Wafer bifurcation deformation prediction method and device, electronic equipment and storage medium
By applying different loads to the wafer during the wafer manufacturing stage to obtain the surface morphology and predicting the bifurcation deformation based on symmetry, the problem of wafer bifurcation deformation in semiconductor manufacturing is solved, and early evaluation and control of bifurcation deformation is achieved.
CN119786363AActive Publication Date: 2025-04-08XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
Patent Information
- Application Number
- CN202411741504.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2044-11-29
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Figure CN119786363A_ABST
Abstract
The embodiment of the invention discloses a wafer bifurcation deformation prediction method and device, electronic equipment and a storage medium, and belongs to the technical field of semiconductor manufacturing, and the wafer bifurcation deformation prediction method comprises the steps: obtaining various surface appearances of a wafer under the condition that different loads are applied to the wafer; and predicting the bifurcation deformation tendency of the wafer according to the symmetry of the wafer under various surface morphologies. According to the method, the bifurcation deformation of the wafer in the wafer manufacturing stage is evaluated, so that the subsequent processing flow can be guided according to the evaluation result, such as adjusting processing parameters or adopting a specific processing technology, and the possibility of bifurcation deformation of the wafer in subsequent production is reduced.
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Citation Information
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