A packaging structure and a manufacturing method thereof

Abstract

The present application provides a packaging structure and a manufacturing method thereof, the method comprising: providing a glass substrate with conductive through holes, which has a first surface and a second surface opposite thereto; connecting the first surface of the glass substrate with conductive through holes to a carrier; arranging a redistribution layer on the second surface of the glass substrate with conductive through holes, which has a third surface and a fourth surface opposite thereto; forming a copper column on the side of the redistribution layer close to the fourth surface; cutting the glass substrate with conductive through holes and the redistribution layer into at least two packaging units on the carrier in a direction perpendicular to the carrier to form at least one gap; forming an integrally formed plastic sealing layer on the side of the redistribution layer close to the fourth surface and in the gap, grinding the plastic sealing layer until the copper column is exposed to the plastic sealing layer; providing a third substrate, the third substrate being connected to the redistribution layer via the copper column to form a packaging structure. This scheme effectively releases and alleviates the stress generated during the molding process by first cutting the material into a single packaging substrate and then performing plastic sealing.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a packaging structure and a manufacturing method thereof. Background Art

[0002] During the packaging process, multiple components to be packaged need to be arranged according to a predetermined layout and fixed together using various packaging materials and technologies to form a continuous and complete packaging structure. This ensures that all components can maintain consistency and stability during the packaging process, and also facilitates subsequent processing.

[0003] However, some problems may be encountered in the process of forming the overall packaging structure and cutting it into individual packaging units. For example, if the stress generated during the molding process is not effectively released or controlled, it may cause a series of negative effects on the product. Glass substrates are very sensitive to stress changes due to their inherent brittleness. Stress may cause the glass substrate to deform, crack or even break, seriously affecting the quality and performance of the product. For example, when the packaging structure is cut into individual units, the originally balanced stress state will be broken, resulting in stress release. When the packaging structure is cut, the stress inside the glass substrate may be suddenly released, causing the substrate to crack, break or even break. This will not only seriously affect the yield of the packaging unit, but also increase production costs and time costs. In addition, when making redistribution layers, the more redistribution layers are made, the greater the warping, which will affect the performance of the packaging structure. Summary of the invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present application provides a packaging structure and a manufacturing method thereof, the method comprising:

[0005] Providing a glass substrate with a conductive through hole, wherein the glass substrate with a conductive through hole has a first surface and a second surface opposite thereto;

[0006] Connecting the first surface of the glass substrate with the conductive through hole to a carrier;

[0007] A redistribution layer is disposed on the second surface of the glass substrate with conductive through holes, wherein the redistribution layer has a third surface and a fourth surface opposite thereto, and the third surface is connected to the second surface;

[0008] forming at least two copper pillars on a side of the redistribution layer close to the fourth surface;

[0009] Cutting the glass substrate with conductive through holes and the redistribution layer into at least two packaging units, including a first packaging unit and a second packaging unit, on the carrier along a direction perpendicular to the carrier to form at least one gap;

[0010] forming an integrally formed plastic encapsulation layer on one side of the redistribution layer close to the fourth surface and in the gap, and grinding the plastic encapsulation layer until the copper column is exposed from the plastic encapsulation layer;

[0011] A third substrate is provided, wherein the third substrate is connected to the redistribution layer via the copper pillar to form the packaging structure.

[0012] In a possible implementation, the step of providing a glass substrate with a conductive through hole, wherein the glass substrate with a conductive through hole comprises a first surface and a second surface opposite thereto, comprises:

[0013] Providing a glass substrate, wherein the glass substrate has a first surface and a second surface opposite thereto;

[0014] forming a through hole extending from the first surface to the second surface of the glass substrate;

[0015] Using a spin coating or spray coating process to form a buffer layer that at least covers the inner wall of the through hole;

[0016] forming a seed layer covering the buffer layer on a side of the buffer layer facing the through hole;

[0017] A filling layer with conductivity is formed on one side of the seed layer close to the through hole, so as to obtain a glass substrate with a conductive through hole.

[0018] In a possible implementation manner, the step of forming at least two copper pillars on a side of the redistribution layer close to the fourth surface further includes:

[0019] Forming at least two copper pillars on a side of the fourth surface of the redistribution layer away from the third surface, including a first copper pillar and a second copper pillar;

[0020] A bridge chip is provided, and the bridge chip is connected to the third substrate on a side close to the redistribution layer.

[0021] In a possible implementation manner, the step of connecting the first surface of the glass substrate with the conductive through-holes to a carrier includes:

[0022] The first surface of the glass substrate with the conductive through hole is connected to the carrier plate by adhesive.

[0023] In a possible implementation manner, the step of forming an integrally formed plastic encapsulation layer on a side of the redistribution layer close to the fourth surface and in the gap includes:

[0024] Cleaning the redistribution layer and the gap surface;

[0025] Select suitable plastic packaging materials and adjust material viscosity, curing temperature and other parameters as needed;

[0026] Using an extrusion process to extrude a molding material onto a side of the redistribution layer close to the fourth surface and into the gap;

[0027] The packaging structure is placed in a heating environment to solidify the plastic packaging material.

[0028] The present application also provides a packaging structure, which is manufactured using any of the aforementioned methods for manufacturing a packaging structure, comprising:

[0029] A first packaging unit, the first packaging unit comprising a first glass substrate with conductive through holes and a first redistribution layer, the first glass substrate with conductive through holes and the first redistribution layer being stacked in a direction parallel to the through hole in the first glass substrate with conductive through holes, and a first connection portion being provided on a side of the first redistribution layer away from the first glass substrate with conductive through holes;

[0030] A second packaging unit, the second packaging unit comprising a second glass substrate with conductive through holes and a second redistribution layer, the second glass substrate with conductive through holes and the second redistribution layer being stacked in a direction parallel to the through hole in the second glass substrate with conductive through holes, and a second connecting portion being provided on a side of the second redistribution layer away from the second glass substrate with conductive through holes;

[0031] In a penetration direction perpendicular to the through hole in the first glass substrate with a conductive through hole, the first encapsulation unit and the second encapsulation unit are arranged at an interval, and there is a gap between the first encapsulation unit and the second encapsulation unit;

[0032] A plastic sealing layer, comprising a first plastic sealing layer and a second plastic sealing layer, wherein the first plastic sealing layer is arranged on a side of the first packaging unit close to the first connecting portion and a side of the second packaging unit close to the second connecting portion, and the second plastic sealing layer is arranged in the gap, and the first plastic sealing layer and the second plastic sealing layer are integrally formed;

[0033] The third substrate is connected to the first packaging unit and the second packaging unit via the first connecting portion and the second connecting portion in a penetration direction parallel to the through hole in the first glass substrate with conductive through holes.

[0034] In a possible implementation manner, the through-hole of the first glass substrate with a conductive through-hole comprises a first filling layer, and the first filling layer comprises a conductive material;

[0035] The first redistribution layer includes a first insulating layer and a first routing line penetrating the first insulating layer, and the first routing line is connected to the first filling layer.

[0036] In a possible implementation manner, the first filling layer material includes copper.

[0037] In a possible implementation manner, the first connection portion includes at least one copper column, and the copper column is connected to the first trace.

[0038] In a possible implementation manner, the third substrate includes a third redistribution layer.

[0039] Compared with the prior art, this application has the following beneficial effects:

[0040] The present application provides a packaging structure and a method for manufacturing the same. The method for manufacturing the packaging structure effectively releases and reduces the stress generated during the molding process by first cutting the material into individual packaging substrates and then performing plastic sealing, thereby reducing the cracking of the glass substrate due to the inability to withstand the stress during the molding process of the packaging structure. At the same time, when the packaging structure formed by the present solution is subsequently cut into individual packaging units, if fragments occur, it will only affect the individual packaging units and will not affect other packaging units. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A schematic diagram of a process for manufacturing a packaging structure provided in this embodiment;

[0043] Figure 2 One of the schematic diagrams of the packaging structure provided in this embodiment;

[0044] Figure 3 A second schematic diagram of the packaging structure provided in this embodiment;

[0045] Figure 4 The third schematic diagram of the packaging structure provided in this embodiment;

[0046] Figure 5 A fourth schematic diagram of the packaging structure provided in this embodiment;

[0047] Figure 6 A fifth schematic diagram of the packaging structure provided in this embodiment;

[0048] Figure 7 A sixth schematic diagram of the packaging structure provided in this embodiment;

[0049] Figure 8A seventh schematic diagram of a packaging structure provided in this embodiment;

[0050] Fig. 9 A schematic diagram of the process of step S11 provided in this embodiment;

[0051] Fig.10 A schematic diagram of the structure corresponding to step S11 provided in this embodiment;

[0052] Fig.11 A schematic diagram of the process of step S14 provided in this embodiment;

[0053] Fig.12 This is a flow chart of step S16 provided in this embodiment.

[0054] Icons: glass substrate with conductive through-holes-100; first surface-101; second surface-102; glass substrate-110; through-hole-120; buffer layer-130; filling layer-140; first filling layer-141; second filling layer-142; first glass substrate with conductive through-holes-150; second glass substrate with conductive through-holes-160; seed layer-170; carrier-200; adhesive-210; redistribution layer-300; third surface-30 1; fourth surface - 302; first redistribution layer - 310; first insulating layer - 311; first routing - 312; second redistribution layer - 320; second insulating layer - 321; second routing - 322; copper pillar - 400; first packaging unit - 510; second packaging unit - 520; gap - 530; plastic layer - 600; first plastic layer - 610; second plastic layer - 620; third substrate - 700; first direction - D1; second direction - D2. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0056] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0057] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0058] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0059] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0060] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.

[0062] The present application provides a packaging structure 900 and a manufacturing method thereof, please refer to Figure 1 , the method comprises the following steps.

[0063] Step S11, please refer to Figure 2 A glass substrate 100 with a conductive through hole is provided, wherein the glass substrate 100 with a conductive through hole has a first surface 101 and a second surface 102 opposite thereto. Optionally, the glass substrate 100 with a conductive through hole has a buffer layer 130 and a filling layer 140 sequentially arranged on the inner wall of the through hole 120.

[0064] Step S12, please refer to Figure 3 , the first surface 101 of the glass substrate 100 with conductive through holes is connected to the carrier 200 .

[0065] In this step, the carrier 200 is used to provide a stable support so as to maintain the stability and position accuracy of the glass substrate 110 during the subsequent processing. The connection method can use various adhesives to ensure the connection between the glass substrate 110 and the carrier 200.

[0066] Step S13, please refer to Figure 4 A redistribution layer 300 is disposed on the second surface 102 of the glass substrate 100 with conductive through holes. The redistribution layer 300 has a third surface 301 and a fourth surface 302 opposite thereto. The third surface 301 is connected to the second surface 102 .

[0067] Step S14, please refer to Figure 5 At least two copper pillars 400 are formed on the side of the redistribution layer 300 close to the fourth surface 302. The copper pillars 400 are used to provide electrical connection and mechanical support. The redistribution layer 300 is connected to the subsequent third substrate 700 via the copper pillars 400 to form a complete packaging structure 900.

[0068] Step S15, please refer to Figure 6 , the glass substrate 100 with conductive vias and the redistribution layer 300 are cut into at least two packaging units on the carrier 200 along a direction perpendicular to the carrier 200, including a first packaging unit 510 and a second packaging unit 520, to form at least one gap 530. These packaging units can be of the same or different sizes and shapes, depending on specific application requirements.

[0069] Step S16, please refer to Figure 7 , please refer to the plastic encapsulation layer 600 formed integrally on the side of the redistribution layer 300 close to the fourth surface 302 and in the gap 530, and grind the plastic encapsulation layer 600 until the copper pillar 400 is exposed in the plastic encapsulation layer 600. The plastic encapsulation layer 600 on the side of the redistribution layer 300 close to the fourth surface 302 is the first plastic encapsulation layer 610, and the plastic encapsulation layer 600 in the gap 530 is the second plastic encapsulation layer 620. The grinding process needs to ensure that the plastic encapsulation layer 600 is well cured, and then the grinding equipment is used in combination with the grinding medium. When the copper pillar 400 appears, the grinding stops to avoid damage.

[0070] Step S17, please refer to Figure 8 , providing a third substrate 700 , wherein the third substrate 700 is connected to the redistribution layer 300 via the copper pillar 400 to form the packaging structure 900 .

[0071] In this embodiment, the material is first cut into individual packaging substrates and then plastic-sealed, thereby effectively releasing and alleviating the stress generated during the molding process, and reducing the cracking caused by the glass substrate 110 being unable to withstand the stress during the molding process of the packaging structure 900; at the same time, when the packaging structure 900 formed by this solution is subsequently cut into a single packaging unit, if fragments occur, it will only affect the single packaging unit and will not affect other packaging units. In addition, when making a redistribution layer, the more layers there are, the greater the warping. When setting two or more redistribution layers, cutting them before molding can release a certain amount of stress, and the formed plastic sealing layer 600 can also serve as a buffer between packaging units.

[0072] In one possible implementation, please refer to Fig. 9 and Fig.10 , step S11 includes the following steps.

[0073] In step S111 , a glass substrate 110 is provided. The glass substrate 110 has a first surface 101 and a second surface 102 opposite thereto.

[0074] In step S112 , a through hole 120 is formed which penetrates from the first surface 101 to the second surface 102 of the glass substrate 110 .

[0075] Step S113 , forming a buffer layer 130 that at least covers the inner wall of the through hole 120 by using a spin coating or spray coating process.

[0076] For example, in step S113, silicon may be used as the buffer layer 130. Silicon is used to improve the interface characteristics between the substrate and the subsequent deposition layer, and to improve the performance and reliability of the device.

[0077] Optionally, in this embodiment, at least a portion of the buffer layer 130 formed in step S113 may extend from the through hole 120 to a side of the first surface 101 away from the second surface 102, and another at least a portion of the buffer layer 130 may extend from the through hole 120 to a side of the second surface 102 away from the first surface 101.

[0078] In step S114 , a seed layer 170 is formed on a side of the buffer layer 130 facing the through hole 120 to cover the buffer layer 130 .

[0079] Optionally, in this embodiment, at least a portion of the seed layer 170 formed in step S114 can extend from the through hole 120 to the side of the first surface 101 away from the second surface 102 and cover the buffer layer 130, and another at least a portion of the seed layer 170 can extend from the through hole 120 to the side of the second surface 102 away from the first surface 101 and cover the buffer layer 130.

[0080] In step S115 , a conductive filling layer 140 is formed on a side of the seed layer 170 close to the through hole 120 , so as to obtain a glass substrate 100 with a conductive through hole.

[0081] For example, in step S115, copper can be used as the filling layer 140. Copper has excellent electrical conductivity, can effectively reduce resistance, improve current transmission efficiency, reduce energy consumption and heat generation. At the same time, the high strength and toughness of copper enhance the stability of the structure, resist external forces, and ensure the durability of the equipment. Its high thermal conductivity makes heat conduction more efficient, maintains system temperature balance, and improves thermal stability. In addition, copper also helps to optimize signal transmission, reduce electromagnetic interference, enhance electromagnetic compatibility, and ensure stable operation of the equipment in complex environments.

[0082] Optionally, in this embodiment, at least a portion of the filling layer 140 formed in step S115 can extend from the through hole 120 to the side of the first surface 101 away from the second surface 102, and cover the seed layer 170, and another at least a portion of the filling layer 140 can extend from the through hole 120 to the side of the second surface 102 away from the first surface 101, and cover the seed layer 170.

[0083] In one possible implementation, please refer to Fig.11 , step S14 also includes the following steps.

[0084] In step S141 , at least two copper pillars 400 are formed on a side of the fourth surface 302 of the redistribution layer 300 away from the third surface 301 , including a first copper pillar and a second copper pillar.

[0085] In this step, the first copper pillar and the second copper pillar are arranged at opposite ends of the fourth surface 302 of the redistribution layer 300. After cutting at least two packaging units in step S15, the first copper pillar and the second copper pillar should be located in the first packaging unit 510 and the second packaging unit 520 respectively.

[0086] Step S142 , providing a bridge chip, and connecting the bridge chip to the third substrate 700 on a side close to the redistribution layer 300 .

[0087] In this step, the method of connecting the bridge chip to the third substrate 700 on the side close to the redistribution layer 300 before plastic packaging has great advantages. The bridge chip can be connected to other chips on the side of the third substrate 700 away from the bridge chip through the third substrate 700. The introduction of the bridge chip significantly improves the storage density and read and write speed, optimizes the package layout, and simplifies the wiring complexity; through the connection of the bridge chip, the reliability and stability of data transmission can be ensured, and the failure and damage rate caused by poor connection can be reduced.

[0088] In a possible implementation, step S12 includes connecting the first surface 101 of the glass substrate 100 with conductive through holes to the carrier 200 by means of an adhesive 210 .

[0089] In this step, an adhesive 210 is required to ensure a firm connection between the glass substrate 100 with conductive through holes and the carrier 200. The selection of the adhesive 210 usually depends on a variety of factors, including the required connection strength, thermal stability, chemical compatibility, and cost. After selecting a suitable adhesive 210, it is coated on the first surface 101 of the glass substrate 100 with conductive through holes, or coated on the corresponding position of the carrier 200. Next, the glass substrate 110 and the carrier 200 are aligned and bonded together. After the alignment is completed, the adhesive 210 is cured by heating, pressurizing or other curing methods, thereby achieving a firm connection between the glass substrate 110 and the carrier 200.

[0090] In one possible implementation, please refer to Fig.12 , step S16 includes the following steps.

[0091] Step S161 , cleaning the surface of the redistribution layer 300 and the gap 530 .

[0092] In this step, it is necessary to ensure that the surfaces of the redistribution layer 300 and the gap 530 are clean and free of impurities. For example, high-pressure gas can be used to remove physical impurities such as particles and dust on the surfaces of the redistribution layer 300 and the gap 530.

[0093] Step S162, selecting a suitable plastic packaging material, and adjusting parameters such as the viscosity and curing temperature of the material as required.

[0094] In this step, it is necessary to select a suitable plastic encapsulation material according to the packaging requirements, and the selected material should have good insulation, heat resistance, mechanical strength and other properties. At the same time, it is necessary to adjust the viscosity of the plastic encapsulation material according to the requirements of the packaging process to ensure that it can be evenly coated in the redistribution layer 300 and the gap 530. In addition, according to the operating temperature and thermal stress requirements of the packaged device, the curing temperature of the plastic encapsulation material is adjusted to ensure that the cured plastic encapsulation body has sufficient strength and stability.

[0095] Step S163 , using an extrusion process to extrude a molding material onto a side of the redistribution layer 300 close to the fourth surface 302 and into the gap 530 .

[0096] In this step, the plastic encapsulation material needs to be squeezed into the side of the redistribution layer 300 close to the fourth surface 302 and into the gap 530. During the squeezing process, it is necessary to ensure that the thickness of the plastic encapsulation material is uniform to avoid defects such as bubbles and cracks.

[0097] Step S164: placing the packaging structure 900 in a heating environment to solidify the plastic packaging material.

[0098] For example, the package structure 900 is placed in a heating environment, and the plastic encapsulation material is gradually solidified to form a plastic encapsulation body with certain strength and stability. During the curing process, it is necessary to ensure the uniformity of the heating temperature and time to avoid problems such as poor curing or over-curing. After the curing is completed, the package structure 900 needs to be taken out of the heating environment and cooled naturally or forcedly to ensure the stability and reliability of the plastic encapsulation body.

[0099] Another object of the present application is to provide a packaging structure 900. Figure 8 , manufactured using any of the aforementioned manufacturing methods of the packaging structure 900, including the following structure.

[0100] A first packaging unit 510, the first packaging unit 510 includes a first glass substrate 150 with conductive through holes and a first redistribution layer 310, in a direction parallel to the penetration direction of the through hole 120 in the first glass substrate 150 with conductive through holes, that is, a first direction D1, the first glass substrate 150 with conductive through holes and the first redistribution layer 310 are stacked, and a first connecting portion is provided on a side of the first redistribution layer 310 away from the first glass substrate 150 with conductive through holes.

[0101] The second packaging unit 520 includes a second glass substrate 160 with conductive through holes and a second redistribution layer 320. In a direction parallel to the penetration direction of the through holes 120 in the second glass substrate 160 with conductive through holes, i.e., a first direction D1, the second glass substrate 160 with conductive through holes and the second redistribution layer 320 are stacked, and a second connecting portion is provided on a side of the second redistribution layer 320 away from the second glass substrate 160 with conductive through holes.

[0102] In a second direction D2 perpendicular to the penetration direction of the through hole 120 in the first glass substrate 150 with conductive through holes, the first encapsulation unit 510 and the second encapsulation unit 520 are spaced apart, and a gap 530 exists between the first encapsulation unit 510 and the second encapsulation unit 520 .

[0103] The plastic sealing layer includes a first plastic sealing layer 610 and a second plastic sealing layer 620. The first plastic sealing layer 610 is arranged on a side of the first packaging unit 510 close to the first connecting portion and on a side of the second packaging unit 520 close to the second connecting portion. The second plastic sealing layer 620 is arranged in the gap 530. The first plastic sealing layer 610 and the second plastic sealing layer 620 are integrally formed.

[0104] The third substrate 700 is connected to the first packaging unit 510 and the second packaging unit 520 via the first connecting portion and the second connecting portion in a direction parallel to the through hole 120 in the first glass substrate 150 with conductive through holes, that is, the first direction D1.

[0105] When forming the encapsulation structure 900 provided in this embodiment, the encapsulation material is first cut into individual encapsulation units, namely the first encapsulation unit 510 and the second encapsulation unit 520. At this time, each encapsulation unit can be independently subjected to plastic encapsulation treatment, thereby ensuring the uniformity and integrity of the plastic encapsulation layer 600. The first plastic encapsulation layer 610 and the second plastic encapsulation layer 620 are integrally formed, which effectively disperses and releases the stress generated during the encapsulation process, thereby reducing the problem of rupture of the encapsulation structure 900 caused by stress concentration. In addition, since the encapsulation units are arranged at intervals and there are gaps 530, this further provides space for the release of stress. When the plastic encapsulation material shrinks during the curing process, these gaps 530 can absorb part of the stress and prevent it from being transferred to the glass substrate, thereby reducing the risk of the glass substrate being broken due to being unable to withstand stress. At the same time, using the encapsulation structure 900 provided in this embodiment, when a single encapsulation unit is subsequently cut, if fragments occur, it will only affect the single encapsulation unit and will not affect other encapsulation units.

[0106] In a possible implementation, the through hole 120 of the first glass substrate 150 with conductive through holes comprises a first filling layer 141 , and the first filling layer 141 comprises a conductive material; the first redistribution layer 310 comprises a first insulating layer 311 and a first routing line 312 penetrating the first insulating layer 311 , and the first routing line 312 is connected to the first filling layer 141 .

[0107] Optionally, the through hole 120 of the second glass substrate 160 with conductive through holes has a second filling layer 142, and the second filling layer 142 has a conductive material; the second redistribution layer 320 includes a second insulating layer 321 and a second routing line 322 passing through the second insulating layer 321, and the second routing line 322 is connected to the second filling layer 142.

[0108] In a possible implementation manner, the material of the first filling layer 141 includes copper.

[0109] In this embodiment, copper is used as the material of the first filling layer 141. Copper has excellent electrical conductivity, thermal conductivity and corrosion resistance, and is generally considered to be a cost-effective choice due to its wide range of applications and excellent performance.

[0110] Optionally, the second filling layer 142 is made of copper.

[0111] In a possible implementation manner, the first connection portion includes at least one copper column, and the copper column is connected to the first trace 312 .

[0112] In this embodiment, the first connection portion may use a plurality of copper pillars 400. The third substrate 700 is connected to the first redistribution layer 310 via the copper pillars 400.

[0113] Optionally, the second connection portion may include a plurality of copper pillars 400 . The third substrate 700 is connected to the second redistribution layer 320 via the copper pillars 400 .

[0114] In addition, in order to improve the performance of the package structure 900 , the first connection portion and the second connection portion may be connected via a bridge chip.

[0115] It is worth noting that the first connection portion and the second connection portion may also use other conductive pillars or other possible connection methods.

[0116] In a possible implementation manner, the third substrate 700 includes a third redistribution layer.

[0117] In this embodiment, the third substrate 700 includes a third redistribution layer, the third redistribution layer includes a third insulating layer and a third routing passing through the third insulating layer, and the third redistribution layer is connected to the first packaging unit 510 and the second packaging unit 520 via the first connecting part and the second connecting part, respectively, for realizing complex circuit connection and signal transmission.

[0118] In summary, the present application provides a packaging structure 900 and a manufacturing method thereof, the method comprising: providing a glass substrate 100 with a conductive through hole, the glass substrate 100 having a first surface 101 and a second surface 102 opposite thereto; connecting the first surface 101 of the glass substrate 100 with a conductive through hole to a carrier 200; providing a redistribution layer 300, the redistribution layer 300 having a third surface 301 and a fourth surface 302 opposite thereto; forming at least two copper pillars 400 on a side of the redistribution layer 300 close to the fourth surface 302; On the carrier 200, the glass substrate 100 with conductive through holes and the redistribution layer 300 are cut into at least two packaging units in a direction perpendicular to the carrier 200 to form at least one gap 530; an integrally formed plastic encapsulation layer 600 is formed on the side of the redistribution layer 300 close to the fourth surface 302 and in the gap 530, and the plastic encapsulation layer 600 is ground until the copper pillar 400 is exposed to the plastic encapsulation layer 600; a third substrate 700 is provided, which is connected to the redistribution layer 300 via the copper pillar 400 to form a packaging structure 900. This solution effectively releases and alleviates the stress generated during the molding process by first cutting the material into a single packaging substrate and then performing plastic encapsulation; at the same time, when the packaging structure 900 formed by this solution is subsequently cut into a single packaging unit, if fragmentation occurs, it will only affect the single packaging unit and will not affect other packaging units.

[0119] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a packaging structure, characterized in that: The method comprises: Providing a glass substrate with a conductive through hole, wherein the glass substrate with a conductive through hole has a first surface and a second surface opposite thereto; Connecting the first surface of the glass substrate with conductive through holes to a carrier; A redistribution layer is disposed on the second surface of the glass substrate with conductive through holes, wherein the redistribution layer has a third surface and a fourth surface opposite thereto, and the third surface is connected to the second surface; forming at least two copper pillars on a side of the redistribution layer close to the fourth surface; Cutting the glass substrate with conductive through holes and the redistribution layer into at least two packaging units, including a first packaging unit and a second packaging unit, on the carrier along a direction perpendicular to the carrier to form at least one gap; forming an integrally formed plastic encapsulation layer on one side of the redistribution layer close to the fourth surface and in the gap, and grinding the plastic encapsulation layer until the copper column is exposed from the plastic encapsulation layer; A third substrate is provided, wherein the third substrate is connected to the redistribution layer via the copper pillar to form the packaging structure.

2. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of providing a glass substrate with a conductive through hole, wherein the glass substrate with a conductive through hole comprises a first surface and a second surface opposite thereto comprises: Providing a glass substrate, wherein the glass substrate has a first surface and a second surface opposite thereto; forming a through hole extending from the first surface to the second surface of the glass substrate; Using a spin coating or spray coating process to form a buffer layer that at least covers the inner wall of the through hole; forming a seed layer covering the buffer layer on a side of the buffer layer facing the through hole; A filling layer with conductivity is formed on one side of the seed layer close to the through hole, so as to obtain a glass substrate with a conductive through hole.

3. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of forming at least two copper pillars on a side of the redistribution layer close to the fourth surface also includes: Forming at least two copper pillars on a side of the fourth surface of the redistribution layer away from the third surface, including a first copper pillar and a second copper pillar; A bridge chip is provided, and the bridge chip is connected to the third substrate on a side close to the redistribution layer.

4. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of connecting the first surface of the glass substrate with the conductive through hole to the carrier includes: The first surface of the glass substrate with the conductive through hole is connected to the carrier plate by adhesive.

5. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of forming an integrally formed plastic encapsulation layer on one side of the redistribution layer close to the fourth surface and in the gap comprises: Cleaning the redistribution layer and the gap surface; Select suitable plastic packaging materials and adjust material viscosity, curing temperature and other parameters as needed; Using an extrusion process to extrude a molding material onto a side of the redistribution layer close to the fourth surface and into the gap; The packaging structure is placed in a heating environment to solidify the plastic packaging material.

6. A packaging structure, characterized in that: The method for manufacturing the packaging structure according to any one of claims 1 to 5 comprises: A first packaging unit, the first packaging unit comprising a first glass substrate with conductive through holes and a first redistribution layer, the first glass substrate with conductive through holes and the first redistribution layer being stacked in a direction parallel to the through hole in the first glass substrate with conductive through holes, and a first connection portion being provided on a side of the first redistribution layer away from the first glass substrate with conductive through holes; A second packaging unit, the second packaging unit comprising a second glass substrate with conductive through holes and a second redistribution layer, the second glass substrate with conductive through holes and the second redistribution layer being stacked in a direction parallel to the through hole in the second glass substrate with conductive through holes, and a second connecting portion being provided on a side of the second redistribution layer away from the second glass substrate with conductive through holes; In a penetration direction perpendicular to the through hole in the first glass substrate with a conductive through hole, the first encapsulation unit and the second encapsulation unit are arranged at an interval, and there is a gap between the first encapsulation unit and the second encapsulation unit; A plastic sealing layer, comprising a first plastic sealing layer and a second plastic sealing layer, wherein the first plastic sealing layer is arranged on a side of the first packaging unit close to the first connecting portion and a side of the second packaging unit close to the second connecting portion, and the second plastic sealing layer is arranged in the gap, and the first plastic sealing layer and the second plastic sealing layer are integrally formed; The third substrate is connected to the first packaging unit and the second packaging unit via the first connecting portion and the second connecting portion in a penetration direction parallel to the through hole in the first glass substrate with conductive through holes.

7. The packaging structure according to claim 6, characterized in that: The through hole of the first glass substrate with conductive through holes has a first filling layer, and the first filling layer has a conductive material; The first redistribution layer includes a first insulating layer and a first routing line penetrating the first insulating layer, and the first routing line is connected to the first filling layer.

8. The packaging structure according to claim 7, characterized in that: The first filling layer material includes copper.

9. The packaging structure according to claim 7, characterized in that: The first connection portion includes at least one copper column, and the copper column is connected to the first trace.

10. The packaging structure according to claim 6, characterized in that: The third substrate includes a third redistribution layer.

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