A method and fixture for installing indium sheet of chip multi-temperature test pressure head

Abstract

The present invention relates to an indium sheet installation method and a fixture for a chip multi-temperature test pressure head. The indium sheet installation method for a chip multi-temperature test pressure head comprises step 1: fixing the pressure head, with the pressure head facing upward, and applying glue to the pressure head of the pressure head; step 2: sucking the indium sheet and placing the indium sheet on the top surface of the pressure head; step 3: pressing the four sides of the indium sheet respectively, and adhering the edge of the indium sheet to the glued part of the pressure head. An indium sheet installation device for a chip multi-temperature test pressure head specifically comprises a shell, a suction component, and two pressing plates; the four sides of the inner wall of the shell are provided with a material discharge positioning groove and a material pressing positioning groove; the suction component comprises a suction piece, a suction nozzle, and a positioning rod; the positioning rod is located in the material discharge positioning groove, and the pressing plate is located in the material pressing positioning groove. The advantages of the present invention are: instead of directly contacting the indium sheet with the hand, the indium sheet is automatically sucked and pressed, the operation proficiency requirements are reduced, the loss of indium sheet caused by finger pressing errors during operation is reduced, and the efficiency and quality of the sheet installation are improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and in particular to an indium sheet installation method and a fixture for a chip multi-temperature test pressure head. Background Art

[0002] A thin sheet pressed from metal indium, with good plasticity, thermal conductivity and electrical conductivity, used as the contact medium between the pressure probe and the test chip during long-term high-temperature testing. The indium sheet has a limited service life. When the surface is hit by external force or after long-term pressure testing, the performance will deteriorate and need to be replaced.

[0003] The current replacement method is manual finger pressing and installation. Since the indium sheet is extremely soft, it can be scratched by fingernails. This method relies on the worker's proficiency and is prone to leaving fingernail marks during installation. Uneven pressure can easily cause the surface of the indium sheet to warp, affecting the performance of the indium sheet and wasting costs.

[0004] Therefore, it is necessary to design the installation method of the indium sheet to solve the problem of difficulty in installing the indium sheet. Summary of the invention

[0005] The object of the present invention is to provide an indium sheet installation method and a fixture for a chip multi-temperature test pressure head, which can improve the indium sheet installation efficiency and reduce indium sheet scratches.

[0006] A first aspect of the present invention provides a method for installing an indium sheet of a chip multi-temperature test pressure head, comprising the following steps:

[0007] Step 1: Fix the pressure probe with the pressure head facing upwards and glue the edge of the top surface of the pressure probe;

[0008] Step 2: Take the indium sheet and place it flat on the top surface of the indenter;

[0009] Step 3: Press the four sides of the indium sheet separately to stick the edge of the indium sheet to the glue of the pressing head.

[0010] Based on the above-mentioned indium sheet installation method of a chip multi-temperature test pressure head, the second aspect of the present invention provides an indium sheet installation fixture for a chip multi-temperature test pressure head, which runs the above-mentioned indium sheet installation method of a chip multi-temperature test pressure head, specifically including a shell, a suction component, and two pressing plates;

[0011] The housing is used to fix the pressure probe in step 1;

[0012] The suction component is used to suck the indium sheet in step 2;

[0013] The pressing plate is used for pressing the indium sheet in step 3;

[0014] The inner wall of the shell is provided with material discharge positioning grooves and material pressing positioning grooves on all four sides;

[0015] The suction component includes a suction piece, a suction nozzle, and a positioning rod. The suction piece is connected to an air pipe interface. The suction nozzle is located at the bottom of the suction piece and communicates with the air pipe interface. Positioning rods are arranged on four sides of the outer wall of the suction piece.

[0016] The pressing plate is vertically provided with a slot adapted to the positioning rod;

[0017] The positioning rod is located in the material discharging positioning groove, and the pressing plate is located in the material pressing positioning groove.

[0018] Preferably, a rubber pressing head is provided at the bottom of the pressing plate.

[0019] As a further improvement of the invention, a hand lever is provided on the top of the material suction piece.

[0020] As a further improvement of the invention, the suction nozzle is a sponge suction nozzle.

[0021] As a further improvement of the invention, the shell is made of transparent material.

[0022] The key point of the present invention is that the shell is sleeved on the outer wall of the pressure probe so that the four walls of the pressure probe are positioned by the shell, so as to avoid the pressure probe shaking when loading the sheet and the edge of the top surface of the pressure probe being glued; the suction piece absorbs the indium sheet through the vacuum negative pressure of the air pipe interface, and the suction piece enters the shell from top to bottom, and the positioning rods on the four sides of the suction piece move downward along the corresponding material discharge positioning grooves respectively, to ensure that the indium sheet sucked by the suction piece is accurately placed above the pressure head, so as to avoid the placement position of the indium sheet being offset; the indium sheet is slowly pressed down and After contacting the surface of the pressure head, the suction piece stops sucking materials through the connected air pipe interface, and slowly inserts the two pressure plates into the pressure positioning grooves of the shell. The card slots of the two pressure plates are respectively inserted into the positioning rods. The positioning rods and the pressure positioning grooves position the pressure plates to ensure that the downward pressing direction of the pressure plates remains vertical to avoid downward pressure deviation and affect the pressure angle of the indium sheet. After pressing both sides of the indium sheet, take out the two pressure plates, turn the direction, and press the other two sides of the indium sheet in the same way, so that the four sides of the indium sheet are pressed on the pressure head.

[0023] Compared with the prior art, the indium sheet installation method and fixture of the chip multi-temperature test pressure head of the present invention have the advantages of automatically sucking and pressing the indium sheet instead of directly contacting the indium sheet with the hands, reducing the operation proficiency requirements, reducing the loss of indium sheet caused by finger pressing errors during operation, and improving the efficiency and quality of sheet installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of an indium sheet installation fixture for a chip multi-temperature test press head of the present invention;

[0025] Figure 2It is a schematic diagram of the structure of the suction component;

[0026] Figure 3 This is the front view of the pressure plate connection;

[0027] Figure 4 It is a side view of the connection of the pressure plate;

[0028] Figure 5 A top view of an indium sheet mounting fixture for a chip multi-temperature test press head according to the present invention. DETAILED DESCRIPTION

[0029] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0030] A first aspect of the present invention provides a method for installing an indium sheet of a chip multi-temperature test pressure head, comprising the following steps:

[0031] Step 1: Fix the pressure probe 4, with the pressure head 41 of the pressure probe 4 facing upwards, and glue is applied to the edge of the top surface of the pressure head 41;

[0032] Step 2: suck up the indium sheet and place it flat on the top surface of the pressing head 41;

[0033] Step 3: Press the four sides of the indium sheet respectively to adhere the edge of the indium sheet to the glue sticking part of the pressing head 41.

[0034] like Figure 1 As shown, based on the above-mentioned indium sheet installation method of a chip multi-temperature test pressure head, the second aspect of the present invention provides an indium sheet installation fixture for a chip multi-temperature test pressure head, and runs the above-mentioned indium sheet installation method of a chip multi-temperature test pressure head, which specifically includes a shell 1, a suction component 2, and two pressing plates 3;

[0035] Shell 1, used for fixing the pressure probe 4 in step 1;

[0036] A suction component 2, used for sucking the indium sheet in step 2;

[0037] Pressing plate 3, used for pressing the indium sheet in step 3;

[0038] The inner wall of the housing 1 is provided with a material discharge positioning groove 11 and a material pressing positioning groove 12 on all four sides;

[0039] like Figure 2 As shown, the suction assembly 2 includes a suction piece 22, a suction nozzle 24, and a positioning rod 25. The suction piece 22 is connected to an air pipe interface 23. The suction nozzle 24 is located at the bottom of the suction piece 22 and communicates with the air pipe interface 23. The outer wall of the suction piece 22 is provided with positioning rods 25 on all four sides.

[0040] like Figure 3-4 As shown, the pressing plate 3 is vertically provided with a slot 31 adapted to the positioning rod 25;

[0041] like Figure 5 As shown, the positioning rod 25 is located in the material discharge positioning groove 11, and the pressing plate 3 is located in the material pressing positioning groove 12.

[0042] After the card slot 31 of the pressure plate 3 contacts the positioning rod 25, the two pressure plates 3 exert pressure on the corresponding positioning rod 25, thereby achieving the purpose of pressing the two sides of the indium sheet. A rubber pressing head 32 is provided at the bottom of the pressure plate 3. The rubber pressing head 32 has a buffering capacity to improve the stability of the downward pressure and avoid uneven pressure on the two sides of the indium sheet, which may cause the indium sheet to be misplaced or damaged.

[0043] A hand lever 21 is provided on the top of the suction member 22. When loading films, the suction member 22 needs to be extended into or out of the housing 1, and the hand lever 21 facilitates hand operation.

[0044] The suction nozzle 24 is a sponge suction nozzle, and the sponge material is relatively soft, which can reduce the scratches on the indium sheet.

[0045] The housing 1 is made of a transparent material to improve visibility during film loading and facilitate observation by the operator.

[0046] The present invention discloses an indium sheet installation jig for a chip multi-temperature test pressure head. The shell 1 is sleeved on the outer wall of the pressure head 4, so that the four walls of the pressure head 4 are positioned by the shell 1, so that the pressure head 4 is prevented from shaking when the sheet is installed, and the edge of the top surface of the pressure head 41 is glued; the suction piece 22 absorbs the indium sheet through the vacuum negative pressure of the air pipe interface 23, and the suction piece 22 enters the shell 1 from top to bottom, and the positioning rods 25 on the four sides of the suction piece 22 move downward along the corresponding material discharge positioning grooves 11 respectively, so as to ensure that the indium sheet sucked by the suction piece 22 is accurately placed above the pressure head 41, so as to avoid the placement position of the indium sheet from being offset; After the indium sheet is slowly pressed down and contacts the surface of the pressure head 41, the suction piece 22 stops suctioning through the connected air pipe interface 23, and slowly inserts the two pressing plates 3 into the pressing material positioning groove 12 of the shell 1, and the card slots 31 of the two pressing plates 3 are respectively inserted into the positioning rods 25, and the positioning rods 25 and the pressing material positioning grooves 12 position the pressing plates 3 to ensure that the pressing direction of the pressing plates 3 remains vertical to avoid the downward displacement and affect the pressure angle of the indium sheet; after pressing both sides of the indium sheet, take out the two pressing plates 3, turn the direction, and press the other two sides of the indium sheet in the same way, so that the four sides of the indium sheet are all pressed on the pressure head 41.

[0047] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A method for installing an indium sheet of a chip multi-temperature test head, characterized in that: The steps include: Step 1: Fix the pressure probe with the pressure head facing upwards and glue the edge of the top surface of the pressure probe; Step 2: Take the indium sheet and place it flat on the top surface of the indenter; Step 3: Press the four sides of the indium sheet separately to stick the edge of the indium sheet to the glue of the pressing head.

2. An indium sheet mounting fixture for a chip multi-temperature test pressure head, characterized in that: The indium sheet installation method for running the above-mentioned chip multi-temperature test pressure head specifically includes a shell, a suction component, and two pressure plates; The housing is used to fix the pressure probe in step 1; The suction component is used to suck the indium sheet in step 2; The pressing plate is used for pressing the indium sheet in step 3; The inner wall of the shell is provided with material discharge positioning grooves and material pressing positioning grooves on all four sides; The suction component includes a suction piece, a suction nozzle, and a positioning rod. The suction piece is connected to an air pipe interface. The suction nozzle is located at the bottom of the suction piece and communicates with the air pipe interface. Positioning rods are arranged on four sides of the outer wall of the suction piece. The pressing plate is vertically provided with a slot adapted to the positioning rod; The positioning rod in the state of installing the indium sheet is located in the material discharge positioning groove, and the pressing plate in the state of installing the indium sheet is located in the material pressing positioning groove.

3. The indium sheet mounting fixture for a chip multi-temperature test pressure head as claimed in claim 2, characterized in that: A rubber pressing head is arranged at the bottom of the pressing plate.

4. The indium sheet mounting fixture for a chip multi-temperature test pressure head as claimed in claim 2, characterized in that: A hand lever is arranged on the top of the material suction piece.

5. The indium sheet mounting fixture for a chip multi-temperature test pressure head as claimed in claim 2, characterized in that: The suction nozzle is a sponge suction nozzle.

6. The indium sheet mounting fixture for a chip multi-temperature test pressure head as claimed in claim 2, characterized in that: The shell is made of transparent material.

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