Wafer pick-and-place device

Abstract

The application provides a wafer taking and placing device for taking and placing a wafer on a suction disc. The wafer taking and placing device comprises a plurality of bearing columns for penetrating through through holes on the suction disc and configured to lift the wafer from the top surface of the suction disc and place the wafer on the top end of the suction disc by lifting; a support disc connected with the bottom end of the plurality of bearing columns; a connecting piece connected with the support disc and extending to the radial outside of the suction disc; a lifting seat arranged on the part of the connecting piece extending from the support disc; a limiting seat provided with a limiting guide rail arranged in the vertical direction, the lifting seat is matched with the limiting guide rail through a sliding block, so as to limit the lifting track of the sliding block and the lifting seat by the limiting guide rail, and the limiting seat is fixed in the working area through a plurality of first adjusting jacks. The lifting of the bearing column is realized while the ball head lever mechanism is cancelled, so that the problems caused by the ball head lever mechanism are avoided, and the parallel degree of the support disc relative to the suction disc can be flexibly adjusted by adjusting the limiting seat through the first adjusting jacks.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and particularly relates to a wafer pick-and-place device. BACKGROUND

[0002] In the process of processing or detecting a wafer, in order to keep the wafer stable, the wafer is usually placed on a wafer chuck, the wafer is fixed by the wafer chuck, and after the processing or detecting operation is completed, the wafer is taken off from the wafer chuck. At present, the device for taking and placing the wafer from the wafer chuck generally comprises a plurality of bearing columns, a support disc and a ball head lever, the plurality of bearing columns are fixed on the support disc, and the wafer chuck is provided with through holes for the bearing columns to pass through. In the working process, the ball head of the ball head lever rolls up the support disc by using the principle of the lever, so that the bearing columns pass through the through holes on the wafer chuck and lift the wafer on the chuck.

[0003] Since the existing pick-and-place device adopts a lever mechanism, the ball head of the ball head lever rolls up the support disc, and the ball head of the ball head lever and the support disc are in friction, which can cause wear at the contact position of the ball head and the support disc after long-term work, thereby not only causing the precision to decrease, but also causing powder particles to be generated near the wafer chuck and to pollute the working area. SUMMARY

[0004] An object of the present application is to provide a wafer pick-and-place device capable of solving any of the above problems.

[0005] In particular, the present application provides a wafer pick-and-place device for taking and placing a wafer on a chuck, and the wafer pick-and-place device comprises:

[0006] a plurality of bearing columns for passing through the through holes on the chuck, the top ends of the bearing columns being used for placing the wafer and being configured to lift the wafer from the top surface of the chuck and place the wafer on the chuck by lifting and lowering;

[0007] a support disc connected with the bottom ends of the plurality of bearing columns;

[0008] a connecting piece connected with the support disc and extending from the support disc to the radial outer side of the chuck;

[0009] a lifting seat arranged on the part of the connecting piece extending from the support disc and lifting together with the connecting piece;

[0010] a limiting seat provided with a limiting guide rail arranged in the vertical direction, the lifting seat being matched with the limiting guide rail through a sliding block to limit the lifting track of the sliding block and the lifting seat, and the limiting seat being provided with a plurality of first adjusting top screws to be fixed in a working area through the plurality of first adjusting top screws.

[0011] Optionally, the lifting seat is provided with a plurality of second adjusting jacks, the lifting seat is fixedly connected with the sliding block through the plurality of second adjusting jacks, so as to adjust the inclination of the lifting seat relative to the sliding block through the plurality of second adjusting jacks, and the adjusting directions of the plurality of second adjusting jacks are perpendicular to the adjusting directions of the plurality of first adjusting jacks.

[0012] Optionally, the thread density of the second adjusting jack is greater than the thread density of the first adjusting jack.

[0013] Optionally, the lifting seat comprises a connecting plate and a supporting plate, the connecting plate is arranged to face the sliding block, the supporting plate is arranged on the side of the connecting plate away from the sliding block, the top surface of the supporting plate is connected with the connecting piece, and the connecting plate is connected with the sliding block through the plurality of second adjusting jacks.

[0014] Optionally, the connecting plate is provided with two outer ears, the two outer ears respectively protrude to the two sides of the sliding block, a reset elastic piece is arranged between each outer ear and the limiting seat, and the lifting seat is configured to stretch the reset elastic piece in the lifting process, so that the reset elastic piece provides an external force to drive the lifting seat to descend.

[0015] Optionally, the limiting seat is provided with three first adjusting jacks, and the connecting lines of the three first adjusting jacks at the arranged positions of the limiting seat form a triangle; and / or,

[0016] The lifting seat is provided with three second adjusting jacks, and the connecting lines of the three second adjusting jacks at the arranged positions of the lifting seat form a triangle.

[0017] Optionally, the bearing column comprises:

[0018] a top column for contacting the wafer through a through hole on the suction disc; and

[0019] a bottom column arranged at the bottom end of the top column and threadedly connected with the top column.

[0020] Optionally, the bearing column further comprises a pre-tightening elastic piece arranged between the top column and the bottom column, and the pre-tightening elastic piece is configured to provide an upward pre-tightening force for the top column.

[0021] Optionally, the wafer picking and placing device further comprises a driving piece arranged at the end of the connecting piece away from the supporting disc, for providing a driving force to drive the connecting piece to rise.

[0022] Optionally, the driving piece comprises a first driving part for directly contacting the connecting piece and a second driving part arranged at the bottom end of the first driving part, and a pressure sensor is arranged between the first driving part and the second driving part.

[0023] The wafer pick-and-place device of the present application limits the lifting track of the sliding block and the lifting seat by providing a limiting guide rail on the limiting seat, so that the lifting seat is matched with the limiting guide rail through the sliding block. The lifting seat is connected with the connecting piece, the connecting piece is connected with the support disc, and the support disc is connected with the plurality of bearing columns. In other words, the sliding block, the lifting seat, the connecting piece, the support disc and the plurality of bearing columns can be lifted as a whole along the limiting guide rail. In other words, the limiting guide rail limits the lifting track of the whole composed of the sliding block, the lifting seat, the connecting piece, the support disc and the plurality of bearing columns. In this way, on the basis of being able to realize the lifting of the plurality of bearing columns, the ball head lever mechanism is cancelled, so as to avoid the situation that the precision is reduced due to the wear of the ball head ball of the ball head lever mechanism and the working area is polluted due to the generation of powder particles. In addition, the limiting seat is fixed in the working area through the plurality of first adjusting top screws, so as to adjust the inclination degree of the top surface of the limiting seat relative to the horizontal plane, that is, to adjust the inclination degree of the limiting guide rail in the vertical direction, so as to adjust the lifting track of the whole composed of the sliding block, the lifting seat, the connecting piece, the support disc and the three bearing columns. In other words, the parallel degree of the support disc relative to the parallel plane of the suction disc can be flexibly adjusted by adjusting the limiting seat, so as to cope with the situation that the surface of the support disc deviates greatly from the parallel plane of the suction disc in the use process, so as to ensure the good contact of the three bearing columns with the wafer, and further ensure the stable pick-and-place of the wafer.

[0024] Further, the wafer pick-and-place device of the present application fixes the lifting seat with the sliding block through the plurality of second adjusting top screws, so that on the basis of being able to adjust the lifting track of the whole composed of the sliding block, the lifting seat, the connecting piece, the support disc and the three bearing columns by adjusting the limiting seat through the first adjusting top screws, the lifting track of the whole composed of the lifting seat, the connecting piece, the support disc and the three bearing columns can also be adjusted by adjusting the lifting seat through the second adjusting top screws, so that the parallel degree of the support disc relative to the parallel plane of the suction disc can be jointly adjusted from two parts, and further help to increase the adjustment range and be conducive to coping with more complex situations.

[0025] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] Some embodiments of the present application will be described in detail with reference to the drawings, wherein like reference numerals refer to like parts throughout the several views. The drawings are in simplified form and are not to precise scale. In the drawings:

[0027] Figure 1 is a schematic view of a wafer pick-and-place device and a suction disc according to an embodiment of the present application;

[0028] Figure 2Fig. 2 is a schematic diagram of a wafer pick-and-place device in a raised state according to an embodiment of the present application;

[0029] Figure 3 Fig. 3 is a schematic diagram of a wafer pick-and-place device in a lowered state according to an embodiment of the present application;

[0030] Figure 4 Fig. 4 is a schematic diagram of a wafer pick-and-place device according to an embodiment of the present application;

[0031] Figure 5 Fig. 5 is a schematic diagram of a lifting seat portion of a wafer pick-and-place device according to an embodiment of the present application;

[0032] Figure 6 Fig. 6 is a schematic diagram of a limiting seat portion of a wafer pick-and-place device according to an embodiment of the present application;

[0033] Figure 7 Fig. 7 is a schematic diagram of a bearing column of a wafer pick-and-place device according to an embodiment of the present application.

[0034] BRIEF DESCRIPTION OF THE DRAWINGS

[0035] 10, wafer pick-and-place device; 20, suction cup; 21, through hole; 30, mounting platform;

[0036] 100, bearing column; 110, top column; 120, bottom column; 130, pre-tightening elastic member; 200, support disc; 300, connecting member; 400, lifting seat; 410, second adjusting jackscrew; 420, connecting plate; 421, outer ear portion; 430, support plate; 500, sliding block; 600, limiting seat; 610, limiting guide rail; 620, first adjusting jackscrew; 700, reset elastic member; 800, driving member; 810, first driving portion; 820, second driving portion; 830, pressure sensor. DETAILED DESCRIPTION

[0037] Those skilled in the art should understand that the embodiments described below are only a part of the embodiments of the present application, and are not intended to limit the protection scope of the present application. Based on the embodiments provided by the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor should fall within the protection scope of the present application.

[0038] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0039] Further, it needs to be further pointed out that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] As Figures 1 to 6 shown, in one embodiment, the wafer pick-and-place device 10 includes three bearing columns 100, a support disc 200, a connecting piece 300, a lifting seat 400, a sliding block 500 and a limiting seat 600. The three bearing columns 100 are used to pass through the through hole 21 on the suction disc 20, the top end of which is used to place the wafer, and is configured to lift the wafer from the top surface of the suction disc 20 and place the wafer at the top end on the suction disc 20. The support disc 200 is connected with the bottom end of the three bearing columns 100. The connecting piece 300 is connected with the support disc 200 and extends radially outward from the support disc 200 to the outside of the suction disc 20. The lifting seat 400 is arranged on the part of the connecting piece 300 extending from the support disc 200 and lifts together with the connecting piece 300. The limiting seat 600 is provided with a limiting guide rail 610 arranged vertically, and the lifting seat 400 cooperates with the limiting guide rail 610 through the sliding block 500 to limit the lifting track of the sliding block 500 and the lifting seat 400 by the limiting guide rail 610. The limiting seat 600 is provided with three first adjusting top screws 620 to be fixed to the mounting platform 30 of the working area through the three first adjusting top screws 620, and the plurality of first adjusting top screws 620 are used to adjust the inclination of the limiting seat 600 relative to the horizontal plane.

[0041] Referring to Figures 1 to 6As shown, specifically, the chuck 20 is an electrostatic chuck or a vacuum chuck, etc. known to those skilled in the art. The chuck 20 is a circular plate, and the top surface is used to place the wafer. The chuck 20 is provided with three through holes 21, and each through hole 21 corresponds to a bearing column 100, which is used to pass through the corresponding bearing column 100. When the bearing column 100 passes through the through hole 21, the top end of the bearing column 100 is higher than the top surface of the chuck 20, so that the wafer originally placed on the top surface of the chuck 20 can be lifted, that is, the wafer is removed from the chuck 20. At the same time, when the top end of the bearing column 100 is higher than the top surface of the chuck 20, the wafer to be processed can be placed on the top end of the bearing column 100, and the bearing column 100 descends together with the wafer until the top end of the bearing column 100 is lower than the top surface of the chuck 20, and the wafer at the top end of the bearing column 100 is placed on the chuck 20.

[0042] It should be noted that in other embodiments, the number of bearing columns can also be two, four or more, and those skilled in the art can adjust the number of bearing columns as needed.

[0043] Continuing to refer to Figures 1 to 6 As shown, the support disc 200 is fixedly connected with the bottom ends of the three bearing columns 100, so that the support disc 200 can drive the three bearing columns 100 to rise and fall simultaneously. The connecting piece 300 is a long strip-shaped block structure, and the main part is a square body. One end of the connecting piece 300 is connected with the support disc 200, so that the connecting piece 300 can drive the support disc 200 to rise and fall, and in turn drive the three bearing columns 100 to rise and fall. The support disc 200 is located at the bottom of the chuck 20, that is, the end of the connecting piece 300 connected with the support disc 200 is located at the bottom of the chuck 20, and the other end of the connecting piece 300 extends outward along the radial direction of the chuck 20. The lifting seat 400 is arranged on the part of the connecting piece 300 extending from the support disc 200, that is, the part of the connecting piece 300 avoiding the connection position with the support disc 200.

[0044] It should be noted that the connecting piece and the support disc can be integrally formed or separately formed and fixedly connected.

[0045] Continuing to refer to Figures 1 to 6 As shown, the limiting seat 600 is a plate-shaped structure, and the limiting guide rail 610 extends upward from the top surface thereof. The lifting seat 400 cooperates with the limiting guide rail 610 through the sliding block 500, so as to limit the lifting track of the sliding block 500 and the lifting seat 400 by the limiting guide rail 610. Because the lifting seat 400 is connected with the connecting piece 300, the connecting piece 300 is connected with the support disc 200, and the support disc 200 is connected with the three bearing columns 100, so the limiting guide rail 610 limits the lifting track of the whole composed of the sliding block 500, the lifting seat 400, the connecting piece 300, the support disc 200 and the three bearing columns 100.

[0046] As Figures 1 to 6As shown, the limiting guide rail 610 is roughly a square column, and the opposite two side edges are concave. The slider 500 includes a main plate facing the limiting guide rail 610, and two matching parts protruding from the surface of the main plate facing the limiting guide rail 610 to the side where the limiting guide rail 610 is located, which can be roughly described as a "concave" shape. The two matching parts are respectively located on the two sides of the limiting guide rail 610, thereby clamping the limiting guide rail 610 and achieving sliding cooperation with the limiting guide rail 610. The side of the two matching parts facing the limiting guide rail 610 is provided with a matching concave part, and the matching part is inserted together with the concave part of the limiting guide rail 610. The lifting seat 400 is arranged on the side of the slider 500 away from the limiting guide rail 610.

[0047] Continuing to refer to Figures 1 to 6 As shown, the limiting seat 600 is fixed to the mounting platform 30 by three first adjusting top screws 620, so that by adjusting one first adjusting top screw 620, the height of the corresponding part of the limiting seat 600 relative to the top surface of the mounting platform 30 can be changed, that is, the inclination of the top surface of the limiting seat 600 relative to the horizontal plane is adjusted, and then the inclination of the limiting guide rail 610 in the vertical direction is adjusted, that is, the lifting track of the whole composed of the slider 500, the lifting seat 400, the connecting piece 300, the support disc 200 and the three bearing columns 100 is adjusted.

[0048] In the scheme of the embodiment, by arranging the limiting guide rail 610 on the limiting seat 600, the lifting seat 400 cooperates with the limiting guide rail 610 through the slider 500, so as to limit the lifting track of the slider 500 and the lifting seat 400 by the limiting guide rail 610. The lifting seat 400 is connected with the connecting piece 300, the connecting piece 300 is connected with the support disc 200, and the support disc 200 is connected with the plurality of bearing columns 100, that is, the slider 500, the lifting seat 400, the connecting piece 300, the support disc 200 and the plurality of bearing columns 100 can be lifted as a whole along the limiting guide rail 610, in other words, the limiting guide rail 610 limits the lifting track of the whole composed of the slider 500, the lifting seat 400, the connecting piece 300, the support disc 200 and the plurality of bearing columns 100. In this way, on the basis of being able to realize the lifting of the plurality of bearing columns, the ball head lever mechanism is cancelled, thereby avoiding the situation that the precision is reduced due to the wear of the ball head ball of the ball head lever mechanism and the working area is polluted due to the generation of powder particles.

[0049] In addition, the limiting seat 600 is fixed to the working area by multiple first adjusting screws 620, which can be used to adjust the tilt of the top surface of the limiting seat 600 relative to the horizontal plane, that is, to adjust the vertical tilt of the limiting guide rail 610, thereby adjusting the lifting trajectory of the whole composed of the slider 500, the lifting seat 400, the connector 300, the support plate 200 and the three bearing columns 100. Because the guide rail lifting method results in more components and more coordination between different components, such as the limiting guide rail 610 and the slider 500 cooperating with each other, and the lifting seat 400 and the connector 300 cooperating with each other, during use, there may be a situation where the surface of the support plate 200 deviates significantly from the parallel plane of the suction cup 20 due to improper coordination, resulting in uneven heights of the multiple bearing columns 100 and making it impossible to smoothly pick up and place wafers. By adjusting the limiting seat 600, the parallelism between the support plate 200 and the suction cup 20 can be flexibly adjusted to deal with the above situation, thereby ensuring good contact between the three bearing posts 100 and the wafer, and thus ensuring the smooth placement and removal of the wafer.

[0050] It should be noted that in some other embodiments, the number of first adjusting set screws may also be two, four or more, and those skilled in the art can adjust the number of first adjusting set screws as needed.

[0051] like Figures 1 to 6 As shown, in one embodiment, the lifting seat 400 is provided with three second adjusting screws 410. The lifting seat 400 is fixedly connected to the slider 500 via the three second adjusting screws 410, so as to adjust the tilt of the lifting seat 400 relative to the slider 500 by means of the multiple second adjusting screws 410. Furthermore, the adjustment direction of the multiple second adjusting screws 410 is perpendicular to the adjustment direction of the multiple first adjusting screws 620. Specifically, the first adjusting screws 620 pass vertically through the limiting seat 600 and are connected to the mounting platform 30, while the second adjusting screws 410 pass horizontally through the lifting seat 400 and are connected to the slider 500.

[0052] In this embodiment, by fixing the lifting seat 400 to the slider 500 via multiple second adjusting screws 410, the lifting trajectory of the entire assembly consisting of the slider 500, lifting seat 400, connector 300, support plate 200, and three bearing columns 100 can be adjusted by adjusting the limiting seat 600 via the first adjusting screw 620. Furthermore, the lifting trajectory of the entire assembly consisting of the lifting seat 400, connector 300, support plate 200, and three bearing columns 100 can be adjusted by adjusting the lifting seat 400 via the second adjusting screws 410. This allows for adjustment of the parallelism of the support plate 200 relative to the suction cup 20 from two aspects, thereby increasing the adjustment range and facilitating the handling of more complex situations.

[0053] It should be noted that in other embodiments, the number of the second adjusting jackscrews can also be two, four or more, and those skilled in the art can adjust the number of the second adjusting jackscrews as needed. In addition, at least two second adjusting jackscrews are arranged in the up-down direction.

[0054] As shown in Figure 5 and Figure 6 , in one embodiment, the thread density of the second adjusting jackscrew 410 is greater than that of the first adjusting jackscrew 620, that is, the second adjusting jackscrew 410 can make more subtle adjustments than the first adjusting jackscrew 620. In this way, during the adjustment process, the first adjusting jackscrew 620 can be used for coarse adjustment, and the second adjusting jackscrew 410 can be used for fine adjustment, thereby helping to quickly adjust the support disc 200 to the right position.

[0055] As shown in Figure 5 and Figure 6 , in one embodiment, the three first adjusting jackscrews 620 form a triangle at the connecting line of the setting positions of the limiting seat 600, so that the limiting seat 600 can be adjusted in two directions, and the stability of the connection between the limiting seat 600 and the mounting platform 30 is improved. In addition, the three second adjusting jackscrews 410 form a triangle at the connecting line of the setting positions of the lifting seat 400, so that the lifting seat 400 can be adjusted in two directions, and the stability of the connection between the lifting seat 400 and the sliding block 500 is improved.

[0056] It should be noted that the three first adjusting jackscrews 620 are as close to the edges of the limiting seat 600 as possible. In addition, the three second adjusting jackscrews 410 are as close to the edges of the lifting seat 400 as possible.

[0057] As shown in Figures 1 to 6 , in one embodiment, the lifting seat 400 includes a connecting plate 420 and a support plate 430 perpendicular to each other, the connecting plate 420 is arranged to face the sliding block 500, and the support plate 430 is arranged on the side of the connecting plate 420 away from the sliding block 500. The top surface of the support plate 430 is connected with the connecting piece 300, and at least one second adjusting jackscrew 410 passes through the connecting plate 420 and is connected with the sliding block 500.

[0058] Referring to Figures 1 to 6 , specifically, the connecting plate 420 is a vertically extending flat plate, and the support plate 430 is a horizontally extending flat plate. One side surface of the connecting plate 420 faces the sliding block 500. The support plate 430 is located at the bottom end of the connecting plate 420 and on the surface of the connecting plate 420 away from the sliding block 500. The connecting piece 300 is placed on the top surface of the support plate 430 and connected with the support plate 430. Two of the three second adjusting jackscrews 410 pass through the connecting plate 420 and are connected with the sliding block 500, and one passes through the support plate 430 and is connected with the sliding block 500.

[0059] The skilled in the art can understand that, by setting the lifting seat 400 as the connecting plate 420 and the supporting plate 430 which are perpendicular to each other, the top surface of the supporting plate 430 is connected with the connecting member 300, and at least part of the plurality of second adjusting top screws 410 is connected with the sliding block 500 through the connecting plate 420. While the connecting member 300 is stably supported by the supporting plate 430, the thickness of the connecting plate 420 connected with the sliding block 500 is relatively thinner, so that the length of the second adjusting top screw 410 passing through the connecting plate 420 can be set to be relatively shorter, and the resistance during adjustment is smaller, and the adjustment is easier.

[0060] In addition, at least one second adjusting top screw 410 is connected with the sliding block 500 through the supporting plate 430, so that the plurality of second adjusting top screws 410 is dispersed as much as possible, and the connection between the lifting seat 400 and the sliding block 500 is more stable, and the adjustment is facilitated.

[0061] As shown in Figure 5 and Figure 6 , the connecting plate 420 is provided with two outer ear portions 421 which protrude to the left and right sides of the sliding block 500 respectively, and a reset elastic member 700 is arranged between each outer ear portion 421 and the limiting seat 600. The lifting seat 400 is configured to stretch the reset elastic member 700 during the lifting process, so that the reset elastic member 700 provides an external force to drive the lifting seat 400 to descend.

[0062] As shown in Figure 5 and Figure 6 , specifically, most of the limiting seat 600 and the lifting seat 400 are located on the opposite sides of the sliding block 500, which are referred to as the front and rear sides for convenience of description. The two outer ear portions 421 of the connecting plate 420 protrude to the left and right sides of the sliding block 500 respectively. In addition, the width of the limiting seat 600 in the left-right direction is greater than the width of the sliding block 500, so that the limiting seat 600 has portions located on the left and right sides of the sliding block 500 respectively. One screw rod extending to the side of the limiting seat 600 is fixed to each outer ear portion 421. The reset elastic member 700 is a tensile spring. For the reset elastic member 700 on the left side of the sliding block 500, one end of the reset elastic member 700 is fixed to the screw rod on the left side of the sliding block 500, and the other end of the reset elastic member 700 is fixed to the portion of the limiting seat 600 on the left side of the sliding block 500. During the lifting process of the lifting seat 400, the reset elastic member 700 is stretched to accumulate elastic force. When the lifting seat 400 descends, the reset elastic member 700 releases the accumulated elastic force, thereby providing an external force to drive the lifting seat 400 to descend.

[0063] The skilled in the art can understand that, by setting two outer ears 421 on the connecting plate 420, and setting reset elastic members 700 between each outer ear 421 and the limiting seat 600, the lifting seat 400 stretches the reset elastic members 700 in the lifting process, so that the reset elastic members 700 provide external force to drive the lifting seat 400 to descend, so that the lifting seat 400 is faster and more stable.

[0064] It should be noted that in other embodiments, a screw rod can also not be provided, but the outer ear itself extends a part to the side where the limiting seat is located for fixing the reset elastic member.

[0065] It should be noted that in other embodiments, the reset elastic member can also be an elastic structure such as a stretchable rope.

[0066] As shown in Figure 1 The wafer picking and placing device 10 further comprises a driving member 800, which is provided at the end of the connecting member 300 away from the support disc 200, and is used to provide driving force to lift the connecting member 300. Specifically, the driving member 800 is a columnar structure, for example, a hydraulic rod. The end of the connecting member 300 away from the support disc 200 is provided with an inverted "L" shaped structure, which is hung at the end of the connecting member 300 away from the support disc 200, that is, the horizontal part of the inverted "L" shaped structure is arranged on the connecting member 300, and the vertical part extends downward. The driving member 800 is not connected with the connecting member 300, and when the three bearing columns 100 need to be lifted, the driving member 800 is lifted to abut against the lower end of the inverted "L" shaped structure, thereby providing external force to the whole consisting of the sliding block 500, the lifting seat 400, the connecting member 300, the support disc 200 and the three bearing columns 100 to lift along the limiting guide rail 610. When the three bearing columns 100 need to be lowered, the driving member 800 is lowered and separated from the connecting member 300, and the whole consisting of the sliding block 500, the lifting seat 400, the connecting member 300, the support disc 200 and the three bearing columns 100 is lowered under the action of gravity.

[0067] The skilled in the art can understand that, by setting the driving member 800 at the end of the connecting member 300 away from the support disc 200, the driving member 800 is away from the area where the suction disc 20 is located, thereby providing sufficient working space for wafer processing or detection.

[0068] As shown in Figure 1As shown, the active element 800 includes a first driving part 810 and a second driving part 820, the first driving part 810 is used to directly contact with the connecting element 300, the second driving part 820 is arranged at the bottom end of the first driving part 810, and a pressure sensor 830 is arranged between the first driving part 810 and the second driving part 820. That is, the second driving part 820 lifts the first driving part 810 and then lifts the connecting element 300, so as to realize the lifting of the connecting element 300. And when the second driving part 820 lifts the first driving part 810, the pressure sensor 830 detects the pressure. Then, when the first driving part 810 lifts the connecting element 300, the gravity of the whole formed by the slider 500, the lifting seat 400, the connecting element 300, the support disc 200 and the three bearing columns 100 will change the detection value of the pressure sensor 830. When the bearing column 100 lifts the wafer, the gravity of the wafer will also change the detection value of the pressure sensor 830. And if the suction cup 20 still maintains the adsorption of the wafer when lifting the wafer, because the wafer cannot be lifted, the pressure applied by the bearing column 100 to the wafer will become larger and larger, at this time, the detection value of the pressure sensor 830 will also change, but the change is very different from that when the wafer is lifted.

[0069] Therefore, by monitoring the detection value of the pressure sensor 830, the adsorption state of the wafer by the suction cup 20 can be monitored, so that when the wafer needs to be lifted from the suction cup 20, if it is judged according to the detection value of the pressure sensor 830 that the wafer has not been separated from the adsorption of the suction cup 20, the action of lifting the wafer can be stopped in time, so as to avoid damaging the wafer. And because the active element 800 is far away from the working area where the suction cup 20 is located, the pressure sensor 830 is also far away from the working area, which is convenient for installation and replacement.

[0070] As shown in Figures 1 to 3 , and Figure 7 In one embodiment, the bearing column 100 includes a top column 110 and a bottom column 120. The top column 110 is used to pass through the through hole 21 on the suction cup 20 to contact with the wafer. The bottom column 120 is arranged at the bottom end of the top column 110 and is threadedly connected with the top column 110.

[0071] As can be understood by those skilled in the art, by arranging the bearing column 100 as the top column 110 and the bottom column 120, and threadedly connecting the bottom column 120 with the top column 110, the length of the whole bearing column 100 can be adjusted by screwing the top column 110, and then the height of the top end of the three bearing columns 100 can be kept consistent by individually adjusting each bearing column 100, so as to ensure the stable support of the wafer.

[0072] As shown in Figures 1 to 3 , and Figure 7As shown, in one embodiment, the support column 100 further includes a preload elastic member 130 disposed between the top column 110 and the bottom column 120, and the preload elastic member 130 is configured to provide an upward preload force to the top column 110.

[0073] like Figures 1 to 3 ,as well as Figure 7 As shown, specifically, the pre-tensioning elastic element 130 is a spring. The top of the bottom post 120 has a threaded rod with a diameter smaller than the diameter of the main body of the bottom post 120, and the pre-tensioning elastic element 130 is sleeved on the threaded rod. The bottom of the top post 110 forms a threaded hole corresponding to the threaded rod, and a bushing is formed at the bottom of the top post 110. The diameter of the bushing matches the diameter of the main body of the bottom post 120, so that after the bottom post 120 and the top post 110 are threadedly connected, the bushing fits snugly on the outer surface of the main body of the bottom post 120. Furthermore, after the bottom post 120 and the top post 110 are threadedly connected, the bottom surface of the top post 110 around the threaded hole and the top surface of the bottom post 120 around the threaded post compress the pre-tensioning elastic element 130. Specifically, within all adjustment ranges of the top post 110 and the bottom post 120, the spring, as the pre-tensioning elastic element 130, is always in a compressed state, that is, it always maintains an upward force on the top post 110.

[0074] Those skilled in the art will understand that because the pre-tightening elastic element 130 always maintains an upward force on the top post 110, when the wafer is placed on the top of the support post 100, the top post 110 is subjected to the weight of the wafer. However, due to the force exerted by the pre-tightening elastic element 130 on the top post 110, the top post 110 can be prevented from shifting slightly downward relative to the bottom post 120 under the weight of the wafer, thereby helping to maintain the high precision of the support post 100.

[0075] It should be noted that in some other embodiments, the preload elastic element may also be other elastic components such as a gas spring.

[0076] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1.A wafer pick-and-place device for picking and placing a wafer on a chuck, the wafer pick-and-place device comprising: a plurality of supporting columns for passing through a through-hole on the chuck, a top end of each of the supporting columns being configured to place the wafer, and the supporting columns being configured to lift the wafer from a top surface of the chuck and place the wafer on the chuck by lifting; a support plate connected to a bottom end of each of the supporting columns; a connecting member connected to the support plate and extending from the support plate to a radially outer side of the chuck; a lifting seat disposed on a portion of the connecting member extending from the support plate and configured to be lifted together with the connecting member; and a limiting seat provided with a limiting guide rail arranged in a vertical direction, the lifting seat being configured to limit a lifting track of the lifting seat and the sliding block by cooperating with the limiting guide rail via a sliding block, and the limiting seat being provided with a plurality of first adjusting studs for fixing the limiting seat to a working area by the plurality of first adjusting studs, and the plurality of first adjusting studs being configured to adjust an inclination of the limiting seat relative to a horizontal plane. 2.The wafer pick-and-place device according to claim 1, wherein the lifting seat is provided with a plurality of second adjusting studs, the lifting seat is fixedly connected to the sliding block by the plurality of second adjusting studs, the plurality of second adjusting studs are configured to adjust the inclination of the lifting seat relative to the sliding block by the plurality of second adjusting studs, and the adjusting directions of the plurality of second adjusting studs are perpendicular to the adjusting directions of the plurality of first adjusting studs. 3.The wafer pick-and-place device according to claim 2, wherein a thread density of the second adjusting studs is greater than a thread density of the first adjusting studs. 4.The wafer pick-and-place device according to claim 2, wherein the lifting seat comprises a connecting plate and a supporting plate, the connecting plate is arranged to face the sliding block, the supporting plate is arranged on a side of the connecting plate away from the sliding block, a top surface of the supporting plate is connected to the connecting member, and at least one of the second adjusting studs is connected to the sliding block via the connecting plate. 5.The wafer pick-and-place device according to claim 4, wherein the connecting plate is provided with two outer ear portions, the two outer ear portions are respectively protruded to two sides of the sliding block, a reset elastic member is arranged between each of the outer ear portions and the limiting seat, and the lifting seat is configured to stretch the reset elastic member in a lifting process, so that the reset elastic member provides an external force to drive the lifting seat to descend. 6.The wafer pick-and-place device according to claim 2, wherein the limiting seat is provided with three first adjusting studs, and a line connecting arrangement positions of the three first adjusting studs forms a triangle; and / or the lifting seat is provided with three second adjusting studs, and a line connecting arrangement positions of the three second adjusting studs forms a triangle. 7.The wafer pick-and-place device according to claim 1, wherein the supporting columns comprise: a top column configured to contact the wafer by passing through the through-hole on the chuck; and a bottom column arranged at a bottom end of the top column and threadedly connected to the top column. 8.The wafer pick-and-place device according to claim 7, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The bearing column further comprises a pre-tightening elastic member, which is arranged between the top column and the bottom column and is configured to provide an upward pre-tightening force for the top column. 9.The wafer pick-and-place device of claim 1, wherein, The wafer pick-and-place device further comprises a driving member, which is arranged at an end of the connecting member away from the support disc and is configured to provide a driving force for lifting the connecting member. 10.The wafer pick-and-place device of claim 9, wherein, The driving member comprises a first driving part and a second driving part, the first driving part is configured to directly contact the connecting member, the second driving part is arranged at a bottom end of the first driving part, and a pressure sensor is arranged between the first driving part and the second driving part.

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