Operation method and device of heat dissipation equipment and computer readable storage medium

Abstract

The embodiment of the invention provides a running method and device of heat dissipation equipment and a computer readable storage medium, a server comprises a server component, a first controller and the heat dissipation equipment, and a first operation system and a second operation system are deployed on the first controller. The method comprises the steps that under the condition that a first controller is restarted in the running process of a server, a first operating system controls heat dissipation equipment according to the environment temperature of the server and the component temperature of a first type of server components, and the system running state of a second operating system is detected; under the condition that the system operation state is a started state, the first operation system stops controlling the heat dissipation equipment to operate; and the second operating system controls the heat dissipation equipment according to the environment temperature of the server and the component temperature of the second type of server components. The problem that the timeliness of controlling the heat dissipation equipment is low is solved, and the effect of improving the timeliness of controlling the heat dissipation equipment is achieved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computers, and more specifically, to an operating method and device for a heat dissipation device and a computer-readable storage medium. Background Art

[0002] The heat dissipation on the server has a crucial impact on the life of the server's components and business operations. During the operation of the server, the controller used to control the operation of the heat dissipation device on the server may be restarted, but in the current related technology, in this case, the controller can only continue to control the heat dissipation device on the server after the restart is completed. The heat dissipation device will be unable to dissipate heat for the server for a long time, which in turn affects the operation efficiency of the server.

[0003] With regard to the problems in related technologies such as low timeliness in controlling heat dissipation equipment, no effective solution has yet been proposed. Summary of the invention

[0004] The embodiments of the present application provide a method, an apparatus, and a computer-readable storage medium for operating a heat dissipation device, so as to at least solve the problem of low timeliness of controlling the heat dissipation device in the related art.

[0005] According to an embodiment of the present application, a method for operating a heat dissipation device is provided, wherein a server comprises: a server component, a first controller and a heat dissipation device, a first operating system and a second operating system are deployed on the first controller, and server components allowed to be configured on the server comprise: a first category of server components and a second category of server components, wherein the first category of server components are server components that allow the first operating system to collect component temperatures, and the second category of server components are server components that allow the second operating system to collect component temperatures, and the method comprises:

[0006] During the operation of the server, the first controller is restarted;

[0007] During the restart of the first controller, the heat dissipation device operates according to the operating parameters output by the first operating system, wherein the operating parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the server component of the first category;

[0008] When the first controller completes restarting, the heat dissipation device operates according to the operating parameters output by the second operating system, wherein the operating parameters output by the second operating system are determined based on the ambient temperature of the server and the component temperature of the second category of server components.

[0009] In an exemplary embodiment, the operating parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the first category of server components, including:

[0010] The operating parameter output by the first operating system is a first operating parameter or a second operating parameter, wherein the ambient temperature of the server and the first operating parameter conform to a first control curve, the first control curve is used to indicate a first corresponding relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device, and the second operating parameter is calculated based on the component temperature of the server component of the first category.

[0011] In an exemplary embodiment, the operating parameters output by the second operating system are determined according to the ambient temperature of the server and the component temperature of the second category of server components, including:

[0012] The operating parameter output by the second operating system is a third operating parameter or a fourth operating parameter, wherein the ambient temperature of the server and the third operating parameter conform to a second control curve, the second control curve is used to indicate a second corresponding relationship between the ambient temperature of the server and the operating parameter of the cooling device, and the fourth operating parameter is calculated based on the component temperature of the server component of the second category.

[0013] In an exemplary embodiment, for the same ambient temperature of the server, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first corresponding relationship is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the second corresponding relationship.

[0014] In an exemplary embodiment, the heat dissipation type of the server includes: multiple heat dissipation types, the multiple heat dissipation types include a target heat dissipation type to which the heat dissipation device belongs, the second control curve includes a first curve and a second curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the second curve;

[0015] When the heat dissipation type adopted by the server is the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the first curve;

[0016] When the heat dissipation type adopted by the server is not the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the second curve.

[0017] In an exemplary embodiment, the second category of server components is divided into a set of server components of multiple risk levels, and the second control curve includes: a plurality of parameter curves corresponding to the multiple risk levels, the higher the risk level, the higher the impact of the component temperature on the server, and the higher the risk level of the server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding control curve under the same ambient temperature of the server;

[0018] In the case where there is a faulty component in the server components of the second category, the ambient temperature of the server and the third operating parameter conform to a reference curve among the multiple parameter curves, wherein the faulty component belongs to a target server component set among the server component sets of the multiple risk levels, and the target risk level of the target server component set corresponds to the reference curve.

[0019] In an exemplary embodiment, the server component sets of the multiple risk levels include: a high-risk heat dissipation component set and a low-risk heat dissipation component set, the component temperature of the server components in the high-risk heat dissipation component set has a higher degree of influence on the server than the component temperature of the server components in the low-risk heat dissipation component set has on the server, the multiple parameter curves include a third curve and a fourth curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fourth curve under the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the third curve;

[0020] In the case where the faulty component is the low-risk heat dissipation component, the ambient temperature of the server and the third operating parameter conform to the third curve;

[0021] In the case where the faulty component is the high-risk heat dissipation component, the ambient temperature of the server and the third operating parameter conform to the fourth curve.

[0022] In an exemplary embodiment, for the same ambient temperature of the server, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the third curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first curve.

[0023] In an exemplary embodiment, the heat dissipation type of the server includes: multiple heat dissipation types, the multiple heat dissipation types include the target heat dissipation type to which the heat dissipation device belongs, the second category of server components includes: high-risk heat dissipation components and low-risk heat dissipation components, the component temperature of the high-risk heat dissipation components has a higher degree of influence on the server than the component temperature of the low-risk heat dissipation components, the second control curve includes: a fifth curve, a sixth curve, a seventh curve and an eighth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fifth curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the sixth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the eighth curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the seventh curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the seventh curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fifth curve;

[0024] When there is a faulty component among the server components of the second category, and the faulty component is the high-risk heat dissipation component, the ambient temperature of the server and the third operating parameter meet the eighth curve;

[0025] When there is a faulty component among the server components of the second category, and the faulty component is the low-risk heat dissipation component, the ambient temperature of the server and the third operating parameter meet the seventh curve;

[0026] When there is no faulty component in the server components of the second category and the heat dissipation type adopted by the server is the target heat dissipation type, the ambient temperature of the server and the third operating parameter meet the fifth curve;

[0027] When there are no faulty components in the second category of server components and the heat dissipation type adopted by the server is not the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the sixth curve.

[0028] In an exemplary embodiment, the second category of server components includes: a plurality of server components, the second control curve includes a plurality of component curves corresponding to the plurality of server components one by one, and a server component with a higher degree of influence of component temperature on the server has a higher heat dissipation performance of a heat dissipation device corresponding to an operating parameter on a corresponding control curve under the same ambient temperature of the server;

[0029] When a faulty component is detected in the server components of the second category, the ambient temperature of the server and the third operating parameter conform to a target curve, wherein a target server component among the multiple server components that belongs to the faulty component corresponds to the target curve in the multiple component curves.

[0030] In an exemplary embodiment, a second controller is further deployed on the server, and the method further includes:

[0031] When the first controller is restarted, the heat dissipation device operates according to the operating parameters output by the second controller;

[0032] In the event that the first controller fails to start, the heat dissipation device continues to operate according to the operating parameters output by the second controller;

[0033] When the first controller is successfully started, the heat dissipation device stops operating according to the operating parameters output by the second controller, and operates according to the operating parameters output by the first controller.

[0034] According to another embodiment of the present application, a device for operating a heat dissipation device is provided, wherein a server comprises: a server component, a first controller and a heat dissipation device, wherein a first operating system and a second operating system are deployed on the first controller, and the server components allowed to be configured on the server comprise: a first category of server components and a second category of server components, wherein the first category of server components are server components that allow the first operating system to collect component temperatures, and the second category of server components are server components that allow the second operating system to collect component temperatures, and the device comprises:

[0035] A restart module, used for restarting the first controller during the operation of the server;

[0036] a first operation module, configured to operate the heat dissipation device according to the operation parameters output by the first operating system during the restart of the first controller, wherein the operation parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the server component of the first category;

[0037] A second operating module is used to operate the heat dissipation device according to the operating parameters output by the second operating system when the first controller completes restart, wherein the operating parameters output by the second operating system are determined based on the ambient temperature of the server and the component temperature of the second category of server components.

[0038] According to another embodiment of the present application, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when run.

[0039] According to another embodiment of the present application, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0040] According to another embodiment of the present application, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0041] Through this application, a dual operating system (i.e., a first operating system and a second operating system) is deployed on the first controller in the server. If the first controller is restarted during the operation of the server, the first operating system can control the operation of the heat dissipation device in a short time, so that the operation of the heat dissipation device will not be interrupted for a long time, and the heat dissipation effect of the server is guaranteed. In addition, the first operating system can control the heat dissipation device according to the ambient temperature of the server and the temperature of the components that it can collect, so that the operation control of the heat dissipation device in the control stage of the first operating system is also fine and accurate. The first operating system can also detect the system operation status of the second operating system. If the second operating system has been started, the control right of the heat dissipation device is handed over to the second operating system, and the second operating system controls the operation of the heat dissipation device according to the ambient temperature of the server and the temperature of the components that it can collect. Therefore, the technical problem of low timeliness of controlling the heat dissipation device can be solved, and the timeliness of controlling the heat dissipation device is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a hardware structure block diagram of a server device of an operation method of a heat dissipation device according to an embodiment of the present application;

[0043] Figure 2 is a flow chart of an operating method of a heat dissipation device according to an embodiment of the present application;

[0044] Figure 3 is a flow chart of an operating method of a heat dissipation device according to an embodiment of the present application;

[0045] Figure 4 is a schematic diagram of an RTOS system controlling a server cooling system according to an embodiment of the present application;

[0046] Figure 5is a schematic diagram of the architecture of a BMC according to an embodiment of the present application;

[0047] Figure 6 is a schematic diagram of control and operation of a heat dissipation device according to an embodiment of the present application;

[0048] Figure 7 It is a structural block diagram of an operating device of a heat dissipation device according to an embodiment of the present application. DETAILED DESCRIPTION

[0049] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0051] The method embodiments provided in the embodiments of the present application can be executed in a server device or a similar computing device. Taking running on a server device as an example, Figure 1 1 is a hardware structure block diagram of a server device of a method for operating a heat dissipation device according to an embodiment of the present application. Figure 1 As shown, the server device may include one or more ( Figure 1 Only one is shown in the figure) a processor 102 (the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, wherein the above-mentioned server device may also include a transmission device 106 and an input / output device 108 for communication functions. It can be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above server device. Figure 1 More or fewer components as shown, or with Figure 1 Different configurations are shown.

[0052] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the operation method of the heat dissipation device in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, to implement the above method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories may be connected to the server device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0053] The transmission device 106 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the server device. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0054] In this embodiment, a method for operating a heat dissipation device is provided. A server includes: a server component, a first controller, and a heat dissipation device. A first operating system and a second operating system are deployed on the first controller. Figure 2 is a flow chart of an operating method of a heat dissipation device according to an embodiment of the present application. Figure 2 As shown, the process includes the following steps:

[0055] Step S202: when the first controller is restarted during the operation of the server, the first operating system controls the operation of the heat dissipation device according to the ambient temperature of the server and the component temperature of the first category of server components, and the first operating system detects the system operation state of the second operating system, wherein the first category of server components are server components that allow the first operating system to collect component temperature;

[0056] Step S204, when it is detected that the system operation state is in the started state, the first operating system stops controlling the operation of the heat dissipation device; the second operating system controls the operation of the heat dissipation device according to the ambient temperature of the server and the component temperature of the second category of server components, wherein the second category of server components are server components that allow the second operating system to collect component temperature.

[0057] Through the above steps, a dual operating system (i.e., the first operating system and the second operating system) is deployed on the first controller in the server. If the first controller is restarted during the operation of the server, the heat dissipation device can be operated in accordance with the operating parameters output by the first operating system in a short time, so that the operation of the heat dissipation device will not be interrupted for a long time, and the heat dissipation effect of the server is guaranteed. In addition, the operating parameters output by the first operating system are determined according to the ambient temperature of the server and the temperature of the components that can be collected by it, so that the operation control of the heat dissipation device at this stage is also fine and accurate. If the second operating system has been started, that is, the first controller has completed the restart, the heat dissipation device can be operated according to the operating parameters output by the second operating system. The operating parameters output by the second operating system are determined according to the ambient temperature of the server and the temperature of the components that can be collected by it, and the operation control of the heat dissipation device will be more fine and accurate. Therefore, the technical problem of low timeliness of controlling the heat dissipation device can be solved, and the timeliness of controlling the heat dissipation device can be improved.

[0058] Optionally, in this embodiment, the first operating system and the second operating system may be, but are not limited to, two heterogeneous or homogeneous operating systems, that is, the first operating system and the second operating system may be of the same type or different types.

[0059] Taking the first operating system and the second operating system as heterogeneous operating systems as an example, the first operating system and the second operating system may be operating systems with different sensitivities to response time, for example, the first operating system is more sensitive to response time than the second operating system. Alternatively, the first operating system and the second operating system may be operating systems with different resource occupancy, for example, the first operating system occupies less resources for services than the second operating system. The first operating system is an operating system that starts faster than the second operating system.

[0060] The above-mentioned first operating system and second operating system can be but are not limited to two heterogeneous operating systems deployed on the controller of the embedded system, that is, embedded operating systems. Embedded operating systems can be divided into real-time operating systems (RTOS) and non-real-time operating systems according to the sensitivity to response time. Real-time operating systems can include but are not limited to Free RTOS (Free Real-Time Operating System) and RT Linux (RealTime Linux). Non-real-time operating systems can include but are not limited to contiki (Contiki Operating System), HeliOS (Helix Operating System) and Linux (Linux Operating System), etc.

[0061] The first controller may include, but is not limited to, a baseboard management controller (BMC) of a server. The second operating system is the main operating system of the BMC, which may be, but is not limited to, Linux. The first operating system is the auxiliary operating system of the BMC, which may be, but is not limited to, RTOS. The heat dissipation device may include, but is not limited to, a fan, a heat sink, a heat pipe, etc. The operation control of the heat dissipation device by the first controller may include, but is not limited to, the control of the operation parameters of the heat dissipation device by the first controller. For example, if the heat dissipation device is a fan, the first controller may control the speed duty cycle of the fan. If the heat dissipation device is a heat sink, a heat pipe, etc., the first controller may control the operation parameters such as the flow rate or flow velocity of the condensed material.

[0062] The first category of server components is the server components that allow the first operating system to collect component temperatures, such as: CPU, memory, PCH, network card, etc. The second category of server components is the server components that allow the second operating system to collect component temperatures, such as: CPU, memory, hard disk, network card, raid card, HBA card, HCA card, GPU, etc.

[0063] In this embodiment, a method for operating a heat dissipation device is provided. A server includes: a server component, a first controller, and a heat dissipation device. A first operating system and a second operating system are deployed on the first controller. Server components that are allowed to be configured on the server include: a first category of server components and a second category of server components. The first category of server components are server components that allow the first operating system to collect component temperatures. The second category of server components are server components that allow the second operating system to collect component temperatures. Figure 3is a flow chart of an operating method of a heat dissipation device according to an embodiment of the present application. Figure 3 As shown, the process includes the following steps:

[0064] Step S302, during the operation of the server, the first controller is restarted;

[0065] Step S304, during the restart of the first controller, the heat dissipation device operates according to the operating parameters output by the first operating system, wherein the operating parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the first category of server components;

[0066] Step S306: When the first controller completes restarting, the heat dissipation device operates according to the operating parameters output by the second operating system, wherein the operating parameters output by the second operating system are determined according to the ambient temperature of the server and the component temperature of the second category of server components.

[0067] Through the above steps, a dual operating system (i.e., the first operating system and the second operating system) is deployed on the first controller in the server. If the first controller is restarted during the operation of the server, the heat dissipation device can be operated in accordance with the operating parameters output by the first operating system in a short time, so that the operation of the heat dissipation device will not be interrupted for a long time, and the heat dissipation effect of the server is guaranteed. In addition, the operating parameters output by the first operating system are determined according to the ambient temperature of the server and the temperature of the components that can be collected by it, so that the operation control of the heat dissipation device at this stage is also fine and accurate. If the second operating system has been started, that is, the first controller has completed the restart, the heat dissipation device can be operated according to the operating parameters output by the second operating system. The operating parameters output by the second operating system are determined according to the ambient temperature of the server and the temperature of the components that can be collected by it, and the operation control of the heat dissipation device will be more fine and accurate. Therefore, the technical problem of low timeliness of controlling the heat dissipation device can be solved, and the timeliness of controlling the heat dissipation device can be improved.

[0068] The restart of the first controller may be, but is not limited to, performed by a restart operation performed on the first controller, or may be, but is not limited to, a restart automatically triggered by the operation of a service on the first controller, for example, certain faults on the first controller may be resolved by automatically restarting the first controller.

[0069] Optionally, in this embodiment, the boot time of the first operating system is shorter than the boot time of the second operating system. For example, the first operating system is an operating system that can be quickly booted within 3 to 5 seconds.

[0070] The restart of the first controller may be, but is not limited to, the restart of the entire first controller, that is, the first operating system and the second operating system are restarted. In this case, the first operating system can immediately control the heat dissipation device after a short startup time. The heat dissipation effect of the heat dissipation device will only be interrupted for a very short time.

[0071] The restart of the first controller may also refer to, but is not limited to, the restart of the main operating system of the first controller, that is, the restart of the second operating system, in which case the first operating system can immediately control the heat dissipation device, and the heat dissipation effect of the heat dissipation device will not be interrupted.

[0072] In an optional example, the first controller is also configured with a first control curve and a first control configuration, the first control curve is used to indicate a first corresponding relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device, the first control configuration is used to indicate the parameter configuration in the operating parameter algorithm corresponding to the first category of server components, and the operating parameter algorithm is used to calculate the operating parameters of the heat dissipation device according to the component temperature of the server components; in the above step S202, the first operating system can control the operation of the heat dissipation device according to the ambient temperature of the server and the component temperature of the first category of server components in the following manners, but not limited to: the first operating system calls the first control curve to convert the ambient temperature of the server into the first operating parameter, and the first operating system calls the first control configuration to calculate the second operating parameter according to the component temperature of the first category of server components; the first operating system determines the target operating parameter according to the first operating parameter and the second operating parameter; the first operating system controls the operation of the heat dissipation device according to the target operating parameter.

[0073] Optionally, in this embodiment, each control curve may be, but is not limited to, any curve form that conforms to the heat dissipation law of the server. For example, the first corresponding relationship may be, but is not limited to, a linear relationship, so the first control curve may be, but is not limited to, a straight line, or a segmented straight line. The first corresponding relationship may be, but is not limited to, an exponential relationship, so the first control curve may be, but is not limited to, an exponential curve. The operating parameter algorithm may be, but is not limited to, any function algorithm that conforms to the heat dissipation law of the server, such as a proportional integral differential (PID) control speed regulation algorithm.

[0074] Optionally, in this embodiment, determining the target operating parameter according to the first operating parameter and the second operating parameter may include, but is not limited to, determining a larger value of the first operating parameter and the second operating parameter as the target operating parameter.

[0075] Take the case where the first controller is BMC, the first operating system is RTOS, and the second operating system is Linux. In order to make full use of the computing power resources of BMC, the RTOS real-time operating system is deployed. According to the BMC Linux / RTOS heterogeneous dual-system parallel technology, data exchange between multi-core and multi-system is realized. The ambient temperature and component temperature are collected through the PECI bus, which can realize millisecond-level signal acquisition control. Then, the temperature and heat dissipation are dynamically controlled through closed-loop feedback, so as to accurately control the heat dissipation resources, minimize the resources to meet the heat dissipation requirements, and reduce ineffective power consumption. For example: Figure 4 is a schematic diagram of an RTOS system controlling a server cooling system according to an embodiment of the present application, such as Figure 4 As shown in the figure, the RTOS system collects component temperatures from temperature sensors deployed on various hardware components such as the CPU deployed on the server, collects ambient temperature from temperature sensors deployed in the server's cooling system, and adjusts the fan speed of the fan deployed in the cooling system according to the component temperature and ambient temperature. At the same time, the RTOS system also has the function of regulating the performance of various hardware components.

[0076] In an optional example, from the perspective of the operation of the heat dissipation device, the operating parameter output by the first operating system is a first operating parameter or a second operating parameter, wherein the ambient temperature of the server and the first operating parameter conform to a first control curve, the first control curve is used to indicate a first corresponding relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device, and the second operating parameter is calculated based on the component temperature of the first category of server components.

[0077] In this embodiment, the corresponding relationship indicated by each control curve can be, but is not limited to, designed according to the server configuration, the model of the heat dissipation device used, and the operating performance of the heat dissipation device. For example, if the heat dissipation device is a fan, the corresponding relationship indicated by each control curve can be, but is not limited to, designed according to the server configuration, the model of the fan, and the PQ characteristic curve. The PQ characteristic curve is one of the key curves that describe the performance of the cooling fan. Here P represents the static pressure (Pressure) generated by the fan, and Q represents the air volume (Airflow) of the fan. The PQ characteristic curve shows the static pressure value that the fan can provide at different air volumes. Specifically, when the air volume increases, the static pressure of the fan usually decreases; conversely, when the air volume decreases, the static pressure of the fan increases. This relationship is expressed as a downward sloping curve on the PQ curve.

[0078] For example, as shown in Table 1, the corresponding relationship between the ambient temperature and the fan speed duty cycle parameter is shown. The corresponding relationship can be, but is not limited to, the curve PWM=k*Inlet+b, where PWM is the speed duty cycle and Inlet is the ambient temperature. In a certain corresponding relationship, multiple straight lines can be spliced ​​at the same time. In different states and configurations, the air volume requirements of the heat dissipation components are different, and different logics can be achieved by adjusting the size of k and b; for example, in the S5 state (that is, the state where the server is powered on but not started), the air volume requirement when there is a smart network card in the configuration is greater than the air volume requirement when there is an OCP network card, and the value of b can be increased accordingly; when there is a smart network card in the configuration, the various components are gradually powered on during the boot process, and the air volume requirement is greater than the air volume requirement in the S5 state, and the values ​​of k and b can be adjusted at the same time. When the temperature is lower than the minimum temperature value defined by the Inlet curve, the corresponding PWM takes the PWM corresponding to the defined minimum temperature; when the temperature is higher than the minimum value defined by the Inlet curve, the corresponding PMW takes the PWM corresponding to the defined maximum temperature. When multiple curves or algorithms are called simultaneously in a certain state and a certain configuration, the maximum fan speed value obtained by combining the multiple curves or algorithms in parallel can be output to the fan.

[0079] Table 1

[0080]

[0081] In an optional example, when the first operating system controls the operation of the heat dissipation device, if the second operating system is starting up and has the ability to collect temperature parameters during its startup, then the ambient temperature, component temperature and other parameters required by the first operating system can be, but not limited to, collected by the second operating system and transmitted to the first operating system through inter-core communication. For example, the first operating system can call the first control curve to convert the ambient temperature of the server into the first operating parameter, and the first operating system calls the first control configuration to calculate the second operating parameter according to the component temperature of the first category of server components in the following manner, but not limited to: when the second operating system is starting up, the second operating system collects the ambient temperature of the server and the component temperature of the first category of server components; the second operating system sends the collected ambient temperature of the server and the component temperature of the first category of server components to the first operating system; the first operating system calls the first control curve to convert the ambient temperature of the server into the first operating parameter, and the first operating system calls the first control configuration to calculate the second operating parameter according to the component temperature of the first category of server components.

[0082] In an optional example, the method of inter-core communication can be, but is not limited to, a method of combining shared memory with interrupt requests. For example: a target storage space is also deployed on the server, and the target storage space allows the first operating system and the second operating system to access it. The second operating system can send the collected server ambient temperature and the component temperature of the first category of server components to the first operating system in the following manners, but is not limited to: the second operating system writes the collected server ambient temperature and the component temperature of the first category of server components into the target storage space; the second operating system sends an interrupt request to the first operating system; the first operating system responds to the interrupt request and reads the server ambient temperature and the component temperature of the first category of server components from the target storage space.

[0083] For example, the first controller is BMC, the first operating system is RTOS real-time operating system, and the second operating system is Linux. Figure 5 is a schematic diagram of the architecture of a BMC according to an embodiment of the present application, such as Figure 5 As shown in the figure, RTOS and Linux are deployed in BMC, and the two communicate through shared memory combined with inter-core communication. BMC is connected to the flash memory (NOR Flash), interface controller (SD / EMMC), hard disk (DDR), out-of-band interface (MAC), central processing unit (CPU), fan (FAN), sensor (Sensor) and integrated south bridge (PCH) on the server.

[0084] Based on the real-time acquisition of sensor temperature data through the RTOS system, before the BMC Linux system is started, the RTOS collects and controls the system temperature; during the BMC Linux system startup phase, Linux collects sensor temperature information, and then passes it to the RTOS through shared memory, and the RTOS performs fan control; when the BMC Linux system is fully started, the Linux system collects sensor temperature and implements temperature control itself. At the same time, when the BMC Linux system fails or restarts, the RTOS can quickly take over the cooling system and accurately control the fan speed.

[0085] Among the three control firmwares of RTOS, BMC Linux and CPLD, BMC has the advantages of high control accuracy and high logic complexity, but BMC takes a long time to start up. When BMC has not started up, fan control cannot be achieved. Both RTOS and CPLD have the characteristics of fast startup, and can start up and control the fan in 3-5S. In addition, RTOS can also obtain the ambient temperature and the temperature of some important components. After obtaining the temperature, RTOS can perform refined control calculations and fan speed output according to these temperatures.

[0086] In an optional implementation, taking the first controller as BMC, the first operating system as RTOS real-time operating system, and the second operating system as Linux as an example, after the server is powered on and the BMC is restarted during operation, the RTOS is started first. If the RTOS starts smoothly and successfully takes over the fan control, then the RTOS performs the dominant control of the fan at this time. The RTOS distinguishes and differentiates the speed adjustment according to the current state, configuration, and component temperature of the server. When the RTOS recognizes that the server is in normal operation after the power-on completion according to the state, different fan speeds can be called according to the obtained ambient temperature, and the RTOS can obtain the core temperature of some components, such as CPU temperature, memory temperature, PCH temperature, and network card temperature. After obtaining the temperature, the fan control can be refined according to the PID. When the server is in the power-on state, each component supports normal use, but compared with the BMC, the RTOS cannot obtain the core temperature of all important components. Therefore, when the RTOS performs fan control, the corresponding ambient temperature and speed linear relationship, the fan speed value corresponding to the same ambient temperature is higher than when the BMC is controlled, so as to avoid the components that the RTOS cannot obtain the temperature from overheating during the operation of the server.

[0087] RTOS controls the fan and checks the BMC status simultaneously. When BMC is started, the heartbeat signal corresponding to BMC starts and lasts for a period of time. When RTOS recognizes that the BMC heartbeat is normal, RTOS hands over the fan control to BMC, which then performs differentiated speed regulation based on the current server status and configuration, and the component temperatures that can be obtained. BMC can obtain the ambient temperature and the component temperatures of most components in the server, and can identify server air cooling, liquid cooling information, the status of each component, and perform detailed speed regulation calculations based on temperature and configuration information.

[0088] In an optional example, a second control curve and a second control configuration are also configured on the first controller, the second control curve is used to indicate a second corresponding relationship between the ambient temperature of the server and the operating parameters of the heat dissipation device, the second control configuration is used to indicate the parameter configuration in the operating parameter algorithm corresponding to the second category of server components, and the operating parameter algorithm is used to calculate the operating parameters of the heat dissipation device according to the component temperature of the server components; in the above step S204, the second operating system can control the operation of the heat dissipation device according to the ambient temperature of the server and the component temperature of the second category of server components in the following manners, but not limited to: the second operating system calls the second control curve to convert the ambient temperature of the server into a third operating parameter, and the second operating system calls the second control configuration to calculate the fourth operating parameter according to the component temperature of the second category of server components; the second operating system determines the reference operating parameter according to the third operating parameter and the fourth operating parameter; the second operating system controls the operation of the heat dissipation device according to the reference operating parameter.

[0089] Optionally, in this embodiment, determining the reference operating parameter according to the third operating parameter and the fourth operating parameter may include, but is not limited to, determining a larger value of the third operating parameter and the fourth operating parameter as the reference operating parameter.

[0090] In an optional example, from the perspective of the operation of the heat dissipation device, the operating parameter output by the second operating system is a third operating parameter or a fourth operating parameter, wherein the ambient temperature of the server and the third operating parameter conform to a second control curve, the second control curve is used to indicate a second corresponding relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device, and the fourth operating parameter is calculated based on the component temperature of the second category of server components.

[0091] Optionally, in this embodiment, for the same server ambient temperature, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first corresponding relationship is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the second corresponding relationship.

[0092] Under the same ambient temperature, the operating parameters output by the first operating system are higher than those when the second operating system is in control, so as to avoid overheating of server components whose temperatures cannot be obtained by the first operating system during server operation.

[0093] In an optional example, the second control curve can be, but is not limited to, adjusted according to the heat dissipation type adopted by the server. For example, the heat dissipation type of the server includes: multiple heat dissipation types, the multiple heat dissipation types include the target heat dissipation type to which the heat dissipation device belongs, the second control curve includes a first curve and a second curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the first curve for the same server ambient temperature is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the second curve; the second operating system can call the second control curve to convert the ambient temperature of the server into a third operating parameter in the following manner, but is not limited to: the second operating system detects the heat dissipation type adopted by the server among multiple heat dissipation types; when the heat dissipation type adopted by the server is the target heat dissipation type, the second operating system calls the first curve to convert the ambient temperature of the server into the third operating parameter; when the heat dissipation type adopted by the server is not the target heat dissipation type, the second operating system calls the second curve to convert the ambient temperature of the server into the third operating parameter.

[0094] The various cooling types may include but are not limited to air cooling and liquid cooling, etc. The cooling type of the cooling device belongs to the target cooling type among the various cooling types. If the cooling type adopted by the server is the target cooling type, the operating parameters output to the cooling device are determined by a control curve with higher cooling performance. If the cooling type adopted by the server is not the target cooling type, the operating parameters output to the cooling device are determined by a control curve with lower cooling performance.

[0095] For example, if the cooling device is a fan, the target cooling type is air cooling. If the server is using air cooling, the speed output to the fan is determined by a control curve with higher cooling performance. If the server is using liquid cooling, the speed output to the fan is determined by a control curve with lower cooling performance.

[0096] In an optional example, from the perspective of the operation of the cooling device, the cooling type of the server includes: multiple cooling types, the multiple cooling types include a target cooling type to which the cooling device belongs, the second control curve includes a first curve and a second curve, and the cooling performance of the cooling device corresponding to the operating parameters of the ambient temperature of the same server under the first curve is higher than the cooling performance of the cooling device corresponding to the operating parameters under the second curve; when the cooling type adopted by the server is the target cooling type, the ambient temperature of the server and the third operating parameter conform to the first curve; when the cooling type adopted by the server is not the target cooling type, the ambient temperature of the server and the third operating parameter conform to the second curve.

[0097] In an optional example, the second operating system can also differentiate and finely control the heat dissipation device by identifying the fault information of the component according to the degree of influence of the component temperature on the server, so that the operation of the heat dissipation device is more in line with the operation of the server. For example: the server components of the second category are divided into server component sets of multiple risk levels, and the second control curve includes: multiple parameter curves corresponding to multiple risk levels, the higher the risk level, the higher the degree of influence of the component temperature on the server, and the higher the risk level of the server component under the same server ambient temperature, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding control curve; the second operating system can call the second control curve to convert the ambient temperature of the server into a third operating parameter in the following manner, but not limited to: the second operating system detects whether there is a faulty component in the server components of the second category; in the case of detecting that there is a faulty component in the server components of the second category, the second operating system detects the target server component set to which the faulty component belongs in the server component sets of multiple risk levels; the second operating system calls the reference curve corresponding to the target risk level of the target server component set from the multiple parameter curves to convert the ambient temperature of the server into the third operating parameter.

[0098] The second category of server components are divided into multiple risk levels to obtain a set of server components of each risk level. Multiple risk levels correspond to multiple parameter curves one by one. The risk level indicates the degree of influence of the temperature of the server component on the server. The higher the risk level, the greater the influence of the component temperature on the server. For example, the risk level of the CPU is higher than the risk level of the hard disk.

[0099] If the faulty component is a variety of server components, the obtained third operating parameter may be multiple parameters, and the maximum value can be extracted from the multiple parameters as the final third operating parameter.

[0100] In an optional example, from the perspective of heat dissipation device operation, the server components of the second category are divided into server component sets with multiple risk levels, and the second control curve includes: multiple parameter curves corresponding to multiple risk levels, the higher the risk level, the greater the impact of the component temperature on the server, and the higher the risk level of the server component at the same server ambient temperature, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding control curve; in the event that there are faulty components in the server components of the second category, the ambient temperature of the server and the third operating parameters conform to the reference curve in the multiple parameter curves, wherein the faulty component belongs to a target server component set in the server component sets with multiple risk levels, and the target risk level of the target server component set corresponds to the reference curve.

[0101] In an optional example, a plurality of risk level server component sets may include: a heat dissipation high risk component set and a heat dissipation low risk component set, the component temperature of the server components in the heat dissipation high risk component set affecting the server to a higher degree than the component temperature of the server components in the heat dissipation low risk component set affecting the server, the plurality of parameter curves including a third curve and a fourth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the same server ambient temperature under the fourth curve being higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the third curve; the second operating system may detect the target server component set to which the faulty component belongs in the plurality of risk level server component sets in the following manner, but is not limited to: the second operating system detects the faulty component as a heat dissipation high risk component or a heat dissipation low risk component; the second operating system may call the reference curve corresponding to the target risk level of the target server component set from the plurality of parameter curves to convert the ambient temperature of the server into a third operating parameter, but is not limited to: when the faulty component is detected as a heat dissipation high risk component, the second operating system calls the fourth curve to convert the ambient temperature of the server into the third operating parameter; when the faulty component is detected as a heat dissipation low risk component, the second operating system calls the third curve to convert the ambient temperature of the server into the third operating parameter.

[0102] Optionally, the risk level of the server component can be divided into, but not limited to, two levels: high heat risk and low heat risk. If the risk level of the faulty server component is high heat risk, then the third operating parameters can be determined by calling, but not limited to, a fourth curve with higher heat dissipation performance; if the risk level of the faulty server component is low heat risk, then the third operating parameters can be determined by calling, but not limited to, a third curve with lower heat dissipation performance.

[0103] In an optional example, from the perspective of heat dissipation device operation, server component sets of multiple risk levels include: a high-risk heat dissipation component set and a low-risk heat dissipation component set, the component temperature of the server components in the high-risk heat dissipation component set affects the server more than the component temperature of the server components in the low-risk heat dissipation component set, the multiple parameter curves include a third curve and a fourth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the same server ambient temperature under the fourth curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the third curve; in the case where the faulty component is a low-risk heat dissipation component, the ambient temperature of the server and the third operating parameter are consistent with the third curve; in the case where the faulty component is a high-risk heat dissipation component, the ambient temperature of the server and the third operating parameter are consistent with the fourth curve.

[0104] Optionally, in this embodiment, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the third curve for the same server ambient temperature is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first curve.

[0105] In an optional example, the heat dissipation type of the server includes: multiple heat dissipation types, the multiple heat dissipation types include the target heat dissipation type to which the heat dissipation device belongs, the second category of server components includes: high-risk heat dissipation components and low-risk heat dissipation components, the component temperature of the high-risk heat dissipation components has a higher degree of influence on the server than the component temperature of the low-risk heat dissipation components, the second control curve includes: a fifth curve, a sixth curve, a seventh curve and an eighth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the same server ambient temperature under the fifth curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the sixth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the same server ambient temperature under the eighth curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the seventh curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the same server ambient temperature under the seventh curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fifth curve; the second operating system may call the second control curve to adjust the ambient temperature of the server in the following manners, but is not limited to: The second operating system detects whether there are faulty components in the server components of the second category; when it is detected that there are faulty components in the server components of the second category, the second operating system detects whether the faulty components are high-risk components for heat dissipation or low-risk components for heat dissipation; when it is detected that the faulty components are high-risk components for heat dissipation, the second operating system calls the eighth curve to convert the ambient temperature of the server into the third operating parameter; when it is detected that the faulty components are low-risk components for heat dissipation, the second operating system calls the seventh curve to convert the ambient temperature of the server into the third operating parameter; when it is detected that there are no faulty components in the server components of the second category, the second operating system detects the heat dissipation type adopted by the server among multiple heat dissipation types; when the heat dissipation type adopted by the server is the target heat dissipation type, the second operating system calls the fifth curve to convert the ambient temperature of the server into the third operating parameter; when the heat dissipation type adopted by the server is not the target heat dissipation type, the second operating system calls the sixth curve to convert the ambient temperature of the server into the third operating parameter.

[0106] Optionally, in this embodiment, the heat dissipation device may be controlled in combination with, but not limited to, the risk level of the server component and the heat dissipation type of the server. The second operating system first identifies the faulty component in the server component, and if there is a faulty component, controls the heat dissipation device according to the risk level of the faulty component. If there is no faulty component, controls the heat dissipation device according to the heat dissipation type of the server.

[0107] In an optional example, from the perspective of the operation of the cooling device, the cooling type of the server includes: multiple cooling types, the multiple cooling types include the target cooling type to which the cooling device belongs, the second category of server components includes: high-risk cooling components and low-risk cooling components, the component temperature of the high-risk cooling components affects the server to a higher degree than the component temperature of the low-risk cooling components, the second control curve includes: a fifth curve, a sixth curve, a seventh curve and an eighth curve, the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the fifth curve for the same server ambient temperature is higher than the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the sixth curve, the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the eighth curve for the same server ambient temperature is higher than the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the seventh curve, and the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the eighth curve for the same server ambient temperature is higher than the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the seventh curve, and the cooling performance of the cooling device corresponding to the operating parameters of the cooling device under the eighth curve for the same server ambient temperature is The heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the seventh curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the fifth curve; when there is a faulty component in the server components of the second category and the faulty component is a high-risk component for heat dissipation, the ambient temperature of the server and the third operating parameter conform to the eighth curve; when there is a faulty component in the server components of the second category and the faulty component is a low-risk component for heat dissipation, the ambient temperature of the server and the third operating parameter conform to the seventh curve; when there is no faulty component in the server components of the second category and the heat dissipation type adopted by the server is the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the fifth curve; when there is no faulty component in the server components of the second category and the heat dissipation type adopted by the server is not the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the sixth curve.

[0108] In an optional example, the second category of server components includes: multiple server components, the second control curve includes multiple component curves corresponding to the multiple server components one by one, the server component with a higher degree of influence of the component temperature on the server has a higher heat dissipation performance of the cooling device corresponding to the operating parameters on the corresponding control curve under the same server ambient temperature; the second operating system may call the second control curve to convert the server ambient temperature into a third operating parameter in the following manner, but is not limited to: the second operating system detects whether there are faulty components in the second category of server components; when it is detected that there are faulty components in the second category of server components, the second operating system extracts a target server component belonging to the faulty component from the multiple server components; the second operating system calls the target curve corresponding to the target server component from the multiple component curves to convert the server ambient temperature into the third operating parameter.

[0109] Optionally, in this embodiment, different server components may correspond to different component curves, and the second operating system may, but is not limited to, determine the third operating parameter according to the component curve corresponding to the faulty component. If there are multiple third operating parameters, the maximum value is extracted from them as the final third operating parameter.

[0110] In an optional example, from the perspective of the operation of the cooling device, the second category of server components includes: multiple server components, the second control curve includes multiple component curves corresponding to the multiple server components one by one, the server component with a higher degree of influence of the component temperature on the server has a higher cooling performance of the cooling device corresponding to the operating parameters on the corresponding control curve at the same server ambient temperature; when a faulty component is detected in the second category of server components, the ambient temperature of the server and the third operating parameters are consistent with the target curve, wherein the target server component that is a faulty component among the multiple server components corresponds to the target curve in the multiple component curves.

[0111] In an optional implementation, taking the first controller as BMC, the first operating system as RTOS, the second operating system as Linux (representing BMC), and the heat dissipation device as a fan as an example, when BMC recognizes that the server is in the boot-up completion state, it further distinguishes between air cooling and liquid cooling configurations, and determines whether the server is in air cooling configuration or liquid cooling configuration by judging whether there is a corresponding liquid cooling in place signal, and calls different ambient temperature curves respectively. Compared with RTOS, BMC supports obtaining component temperatures of more server components (such as CPU temperature, memory temperature, hard disk temperature, network card temperature, raid card temperature, HBA card temperature, HCA card temperature, GPU temperature, etc.). After obtaining the component temperature, fine fan control can be performed according to PID. BMC can also identify the status of each component, and divide the component temperature in the server into high-risk components for heat dissipation and low-risk components for heat dissipation. When a server component fails, resulting in the server component being in place but BMC unable to obtain the component temperature, BMC can call different Inlet curves according to the heat dissipation risk level of the component to ensure that the component does not overheat.

[0112] For example: when the BMC identifies that the server is in the state of booting up, it calls different control curves as shown in Table 2 according to the obtained Inlet temperature (ambient temperature) and configuration status information, and performs PID and linear calculation speed adjustment according to the obtained component temperature of each server component: when the BMC detects that there is no in-place signal corresponding to the liquid cooling configuration, it is determined that the configuration is air cooling at this time, and the corresponding Inlet-1 is called; when the BMC detects that there is an in-place signal corresponding to the liquid cooling configuration, it is determined that the configuration is liquid cooling at this time, and the corresponding Inlet-2 is called; when the BMC detects that there is a low-risk component in the server but the temperature cannot be obtained, the corresponding abnormal speed adjustment Inlet-3 is called; when the BMC detects that there is a high-risk component in the server but the temperature cannot be obtained, the corresponding abnormal speed adjustment Inlet-4 is called. According to different air volume requirements, the corresponding Inlet curves of the fan speed from low to high under the same ambient temperature are: Inlet-2, Inlet-1, Inlet-3, Inlet-4. After the BMC obtains the CPU temperature, memory temperature, hard disk temperature, network card temperature, raid card temperature, HBA card temperature, HCA card temperature, and GPU temperature, it performs PID and linear calculation speed regulation.

[0113] Table 2

[0114]

[0115] In an optional example, an operating parameter algorithm is used to calculate the operating parameters of a cooling device based on the component temperature of a server component at a sampling moment, the component temperature at a historical moment, and the operating parameters corresponding to the historical sampling moment; the first operating system may call the first cooling configuration to calculate the second operating parameter based on the component temperature of a first category of server components in the following manner, but is not limited to: the first operating system calls the first cooling configuration and substitutes it into the operating parameter algorithm to obtain a target operating parameter algorithm; the first operating system obtains the first component temperature of a first category of server components at a sampling moment, the second component temperature at a historical moment, and the historical operating parameters corresponding to the historical sampling moment, wherein the historical operating parameters are the operating parameters corresponding to the first category of server components calculated by the operating parameter algorithm at the historical sampling moment; the first operating system substitutes the first component temperature, the second component temperature, and the historical operating parameters into the target operating parameter algorithm to obtain the second operating parameters.

[0116] Optionally, in this embodiment, the operating parameter algorithm can be but is not limited to PWM(k)=PWM(k-1)+▽PWM; wherein, ▽PWM=Kp*[T(k)-T(k-1)]+Ki(T(k)-Tsp)+Kd*[[T(k)-T(k-1)]-[T(k-1)-T(k-2)]], PWM(k) is the operating parameter corresponding to the current sampling moment, PWM(k-1) is the operating parameter corresponding to the historical sampling moment, T(k) is the component temperature at the current sampling moment, the component temperatures at the historical moments include T(k-1) and T(k-2), T(k-1) is the component temperature at the sampling moment before the current sampling moment, T(k-2) is the component temperature at the sampling moment before the previous sampling moment, and the parameter configuration in the operating parameter algorithm includes: Kp, Ki, Kd and Tsp, and Tsp is the maximum temperature value allowed for the component temperature of the server component to reach during operation.

[0117] For the component temperature of the server components in the server, PID speed regulation can be used but is not limited to it. In the PID calculation, the formula is PWM(k)=PWM(k-1)+▽PWM; ▽PWM=Kp*[T(k)-T(k-1)]+Ki(T(k)-Tsp)+Kd*[[T(k)-T(k-1)]-[T(k-1)-T(k-2)]], PWM(k) is the PWM at time k, PWM(k-1) is the virtual PWM calculated by this temperature sensor at time (k-1) (that is, the historical operating parameters corresponding to the above historical sampling time), Tsp is the set control point, that is, during the operation, the highest temperature value that the component temperature is expected to reach, T(k), T(k-1), and T(k-2) are the temperature values ​​of the temperature sensor at times k, k-1, and k-2, respectively.

[0118] Among them, Kp*[T(k)-T(k-1)] is the temperature difference term, which represents the difference between the temperature at time k and the temperature at time k-1. When the temperature of a component changes, this term can be used to respond quickly: when the temperature of a component rises, this term is positive, which increases the corresponding fan speed; when the temperature of a component drops, this term is negative, which decreases the corresponding fan speed. For components such as CPU and GPU, when the power consumption changes significantly, the temperature will also change significantly. Generally, a larger value (usually 6~12) is set for Kp in this term to increase the fan speed change brought about by this term and avoid temperature overshoot.

[0119] Ki(T(k)-Tsp) is an integral term, which represents the difference between the temperature at time k and the temperature at the control point. When the component temperature is higher than the control point, this term is positive, which can increase the corresponding fan speed. When the component temperature is lower than the control point, this term is negative, which can reduce the corresponding fan speed. The control point in this term determines the stable value of the temperature during the control process.

[0120] Kd*[[T(k)-T(k-1)]-[T(k-1)-T(k-2)]] is a differential term, which represents the difference between the temperature difference at time k and the temperature difference at time k-1.

[0121] In an optional implementation, taking the first controller as BMC, the first operating system as RTOS, the second operating system as Linux (representing BMC), and the heat dissipation device as a fan as an example, when the server is operating normally, the BMC can, but is not limited to, perform fan control in the following manners: each control curve is shown in Table 3. When the server is in an air-cooled configuration and each component is in a non-stressed state, the fan speed is low. At this time, the BMC calls the Inlet-1 curve to increase the ambient temperature of the server, and the server fan speed also increases accordingly. When the ambient temperature increases to a certain value (such as 40°C), the fan speed no longer increases; when the ambient temperature of the server is reduced, the server fan speed decreases accordingly. When the ambient temperature decreases to a certain temperature value (such as 20°C), the fan speed no longer decreases, but is maintained at a stable speed. Moreover, under the same configuration, when the server is in liquid cooling configuration, BMC calls the Inlet-2 curve to compare the fan speeds at different ambient temperatures when all components are in air cooling, and the fan speeds at different ambient temperatures when some components are in liquid cooling (for example, the CPU is in liquid cooling, and the corresponding leakage detection line is wrapped around its liquid cooling plate, and the leakage detection line terminal is installed on the motherboard). The fan speed corresponding to the same ambient temperature must be greater than or equal to the speed when there are components in the configuration that are in liquid cooling. When stress testing the components in the server, it is found that as the temperature of the components increases, the fan speed increases accordingly, and finally the temperature and speed reach a stable value. The BMC can perform refined PID speed regulation based on the obtained component core temperature. It can be found that the stable value of the component temperature is less than the value of the component temperature spec. When the ambient temperature of the server is increased, the component temperature and the corresponding fan speed will increase and stabilize accordingly. However, within a certain range of ambient temperature, the temperature value that the component reaches is consistent; when the ambient temperature is very low, the corresponding fan speed is no longer reduced, and the stable value of the component temperature after the stress test will be lower than the previously mentioned stable value; when the ambient temperature is very high, the corresponding stable fan speed has reached the maximum speed and no longer continues to increase, and the stable value of the component temperature after the stress test will be higher than the previously mentioned temperature stable value. Such components include CPU, memory, VR, hard disk, PCIe network card, OCP network card, raid card, GPU, etc. The parameter settings of some components are shown in Table 4.Log in to the server's WEB BMC, or check the SDR information under the OS. Check that when a component is installed in the configuration, the temperature of this component can be displayed under normal circumstances. When an abnormality occurs, the temperature value of this component is displayed as an abnormal value. At this time, call Inlet-3 or Inlet-4 and find that even if the component is not stress tested, the fan speed is higher than that before the stress test. In addition, the fan speed will increase accordingly when the ambient temperature of the server is changed. In addition, when temperature abnormalities occur in components of different categories, the fan speeds are inconsistent at the same ambient temperature. When temperature abnormalities occur in components with low power consumption and low heat dissipation risk, the corresponding speed is lower (corresponding to the Inlet-3 curve). When temperature abnormalities occur in components with high power consumption and high heat dissipation risk, the corresponding speed is higher (corresponding to the Inlet-4 curve).

[0122] Table 3

[0123]

[0124] Table 4

[0125]

[0126] Use the command to restart the BMC. Within a certain period of time after the restart, the fan speed remains at the speed before the BMC restart. At this time, the CPLD maintains the previous speed for output. After a certain period of time (such as 5S), the RTOS starts before the BMC and performs fan control. At this time, the RTOS cannot obtain the core temperature of all components, so the Inlet-4 curve with a higher speed is called to increase the ambient temperature of the server. The server fan speed also increases accordingly. When the ambient temperature rises to a certain value, the fan speed no longer increases; the ambient temperature of the server is reduced, and the server fan speed decreases accordingly. When the ambient temperature drops to a certain temperature value, the fan speed no longer decreases, but maintains a stable speed. Under the same ambient temperature, the speed after restarting the BMC for a certain period of time is consistent with the speed corresponding to the temperature abnormality of the above-mentioned components with high power consumption and high heat dissipation risk; during the BMC restart process, the RTOS can obtain the CPU temperature and perform PID speed regulation. If the CPU is stress tested, it is found that as the CPU temperature increases, the fan speed will further increase, and finally the CPU temperature and speed are maintained at a stable state. The stable value of CPU temperature is less than the value of CPU temperature spec. When the ambient temperature of the server is increased, the CPU temperature and the corresponding fan speed will increase and stabilize. However, within a certain range of ambient temperature, the stable temperature value of CPU is consistent. When the ambient temperature is very low, the corresponding fan speed will not decrease. At this time, the stable value of CPU temperature after stress test will be lower than the stable value mentioned above. When the ambient temperature is very high, the corresponding stable fan speed has reached the maximum speed and will not continue to increase. At this time, the stable value of component temperature after stress test will be higher than the stable value mentioned above. During the BMC restart process, RTOS cannot obtain the temperature of GPU. If the GPU is stress tested, it is found that the fan speed will not change with the increase of GPU temperature. However, through the tools under OS to obtain the GPU temperature, it can be found that the GPU temperature value is lower than the temperature spec. During the BMC restart process, RTOS is used to control the fan. It can obtain the ambient temperature for fan control and the component temperature of some components and perform fine control, but it cannot obtain the component temperature of all components. However, the fan speed corresponding to the ambient temperature can ensure that the temperature of each component does not exceed the temperature. After restarting the BMC, the GPU was stress tested. After a long period of time, the fan speed was found to increase further, and the GPU temperature and fan speed tended to a stable value. At this time, the BMC was started and took over the fan control and began to control the fan.

[0127] After removing the BMC chip, it was found that after a certain period of time (such as 10 seconds) after the boot was completed, the CPLD determined that the BMC startup failed, and the CPLD took over the fan control rights and controlled the fan according to the Inlet-4 curve. When the ambient temperature of the server is increased, the server fan speed also increased. When the ambient temperature rises to a certain value, the fan speed no longer increases; when the ambient temperature of the server is reduced, the server fan speed decreases. When the ambient temperature drops to a certain temperature value, the fan speed no longer decreases, but maintains a stable speed. Under the same ambient temperature, the speed after the BMC chip is removed and the power is turned on is consistent with the speed corresponding to the temperature abnormality of the components with high power consumption and high heat dissipation risk described above; at this time, using tools to stress test each component under the OS, it will be found that the temperature of each component increases, and the corresponding fan speed is not affected, but the temperature of each component can be kept below the temperature spec.

[0128] In an optional example, the first operating system may detect the system operation status of the second operating system in the following manner but is not limited to: the first operating system detects whether the heartbeat of the second operating system is normal; when the heartbeat of the second operating system is detected, the first operating system detects the duration of the heartbeat of the second operating system; when the duration of the heartbeat of the second operating system is equal to or exceeds the target duration, the first operating system determines that the system operation status is detected to be started.

[0129] Optionally, in this embodiment, the first operating system may, but is not limited to, determine the system running state of the second operating system through the heartbeat signal of the second operating system and the duration of the heartbeat signal.

[0130] In an optional example, a second controller is also deployed on the server. When the first controller restarts, the second controller controls the operation of the heat dissipation device and monitors the startup result of the first controller. When the startup result indicates that the startup of the first controller fails, the second controller identifies the operating status of the server. When the operating status is identified as being in a running state, the second controller continues to control the operation of the heat dissipation device.

[0131] In an optional example, after the second controller monitors the startup result of the first controller, if the startup result indicates that the first controller is successfully started, the second controller stops controlling the operation of the heat dissipation device and the first controller controls the operation of the heat dissipation device.

[0132] Optionally, in this embodiment, the second controller may include, but is not limited to, a complex programmable logic device (CPLD). When the first controller is restarted, the second controller may immediately take over the control of the heat dissipation device and transfer the control right of the heat dissipation device according to the startup status of the first controller. For example, if the first operating system has been successfully started, the second controller may determine that the startup result of the first controller is used to indicate that the first controller has been successfully started, and the second controller may transfer the control right of the heat dissipation device to the first operating system of the first controller.

[0133] In an optional example, from the perspective of the operation of the heat dissipation device, a second controller is also deployed on the server. When the first controller restarts, the heat dissipation device operates according to the operating parameters output by the second controller; when the first controller fails to start, the heat dissipation device continues to operate according to the operating parameters output by the second controller; when the first controller starts successfully, the heat dissipation device stops operating according to the operating parameters output by the second controller, and operates according to the operating parameters output by the first controller.

[0134] In an optional example, the first controller is connected to the heat dissipation device through the second controller; the second controller can control the operation of the heat dissipation device and monitor the startup result of the first controller in the following manner, but is not limited to: the second controller checks whether the heartbeat of the first operating system is normal; when it is detected that the heartbeat of the first operating system is abnormal, the second controller controls the operation of the heat dissipation device and checks whether the heartbeat of the second operating system is normal; when it is detected that the heartbeat of the second operating system is abnormal, it is determined that the startup of the first controller has failed; when it is detected that the heartbeat of the first operating system is normal, it is determined that the startup of the first controller is successful.

[0135] In an optional example, when the startup result is used to indicate that the first controller failed to start, the second controller may identify the operating status of the server in the following manner, but is not limited to: when the startup result is used to indicate that the first controller failed to start, the second controller discards the operating parameters received from the first controller and identifies the operating status of the server; when the startup result is used to indicate that the first controller started successfully, the second controller stops controlling the operation of the heat dissipation device, and the first controller controls the operation of the heat dissipation device in the following manner, but is not limited to: when the startup result is used to indicate that the first controller started successfully, the second controller sends the operating parameters received from the first controller to the heat dissipation device.

[0136] Optionally, in this embodiment, the second controller can be deployed between the first controller and the heat dissipation device, and the second controller decides whether to transmit the operating parameters provided by the first controller to the heat dissipation device based on the startup result and operating status of the first controller, thereby ensuring that the first controller will not transmit the operating parameters generated during the fault process to the heat dissipation device.

[0137] In an optional implementation, taking the first controller as BMC, the first operating system as RTOS, the second operating system as Linux (representing BMC), the second controller as CPLD, and the heat dissipation device as a fan as an example, the server runs normally after power-on. If the BMC restarts, the CPLD immediately takes over the control of the heat dissipation device, and the RTOS starts first. The CPLD will check whether the heartbeat of the RTOS is normal. If the heartbeat of the RTOS is abnormal for a period of time, it proves that the RTOS does not have the ability to control the fan. If the CPLD determines that the RTOS heartbeat is abnormal for a period of time, the CPLD continues to take over the control of the fan. If the CPLD successfully takes over the control of the fan, the CPLD will take the lead in controlling the fan at this time, and the CPLD can obtain the ambient temperature. Therefore, the CPLD will call the corresponding Inlet curve according to the ambient temperature to ensure that the various components in the server do not overheat.

[0138] CPLD controls the fan and checks the BMC status simultaneously. When the BMC is started, the heartbeat signal corresponding to the BMC starts and lasts for a period of time. The CPLD determines that the BMC startup is complete. When the CPLD recognizes that the BMC heartbeat is normal, the CPLD transfers the fan control to the BMC, which performs differentiated speed regulation based on the current server status and configuration, and the component temperature that can be obtained. The BMC can obtain the ambient temperature and the core temperature of most important components in the server, and can identify the server air cooling, liquid cooling information, the status of each component, and other information, and perform detailed speed regulation calculations based on the temperature and configuration information. When the BMC recognizes that the server is in the boot-up state, it further distinguishes between air cooling and liquid cooling configurations. By judging whether there is a corresponding liquid cooling signal in place, it determines whether the server is in air cooling configuration or liquid cooling configuration, and calls different ambient temperature curves respectively. Compared with RTOS, BMC supports obtaining the core temperature of more components (such as CPU temperature, memory temperature, hard disk temperature, network card temperature, raid card temperature, HBA card temperature, HCA card temperature, GPU temperature, etc.). After obtaining the temperature, it can perform refined fan control according to PID. BMC can also identify the status of each component and divide the component temperature in the server into high-risk components for heat dissipation and low-risk components for heat dissipation. When a component fails, resulting in the component being in place but the BMC unable to obtain the component temperature, the BMC can call different Inlet curves according to the heat dissipation risk level of the component to ensure that the component does not overheat.

[0139] CPLD performs fan control and checks the BMC status simultaneously. If the BMC still has no heartbeat, it will further obtain the heartbeat status of the RTOS. If the heartbeat of the RTOS is normal and lasts for a period of time, it can be determined that the RTOS has started successfully, and the CPLD will transfer the fan control to the RTOS. If the RTOS starts smoothly and successfully takes over the fan control, the RTOS will take the lead in fan control at this time. The RTOS will perform differentiated speed regulation based on the current state of the server, configuration, and component temperatures that can be obtained. When the RTOS recognizes that the server is in normal operation after booting up based on the status, it can call different fan speeds based on the obtained ambient temperature. In addition, the RTOS can obtain the core temperatures of some components, such as CPU temperature, memory temperature, PCH temperature, and network card temperature. After obtaining the temperature, it can perform refined fan control based on PID. When the server is powered on, all components support normal use. However, compared with BMC, RTOS cannot obtain the core temperature of all important components. Therefore, when RTOS controls the fan, the corresponding ambient temperature and speed have a linear relationship. The fan speed value corresponding to the same ambient temperature is higher than when BMC controls. This prevents components whose temperatures cannot be obtained by RTOS from overheating during server operation.

[0140] After RTOS performs fan control, it will simultaneously check the BMC status. When BMC is started, the heartbeat signal corresponding to BMC will start and last for a period of time. When RTOS recognizes that the BMC heartbeat is normal, RTOS will hand over the fan control to BMC, which will perform differentiated speed regulation based on the current server status and configuration, and the available component temperatures. BMC can obtain the ambient temperature and the core temperature of most important components in the server, identify server air cooling, liquid cooling information, the status of each component, and perform detailed speed regulation calculations based on temperature and configuration information.

[0141] When BMC recognizes that the server is in the boot-up state, it distinguishes between air cooling and liquid cooling configurations. By judging whether there is a corresponding liquid cooling signal, it determines whether the server is in air cooling configuration or liquid cooling configuration, and calls different environmental temperature curves respectively. Compared with RTOS, BMC supports obtaining the core temperature of more components (such as CPU temperature, memory temperature, hard disk temperature, network card temperature, raid card temperature, HBA card temperature, HCA card temperature, GPU temperature, etc.). After obtaining the temperature, it can perform refined fan control according to PID. Furthermore, BMC can identify the status of each component and divide the component temperature in the server into high-risk components for heat dissipation and low-risk components for heat dissipation. When a component fails, resulting in the component being in place but the BMC unable to obtain the component temperature, BMC can call different Inlet curves according to the heat dissipation risk level of the component to ensure that the component does not overheat.

[0142] The CPLD performs fan control. If it detects that the BMC still has no heartbeat and the RTOS has no heartbeat, the CPLD continues to maintain fan control.

[0143] In summary, BMC can obtain more component temperatures for fan control, the control logic is more complex, and fan control is more precise; RTOS can start up and perform fan control in a short time, and can obtain the ambient temperature and the temperature of some core components, and can achieve some fine speed regulation; CPLD can immediately perform fan control when BMC restarts. Through the synergy of RTOS, CPLD, and BMC, it can not only ensure the stable operation of the server, but also ensure that the server can achieve the most refined fan control under different circumstances, ensure that each component does not overheat and runs at high performance, and ensure that the system noise and fan power consumption are reduced.

[0144] In an optional implementation, taking the first controller as BMC, the first operating system as RTOS, the second operating system as Linux (representing BMC), the second controller as CPLD, and the heat dissipation device as a fan as an example, if the BMC is restarted during the operation of the server, the control and operation of the heat dissipation device are as follows: Figure 6 is a schematic diagram of the control and operation of a heat dissipation device according to an embodiment of the present application, such as Figure 6 As shown in the figure, the server runs stably after being powered on. If the BMC restarts, if the RTOS starts successfully, the RTOS controls the fans and monitors whether the BMC has completed the startup. If the RTOS fails to start successfully, the CPLD controls the fans and monitors whether the BMC has completed the startup. If the BMC has completed the startup, the BMCLinux controls the fans. During the process of the CPLD controlling the fans and monitoring whether the BMC has completed the startup, if the RTOS starts successfully, the CPLD hands over the control of the fans to the RTOS, and the RTOS controls the fans.

[0145] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0146] In this embodiment, a device for operating a heat dissipation device is also provided, and a server includes: a server component, a first controller and a heat dissipation device. A first operating system and a second operating system are deployed on the first controller. The server components allowed to be configured on the server include: a first category of server components and a second category of server components. The first category of server components are server components that allow the first operating system to collect component temperatures, and the second category of server components are server components that allow the second operating system to collect component temperatures. The device is used to implement the above-mentioned embodiments and preferred implementation methods, and those that have been explained will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, it is also possible and conceivable to implement it in hardware, or a combination of software and hardware.

[0147] Figure 7 is a structural block diagram of an operating device of a heat dissipation device according to an embodiment of the present application, such as Figure 7 As shown, the device comprises:

[0148] A restart module 702, configured to restart the first controller during operation of the server;

[0149] A first operation module 704, configured to operate the heat dissipation device according to the operation parameters output by the first operating system during the restart of the first controller, wherein the operation parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the first category of server components;

[0150] The second operation module 706 is used to operate the heat dissipation device according to the operation parameters output by the second operating system when the first controller completes the restart, wherein the operation parameters output by the second operating system are determined according to the ambient temperature of the server and the component temperature of the second category of server components.

[0151] The operating device of the heat dissipation device is also used to execute the steps in any of the above method embodiments.

[0152] It should be noted that the above modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0153] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when running.

[0154] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0155] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0156] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0157] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any one of the above method embodiments are implemented.

[0158] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0159] An embodiment of the present application also provides a computer program, which includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the steps in any one of the above method embodiments.

[0160] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0161] Obviously, those skilled in the art should understand that the above modules or steps of the present application can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order from that herein, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0162] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for operating a heat dissipation device, characterized in that: The server includes: a server component, a first controller and a heat dissipation device, a first operating system and a second operating system are deployed on the first controller, the server components allowed to be configured on the server include: a first category of server components and a second category of server components, the first category of server components are server components that allow the first operating system to collect component temperatures, and the second category of server components are server components that allow the second operating system to collect component temperatures, and the method includes: During the operation of the server, the first controller is restarted; During the restart of the first controller, the heat dissipation device operates according to the operating parameters output by the first operating system, wherein the operating parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the server component of the first category; When the first controller completes restarting, the heat dissipation device operates according to the operating parameters output by the second operating system, wherein the operating parameters output by the second operating system are determined based on the ambient temperature of the server and the component temperature of the second category of server components.

2. The method according to claim 1, characterized in that The operating parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the first category of server components, including: The operating parameter output by the first operating system is a first operating parameter or a second operating parameter, wherein the ambient temperature of the server and the first operating parameter conform to a first control curve, the first control curve is used to indicate a first corresponding relationship between the ambient temperature of the server and the operating parameter of the heat dissipation device, and the second operating parameter is calculated based on the component temperature of the server component of the first category.

3. The method according to claim 1 or 2, characterized in that: The operating parameters output by the second operating system are determined according to the ambient temperature of the server and the component temperature of the server component of the second category, and include: The operating parameter output by the second operating system is a third operating parameter or a fourth operating parameter, wherein the ambient temperature of the server and the third operating parameter conform to a second control curve, the second control curve is used to indicate a second corresponding relationship between the ambient temperature of the server and the operating parameter of the cooling device, and the fourth operating parameter is calculated based on the component temperature of the server component of the second category.

4. The method according to claim 3, characterized in that For the same ambient temperature of the server, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first corresponding relationship is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the second corresponding relationship.

5. The method according to claim 3, characterized in that: The heat dissipation type of the server includes: multiple heat dissipation types, the multiple heat dissipation types include the target heat dissipation type to which the heat dissipation device belongs, the second control curve includes a first curve and a second curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the second curve; When the heat dissipation type adopted by the server is the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the first curve; When the heat dissipation type adopted by the server is not the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the second curve.

6. The method according to claim 3, characterized in that The server components of the second category are divided into a set of server components of multiple risk levels, and the second control curve includes: a plurality of parameter curves corresponding to the multiple risk levels one by one, the higher the risk level, the higher the impact of the component temperature on the server, and the higher the risk level of the server component, the higher the heat dissipation performance of the heat dissipation device corresponding to the operating parameters on the corresponding control curve under the same ambient temperature of the server; In the case where there is a faulty component in the server components of the second category, the ambient temperature of the server and the third operating parameter conform to a reference curve among the multiple parameter curves, wherein the faulty component belongs to a target server component set among the server component sets of the multiple risk levels, and the target risk level of the target server component set corresponds to the reference curve.

7. The method according to claim 6, characterized in that The server component sets of multiple risk levels include: a high-risk heat dissipation component set and a low-risk heat dissipation component set, the component temperature of the server components in the high-risk heat dissipation component set has a higher degree of influence on the server than the component temperature of the server components in the low-risk heat dissipation component set has on the server, the multiple parameter curves include a third curve and a fourth curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fourth curve under the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the third curve; In the case where the faulty component is the low-risk heat dissipation component, the ambient temperature of the server and the third operating parameter conform to the third curve; In the case where the faulty component is the high-risk heat dissipation component, the ambient temperature of the server and the third operating parameter conform to the fourth curve.

8. The method according to claim 7, characterized in that For the same ambient temperature of the server, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the third curve is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters under the first curve.

9. The method according to claim 3, characterized in that: The heat dissipation type of the server includes: multiple heat dissipation types, the multiple heat dissipation types include the target heat dissipation type to which the heat dissipation device belongs, the second category of server components includes: high-risk heat dissipation components and low-risk heat dissipation components, the component temperature of the high-risk heat dissipation components has a higher degree of influence on the server than the component temperature of the low-risk heat dissipation components, the second control curve includes: a fifth curve, a sixth curve, a seventh curve and an eighth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fifth curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the sixth curve, the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the eighth curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the seventh curve, and the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the seventh curve for the same ambient temperature of the server is higher than the heat dissipation performance of the heat dissipation device corresponding to the operating parameters of the fifth curve; When there is a faulty component among the server components of the second category, and the faulty component is the high-risk heat dissipation component, the ambient temperature of the server and the third operating parameter meet the eighth curve; When there is a faulty component among the server components of the second category, and the faulty component is the low-risk heat dissipation component, the ambient temperature of the server and the third operating parameter meet the seventh curve; When there is no faulty component in the server components of the second category and the heat dissipation type adopted by the server is the target heat dissipation type, the ambient temperature of the server and the third operating parameter meet the fifth curve; When there are no faulty components in the second category of server components and the heat dissipation type adopted by the server is not the target heat dissipation type, the ambient temperature of the server and the third operating parameter conform to the sixth curve.

10. The method according to claim 3, characterized in that: The second category of server components includes: a plurality of server components, the second control curve includes a plurality of component curves corresponding to the plurality of server components one by one, the server component with a higher degree of influence of component temperature on the server has a higher heat dissipation performance of the heat dissipation device corresponding to the operating parameter on the corresponding control curve under the same ambient temperature of the server; When a faulty component is detected in the server components of the second category, the ambient temperature of the server and the third operating parameter conform to a target curve, wherein a target server component among the multiple server components that belongs to the faulty component corresponds to the target curve in the multiple component curves.

11. The method according to claim 1, characterized in that: A second controller is also deployed on the server, and the method further includes: When the first controller is restarted, the heat dissipation device operates according to the operating parameters output by the second controller; In the event that the first controller fails to start, the heat dissipation device continues to operate according to the operating parameters output by the second controller; When the first controller is successfully started, the heat dissipation device stops operating according to the operating parameters output by the second controller, and operates according to the operating parameters output by the first controller.

12. An operating device for a heat dissipation device, characterized in that: The server includes: a server component, a first controller and a heat dissipation device, a first operating system and a second operating system are deployed on the first controller, the server components allowed to be configured on the server include: a first category of server components and a second category of server components, the first category of server components are server components that allow the first operating system to collect component temperatures, and the second category of server components are server components that allow the second operating system to collect component temperatures, and the device includes: A restart module, used for restarting the first controller during the operation of the server; a first operation module, configured to operate the heat dissipation device according to the operation parameters output by the first operating system during the restart of the first controller, wherein the operation parameters output by the first operating system are determined according to the ambient temperature of the server and the component temperature of the server component of the first category; A second operating module is used to operate the heat dissipation device according to the operating parameters output by the second operating system when the first controller completes restart, wherein the operating parameters output by the second operating system are determined based on the ambient temperature of the server and the component temperature of the second category of server components.

13. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method described in any one of claims 1 to 11 when executed by a processor.

14. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method described in any one of claims 1 to 11 are implemented.

15. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 11 are implemented.

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