Circuit board detection device and method

Abstract

The invention discloses a circuit board detection device and method, and relates to the technical field of circuit board detection.The circuit board detection device comprises a transfer mechanism, a camera assembly and a backlight source assembly, and the transfer mechanism is used for bearing a circuit board to move; the camera assembly is arranged above the transfer mechanism; the camera assembly is used for detecting the circuit board when the circuit board moves to a preset detection area; the backlight source assembly is arranged below the transfer platform; the backlight source is used for carrying out backlight illumination on the circuit board in the process that the camera assembly detects the circuit board. Due to the adoption of the backlight source assembly, various characteristics including but not limited to straight edges, arc edges, bosses, blind holes, through holes, expansion and shrinkage holes, honeycomb holes and the like on the circuit board can be clearly identified, so that the detection accuracy of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board detection, and in particular to a circuit board detection device and method. Background Art

[0002] With the rapid development of the electronics industry, circuit boards, as a key component of electronic equipment, have a quality that is directly related to the performance and reliability of the entire electronic product. Therefore, the inspection of circuit board quality is becoming increasingly important. Traditionally, circuit board inspection mainly relies on manual visual inspection, however, this method is inefficient and easily interfered by human factors, thus affecting the accuracy of the inspection results. Summary of the invention

[0003] The main purpose of this application is to provide a circuit board detection device and method, aiming to improve the accuracy of circuit board detection.

[0004] To achieve the above purpose, the circuit board detection device proposed in this application includes:

[0005] A transfer mechanism, used for carrying and moving the circuit board;

[0006] A camera assembly is disposed above the transfer mechanism; the camera assembly is used to detect the circuit board when the circuit board moves to a preset detection area;

[0007] The backlight source assembly is arranged below the transfer platform; the backlight source is used to provide backlight illumination to the circuit board during the process of the camera assembly detecting the circuit board.

[0008] In one embodiment, the transfer mechanism comprises:

[0009] A first guide rail, one side of the first guide rail is a loading side, and the other side of the first guide rail is a return side;

[0010] The transfer platform is slidably connected to the first guide rail, and the transfer platform is set to a transparent material; the transfer platform is used to carry the circuit board and move along the first guide rail between the loading side and the return side.

[0011] In one embodiment, the camera assembly comprises:

[0012] A line scan camera, movably arranged above the transfer mechanism;

[0013] The area array camera is movably arranged above the transfer mechanism; the area array camera is arranged on a side of the line scan camera away from the loading side.

[0014] In one embodiment, the circuit board detection device further includes:

[0015] A second guide rail is slidably connected to the line scan camera, and the second guide rail is arranged perpendicular to the first guide rail; the second guide rail is used to move the line scan camera along the vertical direction of the first guide rail;

[0016] The third guide rail is slidably connected to the area array camera, and the third guide rail is arranged perpendicular to the first guide rail; the third guide rail is used to move the area array camera along the vertical direction of the first guide rail.

[0017] In one embodiment, the area array camera is provided in plurality.

[0018] In one embodiment, the circuit board detection device further includes:

[0019] The coaxial linear light source is arranged between the line scanning camera and the transfer mechanism.

[0020] In one embodiment, the circuit board detection device further includes:

[0021] A first ring light source is arranged at a first height position above the transfer mechanism;

[0022] The second ring light source is arranged at a second height position above the transfer mechanism.

[0023] The present application also proposes a circuit board detection method, which is based on the circuit board detection device, the circuit board detection device includes a transfer mechanism, a camera assembly and a backlight source assembly, and the camera assembly includes:

[0024] A line scan camera, movably arranged above the transfer mechanism;

[0025] An area array camera is movably arranged above the transfer mechanism; the area array camera is arranged on a side of the line scan camera away from the feeding side;

[0026] The circuit board detection method comprises:

[0027] Acquire multiple features to be detected of the circuit board and the positional relationship between the multiple features to be detected;

[0028] Controlling the transfer mechanism to move the printed circuit board, and controlling the line scan camera to work to detect the plurality of features to be detected;

[0029] When the line scan camera detects a preset number of features to be detected, the positions of the remaining features to be detected are estimated according to the features to be detected detected by the line scan camera and the positional relationship between the multiple features to be detected;

[0030] The area array camera is controlled to move to a position corresponding to the position of the remaining features to be detected so as to detect them.

[0031] In one embodiment, the feature to be detected includes at least one of a straight edge, an arc edge, a boss, a blind hole, a through hole, an expansion and contraction hole, and a honeycomb hole of the circuit board.

[0032] In one embodiment, the circuit board detection device comprises:

[0033] A coaxial linear light source is disposed between the line scan camera and the transfer mechanism;

[0034] A first ring light source is arranged at a first height position above the transfer mechanism;

[0035] A second ring light source is arranged at a second height position above the transfer mechanism;

[0036] Before the step of controlling the transfer mechanism to carry the circuit board and controlling the line scan camera to work to detect the plurality of features to be detected, the method further includes:

[0037] Turning on the backlight source assembly and the coaxial linear light source to provide backlight illumination and coaxial illumination for circuit board inspection;

[0038] Before the step of controlling the area array camera to move to a position corresponding to the position of the remaining features to be detected to detect them, the method further includes:

[0039] The first ring light source and / or the second ring light source are turned on to provide ring light illumination for circuit board inspection.

[0040] The circuit board detection device of the present application includes a transfer mechanism, a camera assembly and a backlight source assembly. The transfer mechanism is used to carry the circuit board to move; the camera assembly is arranged above the transfer mechanism; the camera assembly is used to detect the circuit board when the circuit board moves to a preset detection area; the backlight source assembly is arranged below the transfer platform; the backlight source is used to backlight the circuit board during the circuit board detection process by the camera assembly. Since the present application adopts a backlight source assembly, various features on the circuit board including but not limited to straight edges, arc edges, bosses, blind holes, through holes, expansion and contraction holes and honeycomb holes can be clearly identified, thereby improving the accuracy of circuit board detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0042] Figure 1A schematic diagram of the structure of an embodiment of a circuit board detection device of the present application;

[0043] Figure 2 A schematic diagram of the structure of another embodiment of the circuit board detection device of the present application;

[0044] Figure 3 for Figure 1 A partial enlarged view of the middle A;

[0045] Figure 4 A schematic diagram of a method flow chart provided for an embodiment of a circuit board detection method of the present application;

[0046] Figure 5 A schematic diagram of a method flow chart of another embodiment of the circuit board detection method of the present application.

[0047] Description of Figure Numbers:

[0048] 11. Transfer platform; 12. First guide rail; 13. Cover plate; 21. Line scan camera; 22. Area array camera; 211. Second guide rail; 221. Third guide rail; 31. Telecentric backlight point light source; 32. Telecentric large field of view backlight light source; 41. Coaxial linear light source; 42. First ring light source; 43. Second ring light source. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0051] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0052] This application proposes a circuit board detection device, referring to Figure 1 , Figure 3 , the circuit board detection device includes a transfer mechanism, a camera assembly and a backlight source assembly. The transfer mechanism is used to carry the circuit board to move. Specifically, the transfer mechanism may include one or more conveyor belts, slide rails or other mobile platforms to achieve precise positioning and movement of the circuit board. The camera assembly may include a line scan camera 21 and an array camera 22. The line scan camera 21 is used to quickly and continuously scan the surface of the circuit board to capture the edge and line features of the circuit board, while the array camera 22 is used to capture specific areas on the circuit board, such as holes, bosses and other detail features. The backlight source assembly is arranged below the transfer platform 11, and its function is to provide uniform backlight illumination when the camera assembly detects the circuit board, thereby enhancing the contrast of the features on the circuit board, so that the camera can capture the details on the circuit board more clearly. In practical applications, the backlight source assembly may be an LED backlight strip or other types of backlight sources, which can ensure that the backlight is evenly distributed to avoid shadows or light spots when the camera assembly is detecting. In this embodiment, since the present application adopts a backlight light source assembly, various features on the circuit board including but not limited to straight edges, arc edges, bosses, blind holes, through holes, expansion and contraction holes and honeycomb holes can be clearly identified, thereby improving the accuracy of circuit board detection.

[0053] In one possible implementation, reference Figure 1 , Figure 2, the transfer mechanism includes a first guide rail 12 and a transfer platform 11, one side of the first guide rail 12 is a loading side, and the other side of the first guide rail 12 is a return side; the transfer platform 11 is slidably connected to the first guide rail 12, and the transfer platform 11 is set to a transparent material; the transfer platform 11 is used to carry the circuit board to move between the loading side and the return side along the first guide rail 12. The backlight source assembly includes a telecentric backlight point light source 31 and a telecentric large-field-of-view backlight light source 32, wherein the telecentric backlight point light source 31 is used to provide high-brightness point light source illumination to enhance the recognition ability of specific area features on the circuit board; and the telecentric large-field-of-view backlight light source 32 is used to provide a wide lighting area to ensure uniform illumination of the entire circuit board surface. Through this combined lighting method, the lighting requirements for different areas and different features on the circuit board can be met at the same time, further improving the comprehensiveness and accuracy of circuit board detection.

[0054] In this embodiment, the transfer platform 11 can be made of glass or acrylic or other transparent materials to ensure that light can penetrate, provide good light transmittance for backlighting, and facilitate the camera component to capture the features on the circuit board. In this embodiment, the first guide rail 12 can be set as two parallel guide rails to ensure that the transfer platform 11 moves smoothly on the guide rail. One end of the first guide rail 12 is connected to the loading port, and the user can manually place the circuit board through the loading port or place the circuit board on the transfer platform 11 through the loading port through an automated loading device. The camera component is set at a corresponding position above the loading side and the return side. The transfer platform 11 slides on the first guide rail 12. During the process of transporting the circuit board from the loading side to the return side, and during the process of transporting the circuit board from the return side to the loading side, the camera component can take a flying shot of the surface features of the circuit board, thereby detecting the circuit board. After completing one inspection, the transfer platform 11 transports the circuit board back to the loading side to prepare for the next inspection. During this process, the backlight source assembly continuously provides uniform backlight illumination, ensuring that the camera assembly can capture all the detailed features on the circuit board, including those tiny holes and complex edges that are difficult to identify. In addition, in order to further improve the efficiency and accuracy of detection, the camera assembly can be used in conjunction with advanced image processing software, which can automatically analyze the captured image data and quickly identify defects and inconsistencies on the circuit board. In this way, the circuit board inspection device can not only achieve high-efficiency detection, but also ensure the high accuracy and reliability of the circuit board inspection results.

[0055] In a feasible embodiment, the transfer mechanism further includes a driving component for driving the transfer platform 11 to move along the first guide rail 12. The driving component can be a stepping motor or other types of motors, and the speed and direction of the motor can be precisely controlled to achieve precise control of the moving speed and direction of the transfer platform 11, thereby ensuring the stability and repeatability of the circuit board during the detection process, thereby improving the accuracy of the detection. In addition, the driving component can also be equipped with an encoder for real-time monitoring of the position of the transfer platform 11, ensuring that the camera component shoots the circuit board at the correct time and position, and further improving the detection efficiency of the circuit board.

[0056] In one possible implementation, reference Figure 1 , the transfer mechanism also includes a cover plate 13 arranged above the transfer platform 11, and the cover plate 13 can be transparent to allow light to pass through and achieve the effect of backlighting. The setting of the cover plate 13 helps to fix the circuit board and prevent the circuit board from being displaced due to vibration or movement during the detection process. The cover plate 13 can also protect the camera assembly from interference from the external environment, while ensuring that the light from the backlight source assembly can be evenly irradiated onto the circuit board. In addition, the cover plate 13 can also play a role in dust and moisture prevention, ensuring the cleanliness of the detection environment, thereby improving the stability and reliability of the detection. In practical applications, the cover plate 13 can be designed to be detachable for easy maintenance and cleaning. Through such a design, the circuit board detection device can adapt to a variety of different detection environments, while ensuring the efficiency and accuracy of the circuit board detection process.

[0057] In one possible implementation, reference Figure 1 , Figure 3 The camera assembly includes a line scan camera 21 and an area array camera 22. Both the line scan camera 21 and the area array camera 22 can be movably arranged above the transfer mechanism. The area array camera 22 is arranged on a side of the line scan camera 21 away from the loading side.

[0058] In this embodiment, the configuration of the line scan camera 21 and the area array camera 22 allows them to be optimized for different inspection requirements of the circuit board. The line scan camera 21 is particularly suitable for inspecting continuous lines and edges on the circuit board due to its high-speed scanning capability, while the area array camera 22 is more suitable for capturing tiny features on the circuit board, such as apertures, pads, etc., due to its high-resolution characteristics. Through the division of labor between the line scan camera 21 and the area array camera 22, a comprehensive inspection of the circuit board can be achieved to ensure that all key features are identified without omission. In addition, the mobility design of the camera components enables them to adjust their positions according to the inspection requirements, thereby adapting to circuit boards of different sizes and shapes. This flexibility not only increases the scope of application of the inspection device, but also allows the circuit board to be inspected at multiple angles and multiple positions, further enhancing the comprehensiveness and accuracy of the inspection. Since the area array camera 22 is arranged on the side of the line scan camera 21 away from the feeding side, that is, after the circuit board is loaded, the edge and line features are first scanned by the line scan camera 21, and the circuit board can be positioned based on the scanning results of the line scan camera 21, so that the area array camera 22 can be moved to a specific area of ​​the circuit board in time to capture high-resolution details. This sequential inspection method ensures the efficiency and accuracy of the inspection process, while reducing the time wasted by repeatedly inspecting the same area.

[0059] In actual operation, the movement and positioning of the camera assembly can be achieved through precise mechanical devices or electronic control systems to ensure that the camera can accurately aim at a specific area on the circuit board during each inspection. With advanced image processing software, the camera assembly can analyze image data in real time, quickly identify defects on the circuit board, and feed back the inspection results to the operator or automatic control system for timely adjustment or repair.

[0060] In one possible implementation, reference Figure 1 The circuit board detection device also includes a second guide rail 211 and a third guide rail 221. The second guide rail 211 is slidably connected to the line scan camera 21, and the second guide rail 211 is vertically arranged to the first guide rail 12; the second guide rail 211 is used to move the line scan camera 21 along the vertical direction of the first guide rail 12; the third guide rail 221 is slidably connected to the area array camera 22, and the third guide rail 221 is vertically arranged to the first guide rail 12; the third guide rail 221 is used to move the area array camera 22 along the vertical direction of the first guide rail 12.

[0061] In this embodiment, the second guide rail 211 and the third guide rail 221 are arranged so that the line scan camera 21 and the area array camera 22 can cover a wider area of ​​the circuit board, thereby realizing a comprehensive inspection of the circuit board. The second guide rail 211 and the third guide rail 221 can be precise linear guide rails to ensure the stability and accuracy of the camera during movement. Through the second guide rail 211, the line scan camera 21 can scan on a path perpendicular to the moving direction of the circuit board, so that lines and features along different directions on the circuit board can be detected. Similarly, the third guide rail 221 also allows the area array camera 22 to move perpendicular to the moving direction of the circuit board, so as to perform a high-resolution detailed inspection of a specific area on the circuit board. In this way, not only the flexibility of the inspection is improved, but also a more detailed analysis of the circuit board is allowed, ensuring the comprehensiveness and accuracy of the inspection results. In addition, the vertical arrangement of the second guide rail 211 and the third guide rail 221 also helps to reduce mutual interference between cameras, ensuring the smooth progress of the inspection process. In practical applications, the lengths of the second guide rail 211 and the third guide rail 221 can be adjusted according to the size of the circuit board to meet the inspection requirements of circuit boards of different sizes.

[0062] In a feasible implementation, the array camera 22 is set to be multiple. It is understandable that the circuit board generally has multiple areas that need to be scanned by the array camera 22, such as multiple chip mounting positions, connector slots, etc. By setting multiple array cameras 22, multiple areas on the circuit board can be scanned at high resolution at the same time, significantly improving the detection efficiency. Each array camera 22 can work independently or collaboratively, and is optimized according to the specific area and detection requirements of the circuit board. For example, some array cameras 22 can focus on detecting high-density chip areas, while other cameras can process connectors or edge areas. This parallel processing method not only speeds up the detection speed, but also ensures that each area is carefully inspected, thereby improving the accuracy and reliability of the overall detection. In addition, the configuration of multiple array cameras 22 can also achieve redundant detection, that is, multiple cameras are used to perform repeated scanning in key areas to further reduce the risk of missed detection and misjudgment. In actual operation, the synchronization and coordination of multiple array cameras 22 can be achieved through an advanced control system to ensure that each camera can shoot at the right time and position, thereby achieving efficient and accurate circuit board detection.

[0063] In one possible implementation, reference Figure 1 , Figure 3, the circuit board detection device also includes a coaxial linear light source 41, which is arranged between the line scan camera 21 and the transfer mechanism. In this embodiment, the use of the coaxial linear light source 41 provides uniform and stable lighting conditions for circuit board detection. The coaxial linear light source 41 can specifically be an LED light source, which can provide light with high brightness and high uniformity. Since the coaxial linear light source 41 is coaxially arranged with the camera assembly, the light is directly irradiated on the circuit board, reducing shadows and reflections, making the features on the circuit board more clearly visible. This lighting method is particularly suitable for detecting tiny defects on the circuit board, such as scratches, stains or solder joint defects. The uniform illumination of the coaxial linear light source 41 ensures that the camera can capture the details of each part of the circuit board, thereby improving the accuracy and repeatability of the detection. In addition, the use of the coaxial linear light source 41 also reduces the dependence on ambient light, so that the circuit board detection device can work stably under different lighting conditions, further improving the reliability and efficiency of the detection. In practical applications, the brightness and color temperature of the coaxial linear light source 41 can be adjusted according to the detection requirements to adapt to circuit boards of different materials and colors, ensuring the accuracy of the circuit board detection results.

[0064] In a feasible embodiment, the circuit board detection device also includes a first ring light source 42 and a second ring light source 43. The first ring light source 42 is arranged at a first height position above the transfer mechanism; the second ring light source 43 is arranged at a second height position above the transfer mechanism.

[0065] In this embodiment, the first ring light source 42 and the second ring light source 43 are provided to provide additional lighting angles so as to more comprehensively illuminate the surface of the circuit board. The first ring light source 42 is located at a higher position and can provide light irradiated from above to form a high-angle ring light, while the second ring light source 43 is located at a lower position and provides light irradiated from below to form a low-angle ring light. The first ring light source 42 can make the plane part of the object reflect light to form a bright field, while the undulating part will cause the light to diverge and cannot enter the camera, forming a dark area, so that the camera component can accurately capture the uneven surface defects, scratches, etc. of the variable Luban. The second ring light source 43 can make the plane part of the object form a dark field due to reflection, while the uneven part will reflect messy light into the camera to form a bright area, so that the camera component can accurately capture the protrusions or texture changes on the surface of the circuit board. Through the coordinated use of the first ring light source 42 and the second ring light source 43, a three-dimensional lighting effect of the surface features of the circuit board can be achieved. This stereoscopic lighting technology helps to enhance the contrast of the surface features of the circuit board, so that even tiny defects can be clearly identified. For example, for solder joints and pads on the circuit board, the first ring light source 42 can highlight their outlines, while the second ring light source 43 can highlight the gloss changes on their surfaces. Through this multi-angle lighting, the detection device can more accurately judge the manufacturing quality of the circuit board and ensure the reliability of the final product. In actual operation, the brightness and height of the first ring light source 42 and the second ring light source 43 can be adjusted according to the material and surface characteristics of the circuit board to achieve the best lighting effect.

[0066] In this embodiment, the circuit board detection device includes a transfer mechanism, a camera assembly and a backlight source assembly. The transfer mechanism is used to carry the circuit board to move; the camera assembly is arranged above the transfer mechanism; the camera assembly is used to detect the circuit board when the circuit board moves to the preset detection area; the backlight source assembly is arranged below the transfer platform 11; the backlight source is used to backlight the circuit board during the camera assembly's circuit board detection process. Since the present application adopts a backlight source assembly, various features on the circuit board including but not limited to straight edges, arc edges, bosses, blind holes, through holes, expansion and contraction holes, and honeycomb holes can be clearly identified, thereby improving the accuracy of circuit board detection.

[0067] The present application also proposes a circuit board detection method, which is based on the circuit board detection device, which includes a transfer mechanism, a camera assembly and a backlight source assembly, and the camera assembly includes a line scan camera 21 and an array camera 22, which can be movably arranged above the transfer mechanism, and the array camera 22 is arranged on the side of the line scan camera 21 away from the feeding side. The specific structure of the circuit board detection device refers to the above embodiment. Since the circuit board detection method adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0068] In this embodiment, reference Figure 4 The circuit board detection method includes steps S100 to S400, wherein:

[0069] Step S100, obtaining a plurality of features to be detected of a circuit board and a positional relationship between the plurality of features to be detected.

[0070] In this embodiment, the features to be detected include at least one of a straight edge, an arc edge, a boss, a blind hole, a through hole, an expansion and contraction hole, and a honeycomb hole. By importing the product drawings corresponding to the circuit board into the detection system in advance, these features can be automatically identified and the positional relationship between them can be established. This ensures that the subsequent steps can accurately locate, detect and analyze the various features to be detected on the circuit board.

[0071] Step S200, controlling the transfer mechanism to move the printed circuit board, and controlling the line scan camera 21 to work to detect the plurality of features to be detected.

[0072] In this embodiment, after the circuit board is placed on the transfer mechanism, the transfer mechanism will move the circuit board along a predetermined path to ensure that it passes through the detection area of ​​the line scan camera 21. Optionally, the transfer mechanism includes a first guide rail 12 and a transfer platform 11, one side of the first guide rail 12 is a loading side, the other side of the first guide rail 12 is a return side, the transfer platform 11 is slidably connected to the first guide rail 12, and the transfer platform 11 is set to a transparent material; the transfer platform 11 can carry the circuit board along the first guide rail 12 to move between the loading side and the return side. The line scan camera 21 continuously shoots during the movement of the circuit board, obtains image data of the circuit board, and analyzes the corresponding features to be detected.

[0073] Step S300 , when the line scan camera 21 detects a preset number of features to be detected, the positions of the remaining features to be detected are estimated according to the features to be detected detected by the line scan camera 21 and the positional relationship between the multiple features to be detected.

[0074] It is understandable that since the positional relationship of each feature on the circuit board has been pre-set, the line scan camera 21 can update these position information in real time during the detection process. When the line scan camera 21 detects a certain number of features, the system will use the known geometric relationship and position information to calculate the approximate position of other features to be detected through an algorithm. This method can significantly improve the detection efficiency, reduce unnecessary detection range, and thus speed up the entire detection process.

[0075] Step S400 , controlling the area array camera 22 to move to a position corresponding to the position of the remaining features to be detected, so as to detect them.

[0076] In this embodiment, after the area array camera 22 moves to the preset position, it will perform precise positioning and shooting to capture detailed images of the remaining features to be detected on the circuit board. Since the area array camera 22 has high resolution and imaging quality, it can perform detailed analysis and identification of tiny defects on the circuit board. For example, for small cracks, tiny scratches or printing errors on the circuit board, the area array camera 22 can provide clear images for further analysis and judgment.

[0077] After step S400 is completed, the circuit board detection method also includes a comprehensive analysis of the image data captured by the line scan camera 21 and the area array camera 22 to determine whether the circuit board meets the quality standards. This step involves image processing algorithms, such as edge detection, pattern recognition and machine learning technology, to ensure the accuracy and reliability of the detection results. Through these algorithms, the system can automatically identify defects on the circuit board and compare them with the preset quality standards to give a final qualified or unqualified judgment. The circuit board detection method can provide a comprehensive, fast and accurate quality inspection process to ensure the quality control of the circuit board during the production process. In addition, the detection method can also record the detection data to provide support for subsequent quality tracking and analysis. In this way, manufacturers can promptly discover problems in the production process and take measures to improve them, thereby improving overall production efficiency and product quality.

[0078] In a feasible implementation, the circuit board detection device includes a coaxial linear light source 41, a first ring light source 42 and a second ring light source 43. The coaxial linear light source 41 is arranged between the line scan camera 21 and the transfer mechanism; the first ring light source 42 is arranged at a first height position above the transfer mechanism; and the second ring light source 43 is arranged at a second height position above the transfer mechanism. Figure 5Before the step of controlling the transfer mechanism to carry the circuit board and controlling the line scan camera 21 to work to detect the multiple features to be detected, the method also includes a step S0200 of turning on the backlight light source assembly and the coaxial linear light source 41 to provide backlight illumination and coaxial illumination for circuit board detection; before the step of controlling the area array camera 22 to move to the corresponding position of the remaining features to be detected to detect them, the method also includes a step S0400 of turning on the first ring light source 42 and / or the second ring light source 43 to provide ring light illumination for circuit board detection.

[0079] In this embodiment, in step S0200, the backlight light source assembly and the coaxial linear light source 41 are turned on to provide backlight illumination and coaxial illumination for circuit board detection; before the step of controlling the area array camera 22 to move to the corresponding position of the position of the remaining features to be detected to detect them, the method also includes step S0400, turning on the first ring light source 42 and / or the second ring light source 43 to provide ring light illumination for circuit board detection.

[0080] In this embodiment, the first ring light source 42 is located at a higher position and can provide light from above to form a high-angle ring light, while the second ring light source 43 is located at a lower position and provides light from below to form a low-angle ring light. The first ring light source 42 can make the flat part of the object reflect light to form a bright field, while the undulating part will cause the light to diverge and cannot enter the camera, forming a dark area, so that the camera component can accurately capture the uneven surface defects, scratches, etc. of the variable Luban. The second ring light source 43 can make the flat part of the object form a dark field due to reflection, while the uneven part will reflect messy light into the camera to form a bright area, so that the camera component can accurately capture the protrusions or texture changes on the surface of the circuit board. Through the coordinated use of the first ring light source 42 and the second ring light source 43, a three-dimensional lighting effect of the surface features of the circuit board can be achieved. This three-dimensional lighting technology helps to enhance the contrast of the surface features of the circuit board, so that even tiny defects can be clearly identified. For example, for solder joints and pads on a circuit board, the first ring light source 42 can highlight their outlines, while the second ring light source 43 can highlight the glossiness changes on their surfaces. Through multi-angle lighting, the inspection device can more accurately determine the manufacturing quality of the circuit board and ensure the reliability of the final product.

[0081] In this embodiment, by turning on and off different light sources at appropriate times in step S0200 and step S0400, the circuit board detection device can flexibly adjust the lighting conditions according to different detection requirements, thereby adapting to various complex detection environments and requirements. By reasonably configuring and turning on the coaxial linear light source 41, the first ring light source 42, and the second ring light source 43, not only the detection efficiency can be improved, but also the reliability of the detection result can be enhanced.

[0082] The above description is only an exemplary embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the technical concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A circuit board detection device, characterized in that: The circuit board detection device comprises: A transfer mechanism, used for carrying and moving the circuit board; A camera assembly is disposed above the transfer mechanism; the camera assembly is used to detect the circuit board when the circuit board moves to a preset detection area; The backlight source assembly is arranged below the transfer platform; the backlight source is used to provide backlight illumination to the circuit board during the process of the camera assembly detecting the circuit board.

2. The circuit board detection device according to claim 1, characterized in that: The transfer mechanism comprises: A first guide rail, one side of the first guide rail is a loading side, and the other side of the first guide rail is a return side; The transfer platform is slidably connected to the first guide rail, and the transfer platform is set to a transparent material; the transfer platform is used to carry the circuit board and move along the first guide rail between the loading side and the return side.

3. The circuit board detection device according to claim 2, characterized in that: The camera assembly comprises: A line scan camera, movably arranged above the transfer mechanism; The area array camera is movably arranged above the transfer mechanism; the area array camera is arranged on a side of the line scan camera away from the loading side.

4. The circuit board detection device according to claim 3, characterized in that: The circuit board detection device also includes: A second guide rail is slidably connected to the line scan camera, and the second guide rail is arranged perpendicular to the first guide rail; the second guide rail is used to move the line scan camera along the vertical direction of the first guide rail; The third guide rail is slidably connected to the area array camera, and the third guide rail is arranged perpendicular to the first guide rail; the third guide rail is used to move the area array camera along the vertical direction of the first guide rail.

5. The circuit board detection device according to claim 3, characterized in that: The area array camera is arranged in plurality.

6. The circuit board detection device according to claim 3, characterized in that: The circuit board detection device also includes: The coaxial linear light source is arranged between the line scanning camera and the transfer mechanism.

7. The circuit board detection device according to claim 3, characterized in that: The circuit board detection device also includes: A first ring light source is arranged at a first height position above the transfer mechanism; The second ring light source is arranged at a second height position above the transfer mechanism.

8. A circuit board detection method, characterized in that: The circuit board detection method is based on the circuit board detection device according to any one of claims 1 to 7, the circuit board detection device comprises a transfer mechanism, a camera assembly and a backlight source assembly, and the camera assembly comprises: A line scan camera, movably arranged above the transfer mechanism; An area array camera is movably arranged above the transfer mechanism; the area array camera is arranged on a side of the line scan camera away from the feeding side; The circuit board detection method comprises: Acquire multiple features to be detected of the circuit board and the positional relationship between the multiple features to be detected; Controlling the transfer mechanism to move the printed circuit board, and controlling the line scan camera to work to detect the plurality of features to be detected; When the line scan camera detects a preset number of features to be detected, the positions of the remaining features to be detected are estimated according to the features to be detected detected by the line scan camera and the positional relationship between the multiple features to be detected; The area array camera is controlled to move to a position corresponding to the position of the remaining features to be detected so as to detect them.

9. The circuit board detection method according to claim 8, characterized in that: The feature to be detected includes at least one of a straight edge, an arc edge, a boss, a blind hole, a through hole, an expansion and contraction hole, and a honeycomb hole of the circuit board.

10. The circuit board detection method according to claim 8, characterized in that: The circuit board detection device comprises: A coaxial linear light source is disposed between the line scan camera and the transfer mechanism; A first ring light source is arranged at a first height position above the transfer mechanism; A second ring light source is arranged at a second height position above the transfer mechanism; Before the step of controlling the transfer mechanism to carry the circuit board and controlling the line scan camera to work to detect the plurality of features to be detected, the method further includes: Turning on the backlight source assembly and the coaxial linear light source to provide backlight illumination and coaxial illumination for circuit board inspection; Before the step of controlling the area array camera to move to a position corresponding to the position of the remaining features to be detected to detect them, the method further includes: The first ring light source and / or the second ring light source are turned on to provide ring light illumination for circuit board inspection.

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