Server component performance testing device

By introducing a temperature simulation mechanism into the performance detection device of the server component to control the temperature of the detection environment, the problem of poor accuracy of server motherboard performance testing in the prior art is solved, and more accurate and reliable performance detection results are achieved.

CN119780665APending Publication Date: 2025-04-08INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202411747035.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-04-08

AI Technical Summary

Technical Problem

In the prior art, the accuracy of server motherboard performance testing is poor and cannot fully reflect the performance of the motherboard in the actual use environment.

Method used

A server component performance detection device is designed, including a workbench, a detection mechanism, a storage platform and a temperature simulation mechanism. The temperature simulating mechanism can control the temperature in the station to make the components in a predetermined temperature state, and the detection mechanism can detect the components.

Benefits of technology

By simulating the temperature conditions of the actual use environment, the server components are detected, which improves the accuracy and reliability of the detection results, making the detection results more in line with the real use environment.

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Abstract

The embodiment of the present application provides a server component performance detection device, including: a workbench; a detection mechanism, which is arranged in the workbench; a storage table, which is connected to the workbench, and the storage table has a placement space, in which components are placed, and the detection mechanism can extend into the placement space and detect the components; a temperature simulation mechanism, at least a part of which can cover the placement space and communicate with the placement space, and the temperature simulation mechanism can control the temperature in the placement space so that the components are in a predetermined temperature state. The present application solves the problem of poor accuracy of server motherboard performance testing in the related art.
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Description

Technical Field

[0001] The embodiments of the present application relate to the computer field, and in particular, to a server component performance detection device. Background Art

[0002] In order to ensure the stability and reliability of server performance, it is necessary to perform performance tests on the main components of the server, such as various server motherboards, before installing the server. Taking the motherboard as an example, when testing the motherboard, a probe is usually used to perform performance tests on the motherboard. The test results obtained by this detection method can only reflect part of the performance of the motherboard, and cannot fully reflect the performance of the motherboard in the actual use environment, resulting in poor accuracy and reliability of the performance test results. Summary of the invention

[0003] The embodiment of the present application provides a server component performance detection device to at least solve the problem of poor accuracy of server mainboard performance testing in the related art.

[0004] According to one embodiment of the present application, a server component performance detection device is provided, including: a workbench; a detection mechanism, which is arranged in the workbench; a storage table, which is connected to the workbench, the storage table has a placement space, the components are placed in the placement space, and the detection mechanism can extend into the placement space and detect the components; a temperature simulation mechanism, at least a part of the temperature simulation mechanism can cover the placement space and is connected to the placement space, and the temperature simulation mechanism can control the temperature in the placement space so that the components are in a predetermined temperature state.

[0005] In an exemplary embodiment, there are multiple temperature simulation mechanisms, including a high temperature simulation mechanism and a low temperature simulation mechanism. The storage table has multiple placement spaces, and the high temperature simulation mechanism and the low temperature simulation mechanism are respectively docked with different placement spaces.

[0006] In an exemplary embodiment, the temperature simulation mechanism includes: a cover body, which can be raised and lowered, and the cover body can be opened and closed to cover the placement space; a heat exchanger, which is connected to the cover body through a delivery pipeline, and the gas after heat exchange by the heat exchanger is transported into the cover body through the delivery pipeline; a pump body, which is arranged on the delivery pipeline and provides power for the gas flow; an air storage part, which is connected to the heat exchanger through an air supply pipeline, and the cover body is connected to the air supply pipeline or the heat exchanger through a return pipeline.

[0007] In an exemplary embodiment, the server component performance detection device also includes a detection component, which is arranged on the inner wall of the cover body. The detection component includes at least one of a temperature detection component and an air pressure detection component. The inner wall of the cover body is provided with an abutment arm. When the cover body is arranged above the placement space, the abutment arm abuts against the component.

[0008] In an exemplary embodiment, the server component performance detection device also includes a placement drive assembly, the placement table is rotatably arranged relative to the workbench, the placement drive assembly is connected to the placement table and drives the placement table to rotate, the placement table has multiple placement spaces, and the placement spaces are arranged at intervals along the circumference of the placement table.

[0009] In an exemplary embodiment, the placement space has a large-mouth section and a small-mouth section arranged in sequence from top to bottom, and a step surface is formed between the large-mouth section and the small-mouth section. Components can be supported on the step surface, and when the temperature simulation mechanism cover is arranged above the placement space, a sealed cavity is formed inside the temperature simulation mechanism, and the side wall of the large-mouth section has an avoidance groove for removing components.

[0010] In an exemplary embodiment, the detection mechanism includes: a support plate, the support plate is located below the placement space, and a test probe is arranged on the support plate; a lifting assembly, the lifting assembly is connected to the support plate, and drives the support plate to rise and fall synchronously so that the test probe can dock and separate from the components; an adjustment assembly, the adjustment assembly is arranged between the lifting assembly and the support plate, and the adjustment assembly drives the support plate to move laterally to change the relative position between the test probe and the components.

[0011] In an exemplary embodiment, the lifting assembly includes: a lifting drive member; a lifting plate, the lifting plate is drivingly connected to the lifting drive member, one of the lifting plate and the support plate has a driving hole, and the other of the lifting plate and the support plate has a driving rod, the driving hole includes a large diameter section and a small diameter section connected in sequence longitudinally, the end of the driving rod includes an expanded diameter section and a necked section connected in sequence longitudinally, the expanded diameter section is located in the large diameter section, the necked section is located in the small diameter section, the expanded diameter section and the large diameter section, and the necked section and the small diameter section are clearance-fitted, and the diameter of the expanded diameter section is greater than the diameter of the small diameter section.

[0012] In an exemplary embodiment, the lifting assembly includes a lifting plate, and the adjustment assembly includes: an adjustment frame, which is located between the lifting plate and the support plate; a first adjustment assembly, which is connected to the lifting plate and is driven by the adjustment frame, and the first adjustment assembly drives the adjustment frame and the support plate to move synchronously along a first lateral direction; a second adjustment assembly, which is connected to the adjustment frame and is driven by the support plate, and the second adjustment assembly drives the support plate to move along a second lateral direction, and the first direction is set at an angle to the second direction.

[0013] In an exemplary embodiment, there are multiple temperature simulation mechanisms, including a high-temperature simulation mechanism and a low-temperature simulation mechanism. The temperature simulation mechanism includes a cover body, a heat exchanger, a pump body and an air storage member. The cover body can be raised and lowered, and the cover body can be opened and closed to cover the placement space, and together with the components, a sealed cavity is formed. The heat exchanger is connected to the cover body through a delivery pipeline; the pump body is arranged on the delivery pipeline, the air storage member is connected to the heat exchanger through an air supply pipeline, and the cover body is connected to the air supply pipeline through a return pipeline; the detection mechanism includes a support plate, a lifting assembly and an adjustment assembly. The support plate is located below the placement space, and a test probe is arranged on the support plate. The lifting assembly includes a lifting plate, which is connected to the support plate and drives the support plate to rise and fall synchronously. The adjustment assembly includes an adjustment frame, a first adjustment assembly and a second adjustment assembly. The adjustment frame is located between the lifting plate and the support plate. The first adjustment assembly is connected to the adjustment frame and drives the adjustment frame and the support plate. The device moves synchronously along a first lateral direction, and the second adjustment component is connected to the support plate and drives the support plate to move in a second lateral direction that is perpendicular to the first direction. The detection mechanism also includes a connecting rod, a mounting plate, an image acquisition component and a light-emitting component. The connecting rod is connected to the lifting plate and extends to the top of the support plate. The mounting plate is connected to the top of the connecting rod. The image acquisition component and the light-emitting component are both arranged on the mounting plate, and the image acquisition component collects images of components. The storage table can be rotatably arranged, and the placement space has multiple and is arranged at intervals along the circumference of the storage table. The server component performance detection device also includes a barcode scanner, a coding machine and a manipulator. Each temperature simulation mechanism, barcode scanner and coding machine cooperates with different placement spaces respectively. The coding machine adds a label to the component, and the barcode scanner reads the label. The manipulator transports the component to a qualified conveyor line or an unqualified conveyor line according to the scanning result of the barcode scanner and the detection result of the detection mechanism.

[0014] By applying the technical solution of the present invention, a temperature simulation mechanism is provided, the temperature simulation mechanism can cooperate with the storage table, and the temperature simulation mechanism can be connected with the placement space for placing components, so that the temperature simulation mechanism can change the temperature conditions in the placement space. In this way, the server component performance detection device has the function of temperature simulation, so that the environment in which the mainboard is tested can be more in line with the actual use environment. After the temperature simulation mechanism adjusts the temperature, the detection mechanism detects the components again, so that the performance results obtained by the detection are more in line with the actual use environment, more real and accurate, and more referenceable. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the server component performance detection device of the present application;

[0016] Figure 2 yes Figure 1 A schematic diagram of the structure of the central storage table and the storage drive assembly;

[0017] Figure 3 yes Figure 2 A schematic diagram of the structure from another perspective;

[0018] Figure 4 It is a schematic diagram of the structure of the storage table and the temperature simulation mechanism;

[0019] Figure 5 It is a schematic diagram of the structure of the storage table and the cover body;

[0020] Figure 6 It is a structural diagram of the detection mechanism.

[0021] The above drawings include the following reference numerals:

[0022] 10. Workbench; 20. Detection mechanism; 21. Support plate; 211. Test probe; 22. Lifting assembly; 221. Lifting drive member; 222. Lifting plate; 23. Adjustment assembly; 231. Adjustment frame; 232. First adjustment assembly; 2321. Adjustment motor; 2322. Adjustment gear; 2323. Adjustment rack; 233. Second adjustment assembly; 24. Connecting rod; 25. Mounting plate; 26. Image acquisition member; 27. Light-emitting member; 28. Distance detection member; 30. Storage table; 3 1. Placement space; 311. Avoidance groove; 40. Temperature simulation mechanism; 41. High temperature simulation mechanism; 42. Low temperature simulation mechanism; 43. Cover body; 431. Abutment arm; 44. Heat exchanger; 45. Pump body; 46. Gas storage part; 47. Delivery pipeline; 48. Gas supply pipeline; 49. Return pipeline; 50. Detection part; 60. Storage drive assembly; 61. Storage drive part; 62. Bevel gear; 63. Conveyor belt; 70. Barcode scanner; 80. Coding machine; 90. Robot; 100. Components. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0025] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0026] In order to solve the problem of poor accuracy in server mainboard performance testing in the related art, an embodiment of the present application provides a server component performance detection device.

[0027] like Figures 1 to 6 A server component performance detection device shown in the figure includes a workbench 10, a detection mechanism 20, a storage table 30 and a temperature simulation mechanism 40, wherein the detection mechanism 20 is arranged in the workbench 10; the storage table 30 is connected to the workbench 10, and the storage table 30 has a placement space 31, and the components 100 are placed in the placement space 31. The detection mechanism 20 can extend into the placement space 31 and detect the components 100; at least a part of the temperature simulation mechanism 40 can cover the placement space 31 and be connected to the placement space 31, and the temperature simulation mechanism 40 can control the temperature in the placement space 31 so that the components 100 are in a predetermined temperature state.

[0028] In this embodiment, a temperature simulation mechanism 40 is provided. The temperature simulation mechanism 40 can cooperate with the storage table 30. The temperature simulation mechanism 40 can be connected with the placement space 31 for placing the components 100, so that the temperature simulation mechanism 40 can change the temperature conditions in the placement space 31. In this way, the server component performance detection device has the function of temperature simulation, so that the environment in which the motherboard is tested can be more in line with the actual use environment. After the temperature simulation mechanism 40 adjusts the temperature, the detection mechanism 20 detects the components 100 again, so that the performance results obtained by the detection are more in line with the actual use environment, more real and accurate, and more referenceable.

[0029] This embodiment is described by taking the component 100 to be detected as a mainboard as an example. Of course, the component 100 may also be other devices and is not limited to the mainboard of this embodiment.

[0030] like Figure 1 As shown, in the present embodiment, there are multiple temperature simulation mechanisms 40, including a high temperature simulation mechanism 41 and a low temperature simulation mechanism 42. The high temperature simulation mechanism 41 and the low temperature simulation mechanism 42 can respectively make the temperature of the placement space 31 be in a high temperature state or a low temperature state as needed, so that the environment where the motherboard is located can be switched between high temperature and low temperature as needed. In this way, the performance of the motherboard in a high temperature environment and a low temperature environment can be tested respectively, thereby ensuring the comprehensiveness of the test results.

[0031] like Figure 2As shown, the storage table 30 of the present embodiment adopts a rotatable setting form, and a plurality of placement spaces 31 are arranged thereon, and the high temperature simulation mechanism 41 and the low temperature simulation mechanism 42 are respectively docked with different placement spaces 31, so that different motherboards can be placed in different placement spaces 31, and the high temperature simulation mechanism 41 and the low temperature simulation mechanism 42 can respectively adjust the temperature of different motherboards, and the setting of multiple detection mechanisms 20 can achieve the effect of simultaneous detection of multiple motherboards, thereby greatly improving the detection efficiency.

[0032] like Figure 4 As shown, in the present embodiment, the temperature simulation mechanism 40 includes a cover body 43, a heat exchanger 44, a pump body 45 and an air storage member 46. The cover body 43 can be raised and lowered. The cover body 43 can be opened and closed above the placement space 31. The bottom of the cover body 43 is opened. In this way, when the cover body 43 rises, the placement space 31 can be opened, so that the mainboard can be loaded into the placement space 31 or taken out of the placement space 31. When the cover body 43 descends, it can be covered above the placement space 31, so that the cover body 43 is connected with the placement space 31. By introducing hot air or cold air into the cover body 43, the temperature of the placement space 31 can be adjusted, that is, the temperature of the environment in which the mainboard is located can be adjusted. The heat exchanger 44 is connected to the cover body 43 through the delivery pipeline 47. The heat exchanger 44 plays a role in heat exchange. The temperature of the air entering the heat exchanger 44 does not need to be specially set. The air forms high-temperature or low-temperature gas after heat exchange in the heat exchanger 44. The gas can be transported to the cover body 43 through the delivery pipeline 47 to adjust the environment of the placement space 31. The pump body 45 is arranged on the delivery pipeline 47 and provides power for the gas flow. The gas storage part 46 is connected to the heat exchanger 44 through the air supply pipeline 48. The gas storage part 46 stores compressed air and other gases. The gas in the gas storage part 46 can be transported to the heat exchanger 44 through the air supply pipeline 48, thereby achieving the effect of supplying air to the heat exchanger 44. At the same time, the present embodiment is also provided with a return pipe 49, and the cover body 43 is connected with the gas supply pipe 48 or the heat exchanger 44 through the return pipe 49. In this way, the gas delivered to the cover body 43 through the delivery pipe 47 can be returned to the heat exchanger 44 through the return pipe 49, so that the gas can be recycled. On the one hand, the amount of gas that needs to be provided is reduced, and the amount of gas used is reduced. On the other hand, the gas with a certain temperature can be recovered through the return pipe 49. When this part of the gas passes through the heat exchanger 44 for heating or cooling again, the amount of heat exchanged by the heat exchanger 44 is reduced, thereby realizing the recycling of high-temperature and low-temperature gases, improving the cooling and heating efficiency of the heat exchanger 44, thereby improving the efficiency of environmental simulation and achieving energy-saving effects, and it can also maintain gas flow to stabilize the temperature in the cover body 43.

[0033] The temperature simulation mechanism 40 of this embodiment also includes a mounting frame, which is placed upright on the workbench 10. The mounting frame adopts an inverted L-shaped structure. A lifting drive member 221 is arranged on the upper bottom surface of the mounting frame. The lifting drive member 221 can adopt a lifting cylinder. The cover body 43 is arranged at the bottom end of the lifting drive member 221, so that the lifting drive member 221 can drive the cover body 43 to rise and fall, thereby realizing the coordination between the cover body 43 and the placement space 31.

[0034] Optionally, control valves can be provided on the delivery pipeline 47, the air supply pipeline 48, and the return pipeline 49 as needed to control the opening and closing of the pipelines. In this embodiment, control valves are provided only on the air supply pipeline 48 and the return pipeline 49, and the connection between the return pipeline 49 and the air supply pipeline 48 is located between the control valve on the air supply pipeline 48 and the air storage member 46, so that when the cover body 43 descends, the control valve opens, thereby achieving communication between the air storage member 46, the heat exchanger 44, and the cover body 43, and achieving temperature adjustment of the placement space 31.

[0035] Of course, the specific structural form of the temperature simulation mechanism 40 is not limited to the above-mentioned setting mode of this embodiment, and other setting forms are also possible, as long as it can cooperate with the placement space 31 to adjust the temperature in the placement space 31.

[0036] like Figure 5 As shown, in this embodiment, the server component performance detection device further includes a detection member 50, which is arranged at the inner wall of the cover body 43, and is used to detect the environment in the placement space 31. The detection member 50 includes at least one of a temperature detection member and an air pressure detection member. The detection member 50 of this embodiment includes a temperature detection member and an air pressure detection member, so that the temperature detection member and the air pressure detection member can detect the temperature and air pressure in the placement space 31, thereby controlling the temperature and pressure in the placement space 31 and ensuring the safety and accuracy of the test.

[0037] In this embodiment, an abutment arm 431 is provided on the inner wall of the cover body 43. The abutment arm 431 is columnar and extends toward the mainboard. In this way, when the cover body 43 is covered above the placement space 31, while the cover body 43 gradually covers the placement space 31, the abutment arm 431 also gradually approaches the mainboard, until the cover body 43 moves downward to the position, and the abutment arm 431 abuts against the component 100. At this time, the abutment arm 431 can keep the mainboard in the placement space 31, thereby preventing the mainboard from shaking, etc., and cooperate with the detection mechanism 20 below to ensure that the test probe 211 of the detection mechanism 20 can contact and cooperate with the contact on the mainboard, ensuring the smooth progress of the test. The number of abutment arms 431 can be set as needed. In this embodiment, four abutment arms 431 are provided. The top ends of the two abutment arms 431 are respectively connected to the top surface of the inner wall of the cover body 43, and the bottom ends extend downward to the opening at the bottom, so as to achieve abutment with the mainboard.

[0038] Since the placement table 30 of this embodiment is rotatable relative to the workbench 10, the placement table 30 of this embodiment adopts a circular turntable structure, and a high temperature simulation mechanism 41 and a low temperature simulation mechanism 42 are respectively arranged on the circumferential side. Figure 2 and Figure 3 As shown, the server component performance detection device also includes a placement drive component 60, which is connected to the placement table 30 and drives the placement table 30 to rotate. In this way, the placement table 30 can rotate under the drive of the placement drive component, so that each placement space 31 switches the corresponding mechanism components, so that each placement space 31 can perform different test steps at the same time, thereby achieving the effect of testing multiple motherboards at the same time, greatly improving the test efficiency.

[0039] Optionally, the storage drive assembly 60 can be in the form of a drive member and a transmission assembly as needed, wherein the transmission assembly can be in various transmission forms such as gear transmission, belt transmission, worm gear transmission, etc. as needed. The storage drive member 61 of this embodiment adopts a motor, and the transmission assembly includes a gear transmission assembly and a belt transmission assembly. The gear transmission includes two bevel gears 62, one of which is connected to the storage drive member 61 for driving, and the two bevel gears 62 are meshed, and the other bevel gear 62 is sleeved with a conveyor belt 63. The other end of the conveyor belt 63 is sleeved on the central axis below the storage table 30, and the storage table 30 can be driven to rotate through the central axis to achieve the switching of the placement space 31. Of course, the above-mentioned storage drive assembly 60 is not limited to the setting method of this embodiment, and it can be adjusted as needed.

[0040] Since the temperature simulation mechanism 40 and the detection component of the present embodiment are respectively located above and below the placement space 31, the placement space 31 of the present embodiment adopts a setting mode of longitudinally penetrating the storage platform 30. In order to place the mainboard in the placement space 31, the placement space 31 of the present embodiment has a large-mouth section and a small-mouth section arranged in sequence from top to bottom, and a step surface is formed between the large-mouth section and the small-mouth section, the step surface faces upward, the size of the large-mouth section is substantially the same as the size of the mainboard, and the size of the small-mouth section is smaller than the size of the mainboard, so that when the mainboard is placed in the placement space 31, the mainboard can be supported on the step surface, thereby achieving the effect of supporting the mainboard on the storage platform 30, and the mainboard is basically completely located in the placement space 31, which also helps to fix the position of the mainboard and avoid the mainboard from being offset. At the same time, when the cover body 43 of the temperature simulation mechanism 40 is covered above the placement space 31, since the bottom surface of the cover body 43 is in contact with the upper surface of the storage table 30, the cavity and the large mouth section inside the cover body 43 together form a sealed sealed cavity. The sealed cavity prevents the hot air or cold air inside the cover body 43 from leaking out. On the one hand, it is beneficial to ensure the temperature in the sealed cavity and reduce the temperature change, thereby reducing the heat exchange demand of the heat exchanger 44 and achieving energy saving. On the other hand, due to the separation of the sealed cavity, the detection mechanism 20 located under the main board will not be affected by hot air or cold air, thereby avoiding the influence of the temperature adjustment mechanism on the detection mechanism 20, thereby ensuring the accuracy and reliability of the detection mechanism 20.

[0041] In this embodiment, the top surface of the storage table 30 is provided with a protruding portion protruding upward, and the placement space 31 is provided in the protruding portion, so that a part of the placement space 31 is higher than the upper surface of the storage table 30, and the inside of the protruding portion forms at least a part of the wide-mouth section, so that the side wall of the wide-mouth section partially protrudes from the upper surface of the storage table 30. In order to facilitate the removal of the mainboard, this embodiment is provided with an avoidance groove 311 on the side wall of the wide-mouth section, so that when the mainboard is placed in the placement space 31, the side of the mainboard can be exposed to the placement space 31 through the avoidance groove 311, so that when the mainboard needs to be removed, personnel or other components can contact the mainboard through the avoidance groove 311, thereby removing the mainboard from the placement space 31, and achieving the effect of convenient removal of the mainboard.

[0042] The opening size of the cover body 43 of this embodiment is larger than the size of the large mouth section, so that when the cover body 43 is downwardly covered on the placement space 31, the cover body 43 can also cover the protrusion inside, thereby avoiding the leakage of hot air and cold air caused by the setting of the avoidance groove 311, and ensuring that the sealed cavity has a certain degree of sealing.

[0043] It should be noted that the sealed cavity mentioned above does not mean that the sealed cavity is completely sealed, but means that the sealed cavity itself has a certain degree of sealing, which can prevent the leakage of hot air and cold air to a large extent, and realize the separation of the sealed cavity from the outside.

[0044] like Figure 6 As shown, in this embodiment, the detection mechanism 20 includes a support plate 21, a lifting assembly 22 and an adjustment assembly 23. The support plate 21 is located below the placement space 31. A test probe 211 is arranged on the support plate 21. The test probe 211 can contact the contact on the mainboard, thereby realizing the performance test of the mainboard. The lifting assembly 22 is connected to the support plate 21 and drives the support plate 21 to rise synchronously. In this way, the lifting assembly 22 drives the support plate 21 to rise so that the test probe 211 can contact and dock with the mainboard, so that the test can be carried out. After the test is completed, the lifting assembly 22 drives the support plate 21 to descend, so that the test probe 211 is separated from the mainboard, and the mainboard can be transferred. The adjustment assembly 23 is arranged between the lifting assembly 22 and the support plate 21. The adjustment assembly 23 drives the support plate 21 to move horizontally. The main function of the adjustment assembly 23 is to change the relative position between the test probe 211 and the component 100, so that the position of the test probe 211 can be adjusted when the performance test is carried out to ensure that the position of the test probe 211 can be aligned with the contact and ensure the accuracy of the docking test.

[0045] In this embodiment, the workbench 10 adopts a shell-like structure, the storage table 30 and the temperature simulation mechanism 40 are both arranged above the workbench 10, and the lifting assembly 22 is arranged in the workbench 10 as a whole. The lifting assembly 22 mainly consists of a test probe 211 extending out of the workbench 10 to cooperate with the main board, and other components are basically arranged in the workbench 10, so as to protect the lifting assembly 22. The lifting assembly 22 includes a lifting drive member 221 and a lifting plate 222. The lifting drive member 221 of this embodiment adopts a telescopic cylinder, which is longitudinally arranged below the lifting plate 222 and is connected to the lifting plate 222. In this way, the lifting plate 222 can be lifted and lowered under the drive of the telescopic cylinder. At the same time, the lifting plate 222 of this embodiment also cooperates with the support plate 21, and the two are lifted and lowered together. Specifically, one of the lifting plate 222 and the support plate 21 has a driving hole, and the other of the lifting plate 222 and the support plate 21 has a driving rod. In this embodiment, a driving rod extending downward is arranged at the bottom of the support plate 21, and a driving hole is arranged on the upper surface of the lifting plate 222, wherein the driving hole includes a large diameter section and a small diameter section connected in sequence longitudinally, and the small diameter section is located above the large diameter section, and the end of the driving rod includes an expanded diameter section and a necked section connected in sequence longitudinally, and the necked section is located above the expanded diameter section. In this way, the expanded diameter section is located in the large diameter section, and the necked section is located in the small diameter section, and there is a clearance fit between the expanded diameter section and the large diameter section, and between the necked section and the small diameter section, and the diameter of the expanded diameter section is larger than that of the small diameter section, so that on the one hand, the driving The matching form between the hole and the driving rod can ensure that the driving hole and the driving rod can stably and reliably realize the upward and downward linkage matching. When the lifting plate 222 is lifted and lowered, the lifting plate 222 can drive the support plate 21 to lift and lower together through the abutment and matching between the end face of the large diameter section and the end face of the expanded diameter section, thereby realizing the lifting and lowering movement of the test probe 211. On the other hand, due to the matching form of the gap, the support plate 21 has a certain movement gap relative to the lifting plate 222, so that the support plate 21 can move within a certain range relative to the lifting plate 222, thereby facilitating the adjustment component 23 to fine-tune the lateral position of the support plate 21, thereby realizing the reliable matching between the test probe 211 and the contact. Of course, the specific matching mode between the support plate 21 and the lifting plate 222 is not limited to the above-mentioned form of this embodiment. The setting positions of the driving hole and the driving rod can also be interchanged, or other matching modes can also be adopted.

[0046] In this embodiment, the adjustment component 23 includes an adjustment frame 231, a first adjustment component 232 and a second adjustment component 233. In the longitudinal direction, the adjustment frame 231 is located between the lifting plate 222 and the support plate 21. There is no direct connection between the adjustment frame 231 and the lifting plate 222 and the support plate 21. It cooperates with the lifting plate 222 and the support plate 21 through the first adjustment component 232 and the second adjustment component 233 respectively. The first adjustment component 232 is connected to the lifting plate 222 and is driven by the adjustment frame 231. The first adjustment component 232 drives the adjustment frame 231 and the support plate 21 to move synchronously along the first horizontal direction, so that the support plate 21 and the test probe 211 thereon can adjust their positions in the first direction. Similarly, the second adjustment component 233 is connected to the adjustment frame 231 and is driven by the support plate 21. The second adjustment component 233 drives the support plate 21 to move along the second horizontal direction, so that the support plate 21 and the test probe 211 thereon can adjust their positions in the second direction, and the first direction is set at an angle to the second direction. This embodiment adopts a vertical setting between the first direction and the second direction, so that the support plate 21 can be adjusted at any position in the horizontal direction as needed, so that the test probe 211 can be accurately docked and matched with the contact.

[0047] The first adjustment component 232 and the second adjustment component 233 of this embodiment have basically the same structural form. Taking the first adjustment component 232 as an example, the first adjustment component 232 includes an adjustment motor 2321, an adjustment gear 2322 and an adjustment rack 2323, wherein the adjustment motor 2321 is arranged on the lifting plate 222, and the adjustment gear 2322 is connected to the output shaft of the adjustment motor 2321, the adjustment rack 2323 is arranged on the side of the adjustment frame 231, and meshes with the adjustment gear 2322, and the extension direction of the adjustment rack 2323 is parallel to the first direction, so that the adjustment motor 2321 drives the adjustment frame 231 to move along the first direction through the adjustment gear 2322 and the adjustment rack 2323, so as to achieve the adjustment of the support plate 21 in the first direction. The difference between the structure of the second adjustment component 233 and the first adjustment component 232 is that the adjustment motor 2321 of the second adjustment component 233 is arranged on the adjustment frame 231, and the adjustment rack 2323 thereof is arranged on the support plate 21 and extends along the second direction. In this way, the first adjustment component 232 can cooperate with the second adjustment component 233 to jointly adjust the lateral position of the support plate 21 .

[0048] In this embodiment, a slide rail assembly is further provided between the adjustment frame 231 and the lifting plate 222. The slide rail assembly includes a slider protruding downwardly provided on the bottom surface of the adjustment frame 231, and a slide rail provided on the upper surface of the lifting plate 222. The slider is embedded in the slide rail and can move along the slide rail. The slide rail extends along a first direction, so that the adjustment frame 231 can move smoothly. In this embodiment, slide rail assemblies are provided on both opposite sides of the adjustment frame 231, so as to ensure the smooth movement of the adjustment frame 231 and avoid tipping.

[0049] In this embodiment, guide rods are also provided on the lifting plate 222, and the guide rods are connected to the workbench 10, so that the guide rods can guide the lifting and lowering movement of the lifting plate 222. The number of guide rods can be set as needed. In this embodiment, four guide rods are provided, and the four guide rods are arranged at the four corners of the lifting plate 222, so as to ensure the smooth lifting and lowering of the lifting plate 222.

[0050] In this embodiment, in addition to the above-mentioned test probe 211 and its adjustment components, the detection mechanism 20 also includes a connecting rod 24, a mounting plate 25, an image acquisition component 26 and a light emitting component 27, wherein the connecting rod 24 is connected to the lifting plate 222, a through hole is provided on the support plate 21, the connecting rod 24 extends upward and passes through the through hole to extend above the support plate 21, and the mounting plate 25 is connected to the top of the connecting rod 24, so that the mounting plate 25 is located above the support plate 21, and the image acquisition component 26 and the light emitting component 27 are both arranged on the mounting plate 25, and the size of the mounting plate 25 is smaller than that of the support plate 21, so that the mounting plate 25 does not affect the installation of components such as the test probe 211 on the support plate 21. The image acquisition component 26 on the mounting plate 25 can acquire images of the components 100, so that it can not only judge whether the appearance of the mainboard is normal according to the image of the mainboard, but also assist in judging the position of the contact for adjustment, and the light source can provide illumination for the image acquisition component 26 to ensure the image acquisition effect. The image acquisition component 26 of this embodiment adopts a camera, and the light source is a light bulb.

[0051] The detection mechanism 20 of this embodiment also includes a distance detection member 28. The distance detection member 28 of this embodiment adopts an infrared transmitter. The distance detection member 28 is connected to the support plate 21 and is located at the test probe 211. It can assist in judging the position of the test probe 211 based on the detection of the contact position by the test probe 211. The number of test probes 211 and distance detection members 28 can be set as needed. In this embodiment, two test probes 211 are provided, and two distance detection members 28 are provided. Two distance detection members 28 are provided on the circumference of each test probe 211, and the distance between the two distance detection members 28 and the test probe 211 is equal. When the position of the support plate 21 is adjusted by the first adjustment component 232 and the second adjustment component 233,

[0052] The support plate 21 is moved according to the distance between the landing point of the infrared emitter on the mainboard and the corresponding contact. When the distances between the two infrared emitters on the side of each test probe 211 and the corresponding contact are the same, the support plate 21 stops moving, indicating that the position adjustment of the support plate 21 is completed and the test probe 211 has been aligned with the contact. At this time, the lifting drive 221 drives the lifting plate 222 and the support plate 21 to rise, so that the test probe 211 is in precise contact with the contact, thereby improving the accuracy of the contact between the test probe 211 and the contact and reducing the possibility of misalignment.

[0053] like Figure 1 As shown, in this embodiment, the server component performance detection device also includes a barcode scanner 70, a coding machine 80, a manipulator 90, a qualified conveyor line and an unqualified conveyor line. The temperature simulation mechanisms 40, the barcode scanner 70, and the coding machine 80 of this embodiment are respectively arranged at intervals along the circumference of the storage table 30, and can cooperate with different placement spaces 31, so that the placement space 31 can be switched between the temperature simulation mechanisms 40, the barcode scanner 70, and the coding machine 80 in sequence through the rotation of the storage table 30, so as to realize different operations on the motherboard. In this embodiment, the barcode scanner 70, the manipulator 90, the coding machine 80, the high temperature simulation mechanism 41, and the low temperature simulation mechanism 42 are arranged in sequence in the circumference. Of course, the specific positions can be adjusted as needed. Among them, the coding machine 80 adds a mark to the mainboard, and can spray a QR code or other mark on the mainboard to mark the mainboard, while the barcode scanner 70 is used to read the mark to identify the mainboard. The robot 90 transports the components 100 to a qualified conveyor line or an unqualified conveyor line according to the scanning results of the barcode scanner 70 and the detection results of the detection mechanism 20. In this way, automated detection, judgment and transportation are realized, thereby improving detection efficiency.

[0054] The specific use process of the server component performance detection device of this embodiment is as follows: the mainboard is placed in the placement space 31, the placement space 31 is rotated to the bottom of the coding machine 80, the coding machine 80 codes the mainboard, and then the storage table 30 is rotated, the placement space 31 is rotated to the position of the high temperature simulation mechanism 41, the cover body 43 of the high temperature simulation mechanism 41 descends, the placement space 31 is covered, the control valve is opened, and the hot air generated by the heat exchanger 44 is transported to the sealed chamber to heat the mainboard, and then the detection mechanism 20 below is actuated to adjust the position of the test probe 211, and then the support plate 21 rises, the test probe 211 contacts the contact point of the mainboard, and a performance test is performed, and a photo appearance test is performed at the same time. After the test is completed, the lifting component 22 is reset, the high temperature simulation mechanism 41 is reset, and the storage table 3 0 rotates, the placement space 31 rotates to the low-temperature adjustment mechanism, the cover body 43 at the low-temperature adjustment mechanism descends and introduces cold air into the sealed cavity, the detection mechanism 20 below is activated to perform a performance test on the mainboard, and after the test is completed, the low-temperature adjustment mechanism and the detection mechanism 20 are reset, the storage table 30 continues to rotate to the position of the barcode scanner 70, the barcode scanner 70 reads the two-dimensional code information, the detection result of the detection mechanism 20 and the scanning structure of the barcode scanner 70 are sent to the control system of the manipulator 90, which determines whether the high-temperature performance, low-temperature performance, and appearance of the corresponding mainboard are qualified according to the detection and scanning results, and then the manipulator 90 grabs any unqualified mainboard and puts it on the unqualified conveyor line, and grabs the mainboard that passes all three tests and puts it on the qualified conveyor line.

[0055] It should be noted that, the multiple in the above embodiments refers to at least two.

[0056] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0057] 1. Solved the problem of poor accuracy of server motherboard performance testing in related technologies;

[0058] 2. The server component performance testing device has the function of temperature simulation, so that the environment in which the motherboard is tested can be more consistent with the actual use environment. After the temperature simulation mechanism adjusts the temperature, the testing mechanism tests the components again, so that the performance results obtained by the test are more consistent with the actual use environment, more real and accurate, and more referenceable;

[0059] 3. Recycle the gas with a certain temperature through the reflux pipeline, so as to realize the recycling of high-temperature and low-temperature gas, improve the cooling and heating efficiency of the heat exchanger, thereby improving the efficiency of environmental simulation and achieving energy-saving effect;

[0060] 4. The separation of the sealed cavity prevents the detection mechanism located under the mainboard from being affected by hot or cold air, thereby avoiding the influence of the temperature adjustment mechanism on the detection mechanism and ensuring the accuracy and reliability of the detection mechanism components;

[0061] 5. The adjustment components and image acquisition components cooperate with each other to accurately adjust the position of the test probe, thereby improving the contact accuracy between the test probe and the contact point and reducing the possibility of misalignment.

[0062] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0063] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0064] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A server component performance detection device, characterized in that: include: Workbench (10); A detection mechanism (20), wherein the detection mechanism (20) is arranged in the workbench (10); A storage table (30), the storage table (30) being connected to the workbench (10), the storage table (30) having a storage space (31), the components (100) being placed in the storage space (31), and the detection mechanism (20) being able to extend into the storage space (31) and detect the components (100); A temperature simulation mechanism (40), at least a portion of which can cover the placement space (31) and is in communication with the placement space (31), and the temperature simulation mechanism (40) can control the temperature in the placement space (31) so that the component (100) is in a state of a predetermined temperature.

2. The server component performance detection device according to claim 1, characterized in that: The temperature simulation mechanism (40) is multiple and includes a high temperature simulation mechanism (41) and a low temperature simulation mechanism (42); the storage table (30) has multiple placement spaces (31); the high temperature simulation mechanism (41) and the low temperature simulation mechanism (42) are respectively docked and matched with different placement spaces (31).

3. The server component performance detection device according to claim 1, characterized in that: The temperature simulation mechanism (40) comprises: A cover body (43), wherein the cover body (43) can be raised and lowered, and the cover body (43) can be opened and closed to cover the placement space (31); A heat exchanger (44), wherein the heat exchanger (44) is connected to the housing (43) via a delivery pipeline (47), and the gas after heat exchange in the heat exchanger (44) is delivered to the housing (43) via the delivery pipeline (47); A pump body (45), wherein the pump body (45) is disposed on the delivery pipeline (47) and provides power for the gas flow; An air storage member (46), wherein the air storage member (46) is connected to the heat exchanger (44) via an air supply pipeline (48), and the cover body (43) is connected to the air supply pipeline (48) or the heat exchanger (44) via a return pipeline (49).

4. The server component performance detection device according to claim 3, characterized in that: The server component performance detection device further comprises a detection member (50), the detection member (50) being arranged on the inner wall of the cover body (43), the detection member (50) comprising at least one of a temperature detection member and an air pressure detection member, the inner wall of the cover body (43) being provided with an abutment arm (431), and when the cover body (43) is arranged above the placement space (31), the abutment arm (431) abuts against the component (100).

5. The server component performance detection device according to claim 1, characterized in that: The server component performance detection device further comprises a placement drive assembly (60); the placement table (30) is rotatably arranged relative to the workbench (10); the placement drive assembly (60) is connected to the placement table (30) and drives the placement table (30) to rotate; the placement table (30) has a plurality of placement spaces (31); and the placement spaces (31) are arranged at intervals along the circumference of the placement table (30).

6. The server component performance detection device according to claim 1, characterized in that: The placement space (31) comprises a large-mouth section and a small-mouth section arranged in sequence from top to bottom, a step surface is formed between the large-mouth section and the small-mouth section, the component (100) can be supported on the step surface, and when the temperature simulation mechanism (40) is covered above the placement space (31), a sealed cavity is formed inside the temperature simulation mechanism (40), and the side wall of the large-mouth section comprises an avoidance groove (311) for taking out the component (100).

7. The server component performance detection device according to claim 1, characterized in that: The detection mechanism (20) comprises: A support plate (21), the support plate (21) being located below the placement space (31), and a test probe (211) being arranged on the support plate (21); A lifting component (22), the lifting component (22) is connected to the support plate (21) and drives the support plate (21) to rise and fall synchronously, so that the test probe (211) and the component (100) can be docked and separated; An adjustment component (23), wherein the adjustment component (23) is arranged between the lifting component (22) and the support plate (21), and the adjustment component (23) drives the support plate (21) to move laterally to change the relative position between the test probe (211) and the component (100).

8. The server component performance detection device according to claim 7, characterized in that: The lifting assembly (22) comprises: A lifting drive member (221); A lifting plate (222), the lifting plate (222) is drivingly connected to the lifting drive member (221), one of the lifting plate (222) and the support plate (21) has a driving hole, the other of the lifting plate (222) and the support plate (21) has a driving rod, the driving hole comprises a large diameter section and a small diameter section connected in sequence longitudinally, the end of the driving rod comprises an expanding diameter section and a necking section connected in sequence longitudinally, the expanding diameter section is located in the large diameter section, the necking section is located in the small diameter section, the expanding diameter section and the large diameter section, as well as the necking section and the small diameter section are clearance-matched, and the diameter of the expanding diameter section is greater than the diameter of the small diameter section.

9. The server component performance detection device according to claim 7, characterized in that: The lifting assembly (22) comprises a lifting plate (222), and the adjusting assembly (23) comprises: an adjustment frame (231), the adjustment frame (231) being located between the lifting plate (222) and the supporting plate (21); A first adjustment component (232), the first adjustment component (232) is connected to the lifting plate (222) and is drivingly connected to the adjustment frame (231), the first adjustment component (232) drives the adjustment frame (231) and the support plate (21) to move synchronously along a first transverse direction; A second adjustment component (233), the second adjustment component (233) is connected to the adjustment frame (231) and is drivingly connected to the support plate (21), the second adjustment component (233) drives the support plate (21) to move along a second transverse direction, and the first direction is arranged at an angle to the second direction.

10. The server component performance detection device according to claim 1, characterized in that: The temperature simulation mechanism (40) is multiple and includes a high temperature simulation mechanism (41) and a low temperature simulation mechanism (42). The temperature simulation mechanism (40) includes a cover body (43), a heat exchanger (44), a pump body (45) and an air storage member (46). The cover body (43) can be raised and lowered. The cover body (43) can be opened and closed above the placement space (31) and together with the component (100) form a sealed cavity. The heat exchanger (44) is connected to the cover body (43) through a delivery pipeline (47); the pump body (45) is arranged on the delivery pipeline (47); the air storage member (46) is connected to the heat exchanger (44) through an air supply pipeline (48); and the cover body (43) is connected to the air supply pipeline (48) through a return pipeline (49); The detection mechanism (20) comprises a support plate (21), a lifting assembly (22) and an adjustment assembly (23); the support plate (21) is located below the placement space (31); a test probe (211) is arranged on the support plate (21); the lifting assembly (22) comprises a lifting plate (222); the lifting plate (222) is connected to the support plate (21) and drives the support plate (21) to rise and fall synchronously; the adjustment assembly (23) comprises an adjustment frame (231), a first adjustment assembly (231) and a second adjustment assembly (232). The adjusting frame (231) is located between the lifting plate (222) and the supporting plate (21); the first adjusting component (232) is drivingly connected to the adjusting frame (231) and drives the adjusting frame (231) and the supporting plate (21) to move synchronously along a first transverse direction; the second adjusting component (233) is drivingly connected to the supporting plate (21) and drives the supporting plate (21) to move along a second transverse direction that is perpendicular to the first direction; The detection mechanism (20) further comprises a connecting rod (24), a mounting plate (25), an image acquisition component (26) and a light emitting component (27); the connecting rod (24) is connected to the lifting plate (222) and extends above the support plate (21); the mounting plate (25) is connected to the top of the connecting rod (24); the image acquisition component (26) and the light emitting component (27) are both arranged on the mounting plate (25); and the image acquisition component (26) acquires an image of the component (100); The storage table (30) is rotatable, the storage spaces (31) are provided in a plurality and are arranged at intervals along the circumference of the storage table (30), the server component performance detection device further comprises a code scanner (70), a code printer (80) and a manipulator (90), each of the temperature simulation mechanisms (40), the code scanner (70) and the code printer (80) respectively cooperates with different storage spaces (31), the code printer (80) adds a mark to the component (100), the code scanner (70) reads the mark, and the manipulator (90) conveys the component (100) to a qualified conveyor line or an unqualified conveyor line according to the scanning result of the code scanner (70) and the detection result of the detection mechanism (20).

Citation Information

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