Test sorting machine and chip test sorting method

Abstract

This invention discloses a test sorting machine and a chip test sorting method using the test sorting machine. The test sorting machine includes a worktable, a conveyor tray, a test holder, a moving mechanism, a picking mechanism, and an amplification mechanism. Two conveyor trays are provided, and the conveyor trays can reciprocate along a first direction on the worktable. The test holder is located on the worktable at one end of the conveyor tray's moving path. The moving mechanism is horizontally positioned above the conveyor tray and can reciprocate along the first direction. The picking mechanism is slidably mounted on the moving mechanism and reciprocates along a second direction. The picking mechanism is used to transport chips from the conveyor tray to the test holder, or to transport chips from the test holder to the conveyor tray. The amplification mechanism is slidably mounted on the worktable and is used to photograph the chips located on the test holder. Multiple test holders are provided and arranged along the second direction. This fully automated chip loading and unloading process improves efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip testing equipment technology, and in particular to a test sorting machine and a chip test sorting method. Background Technology

[0002] A test sorting machine is a device used to test memory chips. For example, a spectral testing and screening device for semiconductor light-emitting chip components, as disclosed in CN217425587U, includes a base plate and three-dimensional fine-tuning frames I, II, Probe I, II, a temperature control module, a three-dimensional fine-tuning frame III, and a light receiver, all mounted on top of the base plate. The temperature control module includes a housing mounted on top of the base plate and a semiconductor cooler welded to the bottom inner side of the housing. A gold-plated metal heat sink is welded to the top of the semiconductor cooler. A groove is formed on the top of the gold-plated metal heat sink, which holds the semiconductor light-emitting chip component, with the light-emitting direction of the chip component facing the light receiver. A transition block and a thermistor are also welded to the top of the gold-plated metal heat sink. Most of these machines only have measuring components, and manual loading and unloading are still required, resulting in low automation and low chip sorting efficiency. Furthermore, during the chip testing and sorting process, it is impossible to control the chips to be tested under specific conditions, such as selecting specific temperatures. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a test sorting machine that can improve the sorting efficiency of chips.

[0004] The present invention also proposes a chip testing and sorting method having the above-mentioned testing and sorting machine.

[0005] According to a first aspect of the present invention, a test sorting machine includes a worktable, a conveyor tray, a test holder, a moving mechanism, a picking mechanism, and an amplification mechanism. Two conveyor trays are provided, and the conveyor trays are reciprocating on the worktable along a first direction. The test holder is disposed on the worktable at one end of the moving path of the conveyor trays. The moving mechanism is horizontally disposed above the conveyor trays and is reciprocating along the first direction. The picking mechanism is slidably disposed on the moving mechanism and is reciprocating along a second direction. The picking mechanism is used to transport chips from the conveyor trays to the test holders, or to transport chips from the test holders to the conveyor trays. The amplification mechanism is slidably disposed on the worktable and is used to photograph pin cards located on the test holders. The amplification mechanism is reciprocating along the second direction. Multiple test holders are provided and arranged along the second direction.

[0006] The test sorting machine according to embodiments of the present invention has at least the following beneficial effects: fully automated loading and unloading of chips, improving efficiency.

[0007] According to some embodiments of the present invention, the test socket includes a machine platform, a lifting seat, a test mounting seat, a heat homogenizing module, and a PCB fine-tuning mechanism. The machine platform is fixed on the workbench; the lifting seat is installed on the machine platform and can move up and down in the machine platform; the test mounting seat is arranged on the surface of the lifting seat, and a test station is arranged on the surface of the test mounting seat; the heat homogenizing module is built in the test mounting seat, and the heat homogenizing module is used to adjust the surface temperature of the test mounting seat; the PCB fine-tuning mechanism includes a rotating seat and an L-shaped support arm. One end of the L-shaped support arm is pivotally installed in the rotating seat, and the other end is detachably connected with a pin card. The L-shaped support arm is provided with a shooting through hole, and the shooting through hole and the observation port of the pin card are arranged corresponding to each other. Among them, the L-shaped support arm can rotate so that the shooting through hole and the test station are arranged corresponding to each other; among them, along the arrangement direction of the plurality of test mounting seats, the temperatures of the plurality of test stations increase or decrease equally.

[0008] According to some embodiments of the present invention, the heat homogenizing module includes a heat homogenizing cavity and turbulence blades. A rotating shaft is built in the heat homogenizing cavity, and the rotating shaft can pivot in the heat homogenizing cavity. A heating wire is built in the heat homogenizing cavity; there are a plurality of turbulence blades, and the plurality of turbulence blades are arranged around the side wall of the rotating shaft, and the plurality of turbulence blades are inclined in the same direction.

[0009] According to some embodiments of the present invention, a lifting cylinder is connected to the bottom surface of the machine platform, and the driving shaft of the lifting cylinder and the bottom of the lifting seat are arranged corresponding to each other. The lifting cylinder can abut against the lifting seat to drive the lifting seat to rise.

[0010] According to some embodiments of the present invention, the machine platform is provided with a vertical track, and the lifting seat is slidably connected with the vertical track.

[0011] According to some embodiments of the present invention, the workbench is provided with two groups of first guide rails, and two conveying trays are respectively slidably connected to the two groups of first guide rails. A plurality of trays are arranged in a matrix on the conveying tray, and a plurality of placement grooves for placing chips are arranged on the surface of the tray.

[0012] According to some embodiments of the present invention, the moving mechanism is in a shape of "冖", and two second guide rails are arranged on both sides of the workbench. Both sides of the moving mechanism are respectively slidably connected with the two second guide rails so that the moving mechanism can reciprocate along the second guide rails.

[0013] According to some embodiments of the present invention, the material handling mechanism includes a sliding seat and an adsorption mechanism. The sliding seat and the upper beam of the moving mechanism are slidably connected. The adsorption mechanism is slidably connected to the surface of the sliding seat. The adsorption mechanism can move up and down to pick up or put down the chip on the test seat or the conveyor tray.

[0014] According to some embodiments of the present invention, the amplification mechanism includes a vertical rod, a third guide rail, an amplifier, and a display screen. The third guide rail is disposed on the worktable along a second direction. One end of the vertical rod is slidably connected to the third guide rail, and the other end is fixedly connected to the display screen. The amplifier is slidably connected to the vertical rod, and the shooting direction of the amplifier faces the test base. The amplifier and the display screen are electrically connected to transmit the captured image to the display screen.

[0015] A chip testing and sorting method according to a second aspect of the present invention, used to control a testing and sorting machine according to a first aspect of the present invention, includes the following steps:

[0016] Step 1: Place the chip on one of the transport trays, and the transport tray will transport the chip to the end closest to the test socket;

[0017] Step 2: Move the picking mechanism to the corresponding position, and the picking mechanism will take the chip out from the conveyor tray;

[0018] Step 3: The moving mechanism moves in the first direction to move the picking mechanism to the corresponding test socket position, and the picking mechanism places the chip to be tested into the test socket;

[0019] Step 4: The imaging unit takes a picture of the chip to be tested, and the magnification mechanism magnifies and samples the chip and pin card on the test socket;

[0020] Step 5: Use the pick-and-place mechanism to remove the tested chip from the test socket;

[0021] Step 6: The picking mechanism moves along the second direction on the moving mechanism to make the position of the picking mechanism correspond to that of another conveyor tray, and the moving mechanism moves in the first direction to enable the picking mechanism to place the chip on the conveyor tray;

[0022] Repeat steps 1 through 6.

[0023] The chip testing and sorting method according to embodiments of the present invention has at least the following beneficial effects: fully automated chip loading and unloading, improving efficiency.

[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 This is a three-dimensional schematic diagram of the test sorting machine according to an embodiment of the present invention;

[0027] Figure 2 This is a top view schematic diagram of the test sorting machine according to an embodiment of the present invention;

[0028] Figure 3 This is a flowchart of a chip testing and sorting method according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the test stand of the test sorting machine according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the uniform heating module of the test sorting machine according to an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the rotating shaft and baffle blades of the test sorting machine according to an embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of the worktable, conveyor tray, moving mechanism, and material handling mechanism of the test sorting machine according to an embodiment of the present invention from one angle.

[0033] Figure 8 This is a schematic diagram of the worktable, conveyor tray, moving mechanism, and material handling mechanism of the test sorting machine according to an embodiment of the present invention from another angle;

[0034] Figure 9 This is a schematic diagram of the conveyor tray of the test sorting machine according to an embodiment of the present invention;

[0035] Figure 10 This is a flowchart of chip testing and sorting according to another embodiment of the present invention;

[0036] Figure 11 This is a schematic diagram of the amplification mechanism of the test sorting machine according to an embodiment of the present invention.

[0037] 100. Worktable; 110. First guide rail; 120. Second guide rail;

[0038] 200. Conveyor tray; 210. Pallet; 211. Placement trough;

[0039] 300. Test stand; 310. Machine base; 311. Lifting cylinder; 320. Lifting seat; 330. Test mounting base; 331. Test station; 3311. Temperature sensor; 340. Heat equalization module; 341. Heat equalization cavity; 3411. Heat insulation cavity; 3412. Rotary bearing; 3413. Heating wire; 342. Rotating shaft; 343. Baffle blade; 350. PCB fine-tuning mechanism; 351. Rotating seat; 352. L-shaped support arm; 3521. Pin holder; 3522. Imaging through hole; 360. Vertical track;

[0040] 400. Moving mechanism;

[0041] 500. Material handling mechanism; 510. Sliding seat; 520. Adsorption mechanism; 530. Barcode scanner; 540. Camera mechanism

[0042] 600. Amplifying mechanism; 610. Vertical rod; 620. Third guide rail; 630. Amplifier; 640. Display screen; Detailed Implementation

[0043] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0044] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0045] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0046] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0047] Reference Figure 1 and Figure 2The testing and sorting machine of this invention includes a worktable 100, a conveyor plate 200, a testing seat 300, a moving mechanism 400, a material handling mechanism 500, and an amplification mechanism 600. Two conveyor plates 200 are provided, and each conveyor plate 200 can reciprocate along a first direction on the worktable 100. The testing seat 300 is disposed on the worktable 100 and is located at one end of the moving path of the conveyor plate 200. The moving mechanism 400 is horizontally disposed above the conveyor plate 200, and the moving mechanism 400 can reciprocate along the first direction (…). Figure 7 The material handling mechanism 500 is slidably mounted on the moving mechanism 400. The material handling mechanism 500 reciprocates along the second direction. The material handling mechanism 500 is used to transport chips from the conveyor tray 200 to the test socket 300, or to transport chips from the test socket 300 to the conveyor tray 200. The amplification mechanism 600 is slidably mounted on the worktable 100. The amplification mechanism 600 is used to amplify the pins located in the test socket 300. The amplification mechanism 600 can reciprocate along the second direction (B direction). Figure 7 The test fixture 300 moves back and forth in the direction A. Multiple test fixtures 300 are provided and arranged along the second direction, with the first and second directions perpendicular to each other.

[0048] In this test sorting machine, two conveyor trays 200 are used to place the chip to be tested and the chip that has already been tested, respectively. The movement between the two conveyor trays 200 is relatively independent, that is, the movement of one conveyor tray 200 will not affect the movement of the other conveyor tray 200. The chip to be tested and the chip that has already been tested can be transported in different directions. Furthermore, multiple chips can be placed on the conveyor tray 200. Therefore, different chips are in different positions on the conveyor tray 200. At this time, the moving mechanism 400 can be used in conjunction with the picking mechanism 500 along the second direction to cooperate with the chips in different positions and pick up (from the conveyor tray 200) or put (onto the conveyor tray 200) the chips. On the other hand, in this solution, the picking mechanism 500 can also cooperate with the test holder 300 to pick up the tested chips. Therefore, in summary, the chip loading and unloading is fully automated, improving efficiency.

[0049] Specifically, refer to Figure 3 The test sorting machine in the above scheme is controlled by a chip test sorting method, which specifically includes the following steps:

[0050] Step 1: Place the chip on one of the transport trays 200, and the transport tray 200 transports the chip to one end near the test socket 300;

[0051] Step 2: Move the picking mechanism 500 to the corresponding position, and the picking mechanism 500 will take the chip out from the conveyor tray 200;

[0052] Step 3: The moving mechanism 400 moves in the first direction to move the picking mechanism 500 to the corresponding test socket 300 position, and the picking mechanism 500 places the chip to be tested into the test socket 300.

[0053] Step 4: The imaging mechanism 540 takes a picture of the chip to be tested, and the magnification mechanism 600 magnifies and samples the chip and pin card on the test socket 300.

[0054] Step 5: Use the pick-up mechanism 500 to remove the tested chip from the test socket 300;

[0055] Step 6: The picking mechanism 500 moves along the second direction on the moving mechanism 400 so that the picking mechanism 500 and another conveyor 200 are in the same position. The moving mechanism 400 moves in the first direction so that the picking mechanism 500 can place the chip on the conveyor 200.

[0056] Repeat steps 1 through 6.

[0057] In some implementations, the test socket 300 is used to place the chip under test (DUT) and for inspectors to test the chip. Different chips typically require different test conditions, including the different temperature conditions required by the chip. Figures 4 to 6 The test stand 300 includes a machine base 310, a lifting seat 320, a test mounting base 330, a heat equalization module 340, and a PCB fine-tuning mechanism 350. The machine base 310 is fixed on the workbench 100; the lifting seat 320 is mounted on the machine base 310 and can move up and down within the machine base 310 (along the...). Figure 4 (D direction); Test mounting base 330 is set on the surface of lifting base 320, and test station 331 is set on the surface of test mounting base 330; Heat equalization module 340 is built into test mounting base 330, and heat equalization module 340 is used to adjust the surface temperature of test mounting base 330; PCB fine adjustment mechanism 350 includes rotating base 351 and L-shaped support arm 352, one end of L-shaped support arm 352 is pivotally mounted in rotating base 351, and the other end is detachably connected to pin clip 3521. L-shaped support arm 352 is provided with imaging through hole 3522, and the imaging through hole 3522 and the observation port of pin clip 3521 are correspondingly set. The L-shaped support arm 352 can rotate so that the imaging through hole 3522 and the test station 331 are correspondingly set. Along the arrangement direction of multiple test mounting bases 330, the temperature of multiple test stations 331 increases or decreases by an equal amount.

[0058] In the actual testing process, chips have different standards under different temperature tests. Therefore, the material handling mechanism 500 can be driven to move on the moving mechanism 400 and matched with the test sockets 300 at different positions (different temperatures) to place the chip under test into the test socket 300 at the appropriate temperature for comprehensive testing. It should be emphasized that the heat equalization mechanism in the test socket 300 can evenly heat the surface of the test station 331, so that the chip on the test station 331 can get the most suitable test conditions. In addition, the pin card 3521 installed on the L-shaped support arm 352 is used to cooperate with the lifting seat 320 to provide convenience for the testers. By raising the lifting seat 320, in conjunction with the observation port and imaging through hole 3522 of the pin card 3521, the magnification mechanism 600 can easily magnify the surface of the chip and the pin card, so as to facilitate the testers to test and adjust.

[0059] Specifically, refer to Figure 5 The heat equalization module 340 includes a heat equalization cavity 341 and baffles 343. The heat equalization cavity 341 has a built-in rotating shaft 342, which can pivot within the heat equalization cavity 341. The heat equalization cavity 341 has a built-in heating wire 3413. Multiple baffles 343 are arranged around the sidewall of the rotating shaft 342, as shown in the figure. Figure 6 Multiple spoiler blades 343 are oriented in the same direction ( Figure 6 The rotation axis 342 rotates around the C direction (in the opposite direction of the C direction).

[0060] The rotating shaft 342 is driven to rotate (rotate around C) by an external drive device, causing it to pivot inside the uniform heating chamber 341. During the pivoting process, the rotating shaft 342 will drive the turbulence blades 343 to swing. Multiple turbulence blades 343 with the same tilt direction will cause the heated gas (which can be air or other inert gas) to flow continuously, so that the internal gas will circulate continuously, making the temperature of each position in the uniform heating chamber 341 tend to be uniform, thereby making the temperature of the test station 331 more uniform.

[0061] Furthermore, referring to Figure 5Insulation chambers 3411 are provided on both sides of the uniform heating chamber 341 to prevent heat transfer to the outside of the entire test mounting base 330. The two ends of the rotating shaft 342 pass through the insulation chambers 3411 on both sides. Rotary bearings 3412 are installed in the insulation chambers 3411, and the rotating bearings 3412 and the rotating shaft 342 are driven together to improve the support of the drive shaft, prevent the rotating shaft 342 from deforming due to high temperature, and improve the rotational stability of the rotating shaft 342. This drive device can be a micro motor, built into one of the insulation chambers 3411. It is important to emphasize that the uniform heating chamber 341 and the rotating shaft 342 need to be sealed to prevent heated gas from entering the insulation chamber 3411.

[0062] In the above technical solution, refer to Figure 5 A temperature sensor 3311 is also provided at the test station 331. The temperature sensor 3311 is electrically connected to the heating wire 3413 mentioned above and is used to adjust the heating power of the heating wire 3413. When the temperature of the test station 331 is higher than the set value, the heating power of the heating wire 3413 is reduced. When the temperature of the test station 331 is lower than the set value, the heating power of the heating wire 3413 is increased.

[0063] Specifically, the test sorting method in the above scheme includes the following steps:

[0064] Step 1: Place the chip on one of the transport trays 200, and the transport tray 200 transports the chip to one end near the test socket 300;

[0065] Step 2: Move the picking mechanism 500 to the corresponding position, and the picking mechanism 500 will take the chip out from the conveyor tray 200;

[0066] Step 3: The moving mechanism 400 moves in the first direction to move the picking mechanism 500 to the test socket 300 position that matches the test conditions, and the picking mechanism 500 places the chip to be tested into the test socket 300.

[0067] Step 4: The imaging mechanism 540 takes a picture of the chip to be tested, and the magnification mechanism 600 magnifies and samples the chip and pin card on the test socket 300.

[0068] Step 5: Use the pick-up mechanism 500 to remove the tested chip from the test socket 300;

[0069] Step 6: The picking mechanism 500 moves along the second direction on the moving mechanism 400 so that the picking mechanism 500 and another conveyor 200 are in the same position. The moving mechanism 400 moves in the first direction so that the picking mechanism 500 can place the chip on the conveyor 200.

[0070] Repeat steps 1 to step 6.

[0071] In some embodiments, referring to Figure 4 , a lifting cylinder 311 is connected to the bottom surface of the machine platform 310. The driving shaft of the lifting cylinder 311 and the bottom of the lifting seat 320 are correspondingly arranged. The lifting cylinder 311 can abut against the lifting seat 320 to drive the lifting seat 320 to rise. By driving the lifting seat 320 to rise through the lifting cylinder 311, the chip can be close to the needle card 3521, and it is convenient for the magnifying mechanism 600 to take a sample by shooting. Among them, in order to restrict the lifting trajectory of the lifting seat 320, the machine platform 310 is provided with a vertical track 360, and the lifting seat 320 is slidably connected to the vertical track 360. So that the lifting seat 320 can stably move up and down along the vertical track 360.

[0072] In some embodiments, referring to Figure 7 , the moving mechanism 400 is in the shape of "冖". Two second guide rails 120 are provided on both sides of the workbench 100. The two sides of the moving mechanism 400 are respectively slidably connected to the two second guide rails 120, so that the moving mechanism 400 can reciprocally move along the second guide rails 120.

[0073] It should be mentioned that, referring to Figure 7 and Figure 8 , the workbench 100 is provided with two groups of first guide rails 110. Two conveying trays 200 are respectively slidably connected to the two groups of first guide rails 110. Among them, referring to Figure 9 , a plurality of trays 210 are arranged in a matrix on the conveying tray 200. A plurality of placement grooves 211 for placing chips are provided on the surface of the tray 210. Specifically, each group of first guide rails 110 has two and is arranged in parallel. Each conveying tray 200 slides on different first guide rails 110 without interference. One is used to convey the chips to be tested, and the other is used to convey the tested chips. Among them, the trays 210 on the conveying tray 200 are detachable. Through the detachable trays 210, it is convenient for the user to place the chips on the trays 210.

[0074] Furthermore, there is a central processing module in the entire test and sorting machine. Each tray 210 is provided with independent two-dimensional codes. The central processing module is built-in with a plurality of input modules. Each input module corresponds to each two-dimensional code one by one. The material taking mechanism 500 is provided with a code scanner 530. The code scanner 530 is used to scan the two-dimensional code on the tray 210 to obtain the data in the two-dimensional code. Among them, the data in the two-dimensional code comes from the input module. The central processing module can control the actions of the conveying tray 200, the moving mechanism 400 and the material taking mechanism 500; among them, referring to Figure 8 , the code scanner 530 and the shooting mechanism 540 are integrated into one part.

[0075] Specifically, referring to Figure 10In the above scheme, the conveyor discs 200 are the feeding conveyor disc 200 and the unloading conveyor disc 200. The testing and sorting method of this scheme includes the following steps:

[0076] Step 1: Place multiple chips under the same test conditions on tray 210 of the feeding conveyor 200;

[0077] Step 2: Enter the test conditions of the corresponding chip into the central processing module and match the test conditions with the corresponding QR code;

[0078] Step 3: Move the picking mechanism 500 to the corresponding position, and the picking mechanism 500 will take the chip out from the conveyor tray 200. At the same time, use the barcode scanner 530 to scan the QR code on the corresponding tray 210 to obtain the test conditions of this series of chips.

[0079] Step 4: The central processing module calculates the movement path and moves the chip to the corresponding test socket 300 by moving the moving mechanism 400 in the first direction and moving the picking mechanism 500 in the second direction.

[0080] Step 5: The chip is placed into the corresponding test socket 300 by the material handling mechanism 500;

[0081] Step 6: The imaging mechanism 540 takes a picture of the chip to be tested, and the magnification mechanism 600 magnifies and samples the chip and pin card on the test socket 300.

[0082] Step 7: Use the pick-up mechanism 500 to remove the tested chip from the test socket 300;

[0083] Step 8: Use the picking mechanism 500 to transport the tested chip onto the tray 210 of the unloading conveyor 200;

[0084] Repeat steps 1 through 8.

[0085] It is worth mentioning that, referring to Figure 8 The picking mechanism 500 includes a sliding seat 510 and an adsorption mechanism 520. The sliding seat 510 is slidably connected to the upper beam of the moving mechanism 400. The adsorption mechanism 520 is slidably connected to the surface of the sliding seat 510 and can move up and down to pick up or drop chips on the test seat 300 or the conveyor tray 200. Specifically, when the picking mechanism 500 performs the picking action, the picking mechanism 500 moves above the corresponding tray 210, and the adsorption mechanism 520 descends to adhere to the surface of the chip. Specifically, the adsorption mechanism 520 can be a suction cup, which uses the vacuum adsorption force of the suction cup to lift the chip. The sliding seat 510 is provided with a corresponding sliding track, and the entire adsorption mechanism 520 is slidably connected to the sliding track. The aforementioned barcode scanner 530 is also integrated into the adsorption mechanism 520.

[0086] In some embodiments, refer to Figure 11 The magnification mechanism 600 includes a vertical rod 610, a third guide rail 620, an amplifier 630, and a display screen 640. The third guide rail 620 is set on the worktable 100 along the second direction. One end of the vertical rod 610 is slidably connected to the third guide rail 620, and the other end is fixedly connected to the display screen 640. The amplifier 630 is slidably connected to the vertical rod 610. The imaging direction of the amplifier 630 faces the test base 300. The amplifier 630 and the display screen 640 are electrically connected to transmit the magnified image to the display screen 640.

[0087] In this scheme, multiple test sockets 300 are arranged along the second direction. Therefore, the third guide rail 620 arranged along the second direction can provide a direction for the vertical rod 610 to move, so that the amplifier 630 can correspond to the position of different test sockets 300 respectively. The amplifier 630 realizes data transmission through electrical connection with the display screen 640. The amplifier 630 magnifies the surface of the chip through the imaging through hole 3522 and the pin card 3521, which is convenient for the testers to inspect and test it.

[0088] The process of "placing the chip into the test socket 300 → using the amplification mechanism 600 to amplify and sample the chip and pin card on the test socket 300 → removing the chip from the test socket 300" includes the following steps:

[0089] Step 1: The L-shaped support arm 352 rotates on the rotating seat 351 and is positioned above the test seat 300;

[0090] Step 2: Use the moving mechanism 400 to bring the picking mechanism 500 above the test socket 300, and the picking mechanism 500 places the chip onto the test socket 300;

[0091] Step 3: The amplification mechanism 600 moves to the corresponding test socket 300, and the tester performs multiple tests on the chip through the pin card 3521 and the amplification mechanism 600 (visual inspection through the display screen 640).

[0092] Step 4: The amplification mechanism 600 moves away from the test base 300, the L-shaped support arm 352 rotates on the rotating base 351, and moves out of the test base 300;

[0093] Step 5: Use the pick-up mechanism 500 to remove the chip from the test socket 300;

[0094] Step 6: Transfer the chip to the transfer tray 200.

[0095] Throughout the process, the overlapping relationship between the L-shaped support arm 352 with the needle card 3521 installed, the amplification mechanism 600 and the material picking mechanism 500 is avoided, thus preventing motion interference. Furthermore, the entire movement process can be centrally controlled through the aforementioned central processing module.

[0096] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A testing and sorting machine, characterized in that, include: Workbench (100); There are two conveyor trays (200), which can reciprocate on the worktable (100) along a first direction, and the movement between the two conveyor trays (200) is relatively independent; A test stand (300) is disposed on the workbench (100), and the test stand (300) is disposed at one end of the moving path of the conveyor plate (200); A moving mechanism (400) is horizontally disposed above the conveyor plate (200), and the moving mechanism (400) can reciprocate along a first direction; The material handling mechanism (500) is slidably disposed on the moving mechanism (400). The material handling mechanism (500) reciprocates along a second direction, which is perpendicular to the first direction. The material handling mechanism (500) is used to transport the chip on the conveyor tray (200) to the test socket (300), or to transport the chip on the test socket (300) to the conveyor tray (200). The material handling mechanism (500) has a built-in imaging mechanism. An amplification mechanism (600) is slidably disposed on the worktable (100). The amplification mechanism (600) is used to amplify the pin card located on the test seat (300). The amplification mechanism (600) can reciprocate along a second direction. The test fixture (300) is provided in multiple ways and is arranged along the second direction.

2. The test sorting machine according to claim 1, characterized in that, The test socket (300) includes: The machine base (310) is fixed on the workbench (100); A lifting seat (320) is installed on the machine base (310) and can be raised and lowered within the machine base (310); A test mounting base (330) is disposed on the surface of the lifting base (320), and a test station (331) is provided on the surface of the test mounting base (330); A uniform heating module (340) is built into the test mounting base (330), and the uniform heating module (340) is used to adjust the surface temperature of the test mounting base (330); The PCB fine-tuning mechanism (350) includes a rotating base (351) and an L-shaped support arm (352). One end of the L-shaped support arm (352) is pivotally mounted in the rotating base (351), and the other end is detachably connected to a pin clip (3521). The L-shaped support arm (352) is provided with an imaging through hole (3522). The imaging through hole (3522) and the observation port of the pin clip (3521) are correspondingly set. The L-shaped support arm (352) can rotate so that the imaging through hole (3522) and the test station (331) are correspondingly set. Along the arrangement direction of the plurality of test mounting bases (330), the temperature of the plurality of test stations (331) increases or decreases by an equal amount.

3. The test sorting machine according to claim 2, characterized in that, The uniform heating module (340) includes: A uniform heating cavity (341) has a built-in rotating shaft (342), which can pivot within the uniform heating cavity (341), and the uniform heating cavity (341) has a built-in heating wire (3413); The spoiler blades (343) are provided in plurality, and the plurality of spoiler blades (343) are arranged around the side wall of the rotating shaft (342), and the plurality of spoiler blades (343) are inclined in the same direction.

4. The test sorting machine according to claim 2, characterized in that, A lifting cylinder (311) is connected to the bottom surface of the machine platform (310), the drive shaft of the lifting cylinder (311) and the bottom of the lifting seat (320) are correspondingly arranged, and the lifting cylinder (311) can abut against the lifting seat (320) to drive the lifting seat (320) to rise.

5. The test sorting machine according to claim 2 or 4, characterized in that, The machine platform (310) is provided with a vertical track (360), and the lifting seat (320) is slidably connected to the vertical track (360).

6. The test sorting machine according to claim 1, characterized in that, The workbench (100) is provided with two groups of first guide rails (110), and two of the conveying trays (200) are respectively slidably connected to the two groups of first guide rails (110). A plurality of trays (210) are arranged in a matrix on the conveying tray (200), and a plurality of placement grooves (211) for placing chips are provided on the surface of the tray (210).

7. The test sorting machine according to claim 1, characterized in that, The moving mechanism (400) is in the shape of "冖". Two second guide rails (120) are provided on both sides of the workbench (100), and both sides of the moving mechanism (400) are respectively slidably connected to the two second guide rails (120), so that the moving mechanism (400) can reciprocate along the second guide rail (120).

8. The test sorting machine according to claim 7, characterized in that, The chip taking mechanism (500) includes a sliding seat (510) and an adsorption mechanism (520). The sliding seat (510) is slidably connected to the upper beam of the moving mechanism (400), and the adsorption mechanism (520) is slidably connected to the surface of the sliding seat (510). The adsorption mechanism (520) can move up and down to pick up or place the chips on the test seat (300) or the conveying tray (200).

9. The test sorting machine according to claim 1, characterized in that, The amplifying mechanism (600) includes a vertical rod (610), a third guide rail (620), an amplifier (630) and a display screen (640). The third guide rail (620) is arranged on the workbench (100) along a second direction. One end of the vertical rod (610) is slidably connected to the third guide rail (620), and the other end is fixedly connected to the display screen (640). The amplifier (630) is slidably connected to the vertical rod (610), the shooting direction of the amplifier (630) faces the test seat (300), and the amplifier (630) is electrically connected to the display screen (640) to transmit the captured image to the display screen (640).

10. A chip testing and sorting method, characterized in that, For controlling the test sorter according to any one of claims 1 to 9, comprising the following steps: Step 1: Place the chip on one of the conveying trays (200), and the conveying tray (200) conveys the chip to one end close to the test seat (300); Step 2: Move the chip taking mechanism (500) to the corresponding position, and the chip taking mechanism (500) takes out the chip from the conveying tray (200); Step 3: Move the picking mechanism (500) to the corresponding test socket (300) position by moving the moving mechanism (400) in the first direction, and place the chip to be tested into the test socket (300) by the picking mechanism (500); Step 4: The imaging mechanism (540) takes a picture of the chip to be tested, and the magnification mechanism (600) magnifies and samples the chip and pin card on the test socket (300); Step 5: Use the pick-up mechanism (500) to remove the tested chip from the test socket (300); Step 6: The picking mechanism (500) moves along the second direction on the moving mechanism (400) so that the picking mechanism (500) and another conveyor plate (200) are in the same position. The moving mechanism (400) moves in the first direction so that the picking mechanism (500) can place the chip on the conveyor plate (200). Repeat steps 1 through 6.

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