Silicon wafer silk-screen printing discharging device

Abstract

The invention discloses a silicon wafer silk-screen printing discharging device. The silicon wafer silk-screen printing discharging device comprises a conveying mechanism and a mounting frame. The mounting frame is horizontally located below the conveying mechanism, a limiting groove is formed in the part, located below the conveying mechanism, of the mounting frame, a strip-shaped plate is vertically and slidably connected into the limiting groove, and a lifting mechanism is mounted in the limiting groove and used for driving the strip-shaped plate to ascend and descend; a lifting table is horizontally installed on the top of the strip-shaped plate and is perpendicular to the conveying mechanism, and a slope is arranged on the top side of the lifting table. A base table is installed on the installation frame, a rotating pipe is rotationally connected to the base table, a suction cup is installed at the tail end of the rotating pipe, a motor and an air pump are installed on the base table, the motor is used for driving the rotating pipe to rotate, and the air pump communicates with the rotating pipe.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to a silicon wafer screen printing unloading device. Background Art

[0002] Silicon wafer screen printing is a technology that transfers conductive paste (such as silver paste, aluminum paste, etc.) to the surface of silicon wafers by screen printing. The basic principle is to use the mesh of the screen as a template for screen printing. The screen is usually made of nylon, polyester and other materials, with a pre-designed pattern on it. When the scraper moves on the screen at a certain pressure and speed, the conductive paste placed on one end of the screen is squeezed by the scraper and passes through the mesh of the screen and is deposited on the surface of the silicon wafer, thereby forming a specific electrode pattern or other functional layer. After the silicon wafer is screen printed, it needs to be unloaded. Silicon wafer unloading is a key link in the silicon wafer processing process. Silicon wafers need to be unloaded safely and efficiently from the processing equipment for subsequent packaging, inspection or other processes. This process is directly related to the quality and production efficiency of silicon wafers. For example, if the silicon wafer is damaged during the unloading process, such as defects such as broken edges and scratches, the scrap rate of the silicon wafer will increase, thereby increasing production costs. In current automated production, silicon wafers are usually transported by a conveying mechanism consisting of two sets of conveyor belts located on the same horizontal plane and parallel to each other. How to automatically and efficiently unload the silicon wafers from the conveying mechanism is the design focus of the present invention. Summary of the invention

[0003] In order to solve the technical problems existing in the background technology, the present invention provides a silicon wafer screen printing unloading device.

[0004] The present invention provides a silicon wafer screen printing unloading device, comprising a conveying mechanism and a mounting frame, wherein the conveying mechanism comprises a first conveying belt and a second conveying belt, wherein the first conveying belt and the second conveying belt are located in the same horizontal plane and are parallel to each other, and the silicon wafers are placed on the upper parts of the first conveying belt and the second conveying belt for conveying; the mounting frame is horizontally located below the conveying mechanism, and a limiting groove is provided on the part of the mounting frame located below the conveying mechanism, and a strip plate is vertically slidably connected in the limiting groove, and a lifting mechanism is installed in the limiting groove for driving the strip plate to rise and fall;

[0005] A lifting platform is horizontally installed on the top of the strip plate, and the lifting platform is perpendicular to the conveying mechanism. A groove is transversely provided on the top side of the lifting platform, and the groove divides the lifting platform into part A and part B. When the lifting platform rises, the first conveyor belt is located in the groove, part A is located outside the conveyor belt, and part B is located between the first conveyor belt and the second conveyor belt. A through groove is longitudinally provided in the middle of the front side of part A. A limit block is fixedly connected to the top of part A of the lifting platform away from the conveying mechanism. A slope is provided on the top side of the lifting platform, which gradually slopes downward from part B to part A.

[0006] A base is installed on the mounting frame, and a rotating tube is rotatably connected to the base. A suction cup is installed at the end of the rotating tube. The axis of the rotating shaft of the rotating tube is parallel to the conveying mechanism. When the rotating tube rotates toward the conveying mechanism, the rotating tube is located between the through grooves of the lifting platform. At this time, the suction cup opens upward and is located below the upper surface of the A part of the lifting platform. A motor and an air pump are installed on the base. The motor is used to drive the rotating tube to rotate, and the air pump is connected to the rotating tube.

[0007] Preferably, the lifting mechanism comprises a gear roller and a motor, wherein the motor is used to drive the gear roller to rotate, a gear rail is installed on one side of the strip plate, and the gear roller and the gear rail are meshed with each other.

[0008] Preferably, a rubber pad is installed on a side of the limit block close to the conveying mechanism.

[0009] Preferably, the angle between the upper surface of part A of the lifting platform and the horizontal plane is between 10° and 20°.

[0010] Preferably, a plurality of rollers are installed on the top side of the lifting platform.

[0011] Preferably, the axis of the rotating shaft of the rotating tube divides the base into a C part away from the conveying mechanism and a D part close to the conveying mechanism, the upper surface of the C part is a horizontal plane, the upper surface of the D part is an inclined plane, the plane where the upper surface of the D part is located is parallel to the plane where the upper surface of the lifting platform is located, when the rotating tube rotates to above the C part, the rotating tube is horizontal and the opening of the suction cup is downward, when the rotating tube rotates to above the D part, the rotating tube is inclined and located between the through grooves of the A part of the lifting platform and the opening of the suction cup is upward.

[0012] Preferably, a plurality of groups of guide rods are vertically mounted on the bottom side of the A portion of the lifting platform, and each group of guide rods is slidably connected to the mounting frame.

[0013] In the present invention, a silicon wafer screen printing unloading device is proposed. During the silicon wafer conveying process, the silicon wafer is placed above the first conveyor belt and the second conveyor belt. When the lifting platform rises, the B part is located between the first conveyor belt and the second conveyor belt. The part of the B part protruding from the first conveyor belt and the second conveyor belt can lift the silicon wafer and make the silicon wafer separate from the first conveyor belt and the second conveyor belt. Since the top side of the lifting platform is inclined, the silicon wafer will slide down through the inclined slope and slide to the A part of the lifting platform until it slides to the limit block and stops sliding, completing the process of the silicon wafer separating from the conveying mechanism and being transferred to the upper side of the A part of the lifting platform.

[0014] When the silicon wafer is separated from the conveying mechanism and transported to the upper side of the lifting platform A, the motor is used to drive the rotating tube to rotate. When the rotating tube is located in the through slot of the lifting platform, the air pump generates suction on the suction cup through the rotating tube to fix the silicon wafer to the suction cup.

[0015] The motor drives the rotating tube to rotate from part D to part C. At this time, the suction cup faces downward, and the air pump adjusts the air pressure in the rotating tube to separate the silicon wafer from the suction cup. The silicon wafer is placed in a collecting device to complete unloading. At this time, the lifting platform descends and the rotating tube flips. The above operations are repeated. The present invention can realize automatic unloading and enhance the unloading efficiency.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention;

[0018] Figure 2 It is a structural schematic diagram of the unloading structure of the present invention;

[0019] Figure 3 It is a structural schematic diagram of the lifting platform in the present invention;

[0020] Figure 4 It is a structural schematic diagram of the base platform in the present invention;

[0021] Explanation of the numbers in the figure: 1. Mounting frame; 101. Limiting groove; 102. Tooth roller; 2. Strip plate; 201. Tooth rail; 3. Lifting platform; 301. Groove; 302. Roller; 303. Through groove; 304. Limiting block; 305. Guide rod; 4. Base; 401. Rotating tube; 402. Suction cup; 403. Motor; 404. Air pump; 5. Conveying mechanism; 501. First conveyor belt; 502. Second conveyor belt. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar symbols throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0023] like Figure 1-Figure 4A silicon wafer screen printing unloading device shown in the figure comprises a conveying mechanism 5 and a mounting frame 1, wherein the conveying mechanism 5 comprises a first conveying belt 501 and a second conveying belt 502, wherein the first conveying belt 501 and the second conveying belt 502 are located in the same horizontal plane and are parallel to each other, and the silicon wafers are placed on the upper parts of the first conveying belt 501 and the second conveying belt 502 for conveying; the mounting frame 1 is horizontally located below the conveying mechanism 5, and a limiting groove 101 is provided in the portion of the mounting frame 1 located below the conveying mechanism 5, and a strip plate 2 is vertically slidably connected in the limiting groove 101, and a lifting mechanism is installed in the limiting groove 101 for driving the strip plate 2 to rise and fall;

[0024] The mounting frame 1 has a portion located below the conveying mechanism 5 , and the limiting groove 101 provided in the portion can facilitate the lifting and moving of the positioning strip plate 2 .

[0025] A lifting platform 3 is horizontally installed on the top of the strip plate 2, and the lifting platform 3 is perpendicular to the conveying mechanism 5. A groove 301 is transversely opened on the top side of the lifting platform 3, and the groove 301 divides the lifting platform 3 into part A and part B. When the lifting platform 3 rises, the first conveyor belt 501 is located in the groove 301, part A is located outside the conveyor belt, and part B is located between the first conveyor belt 501 and the second conveyor belt 502. A through groove 303 is longitudinally opened in the middle of the front side of part A. The top of part A of the lifting platform 3 away from the conveying mechanism 5 is fixedly connected to a limiting block 304, and a slope is provided on the top side of the lifting platform 3, which gradually slopes downward from part B to part A.

[0026] During the transportation of silicon wafers, the silicon wafers are placed above the first conveyor belt 501 and the second conveyor belt 502. When the lifting platform 3 rises, part B is located between the first conveyor belt 501 and the second conveyor belt 502. Part B protrudes from the first conveyor belt 501 and the second conveyor belt 502, which can lift the silicon wafer and make the silicon wafer separate from the first conveyor belt 501 and the second conveyor belt 502. Since the top side of the lifting platform 3 is inclined, the silicon wafer will slide down through the inclined surface and slide to part A of the lifting platform 3 until it slides to the limit block 304 and stops sliding, completing the process of the silicon wafer separating from the conveying mechanism 5 and being transferred to the upper side of part A of the lifting platform 3.

[0027] A base 4 is installed on the mounting frame 1, and a rotating tube 401 is rotatably connected to the base 4. A suction cup 402 is installed at the end of the rotating tube 401. The axis of the rotating shaft of the rotating tube 401 is parallel to the conveying mechanism 5. When the rotating tube 401 rotates toward the conveying mechanism 5, the rotating tube 401 is located between the through grooves 303 of the lifting platform 3. At this time, the suction cup 402 opens upward and is located below the upper surface of the A part of the lifting platform 3. A motor 403 and an air pump 404 are installed on the base 4. The motor 403 is used to drive the rotating tube 401 to rotate, and the air pump 404 is connected to the rotating tube 401.

[0028] When the silicon wafer is separated from the conveying mechanism 5 and transported to the upper side of the lifting platform 3A, the motor 403 is used to drive the rotating tube 401 to rotate. When the rotating tube 401 is located in the through groove 303 of the lifting platform 3, the air pump 404 generates suction on the suction cup 402 through the rotating tube 401 to fix the silicon wafer and the suction cup 402.

[0029] The motor 403 drives the rotating tube 401 to rotate, so that the rotating tube 401 rotates from part D to part C. At this time, the suction cup 402 faces downward, and the air pump 404 adjusts the air pressure in the rotating tube 401 to separate the silicon wafer from the suction cup 402. The silicon wafer is placed in the collecting device to complete the unloading. At this time, the lifting platform 3 descends, and the rotating tube 401 flips over. The above operations are repeated. The present invention can realize automatic unloading and enhance the unloading efficiency.

[0030] Preferably, the lifting mechanism comprises a gear roller 102 and a motor 403 , wherein the motor 403 is used to drive the gear roller 102 to rotate, and a rack 201 is installed on one side of the strip plate 2 , and the gear roller 102 and the rack 201 are meshed with each other.

[0031] The motor 403 drives the gear roller 102 to rotate, and controls the lifting and lowering of the strip plate 2 by meshing with the gear rail 201, thereby controlling the lifting and lowering of the lifting platform 3.

[0032] Preferably, a rubber pad is installed on one side of the limit block 304 close to the conveying mechanism 5, which can play a buffering role when the silicon wafer slides from the B part to the A part of the lifting platform 3.

[0033] Preferably, the angle between the upper surface of part A of the lifting platform 3 and the horizontal plane is between 10°-20°. The inclination angle enables the silicon wafer to slide the lifting platform 3 from part B to part A, and the impact force is reduced as much as possible when the silicon wafer contacts the limit block 304, thereby protecting the silicon wafer.

[0034] Preferably, a plurality of rollers 302 are installed on the top side of the lifting platform 3 , which can prevent the lower surface of the silicon wafer from being scratched and can reduce the friction resistance between the silicon wafer and the lifting platform 3 .

[0035] Preferably, the axis of the rotating shaft of the rotating tube 401 divides the base 4 into a C portion away from the conveying mechanism 5 and a D portion close to the conveying mechanism 5, the upper surface of the C portion is a horizontal plane, the upper surface of the D portion is an inclined plane, the plane where the upper surface of the D portion is located is parallel to the plane where the upper surface of the lifting platform 3 is located, when the rotating tube 401 rotates to above the C portion, the rotating tube 401 is horizontal and the opening of the suction cup 402 is downward, when the rotating tube 401 rotates to above the D portion, the rotating tube 401 is inclined and located between the through grooves 303 of the A portion of the lifting platform 3 and the opening of the suction cup 402 is upward.

[0036] The inclined surface of part D can ensure that when the silicon wafer slides from part B to part A of the lifting platform 3, the inclination angle of the rotating tube 401 is always parallel to the inclination angle of the upper surface of part A of the lifting platform 3, so that the suction cup 402 can be located on the lower side of the silicon wafer and the side suction cup 402 can absorb the silicon wafer.

[0037] Preferably, a plurality of groups of guide rods 305 are vertically installed on the bottom side of the A portion of the lifting platform 3, and each group of guide rods 305 is slidably connected to the mounting frame 1, so as to ensure that the lifting platform 3 moves smoothly in the vertical direction.

[0038] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A silicon wafer screen printing unloading device, comprising a conveying mechanism (5) and a mounting frame (1), wherein the conveying mechanism (5) comprises a first conveying belt (501) and a second conveying belt (502), wherein the first conveying belt (501) and the second conveying belt (502) are located in the same horizontal plane and are parallel to each other, and the silicon wafer is placed on the first conveying belt (501) and the second conveying belt (502) to be transported; characterized in that: The mounting frame (1) is horizontally located below the conveying mechanism (5); a limiting groove (101) is provided on the portion of the mounting frame (1) located below the conveying mechanism (5); a strip plate (2) is vertically slidably connected in the limiting groove (101); a lifting mechanism is installed in the limiting groove (101) for driving the strip plate (2) to move up and down; A lifting platform (3) is horizontally installed on the top of the strip plate (2), and the lifting platform (3) is perpendicular to the conveying mechanism (5). A groove (301) is transversely opened on the top side of the lifting platform (3), and the groove (301) divides the lifting platform (3) into a part A and a part B. When the lifting platform (3) rises, the first conveyor belt (501) is located in the groove (301), the part A is located outside the conveyor belt, and the part B is located between the first conveyor belt (501) and the second conveyor belt (502). A through groove (303) is longitudinally opened in the middle of the front side of the part A. The top of the part A of the lifting platform (3) away from the conveying mechanism (5) is fixedly connected to a limiting block (304), and the top side of the lifting platform (3) is provided with a slope, which gradually slopes downward from the part B to the part A. A base (4) is installed on the mounting frame (1), and a rotating tube (401) is rotatably connected to the base (4). A suction cup (402) is installed at the end of the rotating tube (401), and the axis of the rotating shaft of the rotating tube (401) is parallel to the conveying mechanism (5). When the rotating tube (401) rotates toward the conveying mechanism (5), the rotating tube (401) is located between the through grooves (303) of the lifting platform (3). At this time, the suction cup (402) opens upward and is located below the upper surface of the A part of the lifting platform (3). A motor (403) and an air pump (404) are installed on the base (4), and the motor (403) is used to drive the rotating tube (401) to rotate, and the air pump (404) is connected to the rotating tube (401).

2. A silicon wafer screen printing unloading device according to claim 1, characterized in that: The lifting mechanism comprises a gear roller (102) and a motor (403), wherein the motor (403) is used to drive the gear roller (102) to rotate, a gear rail (201) is installed on one side of the strip plate (2), and the gear roller (102) and the gear rail (201) are meshed with each other.

3. The silicon wafer screen printing unloading device according to claim 1, characterized in that: A rubber pad is installed on one side of the limit block (304) close to the conveying mechanism (5).

4. The silicon wafer screen printing unloading device according to claim 1, characterized in that: The angle between the upper surface of the A part of the lifting platform (3) and the horizontal plane is between 10° and 20°.

5. The silicon wafer screen printing unloading device according to claim 1, characterized in that: A plurality of rollers (302) are installed on the top side of the lifting platform (3).

6. The silicon wafer screen printing unloading device according to claim 1, characterized in that: The axis of the rotating shaft of the rotating tube (401) divides the base (4) into a C portion away from the conveying mechanism (5) and a D portion close to the conveying mechanism (5); the upper surface of the C portion is a horizontal plane, and the upper surface of the D portion is an inclined plane; the plane where the upper surface of the D portion is located is parallel to the plane where the upper surface of the lifting platform (3) is located; when the rotating tube (401) rotates to above the C portion, the rotating tube (401) is horizontal and the opening of the suction cup (402) is downward; when the rotating tube (401) rotates to above the D portion, the rotating tube (401) is inclined and located between the through grooves (303) of the A portion of the lifting platform (3) and the opening of the suction cup (402) is upward.

7. The silicon wafer screen printing unloading device according to claim 1, characterized in that: A plurality of groups of guide rods (305) are vertically mounted on the bottom side of the A portion of the lifting platform (3), and each group of guide rods (305) is slidably connected to the mounting frame (1).

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