Low-temperature cooling control method for semiconductor etching machine accessory equipment

Abstract

The invention relates to the technical field of semiconductor etching machine accessory equipment cooling control, and discloses a low-temperature cooling control method for semiconductor etching machine accessory equipment, and the method comprises the steps: carrying out the partitioning setting of the heat dissipation of a working part according to the optimal working temperature of the working part in an etching machine; the multiple sets of liquid conveying branch pumps and the cold flow control valves are matched to conduct independent liquid supply and conveying on all the heat dissipation subareas, subarea heat dissipation control over working components can be achieved through refrigerant liquid flow control, the heat dissipation and cooling control accuracy of the equipment can be effectively improved, heat circulation pipes are arranged at part of components in the heat dissipation subareas, and therefore the heat dissipation efficiency of the equipment is improved. Auxiliary heat compensation can be improved for working components with the high low-temperature upper limit in the subareas through an external heat source, all the components in the subareas are made to be at the optimal working temperature all the time, a real-time dynamic cooling temperature control mode is adopted, dynamic and accurate cooling of the working components can be achieved, and the working efficiency is improved. And it is ensured that working parts in the equipment can be kept in the optimal working state in different working stages.

Description

Technical Field

[0001] The invention relates to the technical field of temperature reduction control of semiconductor etching machine auxiliary equipment, and in particular to a low-temperature cooling control method for semiconductor etching machine auxiliary equipment. Background Art

[0002] Semiconductor etching is a technology that selectively corrodes or strips the surface of a semiconductor substrate or a thin film covering the surface according to mask patterns or design requirements in the semiconductor production process. Etching technology is not only a basic manufacturing process for semiconductor devices and integrated circuits, but is also used in the processing of thin-film circuits, printed circuits and other fine patterns. In the semiconductor manufacturing process, etching technology is a crucial step.

[0003] The etching process relies on the cooperation of the working parts inside the etching machine and its ancillary equipment. Since the etching machine is a high-precision processing equipment, the performance of its working parts is greatly affected by its own working temperature. The temperature of the etching machine and its ancillary equipment directly affects the etching effect and the quality of the product. The working parts rely on the low-temperature cooling system in the equipment for temperature control. Although the traditional cooling system can complete the cooling of the parts, it is often difficult to accurately control the temperature. Unstable temperature fluctuations will lead to fluctuations in the working performance of the parts, thereby causing process instability and affecting the yield of the product. Therefore, a low-temperature cooling control method for the ancillary equipment of the semiconductor etching machine is proposed. Summary of the invention

[0004] The object of the present invention is to provide a low temperature cooling control method for semiconductor etching machine auxiliary equipment to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a low-temperature cooling and temperature reduction system for semiconductor etching machine auxiliary equipment, including a coolant storage unit, a liquid pump unit, a coolant distribution unit, a cooling unit, a heat exchange and temperature reduction unit, a temperature compensation unit, a work control unit, a temperature detection unit, a flow monitoring unit and a data recording unit;

[0006] The coolant storage unit is used for storing coolant to ensure sufficient supply of coolant, and the coolant storage unit includes a coolant tank;

[0007] The liquid pump unit is used for supplying and delivering the cooling liquid, and the liquid pump unit comprises an infusion master pump and an infusion branch pump;

[0008] The coolant distribution unit is used for quantitative distribution and delivery of the coolant, and the coolant distribution unit includes a liquid cooling flow control valve;

[0009] The cooling unit is installed with the working component to dissipate heat and cool the working component, and the cooling unit includes a heat exchange cooling module;

[0010] The heat exchange and cooling unit is used for heat dissipation and cooling of the coolant, and the heat exchange and cooling unit includes a cooling fan and a heat exchange radiator;

[0011] The temperature compensation unit is used to assist the temperature control of the working parts, and the temperature compensation unit includes a heat circulation pipe and a heat pipe flow control valve;

[0012] The working control unit is used for overall operation control of the cooling system, and the working control unit includes a master control module;

[0013] The temperature detection unit is used for temperature detection at key positions in the system, and includes a liquid inlet temperature detection module, a reflux temperature detection module and a component temperature detection module;

[0014] The flow monitoring unit is used for real-time monitoring of flow at key points in the pipeline, and the flow monitoring unit includes a total flow monitoring module and a sub-flow monitoring module;

[0015] The data recording unit is used for recording data of system operation, and the data recording unit includes a local database and a cloud database.

[0016] Preferably, the above-mentioned infusion main pump is installed in communication with the liquid outlet end of the cooling liquid tank, the liquid outlet end of the infusion main pump is provided with a liquid distribution tube, and multiple infusion sub-pumps are provided, and the liquid inlet end of the infusion sub-pump is installed in communication with the liquid outlet end of the liquid distribution tube.

[0017] Preferably, the working parts in the above-mentioned etching machine are divided into multiple heat dissipation zones according to temperature zones, and several of the infusion sub-pumps are respectively connected to the liquid inlet pipelines of the corresponding heat dissipation zones and installed for cooling liquid supply control of the heat dissipation zones.

[0018] Preferably, the above-mentioned liquid cooling flow control valve is provided in plurality, and several of the liquid cooling flow control valves are respectively connected and installed in the liquid inlet pipelines of the corresponding heat dissipation partitions for controlling the coolant inlet flow of the heat dissipation partitions.

[0019] Preferably, the heat exchange cooling module is a conductive liquid cooling structure, which is installed in close contact with the working component to achieve heat dissipation and cooling of the working component through contact heat conduction. The heat circulation pipe is installed in a threaded shape in contact with the liquid inlet pipe end of the heat exchange cooling module, and the heat pipe flow control valve is connected and installed on the air inlet side of the heat circulation pipe for air inlet on-off control of the heat pipe.

[0020] Preferably, the heat exchanger radiator is connected to the coolant return pipeline of the installation system for dissipating heat and cooling the coolant, the cooling fan is installed on the cooling fin side of the heat exchanger radiator for accelerating the dissipation of heat from the heat exchanger radiator, and the master control module is a high-performance processor for overall system operation control.

[0021] Preferably, the above-mentioned liquid inlet temperature detection module, reflux temperature detection module and component temperature detection module are all temperature sensors, the liquid inlet temperature detection module is connected and installed in the liquid outlet pipeline of the infusion master pump for temperature detection of cooling the liquid inlet side, the reflux temperature detection module is connected and installed in the reflux pipeline of the system for temperature detection of cooling the reflux side, and the component temperature detection module is connected and installed with the working component for temperature detection at the working component.

[0022] Preferably, the above-mentioned total flow monitoring module and sub-flow monitoring module are both flow detection sensors. The total flow monitoring module is installed in the liquid outlet pipeline of the main infusion pump for flow monitoring on the cooling liquid inlet side, and the sub-flow monitoring modules are respectively installed in the liquid inlet pipelines of multiple heat dissipation partitions for flow monitoring of the coolant entering the heat dissipation partitions. The inlet temperature detection module, reflux temperature detection module, component temperature detection module, total flow monitoring module and sub-flow monitoring module are all installed in connection with the signal receiving end of the main control module through communication wiring.

[0023] Preferably, the local database and cloud database are respectively arranged in the etching machine and in the remote cloud, and the local database and cloud database are respectively used for storing local working data and cloud working data and providing data support for the control of the master control module.

[0024] A control method for a low temperature cooling system of ancillary equipment of a semiconductor etching machine comprises the following steps:

[0025] S1, system initialization, the initialization work is synchronized with the start of the etching machine, and the system self-check is performed before work to check whether the components of the cooling system are working properly and ensure that there is enough coolant in the coolant tank;

[0026] S2, cooling work, after completing the initialization self-test, the infusion master pump works to extract the coolant from the coolant tank and transport it to the cooling circuit. The coolant enters the buffer cavity in the dispensing tube and is transported to each heat dissipation partition through the infusion sub-pump. The coolant quantitatively flows into the heat exchange cooling module to complete the heat dissipation and cooling of the working parts through heat conduction. After that, the coolant gathers on the return line side and flows back into the coolant tank through the heat exchange radiator to complete the cooling cycle;

[0027] S3, temperature detection, when working, the real-time temperature of the coolant on the inlet side, the return side and the working component side is detected by the inlet temperature detection module, the return temperature detection module and the component temperature detection module respectively, and the temperature information is transmitted and fed back to the main control module, and correction parameters are provided for the pump body and the valve body according to the real-time temperature state detection, and the working parameters of the pump body and the valve body are dynamically adjusted according to the temperature parameters;

[0028] S4, flow detection, when working, the coolant flow at the outlet side of the infusion main pump and the inlet side of the heat dissipation partition are respectively monitored in real time through the total flow monitoring module and the sub-flow monitoring module, and the flow information is transmitted and fed back to the main control module. The actual coolant supply can be monitored and verified through real-time flow monitoring, and the working parameters of the pump body and the valve body can be dynamically adjusted according to the flow deviation;

[0029] S5, cooling control, when working, the real-time temperature in the system is detected according to the inlet temperature detection module, the return temperature detection module and the component temperature detection module, and the real-time supply flow of the coolant is monitored through the total flow monitoring module and the sub-flow monitoring module. By receiving the real-time temperature and flow data, the main control module is used to calculate and adjust the working parameters of the pump body and the valve body in real time to achieve dynamic and precise temperature control. The control steps are as follows:

[0030] Theoretical coolant flow calculation: According to the heat load of the etching machine and its auxiliary equipment and the thermal conductivity of the coolant, the theoretical required coolant flow is calculated. The specific formula is as follows:

[0031] Q=m·c·△T

[0032] Where Q is the theoretical heat load, m is the mass flow rate of the coolant, c is the specific heat capacity of the coolant, and ΔT is the temperature rise of the coolant;

[0033] Calculation of theoretical power of cooler: Calculate the theoretical power required by the cooler based on the flow rate and temperature rise of the coolant. The specific formula is as follows:

[0034] P=Q·NT

[0035] Among them, P is the theoretical cooler power, Q is the theoretical heat load, and NT is the efficiency of the cooler. The working flow range of the temperature zone is defined by calculating the theoretical power;

[0036] In actual work, the actual heat load is calculated according to the energy conservation equation. The specific formula is as follows:

[0037] Q1=m·c·(T in -T out )

[0038] Among them, Q1 is the working heat load, m is the mass flow rate of the coolant, c is the specific heat capacity of the coolant,

[0039] T in is the temperature of the coolant at the inlet side, T out is the temperature of the coolant on the return side;

[0040] Real-time temperature control calculation: Using PID control algorithm, adjust the speed of the coolant pump, the opening and closing degree of the valve body and the power of the heat exchanger according to the temperature deviation. The specific formula is as follows:

[0041]

[0042] Among them, u(t) is the control quantity, e(t) is the temperature deviation, K p is the proportionality coefficient, K i is the integration coefficient, K d The differential coefficient is used to dynamically adjust and control the working parameters of the pump body, valve body and heat exchanger through real-time feedback parameter analysis and calculation to achieve precise temperature control of the working parts.

[0043] S6, temperature control compensation, when working, when high-power cooling work is required due to work, due to excessive cooling of the coolant, some working parts exceed the minimum working temperature limit, the heat pipe flow control valve is opened, and external high-temperature gas is introduced through the heat circulation pipe. Through contact and conduction with the coolant pipe on the liquid inlet side, the low-temperature working parts can be compensated for overcooling, and the working parts are maintained within the limited working temperature range;

[0044] S7, working data recording, when working, the temperature monitoring data and the operating parameters of the cooling system are recorded through the local database, and then the data is transmitted to the cloud database through remote communication, and the cooling strategy is optimized through subsequent data analysis.

[0045] Compared with the prior art, the present invention adopts the above technical solution and has the following technical effects:

[0046] 1. This cooling system adopts a zoned cooling and temperature control method. The heat dissipation of the components is zoned according to the optimal working temperature of the working components in the etching machine, and each heat dissipation zone is independently supplied with liquid through multiple groups of infusion sub-pumps and cold flow control valves. The zoned heat dissipation control of the working components can be achieved through the control of the refrigerant flow, which can effectively improve the accuracy of the heat dissipation and temperature control of the equipment.

[0047] 2. Heat circulation pipes are provided at some parts of the heat dissipation partition. The heat circulation pipes are connected to the external hot air source through the heat pipe flow control valve, and are installed in contact with the liquid inlet pipe end of the heat exchange cooling module through the spiral heat exchange structure. When performing high-power heat dissipation work, the external heat source can increase the auxiliary heat compensation for the working parts with a higher low-temperature upper limit in the partition, so that each component in the partition is always at the optimal working temperature, which is conducive to improving the working stability of the equipment.

[0048] 3. A real-time dynamic cooling temperature control method is adopted. Temperature and real-time flow sensors are installed in the key pipelines in the cooling system. Through real-time temperature and flow detection, combined with the calculation and analysis of the master control module, the working parameters of the liquid pump, flow valve and heat exchanger can be adjusted to achieve dynamic adjustment of the cooling power. Combined with the zoned cooling temperature control structure, dynamic and precise cooling of the working parts can be achieved to ensure that the working parts in the equipment can maintain the best working state in different working stages. The working stability of the equipment can be further improved to improve the yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0050] Figure 1 It is a schematic diagram of the overall working process of the system working method of the present invention;

[0051] Figure 2 It is a schematic diagram of the structure of the system unit of the present invention;

[0052] Figure 3 It is a schematic diagram of the structure of the system modules of the present invention. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0055] Example

[0056] See also Figure 1-3The present invention provides a technical solution: a low-temperature cooling system for semiconductor etching machine auxiliary equipment, including a coolant storage unit, a liquid pump unit, a coolant distribution unit, a cooling unit, a heat exchange cooling unit, a temperature compensation unit, a work control unit, a temperature detection unit, a flow monitoring unit and a data recording unit, specifically:

[0057] The coolant storage unit is used for storing coolant to ensure sufficient supply of coolant. The coolant storage unit includes a coolant tank, which is used for storing and supplying coolant.

[0058] In order to achieve precise temperature control, the working parts in the etching machine are divided into multiple heat dissipation zones according to the temperature zones. The liquid pump unit is used for the supply and transportation of the coolant. The liquid pump unit includes an infusion main pump and an infusion sub-pump. The power of the infusion main pump is higher than that of the infusion sub-pump. The infusion main pump is connected and installed with the liquid outlet of the coolant tank, and is used for taking and transporting the coolant in the coolant tank. In order to achieve the diversion and transportation of the coolant, a diversion tube is provided at the liquid outlet of the infusion main pump, a buffer cavity is provided on the liquid inlet side of the diversion tube, and a plurality of diversion ducts are provided on the liquid outlet side of the diversion tube. The infusion sub-pump is provided with a plurality of, The liquid inlet end is connected and installed with the liquid outlet end of the liquid dispensing pipe, and several liquid infusion sub-pumps are connected and installed with the liquid inlet pipelines of the corresponding heat dissipation partitions, so that the coolant can be accurately and quantitatively delivered to each heat dissipation partition for the coolant supply control of the heat dissipation partition. The heat dissipation of the components is divided into zones according to the optimal working temperature of the working components in the etching machine, and each heat dissipation partition is independently supplied with liquid through multiple groups of liquid infusion sub-pumps and cold flow control valves. The zoned heat dissipation control of the working components can be realized through the control of the refrigerant flow, which can effectively improve the accuracy of the heat dissipation and cooling control of the equipment;

[0059] The coolant distribution unit is used for quantitative distribution and delivery of the coolant. The coolant distribution unit includes a liquid cooling flow control valve. The liquid cooling flow control valve is an electromagnetic flow valve. There are multiple liquid cooling flow control valves. Several liquid cooling flow control valves are connected and installed in the liquid inlet pipelines corresponding to the heat dissipation partitions respectively for controlling the coolant inlet flow of the heat dissipation partitions. The coolant can be dynamically supplied and controlled in cooperation with the infusion sub-pump according to the working conditions of the working parts.

[0060] The cooling unit is installed with the working part for heat dissipation and cooling of the working part. The cooling unit includes a heat exchange cooling module. The heat exchange cooling module is a conductive liquid cooling heat conduction structure. The heat exchange cooling module is installed in close contact with the working part to complete the heat dissipation and cooling of the working part through contact heat conduction. The temperature compensation unit is used for temperature control assistance of the working part. The temperature compensation unit includes a heat circulation pipe and a heat pipe flow control valve. Specifically, the heat circulation pipe is threaded and installed in contact with the liquid inlet pipeline end of the heat exchange cooling module. The heat pipe flow control valve is connected and installed on the air inlet side of the heat circulation pipe for air inlet on-off control of the heat pipe.

[0061] The heat exchange and cooling unit is used for cooling the coolant. The heat exchange and cooling unit includes a cooling fan and a heat exchange radiator. The heat exchange radiator is connected to the coolant return pipeline of the installation system for cooling the coolant. The cooling fan is installed on the heat radiating fin side of the heat exchange radiator to accelerate the heat dissipation of the heat exchange radiator. The heat dissipation power of the heat exchange radiator can be controlled by changing the speed of the cooling fan.

[0062] The working control unit is used for the overall operation control of the cooling system. The working control unit includes a master control module. The master control module is a high-performance processor used for the overall operation control of the system. The temperature detection unit is used for temperature detection at key positions in the system. The temperature detection unit includes an inlet temperature detection module, a reflux temperature detection module and a component temperature detection module. For details, see the attached Figure 3 As shown, the inlet temperature detection module, the reflux temperature detection module and the component temperature detection module are all temperature sensors. The inlet temperature detection module is connected and installed in the outlet pipeline of the infusion master pump for temperature detection on the cooling inlet side. The reflux temperature detection module is connected and installed in the reflux pipeline of the system for temperature detection on the cooling reflux side. The component temperature detection module is connected and installed with the working component for temperature detection at the working component.

[0063] The flow monitoring unit is used for real-time monitoring of the flow at key points in the pipeline. The flow monitoring unit includes a total flow monitoring module and a sub-flow monitoring module. Both the total flow monitoring module and the sub-flow monitoring module are flow detection sensors. The total flow monitoring module is installed in the outlet pipeline of the infusion master pump for flow monitoring on the cooling inlet side. The sub-flow monitoring modules are respectively installed in the inlet pipelines of multiple heat dissipation partitions for flow monitoring of the coolant entering the heat dissipation partitions. The inlet temperature detection module, the reflux temperature detection module, the component temperature detection module, the total flow monitoring module and the sub-flow monitoring module are all connected and installed with the signal receiving end of the master control module through communication wiring;

[0064] The data recording unit is used to record the data of the system operation. The data recording unit includes a local database and a cloud database. The local database and the cloud database are respectively set in the etching machine and the remote cloud. The local database and the cloud database are respectively used to store local working data and cloud working data and provide data support for the control of the master control module.

[0065] A control method for a low temperature cooling system of ancillary equipment of a semiconductor etching machine, the specific steps are as follows:

[0066] S1, system initialization, the initialization work is synchronized with the start of the etching machine, and the system self-check is performed before work to check whether the components of the cooling system are working properly and ensure that there is enough coolant in the coolant tank;

[0067] S2, cooling work, after completing the initialization self-test, the infusion master pump works to extract the coolant from the coolant tank and transport it to the cooling circuit. The coolant enters the buffer cavity in the dispensing tube and is transported to each heat dissipation partition through the infusion sub-pump. The coolant quantitatively flows into the heat exchange cooling module to complete the heat dissipation and cooling of the working parts through heat conduction. After that, the coolant gathers on the return line side and flows back into the coolant tank through the heat exchange radiator to complete the cooling cycle;

[0068] S3, temperature detection, when working, the real-time temperature of the coolant on the inlet side, the return side and the working component side is detected by the inlet temperature detection module, the return temperature detection module and the component temperature detection module respectively, and the temperature information is transmitted and fed back to the main control module, and correction parameters are provided for the pump body and the valve body according to the real-time temperature state detection, and the working parameters of the pump body and the valve body are dynamically adjusted according to the temperature parameters;

[0069] S4, flow detection, when working, the coolant flow at the outlet side of the infusion main pump and the inlet side of the heat dissipation partition are respectively monitored in real time through the total flow monitoring module and the sub-flow monitoring module, and the flow information is transmitted and fed back to the main control module. The actual coolant supply can be monitored and verified through real-time flow monitoring, and the working parameters of the pump body and the valve body can be dynamically adjusted according to the flow deviation;

[0070] S5, cooling control, when working, the real-time temperature in the system is detected according to the inlet temperature detection module, the return temperature detection module and the component temperature detection module, and the real-time supply flow of the coolant is monitored through the total flow monitoring module and the sub-flow monitoring module. By receiving the real-time temperature and flow data, the main control module is used to calculate and adjust the working parameters of the pump body and the valve body in real time to achieve dynamic and precise temperature control. The control steps are as follows:

[0071] Theoretical coolant flow calculation: According to the heat load of the etching machine and its auxiliary equipment and the thermal conductivity of the coolant, the theoretical required coolant flow is calculated. The specific formula is as follows:

[0072] Q=m·c·ΔT

[0073] Where Q is the theoretical heat load, m is the mass flow rate of the coolant, c is the specific heat capacity of the coolant, and ΔT is the temperature rise of the coolant;

[0074] Calculation of theoretical power of cooler: Calculate the theoretical power required by the cooler based on the flow rate and temperature rise of the coolant. The specific formula is as follows:

[0075] P=Q·NT

[0076] Among them, P is the theoretical cooler power, Q is the theoretical heat load, and NT is the efficiency of the cooler. The working flow range of the temperature zone is defined by calculating the theoretical power;

[0077] In actual work, the actual heat load is calculated according to the energy conservation equation. The specific formula is as follows:

[0078] Q1=m·c·(T in -T out )

[0079] Among them, Q1 is the working heat load, m is the mass flow rate of the coolant, c is the specific heat capacity of the coolant,

[0080] T in is the temperature of the coolant at the inlet side, T out is the temperature of the coolant on the return side;

[0081] Real-time temperature control calculation: Using PID control algorithm, adjust the speed of the coolant pump, the opening and closing degree of the valve body and the power of the heat exchanger according to the temperature deviation. The specific formula is as follows:

[0082]

[0083] Among them, u(t) is the control quantity, e(t) is the temperature deviation, K p is the proportionality coefficient, K i is the integration coefficient, K d It is a differential coefficient. Through real-time feedback parameters, analysis and calculation, real-time temperature and flow detection, and calculation and analysis of the master control module, the working parameters of the liquid pump, flow valve and heat exchanger can be adjusted to achieve dynamic adjustment of cooling power. With the partitioned cooling temperature control structure, dynamic and accurate cooling of working parts can be achieved to ensure that the working parts in the equipment can maintain the best working state in different working stages.

[0084] S6, temperature control compensation. When working, when high-power cooling is required, and some working parts exceed the minimum working temperature limit due to excessive cooling of the coolant, the heat pipe flow control valve is opened, and external high-temperature gas is introduced through the heat circulation pipe. Through contact and conduction with the coolant pipe on the liquid inlet side, the low-temperature working parts can be compensated for overcooling, and the working parts are maintained in the limited working temperature range. When performing high-power heat dissipation work, the external heat source can be used to increase the auxiliary heat compensation for the working parts with higher low-temperature upper limits in the partition, so that each component in the partition is always at the optimal working temperature, which is conducive to improving the working stability of the equipment;

[0085] S7, working data recording, when working, the temperature monitoring data and the operating parameters of the cooling system are recorded through the local database, and then the data is transmitted to the cloud database through remote communication, and the cooling strategy is optimized through subsequent data analysis.

[0086] In summary, the cooling and temperature reduction system adopts a zoned cooling and temperature control method, and sets the heat dissipation of the components according to the optimal working temperature of the working components in the etching machine, and independently supplies liquid to each heat dissipation partition through multiple groups of infusion sub-pumps and cold flow control valves. The zoned heat dissipation control of the working components can be achieved through refrigerant liquid flow control, which can effectively improve the accuracy of the heat dissipation and temperature reduction control of the equipment, and heat circulation pipes are arranged at some components in the heat dissipation partition. The heat circulation pipes are connected to the external hot air source through the heat pipe flow control valve, and are installed in contact with the liquid inlet pipeline end of the heat exchange cooling module through a spiral heat exchange structure. When performing high-power heat dissipation work, the low temperature upper limit in the partition can be relatively high through the external heat source. The high working parts improve the auxiliary heat compensation, so that each component in the partition is always at the best working temperature, which is beneficial to the improvement of the working stability of the equipment. The real-time dynamic cooling temperature control method is adopted. Temperature and real-time flow sensors are installed in the key pipelines in the cooling system. Through real-time temperature and flow detection, combined with the calculation and analysis of the main control module, the working parameters of the liquid pump, flow valve and heat exchange radiator can be adjusted to achieve dynamic adjustment of the cooling power. With the partitioned cooling temperature control structure, dynamic and accurate cooling of the working parts can be achieved to ensure that the working parts in the equipment can maintain the best working state in different working stages, which can further improve the working stability of the equipment and improve the yield of the product.

[0087] It will be appreciated by those skilled in the art that the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.

Claims

1. A low temperature cooling system for semiconductor etching machine auxiliary equipment, including a coolant storage unit, a liquid pump unit, a coolant distribution unit, a cooling unit, a heat exchange cooling unit, a temperature compensation unit, a work control unit, a temperature detection unit, a flow monitoring unit and a data recording unit, characterized in that: The coolant storage unit is used for storing coolant to ensure sufficient supply of coolant, and the coolant storage unit includes a coolant tank; The liquid pump unit is used for supplying and delivering the cooling liquid, and the liquid pump unit comprises an infusion master pump and an infusion branch pump; The coolant distribution unit is used for quantitative distribution and delivery of the coolant, and the coolant distribution unit includes a liquid cooling flow control valve; The cooling unit is installed with the working component to dissipate heat and cool the working component, and the cooling unit includes a heat exchange cooling module; The heat exchange and cooling unit is used for heat dissipation and cooling of the coolant, and the heat exchange and cooling unit includes a cooling fan and a heat exchange radiator; The temperature compensation unit is used to assist the temperature control of the working parts, and the temperature compensation unit includes a heat circulation pipe and a heat pipe flow control valve; The working control unit is used for overall operation control of the cooling system, and the working control unit includes a master control module; The temperature detection unit is used for temperature detection at key positions in the system, and includes a liquid inlet temperature detection module, a reflux temperature detection module and a component temperature detection module; The flow monitoring unit is used for real-time monitoring of flow at key points in the pipeline, and the flow monitoring unit includes a total flow monitoring module and a sub-flow monitoring module; The data recording unit is used for recording data of system operation, and the data recording unit includes a local database and a cloud database.

2. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 1 is characterized in that: The main infusion pump is installed in communication with the liquid outlet of the cooling liquid tank. The liquid outlet of the main infusion pump is provided with a liquid distribution tube. There are multiple infusion sub-pumps. The liquid inlet end of the infusion sub-pump is installed in communication with the liquid outlet end of the liquid distribution tube.

3. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 2 is characterized in that: The working parts in the etching machine are divided into a plurality of heat dissipation zones according to the temperature zones, and a plurality of the infusion sub-pumps are respectively connected to the liquid inlet pipelines corresponding to the heat dissipation zones and installed for controlling the coolant supply of the heat dissipation zones.

4. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 3 is characterized in that: There are multiple liquid cooling flow control valves, and several of the liquid cooling flow control valves are respectively connected and installed in the liquid inlet pipelines corresponding to the heat dissipation partitions for controlling the coolant inlet flow of the heat dissipation partitions.

5. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 4 is characterized in that: The heat exchange cooling module is a conductive liquid cooling heat conduction structure. The heat exchange cooling module is installed in close contact with the working component to complete the heat dissipation and cooling of the working component through contact heat conduction. The heat circulation pipe is threaded and installed in contact with the liquid inlet pipeline end of the heat exchange cooling module. The heat pipe flow control valve is connected and installed on the air intake side of the heat circulation pipe for air intake on-off control of the heat pipe.

6. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 5, characterized in that: The heat exchange radiator is connected to the coolant return pipeline of the installation system for heat dissipation and cooling of the coolant. The cooling fan is installed on the heat dissipation fin side of the heat exchange radiator to accelerate the heat dissipation of the heat exchange radiator. The master control module is a high-performance processor for overall work control of the system.

7. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 6, characterized in that: The inlet temperature detection module, the reflux temperature detection module and the component temperature detection module are all temperature sensors. The inlet temperature detection module is connected and installed in the outlet pipeline of the main infusion pump for temperature detection of the cooling inlet side. The reflux temperature detection module is connected and installed in the reflux pipeline of the system for temperature detection of the cooling reflux side. The component temperature detection module is connected and installed with the working component for temperature detection at the working component.

8. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 6, characterized in that: The total flow monitoring module and the sub-flow monitoring module are both flow detection sensors. The total flow monitoring module is installed in the liquid outlet pipeline of the main infusion pump for flow monitoring on the cooling liquid inlet side. The sub-flow monitoring modules are respectively installed in the liquid inlet pipelines of multiple heat dissipation partitions for flow monitoring of the coolant entering the heat dissipation partitions. The inlet temperature detection module, reflux temperature detection module, component temperature detection module, total flow monitoring module and sub-flow monitoring module are all installed in connection with the signal receiving end of the main control module through communication wiring.

9. The low temperature cooling system for semiconductor etching machine auxiliary equipment according to claim 8, characterized in that: The local database and the cloud database are respectively arranged in the etching machine and in the remote cloud, and are respectively used for storing local working data and cloud working data and providing data support for the control of the master control module.

10. The control method for a low temperature cooling system for semiconductor etching machine auxiliary equipment according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, system initialization, the initialization work is synchronized with the start-up of the etching machine, and the system self-check is performed before work to check whether the components of the cooling system are working properly and ensure that there is enough coolant in the coolant tank; S2, cooling work, after completing the initialization self-test, the infusion master pump works to extract the coolant from the coolant tank and transport it to the cooling circuit. The coolant enters the buffer cavity in the dispensing tube and is transported to each heat dissipation partition through the infusion sub-pump. The coolant quantitatively flows into the heat exchange cooling module to complete the heat dissipation and cooling of the working parts through heat conduction. After that, the coolant gathers on the return line side and flows back into the coolant tank through the heat exchange radiator to complete the cooling cycle; S3, temperature detection, when working, the real-time temperature of the coolant on the inlet side, the return side and the working component side is detected by the inlet temperature detection module, the return temperature detection module and the component temperature detection module respectively, and the temperature information is transmitted and fed back to the main control module, and correction parameters are provided for the pump body and the valve body according to the real-time temperature state detection, and the working parameters of the pump body and the valve body are dynamically adjusted according to the temperature parameters; S4, flow detection, when working, the coolant flow at the outlet side of the infusion main pump and the inlet side of the heat dissipation partition are respectively monitored in real time through the total flow monitoring module and the sub-flow monitoring module, and the flow information is transmitted and fed back to the main control module. The actual coolant supply can be monitored and verified through real-time flow monitoring, and the working parameters of the pump body and the valve body can be dynamically adjusted according to the flow deviation; S5, cooling control, when working, the real-time temperature in the system is detected according to the inlet temperature detection module, the return temperature detection module and the component temperature detection module, and the real-time supply flow of the coolant is monitored through the total flow monitoring module and the sub-flow monitoring module. By receiving the real-time temperature and flow data, the main control module is used to calculate and adjust the working parameters of the pump body and the valve body in real time to achieve dynamic and precise temperature control. The control steps are as follows: Theoretical coolant flow calculation: According to the heat load of the etching machine and its ancillary equipment and the thermal conductivity of the coolant, the theoretical required coolant flow is calculated. The specific formula is as follows: Q=m·c·△T Where Q is the theoretical heat load, m is the mass flow rate of the coolant, c is the specific heat capacity of the coolant, and ΔT is the temperature rise of the coolant; Calculation of theoretical power of cooler: Calculate the theoretical power required by the cooler based on the flow rate and temperature rise of the coolant. The specific formula is as follows: P=Q·NT Among them, P is the theoretical cooler power, Q is the theoretical heat load, and NT is the efficiency of the cooler. The working flow range of the temperature zone is defined by calculating the theoretical power; In actual work, the actual heat load is calculated according to the energy conservation equation. The specific formula is as follows: Q1=m·c·(T in -T out ) Among them, Q1 is the working heat load, m is the mass flow rate of the coolant, c is the specific heat capacity of the coolant, T in is the temperature of the coolant at the inlet side, T out is the temperature of the coolant on the return side; Real-time temperature control calculation: Using PID control algorithm, adjust the speed of the coolant pump, the opening and closing degree of the valve body and the power of the heat exchanger according to the temperature deviation. The specific formula is as follows: Among them, u(t) is the control quantity, e(t) is the temperature deviation, K p is the proportionality coefficient, K i is the integration coefficient, K d The differential coefficient is used to dynamically adjust and control the working parameters of the pump body, valve body and heat exchanger through real-time feedback parameter analysis and calculation to achieve precise temperature control of the working parts. S6, temperature control compensation, when working, when high-power cooling work is required due to work, due to excessive cooling of the coolant, some working parts exceed the minimum working temperature limit, the heat pipe flow control valve is opened, and external high-temperature gas is introduced through the heat circulation pipe. Through contact and conduction with the coolant pipe on the liquid inlet side, the low-temperature working parts can be compensated for overcooling, and the working parts are maintained within the limited working temperature range; S7, working data recording, when working, the temperature monitoring data and the operating parameters of the cooling system are recorded through the local database, and then the data is transmitted to the cloud database through remote communication, and the cooling strategy is optimized through subsequent data analysis.

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