A kind of resistance exclusion processing method and high power resistance exclusion

Abstract

The present invention provides a resistor processing method and a high-power resistor. The resistor processing method comprises the following steps: taking a plurality of copper substrates, and opening a plurality of separation grooves on each copper substrate; filling the separation grooves with epoxy resin glue; transferring the copper substrate to an oven for drying, so that the epoxy resin glue is cured to form an insulating layer; coating the surface of the copper substrate with Ag paste and transferring it to an oven for drying; taking an alloy substrate and covering it on the copper substrate, applying pressure to press the alloy substrate and the copper substrate together; laser engraving a resistor prototype on the alloy substrate; plastic sealing the side where the alloy substrate is located to obtain a resistor substrate; cutting the resistor substrate to obtain a resistor semi-finished product; coating the surface of the resistor semi-finished product with thermal conductive glue, and bonding the heat sink to obtain a high-power resistor. The above-mentioned resistor processing method and high-power resistor can improve the processing efficiency of the resistor and reduce its production cost, and improve the heat dissipation efficiency of the resistor, so that it is suitable for high-power carrying occasions.

Description

Technical Field

[0001] The invention relates to the field of resistor production, and in particular to a resistor exclusion processing method and a high-power resistor exclusion. Background Art

[0002] A resistor array is composed of several resistors with exactly the same parameters packaged together, one of their pins is connected together as a common pin, and the other pin is normally led out. For example, when a resistor array consists of n resistors, it has n+1 pins.

[0003] The main heat dissipation method of existing resistors is mainly in the form of radiation heat dissipation, and the heat dissipation effect is not suitable for high-power operation scenarios. When making a resistor, two materials need to be pressed together. The pressing process requires bonding two substrates of different materials together. The two substrates can be metal materials or metal materials and non-metal materials. After pressing, an etching process is required to process the target pattern on the metal material layer. During etching, the etching liquid is easy to contact the non-target layer. If two metal materials are used for pressing, the non-target layer will be etched and cause defects. If the non-target layer is a non-metal material, it is necessary to add a process to trim the non-metallic part after etching. The processing process is cumbersome, which increases the processing cost of the resistor and also leads to low processing efficiency of the resistor. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a resistor processing method and a high-power resistor, thereby improving the processing efficiency of the resistor and reducing its production cost, and improving the heat dissipation efficiency of the resistor, making it suitable for high-power transportation occasions.

[0005] The objective of the present invention is achieved through the following technical solutions:

[0006] A resistance exclusion processing method comprises the following steps:

[0007] Step 1: Take a plurality of copper substrates and open a plurality of separation grooves on each of the copper substrates;

[0008] Step 2: Fill the separation groove with epoxy glue;

[0009] Step 3: Transfer the copper substrate to an oven for drying to allow the epoxy resin glue to solidify to form an insulating layer;

[0010] Step 4: Coat the surface of the copper substrate with Ag paste and transfer it to an oven for drying;

[0011] Step 5: Cover the alloy substrate on the copper substrate, and apply pressure to press the alloy substrate and the copper substrate together;

[0012] Step 6: Laser engrave the shape of the resistor on the alloy substrate;

[0013] Step 7: Perform plastic sealing treatment on the side where the alloy substrate is located to obtain an exclusion substrate;

[0014] Step 8: cutting the exclusion substrate to obtain an exclusion semi-finished product;

[0015] Step 9: Apply thermal conductive adhesive on the surface of the semi-finished resistor and bond the heat sink to obtain a high-power resistor.

[0016] In one of the embodiments, step 2 uses a glue pouring device to fill the partition groove with epoxy resin glue, the glue pouring device includes a liquid storage barrel, a piston and a fixture, the liquid storage barrel stores epoxy resin glue, the piston is movably arranged in the liquid storage barrel, the inner cavity of the liquid storage barrel is provided with a limit strip, the fixture is arranged at the center of the liquid storage barrel, and separates the inner cavity of the liquid storage barrel into an upper cavity and a lower cavity, the fixture includes a connecting block and a plurality of partitions, the partition is provided with a liquid injection hole, a plurality of the partitions are arranged at intervals on the connecting block, and a storage area is formed between adjacent partitions, the connecting block is provided with an avoidance groove, the avoidance groove is connected to the storage area, and when the fixture is located in the liquid storage barrel, the limit strip penetrates the avoidance groove and extends into the storage area; the filling process of epoxy resin glue is as follows:

[0017] Place multiple copper substrates into the jig so that each storage area contains a copper substrate; place the jig into the inner cavity of the liquid storage barrel, extend the limit bar into the storage area to lift the copper substrate, and align the separation groove with the injection hole; after the piston drives the epoxy resin glue to pass through the jig, take the jig out of the liquid storage barrel.

[0018] In one embodiment, in step 7, before the plastic encapsulation process is performed, the resistance value of the resistor array prototype is first detected, and a resistance adjustment groove is opened on the resistor array prototype according to the detection result.

[0019] In one of the embodiments, after the resistance trimming groove is formed, a layer of glass paste is screen-printed at the location of the resistance trimming groove, and then the glass paste is cured in an oven.

[0020] In one embodiment, after obtaining the exclusion semi-finished product in step 8, electroplating is performed on the copper layer of the semi-finished product.

[0021] In one of the embodiments, the resistance value of the resistor exclusion semi-finished product after electroplating is detected and defective products are sorted out.

[0022] A high-power resistor, comprising: a copper layer, a resistor alloy layer, an epoxy plastic sealing layer and a heat sink;

[0023] Ag paste is provided between the copper layer and the resistance alloy layer; the copper layer includes two conductive parts, a separation groove is provided between the two conductive parts, the separation groove penetrates the copper layer, and the separation groove is filled with epoxy resin glue; the epoxy molding layer and the heat sink are located on a side of the resistance alloy layer away from the copper layer.

[0024] In one embodiment, the heat sink includes a contact portion and a plurality of heat sinks spaced apart on the contact portion, and the contact portion is used to absorb heat from the resistance alloy layer.

[0025] The above-mentioned resistor processing method and high-power resistor can improve the processing efficiency of the resistor and reduce its production cost, and improve the heat dissipation efficiency of the resistor, making it suitable for high-power transportation occasions. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 It is a schematic diagram of the structure of a high power resistor;

[0028] Figure 2 Schematic diagram of the distribution of the resistance adjustment slots;

[0029] Figure 3 It is a schematic diagram of the pressing of the copper substrate and the alloy substrate;

[0030] Figure 4 This is a schematic diagram of the structure of the alloy substrate after laser engraving;

[0031] Figure 5 It is a schematic diagram of the structure of the semi-finished product;

[0032] Figure 6 This is the initial state diagram of the glue filling device;

[0033] Figure 7 This is a schematic diagram of the coordination between epoxy resin glue and the fixture during glue pouring;

[0034] Figure 8 It is a structural diagram of the fixture;

[0035] Fig. 9 It is a schematic diagram of the coordination between the liquid injection hole and the resistance adjustment groove when the fixture is located in the liquid storage barrel;

[0036] Fig.10This is a schematic diagram of the coordination between the liquid injection hole and the resistance adjustment groove when the fixture is located outside the liquid storage barrel. DETAILED DESCRIPTION

[0037] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0038] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0040] See also Figure 1 The present invention provides a high-power resistor 10, which includes: a copper layer 100, a resistor alloy layer 200, an epoxy plastic sealing layer 300 and a heat sink 400.

[0041] See also Figure 1 , Ag paste (not shown) is provided between the copper layer 100 and the resistance alloy layer 200; Ag paste refers to metal glue (such as silver glue), which is a conductive material with good adhesion, high temperature resistance and corrosion resistance, and is often used for connecting circuit boards and welding electronic components. In the present application, Ag paste is used as an adhesive to bond the copper layer 100 and the resistance alloy layer 200 together, and the Ag paste itself has a conductive property, which can ensure that the copper layer 100 and the resistance alloy layer 200 are conductive after bonding; at the same time, the corrosion resistance of the Ag paste is used to separate the copper layer 100 from the resistance alloy layer 200 to avoid damaging the other layer of material during subsequent processing of one of them.

[0042] See also Figure 1The copper layer 100 includes two conductive parts 110, and a separation groove 120 is provided between the two conductive parts 110. The separation groove 120 penetrates the copper layer 100 and is filled with epoxy resin glue. After curing, the epoxy resin glue in the separation groove 120 forms an insulating layer to separate the two conductive parts 110, so that the two conductive parts 110 cannot be directly connected. In this way, when the resistor is connected to electricity, the current flows from one of the conductive parts 110 to the resistance alloy layer 200 before reaching the other conductive part 110. The conductive part 110 is the electrode of the resistor.

[0043] The epoxy plastic sealing layer 300 and the heat sink 400 are located on the side of the resistance alloy layer 200 away from the copper layer 100. The resistance alloy layer 200 is the working part of the resistor. When loaded, the resistance alloy layer 200 generates heat. The heat sink 400 can improve the heat dissipation efficiency, so that the resistor can be used in high-power scenarios. Preferably, the heat sink 400 includes a contact portion 410 and a plurality of heat sinks 420 spaced apart on the contact portion 410. The contact portion 410 is used to absorb the heat on the resistance alloy layer 200.

[0044] See also Figure 4 In one embodiment, a resistance adjustment groove 210 is formed on the resistance alloy layer 200. The resistance value of the resistance alloy layer 200 can be adjusted by increasing or decreasing the size of the resistance adjustment groove 210.

[0045] See also Figures 2 to 5 The present application also provides a resistor processing method for manufacturing the high-power resistor 10, and the resistor processing method comprises the following steps:

[0046] Step 1: Take a plurality of copper substrates 11 and open a plurality of separation grooves 120 on each copper substrate 11. Figure 2 As shown;

[0047] Step 2: Filling the separation groove 120 with epoxy resin glue;

[0048] Step 3: Transfer the copper substrate 11 to an oven for drying, so that the epoxy resin glue solidifies to form an insulating layer; the purpose of steps 1 to 3 is to form two conductive parts 110 on the copper layer 100 of the obtained resistor, and separate the conductive parts 110 through the insulating layer formed by the epoxy resin glue for insulation isolation, while the solidified epoxy resin glue fills the separation groove 120 to ensure the structural strength of the resistor itself.

[0049] Step 4: Coating Ag paste on the surface of the copper substrate 11 and transferring it to an oven for drying;

[0050] Step 5: Take the alloy substrate 13 and cover it on the copper substrate 11, and apply pressure to press the alloy substrate 13 and the copper substrate 11 together. Figure 3As shown; heating and pressure are required during pressing, and Ag paste is used as a medium to bond the alloy substrate 13 and the copper substrate 11.

[0051] Step 6: Laser engrave a resistor prototype 30 on the alloy substrate 13, such as Figure 4 As shown; laser engraving is used instead of the original chemical etching to process the alloy substrate 13, thereby improving the processing efficiency of the exclusion pattern.

[0052] Step 7: Perform a plastic encapsulation process on the side where the alloy substrate 13 is located to obtain a resistor exclusion substrate; and form an epoxy plastic encapsulation layer 300 on the resistor exclusion prototype 30 to prevent moisture in the air from contacting it.

[0053] Step 8: Cut the exclusion substrate to obtain the exclusion semi-finished product, such as Figure 5 As shown; after granulation, the copper substrate 11 forms a semi-finished copper layer 100, and the resistor prototype 30 forms a semi-finished resistor alloy layer 200.

[0054] Step 9: Coat thermal conductive adhesive on the surface of the resistor excluder semi-finished product and bond the heat sink 400 to obtain the high-power resistor excluder 10.

[0055] See also Figure 4 Preferably, in step 7, before the plastic encapsulation process is performed, the resistance value of the resistor array prototype 30 is first detected, and a resistance adjustment groove 210 is opened on the resistor array prototype 30 according to the detection result to adjust the resistance value of the resistor array prototype 30 to a target value. After the resistance adjustment groove 210 is opened, a layer of glass paste is screen-printed at the location of the resistance adjustment groove 210, and then the glass paste is cured in an oven.

[0056] Preferably, after obtaining the exclusion semi-finished product in step 8, electroplating is performed on the copper layer 100 of the semi-finished product.

[0057] In one embodiment, the resistance value of the resistor array semi-finished product after electroplating is detected and defective products are sorted out.

[0058] When the copper substrate 11 and the alloy substrate 13 are pressed together, laser engraving is used instead of chemical etching to remove resistors. Compared with the original solution, it is more environmentally friendly and shortens the processing time, which is beneficial to improving the efficiency of the resistor removal processing. There is no need to add process trimming after etching is completed, thus eliminating redundant processes in the resistor removal process.

[0059] In the existing process, a dispensing machine is used to fill the separation groove 120 with epoxy resin glue. The copper substrate 11 with the separation groove 120 opened needs to be clamped on the dispensing machine, and the dispensing head on the dispensing machine dispenses glue. Since the copper substrate 11 contains multiple separation grooves 120, after one of the separation grooves 120 is filled with epoxy resin glue, the copper substrate 11 or the dispensing head needs to be moved to align the dispensing head with the next separation groove 120, and then the dispensing operation is repeated, thereby each separation groove 120 on the copper substrate 11 is dispensed one by one. During glue dispensing, there are differences in the injection timing of the epoxy resin glue in each dividing groove 120, while the baking time of the copper substrate 11 in the oven is fixed, which leads to inconsistent curing degrees of the epoxy resin glue in each dividing groove 120. At the same time, there are many dividing grooves 120 on the copper substrate 11, and even the epoxy resin glue in the dividing groove 120 that is glued first has been cured, and the glue dispensing machine has not completed the glue dispensing operation, and the glue dispensing efficiency is low. The existing method of filling epoxy resin glue does not match the improved resistance exclusion processing method.

[0060] See also Figure 6 , Figure 8 and Fig. 9 In order to solve the above problem, the present application provides a glue pouring device 20 to implement the operation of step 2. The glue pouring device 20 includes a liquid storage barrel 500, a piston 600 and a fixture 700. The liquid storage barrel 500 stores epoxy resin glue 21. The piston 600 is movably arranged in the liquid storage barrel 500. The inner cavity of the liquid storage barrel 500 is provided with a limit strip 510. The fixture 700 is arranged at the center of the liquid storage barrel 500 and separates the inner cavity of the liquid storage barrel 500 into an upper cavity 51 and a lower cavity 52. ​​When the piston 600 moves, it can push the epoxy resin glue 21 through the fixture 700, so that the epoxy resin glue 21 enters the upper cavity 51 from the lower cavity 52.

[0061] See also Figure 8 and Fig. 9 The fixture 700 includes a connecting block 710 and a plurality of partitions 720, the partitions 720 are provided with injection holes 721, the plurality of partitions 720 are spaced apart on the connecting block 710, and a storage area 722 is formed between adjacent partitions 720, the connecting block 710 is provided with an avoidance groove 711, and the avoidance groove 711 is connected to the storage area 722. When the fixture 700 is located in the liquid storage barrel 500, the limit strip 510 penetrates the avoidance groove 711 and extends into the storage area 722. The filling process of the epoxy resin glue 21 is as follows:

[0062] Place multiple copper substrates 11 into the fixture 700, so that each storage area 722 contains a copper substrate 11; after the copper substrate 11 is placed in the storage area 722, the two side surfaces of the copper substrate 11 are attached to the two partitions 720 constituting the storage area 722;

[0063] See also Figure 6 and Fig. 9 , the jig 700 is placed into the inner cavity of the liquid storage barrel 500, and the limiting strip 510 extends into the receiving area 722 to lift up the copper substrate 11, so that the separation groove 120 is aligned with the injection hole 721; since the connecting block 710 is provided with an avoidance groove 711, when the jig 700 is placed into the inner cavity of the liquid storage barrel 500, the limiting strip 510 can penetrate the avoidance groove 711, and extend into the receiving area 722 to abut against the copper substrate 11, thereby lifting up the copper substrate 11, thereby aligning the separation groove 120 on the copper substrate 11 with the injection hole 721 on the partition 720, and connecting the upper cavity 51 with the lower cavity 52.

[0064] See also Figure 7 and Fig.10 After the piston 600 drives the epoxy resin glue 21 to pass through the fixture 700, the fixture 700 is taken out of the liquid storage barrel 500. When the piston 600 is started, the epoxy resin glue 21 is pushed from the lower cavity 52 into the upper cavity 51. During this process, the epoxy resin glue 21 needs to flow through the partition groove 120, that is, the epoxy resin glue 21 enters the interior of the partition groove 120. When the fixture 700 is taken out, since the copper substrate 11 is separated from the limit bar 510, the copper substrate 11 loses the support of the limit bar 510 and is in an active state. It can slide down under the action of external force until it contacts the connecting block 710. At this time, the partition groove 120 on the copper substrate 11 and the injection hole 721 on the partition 720 are staggered. Since the two sides of the copper substrate 11 are in contact with the partition 720, it is equivalent to the partition 720 sealing the partition groove 120, thereby sealing the epoxy resin glue 21 in the partition groove 120. After the fixture 700 is taken out from the liquid storage barrel 500, it is ensured that the epoxy resin glue 21 will not leave the partition groove 120, and the glue filling operation is completed.

[0065] In this way, when curing the epoxy resin glue 21 in step 3, the jig 700 needs to be placed in an oven together with the copper substrate 11 for baking; after the epoxy resin glue 21 is cured to form an insulating layer, the copper substrate 11 is taken out of the storage area 722, and the copper substrate 11 can be pushed out of the storage area 722 by inserting a rod-shaped object into the avoidance groove 711. It should be noted that after the jig 700 is taken out of the liquid storage barrel 500, the partition groove 120 is offset from the injection hole 721. Fig.10 As shown, after curing, the epoxy resin glue 21 in the separation groove 120 will not form a whole with the epoxy resin glue 21 in the injection hole 721, thereby reducing the resistance when the copper substrate 11 is removed from the storage area 722.

[0066] It should be emphasized that in the above process, the piston 600 only performs a single piston movement to fill the epoxy resin glue 21 into all the partition grooves 120 on the multiple copper substrates 11, and the epoxy resin glue 21 is sealed in the partition groove 120 by the partition 720. In the subsequent process, the fixture 700 is transferred to the oven for baking to solidify the epoxy resin glue 21. Compared with the dispensing method of a glue dispenser, the glue filling device 20 is more efficient in filling the partition groove 120 with the epoxy resin glue 21, and the epoxy resin glue 21 enters the partition groove 120 at the same time, which can ensure that the curing time of the epoxy resin glue 21 in each partition groove 120 is consistent, which is conducive to the mass production of resistors.

[0067] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for processing a resistor, used for processing a high-power resistor, characterized in that: The steps include: Step 1: Take a plurality of copper substrates and open a plurality of separation grooves on each of the copper substrates; Step 2: Fill the separation groove with epoxy glue; Step 3: Transfer the copper substrate to an oven for drying to allow the epoxy resin glue to solidify to form an insulating layer; Step 4: Coat the surface of the copper substrate with Ag paste and transfer it to an oven for drying; Step 5: Cover the alloy substrate on the copper substrate, and apply pressure to press the alloy substrate and the copper substrate together; Step 6: Laser engrave the shape of the resistor on the alloy substrate; Step 7: Perform plastic sealing treatment on the side where the alloy substrate is located to obtain an exclusion substrate; Step 8: cutting the exclusion substrate to obtain an exclusion semi-finished product; Step 9: Apply thermal conductive adhesive on the surface of the semi-finished resistor and bond the heat sink to obtain a high-power resistor.

2. The resistance exclusion processing method according to claim 1, characterized in that: Step 2: Use a glue pouring device to fill the partition groove with epoxy resin glue. The glue pouring device includes a liquid storage barrel, a piston and a fixture. The liquid storage barrel stores epoxy resin glue. The piston is movably arranged in the liquid storage barrel. The inner cavity of the liquid storage barrel is provided with a limit strip. The fixture is arranged at the center of the liquid storage barrel and separates the inner cavity of the liquid storage barrel into an upper cavity and a lower cavity. The fixture includes a connecting block and a plurality of partitions. The partition is provided with a liquid injection hole. The plurality of partitions are arranged at intervals on the connecting block. A storage area is formed between adjacent partitions. The connecting block is provided with an avoidance groove, which is connected to the storage area. When the fixture is located in the liquid storage barrel, the limit strip penetrates the avoidance groove and extends into the storage area. The filling process of epoxy resin glue is as follows: Place multiple copper substrates into the fixture so that each receiving area contains a copper substrate; Place the fixture into the inner cavity of the liquid storage barrel, extend the limit bar into the storage area to lift up the copper substrate, and align the separation groove with the injection hole; After the epoxy resin glue is driven through the fixture by the piston, the fixture is taken out of the liquid storage barrel.

3. The resistance exclusion processing method according to claim 1, characterized in that: In step 7, before the plastic encapsulation process is performed, the resistance value of the resistor array prototype is first detected, and a resistance adjustment groove is opened on the resistor array prototype according to the detection result.

4. The resistance exclusion processing method according to claim 3, characterized in that: After the resistance trimming groove is opened, a layer of glass paste is screen-printed at the location of the resistance trimming groove, and then the glass paste is cured in an oven.

5. The resistance exclusion processing method according to claim 1, characterized in that: After obtaining the exclusion semi-finished product in step 8, electroplating is performed on the copper layer of the semi-finished product.

6. The resistance exclusion processing method according to claim 5, characterized in that: The resistance value of the resistor array semi-finished product after electroplating is detected, and defective products are sorted out.

7. A high-power resistor, obtained by the resistor processing method according to claim 1, characterized in that: include: Copper layer, resistance alloy layer, epoxy plastic sealing layer and heat sink; Ag paste is provided between the copper layer and the resistance alloy layer; The copper layer comprises two conductive parts, a separation groove is provided between the two conductive parts, the separation groove penetrates the copper layer, and the separation groove is filled with epoxy resin glue; The epoxy molding layer and the heat sink are located on a side of the resistance alloy layer away from the copper layer.

8. The high power resistor according to claim 7, characterized in that: The heat sink comprises a contact portion and a plurality of heat sinks spaced apart and distributed on the contact portion, wherein the contact portion is used for absorbing heat on the resistance alloy layer.

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