, the first sliding pin 11 can enter the inner wall of the outer vertical groove 15, and the first sliding pin 11 can move upward and rightward at the same time under the meshing of the first inclined groove 14. 1. The first straight rack 9 is at the outermost end and moves vertically upward, that is, the clamping plate 21 moves vertically upward in the clamping state; through the engagement of the first sliding pin 11 with the inner vertical groove 13, the first inclined groove 14, and the outer vertical groove 15, when the support plate 7 moves upward from the bottom, the clamping plate 21 will not clamp at this time. When the support plate 7 moves upward to the specified position, that is, after the support plate 7 holds up the semiconductor chip, the first sliding pin 11 enters the inner wall of the first inclined groove 14, and the corresponding clamping plate 21 will move upward with the support plate 7 and move inward again, clamping When the plate 21 moves inward, it can clamp and fix the semiconductor chip. When the support plate 7 continues to move upward, that is, when the first sliding pin 11 enters the inner wall of the outer vertical groove 15, the clamping plate 21 can be moved to the innermost end. At this time, the clamping plate 21 can clamp and fix the semiconductor chip, that is, it can move the support plate 7 and the semiconductor chip upward to the top position and clamp and fix the semiconductor chip, which is convenient for gluing. Similarly, when the support plate 7 moves downward to reset, the clamping plate 21 can move outward to reset. The principle is the same and will not be repeated here.

[0042] The upper end of the operating table 1 is also fixedly connected to a first circular ring 28, a second circular ring 29 is rotatably connected to the upper end surface of the first circular ring 28, the first driving plate 33 is slidably connected to the upper end surface of the second circular ring 29, a driving pin 32 is fixedly connected to the lower end surface of the first driving plate 33, and the upper end surface of the first circular ring 28 is provided with a V-shaped groove 30 and a circular groove 31 which match the driving pin 32.

[0043] like Figure 7-Figure 11 As shown, four second guide rods 52 are fixedly connected to the upper end surface of the operating table 1, and the first ring 28 is fixedly connected to the upper end surface of the second guide rod 52, which is equivalent to the first ring 28 being fixedly connected to the upper end of the operating table 1. The first ring 28 supports and limits the second ring 29, so that the second ring 29 can only rotate on the first ring 28; the first driving plate 33 can be slidably connected to the upper end surface of the second ring 29, that is, the glue mechanism and the first driving plate 33 can move inward or outward, and a key-shaped hole is opened on the upper end surface of the second ring 29, and the driving pin 32 is installed in the key-shaped hole, that is, the driving pin 32 can move left and right on the second ring 29; the installation and shape of the driving pin 32, the V-shaped groove 30, and the annular groove 31 are as shown in Fig.16 As shown, when the second ring 29 rotates, it can drive the first driving plate 33, the driving pin 32 and the like to move in a circular motion. When the driving pin 32 moves in a circular motion, it will engage with the V-shaped groove 30, which will cause the driving pin 32 to move inward. When the driving pin 32 moves inward, it can drive the first driving plate 33 to move inward. When the driving pin 32 moves inward and enters the inner wall of the annular groove 31, the driving pin 32 and the first driving plate 33 will move inward to the top position, and under the engagement of the driving pin 32 and the annular groove 31, the first driving plate 33 can move stably in a circular motion at the innermost end. When the second ring 29 continues to rotate to cause the driving pin 32 to enter the inner wall of the V-shaped groove 30, the driving pin 32 will move outward to the top position under the engagement of the V-shaped groove 30, that is, the corresponding first driving plate 33 and the glue-applying mechanism move outward to the top position.

[0044] The film is detachably mounted on the first driving plate 33, and an extension plate 34 is slidably connected to the inner wall of the first driving plate 33. First springs 36 matching the extension plate 34 are fixedly connected on both sides of the inner wall at the bottom end of the first driving plate 33. The pressure wheel 38 is rotatably connected to the extension plate 34, and a plurality of adsorption holes 39 are provided on the outer surface of the pressure wheel 38.

[0045] like Figure 13-14As shown, the upper end surface of the first driving plate 33 is rotatably connected with a sleeve shaft, and the film is sleeved on the sleeve shaft. The film and the sleeve shaft are in an interference fit, so that the film can rotate on the first driving plate 33 and can be disassembled and replaced; an anti-slip plate 35 is fixedly connected to the end surface of one side of the extension plate 34, and the anti-slip plate 35 can be slidably connected to the inner wall of the first driving plate 33 to the left and right. The anti-slip plate 35 can prevent the extension plate 34 from being separated from the first driving plate 33, and the first spring 36 always has an inner thrust on the anti-slip plate 35 and the extension plate 34 , so that the extension plate 34 is in an extended state under normal conditions, even if the pressure wheel 38 is at the innermost end under normal conditions, a rotating shaft is fixedly connected to the inner wall of the center of the pressure wheel 38, and the rotating shaft is rotatably connected to the inner wall of the extension plate 34. The limiting pressure wheel 38 can only rotate on the extension plate 34, and the interior of the rotating shaft is hollow and communicated with the adsorption hole 39. The lower end of the rotating shaft is connected to a negative pressure device, which is communicated with the adsorption hole 39 through the negative pressure device. When the negative pressure device is working, the adsorption hole 39 can have a suction force, and after the adsorption hole 39 has suction, it can The adhesive tape 37 is adsorbed and fixed. Under normal circumstances, the adhesive tape 37 can be adsorbed and fixed on the outer surface of the pressure wheel 38. The negative pressure device is a prior art and will not be described in detail. When the first driving plate 33 moves inward, it can drive the extension plate 34, the pressure wheel 38, the adhesive tape 37, etc. to move inward synchronously. When the pressure wheel 38 moves inward and contacts the side end surface of the semiconductor chip, the pressure wheel 38 can squeeze the adhesive tape 37 and make the adhesive tape 37 stick to the side end surface of the semiconductor chip. When the second ring 29 moves in a circular motion, it can drive the extension plate 34, the pressure wheel 38, the adhesive tape 37, etc. to move inward synchronously. The first driving plate 33, the pressure wheel 38 and the adhesive tape 37 are moved in a circle. When the pressure wheel 38 moves in a circle, the pressure wheel 38 can move along the side end surface of the semiconductor chip under the extrusion thrust of the first spring 36, and the pressure wheel 38 can also rotate under the friction force of the extrusion. When the pressure wheel 38 rotates and moves in a circle, the adhesive tape 37 can be attached to the side end surface of the semiconductor chip. When the second ring 29 rotates one circle, the adhesive tape 37 can be attached along the semiconductor chip for one circle, thereby performing edge sealing on the semiconductor chip.

[0046] The front and rear end surfaces of the extension plate 34 are respectively fixedly connected with L-shaped support rods 51, and the inner end surfaces of the two L-shaped support rods 51 are fixedly connected with a vertical plate 50. The vertical plate 50 is slidably connected with an L-shaped connecting rod 48 that can move up and down, and the lower end of the L-shaped connecting rod 48 is fixedly connected with a blade 49.

[0047] like Figure 15-16As shown, the L-shaped connecting rod 48 can be slidably connected to the inner wall of the vertical plate 50 up and down, and the L-shaped support rod 51 can support and limit the vertical plate 50 and the L-shaped connecting rod 48. The L-shaped connecting rod 48 can be slidably connected to the inner wall of the vertical plate 50 up and down. By setting the L-shaped connecting rod 48 and the blade 49, when the L-shaped connecting rod 48 moves downward, the blade 49 can be driven to move downward. When the blade 49 moves downward, the tape 37 can be cut, that is, after the tape 37 is glued to the four end surfaces of the semiconductor chip, the blade 49 Moving downward can cut the tape 37, thus completing the edge sealing of the semiconductor chip; the L-shaped support rod 51 and the vertical plate 50 are fixed to the extension plate 34. When the extension plate 34 moves inward or outward, the corresponding L-shaped support rod 51, the vertical plate 50, the L-shaped connecting rod 48, and the blade 49 can be driven to move inward or outward synchronously, that is, the blade 49 can always be on one side of the pressure wheel 38 and maintain a relative position with the pressure wheel 38, that is, the tape 37 can be cut when the blade 49 moves downward.

[0048] A U-shaped frame 40 is fixedly connected to the upper end surface of the first circular ring 28, a U-shaped seat 45 is fixedly connected to the inner wall of the top end of the U-shaped frame 40, a second driving plate 47 is slidably connected to the inner wall of the U-shaped seat 45, two second springs 46 matching the second driving plate 47 are also fixedly connected to the inner wall of the top end of the U-shaped frame 40, the L-shaped connecting rod 48 is slidably connected to the inner wall of the second driving plate 47, the front and rear end surfaces of the second driving plate 47 are respectively fixedly connected to the second sliding pin 41, the front and rear sides of the upper end surface of the first driving plate 33 are respectively fixedly connected to the second guide plate 42, and the second guide plate 42 is respectively provided with an inclined surface 43 and a transverse surface 44 matching the second sliding pin 41.

[0049] like Figure 15-17 As shown, the U-shaped frame 40 serves to support and limit the U-shaped seat 45 and the second driving plate 47. The second driving plate 47 can be slidably connected to the inner wall of the U-shaped seat 45 up and down. The second spring 46 always has a downward driving force on the second driving plate 47, so that the second driving plate 47, the second sliding pin 41, the L-shaped connecting rod 48, and the blade 49 are in the lowest position under normal conditions. The L-shaped connecting rod 48 can be slidably connected to the inner wall of the second driving plate 47 left and right, even if the L-shaped connecting rod 48 and the blade 49 can follow the first driving plate 33 and the extension plate 34 to move inward or outward, and when the second driving plate 47 moves up and down, it can drive the L-shaped connecting rod 48 and the blade 49 to move upward or downward; the second sliding pin 41, the second guide plate 42, the inclined surface 43, and the transverse surface 44 are installed and shaped as shown in FIG. Fig.16As shown, when the first ring 28 rotates to move the first driving plate 33 inwardly, the second guide plate 42 can be driven to move inwardly. When the second guide plate 42 moves inwardly, the inclined surface 43 can meet the second sliding pin 41. When the inclined surface 43 meets the second sliding pin 41, the second sliding pin 41 can be driven to move upward. When the second sliding pin 41 moves upward, it can drive the second driving plate 47, the L-shaped connecting rod 48, and the blade 49 to move upward. When the first driving plate 33 and the second guide plate 42 continue to move inwardly, the second sliding pin 41 can meet and engage with the cross surface 44. At this time, the second sliding pin 41 moves upward to the top position, and the corresponding second driving plate 47, the L-shaped connecting rod 48, and the blade 49 move upward to the top position. When the first ring 28 rotates one circle, that is, after the edge sealing of the semiconductor chip is completed, the corresponding first driving plate 33 will move outward under the engagement of the driving pin 32 and the V-shaped groove 30. When the first driving plate 33 and the second guide plate 42 move outward, the second sliding pin 41 will move downward and reset under the elastic force of the second spring 46. When the second sliding pin 41 and the second driving plate 47 move downward and reset, they can drive the blade 49 to move downward and reset. When the blade 49 moves downward and resets, it will cut the tape 37, thereby completing the edge sealing of the semiconductor chip.

[0050] An incomplete spur gear 24 is coaxially fixed to the lower end of the cylindrical cam 4, a small idler gear 25 matching the incomplete spur gear 24 is rotatably connected to the upper end surface of the operating table 1, a large idler gear 26 is coaxially fixed to the upper end of the small idler gear 25, and a gear ring 27 meshing with the large idler gear 26 is fixed to the outer surface of the second ring 29.

[0051] like Figure 8-Figure 10As shown, a rotating shaft is fixed at the center of the small idler wheel 25 and the large idler wheel 26, and the rotating shaft is rotatably connected to the inner wall of the operating table 1, and the small idler wheel 25 and the large idler wheel 26 can only rotate synchronously. Through the cooperation of the incomplete spur gear 24 and the small idler wheel 25, when the toothed part of the incomplete spur gear 24 meets the small idler wheel 25, the rotation of the incomplete spur gear 24 can drive the small idler wheel 25 to rotate, and when the small idler wheel 25 rotates, it can also drive the large idler wheel 26, the gear ring 27, and the second ring 29 to rotate; through the mutual cooperation of the incomplete spur gear 24 and the cylindrical cam 4, when the cylindrical cam 4 rotates, it can drive the support plate 7 and the semiconductor chip to move up and down intermittently. When the semiconductor chip intermittently moves upward to the top, the incomplete spur gear 24 can mesh with the small idler wheel 25 and drive the small idler wheel 25 and the large idler wheel 2 6. The ring gear 27 and the second ring 29 rotate synchronously. When the second ring 29 rotates, the gluing mechanism can work normally. When the incomplete spur gear 24 is disengaged from the small idler gear 25, the small idler gear 25, the large idler gear 26 and the ring gear 27 can drive the second ring 29 to rotate one circle, that is, the corresponding gluing mechanism works once. At this time, when the cylindrical cam 4 continues to rotate, the corresponding semiconductor chip can be moved downward and reset, that is, placed on the conveying rack 16. Through the transmission of the small idler gear 25 and the large idler gear 26, the transmission ratio of the incomplete spur gear 24 and the ring gear 27 can be indirectly changed. Then, through the mutual cooperation of the cylindrical cam 4 and the incomplete spur gear 24, that is, the intermittent up and down movement of the support plate 7 and the intermittent operation of the gluing mechanism cooperate with each other, the semiconductor chip is edge-sealed on the assembly line.

[0052] The upper end of the incomplete spur gear 24 is coaxially fixedly connected with a cam wheel 22 , and the upper end of the small idler gear 25 is coaxially fixedly connected with a concave wheel 23 that matches the cam wheel 22 .

[0053] like Figure 8 As shown, when the incomplete spur gear 24 is meshed with the small idler gear 25, the convex locking wheel 22 and the concave locking wheel 23 are disengaged, that is, the small idler gear 25 can rotate under the meshing of the incomplete spur gear 24. When the incomplete spur gear 24 is disengaged from the small idler gear 25, the convex locking wheel 22 and the concave locking wheel 23 are meshed, that is, the small idler gear 25 cannot rotate. Through the mutual cooperation of the convex locking wheel 22 and the concave locking wheel 23, the small idler gear 25, the large idler gear 26, the ring gear 27 and the second ring 29 can be locked under normal conditions, that is, the second ring 29 is prevented from rotating and the rubber sticking mechanism is prevented from moving.

[0054] When the present invention is in use, when the roller 17 rotates, it can drive the semiconductor chip to move, thereby conveying the semiconductor chip to a designated position; when the semiconductor chip reaches the designated position, that is, reaches the position directly above the positioning plate 20, by providing a rotatable cylindrical cam 4, the positioning plate 20 can be driven to move upward, and when the positioning plate 20 moves upward, the semiconductor chip can be lifted up and moved upward, and when the positioning plate 20 and the semiconductor chip move upward to the designated position, the corresponding clamping plate 21 can move inward to clamp and fix the semiconductor chip, so that the semiconductor chip is calibrated and fixed in the middle position of the positioning plate 20, and when the positioning plate 20 moves upward to the designated position, the semiconductor chip can be moved to the center of the second ring 29, that is, when the gluing mechanism is working, the four sides of the semiconductor chip can be fixed. The side end faces are subjected to glue treatment; through the cooperation of the set glue mechanism, namely the second driving plate 47, the pressure wheel 38, the film and other parts, when the second ring 29 rotates, the second driving plate 47, the pressure wheel 38, the film and the like can be synchronously moved inwardly; when the pressure wheel 38 and the film move inwardly to the specified position, the pressure wheel 38 can squeeze the film so that the film contacts the outer end face of the semiconductor chip; when the second ring 29 continues to rotate, the glue mechanism can be driven to move in a circle, so that the film is glued along the four end faces of the semiconductor chip; and under the pressure of the pressure wheel 38, the film can be squeezed during glue treatment, so that the film is more closely attached to the outer surface of the semiconductor chip, and can cooperate with the production line to perform edge sealing operations on the semiconductor chip, thereby replacing manual operations, reducing costs, and improving productivity.

Claims

1. A semiconductor chip automatic glue sealing machine, comprising an operating table (1), characterized in that: A conveying rack (16) is provided at the upper end of the operating table (1), on which semiconductor chips are placed, a positioning plate (20) is provided in the middle of the conveying rack (16), on which a plurality of clamping plates (21) matching the semiconductor chips are provided, and a rotatable cylindrical cam (4) is also provided on the operating table (1), and when the cylindrical cam (4) rotates, a structure is formed in which the clamping plates (21) move inward after the positioning plate (20) moves upward; a second rotatable ring (21) is also provided at the upper end of the operating table (1). 9), a glue sticking mechanism is provided at the upper end of the second circular ring (29), the glue sticking mechanism comprises a first driving plate (33), a film is provided on the first driving plate (33), and a pressure wheel (38) matched with the film is also provided on the first driving plate (33), when the second circular ring (29) rotates, the second driving plate (47) can be formed to move inward so that the pressure wheel (38) squeezes the film to contact the side end surface of the semiconductor chip, and when the second circular ring (29) continues to rotate, the film can be formed to be evenly glued along the four side end surfaces of the semiconductor chip.

2. The automatic sealing machine for semiconductor chips according to claim 1, characterized in that: The lower end surface of the operating table (1) is fixedly connected to a first motor (3), the cylindrical cam (4) is fixedly connected to the output end of the first motor (3), the upper end surface of the operating table (1) is fixedly connected to a telescopic rod (6), the upper end of the telescopic rod (6) is fixedly connected to a support plate (7), the positioning plate (20) is fixedly connected to the upper end of the support plate (7), and the left end surface of the support plate (7) is fixedly connected to a long pin (5) that matches the cylindrical cam (4).

3. The automatic sealing machine for semiconductor chips as claimed in claim 2, characterized in that: The lower end surface of the positioning plate (20) is rotatably connected to a first disk (18), and four evenly distributed first connecting rods (19) are hingedly connected to the non-center portion of the lower end surface of the first disk (18). The clamping plates (21) are respectively slidably connected to the inner wall of the positioning plate (20), and the outer ends of the first connecting rods (19) are respectively hingedly connected to the corresponding clamping plates (21).

4. The automatic sealing machine for semiconductor chips as claimed in claim 3, characterized in that: A first spur gear (8) is coaxially fixedly connected to the lower end of the first disc (18); a first spur rack (9) slidably connected to the support plate (7) is meshed on the outer surface of the first spur gear (8); a first sliding pin (11) is fixedly connected to the inner wall of the right end of the first spur rack (9); a first guide plate (12) is fixedly connected to the upper end surface of the operating table (1); and an inner vertical groove (13) matching the first sliding pin (11), a first inclined groove (14) and an outer vertical groove (15) are formed on the first guide plate (12).

5. The automatic sealing machine for semiconductor chips according to claim 1, characterized in that: The upper end of the operating table (1) is also fixedly connected to a first circular ring (28); the second circular ring (29) is rotatably connected to the upper end surface of the first circular ring (28); the first driving plate (33) is slidably connected to the upper end surface of the second circular ring (29); a driving pin (32) is fixedly connected to the lower end surface of the first driving plate (33); and the upper end surface of the first circular ring (28) is provided with a V-shaped groove (30) and a circular groove (31) that match the driving pin (32).

6. The automatic sealing machine for semiconductor chips as claimed in claim 1, characterized in that: The film roll is detachably mounted on a first driving plate (33); an extension plate (34) is slidably connected to the inner wall of the first driving plate (33); first springs (36) matching the extension plate (34) are fixedly connected to both sides of the inner wall at the bottom end of the first driving plate (33); the pressure wheel (38) is rotatably connected to the extension plate (34); and a plurality of adsorption holes (39) are provided on the outer surface of the pressure wheel (38).

7. The automatic sealing machine for semiconductor chips as claimed in claim 6, characterized in that: The front and rear end surfaces of the extension plate (34) are respectively fixedly connected to L-shaped support rods (51), the inner end surfaces of the two L-shaped support rods (51) are fixedly connected to a vertical plate (50), the vertical plate (50) is slidably connected to an L-shaped connecting rod (48) capable of moving up and down, and the lower end of the L-shaped connecting rod (48) is fixedly connected to a blade (49).

8. The automatic sealing machine for semiconductor chips as claimed in claim 7, characterized in that: A U-shaped frame (40) is fixedly connected to the upper end surface of the first circular ring (28), a U-shaped seat (45) is fixedly connected to the inner wall of the top end of the U-shaped frame (40), a second driving plate (47) is slidably connected to the inner wall of the U-shaped seat (45), two second springs (46) matched with the second driving plate (47) are also fixedly connected to the inner wall of the top end of the U-shaped frame (40), the L-shaped connecting rod (48) is slidably connected to the inner wall of the second driving plate (47), the front and rear end surfaces of the second driving plate (47) are respectively fixedly connected to the second sliding pins (41), the front and rear sides of the upper end surface of the first driving plate (33) are respectively fixedly connected to the second guide plates (42), and the second guide plates (42) are respectively provided with inclined surfaces (43) and transverse surfaces (44) matched with the second sliding pins (41).

9. The automatic sealing machine for semiconductor chips as claimed in claim 1, characterized in that: An incomplete spur gear (24) is coaxially fixedly connected to the lower end of the cylindrical cam (4); a small idler gear (25) matching the incomplete spur gear (24) is rotatably connected to the upper end surface of the operating table (1); a large idler gear (26) is coaxially fixedly connected to the upper end of the small idler gear (25); and a gear ring (27) meshing with the large idler gear (26) is fixedly connected to the outer surface of the second circular ring (29).

10. The automatic sealing machine for semiconductor chips as claimed in claim 9, characterized in that: The upper end of the incomplete spur gear (24) is coaxially fixedly connected to a convex locking wheel (22), and the upper end of the small idler wheel (25) is coaxially fixedly connected to a concave locking wheel (23) that matches the convex locking wheel (22).

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