Glass substrate, detection device and method

Abstract

The present invention belongs to the technical field of glass substrates, and particularly relates to a glass substrate, a detection device and a method. The glass substrate detection device includes a fixing part, a visual positioning system, a laser system and a detection part. The fixing part is used to fix the glass substrate; the visual positioning system, the laser system and the detection part can detect the conductive structure through the above-mentioned glass substrate detection method. The visual positioning system can determine the cutting path, and the laser system can cut the glass substrate. With the cooperation of the visual positioning system and the laser system, positioning marks can be set at both ends of the cutting path respectively, so as to redetermine the cutting path after electroplating, and because the center lines of all through holes on the same cutting path coincide with the cutting path, the consistency and integrity of each cutting surface can be guaranteed, so that the detection part can detect the cutting surface.

Description

Technical Field

[0001] The present invention relates to the technical field of glass substrates, and in particular to a glass substrate, a detection device and a detection method. Background Art

[0002] TGV (Through Glass Via) technology is a technology for manufacturing through holes on a glass substrate. Specifically, tiny through holes are set on the glass substrate and electrical interconnection in the vertical direction of the glass substrate is achieved by electroplating filling or electroplating a thin layer, thereby enabling miniaturization of the package.

[0003] To ensure the conductive performance of the glass substrate, the electroplating quality needs to be tested after the electroplating is completed. Specifically, after the electroplating is completed, the glass substrate needs to be cut so that the conductive structure obtained by the electroplating can be tested through a SEM (Scanning Electron Microscope).

[0004] In order to ensure the consistency and integrity of the cutting surfaces of each conductive structure after each through hole is cut on the same cutting surface, so as to facilitate the detection of the conductive structure, therefore, currently after the through hole is cut, it is often necessary to grind the cutting surfaces with differences, resulting in low cutting efficiency and further reduced detection efficiency.

[0005] Therefore, the above problems need to be solved urgently. Summary of the invention

[0006] An object of the present invention is to provide a glass substrate, a detection device and a method to improve the detection efficiency of the glass substrate.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A glass substrate detection method, the detection method comprising:

[0009] Based on the arrangement of the through holes on the glass substrate, a plurality of cutting paths are determined, wherein the center lines of all the through holes on any of the cutting paths coincide with the cutting path;

[0010] Positioning marks are respectively provided at positions of the substrate corresponding to two ends of any of the cutting paths;

[0011] The conductive structure is arranged in the through hole by electroplating;

[0012] Redefine the cutting path based on the positioning marks at both ends;

[0013] Cutting the glass substrate along the cutting path to obtain a cutting surface of each conductive structure;

[0014] The cut surface of the conductive structure is inspected.

[0015] Preferably, the positioning mark is a positioning hole, and the positioning hole is made by laser drilling.

[0016] Preferably, the positioning hole is a cross hole.

[0017] Preferably, the step of respectively setting positioning marks at positions of the substrate corresponding to both ends of any cutting path comprises:

[0018] A visual positioning system is used to face the cutting path, and the visual positioning system is moved to both ends of the cutting path along the extension direction of the cutting path to determine the position of the mark.

[0019] Preferably, before electroplating, a mask material is used to cover the positioning mark;

[0020] After electroplating, the mask material is removed.

[0021] Preferably, the re-determining the cutting path based on the positioning marks at both ends includes:

[0022] A visual positioning system is used to obtain two positioning marks corresponding to any of the cutting paths.

[0023] Preferably, the visual positioning system is electrically connected to the laser system to transmit the re-determined cutting path information to the laser system, and the laser system cuts the glass substrate along the corresponding cutting path.

[0024] A glass substrate comprises a substrate body, a through hole and a positioning mark. The through hole and the positioning mark are both arranged on the substrate body, and the positioning mark corresponds to the through hole.

[0025] Preferably, the glass substrate further comprises a plurality of hanging holes, and the plurality of hanging holes are evenly distributed on the substrate body.

[0026] A glass substrate detection device comprises a fixing part, a visual positioning system, a laser system and a detection part, wherein the fixing part is used to fix the glass substrate; the visual positioning system, the laser system and the detection part can detect the conductive structure through the above-mentioned glass substrate detection method.

[0027] Beneficial effects of the present invention:

[0028] The glass substrate, detection device and method of the present invention respectively set positioning marks at both ends of the cutting path to facilitate the redefinition of the cutting path after electroplating, and because the center lines of all through holes on the same cutting path coincide with the cutting path, the consistency and integrity of each cutting surface can be guaranteed, so that the cutting surface does not need to be ground, thereby further improving the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic flow chart of a cutting method in an embodiment of the present invention;

[0030] Figure 2 is a schematic structural diagram of a glass substrate in an embodiment of the present invention;

[0031] Figure 3 It is a schematic diagram of the structure of the positioning hole and the through hole in the embodiment of the present invention.

[0032] In the figure:

[0033] 100. Cutting path;

[0034] 1. Glass substrate; 2. Through hole; 3. Positioning mark; 4. Hanging hole. DETAILED DESCRIPTION

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0036] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0039] TGV technology is a technology for making through holes on a glass substrate. Specifically, by setting tiny through holes on the glass substrate and filling or plating a thin layer of electroplating to achieve electrical interconnection in the vertical direction of the glass substrate, the miniaturization of the package can be achieved. In order to ensure the conductive performance of the glass substrate, the glass substrate needs to be cut after the electroplating is completed. In order to ensure the consistency and integrity of the conductive structure after each through hole is cut on the same cutting surface, the through hole is currently cut. After the cutting is completed, the cutting surface often needs to be ground, resulting in low cutting efficiency, which in turn leads to reduced detection efficiency. Based on the above, a glass substrate detection method is proposed in this embodiment to improve the cutting efficiency of the glass substrate.

[0040] Specifically, see Figures 1 to 3 , the detection method comprises the following steps:

[0041] Step 1: Based on the arrangement of the through holes 2 on the glass substrate 1, several cutting paths 100 are determined, and the center lines of all the through holes 2 on any cutting path 100 coincide with the cutting path 100; it can be understood that, according to the arrangement of the through holes 2, multiple through holes 2 whose center lines are on the same straight line are selected, such as all the through holes 2 in the same row or in the same column, so as to determine the cutting paths 100 passing through each center line, thereby ensuring the consistency and integrity of the subsequent cutting surface of the conductive structure.

[0042] Step 2: Positioning marks 3 are respectively set at the positions of the substrate corresponding to the two ends of any cutting path 100. It can be understood that two positioning marks 3 can determine a straight line, so as to facilitate the subsequent reconfirmation of the cutting path 100.

[0043] Step 3: Use electroplating to set a conductive structure in the through hole 2. It is understandable that the electroplating method generally includes electroplating filling or electroplating thin layer, and the electrical interconnection in the vertical direction of the glass substrate 1 is achieved by electroplating filling or electroplating thin layer. The electroplating method is a prior art means, so it will not be described in detail here.

[0044] Step 4: Re-determine the cutting path 100 based on the positioning marks 3 at both ends. It is understandable that after the electroplating is completed, the conductive structure can shield the through hole 2, and the cutting path 100 can be repositioned by the positioning marks 3 at both ends, thereby improving the cutting efficiency and further improving the detection efficiency.

[0045] Step 5: Cut the glass substrate 1 along the cutting path 100 to obtain the cutting surface of each conductive structure. It can be understood that during the cutting process, the conductive structures on the same cutting path 100 can be cut in sequence. Since the center line of each through hole 2 is on the cutting path 100, the integrity and consistency of each conductive structure can be guaranteed.

[0046] Step 6: inspecting the cut surface of the conductive structure. It is understandable that after the cutting is completed, the conductive structure obtained by electroplating is observed by a scanning electron microscope to identify the electroplating quality.

[0047] In actual applications, when electroplating is performed on the same batch of glass substrates 1, the conductive structure of the first glass substrate 1 is inspected using the above-mentioned glass substrate inspection method, so that the electroplating quality can be judged. If the inspection result is qualified, the subsequent glass substrates 1 do not need to be inspected during the electroplating process. If the inspection result is unqualified, the electroplating parameters are adjusted and the inspection is performed again until the inspection result is qualified.

[0048] In this embodiment, the positioning mark 3 is a positioning hole, and the positioning hole is made by laser drilling. It can be understood that after determining the cutting path 100, holes are punched on both sides of all the through holes 2 by laser drilling, so that the center line of the positioning hole is on the corresponding cutting path 100, so as to facilitate positioning before cutting.

[0049] Preferably, the positioning hole is a cross hole. It is understandable that the positioning performance of the cross-shaped configuration is better than that of the circular configuration, thereby being able to increase the positioning speed of subsequent positioning holes during positioning.

[0050] In step 2, a visual positioning system is used to face the cutting path 100, and the visual positioning system is moved to both ends of the cutting path 100 along the extension direction of the cutting path 100 to determine the position of the mark 3. In practical applications, the visual positioning system is electrically connected to the laser system. Before drilling, the visual positioning system can move to both sides along the cutting path 100. After the visual positioning system passes through the through hole 2 at the end, it continues to move for a distance (such as 2μm, 4μm, etc.), and then transmits the position information of the mark position to the laser system, and the laser system starts to drill the glass substrate 1.

[0051] In addition, before cutting the glass substrate 1, a visual positioning system is used to obtain two positioning marks 3 corresponding to any cutting path 100. It is understandable that after the electroplating is completed, the conductive structure can block the through hole 2, which makes it inconvenient to re-determine the cutting path 100. Therefore, before the electroplating, the two positioning marks 3 corresponding to the cutting path 100 are obtained by the visual positioning system to facilitate the re-acquisition of the cutting path 100, thereby improving the cutting efficiency and the detection efficiency. Among them, the visual positioning system is preferably an existing visual positioning structure such as a high-definition camera.

[0052] Furthermore, the visual positioning system is electrically connected to the laser system to transmit the re-determined cutting path 100 information to the laser system, and the laser system cuts the glass substrate 1 along the corresponding cutting path 100. It can be understood that the laser system includes a laser head for emitting laser light and a mobile module for driving the laser head to move along the cutting path 100. The mobile module is electrically connected to the visual positioning system. When the visual positioning system detects the positioning mark 3, it can re-determine the cutting path 100, and then transmit the path information of the cutting path 100 to the mobile module. The mobile module drives the laser head to move along the corresponding cutting path 100 to complete the cutting of the glass substrate 1.

[0053] During the electroplating process, the electroplating material may block the positioning mark 3, so that the visual positioning system cannot recognize the positioning mark 3, thereby affecting the cutting efficiency and cutting quality. For this reason, in this embodiment, before electroplating, a mask material is used to cover the positioning mark 3; after electroplating, the mask material is removed. It can be understood that during the electroplating process, the mask material can prevent the electroplating material from blocking the positioning mark 3. After the electroplating is completed, the mask material is removed to facilitate positioning during cutting, wherein the mask material is preferably a photoresist or the like.

[0054] This embodiment also proposes a glass substrate detection device, which includes a fixing part, a visual positioning system, a laser system and a detection part. The fixing part is used to fix the glass substrate 1; the visual positioning system, the laser system and the detection part can detect the conductive structure through the above-mentioned glass substrate detection method.

[0055] In practical applications, the visual positioning system can determine the cutting path 100, and the laser system can cut the glass substrate 1. With the cooperation of the visual positioning system and the laser system, positioning marks 3 can be set at both ends of the cutting path 100 to facilitate the redefinition of the cutting path 100 after electroplating. Moreover, since the center lines of all through holes 2 on the same cutting path 100 coincide with the cutting path 100, the consistency and integrity of each cutting surface can be guaranteed, so that the detection unit can detect the cutting surface.

[0056] Based on the above, the present embodiment further proposes a glass substrate, including a substrate body, a through hole 2 and a positioning mark 3, wherein the through hole 2 and the positioning mark 3 are both arranged on the substrate body, and the positioning mark 3 corresponds to the through hole 2. It can be understood that the glass substrate 1 with the positioning mark 3 is a detection plate, so as to detect the electroplating quality, wherein the positioning mark 3 is determined by step 1 and step 2 in the above-mentioned glass substrate detection method, and after the electroplating is completed, the electroplating quality is detected by step 4 to step 6.

[0057] Preferably, the through hole 2 is a circular hole, and a plurality of through holes 2 are arranged in an array on the substrate body. The extension direction of the cutting path 100 is set horizontally or vertically. The positioning mark 3 and the center line of the through hole are both located in the corresponding cutting path 100 to ensure accuracy during cutting, thereby ensuring the consistency and integrity of the cutting surface of the conductive structure.

[0058] Furthermore, the glass substrate 1 further comprises a plurality of hanging holes 4, and the plurality of hanging holes 4 are evenly distributed on the substrate body 1. Such arrangement facilitates hanging the glass substrate 1 during the electroplating process.

[0059] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A glass substrate detection method, characterized in that: The detection method comprises: Based on the arrangement of the through holes (2) on the glass substrate (1), a plurality of cutting paths (100) are determined, wherein the center lines of all the through holes (2) on any of the cutting paths (100) coincide with the cutting path (100); Positioning marks (3) are respectively provided at positions on the substrate corresponding to the two ends of any cutting path (100); A conductive structure is provided in the through hole (2) by electroplating; Re-determining the cutting path (100) based on the positioning marks (3) at both ends; Cutting the glass substrate (1) along the cutting path (100) to obtain a cutting surface of each conductive structure; The cut surface of the conductive structure is inspected.

2. The glass substrate detection method according to claim 1, characterized in that: The positioning mark (3) is a positioning hole, and the positioning hole is made by laser drilling.

3. The glass substrate detection method according to claim 2, characterized in that: The positioning hole is a cross hole.

4. The glass substrate detection method according to claim 1, characterized in that: The positioning marks (3) are respectively provided at positions of the substrate corresponding to the two ends of any cutting path (100) and include: A visual positioning system is used to face the cutting path (100), and the visual positioning system is moved to the two ends of the cutting path (100) along the extension direction of the cutting path (100) to determine the position of the position mark (3).

5. The glass substrate detection method according to claim 1, characterized in that: Before electroplating, the positioning mark (3) is covered with a mask material; After electroplating, the mask material is removed.

6. The glass substrate detection method according to claim 1, characterized in that: The re-determining of the cutting path (100) based on the positioning marks (3) at both ends comprises: A visual positioning system is used to obtain two positioning marks (3) corresponding to any one of the cutting paths (100).

7. The glass substrate detection method according to claim 6, characterized in that: The visual positioning system is electrically connected to a laser system to transmit the re-determined cutting path (100) information to the laser system, and the laser system cuts the glass substrate (1) along the corresponding cutting path (100).

8. A glass substrate, characterized in that: It comprises a substrate body, a through hole (2) and a positioning mark (3), wherein the through hole (2) and the positioning mark (3) are both arranged on the substrate body, and the positioning mark (3) corresponds to the through hole (2).

9. The glass substrate according to claim 8, characterized in that: The glass substrate (1) further comprises a plurality of hanging holes (4), and the plurality of hanging holes (4) are evenly distributed on the substrate body.

10. A glass substrate detection device, characterized in that: It comprises a fixing part, a visual positioning system, a laser system and a detection part, wherein the fixing part is used to fix the glass substrate (1); the visual positioning system, the laser system and the detection part can detect the conductive structure by using the glass substrate detection method according to any one of claims 1 to 7.

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