Waste gas treatment system in semiconductor manufacturing process

Abstract

The invention provides a waste gas treatment system in a semiconductor manufacturing process. The waste gas treatment system comprises a reaction chamber, the spraying and washing mechanism surrounds the peripheral surface of the reaction chamber, a spiral spraying channel and a cooling cavity are arranged in the spraying and washing mechanism, the spraying channel is used for circulation of semiconductor waste gas, and the bottom end of the spraying channel is communicated with the bottom end of the reaction chamber; the cooling cavity is positioned between the spraying channel and the outer wall of the reaction chamber; the water receiving pool is arranged at the bottom of the spraying channel, and the water receiving pool is connected with a high-pressure water pump; the heater is arranged in the reaction chamber, the heater is connected with a driving mechanism, an outlet pipe communicated with the bottom end of the reaction chamber is arranged below the heater, a side opening is formed in one side of the outlet pipe, and a flushing assembly connected with the high-pressure water pump is arranged on one side of the side opening. The reaction chamber is surrounded by the spraying and washing mechanism, so that spraying and washing can be provided for waste gas, the spraying and washing mechanism can also serve as a heat insulation structure of the reaction chamber, the overall structure is compact, and the occupied area is reduced.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a waste gas treatment system in a semiconductor manufacturing process. Background Art

[0002] Waste gas treatment is a critical link in the semiconductor manufacturing process, which aims to reduce or eliminate harmful gases generated in the semiconductor manufacturing process to protect the environment and employee health.

[0003] For example, the waste gas generated in the process of silicon carbide production mainly includes SiCl4, SiHCl3, HCl, H2, N2 and a small amount of metal chlorides, etc. These waste gases not only contain toxic and harmful substances, but also may have a serious impact on the atmospheric environment. In practical applications, it is necessary to select appropriate treatment methods based on factors such as the type, concentration, and amount of waste gas, and pay attention to controlling the treatment effect to ensure that waste gas emissions meet relevant national and local standards.

[0004] In the existing patent document "CN215654636U, a waste gas treatment device for semiconductor device manufacturing", it includes a reaction chamber, a water washing chamber, a clean water tank, a cooling tower and a water pump. A heat exchange mechanism is arranged between the reaction chamber and the water washing chamber. The heat exchange mechanism includes a cylinder body and a heat conducting rod. The two ends of the cylinder body are respectively connected to the gas outlet at the bottom of the reaction chamber and the inlet at the top of the water washing chamber and a valve is arranged. The cylinder body contains a cavity around the wall and the upper and lower parts of the outer wall of the cylinder body are respectively provided with a first outlet and a first inlet. The first outlet is connected with the air inlet of the reaction chamber. The two ends of the heat conducting rod are respectively located in the cavity of the cylinder wall around the wall and in the first cavity of the cylinder body. Although the above-mentioned prior art can be used for waste gas treatment, the structure for waste gas spraying is separately arranged with the waste gas reaction chamber, resulting in a large overall space occupation and the waste gas reaction chamber needs to be additionally provided with a cooling and heat insulation structure. Further, the heating structure in the waste gas reaction chamber is in contact with the waste gas for a long time, and the derivatives produced after the combustion of the waste gas are easily attached to it, and long-term accumulation is easy to affect the subsequent normal use. Summary of the invention

[0005] The present invention provides an exhaust gas treatment system in a semiconductor manufacturing process in order to solve the technical problems that a spray structure and a cooling and heat-insulating structure of an exhaust gas reaction chamber lack a combined design and that a heating structure in the exhaust gas reaction chamber is easily affected by post-combustion derivatives.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] The present invention provides an exhaust gas treatment system in a semiconductor manufacturing process, comprising a reaction chamber; further comprising: a spray water washing mechanism, the spray water washing mechanism surrounds the outer peripheral surface of the reaction chamber, and a spiral spray channel and a cooling chamber are arranged in the spray water washing mechanism, the spray channel is used for the circulation of semiconductor exhaust gas, and the bottom end of the spray channel is connected to the bottom end of the reaction chamber; the cooling chamber is located between the spray channel and the outer wall of the reaction chamber; a water receiving pool, the water receiving pool is arranged at the bottom of the spray channel, and the water receiving pool is connected to a high-pressure water pump that can pump water in the pool into the cooling chamber; a heater, the heater is arranged in the reaction chamber, the heater is connected to a driving mechanism, the driving mechanism can drive the heater to move vertically and rotate, an outlet pipe connected to the bottom end of the reaction chamber is arranged below the heater, and the outlet pipe is provided with a sleeve that can automatically release the positioning, a side opening is arranged on one side of the outlet pipe, and a flushing component connected to the high-pressure water pump is arranged on one side of the side opening; a filtering mechanism, the filtering mechanism is connected to an exhaust pipe, and the exhaust pipe is connected to the top of the reaction chamber.

[0008] In the present technical solution, the reaction chamber is surrounded by a spray water washing mechanism, which can provide spray water washing for the exhaust gas and also serve as a heat insulation structure for the reaction chamber, while making the overall structure compact and reducing the footprint; further, through the high-pressure water pump flushing component and the design of the heater being driven by a driving mechanism, the surface of the heater can be cleaned.

[0009] Preferably, an upper cover and a lower cover are fixedly installed on the top and bottom of the reaction chamber respectively; the driving mechanism is installed on the upper cover, and the driving mechanism includes a screw, a carrier, a fixing nut, a prism and a motor; a fixing nut is fixedly installed on the middle part of the upper cover, the screw is threadedly connected with the fixing nut, and the bottom end of the screw is fixedly connected to the top of the heater, a matching hole with a top opening is opened at the axis of the screw, the matching hole is matched with the prism, the top of the prism is fixedly connected to the output shaft end of the motor, the carrier is fixedly installed on the top surface of the upper cover, and the motor is fixedly connected to the top of the carrier.

[0010] In this technical solution, the driving mechanism is used to drive the heater to move.

[0011] Preferably, the spray water washing mechanism includes an outer cylinder, an inner cylinder and a spray pipe; the outer cylinder, the inner cylinder and the reaction chamber are coaxially arranged, the top end of the outer cylinder and the top end of the inner cylinder are both fixedly connected to the bottom surface of the upper cover, the bottom end of the outer cylinder and the bottom end of the inner cylinder are both fixedly connected to the top surface of the lower cover, the spray pipe is arranged between the outer cylinder and the inner cylinder, and a cooling chamber is formed between the inner cylinder and the outer wall of the reaction chamber.

[0012] In this technical solution, the spray water washing mechanism provides spray water washing for the exhaust gas before it enters the reaction chamber.

[0013] Preferably, the spray pipe consists of a spiral blade, a spiral tube, a partition and a spray head; the spiral blade is fixedly installed between the outer cylinder and the inner cylinder, and an annular groove is formed between the outer cylinder and the inner cylinder, and the annular groove is divided into a spray channel by the spiral blade, the spiral tube is fixedly laid in the length direction of the spiral blade, and the spiral tube is installed with a number of evenly distributed spray heads along the length direction, the top of the spiral tube is closed, and the bottom of the spiral tube is open, the open end of the spiral tube is connected to a high-pressure water inlet pipe fixed to the wall of the outer cylinder, and the high-pressure water inlet pipe extends to the outside of the outer cylinder; a partition is fixedly installed at the top of the spiral blade, the top of the spray channel is connected to an exhaust gas inlet pipe, and the exhaust gas inlet pipe is fixed to the upper cover.

[0014] In the present technical solution, a spiral spray channel is formed by the spiral design of the spray pipe, which extends the path of the waste gas spray water washing and improves the effect of the spray water washing.

[0015] Preferably, the lower sealing cover includes a first sealing plate, a second sealing plate, a connecting strip and an outer ring; the first sealing plate is fixedly sealed to the bottom of the cooling chamber, the second sealing plate is fixedly sealed to the bottom end of the reaction chamber, the first sealing plate and the outer ring are fixedly connected by a plurality of connecting strips, and a lower water trough is formed between every two adjacent connecting strips, the lower water trough is located between the spray channel and the water receiving pool, the top of the water receiving pool is fixedly connected to the bottom surface of the lower sealing cover, and a filter is installed inside the water receiving pool.

[0016] In the present technical solution, the water receiving pool is used to receive the water after the spray washing, and to recycle it. The water is filtered through the filter screen therein to ensure the cleanliness of the recycled water.

[0017] Preferably, the bottom end of the spray channel is connected to a first gas pipe fixedly connected to the outer cylindrical wall, the first gas pipe is fixedly connected to a second gas pipe, the second gas pipe is fixedly connected to the second blocking plate, and the second gas pipe is connected to the bottom end of the reaction chamber.

[0018] In the present technical solution, the first gas pipeline and the second gas pipeline are designed to transport the waste gas after spraying and washing in the spray channel into the reaction chamber.

[0019] Preferably, the water inlet of the high-pressure water pump is connected to a first water pipe, the first water pipe is connected to the bottom of the water receiving pool, the water outlet of the high-pressure water pump is connected to a three-way pipe, the two ports of the three-way pipe are respectively installed with a first electrically-controlled valve and a second electrically-controlled valve, the first electrically-controlled valve is connected to a second water pipe, the second water pipe is connected to the bottom of the cooling chamber, and the top of the cooling chamber is connected to a drain outlet, the drain outlet is fixedly connected to the upper cover; the second electrically-controlled valve is connected to the flushing assembly.

[0020] In this technical solution, the flushing component is connected to a high-pressure water pump, and the high-pressure water pump provides drive for the flushing component.

[0021] Preferably, the flushing assembly includes a fixed cylinder, a movable tube, a knife block, a piston sleeve and a second spring; one end of the fixed cylinder is fixedly connected to the second electrically-controlled valve, one end of the movable tube is fixedly sleeved with a piston sleeve, and the outer ring of the piston sleeve is cooperatively connected to the inner wall of the fixed cylinder, the movable tube is cooperatively connected to the end of the fixed cylinder away from the second electrically-controlled valve, and the movable tube extends outside the fixed cylinder, a second spring is arranged inside the movable tube, two ends of the second spring are respectively fixedly connected to the movable tube and the fixed cylinder, and a water spray hole is arranged at the end of the movable tube away from the piston sleeve; the knife block is fixed to the movable tube below the water spray hole.

[0022] In the technical solution, the flushing component is used to clean the surface of the heater.

[0023] Preferably, it also includes a connecting ring, which is connected to the sealing sleeve; the connecting ring includes a ring seat, a sealing gasket, a slot and a chamfer; the ring seat is fixed to the bottom surface of the lower cover, and the ring seat is coaxially arranged with the outlet pipe, a sealing gasket is fixedly installed in the ring seat, the bottom inner edge of the ring seat is provided with a chamfer, and the inner side wall of the ring seat is provided with a slot; the sealing sleeve includes a sleeve, a guide sleeve, a first spring, a bevel plug, a connecting rod, a guide groove and a sealing ring; the bottom end of the sleeve is closed, and the top end of the sleeve is The guide sleeve is fixedly installed on one side of the outer wall of the sleeve, the inclined surface block is connected with the guide sleeve, and a first spring is arranged in the guide sleeve, the two ends of the first spring are respectively fixed with the inclined surface block and the guide sleeve, and one end of the inclined surface block is embedded in the slot, a guide groove is provided at the bottom of the guide sleeve, the guide groove is slidably connected with the connecting rod, and the top end of the connecting rod is fixed with the inclined surface block, and the connecting rod is located on one side of the knife block.

[0024] In the technical solution, the connecting ring provides an installation position for the sleeve, and the sleeve has an automatic release design to facilitate removal from the outlet pipe.

[0025] Preferably, the filtering mechanism includes a box body, a connecting pipe, a filter and a fan; the box body is fixedly connected to the outer wall of the outer cylinder, the fan is fixedly installed to one side of the box body, a filter is arranged in the box body, a connecting pipe is fixedly connected to the top of the box body, the connecting pipe is fixedly connected to the exhaust pipe, and the bottom of the box body is connected to the air inlet of the fan.

[0026] In the present technical solution, after the waste gas in the reaction chamber is treated, a filtering mechanism is used to provide a second filtering treatment to ensure the effect of the waste gas treatment.

[0027] On the basis of being in accordance with the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0028] The positive and progressive effects of the present invention are:

[0029] The waste gas treatment system in the semiconductor manufacturing process proposed above is surrounded by a spray water washing mechanism on the outer peripheral surface of the reaction chamber. The spray water washing mechanism is used for spray water washing before the waste gas enters the reaction chamber, and also serves as a heat insulation structure of the reaction chamber. The spray water washing mechanism has a spray channel and a cooling chamber. The water after the spray water washing can be used as a cold source in the cooling chamber to avoid waste. It is different from the prior art that only uses the cooling chamber as heat insulation. The added spray channel further improves the heat insulation effect, and the spray water washing mechanism is gathered on the outer peripheral surface of the reaction chamber, making the overall structure compact and reducing the floor space. Furthermore, through the arrangement of a high-pressure water pump, a flushing assembly and a driving mechanism, the heater can be cleaned after use to avoid the accumulation of derivatives thereon and affecting its use. Furthermore, an outlet pipe is arranged, and the outlet pipe is used to leave the reaction chamber during the cleaning process of the heater, and a sleeve that can automatically release its position is arranged on the outlet pipe. When no cleaning is performed, it blocks the outlet pipe, and when cleaning is required, it automatically releases its position, which is convenient for manual opening of the outlet pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall external structure of the present invention.

[0031] Figure 2 It is a schematic diagram of the structure of the outer cylinder, inner cylinder and the interior of the reaction chamber of the present invention.

[0032] Figure 3 For the present invention Figure 2 Schematic diagram of the structure with the A part in the middle enlarged.

[0033] Figure 4 It is a schematic diagram of the structure of the spray pipe of the present invention.

[0034] Figure 5 It is a schematic structural diagram of the lower cover and the top surface of the water receiving pool of the present invention.

[0035] Figure 6 It is a structural schematic diagram of the bottom of the lower cover of the present invention.

[0036] Figure 7 For the present invention Figure 6 Schematic diagram of the structure with the B part enlarged.

[0037] Figure 8 It is a schematic structural diagram of the high-pressure water pump and flushing assembly of the present invention.

[0038] Fig. 9 It is a schematic diagram of the structure of the flushing assembly and the envelope of the present invention.

[0039] Fig.10 It is a structural schematic diagram of the filtering mechanism of the present invention.

[0040] Description of Reference Numerals

[0041] 1. Outer cylinder;

[0042] 2. Support frame;

[0043] 3. Upper cover;

[0044] 4. Lower cover; 401. First sealing plate; 402. Second sealing plate; 403. Connecting strip; 404. Outer ring;

[0045] 5. driving mechanism; 501. screw rod; 502. carrier; 503. fixing nut; 504. prism; 505. motor;

[0046] 6. Water receiving pool; 601. Filter;

[0047] 7. The first gas pipeline;

[0048] 8. High-pressure water inlet pipe;

[0049] 9. Exhaust pipe;

[0050] 10. Drainage outlet;

[0051] 11. Exhaust gas enters the pipe;

[0052] 12. Filter mechanism; 1201. Box body; 1202. Connecting pipe; 1203. Filter; 1204. Fan;

[0053] 13. Inner cylinder;

[0054] 14. Reaction chamber;

[0055] 15. Sprinkler pipe; 1501. Spiral blade; 1502. Spiral pipe; 1503. Partition plate; 1504. Sprinkler head;

[0056] 16. Cooling chamber;

[0057] 17. Spray channel;

[0058] 18. Heater;

[0059] 19. Second gas pipeline;

[0060] 20. outlet pipe; 2001. side opening;

[0061] 21. Envelope; 2101. Sleeve; 2102. Guide sleeve; 2103. First spring; 2104. Inclined insert; 2105. Connecting rod; 2106. Guide groove; 2107. Sealing ring;

[0062] 22. High-pressure water pump;

[0063] 23. First water pipe;

[0064] 24. Tee pipe;

[0065] 25. Second water pipe;

[0066] 26. Flushing assembly; 2601. Fixed cylinder; 2602. Movable tube; 2603. Knife block; 2604. Piston sleeve; 2605. Second spring;

[0067] 27, connecting ring; 2701, ring seat; 2702, sealing gasket; 2703, slot; 2704, chamfer;

[0068] 28. The first electronically controlled valve;

[0069] 29. Second electronically controlled valve. DETAILED DESCRIPTION

[0070] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0071] like Figure 1-10 As shown, the waste gas treatment system in the semiconductor manufacturing process includes a reaction chamber 14; it also includes: a spray water washing mechanism, the spray water washing mechanism surrounds the outer peripheral surface of the reaction chamber 14, and a spiral spray channel 17 and a cooling chamber 16 are arranged in the spray water washing mechanism, the spray channel 17 is used for the circulation of semiconductor waste gas, and the bottom end of the spray channel 17 is connected to the bottom end of the reaction chamber 14; the cooling chamber 16 is located between the spray channel 17 and the outer wall of the reaction chamber 14; a water receiving pool 6, the water receiving pool 6 is arranged at the bottom of the spray channel 17, and the water receiving pool 6 is connected to a high-pressure water pump 2 that can pump water in the pool into the cooling chamber 16 2; a heater 18, wherein the heater 18 is disposed in the reaction chamber 14, and the heater 18 is connected to a driving mechanism 5, and the driving mechanism 5 can drive the heater 18 to move vertically and rotate, and an outlet pipe 20 connected to the bottom end of the reaction chamber 14 is disposed below the heater 18, and the outlet pipe 20 is provided with a cover 21 that can automatically release the positioning, and a side opening 2001 is disposed on one side of the outlet pipe 20, and a flushing assembly 26 connected to a high-pressure water pump 22 is disposed on one side of the side opening 2001; a filtering mechanism 12, wherein the filtering mechanism 12 is connected to an exhaust pipe 9, and the exhaust pipe 9 is connected to the top end of the reaction chamber 14.

[0072] like Figure 1-2As shown, as a specific technical solution, the top and bottom ends of the reaction chamber 14 are respectively fixedly installed with an upper cover 3 and a lower cover 4; the driving mechanism 5 is installed on the upper cover 3, and the driving mechanism 5 includes a screw 501, a carrier 502, a fixing nut 503, a prism 504 and a motor 505. A fixing nut 503 is fixedly installed in the middle of the upper cover 3, the screw 501 is threadedly connected with the fixing nut 503, and the bottom end of the screw 501 is fixedly connected to the top of the heater 18, a matching hole with a top opening is opened at the axis of the screw 501, the matching hole is matched with the prism 504, the top of the prism 504 is fixedly connected to the output shaft end of the motor 505, the carrier 502 is fixedly installed to the top surface of the upper cover 3, and the motor 505 is fixedly connected to the top of the carrier 502.

[0073] When the heater 18 needs to be cleaned, the motor 505 drives the prism 504 to rotate, and the prism 504 causes the screw 501 to be threaded about the fixing nut 503, driving the heater 18 to move downward and rotate at the same time, so as to pass through the outlet pipe 20, and further provide flushing through the flushing component 26 on the side of the outlet pipe 20. By moving the heater 18 downward and rotating itself, cleaning of various positions along the length direction of the heater 18 is achieved.

[0074] The prism 504 cooperates with the matching holes on the screw rod 501 . When the screw rod 501 moves downward, the two slide vertically, so that the two form a retractable structure, and the prism 504 will not affect the downward movement of the screw rod 501 .

[0075] like Figure 2 , Figure 4As shown in Figure 5, as a specific technical solution, the spray water washing mechanism includes an outer cylinder 1, an inner cylinder 13 and a spray pipe 15; the outer cylinder 1, the inner cylinder 13 and the reaction chamber 14 are coaxially arranged, the top end of the outer cylinder 1 and the top end of the inner cylinder 13 are fixedly connected to the bottom surface of the upper cover 3, the bottom end of the outer cylinder 1 and the bottom end of the inner cylinder 13 are fixedly connected to the top surface of the lower cover 4, the spray pipe 15 is arranged between the outer cylinder 1 and the inner cylinder 13, and a cooling chamber 16 is enclosed between the inner cylinder 13 and the outer wall of the reaction chamber 14. The spray pipe 15 is composed of a spiral blade 1501, a spiral tube 1502, a partition 1503 and a spray head 1504; the spiral blade 1501 is fixedly installed between the outer cylinder 1 and the inner cylinder 13, and an annular groove is formed between the outer cylinder 1 and the inner cylinder 13. The annular groove is divided into a spray channel 17 by the spiral blade 1501. The spiral tube 1502 is fixedly laid in the length direction of the spiral blade 1501, and the spiral tube 1502 is arranged along the length direction. It is equipped with a plurality of evenly distributed spray heads 1504, the top end of the spiral tube 1502 is closed, and the bottom end of the spiral tube 1502 is open, the open end of the spiral tube 1502 is connected to the high-pressure water inlet pipe 8 fixed to the wall of the outer cylinder 1, and the high-pressure water inlet pipe 8 extends to the outside of the outer cylinder 1; a partition plate 1503 is fixedly installed on the top of the spiral blade 1501, the top end of the spray channel 17 is connected to the exhaust gas inlet pipe 11, and the exhaust gas inlet pipe 11 is fixed to the upper cover 3. The lower cover 4 includes a first sealing plate 401, a second sealing plate 402, a connecting strip 403 and an outer ring 404; the first sealing plate 401 is fixedly sealed to the bottom of the cooling chamber 16, the second sealing plate 402 is fixedly sealed to the bottom end of the reaction chamber 14, the first sealing plate 401 and the outer ring 404 are fixedly connected by a plurality of connecting strips 403, and a lower water trough is formed between every two adjacent connecting strips 403, and the lower water trough is located between the spray channel 17 and the water receiving pool 6, the top of the water receiving pool 6 is fixedly connected to the bottom surface of the lower cover 4, and a filter screen 601 is installed inside the water receiving pool 6.

[0076] The outer cylinder 1 is fixedly mounted with a support frame 2 for the support frame 2 to be high.

[0077] The water inlet of the high-pressure water pump 22 is connected to a first water pipe 23, and the first water pipe 23 is connected to the bottom of the water receiving pool 6. The water outlet of the high-pressure water pump 22 is connected to a three-way pipe 24, and the two ports of the three-way pipe 24 are respectively installed with a first electrically-controlled valve 28 and a second electrically-controlled valve 29. The first electrically-controlled valve 28 is connected to a second water pipe 25, and the second water pipe 25 is connected to the bottom of the cooling chamber 16. The top of the cooling chamber 16 is connected to a drain port 10, and the drain port 10 is fixedly connected to the upper cover 3; the second electrically-controlled valve 29 is connected to the flushing component 26.

[0078] The waste gas inlet pipe 11 is connected to the waste gas outlet pipe of the semiconductor manufacturing machine, wherein an air pump can be provided at the connection point for conveying waste gas. When the waste gas is input, air needs to be introduced into the waste gas inlet pipe 11. Figure 1 As shown, there are two exhaust gas inlet pipes 11, which can be used to introduce air and exhaust gas respectively; the exhaust gas enters the top of the spiral spray channel 17 through the exhaust gas inlet pipe 11, and flows downward in the spray channel 17, wherein the high-pressure water inlet pipe 8 is connected to the high-pressure cold water source, and the water enters the spray heads 1504 evenly distributed in the spray channel 17 through the spiral tube 1502, and is sprayed through the spray heads 1504 to perform spray water washing of the exhaust gas. Through the above-mentioned spiral design, the spray water washing path is greatly extended, and the spray water washing effect is improved.

[0079] After the spray water is sprayed out, the water falls onto the spiral blade 1501, is guided along the spiral blade 1501, passes through the lower water tank, and enters the water receiving pool 6. After being filtered through the filter net 601, the water is collected. The above design forms a continuous water layer on the spiral blade 1501, and the exhaust gas contacts the surface of this part of the water layer, which can absorb dust and water-soluble components in the exhaust gas, thereby improving the effect of spray water washing.

[0080] The water after spraying and washing is recovered in the water receiving box; it is pumped by the high-pressure water pump 22, and the water enters the high-pressure water pump 22 through the first water pipe 23. When the first electrically controlled valve 28 is in the open state and the second electrically controlled valve 29 is in the closed state, the water enters the cooling chamber 16 through the second water pipe 25, and after passing through the cooling chamber 16, it is discharged from the drain port 10, and the discharged water is returned to the high-pressure cold water source connected to the high-pressure water inlet pipe 8 through the pipeline.

[0081] Through the above design, the semiconductor exhaust gas is sprayed and washed with water, and the water after the spraying and washing is used as the cold source of the cooling chamber 16.

[0082] like Figure 2 As shown, the bottom end of the spray channel 17 is connected to the first gas pipe 7 fixedly connected to the wall of the outer cylinder 1, the first gas pipe 7 is fixedly connected to the second gas pipe 19, the second gas pipe 19 is fixedly connected to the second blocking plate 402, and the second gas pipe 19 is connected to the bottom end of the reaction chamber 14.

[0083] The waste gas after water washing in the spray channel 17 enters the reaction chamber 14 through the first gas pipe 7 and the second gas pipe 19, and is heated by the heater 18 in the reaction chamber 14 to be burned.

[0084] like Figure 1 and Fig.10As shown, the filtering mechanism 12 includes a box body 1201, a connecting pipe 1202, a filter 1203 and a fan 1204; the box body 1201 is fixedly connected to the outer wall of the outer cylinder 1, the fan 1204 is fixedly installed on one side of the box body 1201, a filter 1203 is arranged in the box body 1201, a connecting pipe 1202 is fixedly connected to the top of the box body 1201, the connecting pipe 1202 is fixedly connected to the exhaust pipe 9, and the bottom of the box body 1201 is connected to the air inlet of the fan 1204.

[0085] After the exhaust gas is burned in the reaction chamber 14 , it passes through the exhaust pipe 9 and the connecting pipe 1202 , enters the box body 1201 , is filtered by the filter 1203 , and is finally discharged by the fan 1204 .

[0086] like Figure 2 , Figure 3 , Figure 6 , Figure 7 , Figure 8As shown in Figure 9, as a specific technical solution, the flushing assembly 26 includes a fixed cylinder 2601, a movable tube 2602, a knife block 2603, a piston sleeve 2604 and a second spring 2605; one end of the fixed cylinder 2601 is fixedly connected to the second electrically controlled valve 29, one end of the movable tube 2602 is fixedly sleeved with the piston sleeve 2604, and the outer ring of the piston sleeve 2604 is matched with the inner wall of the fixed cylinder 2601, the movable tube 2602 is matched with the end of the fixed cylinder 2601 away from the second electrically controlled valve 29, and the movable tube 2602 extends to the outside of the fixed cylinder 2601, and a second spring 2605 is arranged inside the movable tube 2602, and the two ends of the second spring 2605 are respectively fixedly connected to the movable tube 2602 and the fixed cylinder 2601, and the end of the movable tube 2602 away from the piston sleeve 2604 is provided with a water spray hole; the knife block 2603 is fixed to the lower part of the movable tube 2602 where the water spray hole is arranged. It also includes a connecting ring 27, which is connected to the envelope 21; the connecting ring 27 includes a ring seat 2701, a sealing gasket 2702, a slot 2703 and a chamfer 2704; the ring seat 2701 is fixed to the bottom surface of the lower cover 4, and the ring seat 2701 is coaxially arranged with the outlet pipe 20, a sealing gasket 2702 is fixedly installed in the ring seat 2701, a chamfer 2704 is arranged on the inner edge of the bottom of the ring seat 2701, and a slot 2703 is opened on the inner side wall of the ring seat 2701; the envelope 21 includes a sleeve 2101, a guide sleeve 2102, a first spring 2103, a bevel plug 2104, a connecting rod 2105, a guide groove 2106 and a sealing ring 2107; the bottom end of the sleeve 2101 is closed, and the sleeve 21 01 is open at the top, a sealing ring 2107 is fixedly installed on the inner wall of the closed end of the sleeve 2101, the guide sleeve 2102 is fixedly installed on one side of the outer wall of the sleeve 2101, the inclined surface plug 2104 is matched and connected with the guide sleeve 2102, and a first spring 2103 is arranged in the guide sleeve 2102, the two ends of the first spring 2103 are respectively fixed with the inclined surface plug 2104 and the guide sleeve 2102, and the end of the inclined surface plug 2104 with the inclined surface is embedded in the slot 2703, and a guide groove 2106 is arranged at the bottom of the guide sleeve 2102, the guide groove 2106 is slidably connected with the connecting rod 2105, and the top of the connecting rod 2105 is fixed with the inclined surface plug 2104, and the connecting rod 2105 is located on one side of the knife block 2603. The movable tube 2602 is selected from a non-circular tube to prevent the movable tube 2602 from rotating with the fixed tube 2601.

[0087] After the use of the entire exhaust gas treatment system is completed, the heater 18 is driven by the driving mechanism 5 to extend into the outlet pipe 20, so that the bottom side of the heater 18 is aligned with the flushing assembly 26; the second electrically controlled valve 29 is opened, the first electrically controlled valve 28 is closed, and the high-pressure water pump 22 is started, so that the high-pressure water flow of the high-pressure water pump 22 enters the flushing assembly 26, and the piston sleeve 2604 and the movable tube 2602 are moved by the water pressure, and the movable tube 2602 extends out of the fixed tube 2601, and the second spring 2605 is stretched at the same time, and the knife block 2603 moves with the movable tube 2602, and the connecting rod 210 is pushed by the knife block 2603. 5. The connecting rod 2105 slides along the guide groove 2106, driving the inclined surface plug 2104 to be received in the guide sleeve 2102, and compressing the first spring 2103 at the same time; the positioning lock of the sleeve 2101 is automatically cancelled, and then the sleeve 2101 is manually rotated. Since the sleeve 2101 and the outlet pipe 20 are both round tubes, the sleeve 2101 can be rotated on the outlet pipe 20, so that the guide sleeve 2102 and the inclined surface plug 2104 are not in the same vertical plane with the flushing assembly 26, and then the sleeve 2101 is pulled down, and the envelope 21 can be pulled down from the outlet pipe 20, so that the bottom end of the outlet pipe 20 and the side opening 2001 are unblocked and opened. Through the above design, the envelope 21 can be automatically released from the position without manual operation. Among them, the surface where the connecting rod 2105 contacts the knife block 2603 is preferably an arc surface.

[0088] After the outlet pipe 20 is opened, the high-pressure water pump 22 is pressurized and continues to drive the movable pipe 2602 to move, so that the movable pipe 2602 enters the outlet pipe 20 through the side opening 2001, and the blade of the knife block 2603 is in contact with the surface of the heater 18. After contact, there is a certain distance between the end of the movable pipe 2602 and the heater 18, and the water in the high-pressure water pump 22 is sprayed out through the spray hole on the movable pipe 2602 to flush the heater 18. When the heater 18 is driven to rotate and move downward, the derivatives on the peripheral surface of the heater 18 can be flushed and removed.

[0089] After the heater 18 is cleaned, the high-pressure water pump 22 is turned off, and the movable tube 2602 is reset by the elastic force of the second spring 2605; the heater 18 is then reset by the driving mechanism 5; the sleeve 21 is then installed, the top end of the sleeve 2101 is aligned with the outlet pipe 20, and the guide sleeve 2102 and the inclined plug 2104 are located on the left side of the sleeve 2101, and the sleeve 2101 is pushed up. During the upward movement of the sleeve 2101, the chamfer 2704 is used to Squeeze the inclined surface of the inclined surface plug 2104 to insert the inclined surface plug 2104 into the guide sleeve 2102, and compress the first spring 2103 at the same time until the top end of the sleeve 2101 presses the sealing gasket 2702, and the bottom end of the outlet pipe 20 presses the sealing ring 2107, and then rotate the sleeve 2101 until the inclined surface plug 2104 is aligned with the slot 2703, and the elastic force of the first spring 2103 is used to insert the inclined surface plug 2104 into the slot 2703 to complete the installation.

[0090] The present invention is not limited to the above-mentioned embodiments. Any changes in shape or structure are within the protection scope of the present invention. The protection scope of the present invention is defined by the attached claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, but these changes and modifications are within the protection scope of the present invention.

Claims

1. A system for treating waste gas in a semiconductor manufacturing process, comprising a reaction chamber (14); characterized in that: Also includes: A spray water washing mechanism, the spray water washing mechanism surrounds the outer peripheral surface of the reaction chamber (14), and a spiral spray channel (17) and a cooling chamber (16) are arranged in the spray water washing mechanism, the spray channel (17) is used for the circulation of semiconductor waste gas, and the bottom end of the spray channel (17) is connected to the bottom end of the reaction chamber (14); the cooling chamber (16) is located between the spray channel (17) and the outer wall of the reaction chamber (14); A water receiving pool (6), the water receiving pool (6) being arranged at the bottom of the spray channel (17), and the water receiving pool (6) being connected to a high-pressure water pump (22) capable of pumping water in the pool into the cooling chamber (16); A heater (18), wherein the heater (18) is arranged in a reaction chamber (14), the heater (18) is connected to a driving mechanism (5), and the driving mechanism (5) can drive the heater (18) to move vertically and rotate, an outlet pipe (20) connected to the bottom end of the reaction chamber (14) is arranged below the heater (18), and the outlet pipe (20) is provided with a sleeve (21) that can automatically release the positioning, a side opening (2001) is arranged on one side of the outlet pipe (20), and a flushing component (26) connected to a high-pressure water pump (22) is arranged on one side of the side opening (2001); A filtering mechanism (12), wherein the filtering mechanism (12) is connected to an exhaust pipe (9), and the exhaust pipe (9) is in communication with the top end of the reaction chamber (14).

2. The semiconductor manufacturing process waste gas treatment system according to claim 1, characterized in that: The top and bottom ends of the reaction chamber (14) are respectively fixedly mounted with an upper cover (3) and a lower cover (4); the driving mechanism (5) is mounted on the upper cover (3), and the driving mechanism (5) comprises a screw (501), a carrier (502), a fixing nut (503), a prism (504) and a motor (505); a fixing nut (503) is fixedly mounted in the middle of the upper cover (3); the screw (501) and the fixing nut (503) are connected to each other. The female (503) is threadedly connected, and the bottom end of the screw (501) is fixedly connected to the top end of the heater (18). A matching hole with a top opening is opened at the axis of the screw (501), and the matching hole is matched and connected with the prism (504). The top end of the prism (504) is fixedly connected to the output shaft end of the motor (505). The carrier (502) is fixedly installed on the top surface of the upper cover (3), and the motor (505) is fixedly connected to the top of the carrier (502).

3. The semiconductor manufacturing process waste gas treatment system according to claim 2, characterized in that: The spray water washing mechanism comprises an outer cylinder (1), an inner cylinder (13) and a spray pipe (15); the outer cylinder (1), the inner cylinder (13) and the reaction chamber (14) are coaxially arranged, the top end of the outer cylinder (1) and the top end of the inner cylinder (13) are both fixedly connected to the bottom surface of the upper cover (3), the bottom end of the outer cylinder (1) and the bottom end of the inner cylinder (13) are both fixedly connected to the top surface of the lower cover (4), the spray pipe (15) is arranged between the outer cylinder (1) and the inner cylinder (13), and a cooling chamber (16) is formed between the inner cylinder (13) and the outer wall of the reaction chamber (14).

4. The semiconductor manufacturing process waste gas treatment system according to claim 3, characterized in that: The spray pipe (15) comprises a spiral blade (1501), a spiral tube (1502), a partition (1503) and a spray head (1504); the spiral blade (1501) is fixedly installed between the outer cylinder (1) and the inner cylinder (13); an annular groove is formed between the outer cylinder (1) and the inner cylinder (13); the annular groove is divided into spray channels (17) by the spiral blade (1501); the spiral tube (1502) is fixedly laid in the length direction of the spiral blade (1501); and the spiral tube (1502) is arranged along the length direction. A plurality of evenly distributed spray heads (1504) are installed, the top end of the spiral tube (1502) is closed, and the bottom end of the spiral tube (1502) is open, the open end of the spiral tube (1502) is connected to a high-pressure water inlet pipe (8) fixedly connected to the wall of the outer cylinder (1), and the high-pressure water inlet pipe (8) extends to the outside of the outer cylinder (1); a partition plate (1503) is fixedly installed at the top end of the spiral blade (1501), the top end of the spray channel (17) is connected to an exhaust gas inlet pipe (11), and the exhaust gas inlet pipe (11) is fixedly connected to the upper cover (3).

5. The semiconductor manufacturing process waste gas treatment system according to claim 4, characterized in that: The lower cover (4) comprises a first sealing plate (401), a second sealing plate (402), a connecting strip (403) and an outer ring (404); the first sealing plate (401) is fixedly sealed to the bottom of the cooling chamber (16), the second sealing plate (402) is fixedly sealed to the bottom end of the reaction chamber (14), the first sealing plate (401) and the outer ring (404) are fixedly connected via a plurality of connecting strips (403), a lower water trough is formed between every two adjacent connecting strips (403), the lower water trough is located between the spray channel (17) and the water receiving pool (6), the top of the water receiving pool (6) is fixedly connected to the bottom surface of the lower cover (4), and a filter screen (601) is installed inside the water receiving pool (6).

6. The semiconductor manufacturing process waste gas treatment system according to claim 5, characterized in that: The bottom end of the spray channel (17) is connected to a first gas pipe (7) fixedly connected to the wall of the outer cylinder (1); the first gas pipe (7) is fixedly connected to a second gas pipe (19); the second gas pipe (19) is fixedly connected to a second blocking plate (402); and the second gas pipe (19) is connected to the bottom end of the reaction chamber (14).

7. The semiconductor manufacturing process waste gas treatment system according to claim 1, characterized in that: The water inlet of the high-pressure water pump (22) is connected to a first water pipe (23), the first water pipe (23) is connected to the bottom of the water receiving pool (6), the water outlet of the high-pressure water pump (22) is connected to a three-way pipe (24), the two ends of the three-way pipe (24) are respectively installed with a first electrically controlled valve (28) and a second electrically controlled valve (29), the first electrically controlled valve (28) is connected to a second water pipe (25), the second water pipe (25) is connected to the bottom of the cooling chamber (16), and the top of the cooling chamber (16) is connected to a drain port (10), the drain port (10) is fixedly connected to the upper cover (3); the second electrically controlled valve (29) is connected to the flushing component (26).

8. The semiconductor manufacturing process waste gas treatment system according to claim 7, characterized in that: The flushing assembly (26) comprises a fixed cylinder (2601), a movable tube (2602), a knife block (2603), a piston sleeve (2604) and a second spring (2605); one end of the fixed cylinder (2601) is fixedly connected to the second electric control valve (29), one end of the movable tube (2602) is fixedly sleeved with the piston sleeve (2604), and the outer ring of the piston sleeve (2604) is matched with the inner wall of the fixed cylinder (2601), and the movable tube (2602) and the fixed cylinder (2601) are far away from the second electric control valve (29). One end of the two electrically controlled valves (29) are matched and connected, and the movable tube (2602) extends to the outside of the fixed tube (2601), a second spring (2605) is arranged inside the movable tube (2602), and the two ends of the second spring (2605) are respectively fixed to the movable tube (2602) and the fixed tube (2601), and a water spray hole is arranged at one end of the movable tube (2602) away from the piston sleeve (2604); the knife block (2603) is fixed to the movable tube (2602) below the water spray hole.

9. The semiconductor manufacturing process waste gas treatment system according to claim 8, characterized in that: The invention also comprises a connecting ring (27), wherein the connecting ring (27) is connected to the sealing sleeve (21); the connecting ring (27) comprises a ring seat (2701), a sealing gasket (2702), a slot (2703) and a chamfer (2704); the ring seat (2701) is fixedly connected to the bottom surface of the lower sealing cover (4), and the ring seat (2701) is coaxially arranged with the outlet pipe (20), and the sealing gasket (2702) is fixedly installed in the ring seat (2701). The inner edge of the bottom of the ring seat (2701) is provided with a chamfer (2704), and the inner wall of the ring seat (2701) is provided with a slot (2703); the sleeve (21) comprises a sleeve (2101), a guide sleeve (2102), a first spring (2103), an inclined plug (2104), a connecting rod (2105), a guide groove (2106) and a sealing ring (2107); the bottom end of the sleeve (2101) is closed, The top of the sleeve (2101) is open, a sealing ring (2107) is fixedly installed on the inner wall of the closed end of the sleeve (2101), the guide sleeve (2102) is fixedly installed on one side of the outer wall of the sleeve (2101), the inclined surface plug (2104) is matched with the guide sleeve (2102), and a first spring (2103) is arranged in the guide sleeve (2102), and the two ends of the first spring (2103) are respectively connected to the inclined surface plug (2104) and the guide sleeve (2102) are fixedly connected, and one end of the inclined surface of the inclined surface of the inclined surface block (2104) is embedded in the slot (2703), and a guide groove (2106) is provided at the bottom of the guide sleeve (2102), and the guide groove (2106) is slidably connected to the connecting rod (2105), and the top end of the connecting rod (2105) is fixedly connected to the inclined surface block (2104), and the connecting rod (2105) is located on one side of the knife block (2603).

10. The semiconductor manufacturing process waste gas treatment system according to claim 1, characterized in that: The filtering mechanism (12) comprises a box (1201), a connecting pipe (1202), a filter (1203) and a fan (1204); the box (1201) is fixedly connected to the outer wall of the outer cylinder (1); the fan (1204) is fixedly installed on one side of the box (1201); a filter (1203) is arranged inside the box (1201); a connecting pipe (1202) is fixedly connected to the top of the box (1201); the connecting pipe (1202) is fixedly connected to the exhaust pipe (9); and the bottom of the box (1201) is connected to the air inlet of the fan (1204).

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