Efficient heat dissipation laminated topology type diode current aging structure

Abstract

The invention discloses an efficient heat dissipation laminated topology type diode current aging structure, and provides a basic framework of the efficient heat dissipation laminated topology type diode current aging structure, which comprises an aging cabinet, a power supply placement area and an aging PCB (Printed Circuit Board) slot. According to the structure, the direct-current power supply can be directly connected to the burn-in PCB, and necessary power support is provided for burn-in testing of the diode. Basic functions of burn-in testing are achieved, a basis is provided for subsequent efficient heat dissipation and flexible configuration, and compared with a conventional high-power burn-in single-layer mode, the space utilization rate and the effective burn-in station of a single machine are obviously improved.

Description

Technical Field

[0001] The invention belongs to the technical field of diode aging, and in particular relates to a high-efficiency heat dissipation stacked topology diode current aging structure. Background Art

[0002] Semiconductor discrete devices, as the cornerstone of the development of the modern electronics industry, not only have a profound impact on many fields such as consumer electronics, industrial control, and communication technology, but also play an irreplaceable role in cutting-edge technologies such as new energy, intelligent transportation, and high-speed data transmission. In particular, Schottky diodes, with their significant advantages such as low voltage drop, fast switching characteristics, and high efficiency, have shown great application potential in battery management systems for new energy vehicles, solar inverters, wind power converters, and high-frequency power amplifier circuits for 5G communication base stations. The market demand continues to grow, indicating that its market prospects are bright.

[0003] However, to ensure that Schottky diodes can work stably and reliably in practical applications, the aging process is particularly important. Aging, as a method of accelerating the early failure of devices by applying specific conditions to screen out potential defects, is crucial to improving the reliability and service life of Schottky diodes. Traditional aging methods usually involve mounting the devices on special heat dissipation fixtures, which are then connected to a water cooling system to ensure that the junction temperature of the device can be maintained within a safe range under high current operating conditions. This process not only requires precise temperature control and current regulation, but also due to the limitations of equipment design, there are often problems such as complex operation, poor heat dissipation uniformity, and limited production capacity, making it difficult to meet the needs of large-scale production and high-efficiency testing. Summary of the invention

[0004] The present invention provides a high-efficiency heat dissipation stacked topology diode current aging structure, which solves the problems of the existing aging method having trouble in operation, low heat dissipation efficiency and low production efficiency.

[0005] To achieve the above object, the present invention provides the following technical solutions: A high-efficiency heat dissipation stacked topology diode current aging structure comprises an aging cabinet, wherein a power supply placement area and an aging PCB board slot are arranged inside the aging cabinet, a DC power supply is arranged in the power supply placement area, an aging PCB board is arranged in the aging PCB board slot, and the DC power supply is connected to the aging PCB board.

[0006] Preferably, the aging cabinet is made of 306 stainless steel and its surface is coated with insulating paint.

[0007] Preferably, a universal wheel with a locking function is provided at the bottom of the aging cabinet.

[0008] Preferably, an anti-static wristband interface is provided on the side of the aging cabinet.

[0009] Preferably, the power supply placement area and the aged PCB board slot are both four-layered, and each layer is separated by a partition.

[0010] Preferably, the aging PCB board is designed with a plurality of workstations, and each workstation is designed with a short-circuit jumper cap and a connection gasket.

[0011] Preferably, it also includes an axial flow fan arranged on the side of the aging cabinet. Preferably, a heat dissipation tool is provided on the side of the aged PCB board.

[0012] Preferably, the heat dissipation wind direction of the axial flow fan and the heat dissipation tooling is the same.

[0013] Preferably, the heat dissipation wind direction of the axial flow fan and the heat dissipation tooling is parallel to the aging PCB board.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides an efficient heat dissipation stacked topology diode current aging structure, and provides a basic framework of the efficient heat dissipation stacked topology diode current aging structure, including an aging cabinet, a power supply placement area, and an aging PCB board slot. This structure enables the DC power supply to be directly connected to the aging PCB board, providing the necessary power support for the diode aging test. The basic functions of the aging test are realized, providing a basis for subsequent efficient heat dissipation and flexible configuration, and compared with the conventional high-power aging single-layer method, there is a significant improvement in space utilization and single-machine effective aging stations.

[0015] Furthermore, the aging cabinet is made of 306 stainless steel and coated with insulating paint. 306 stainless steel has good corrosion resistance and mechanical strength, which ensures the durability of the cabinet. The coating of insulating paint enhances the electrical safety of the cabinet, prevents current leakage or short circuit, and improves the overall safety and service life of the equipment.

[0016] Furthermore, universal wheels with locking function are provided at the bottom of the cabinet, which enables the aging cabinet to be easily moved to different locations. At the same time, the locking function ensures the stability of the cabinet during the test, enhancing the flexibility and convenience of operation of the equipment.

[0017] Furthermore, an anti-static wristband interface is provided on the side of the cabinet. This helps operators wear anti-static wristbands while working to prevent static electricity from damaging the test equipment and diodes. The beneficial effect is that the electrostatic protection capability of the test process is improved.

[0018] Furthermore, the source placement area and the burn-in PCB board slots are both four-layered, and each layer is separated by a partition. This layered design allows multiple diodes to be burn-in tested simultaneously, improving test efficiency. The setting of the partition ensures electrical isolation and heat dissipation between the layers, achieving efficient multi-layer burn-in testing.

[0019] Furthermore, the aging PCB is designed with multiple stations and equipped with short-circuit jumper caps and connection pads. This allows diodes of different specifications to be easily connected to the aging PCB for testing, while the short-circuit jumper caps and connection pads provide flexible circuit configuration options, enhancing the versatility and flexibility of the test.

[0020] Furthermore, an axial flow fan is provided on the side of the aging cabinet. The axial flow fan can provide forced air cooling, help dissipate heat, and ensure that the diode will not be damaged due to overheating during the aging process, thereby improving the heat dissipation performance of the equipment and the stability of the test.

[0021] Furthermore, a heat dissipation tool is provided on the side of the aged PCB board, which can directly dissipate heat from the diodes in the aged state, further enhancing the heat dissipation effect, optimizing the heat dissipation path, and improving the heat dissipation efficiency.

[0022] Furthermore, the axial fan and the heat dissipation fixture have the same heat dissipation direction. This design ensures that the fan and the heat dissipation fixture can work together to form an effective heat dissipation air duct, further improve the heat dissipation effect, and achieve optimization and coordinated work of the heat dissipation system.

[0023] Furthermore, the heat dissipation direction of the cooling fan and the heat dissipation tooling is parallel to the aging PCB board. This design enables the heat dissipation airflow to evenly cover all diodes on the aging PCB board, ensuring the uniformity and effectiveness of heat dissipation, improving the uniformity of heat dissipation and the overall heat dissipation effect, and making up for the problem of insufficient heat dissipation in the vertical direction of the stacked design. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a current aging structure of a high-efficiency heat dissipation stacked topology diode of the present invention; Figure 2 Another side view of a high-efficiency heat dissipation stacked topology diode current aging structure of the present invention; Figure 3 This is another front view of a high-efficiency heat dissipation stacked topology diode current aging structure of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0028] In the description of the embodiments of the present invention, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] In addition, if the term "horizontal" appears, it does not mean that the component must be absolutely horizontal, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", which does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0030] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] The present invention provides a high-efficiency heat dissipation stacked topology diode current aging structure, including an aging cabinet, wherein a power supply placement area and an aging PCB board slot are arranged inside the aging cabinet, a DC power supply is arranged in the power supply placement area, an aging PCB board is arranged in the aging PCB board slot, and the DC power supply is connected to the aging PCB board.

[0033] A basic framework of a highly efficient heat dissipation stacked topology diode current burn-in structure is provided, including a burn-in cabinet, a power supply placement area, and a burn-in PCB board slot. This structure enables the DC power supply to be directly connected to the burn-in PCB board, providing the necessary power support for the burn-in test of the diode. The basic functions of the burn-in test are realized, providing a basis for subsequent efficient heat dissipation and flexible configuration, and compared with the conventional high-power burn-in single-layer method, the space utilization rate and the effective burn-in station of a single machine are significantly improved.

[0034] The aging cabinet is made of 306 stainless steel and coated with insulating paint. 306 stainless steel has good corrosion resistance and mechanical strength, which ensures the durability of the cabinet. The coating of insulating paint enhances the electrical safety of the cabinet, prevents current leakage or short circuit, and improves the overall safety and service life of the equipment.

[0035] The bottom of the cabinet is equipped with universal wheels with locking function, which makes the cabinet easy to move to different locations. At the same time, the locking function ensures the stability of the cabinet during the test, enhancing the flexibility and convenience of operation of the equipment.

[0036] An anti-static wristband interface is provided on the side of the cabinet. This helps operators wear anti-static wristbands while working to prevent static electricity from damaging test equipment and diodes. The beneficial effect is that the electrostatic protection capability of the test process is improved.

[0037] The source placement area and the burn-in PCB board slots are both four-layer, and each layer is separated by a partition. This layered design allows multiple diodes to be burned-in tested simultaneously, improving test efficiency. The setting of the partition ensures electrical isolation and heat dissipation between each layer, achieving efficient multi-layer burn-in testing.

[0038] The aging PCB is designed with multiple stations and equipped with short-circuit jumper caps and connection pads. This allows diodes of different specifications to be easily connected to the aging PCB for testing. At the same time, the short-circuit jumper caps and connection pads provide flexible circuit configuration options, enhancing the versatility and flexibility of the test.

[0039] An axial flow fan is installed on the side of the aging cabinet. The axial flow fan can provide forced air cooling, help dissipate heat, and ensure that the diode will not be damaged due to overheating during the aging process, thereby improving the heat dissipation performance of the equipment and the stability of the test.

[0040] The side of the aging PCB board is equipped with a heat dissipation tool. The heat dissipation tool can directly dissipate heat from the diodes during aging, further enhancing the heat dissipation effect, optimizing the heat dissipation path, and improving the heat dissipation efficiency.

[0041] The axial flow fan and the heat dissipation tooling have the same heat dissipation direction. This design ensures that the fan and the heat dissipation tooling can work together to form an effective heat dissipation duct, further improve the heat dissipation effect, and achieve the optimization and coordinated work of the heat dissipation system.

[0042] The cooling wind direction of the fan and the heat dissipation tooling is parallel to the aging PCB board. This design allows the cooling airflow to evenly cover all diodes on the aging PCB board, ensuring the uniformity and effectiveness of heat dissipation, improving the uniformity of heat dissipation and the overall heat dissipation effect, and making up for the problem of insufficient heat dissipation in the vertical direction of the stacked design.

[0043] Another embodiment of the present invention provides a high-efficiency heat dissipation stacked topology diode current aging structure for power aging of diode devices in common packages such as SMD and TO. The structure includes an aging cabinet, a DC power supply, an aging PCB board, an axial flow fan, and the like.

[0044] The burn-in cabinet is composed of 8 layers. The lower 4 layers are for power supply placement, and the upper 4 layers are for burn-in PCB board slots. Each layer is separated by a partition in the middle, which can support a total of 8 power supplies and 8 burn-in PCB boards for simultaneous burn-in. The whole is processed with 306 stainless steel and coated with insulating paint on the surface. The burn-in rack is equipped with 4 universal wheels with a locking function to make it easy to carry. An anti-static wristband interface is reserved on the side of the burn-in rack so that subsequent workers can operate directly next to the burn-in cabinet. At the same time, this device is easy to expand, which improves the utilization rate of the site. See the schematic diagram. Figure 1 and Figure 2 .

[0045] The DC power supply selects a DC regulated power supply of appropriate range according to the actual aging current. This power supply has the characteristics of high stability, low noise, small size, high reliability, etc., and can be set with overvoltage, overcurrent protection and other functions.

[0046] The PCB board can be burned in with the corresponding heat dissipation tooling and burn-in sockets according to the devices with different packages. Considering the actual power supply and heat dissipation capacity, 10 stations are designed for each PCB board. Each station is designed with short-circuit jumper caps and connection gaskets. In actual burn-in, any number of devices can be selected for burn-in per board. When designing the PCB line width, it can be calculated according to the corresponding formula of line width and current.

[0047] Axial flow fans have a simple structure, large air volume and high efficiency. By adjusting the air volume, it can ensure that the excess heat in the aging process is discharged in time and that the junction temperature of the device meets the test requirements.

[0048] When aging the power of Schottky diodes, a single device on the existing aging platform can only age 32 stations. Using the above aging structure for aging, 80 can be aged at the same time.

[0049] Although the embodiments of the present invention are described above in conjunction with the accompanying drawings, the present invention is not limited to the above-mentioned specific embodiments and application fields, and the above-mentioned specific embodiments are only illustrative and instructive, rather than restrictive. Under the guidance of the specification, a person skilled in the art can also make many forms without departing from the scope of protection of the claims of the present invention, all of which belong to the scope of protection of the present invention.

Claims

1. An efficient heat dissipation stacked topology diode current aging structure, characterized in that: It comprises an aging cabinet, wherein a power supply placement area and an aging PCB board slot are arranged inside the aging cabinet, a DC power supply is arranged in the power supply placement area, an aging PCB board is arranged in the aging PCB board slot, and the DC power supply is connected to the aging PCB board.

2. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 1, characterized in that: The aging cabinet is made of 306 stainless steel and coated with insulating paint on its surface.

3. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 1, characterized in that: The bottom of the aging cabinet is provided with universal wheels with a locking function.

4. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 1, characterized in that: An anti-static wristband interface is provided on the side of the aging cabinet.

5. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 1, characterized in that: The power supply placement area and the aged PCB board slot are both four-layered, and each layer is separated by a partition.

6. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 1, characterized in that: The aging PCB board is designed with multiple workstations, and each workstation is designed with a short-circuit jumper cap and a connecting gasket.

7. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 1, characterized in that: It also includes an axial flow fan arranged on the side of the aging cabinet.

8. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 7, characterized in that: A heat dissipation tool is arranged on the side of the aged PCB board.

9. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 8, characterized in that: The heat dissipation wind direction of the axial flow fan and the heat dissipation tooling is the same.

10. The high-efficiency heat dissipation stacked topology diode current aging structure according to claim 9, characterized in that: The heat dissipation wind direction of the axial flow fan and the heat dissipation tooling is parallel to the aging PCB board.

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