Heat pump integrated machine and heat pump system

Abstract

The present application discloses a heat pump integrated machine and a heat pump system, which relates to the field of HVAC technology, including a shell, a heat sink, a circuit board, a heat exchange component and a water cooling component. The heat exchange component is arranged in a cavity, and the heat exchange component includes a shell and a heat exchange tube. A water cavity is formed between the shell and the heat exchange tube. The surface of the shell has a water inlet and a water outlet connected to the water cavity. The water cooling component includes a pump body and a water pipe. The water pipe has a water outlet and a water inlet, and both the water outlet and the water inlet are connected to the water cavity. The heat sink is a water-cooled heat sink, and the water pipe provides cooling water for the heat sink. The pump body is connected to the water pipe. Heat is exchanged with water in the water cavity through the heat exchange tube, and the water exchanged in the water cavity is sucked into the water pipe by the pump body in the water cooling component, thereby providing cooling water for the heat sink, and taking away the heat of the heat sink. Since the water in the water pipe has a certain temperature after heat exchange in the water cavity, the temperature difference with the temperature of the heat sink can be reduced, thereby reducing the probability of condensation.

Description

Technical Field

[0001] The present application relates to the field of HVAC technology, and in particular to an all-in-one heat pump and a heat pump system. Background Art

[0002] The electrical control board of the heat pump product is used to control the start and stop of the heat pump water heater and the heat exchange work. There are various heating devices on the electrical control board. When working, due to the high voltage and large current passing through, it will generate a lot of heat. If the heat is not conducted in time, it will cause excessive temperature rise and damage the components.

[0003] In the related art, fans or refrigerant heat exchange are generally used for heat dissipation. When the operating environment is harsh and the ambient temperature is high, the heat sink thermally connected to the electronic control board has poor thermal conductivity, and the fan cannot take away the heat of the heat sink in time. When refrigerant is used for heat exchange and heat dissipation, condensation is easily generated due to the large temperature difference, so the heat dissipation effect is not ideal. Summary of the invention

[0004] The embodiments of the present application provide an all-in-one heat pump and a heat pump system, which can ensure good heat conduction effect while reducing the probability of condensation.

[0005] In a first aspect, an embodiment of the present application provides a heat pump integrated machine, comprising:

[0006] a housing formed with a cavity;

[0007] A heat sink is disposed in the cavity, and a first temperature sensing probe is disposed on the heat sink;

[0008] A circuit board, relatively fixed on the heat sink;

[0009] A heat exchange component is arranged in the shell, the heat exchange component includes an outer shell and a heat exchange tube arranged in the outer shell, a water passage cavity is formed between the outer shell and the heat exchange tube, and the outer shell surface has a water inlet and a water outlet connected to the water passage cavity; and

[0010] The water cooling component includes a pump body and a water pipe, wherein the water pipe has a water outlet and a water inlet, wherein the water outlet and the water inlet are both connected to the water passage cavity, the heat sink is a water-cooled heat sink, the water pipe provides cooling water for the heat sink, the pump body is connected to the water pipe, and the pump body runs at a corresponding speed according to the temperature detected by the first temperature sensing probe.

[0011] In some embodiments, the heat exchange tube constitutes an energy release flow path, the water flow chamber constitutes an energy charging flow path, the energy release flow path is parallel to the energy charging flow path and flows in the opposite direction, the water inlet is located upstream of the energy charging flow path, and the water outlet is located downstream of the energy charging flow path.

[0012] In some of the embodiments, the water inlet is located upstream of the charging flow path, and the water outlet is located downstream of the charging flow path.

[0013] In some embodiments, the heat pump integrated machine further includes a regulating valve, the regulating valve includes a first interface, a second interface and a third interface, the water pipe includes a first water pipe, a second water pipe and a third water pipe, the water inlet end includes a first water inlet end and a second water inlet end, the first water inlet end is located upstream of the water channel in the water passage cavity, and the second water inlet end is located downstream of the water channel in the water passage cavity;

[0014] The first water pipe is connected to the first interface and the first water inlet, the second water pipe is connected to the second interface and the second water inlet, one end of the third water pipe is connected to the third interface, the other end of the third water pipe forms the water outlet, and the third water pipe can be selectively connected to the first interface or the second interface;

[0015] The first temperature sensing probe is used to detect the temperature T of the surface of the heat sink, and when the temperature T is not less than the fifth preset temperature T 5 When the first interface is connected to the third interface, when the temperature T is less than the fifth preset temperature T 5 When the second interface is connected to the third interface.

[0016] In some embodiments, the heat sink comprises:

[0017] A plate body, the plate body having a first side and a second side opposite to each other, the circuit board is arranged on the first side, and the second side is provided with a groove; and

[0018] A heat dissipation pipe is arranged in the groove and is adapted to the shape of the groove;

[0019] Wherein, the heat dissipation pipe is communicated with the water pipe.

[0020] In some embodiments, a heat conductor is provided on the wall surface of the groove.

[0021] In some embodiments, the plate has a first area and a second area, and electrical components are disposed on both the first area and the second area, and the number of electrical components located in the first area is greater than the number of electrical components located in the second area;

[0022] The heat dissipation pipe located in the first area forms a first circulation cavity, and the heat dissipation pipe located in the second area forms a second circulation cavity, and the volume of the first circulation cavity is greater than the volume of the second circulation cavity.

[0023] In some embodiments, the length of the heat dissipation pipe in the first area is greater than the length of the heat dissipation pipe in the second area.

[0024] In some embodiments, the diameter of the heat dissipation pipe located in the first area is larger than the diameter of the heat dissipation pipe located in the second area.

[0025] In some embodiments, the heat dissipation pipe has two first connection ends, and the first connection ends extend to the edges of the plate body and are connected to the water pipe.

[0026] In some embodiments, the water pipe has two second connection ends, and the two second connection ends are correspondingly connected to the two first connection ends;

[0027] Wherein, the first connection end and the second connection end are connected via a flange, or the first connection end and the second connection end are snap-connected.

[0028] In some embodiments, a groove is provided on the surface of the heat sink, and a portion of the water pipe is located in the groove and matches the shape of the groove.

[0029] Some of the embodiments further include a wind wheel assembly and a heat exchanger, both of which are disposed in the cavity, and at least a portion of the heat exchanger is distributed in sequence with the heat sink, the circuit board and the wind wheel assembly along the thickness direction of the circuit board.

[0030] In some embodiments, the heat pump integrated machine further includes a controller electrically connected to the first temperature sensing probe and the pump body, the first temperature sensing probe being used to detect the temperature T on the surface of the heat sink; and

[0031] Wherein, the controller is configured to be such that when the temperature T is not less than the first preset temperature T 1 When the pump body is controlled to run at a first speed, the temperature T is not greater than the second preset temperature T 2 When the pump body is controlled to run at a second speed or stop running; the first preset temperature T 1 When it is greater than the second preset temperature T 2 , the first rotational speed is greater than the second rotational speed.

[0032] In some embodiments, a second temperature sensing probe is provided on the surface of the housing, and the second temperature sensing probe is used to detect the air temperature T 3 , the T 1 , T 2 Satisfaction: T 4 ≤T 2 ≤T 3 +10℃, T 3+10℃≤T 1 ≤T 3 +40℃, where T 4 is the condensation temperature.

[0033] In some embodiments, the pump body includes at least one of a self-priming pump and an impeller pump.

[0034] In a first aspect, an embodiment of the present application provides a heat pump system, comprising:

[0035] Water use units; and

[0036] According to the above-mentioned integrated heat pump machine, the water-using unit is connected to the integrated heat pump machine through a pipeline.

[0037] The heat pump integrated machine and the heat pump system based on the embodiment of the present application include a housing, a heat sink, a circuit board, a heat exchange component and a water cooling component. Heat is exchanged with water in a water passage cavity through a heat exchange pipe. The water exchanged in the water passage cavity is sucked into the water pipe through a pump body in the water cooling component, thereby providing cooling water for the heat sink and taking away the heat of the heat sink. Since the water in the water pipe has a certain temperature after heat exchange in the water passage cavity, the temperature difference with the temperature of the heat sink can be reduced, thereby reducing the probability of condensation.

[0038] In addition, by running the pump body at a corresponding speed according to the temperature detected by the first temperature sensing probe, unnecessary energy consumption can be reduced, thereby achieving energy-saving effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0040] Figure 1 A schematic diagram of the structure of the first perspective of the interior of the integrated heat pump provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of the structure of the heat pump integrated machine from a second perspective provided in an embodiment of the present application;

[0042] Figure 3 A schematic diagram of the structure of the heat pump integrated machine from a third perspective provided in an embodiment of the present application;

[0043] Figure 4 A schematic diagram of the structure of the heat pump integrated machine from a fourth perspective provided in an embodiment of the present application;

[0044] Figure 5A schematic diagram of the structure of the fifth perspective of the internal structure of the integrated heat pump provided in the embodiment of the present application;

[0045] Figure 6 A schematic diagram of the structure of the heat sink and heat exchange assembly provided in an embodiment of the present application;

[0046] Figure 7 for Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle.

[0047] Reference numerals in the figures:

[0048] 100. Shell;

[0049] 200, heat sink; 210, plate body; 210a, groove; 220, heat pipe;

[0050] 300, circuit board;

[0051] 400, heat exchange component; 410, housing; 410a, water passage chamber; 410b, water inlet; 410c, water outlet;

[0052] 500, water cooling assembly; 510, pump body; 520, water pipe; 521, first water pipe; 522, second water pipe; 523, third water pipe; 520a, water outlet; 520b, water inlet;

[0053] 600, wind wheel assembly;

[0054] 700, heat exchanger; 710, first part; 720, second part; 730, third part;

[0055] 800, regulating valve; 800a, first interface; 800b, second interface; 800c, third interface. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0057] See also Figure 1-2 The embodiment of the present application provides a heat pump system, which is used for heating, including a water unit and an integrated heat pump. The water unit and the integrated heat pump are connected and circulated through a pipeline. The integrated heat pump can heat the water unit so that the water unit can reach a preset temperature. After the temperature of the water unit drops, it is heated again by the integrated heat pump, thus forming a complete heating cycle.

[0058] Among them, the water use unit can be a domestic water module, a swimming pool water module, a heating module, etc.

[0059] When the water unit is a domestic water module, the module is mainly used to meet the hot water needs in daily life, such as bathing, washing, etc. When the water temperature of the domestic water module drops to a preset value, the heat pump integrated machine will automatically start to provide heat energy for the domestic water module to ensure that the water temperature is always kept within a comfortable range. At this time, the heat pump system also includes a water replenishment unit, which can be connected to municipal water to replenish the water used by the entire heat pump system.

[0060] When the water use unit is a swimming pool water module, the swimming pool water module can maintain a stable water temperature through the heating effect of the heat pump integrated machine, providing a comfortable swimming environment for swimmers.

[0061] When the water-using unit is a heating module, it is used to provide heat for the indoor space. The heating module usually includes terminal heating equipment such as radiators and floor heating pipes. These devices are connected to the water-using unit through pipes. When the indoor temperature drops to a preset value, the heat pump integrated machine will start and heat the water-using unit. Then the heat is transferred to the indoor space through the radiator or floor heating pipe to achieve a heating effect.

[0062] Of course, in some embodiments, the water use unit may also include a domestic water module, a swimming pool water module and a heating module to achieve a multi-purpose function. In the embodiment of the present application, the water use unit is described as swimming pool water.

[0063] See also Figure 1-3 The embodiment of the present application provides a heat pump integrated machine, including a housing 100 and a heat sink 200, a circuit board 300, a heat exchange component 400, a water cooling component 500, and a compressor and a heat exchanger 700 arranged in the housing 100.

[0064] The housing 100 is the external structure of the heat pump integrated machine, and mainly plays a protective role to prevent the internal components from being damaged by the external environment, such as dust, moisture, physical shock, etc. At the same time, it also provides a framework for installing and fixing the internal components.

[0065] The compressor has a heating mode and a cooling mode. The heat pump system based on the present application is mainly used to heat swimming pool water, so the compressor generally only operates in the heating mode.

[0066] In the heating mode, the compressor outputs high-temperature and high-pressure gaseous refrigerant, which is transmitted to the heat exchange component 400 and undergoes condensation and heat exchange to become a high-pressure and normal-temperature liquid refrigerant. The high-pressure and normal-temperature liquid refrigerant is further transmitted to the throttling component and undergoes throttling and pressure reduction to become a low-temperature and low-pressure gas-liquid mixed refrigerant. The low-temperature and low-pressure gas-liquid mixed refrigerant then enters the heat exchanger 700 and undergoes evaporation and heat exchange to become a low-temperature and low-pressure gaseous refrigerant. Finally, the low-temperature and low-pressure gaseous refrigerant flows back to the compressor, completing a complete heating cycle.

[0067] The circuit board 300 is the control center of the heat pump integrated machine, responsible for receiving user instructions, monitoring sensor data, controlling the switches of various components, and adjusting working parameters, etc. It contains various electronic components, such as microprocessors, relays, capacitors, etc., and realizes complex control logic through circuit connections, such as controlling the start and stop and power of the compressor.

[0068] The heat sink 200 is thermally connected to the circuit board 300, and can transfer the heat generated by the circuit board 300, the compressor and other heating components to ensure that these components operate within the normal operating temperature range. The heat sink 200 may be made of metal, such as aluminum or copper, which has good thermal conductivity.

[0069] The heat sink 200 is mounted on the circuit board 300 through threaded fasteners. During assembly, the electronic components can be bonded to the heat sink 200 through thermally conductive adhesive, and then further fixed through threaded fasteners, and then the heat sink 200 is connected to the circuit board 300 through threaded fasteners, and finally the pins of the electronic components are welded to the circuit board 300, thereby completing the assembly of the circuit board 300 and the heat sink 200.

[0070] The heat exchange assembly 400 is disposed in the cavity and includes a housing 410 and a heat exchange tube disposed in the housing 410. The housing 410 is the main structure of the heat exchange assembly 400, which surrounds and protects the internal heat exchange tube. The housing 410 is usually made of corrosion-resistant, high-strength materials, such as stainless steel or titanium alloy, to ensure its long-term stable operation.

[0071] The heat exchange tube is connected to the compressor. In the heating mode, the high-temperature and high-pressure gaseous refrigerant output by the compressor first passes through the heat exchange tube and then through the heat exchanger 700 before finally flowing back to the compressor, forming a heating cycle.

[0072] A water passage cavity 410a is formed between the outer shell 410 and the heat exchange tube. The surface of the outer shell 410 has a water inlet 410b and a water outlet 410c connected to the water cavity 410a. The water inlet 410b and the water outlet 410c are connected to the swimming pool through pipes. The water in the swimming pool enters the water passage cavity 410a through the water inlet 410b. The water exchanges heat with the heat exchange tube in the water passage cavity 410a, thereby increasing the temperature of the swimming pool water. The swimming pool water with the increased water temperature flows back to the swimming pool through the water outlet 410c, so that the swimming pool water always maintains a certain water temperature.

[0073] The water cooling assembly 500 includes a pump body 510 and a water pipe 520. The pump body 510 is arranged on the water pipe 520. The water pipe 520 has a water outlet end 520a and a water inlet end 520b. The water outlet end 520a and the water inlet end 520b are both connected to the water cavity 410a. The heat sink 200 is a water-cooled heat sink 200. The water pipe 520 provides cooling water for the heat sink 200. The pump body 510 is connected to the water pipe 520, that is, the pump body 510 draws water from the water cavity 410a to provide cooling water for the heat sink 200. In the present application, since the water has a certain temperature after heat exchange in the water cavity 410a, it can reduce the temperature difference with the temperature of the heat sink 200. Therefore, when the heat sink 200 is cooled, the probability of condensation is reduced.

[0074] In addition, the temperature of the water drawn from the water chamber 410a to the water pipe 520 by the pump body 510 is generally around 30°, and when the heat pump is in operation, the surface temperature of the heat sink 200 is 80°. Therefore, the water in the water pipe 520 can exchange heat with the heat sink 200, and the water in the water pipe 520 will further heat up and flow back into the water chamber 410a, thereby improving the utilization of resources and reducing energy loss.

[0075] It should be understood that in the embodiment of the present application, the water pipe 520 directly draws swimming pool water in the heat exchange component 400 as cooling water and provides it to the heat sink 200, that is, there is no need to set up additional pipes to connect with external cooling water. In this way, the number and length of external pipes can be reduced, the installation cost is reduced, and the structure of the system is simplified.

[0076] On the other hand, since the water pipe 520 does not require an external pipeline, after heat exchange through the heat sink 200, the pool water with increased temperature directly flows back to the water chamber 410a, and further flows back to the swimming pool through the water outlet 410c. That is, the entire process reduces the heat loss and resistance loss of the external pipeline connected to the water pipe 520, and the energy utilization efficiency of the system is also improved.

[0077] In addition, since the first temperature sensing probe is provided on the heat sink 200, the temperature of the heat sink 200 can be detected, and the operation of the pump body 510 can be guided by the temperature of the heat sink 200. For example, when the temperature of the heat sink 200 is high, the rotation speed of the pump body 510 can be appropriately increased. When the temperature of the heat sink 200 is low, the rotation speed of the pump body 510 can be reduced to reduce the flow rate of the swimming pool water in the water pipe 520. In this way, unnecessary energy consumption can be reduced and energy-saving effects can be achieved.

[0078] In some embodiments, the flow path of the refrigerant in the heat exchange tube constitutes an energy release flow path, and the swimming pool water in the water chamber 410a constitutes an energy charging flow path. The refrigerant output by the compressor is in the energy release flow path. Since the refrigerant exchanges heat with the swimming pool water, the temperature of the refrigerant gradually decreases from upstream to downstream in the energy release flow path. Therefore, the water temperature of the swimming pool water will be higher near the upstream position of the energy release flow path. Therefore, in the embodiment of the present application, the energy release flow path is parallel to the energy charging flow path and flows in opposite directions. The water inlet 410b is located upstream of the energy charging flow path, and the water outlet 410c is located downstream of the energy charging flow path, that is, the flow direction of the refrigerant is opposite to that of the swimming pool water.

[0079] Since in the charging flow path, the temperature upstream is lower and the temperature downstream is relatively higher, in the embodiment of the present application, the water outlet 410c connected to the swimming pool is arranged downstream of the charging flow path, so that the temperature of the swimming pool water returning from the water outlet 410c is the highest. In this way, the heat exchange efficiency of the heat exchange tube can be improved by setting the water outlet 410c and the water inlet 410b.

[0080] It can be understood that when the water in the water pipe 520 exchanges heat with the heat sink 200, the lower the water temperature in the water pipe 520, the better the heat exchange effect with the heat sink 200. In the discharge flow path, the temperature of the refrigerant gradually decreases from upstream to downstream. On the contrary, in the charging flow path, the temperature of the swimming pool water gradually increases from upstream to downstream. Therefore, in the embodiment of the present application, the water inlet end 520b of the water pipe 520 is located upstream of the charging flow path, and the water outlet end 520a is located downstream of the charging flow path. Therefore, the water temperature of the swimming pool water entering the water pipe 520 is relatively low, and the water outlet end 520a of the water pipe 520 is relatively low. After heat exchange, the pool water with increased temperature can enter the downstream of the charging flow path with higher water temperature, and finally flow back to the swimming pool through the outlet 410c. That is, although the temperature of the cooling water entering the water pipe 520 has increased to a certain extent, the increase is relatively small. In this way, the pool water in the water inlet pipe 520 can still exchange heat with the temperature of the heat sink 200, thereby taking away the temperature of the heat sink 200, and the heated pool water can reduce the temperature difference with the temperature of the heat sink 200. Therefore, when the heat sink 200 is dissipated, the probability of condensation can also be reduced.

[0081] In the implementation of the present application, the heat exchange time between the water in the water pipe 520 and the heat exchanger 700 is short, and the increase in its temperature is mainly achieved by heat exchange with the heat sink 200, thereby improving resource utilization and heat exchange efficiency.

[0082] Optionally, see Figure 5 The heat pump integrated machine further includes a regulating valve 800, the regulating valve 800 includes a first interface 800a, a second interface 800b and a third interface 800c, the water pipe 520 includes a first water pipe 521, a second water pipe 522 and a third water pipe 523, the water inlet end 520b includes a first water inlet end and a second water inlet end, the first water inlet end is located upstream of the water path in the water passage chamber 410a, and the second water inlet end is located downstream of the water path in the water passage chamber 410a;

[0083] The first water pipe 521 is connected to the first interface 800a and the first water inlet end, the second water pipe 522 is connected to the second interface 800b and the second water inlet end, one end of the third water pipe 523 is connected to the third interface 800c, and the other end of the third water pipe 523 forms a water outlet end. The third water pipe 523 can be selectively connected to the first interface 800a or the second interface 800b;

[0084] The first temperature sensing probe is used to detect the temperature T on the surface of the heat sink 200. When the temperature T is not less than the fifth preset temperature T 5 When the first interface 800a is connected to the third interface 800c, the temperature T is not greater than the sixth preset temperature T 6 When the second interface 800b is connected to the third interface 800c.

[0085] That is, when the circuit board 300 is working under load, the surface temperature of the circuit board 300 is relatively high, and the first temperature sensing probe located on the heat sink can also sense the surface temperature of the circuit board 300 in time. If the sensed temperature is not less than the fifth preset temperature T 5 When the sensed temperature is greater than or equal to the fifth preset temperature T 5 When the regulating valve 800 is controlled, the user can be guided to connect the first interface 800a with the third interface 800c. Since the first interface 800a is connected with the first water inlet end, and the first water inlet end is connected with the upstream of the water path in the water chamber 410a, the temperature of the upstream of the water path in the water chamber 410a is relatively low compared with the downstream. In this way, the circuit board 300 can be cooled down quickly.

[0086] It is understandable that after the first temperature sensing probe senses that the temperature on the surface of the heat sink 200 drops to a certain temperature, if the sensed temperature is less than the fifth preset temperature T 5When the user controls the regulating valve 800, the second interface 800b is connected to the third interface 800c. Since the second interface 800b is connected to the second water inlet end, and the first water inlet end is connected to the downstream of the water path in the water chamber 410a, and the temperature of the water in the downstream is relatively high, the cooling speed of the circuit board 300 can be slowed down and the probability of condensation on the circuit board 300 can be reduced.

[0087] Optionally, the regulating valve 800 can be a three-way solenoid valve, and a controller can be set to be electrically connected to the first temperature probe and the three-way solenoid valve, that is, signal connection can be achieved, that is, the controller can automatically adjust the first interface 800a to be connected to the first water inlet end, or the second interface 800b to be connected to the second water inlet end according to the temperature T feedback from the first temperature probe, thereby reducing the need for manual operation and improving the degree of automation of the system.

[0088] See also Figure 6 The heat sink 200 includes a plate body 210 and a heat sink 220. The plate body 210 has a first side and a second side opposite to each other. The circuit board 300 is arranged on the first side. A groove 210a is opened on the second side. The heat sink 220 is arranged in the groove 210a and is adapted to the shape of the groove 210a. The heat sink 220 is connected to the water pipe 520.

[0089] By arranging the heat dissipation pipe 220 in the groove 210a, the length of the entire water pipe 520 is reduced, and the space occupied by the water pipe 520 is saved, making the internal structure of the entire heat pump integrated machine more compact, meeting the miniaturization and lightweight design of the heat pump integrated machine.

[0090] On the other hand, the shape of the heat pipe 220 is compatible with the groove 210a, that is, the heat pipe 220 can make full use of the space of the groove 210a to increase the heat exchange area. A larger heat exchange area means higher heat dissipation efficiency, because more heat can be transferred to the cooling water in a shorter time. The shape of the groove 210a is not limited, and it can be an arc groove, a rectangular groove, etc.

[0091] In the embodiment of the present application, the material of the plate body 210 is aluminum alloy, and the material of the heat dissipation pipe 220 is copper. The aluminum alloy used as the material of the plate body 210 has the characteristics of light weight and good heat dissipation performance, and the copper tube used as the heat dissipation pipe 220 also has a good thermal conductivity effect.

[0092] The electrical components on the surface of the circuit board 300 are mainly arranged on the side of the circuit board 300 facing the heat sink 200. The board body 210 has a first area and a second area. Electrical components are arranged on both the first area and the second area, and the number of electrical components located in the first area is greater than the number of electrical components located in the second area. Therefore, the electrical components located in the first area have a high heat generation, while the number of electrical components located in the second area is small and the heat generation is low.

[0093] Alternatively, the electrical components on the surface of the circuit board 300 are mainly arranged on the side of the circuit board 300 facing away from the heat sink 200, and similarly, the number of electrical components located in the first area is large and the heat generation is high, while the number of electrical components located in the second area is small and the heat generation is low.

[0094] The heat dissipation pipe 220 located in the first area forms a first flow cavity, and the heat dissipation pipe 220 located in the second area forms a second flow cavity, and the volume of the first flow cavity is greater than the volume of the second flow cavity.

[0095] Therefore, in the first area, the water volume of the heat dissipation pipe 220 is greater than the water volume of the heat dissipation pipe 220 in the second area, that is, when the diameters of the heat dissipation pipes 220 are the same, the length of the heat dissipation pipes 220 in the first area is greater than the length of the heat dissipation pipes 220 in the second area. Specifically, the heat dissipation pipes 220 in the first area can be designed to be winding back and forth.

[0096] Or in another embodiment, the diameter of the heat dissipation pipe 220 in the first area is greater than the diameter of the heat dissipation pipe 220 in the second area.

[0097] Furthermore, a heat conductor is provided on the wall of the groove 210a, and at least a portion of the heat pipe 220 can be attached to the heat conductor. The heat of the heat sink 200 can be transferred to the heat pipe 220 more directly and efficiently through the heat conductor, thereby improving the heat dissipation efficiency of the entire heat dissipation system.

[0098] Among them, the heat conductor can be structures such as thermal conductive silicone, thermal paste and graphene heat sink. In the embodiment of the present application, thermal conductive silicone is preferred. The thermal conductive silicone can be bonded to the wall of the groove 210a by hot pressing, so that the heat pipe 220 can be in full contact with the thermal conductive silicone, thereby improving the heat exchange efficiency.

[0099] In the embodiment of the present application, the heat dissipation pipe 220 has two first connection ends and extends to the side of the plate body 210. The water pipe 520 also has two corresponding second connection ends. The first connection end can be connected to the corresponding second connection end through a flange, or the first connection end can be directly snap-connected to the second connection end to achieve communication between the water pipe 520 and the heat dissipation pipe 220.

[0100] Since the internal structure of the heat pump integrated machine is compact, based on the fact that the heat dissipation pipe 220 and the plate body 210 are an integral structure, they are assembled together during processing. When the heat pump integrated machine is finally assembled, it is only necessary to connect the second connection end of the water pipe 520 with the first connection end extending to the side of the plate body 210, which reduces the difficulty of installation and improves the installation efficiency.

[0101] Of course, it is understandable that in some embodiments, the water pipe 520 can also directly contact the second side of the plate body 210. In this way, the process of grooving on the second side can be reduced. Based on the fact that the water pipe 520 directly exchanges heat with the heat sink 200, the water pipe 520 is a pipe with a thermal conductivity effect such as a copper pipe or an aluminum pipe. Of course, a heat conductor can also be set at the position where the water pipe 520 contacts the heat sink 200, thereby improving the heat exchange effect between the water pipe 520 and the heat sink 200.

[0102] When the heat pump is working, that is, in heating mode, the compressor outputs high-temperature and high-pressure gaseous refrigerant, which is transmitted to the heat exchange component 400 and undergoes condensation and heat exchange to become a high-pressure liquid refrigerant at normal temperature. The high-pressure liquid refrigerant at normal temperature is further transmitted to the throttling component and undergoes throttling and pressure reduction to become a low-temperature and low-pressure gas-liquid mixed refrigerant. Then, the low-temperature and low-pressure gas-liquid mixed refrigerant enters the heat exchanger 700 and undergoes evaporation and heat exchange to become a low-temperature and low-pressure gaseous refrigerant. Finally, the low-temperature and low-pressure gaseous refrigerant flows back to the compressor, completing a complete heating cycle.

[0103] In the embodiment of the present application, in order to quickly remove the heat from the heat sink 200, the heat exchanger 700 is arranged near the heat sink 200. Since the temperature of the heat exchanger 700 is relatively low, the heat from the heat sink 200 can also be removed.

[0104] In some embodiments, in order to improve the heat exchange efficiency of the heat exchanger 700, please refer to Figure 1 , further comprising a wind wheel assembly 600, the wind wheel assembly 600 and the heat exchanger 700 are both arranged in the cavity, see Figure 7 At least part of the heat exchanger 700 is distributed in sequence with the heat sink 200 , the circuit board 300 and the wind wheel assembly 600 along the thickness direction of the circuit board 300 .

[0105] The wind wheel assembly 600 can accelerate the flow of gas in the cavity, which can not only improve the heat exchange efficiency of the heat exchanger 700, but also exchange the air on the surface of the heat sink 200 and the circuit board 300 with the outside air, thereby further improving the heat dissipation effect. It can be understood that when the wind wheel assembly 600 is running, the gas with a lower temperature near the heat exchanger 700 can pass through the radiator quickly, thereby quickly taking away the heat of the radiator.

[0106] The first temperature sensing probe is disposed on the surface of the heat sink 200 to accurately detect the temperature T on the surface of the heat sink 200 , and can obtain direct feedback on the heat dissipation efficiency in real time, providing data support for subsequent intelligent regulation.

[0107] The controller is electrically connected to the first temperature sensing probe and the pump body 510, that is, it can realize signal connection. The controller controls the operation of the pump body 510 according to the temperature detected by the first temperature sensing probe, that is, the controller automatically adjusts the operating state of the pump body 510 according to the temperature T fed back by the first temperature sensing probe, thereby realizing a dynamic balance between heat dissipation efficiency and energy consumption.

[0108] When the temperature T on the surface of the heat sink 200 is not less than the first preset temperature T1, the controller automatically adjusts the pump body 510 to run at the first speed (higher speed), which can quickly increase the flow rate of the swimming pool water in the water pipe 520, so that the heat can be quickly taken away, effectively preventing overheating and improving the overall heat dissipation efficiency. On the contrary, when the temperature T is not greater than the second preset temperature T2, the controller controls the pump body 510 to run at the second speed (lower speed) or completely stop running, that is, reduce the flow rate of the swimming pool water in the water pipe 520 or the water pipe 520 does not provide cooling water for the heat sink 200, so that unnecessary energy consumption can be reduced and energy saving effect can be achieved.

[0109] When the electrical components on the circuit board 300 are under low load or at a low temperature, the controller reduces the speed of the pump body 510 or stops the operation, thereby effectively reducing the noise and vibration generated by the operation of the pump body 510 and extending the service life of the pump body 510 to a certain extent.

[0110] Among them, the pump body 510 can be a self-priming pump or an impeller pump, or it can be a self-priming pump and an impeller pump at the same time. There is no limitation in the embodiment of the present application. Among them, when the pump body 510 is an impeller pump, the height of the inlet of the pump body 510 along the gravity direction needs to be lower than the water outlet 410c on the surface of the shell 410.

[0111] In a further embodiment of the present application, a second temperature sensing probe is provided on the surface of the housing 100, and the second temperature sensing probe is used to detect the air temperature T 3 , T 1 、T 2 Satisfaction: T 4 ≤T 2 ≤T 3 +10℃, T 3 +10℃≤T 1 ≤T 3 +40℃, where T 4 is the condensation temperature.

[0112] Generally, when the ambient temperature difference exceeds a certain threshold, condensation is easily formed on the surface of the heat sink 200, which poses a certain safety hazard.

[0113] Therefore, in the embodiment of the present application, by monitoring the air temperature T 3 , and combined with the condensation temperature T 4(usually a lower critical value, indicating that water vapor in the air is easy to condense at this temperature) to determine the first preset temperature T of the heat sink 200 surface. 1 and the second preset temperature T 2 , and then determine the rotation speed of the pump body 510, wherein the condensation temperature can be detected by existing technology, which is not explained in detail here, and the air temperature is in a real-time changing state, and then a program can be set to control the second temperature sensing probe to detect and monitor the air temperature at intervals of a period of time, for example, at intervals of 1h or 2h, etc., and no further restrictions are made here.

[0114] In another embodiment, the air temperature T 3 , and combined with the condensation temperature T 4 The operation of the heat pump integrated machine is controlled by controlling the operating efficiency of the electronic components to control the temperature of the surface of the heat sink 200.

[0115] It can be understood that by setting T 4 ≤T 2 ≤T 3 +10℃≤T 1 ≤T 3 The +40°C range can reduce the temperature difference between the surface of the heat sink 200 and the surrounding environment, thereby reducing the probability of condensation.

[0116] Combining the air temperature T3 with the surface temperature threshold T of the heat sink 200 1 and T 2 Setting (T 4 ≤T 2 ≤T 3 +10℃, T3+10℃≤T 1 ≤T 3 +40℃), the controller can more intelligently adjust the speed of the pump body 510. When the air temperature is moderate or high (i.e., T3 is high), the heat dissipation demand increases, and the controller will increase the speed of the pump body 510 to the first speed to enhance the heat dissipation effect; when the air temperature is low, i.e., T 3 Lower, but still higher than the condensation temperature T 4 Within a certain range, the heat dissipation demand is reduced, and the controller can reduce the speed of the pump body 510 to a second speed or stop running to achieve energy saving effect, while ensuring that the surface temperature of the heat dissipation plate 200 will not be too low to cause condensation.

[0117] See also Figure 7In the embodiment of the present application, the heat exchange component 400 is arranged on the side of the cavity and also on the side of the heat exchanger 700. In combination with at least part of the heat exchanger 700 being distributed in sequence with the heat sink 200, the circuit board 300 and the wind wheel assembly 600 along the thickness direction of the heat pump all-in-one, the two ends of the water pipe 520, namely the water outlet end 520a and the water inlet end 520b, both extend from one side of the heat sink 200 and face the heat exchange component 400. In this way, it is not only convenient to connect with the heat exchange component 400, but also saves materials, reduces space practicality, and makes the entire heat pump all-in-one miniaturized and lightweight design.

[0118] In order to improve the delivery efficiency of the pump body 510, the pump body 510 is located between the heat exchange assembly 400 and the heat exchanger 700. In this way, the pool water in the water chamber 410a can be quickly delivered to the water pipe 520, and the water in the water pipe 520 can also be quickly delivered to the water chamber 410a.

[0119] It should be understood that since the heat exchange assembly 400 and the pump body 510 are both disposed on one side of the heat exchanger 700, and the heat exchange assembly 400 and the pump body 510 both occupy a certain space in the cavity, in order not to affect the heat exchange efficiency of the heat exchanger 700, please refer to Figure 7 In the embodiment of the present application, the heat exchanger 700 includes a first part 710, a second part 720 and a third part 730. The first part 710 and the third part 730 are arranged at approximately right angles. The second part 720 is arc-shaped and connects the first part 710 and the third part 730. The arc-shaped second part 720 can effectively guide the flow of the refrigerant in the heat exchanger 700, reduce the eddy currents and turbulences that may be generated by the fluid at right-angle turns, thereby reducing energy loss and improving heat exchange efficiency. Through the smooth transition design, the resistance encountered by the refrigerant during the flow process is reduced, and the pressure drop is reduced, which is conducive to maintaining a stable fluid pressure and flow rate, and further ensuring the heat exchange efficiency.

[0120] Among them, see Figure 7 The first part 710 is distributed in sequence with the heat sink 200, the circuit board 300 and the wind wheel assembly 600 in the thickness direction of the heat pump all-in-one, and is attached to the inner wall of the shell 100, while the third part 730 is attached to the adjacent side wall of the inner wall, and the third part 730 is located on the side of the first part 710 away from the heat exchange assembly 400. In this way, the distribution of the water pipe 520 and the pump body 510 will not be affected, and the layout of the entire heat pump all-in-one can be compact and miniaturized.

[0121] The first part 710 , the second part 720 , and the third part 730 may be an integrally formed structure, or may be connected by welding, which is not limited in the embodiment of the present application.

[0122] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0123] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A heat pump integrated machine, characterized in that: include: a housing, forming a cavity; A heat sink is disposed in the cavity, and a first temperature sensing probe is disposed on the heat sink; A circuit board, relatively fixed on the heat sink; A heat exchange component is arranged in the cavity, the heat exchange component comprises a shell and a heat exchange tube arranged in the shell, a water passage cavity is formed between the shell and the heat exchange tube, and a water inlet and a water outlet communicating with the water passage cavity are provided on the surface of the shell; as well as A water cooling component includes a pump body and a water pipe, wherein the water pipe has a water outlet and a water inlet, wherein the water outlet and the water inlet are both connected to the water passage cavity, the heat sink is a water-cooled heat sink, the water pipe provides cooling water for the heat sink, the pump body is connected to the water pipe, and the pump body runs at a corresponding speed according to the temperature detected by the first temperature sensing probe; The heat pump integrated machine further includes a regulating valve, the regulating valve includes a first interface, a second interface and a third interface, the water pipe includes a first water pipe, a second water pipe and a third water pipe, the water inlet end includes a first water inlet end and a second water inlet end, the first water inlet end is located upstream of the water channel in the water passage cavity, and the second water inlet end is located downstream of the water channel in the water passage cavity; The first water pipe is connected to the first interface and the first water inlet, the second water pipe is connected to the second interface and the second water inlet, one end of the third water pipe is connected to the third interface, and the other end of the third water pipe forms the water outlet. The third water pipe can be selectively connected to the first interface or the second interface.

2. The heat pump integrated machine according to claim 1, characterized in that: The heat exchange tube constitutes an energy release flow path, the water flow chamber constitutes an energy charging flow path, the energy release flow path is parallel to the energy charging flow path and flows in the opposite direction, the water inlet is located upstream of the energy charging flow path, and the water outlet is located downstream of the energy charging flow path.

3. The integrated heat pump according to claim 2, characterized in that: The water inlet end is located upstream of the charging flow path, and the water outlet end is located downstream of the charging flow path.

4. The heat pump integrated machine according to claim 1, characterized in that: The first temperature sensing probe is used to detect the temperature T of the surface of the heat sink. When the temperature T is not less than the fifth preset temperature T5, the first interface is connected to the third interface. When the temperature T is less than the fifth preset temperature T5, the second interface is connected to the third interface.

5. The integrated heat pump according to claim 1, characterized in that: The heat sink comprises: A plate body, the plate body having a first side and a second side opposite to each other, the circuit board is arranged on the first side, and the second side is provided with a groove; and A heat dissipation pipe is arranged in the groove and is adapted to the shape of the groove; Wherein, the heat dissipation pipe is communicated with the water pipe.

6. The integrated heat pump according to claim 5, characterized in that: The wall surface of the groove is provided with a heat conductor.

7. The integrated heat pump according to claim 5, characterized in that: The plate body has a first area and a second area, and electrical components are disposed on the first area and the second area, and the number of electrical components located in the first area is greater than the number of electrical components located in the second area; The heat dissipation pipe located in the first area forms a first circulation cavity, and the heat dissipation pipe located in the second area forms a second circulation cavity, and the volume of the first circulation cavity is greater than the volume of the second circulation cavity.

8. The integrated heat pump according to claim 7, characterized in that: The length of the heat dissipation pipe in the first area is greater than the length of the heat dissipation pipe in the second area.

9. The integrated heat pump according to claim 7, characterized in that: The diameter of the heat dissipation pipe located in the first area is greater than the diameter of the heat dissipation pipe located in the second area.

10. The integrated heat pump according to claim 5, characterized in that: The heat dissipation pipe has two first connection ends, and the first connection ends extend to the edges of the plate body and are connected to the water pipe.

11. The integrated heat pump according to claim 10, characterized in that: The water pipe has two second connection ends, and the two second connection ends are correspondingly connected to the two first connection ends; Wherein, the first connection end and the second connection end are connected via a flange, or the first connection end and the second connection end are snap-connected.

12. The integrated heat pump according to claim 1, characterized in that: A groove is provided on the surface of the heat dissipation plate, and part of the water pipe is located in the groove and is adapted to the shape of the groove.

13. The integrated heat pump according to claim 1, characterized in that: It also includes a wind wheel assembly and a heat exchanger, which are both arranged in the cavity, and at least part of the heat exchanger is distributed in sequence with the heat sink, the circuit board and the wind wheel assembly along the thickness direction of the circuit board.

14. The integrated heat pump according to claim 1, characterized in that: The heat pump integrated machine further includes a controller, the controller is electrically connected to the first temperature sensing probe and the pump body, the first temperature sensing probe is used to detect the temperature T of the surface of the heat sink; and Wherein, the controller is configured to control the pump body to operate at a first speed when the temperature T is not less than a first preset temperature T1, and to control the pump body to operate at a second speed or stop operating when the temperature T is not greater than a second preset temperature T2; the first preset temperature T1 is greater than the second preset temperature T2, and the first speed is greater than the second speed.

15. The integrated heat pump according to claim 14, characterized in that: A second temperature sensing probe is provided on the surface of the shell, and the second temperature sensing probe is used to detect the air temperature T3. The T1 and T2 satisfy: T4≤T2≤T3+10℃, T3+10℃≤T1≤T3+40℃, wherein T4 is the condensation temperature.

16. The integrated heat pump according to claim 1, characterized in that: The pump body includes at least one of a self-priming pump and an impeller pump.

17. A heat pump system, characterized in that: include Water use units; and According to the integrated heat pump machine according to any one of claims 1 to 16, the water use unit is connected to the integrated heat pump machine through a pipeline.

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