Electronic package assembly and method of forming electronic package assembly

Abstract

An electronic package assembly and a method of forming the electronic package assembly are provided. The electronic package assembly includes: a first electronic package including a first package substrate and a first mold cover formed on the first package substrate, where the first mold cover has a first notch at a periphery thereof; the second electronic package comprises a second package substrate and a second mold cover formed on the second package substrate, and the second mold cover is provided with a second notch matched with the first notch in shape at the periphery of the second mold cover; wherein the first mold cover is connected with the second mold cover through an adhesive material, and the first notch of the first mold cover is adjacent to the second notch of the second mold cover.

Description

Field of the Invention

[0001] The present application relates generally to semiconductor technology and, more particularly, to electronic packages and methods of forming electronic packages. Background Art

[0002] The semiconductor industry has been facing complex integration challenges as consumers want their electronic products to be smaller, faster, and higher performing, packing more and more functions into a single device. In recent years, electronic packages have been manufactured in smaller sizes to increase the density of electronic components. However, due to the complexity of IC design and the limitations of manufacturing processes, the spatial arrangement between electronic packages and the electronic components installed therein still needs to be improved, thus creating obstacles to the miniaturization of electronic packages.

[0003] Therefore, there is a need for an electronic package with better spatial arrangement. Summary of the invention

[0004] An object of the present application is to provide an electronic package assembly and a method of forming the electronic package assembly.

[0005] According to one aspect of an embodiment of the present application, the present invention provides an electronic packaging assembly. The electronic packaging assembly includes: a first electronic package, which includes a first packaging substrate and a first mold cover formed on the first packaging substrate, wherein the first mold cover has a first notch at its periphery; and a second electronic package, which includes a second packaging substrate and a second mold cover formed on the second packaging substrate, wherein the second mold cover has a second notch at its periphery that matches the first notch in shape; wherein the first mold cover is connected to the second mold cover by an adhesive material, wherein the first notch of the first mold cover is adjacent to the second notch of the second mold cover.

[0006] According to another aspect of the present application, the present invention provides a method for forming an electronic package assembly. The method includes: providing a first electronic package, which includes a first package substrate and a first mold cover formed on the first package substrate, wherein the first mold cover has a first notch at its periphery; and providing a second electronic package, which includes a second package substrate and a second mold cover formed on the second package substrate, wherein the second mold cover has a second notch at its periphery that matches the first notch in shape; and connecting the first mold cover with the second mold cover by an adhesive material, so that the first notch of the first mold cover is adjacent to the second notch of the second mold cover.

[0007] It should be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and do not limit the present invention. In addition, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings referred to herein form part of the specification. Unless the detailed description explicitly indicates otherwise, the features shown in the drawings only illustrate some embodiments of the present application, not all embodiments of the present application, and readers of this specification should not make contrary inferences.

[0009] Figure 1 A cross-sectional view of an electronic package assembly 100 according to a first embodiment of the present application is shown.

[0010] Figure 2 A top view of an electronic package assembly 200 according to a second embodiment of the present application is shown.

[0011] Figure 3 A cross-sectional view of an electronic package assembly 300 according to a third embodiment of the present application is shown.

[0012] Figures 4A to 4G Various steps of a method for manufacturing an electronic package assembly according to an embodiment of the present application are shown.

[0013] The same reference numbers will be used throughout the drawings to refer to the same or like parts. DETAILED DESCRIPTION

[0014] The following detailed description of exemplary embodiments of the present application refers to the accompanying drawings that form a part of the description. The drawings illustrate specific exemplary embodiments in which the present application can be practiced. The detailed description including the drawings describes these embodiments in sufficient detail to enable a person skilled in the art to practice the present application. A person skilled in the art may further utilize other embodiments of the present application and make logical, mechanical and other changes without departing from the spirit or scope of the present application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiments of the present application.

[0015] In this application, unless otherwise expressly stated, the use of the singular includes the plural. In this application, unless otherwise expressly stated, the use of "or" means "and / or". In addition, the use of the term "comprising" and other forms is not limiting. In addition, unless otherwise expressly stated, terms such as "element" or "component" cover both elements and components that contain one unit and elements and components that contain more than one subunit. In addition, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0016] As used herein, for ease of description, spatially relative terms such as "under," "below," "above," "above," "up," "upper," "lower," "left," "right," "vertical," "horizontal," "side," etc. may be used herein to describe the relationship of one element or feature to another element (or elements) or feature (or features), as shown in the drawings. In addition to the orientation depicted in the drawings, spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. It should be understood that when an element is referred to as being "connected to" or "coupled to" another element, the element may be directly connected to or coupled to the other element, or there may be intermediate elements.

[0017] Figure 1 A cross-sectional view of an electronic package assembly 100 according to a first embodiment of the present application is shown. The electronic package assembly 100 may include various electronic components and a substrate for mounting such electronic components.

[0018] like Figure 1 As shown, the electronic package assembly 100 includes a first electronic package 101, which further includes a first package substrate 102 and a first mold cover 103 formed on the first package substrate 102. Various electronic components can be mounted on the first package substrate 102 and encapsulated by the first mold cover 103. In an embodiment, the first mold cover 103 has a first notch at its periphery, and the first notch removes a portion of the first mold cover 103, but may not expose any electronic components.

[0019] The electronic package assembly 100 further includes a second electronic package 111, which further includes a second package substrate 112 and a second mold cover 113 formed on the second package substrate 112. Similar to the first mold cover 103, the second mold cover 113 also has a second notch at its periphery. The second notch can match the first notch of the first mold cover 103 in shape so that the second mold cover 113 can be attached to the first mold cover 103. In this embodiment, the second electronic package 111 is substantially aligned with the first notch of the first mold cover 103 so that it can be mounted on the first electronic package 101, or specifically, the first mold cover 103 can be connected to the second mold cover 113 by an adhesive material. When the first electronic package 101 and the second electronic package 111 are connected together, the first notch of the first mold cover 103 is adjacent to the second notch of the second mold cover 113.

[0020] In some embodiments, the first electronic package 101 may have a larger size so that it can be used as a main module in the entire electronic package assembly 100, while the second electronic package 111 may have a smaller size so that it can be used as an auxiliary module, which is functionally coordinated with the first electronic package 101 and may not be packaged together with the second electronic package 111. For example, the first electronic package 101 may include electronic components that may have a larger size, such as signal processing components, power supply components, etc., while the second electronic package 111 may include an antenna or image sensor that may have a smaller size. However, it can be understood that various other types of electronic components can be installed in either the first electronic package 101 or the second electronic package 111.

[0021] exist Figure 1 In the illustrated embodiment, the first electronic package 101 further includes at least one first electronic component 121a mounted on the first package substrate 102. Among them, one or more first electronic components 121a may be close to the first notch and disposed between the first notch and the first package substrate 102. In addition, the second electronic package 111 further includes at least one second electronic component 122 mounted on the second package substrate 112. Among them, one or more second electronic components 122 may be close to the second notch and disposed between the second notch and the second package substrate 112. In some embodiments, the first electronic component 121a may include an electronic component with a smaller size, such as a resistor or a capacitor. Similarly, the size of the second electronic component 122 may also be smaller, such as an antenna. Therefore, although the molding material is removed at the first notch and the second notch, respectively, the smaller first electronic component 121a and the second electronic component 122 can be completely encapsulated by the corresponding molding materials of the first mold cover 103 and the second mold cover 113, and are therefore protected from environmental influences.

[0022] In this embodiment, the first electronic package 101 further includes at least one third electronic component 121b mounted on the first package substrate 102. Figure 1 In the illustrated embodiment, the third electronic component 121b is far away from the first notch, that is, the third electronic component 121b is not between the first notch and the first packaging substrate 102. In some embodiments, the first electronic component 121a and the third electronic component 121b can be placed at random positions of the first packaging substrate 102. For example, in some cases, the third electronic component 121b can be placed at the center of the first packaging substrate 102, and in other cases, the third electronic component 121b can be placed at other positions of the first packaging substrate 102.

[0023] In addition, the third electronic component 121b is electrically connected to the interconnection wire embedded in the first package substrate 102 via a plurality of solder bumps 150a. The material of the bumps may be Al, Sn, Ni, Au, Ag, lead (Pb), bismuth (Bi), Cu or a combination thereof, and an optional flux solution. Similarly, the first electronic component 121a and the second electronic component 122 may be mounted on the first package substrate 102 and the second package substrate 112, respectively, via solder bumps.

[0024] In this embodiment, the height of at least one third electronic component 121b may be greater than the height of the first electronic component 121a. In other embodiments, the position and size of the third electronic component 121b and the first electronic component 121a may be changed according to the actual needs of the device. For example, the third electronic component 121b may be placed at the edge of the first package substrate 102, and the second electronic package does not need to be placed at the edge. In this embodiment, the third electronic component 121b may include electronic components such as semiconductor chips or other key functional modules. The third electronic component 121b and the first electronic component 121a connected together by interconnects embedded in the first package substrate 102 are used together as the main functional electronic device in the entire electronic package assembly 100. Similarly, the second electronic component 122 may include electronic components such as resistors, capacitors or antennas, which are used as coupling electronic devices that are functionally coordinated with the third electronic component 121b and the first electronic component 121a on the first package substrate 102. In some embodiments, the electronic devices on the first packaging substrate 102 may not be electrically coupled with the electronic devices on the second packaging substrate 112, while in some other embodiments, the electronic devices on the first packaging substrate 102 may be electrically coupled with the electronic devices on the second packaging substrate 112, which will be described in detail below.

[0025] like Figure 1As shown, the first electronic components 121a may also have different heights. More specifically, the height of the first electronic components 121a installed closer to the periphery of the first package substrate 102 may be smaller than the height of the first electronic components 121a installed relatively farther from the periphery of the first package substrate 102, so that the height of the electronic components of the first package substrate 102 decreases from the third electronic components 121b to the first electronic components 121a closer to the periphery of the first package substrate 102. In some other embodiments, the height of at least one third electronic component 121b may be greater than the height of the first electronic component 121a, and the first electronic components 121a may have the same height, or may have irregular and different heights according to various layouts of the first electronic package 101. However, since the height of the electronic components at or near the periphery of the first electronic package 101 is smaller, more space filled with molding material is formed above the first electronic components 121a compared to the space above the third electronic components 121b.

[0026] In this embodiment, the first mold cover 103 formed on the first packaging substrate 102 covers the corresponding front surfaces of the first electronic component 121a and the third electronic component 121b, as well as the front surface of the first packaging substrate 102 where no electronic components are installed. The first mold cover 103 is used to protect the first electronic component 121a and the third electronic component 121b from any potential contamination during the subsequent manufacturing or testing process, thereby ensuring better electrical performance and electrical reliability. The material of the first mold cover 103 includes polymers such as epoxy resin, polyimide, acrylic resin, and ceramics such as aluminum oxide, aluminum nitride, etc. Similarly, the second mold cover 113 formed on the second packaging substrate 112 covers the front surface of the second electronic component 122, as well as the front surface of the second packaging substrate 112 where the second electronic component 122 is not installed.

[0027] exist Figure 1In the illustrated embodiment, the first electronic package 101 is placed adjacent to the second electronic package 111, and the first notch of the first mold cover 103 matches the second notch of the second mold cover 113 to ensure that the first electronic package 101 and the second electronic package 111 are matched and placed in coordination with each other. More specifically, for the first electronic package 101, since the height of the electronic components of the first package substrate 102 decreases from the third electronic component 121b to the first electronic component 121a near the periphery of the first package substrate 102, there is more unused space above the first electronic component 121a at the periphery of the first package substrate 102. Such space (i.e., the first notch) can be used to place or attach the second electronic package 111 instead of molding material. In some embodiments, the first notch of the first mold cover 103 includes a first bevel 104, which also has a corresponding downward trend in the height direction of the first electronic package 101. As described above, since the height of the first electronic component 121a is less than the height of the third electronic component 121b installed away from the periphery of the first packaging substrate 102, this shape of the first notch saves the excess molding material above the first electronic component 121a installed near the periphery of the first packaging substrate 102. In addition, this notch with a bevel shape can be formed by a relatively simple method.

[0028] Accordingly, the second notch of the second mold cover 113 may include a second oblique side 114. The surface of the second oblique side 114 may be substantially the same as the surface of the first oblique side 104 of the first mold cover 103, so that the second oblique side and the first oblique side may be connected to each other. In some embodiments, the first oblique side 104 may have a first angle relative to the first package substrate 102, the second oblique side 114 may have a second angle relative to the second package substrate 112, and the sum of the first angle and the second angle may be 90 degrees. Therefore, when attached together, the first package substrate 102 is perpendicular to the second package substrate 112. However, it can be understood that the first notch and the second notch of other shapes can be formed for the first mold cover and the second mold cover. For example, the first oblique side 104 may have a first angle relative to the first package substrate 102, and the second oblique side 114 may have a second angle relative to the second package substrate 112. The sum of the first angle and the second angle may be 90 degrees, and the first angle is less than the second angle, so that the height of the first electronic component 121a closer to the first notch of the first mold cover 103 can be less than the height of the second electronic component 122. In some other embodiments, the first angle is greater than the second angle, so that the height of the first electronic component closer to the first notch of the first mold cover may be greater than the height of the second electronic component.

[0029] Additionally, in some embodiments, the first mold cap 103 and the second mold cap 113 may together form a flat top surface on which other structures of the electronic package assembly 100 may be formed. For example, the shielding layer 130 may be formed at least on the flat top surface above the first mold cap 103 and the second mold cap 113, which may help protect other portions of the electronic package assembly 100 from electromagnetic interference. In some instances, the shielding layer 130 may extend to structures adjacent to the mold caps and / or other surfaces of the mold caps (e.g., lateral surfaces). The first mold cap 103 may be connected to the second mold cap 113 by an adhesive material such that a first notch of the first mold cap 103 is adjacent to a second notch of the second mold cap 113. Figure 1 In the illustrated embodiment, the adhesive material includes a non-conductive material. In some other embodiments, the first mold cover and the second mold cover may have conductive pillars embedded therein, and the adhesive material may include a conductive tape such as anisotropic conductive film, thereby realizing an additional electrical connection path between the first electronic component and the second electronic component. Among them, this assembly method of the first electronic package 101 and the second electronic package 111 makes good use of the redundant space above the first electronic component 121a to accommodate the second electronic component 122, thereby improving the integration density and integration level of the electronic device.

[0030] Understandably, Figure 1 The embodiment shown is only a cross-section of the electronic package assembly 100, and the electronic package assembly 100 may be Figure 1 In some other examples, the first notch of the first mold cover may include a first stepped edge that matches the different heights of the third electronic component and the first electronic component. Correspondingly, the second notch of the second mold cover may include a second stepped edge that matches the first stepped edge. The first stepped edge and the second stepped edge may be disposed at the periphery of the first mold cover and the second mold cover, similar to Figure 1 In some embodiments, the first stepped edge and the second stepped edge may be disposed at any position around the third electronic component.

[0031] In the present embodiment, the first packaging substrate 102 and the second packaging substrate 112 may be made of a flexible material such as a polymer, and both have interconnection lines embedded therein. The first electronic component 121a mounted on the first packaging substrate 102 is electrically connected to the interconnection line in the first packaging substrate 102, and the (one or more) second electronic components 122 mounted on the second packaging substrate 112 are electrically connected to the interconnection line in the second packaging substrate 112. In some embodiments, the electronic components on the first packaging substrate 102 and the second packaging substrate 112 may not be electrically coupled to each other, but in some other embodiments, these electronic components may be electrically coupled to each other, which will be described in detail below.

[0032] like Figure 1 As shown, for example, the electronic package assembly 100 further includes a first bonding substrate 141, which is mounted on the rear surface of the first package substrate 102 through a solder bump 150b and is placed away from the first mold cover 103. That is, the first bonding substrate 141 and the first mold cover 103 may be formed on opposite sides of the first package substrate 102. In addition, in some embodiments, the first bonding substrate 141 may extend along a portion of the rear surface of the first package substrate 102, rather than extending across the entire length or width of the rear surface of the first package substrate 102. Therefore, a portion of the solder bump 150d may not be covered by the first bonding substrate 141, and the solder bump 150d may be used to attach the first package substrate 102 to another substrate or another device and achieve electrical connection, so that the entire electronic package assembly 100 is mounted on the other substrate or another device. In some alternative embodiments, the first bonding substrate 141 may extend across the first package substrate 102 in at least one of the longitudinal direction and the lateral direction of the first package substrate 102.

[0033] In addition, the second bonding substrate 142 can be mounted on the rear surface of the second encapsulation substrate 112 and placed away from the second mold cover 113 through the solder bump 150c. That is, the second bonding substrate 142 and the second mold cover 113 can be formed on opposite sides of the second encapsulation substrate 112. The first bonding substrate 141 and the second bonding substrate 142 can be connected to each other via a flexible bonding member 143, and the flexible bonding member can have a built-in wire for electrically coupling the first bonding substrate 141 and the second bonding substrate 142, and in some cases, the flexible bonding member may not have such a built-in wire. In some embodiments, the first bonding substrate 141, the second bonding substrate 142 and the flexible bonding member 143 may be a polymer tape or sheet with interconnects embedded therein or coated thereon. In this way, the third electronic component 121b, the first electronic component 121a mounted on the first encapsulation substrate 102 and the second electronic component 122 mounted on the second encapsulation substrate 112 can be electrically connected to each other, thereby forming an integrated electronic device.

[0034] In some embodiments, the length of the second electronic component 122 is less than the length of the first electronic component 121a, so the length of the second mold cover 113 covering the second electronic component 122 is also less than the length of the first mold cover 103. Accordingly, the first notch may not extend across the entire width of the first mold cover 103, that is, the first notch may only occupy a corner of the first mold cover 103. In some other embodiments, as long as there is no interference between the components, the first electronic component 121a, the second electronic component 122, the first mold cover 103, and the second mold cover 113 can be sized and arranged according to the actual needs of the electronic packaging assembly 200.

[0035] Figure 2 A cross-sectional view of an electronic package assembly 200 according to a second embodiment of the present application is shown.

[0036] like Figure 2 As shown, the electronic package assembly 200 includes a first electronic package having a first package substrate and a first mold cover 203. The first mold cover 203 has two first notches at its periphery. The electronic package assembly 200 further includes two second electronic packages 211, wherein each second electronic package 211 has a second package substrate 212 and a second mold cover 213 formed on the second package substrate 212. The second mold cover 213 has a second notch at its periphery, and the second notch matches the first notch in shape. The first mold cover 203 is connected to the second mold cover 213 by an adhesive material, wherein the first notch of the first mold cover 203 is adjacent to the second notch of the second mold cover 213.

[0037] In this embodiment, the first electronic package further includes at least one third electronic component 221b mounted on the first packaging substrate, and the third electronic component 221b is far away from the first notch, that is, the third electronic component 221b is not between the first notch and the first packaging substrate 202. The first electronic package also includes a first electronic component 221a mounted on the first packaging substrate and between the first notch and the first packaging substrate. In addition, each second electronic package 211 further includes a second electronic component 222 mounted on the second packaging substrate 212 and between the corresponding second notch and the second packaging substrate 212.

[0038] exist Figure 2 In the illustrated embodiment, two first oblique edges 204 may be formed on two opposite edges of the first mold cover 103, and the two first oblique edges 204 have a mirror image layout to receive two second electronic packages 211. The two second electronic packages 211 and Figure 1 The first mold cover may include a plurality of first bevels at different positions thereof to accommodate more second electronic packages and more second electronic components, which can further improve the space utilization of the electronic package assembly. The first bevels may have the same size or shape, or different sizes or shapes.

[0039] In addition, if Figure 2As shown, the electronic packaging assembly 200 further includes a first bonding substrate 241, which is mounted on the rear surface of the first packaging substrate 202 and is placed away from the first mold cover 203. In addition, two second bonding substrates 242 are mounted on the rear surfaces of the corresponding two second packaging substrates 212 and are placed away from the second mold cover 213. The first bonding substrate 241 and the second bonding substrate 242 can be connected to each other via a flexible bonding member 243, and the flexible bonding member can have built-in wires for electrically coupling the first bonding substrate 241 and the second bonding substrate 242, and in some cases, the flexible bonding member may not have such built-in wires. In some embodiments, the first bonding substrate 241 can be an integrally formed structure, and the two second bonding substrates 242 arranged in a mirror image can share the first bonding substrate 241. Different from this, in some other embodiments, each second bonding substrate 242 can be connected to a first bonding substrate 241 respectively, and the first bonding substrates 241 can be separated from each other or connected to each other.

[0040] Figure 3 A cross-sectional view of an electronic package assembly 300 according to a third embodiment of the present application is shown.

[0041] like Figure 3 As shown, the electronic package assembly 300 includes a first electronic package 301 and a second electronic package 311 assembled together. The first package substrate 302 of the first electronic package 301 further includes a cavity on its rear side for receiving a first bonding substrate 341, so that the first package substrate 302 and the first bonding substrate 341 together form a flat bottom surface of the electronic package assembly 300. Similarly, the second package substrate 312 of the second electronic package 311 further includes a cavity for receiving a second bonding substrate 342, so that the second package substrate 312 and the second bonding substrate 342 together form a flat side surface of the electronic package assembly 300. In this way, the dimensions of the electronic package assembly 300 in both the longitudinal and lateral directions thereof can be further reduced, and a structure of a generally regular shape, i.e., a rectangular block, can be formed. Similar to Figure 1 In the electronic package assembly 100 shown, the first electronic package 301 further includes a first mold cover 303 formed on the first package substrate 302, and the first mold cover 303 has a first notch at its periphery. In addition, the second electronic package 311 further includes a second mold cover 313 formed on the second package substrate 312, and the second mold cover 313 has a second notch at its periphery that matches the first notch in shape. The first mold cover 303 is connected to the second mold cover 313 by an adhesive material, and the first notch of the first mold cover 303 is adjacent to the second notch of the second mold cover 313.

[0042] Figures 4A to 4GThe various steps of the method for manufacturing an electronic packaging assembly according to an embodiment of the present application are shown. For example, the method can be used to manufacture Figure 1 The electronic package assembly 100 shown in FIG. Figures 4A to 4G The method is described in more detail.

[0043] like Figure 4A As shown, the first package substrate 402 has an embedded interconnection line. The third electronic component 421b is attached to the front surface of the first package substrate 402. In this example, a plurality of bumps 450a are formed on the conductive pattern exposed from the front surface of the first package substrate 402, for attaching the third electronic component 421b to the first package substrate 402. Among them, a plurality of first electronic components 421a are also mounted on the front surface of the first package substrate 402, and the plurality of first electronic components 421a are located around the third electronic component 421b. Among them, the height of the first electronic component 421a is less than the height of the third electronic component 421b. The first electronic component 421a is also electrically connected to the interconnection line in the first package substrate 402.

[0044] Then, if Figure 4B As shown, the first mold cap 403 is formed on the front surface of the first package substrate 402 using a molding process such as an injection molding process, and the first mold cap 403 covers and encapsulates the corresponding top surfaces of the first electronic component 421a and the third electronic component 421b. In addition, at least one periphery of the first mold cap 403 is removed and a first notch without molding material is formed. In some embodiments, the first notch can also be formed during the molding process, that is, using a mold groove with a corresponding protrusion cavity. In some other embodiments, the first notch can be formed after the molding process, for example, using a cutting process or a mechanical sawing process to form the first electronic package 401. In some embodiments, the first bevel 404 can be formed at the periphery of the first mold cap 403 to form the first notch. In other embodiments, multiple first bevels can also be formed at multiple locations of the periphery of the first mold cap. In some embodiments, the first mold cap 403 can undergo a laser marking process to ensure that the electronic components encapsulated by the first mold cap 403 can be accurately positioned in subsequent processes.

[0045] like Figure 4C As shown, the second package substrate 412 has embedded interconnects. The second electronic component 422 is mounted on the front surface of the second package substrate 412. Figure 4DAs shown, the second mold cover 413 is formed on the front surface of the second package substrate 412 using a molding process, and the second mold cover encapsulates the second electronic component 422. The second notch can be formed at at least one position of the periphery of the second mold cover 413, thereby forming the second electronic package 411. The shape and size of the second notch can correspond to the shape and size of the first notch of the first mold cover 403. In this embodiment, the second notch can include a second bevel 414 that matches the first bevel 404 of the first mold cover 403.

[0046] Then, if Figure 4E As shown, a joint assembly 446 is provided. The joint assembly 446 has a first joint substrate 441 and a second joint substrate 442 connected to each other by a flexible joint member 443. Figure 4F As shown, the first electronic package 401 is loosely assembled with the second electronic package 411 through the bonding component 446. Specifically, the first bonding substrate 441 is mounted on the rear surface of the first packaging substrate 402 via the conductive bump 450b and is placed away from the first mold cover 403; the second bonding substrate 442 is mounted on the rear surface of the second packaging substrate 412 via the conductive bump 450c and is placed away from the second mold cover 413.

[0047] like Figure 4G As shown, the first notch of the first mold cover 403 is placed adjacent to the second notch of the second mold cover 413 by bending the flexible joint 443. The first mold cover 403 is then connected to the second mold cover 413 by an adhesive material, so that the first notch of the first mold cover 403 is adjacent to the second notch of the second mold cover 413. After the first mold cover 403 is connected to the second mold cover 413 by an adhesive material, the first packaging substrate 402 can be perpendicular to the second packaging substrate 412, and at the same time, the first mold cover 403 and the second mold cover 413 together form a flat top surface. Subsequently, the shielding layer 430 can be formed at least on the flat top surface, and the shielding layer 430 can also be optionally formed on its lateral surface, thereby forming the electronic packaging assembly 400. In some examples, the shielding layer 430 can extend to the structure adjacent to the mold cover and / or other surfaces (e.g., lateral surfaces) of the mold cover.

[0048] Although exemplary electronic package assemblies of the present application have been described in conjunction with the corresponding drawings, those skilled in the art will appreciate that modifications and adaptations may be made to the electronic package assemblies without departing from the scope of the present invention.

[0049] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes may be made to these embodiments, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the appended claims. In addition, other embodiments will be apparent to those skilled in the art by considering the specification and practice of one or more embodiments of the invention disclosed herein. Therefore, it is intended that the present application and the examples herein be considered merely exemplary, with the true scope and spirit of the invention being indicated by the enumeration of the appended exemplary claims.

Claims

1. An electronic packaging component, characterized in that: The electronic packaging assembly comprises: a first electronic package, the first electronic package comprising a first package substrate and a first mold cover formed on the first package substrate, wherein the first mold cover has a first notch at a periphery thereof; and a second electronic package, the second electronic package comprising a second package substrate and a second mold cover formed on the second package substrate, wherein the second mold cover has a second notch at its periphery that matches the first notch in shape; The first mold cover is connected to the second mold cover by an adhesive material, and the first notch of the first mold cover is adjacent to the second notch of the second mold cover.

2. The electronic packaging assembly according to claim 1, characterized in that: The first notch includes a first bevel, and the second notch includes a second bevel.

3. The electronic packaging assembly according to claim 2, characterized in that: The first packaging substrate is perpendicular to the second packaging substrate.

4. The electronic packaging assembly according to claim 1, characterized in that: The first electronic package further includes a first electronic component mounted on the first packaging substrate and between the first notch and the first packaging substrate, and the second electronic package further includes a second electronic component mounted on the second packaging substrate and between the second notch and the second packaging substrate.

5. The electronic packaging assembly according to claim 4, characterized in that: The first electronic package further includes at least one third electronic component mounted on the first package substrate, the third electronic component is not between the first notch and the first package substrate, and wherein a height of the third electronic component is greater than a height of the first electronic component.

6. The electronic packaging assembly according to claim 1, characterized in that: The first mold cover and the second mold cover together form a planar top surface, and the electronic package assembly further includes a shielding layer formed at least on the planar top surface.

7. The electronic packaging assembly according to claim 1, characterized in that: The electronic packaging assembly further includes a first bonding substrate mounted on the first packaging substrate and away from the first mold cover, and a second bonding substrate mounted on the second packaging substrate and away from the second mold cover, wherein the first bonding substrate and the second bonding substrate are connected to each other via a flexible bonding member.

8. The electronic packaging assembly according to claim 7, characterized in that: The first packaging substrate further includes a cavity for receiving the first bonding substrate such that the first packaging substrate and the first bonding substrate together form a flat bottom surface.

9. The electronic packaging assembly according to claim 7, characterized in that: The second packaging substrate further includes a cavity for receiving the second bonding substrate, such that the second packaging substrate and the second bonding substrate together form a flat side surface.

10. The electronic packaging assembly according to claim 7, characterized in that: The first bonding substrate extends across the first packaging substrate in at least one of a longitudinal direction and a lateral direction of the first packaging substrate.

11. A method of forming an electronic package assembly, characterized in that: The method comprises: Providing a first electronic package, the first electronic package comprising a first package substrate and a first mold cover formed on the first package substrate, wherein the first mold cover has a first notch at a periphery thereof; and providing a second electronic package, the second electronic package comprising a second package substrate and a second mold cover formed on the second package substrate, wherein the second mold cover has a second notch at its periphery that matches the first notch in shape; and The first mold cover is connected to the second mold cover by an adhesive material so that the first notch of the first mold cover is adjacent to the second notch of the second mold cover.

12. The method according to claim 11, characterized in that The first mold cover and the second mold cover are formed using a molding process.

13. The method according to claim 11, characterized in that Before connecting the first mold cover and the second mold cover by an adhesive material, the method further comprises: providing a joint assembly having a first joint substrate and a second joint substrate connected to each other via a flexible joint; mounting the first bonding substrate on the first packaging substrate and keeping the first bonding substrate away from the first mold cover; and The second bonding substrate is mounted on the second packaging substrate and the second bonding substrate is spaced away from the second mold cover.

14. The method according to claim 11, characterized in that The first notch includes a first bevel, and the second notch includes a second bevel.

15. The method according to claim 11, characterized in that After the first mold cover is connected to the second mold cover by an adhesive material, the first packaging substrate is perpendicular to the second packaging substrate.

16. The method according to claim 11, characterized in that The first electronic package further includes a first electronic component mounted on the first packaging substrate and between the first notch and the first packaging substrate, and the second electronic package further includes a second electronic component mounted on the second packaging substrate and between the second notch and the second packaging substrate.

17. The method according to claim 16, characterized in that The first electronic package further includes at least one third electronic component mounted on the first package substrate, the third electronic component is not between the first notch and the first package substrate, and wherein a height of the third electronic component is greater than a height of the first electronic component.

18. The method according to claim 11, characterized in that After connecting the first mold cover with the second mold cover by the adhesive material, the first mold cover and the second mold cover together form a flat top surface, and the method further comprises: A shielding layer is formed on at least the flat top surface.

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