Chip heat spreader and computer device

Abstract

The embodiment of the present application provides a chip radiator and computer equipment, the chip radiator includes: liquid cooling heat exchange cavity, which is arranged on the surface of the chip, the liquid cooling heat exchange cavity is filled with cooling liquid for absorbing heat generated by the chip; Evaporation phase change cavity, which is communicated with the liquid cooling heat exchange cavity; Liquid cooling cavity, which is arranged between the liquid cooling heat exchange cavity and the evaporation phase change cavity; The first vortex tube includes the first hot end for providing the hot gas flow of the first compressed gas, and the first cold end for providing the cold gas flow of the first compressed gas, wherein the first hot end extends to the evaporation phase change cavity and vaporizes part of the cooling liquid from the liquid cooling heat exchange cavity, and the first cold end extends to the liquid cooling cavity. The flow of the cooling liquid between the liquid cooling heat exchange cavity and the evaporation phase change cavity and the cooling of the cooling liquid flowing to the liquid cooling heat exchange cavity can be realized, so that the heat exchange efficiency is improved, and the heat dissipation capacity of the chip radiator is improved.

Description

Technical Field

[0001] This application relates to the field of computer technology, specifically to a chip heat sink and a computer device. Background Technology

[0002] As chip computing power increases, chip power consumption also increases. This increased power consumption leads to greater heat generation during chip operation, placing higher demands on the heat dissipation capabilities of chip heat sinks. Therefore, improving the heat dissipation capacity of chip heat sinks has become a pressing issue for those skilled in the art. Summary of the Invention

[0003] In view of this, embodiments of this application provide a chip heat sink and a computer device to improve the heat dissipation capacity of the chip heat sink.

[0004] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0005] This application provides a chip heat sink, including:

[0006] A liquid-cooled heat exchange chamber is disposed on the surface of the chip. The liquid-cooled heat exchange chamber is filled with coolant for absorbing the heat generated by the chip. The liquid-cooled heat exchange chamber includes a first inlet for inputting the coolant and a first outlet for outputting the coolant.

[0007] An evaporation phase change chamber, connected to the liquid-cooled heat exchange chamber, includes a second liquid inlet and a second liquid outlet. The second liquid inlet receives coolant from the first liquid outlet of the liquid-cooled heat exchange chamber, and the second liquid outlet transfers the coolant stored in the evaporation phase change chamber to the first liquid inlet of the liquid-cooled heat exchange chamber.

[0008] A liquefaction cooling chamber is provided between the liquid-cooled heat exchange chamber and the evaporation phase change chamber;

[0009] The first vortex tube includes a first hot end that provides a hot gas flow of the first compressed gas and a first cold end that provides a cold gas flow of the first compressed gas, wherein the first hot end extends to the evaporation phase change chamber and vaporizes a portion of the coolant from the liquid-cooled heat exchange chamber, and the first cold end extends to the liquefaction cooling chamber.

[0010] Optionally, it also includes: an air-cooled convection cavity surrounding the liquid-cooled heat exchange cavity, the liquefaction cooling cavity, and the chip;

[0011] The second vortex tube includes a second hot end that provides a hot gas flow of the second compressed gas and a second cold end that provides a cold gas flow of the second compressed gas, wherein the second hot end extends to the evaporation phase change cavity and vaporizes a portion of the coolant from the liquid-cooled heat exchange cavity, and the second cold end extends to the air-cooled convection cavity.

[0012] Optionally, it also includes: a first liquid cooling channel, connecting the second liquid outlet of the evaporation phase change chamber to the first liquid inlet of the liquid cooling heat exchange chamber;

[0013] The second liquid cooling channel connects the first liquid outlet of the liquid cooling heat exchange chamber to the second liquid inlet of the evaporation phase change chamber.

[0014] Optionally, the second liquid cooling channel includes:

[0015] A check valve is installed at the second inlet of the evaporation phase change chamber connected to the second liquid cooling channel to prevent coolant backflow.

[0016] Optionally, the inner surface of the liquefaction cooling chamber is provided with a first heat dissipation fin;

[0017] The outer surface of the liquid-cooled heat exchange cavity is provided with a second heat dissipation fin;

[0018] The materials of the first heat dissipation fin and the second heat dissipation fin include aluminum or copper.

[0019] Optionally, the evaporation phase change chamber is located away from the liquid-cooled heat exchange chamber.

[0020] Optionally, it may also include: a housing;

[0021] The housing has a first housing space and an air-cooled convection cavity;

[0022] The evaporation phase change cavity and the first hot end are disposed in the first housing space.

[0023] Optionally, the second cold end of the second vortex tube is located in the side region of the air-cooled convection cavity, providing cold airflow to the side and bottom of the air-cooled convection cavity;

[0024] A first through hole is provided between the air-cooled convection cavity and the substrate where the chip is located, and the first through hole connects the air-cooled convection cavity and the outside of the housing.

[0025] Optionally, it also includes: a housing backplate disposed on the side of the substrate where the chip is located away from the chip; the housing backplate has a second housing space;

[0026] The surface of the substrate has a second through hole for connecting the air-cooled convection cavity and the second housing space.

[0027] Optional, also includes:

[0028] A first gas inlet is provided in the first vortex tube for inputting a first compressed gas into the first vortex tube.

[0029] The second gas inlet is located in the second vortex tube and is used to input the second compressed gas into the second vortex tube.

[0030] Optionally, the boiling point of the coolant is 40 to 50 degrees Celsius;

[0031] The first compressed gas and the second compressed gas are gases that do not condense or frost when at -60 degrees Celsius;

[0032] The materials of the first vortex tube and the second vortex tube include stainless steel or copper.

[0033] This application also provides a computer device, including the chip heat sink described above.

[0034] The chip heat sink provided in this application includes: a liquid-cooled heat exchange chamber disposed on the surface of the chip, which can absorb the heat generated by the chip through the coolant filled in the liquid-cooled heat exchange chamber, and the coolant enters and exits the liquid-cooled heat exchange chamber through a first inlet and a first outlet; an evaporation phase change chamber connected to the liquid-cooled heat exchange chamber, specifically, the evaporation phase change chamber has a second inlet connected to the first outlet of the liquid-cooled heat exchange chamber, which can receive the coolant from the liquid-cooled heat exchange chamber, and a second outlet connected to the first inlet of the liquid-cooled heat exchange chamber, which can transfer the coolant stored in the evaporation phase change chamber to the liquid-cooled heat exchange chamber; a liquefaction cooling chamber is disposed between the liquid-cooled heat exchange chamber and the evaporation phase change chamber, which can cool the coolant transferred between the liquid-cooled heat exchange chamber and the evaporation phase change chamber; and a first vortex tube. The device includes a first hot end that provides a hot gas flow of the first compressed gas and a first cold end that provides a cold gas flow of the first compressed gas. The first hot end extends to the evaporation phase change chamber and vaporizes a portion of the coolant from the liquid-cooled heat exchange chamber. The first cold end extends to the liquefaction cooling chamber. Thus, the cold gas flow provided by the first cold end of the first vortex tube extending to the liquefaction cooling chamber can cool the coolant (including the coolant flowing to the liquid-cooled heat exchange chamber) transferred between the liquid-cooled heat exchange chamber and the evaporation phase change chamber. The hot gas flow provided by the first hot end of the first vortex tube extending to the evaporation phase change chamber can vaporize a portion of the coolant in the evaporation phase change chamber. This causes the unvaporized portion of the coolant in the evaporation phase change chamber to flow from the evaporation phase change chamber to the liquid-cooled heat exchange chamber and then back from the liquid-cooled heat exchange chamber, thus achieving a circulating flow of the coolant.

[0035] As can be seen, the chip heat sink combines a liquid-cooled heat exchange chamber, a liquefaction cooling chamber, an evaporation phase change chamber, and a first vortex tube. The heat of the chip is conducted through the liquid-cooled heat exchange chamber filled with coolant, and the coolant is cooled by the cold airflow provided by the first cold end of the first vortex tube in the evaporation phase change chamber. The hot airflow provided by the first hot end of the first vortex tube in the evaporation phase change chamber vaporizes part of the coolant. This can realize the flow of coolant between the liquid-cooled heat exchange chamber and the evaporation phase change chamber, as well as the cooling of the coolant flowing to the liquid-cooled heat exchange chamber, thereby improving the heat exchange efficiency and enhancing the heat dissipation capacity of the chip heat sink. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the chip heat sink provided in the embodiments of this application;

[0038] Figure 2 A schematic diagram of a connection structure between a vortex tube and a gas generating device provided in an embodiment of this application;

[0039] Figure 3 A schematic diagram of another connection structure between the vortex tube and the gas generating device provided in an embodiment of this application;

[0040] Figure 4 This is another schematic diagram of the chip heat sink provided in an embodiment of this application. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] As chip computing power increases, chip power consumption also increases. Increased power consumption leads to more heat generation during chip operation, which places higher demands on the heat dissipation capacity of chip heat sinks. Chip heat sinks have gradually become one of the key bottlenecks in improving chip performance.

[0043] Chip heat sinks are mainly classified into three categories: air-cooled heat sinks, cold plate heat sinks, and air-liquid hybrid heat sinks.

[0044] When air-cooled heatsinks dissipate heat from chips, they rely on heat convection from the surrounding air. Therefore, their cooling capacity is limited by the ambient air temperature, fluctuating with temperature variations, and exhibiting a low upper limit and narrow temperature range. Air-cooled heatsinks must be paired with fans. Under high-power cooling conditions, the fans operate at high speeds for extended periods, increasing their susceptibility to damage and increasing overall system power consumption.

[0045] Cold plate heat sinks cannot cool chips on their own; they must be paired with complex liquid cooling supply devices and flow control systems. The multi-level connection of the system poses a risk of leakage during long-term operation, and the infrastructure costs and maintenance requirements are relatively high.

[0046] A hybrid air-liquid radiator is a closed system that connects a water-cooling plate, heat sink, and fan in series through channels. It is essentially an extension of an air-cooled radiator and has all the disadvantages of both air-cooled and liquid-cooled radiators. Its heat dissipation capacity is also limited, and it is essentially still a form of passive heat dissipation.

[0047] All three types of heat dissipation devices have a heat dissipation path from bottom to top, which is a single-direction heat conduction and cannot achieve simultaneous three-dimensional heat dissipation in four spatial dimensions: top, bottom, left, and right.

[0048] To improve the heat dissipation effect of the heat dissipation device, taking a chip heat sink as an example, this chip heat sink utilizes a high-velocity cold airflow to achieve a circulating cooling function. By setting one or more heat return pipes, the cold airflow can circulate back to the nozzle for the next heat exchange, realizing the circulating cooling and heating function of the vortex tube, effectively reducing the demand for cold airflow.

[0049] Based on the above description, there is an urgent need to invent a new type of heat dissipation device that is between traditional air cooling and liquid cooling. It should have the ease of use of air cooling and the high performance of liquid cooling, and at the same time have active low temperature cooling, fanless and power-free design, be unaffected by ambient temperature, have liquid circulation that does not require pump drive, be safe and reliable for long-term operation, and be leak-free.

[0050] To address the aforementioned problems, this application provides a chip heat sink that, by combining it with a liquid cooling device, allows for more rapid heat transfer from the chip to the coolant. The extremely low-temperature cold airflow further cools the coolant, resulting in faster cooling of the chip and significantly improved heat dissipation capacity. As an optional implementation, Figure 1 A schematic diagram of the chip heat sink provided in an embodiment of this application is shown. Figure 1 As shown in the embodiments of this application, the chip heat sink includes the following structure.

[0051] A liquid-cooled heat exchange chamber 210 is disposed on the surface of the chip. The liquid-cooled heat exchange chamber is filled with coolant for absorbing the heat generated by the chip. The liquid-cooled heat exchange chamber includes a first inlet and a first outlet. That is, the liquid-cooled heat exchange chamber receives and discharges coolant through the first inlet and the first outlet. Specifically, the first inlet receives coolant and the first outlet discharges coolant.

[0052] The liquefaction cooling chamber 220 is disposed between the liquid-cooled heat exchange chamber 210 and the evaporation phase change chamber 230.

[0053] The evaporation phase change chamber 230 is connected to the liquid-cooled heat exchange chamber 210 and includes a second inlet and a second outlet. The second inlet receives coolant from the liquid-cooled heat exchange chamber 210, and the second outlet transfers the coolant stored in the evaporation phase change chamber 230 to the liquid-cooled heat exchange chamber 210. In an optional implementation, the second inlet of the evaporation phase change chamber is connected to the first outlet of the liquid-cooled heat exchange chamber, receiving coolant from the first outlet; the second outlet of the evaporation phase change chamber is connected to the first inlet of the liquid-cooled heat exchange chamber, transferring the coolant stored in the evaporation phase change chamber to the liquid-cooled heat exchange chamber.

[0054] In an optional implementation, in order to improve the heat dissipation effect of the chip heat sink, the coolant is a liquid with a boiling point of 40 to 50 degrees Celsius.

[0055] The liquid-cooled heat exchange chamber 210 is used to absorb heat from the chip 100 using cooled coolant; wherein the coolant absorbing heat from the chip flows to the evaporation phase change chamber 230. Figure 1 As shown, in one optional implementation, the liquid-cooled heat exchange chamber 210 is in direct contact with the chip 100, and the heat of the chip 100 is conducted to the coolant through the outer shell of the chip 100 and the outer shell of the liquid-cooled heat exchange chamber 210.

[0056] In another alternative implementation, a thermally conductive medium is further filled between the chip 100 and the liquid-cooled heat exchange cavity 210. Figure 1 (Not shown in the image) to increase the thermal conductivity area between the chip 100 and the liquid-cooled heat exchange cavity 210, thereby improving heat transfer efficiency. In an optional implementation, the thermally conductive medium includes silicone grease.

[0057] The coolant undergoes a phase change within the evaporation phase change chamber 230, changing from a liquid to a gaseous state. The volume change after the coolant vaporizes creates a pressure difference between the evaporation phase change chamber 230 and the liquid-cooled heat exchange chamber 210, thereby driving the coolant to flow between the two chambers.

[0058] The liquefaction cooling chamber 220 is used to cool the coolant flowing between the evaporation phase change chamber 230 and the liquid-cooled heat exchange chamber 210. Figure 1 As shown, the liquefaction cooling chamber 220 is the area between the evaporation phase change chamber 230 and the liquid cooling heat exchange chamber 210.

[0059] The first vortex tube 310 includes a first hot end 311 that provides a hot gas flow of the first compressed gas and a first cold end 312 that provides a cold gas flow of the first compressed gas, wherein the first hot end 311 extends to the evaporation phase change chamber 230 and vaporizes a portion of the coolant from the liquid-cooled heat exchange chamber 210, and the first cold end 312 extends to the liquefaction cooling chamber 220.

[0060] It should be noted that a vortex tube is a tubular device capable of spontaneously generating localized cooling or heating effects, such as... Figure 1 As shown, a first gas inlet 314 is provided on the side of the first vortex tube 310, through which first compressed gas is introduced into the first vortex tube. Figure 1 (The source of the first compressed gas is not shown), so that the cold airflow of the first compressed gas and the hot airflow of the first compressed gas can be discharged at both ends of the first vortex tube respectively.

[0061] Because the vortex tube can simultaneously discharge cold and hot air streams from its two ends, the cold air stream discharged from the cold end can be used for cooling, while the hot air stream discharged from the hot end can be used for heating. Therefore, cooling equipment using the vortex tube does not require the addition of traditional coolants or additional heating devices.

[0062] Specifically, taking the first vortex tube 310 as an example, the operating principle of the vortex tube is as follows: A first compressed gas at room temperature and high pressure is input into the first gas inlet 314. The first compressed gas rapidly expands within the first gas inlet 314 and accelerates to the speed of sound, then enters the vortex chamber within the first vortex tube 310 tangentially, forming a free vortex. Within the free vortex, the closer the first compressed gas is to the center, the greater its angular velocity of rotation.

[0063] Furthermore, the high-speed rotating free vortex can simultaneously generate an upward-flowing, high-temperature hot airflow of the first compressed gas and a downward-flowing, low-temperature cold airflow of the first compressed gas. The hot airflow of the first compressed gas is drawn out from the first hot end 311. The cold airflow of the first compressed gas is drawn out from the first cold end 312. In an optional implementation, the first hot end 311 further includes a cold air blocking structure 316 for blocking cold air and allowing hot air to flow.

[0064] Furthermore, during the circulation of the coolant, the cold airflow of the first compressed gas provided by the first cold end 312 of the first vortex tube 310 is used at least to cool the coolant flowing towards the chip 100, thereby reducing the temperature of the coolant more quickly and thus cooling the chip 100 more rapidly. The hot airflow provided by the first hot end 311 of the first vortex tube 310 is used at least to vaporize the coolant that absorbs heat from the chip 100. In an optional implementation, the first cold end 312 further includes a hot air blocking structure 317 for blocking hot air and allowing cold air to circulate.

[0065] Thus, the chip heat sink provided in this embodiment combines a liquid-cooled heat exchange chamber 210, a liquefaction cooling chamber 220, an evaporation phase change chamber 230, and a first vortex tube 310. The liquid-cooled heat exchange chamber 210, filled with coolant, conducts heat from the chip 100. A cold airflow provided by the first cold end 312 of the first vortex tube 310 within the liquefaction cooling chamber 220 cools the coolant. A hot airflow provided by the first hot end 311 of the first vortex tube 310 within the evaporation phase change chamber 230 vaporizes a portion of the coolant. This allows for the flow of coolant between the liquid-cooled heat exchange chamber 210 and the evaporation phase change chamber 230, as well as the cooling of coolant flowing towards the liquid-cooled heat exchange chamber 210. Simultaneously, the first vortex tube 310 generates an extremely low-temperature cold airflow, which is lower in temperature than the gas generated by traditional air-cooled equipment or traditional chip heat sinks, allowing for faster temperature reduction of the coolant. Therefore, the chip heat sink provided in this embodiment improves heat exchange efficiency and enhances the heat dissipation capacity of the chip heat sink.

[0066] To further improve the heat dissipation performance of the chip heat sink provided in the embodiments of this application, in one optional implementation, such as Figure 1 As shown, the chip heat sink provided in this embodiment further includes: an air-cooled convection cavity 420 surrounding the liquid-cooled heat exchange cavity 210, the liquefaction cooling cavity 220, and the chip 100; a second vortex tube 320, including a second hot end 321 providing a hot airflow of the second compressed gas, and a second hot end 321 providing the second compressed gas ( Figure 1 The second cold end 322 is a cold gas flow (the source of the second compressed gas is not shown). The second hot end 321 extends to the evaporation phase change chamber and vaporizes part of the coolant from the liquid-cooled heat exchange chamber, and the second cold end 322 extends to the air-cooled convection chamber 420.

[0067] It should be noted that the structure, working principle, and materials of the second vortex tube 320, as well as the second compressed gas input to the second vortex tube 320, can be the same as the first compressed gas input to the first vortex tube 310. Both the second vortex tube 320 and the first vortex tube 310 are tubular devices that do not require the use of traditional coolants or heating devices to produce localized cooling or heating effects. The function of the second hot end 321 of the second vortex tube 320 is the same as the function of the first hot end 311 of the first vortex tube 310, both outputting hot airflow; the function of the second cold end 322 of the second vortex tube 320 is similar to the function of the first cold end 312 of the first vortex tube 310, both outputting cold airflow.

[0068] like Figure 1 As shown, in an optional implementation, the second hot end 321 of the second vortex tube 320 is also disposed within the evaporation phase change cavity 230. Thus, the second hot end 321 of the second vortex tube 320 functions the same as the first hot end 311 of the first vortex tube 310, both used to vaporize a portion of the coolant within the evaporation phase change cavity 230. Meanwhile, the second cold end 322 of the second vortex tube 320 can fill the chip 100 and the air-cooled convection cavity 420 with cold airflow, thereby making the heat dissipation of the chip 100 and the chip heat sink more comprehensive.

[0069] It should be noted that the first vortex tube 310 of the chip heat sink further includes a first gas inlet 314 for inputting the first compressed gas into the first vortex tube 310. The second vortex tube 320 further includes a second gas inlet 315 for inputting the second compressed gas into the second vortex tube 320. The first gas inlet 314 and the second gas inlet 315 are connected to a gas generating device outside the chip heat sink. The gas generating device is used to generate high-pressure, high-speed gas with a speed matching the requirements of the vortex tube, and inputs the high-pressure, high-speed gas into the first vortex tube 310 or the second vortex tube 320 through the first gas inlet 314. In an optional implementation, the first gas inlet 314 and the second gas inlet 315 can be connected to the same gas generating device.

[0070] In an optional implementation, the first gas inlet 314 and the second gas inlet 315 can be connected to the gas generating device in two ways, respectively as follows: Figure 2 and Figure 3 As shown.

[0071] In one alternative implementation, such as Figure 2As shown, taking the leftmost first vortex tube 310 and second vortex tube 320 as examples, the first gas inlet 314 is connected to the gas generating device 330 through the first gas pipe 331; the second gas inlet 315 is connected to the gas generating device 330 through the second gas pipe 332. That is, the first and second vortex tubes have independent gas pipes connected to the gas generating device, allowing the gas generating device to independently provide the first vortex tube with a first compressed gas and the second vortex tube with a second compressed gas. The first and second compressed gases can be the same or different. The housing 400 of the chip heat sink has an opening through which the first gas pipe 331 and the second gas pipe 332 extend into the housing 400 and bypass other structures to connect to the first gas inlet 314 and the second gas inlet 315.

[0072] Since the first gas inlet 314 and the second gas inlet 315 are respectively connected to different gas pipes of the gas generating device 330, the first gas vortex tube 310 and the second vortex tube 320 can be adjusted more independently and flexibly. For example, the airflow, temperature, pressure, etc. of the first gas vortex tube 310 or the second vortex tube 320 can be adjusted independently to optimize the working efficiency of the vortex tube. Therefore, it can be applied to chip heat sinks with high power and high load chip heat dissipation requirements.

[0073] In another alternative implementation, such as Figure 3As shown, taking the leftmost first vortex tube 310 and second vortex tube 320 as examples, the first gas inlet 314 and the second gas inlet 315 are connected to the gas generating device 330 through a third gas pipe 333. The housing 400 of the chip heat sink has an opening, through which the third gas pipe 333 extends into the housing 400 and bypasses other structures to connect with the first gas inlet 314 and the second gas inlet 315. At this time, the first gas inlet 314 and the second gas inlet 315 share a common gas source, that is, the first vortex tube and the second vortex tube have a common gas pipeline (i.e., the third gas pipeline 333) connected to the gas generating device 330. At this time, the first compressed gas and the second compressed gas can be the same. Specifically, the compressed gas provided by the gas generating device 330 is diverted to the first gas inlet 314 of the first vortex tube and the second gas inlet 315 of the second vortex tube after passing through the third gas pipeline 333. That is, the pipeline connected to the first vortex tube after the third gas pipeline 333 is the diversion pipeline of the first vortex tube, and the pipeline connected to the second vortex tube after the third gas pipeline 333 is the diversion pipeline of the second vortex tube. Thus, the compressed gas diverted to the first gas inlet 314 is the first compressed gas, and the compressed gas diverted to the second gas inlet 315 is the second compressed gas. Figure 3 The design structure is compared to Figure 2 The structure is simplified, with fewer gas pipes, reducing layout complexity and cost. Furthermore, the design of a shared third gas pipe 333 connecting the gas generation device simplifies the structure, reduces cost, and can be applied to chip heat sinks with low-power, low-load chip cooling requirements.

[0074] It should be noted that, in an optional implementation, a compressed gas control valve is further provided between the first gas inlet 314 and the second gas inlet 315 and the gas generating device, for controlling the gas flow rate of the first compressed gas and the second compressed gas input into the first vortex tube 310 or the second vortex tube 320 by the gas generating device. Thus, by controlling the gas flow rate of the first compressed gas and the second compressed gas through the compressed gas control valve, the flow rate of the cold air output from the first vortex tube 310 or the second vortex tube 320 can be adjusted, thereby changing the heat dissipation effect of the chip heat sink. Therefore, the flow rate of the cold air can be adjusted according to the heat dissipation requirements of the chip 100 to obtain a heat dissipation effect more suitable for the heat dissipation requirements of the chip 100.

[0075] Furthermore, when the first vortex tube 310 and the second vortex tube 320 are respectively connected to the gas generating device 330 via independent first gas pipes 331 and second gas pipes 332, each of the first gas pipes 331 and second gas pipes 332 is equipped with an independent compressed cooling gas control valve to control the compressed gas flowing through the first gas pipes 331 and second gas pipes 332, respectively. When the first vortex tube 310 and the second vortex tube 320 are respectively connected to the gas generating device 330 via a shared third gas pipe 333, the compressed gas control valve on the third gas pipe 333 can simultaneously control the compressed gas flowing to the first vortex tube 310 and the second vortex tube 320; alternatively, compressed gas control valves can be installed on the branch pipes after the third gas pipe 333 that branch to the first vortex tube 310 and the second vortex tube 320 to control the compressed gas flowing to the first vortex tube 310 and the second vortex tube 320 after the branch pipes, respectively.

[0076] Furthermore, in an optional implementation, the dew point of the first compressed gas and the second compressed gas is less than or equal to -60 degrees Celsius, meaning that the first compressed gas and the second compressed gas are gases that do not condense or frost at -60 degrees Celsius. This prevents condensation and frost formation around the chip 100 and the substrate 110, thus avoiding device damage. In an optional implementation, the material of the first eddy current tube includes stainless steel or copper.

[0077] Furthermore, in order to perform a phase change of the coolant in the evaporation phase change chamber, in an optional implementation, the evaporation phase change chamber 230 is used to perform a phase change of the coolant by utilizing the hot air flow provided by the first hot end 311 and the second hot end 321, so that the coolant changes from a liquid state to a gaseous state.

[0078] Furthermore, in order to allow the coolant in the liquefaction cooling chamber 220 to flow between the evaporation phase change chamber 230 and the liquid-cooled heat exchange chamber 210, in an optional implementation, the first cold end 312 of the first vortex tube 310 can be connected to the liquefaction cooling chamber 220, so that the liquefaction cooling chamber 220 can use the cold airflow provided by the first cold end 312 of the first vortex tube 310 to cool the coolant from the evaporation phase change chamber 230; wherein the cooled coolant flows to the liquid-cooled heat exchange chamber 210.

[0079] For further information, please refer to the following: Figure 1In an optional implementation, the chip heat sink further includes: a first liquid-cooling channel 241 for transferring coolant from the evaporation phase change chamber 230 to the liquid-cooled heat exchange chamber 210, and a second liquid-cooling channel 242 for transferring coolant from the liquid-cooled heat exchange chamber 210 to the evaporation phase change chamber 230. The first liquid-cooling channel 241 connects to the second liquid outlet of the evaporation phase change chamber 230 and to the first liquid inlet of the liquid-cooled heat exchange chamber 210. The second liquid-cooling channel 242 connects to the first liquid outlet of the liquid-cooled heat exchange chamber 210 and to the second liquid inlet of the evaporation phase change chamber 230. Figure 1 As shown, in the first liquid cooling channel 241, the coolant flows in the direction of B; in the second liquid cooling channel 242, the coolant flows in the direction of A.

[0080] The first liquid cooling channel 241 and the second liquid cooling channel 242 are used to transfer coolant between the liquid cooling heat exchange chamber 210 and the evaporation phase change chamber 230. Specifically, as shown... Figure 1 As shown, in one optional implementation, the evaporation phase change cavity 230 is disposed away from the liquid-cooled heat exchange cavity 210; the first liquid-cooling channel 241 and the second liquid-cooling channel 242 connect the internal spaces of the liquid-cooled heat exchange cavity 210 and the evaporation phase change cavity 230. Thus, a flow channel exists between the liquid-cooled heat exchange cavity 210 and the evaporation phase change cavity 230.

[0081] It should be noted that the first liquid cooling channel 241 and the second liquid cooling channel 242 only need to connect the liquid cooling heat exchange chamber 210 and the evaporation phase change chamber 230 to allow the coolant to circulate. There are no restrictions on the shape or structure of the first liquid cooling channel 241 and the second liquid cooling channel 242; for example, they can be at least two tubular channels or hollow sidewalls. After connecting the liquid cooling heat exchange chamber 210 and the evaporation phase change chamber 230, the first hot end 311 and the second hot end 321 provided in the evaporation phase change chamber 230 change part of the coolant from a liquid state to a gaseous state. Then, utilizing the volume change after the coolant vaporizes, a pressure difference is created between the evaporation phase change chamber 230 and the liquid cooling heat exchange chamber 210, making the gas pressure in the evaporation phase change chamber 230 greater than the gas pressure in the liquid cooling heat exchange chamber 210. Consequently, due to the pressure difference, the coolant is squeezed and propelled, flowing from the evaporation phase change chamber 230 to the liquid cooling heat exchange chamber 210. Meanwhile, the vaporized coolant near the side wall of the evaporation phase change chamber 230 and the vaporized coolant flowing through the first liquid cooling channel 241 will dissipate heat and re-liquefy into liquid coolant.

[0082] It should be noted that, in one specific implementation, both the first hot end 311 and the second hot end 321 are located in the upper half of the evaporation phase change cavity 230. In this way, the first hot end 311 and the second hot end 321 can vaporize the coolant in the upper half of the evaporation phase change cavity 230, while the coolant in the lower half of the evaporation phase change cavity 230 is still normally cooled by the first cold end 312. This causes the gas pressure inside the evaporation phase change cavity 230 to increase, and the vaporized coolant to re-liquefy before entering the first liquid cooling channel 241, preventing gas from entering the first liquid cooling channel 241 and the liquefaction cooling cavity 220, thus affecting the heat dissipation effect on the chip.

[0083] In one optional implementation, to improve the circulation rate of the coolant, the number of the first liquid cooling channel 241 and the second liquid cooling channel 242 can both be set to multiple; of course, embodiments of this application may also support setting one or more first liquid cooling channels 241 and one or more second liquid cooling channels 242.

[0084] Furthermore, such as Figure 1 As shown, in one optional implementation, a check valve 243 is provided at the outlet of the second liquid cooling channel 242, i.e., the second inlet of the evaporation phase change chamber 230. The check valve 243 ensures that the coolant flows unidirectionally along direction A into the evaporation phase change chamber 230 in the second liquid cooling channel 242. The check valve 243 is, for example, an inverted T-shaped structure.

[0085] In this way, when the coolant is in the evaporation phase change chamber 230, the pressure in the evaporation phase change chamber 230 increases, and the unvaporized coolant in the evaporation phase change chamber 230 is pushed by the pressure to the first liquid cooling channel 241; and the coolant that absorbs the heat of the chip in the liquid cooling heat exchange chamber 210 flows to the evaporation phase change chamber 230 through the second liquid cooling channel 242 under pressure.

[0086] Furthermore, such as Figure 1 As shown, in one optional implementation, the inner surface of the liquefaction cooling chamber 220 is provided with a first heat dissipation fin 251; the outer surface of the liquid-cooled heat exchange chamber is provided with a second heat dissipation fin 252. By providing the first heat dissipation fins 251 and 252, the heat dissipation area of ​​the liquid-cooled heat exchange chamber 210, the evaporation phase change chamber 230, and the first liquid-cooled channel 241 and the second liquid-cooled channel 242 can be increased, thereby improving the heat exchange efficiency between the above-mentioned equipment and the cold airflow and enhancing the heat dissipation performance.

[0087] Specifically, in order to achieve better heat dissipation, in one optional implementation, the materials of the first heat dissipation fin 251 and the first heat dissipation fin 252 include aluminum or copper.

[0088] Furthermore, such as Figure 4 As shown, in an optional implementation, the chip heat sink provided in this application embodiment further includes: a housing 400; the housing 400 has a first housing space 410 and a wind-cooled convection cavity 420. The evaporation phase change cavity 230, the first hot end 311 and the second hot end 321 are disposed in the first housing space 410; the liquefaction cooling cavity 220, the liquid cooling heat exchange cavity 210, the first cold end 312, the second cold end 322 and the chip 100 are disposed in the wind-cooled convection cavity 420.

[0089] In this way, the housing can confine the cold airflow of the second compressed gas generated by the second vortex tube 320 around the chip 100, thereby extending the contact time between the cold airflow and the chip 100. Simultaneously, the cold airflow of the second compressed gas output from the second cold end 322 has a certain velocity, causing it to rotate around the chip 100 and the liquefied cooling chamber 220. This allows for more thorough contact between the cold airflow and the chip 100 and the liquefied cooling chamber 220, maximizing heat exchange and thus better utilizing the cold airflow to cool the chip 100.

[0090] Furthermore, such as Figure 4 As shown, in one optional implementation, the liquefaction cooling chamber 220, the liquid-cooled heat exchange chamber 210, and the chip 100 are located in the middle region of the air-cooled convection chamber 420. The second cold end 322 of the second vortex tube is located in the side region of the air-cooled convection chamber 420, providing cold airflow to the sides and bottom of the air-cooled convection chamber 420.

[0091] Furthermore, such as Figure 4 As shown, in one optional implementation, a first through hole 421 is provided between the air-cooled convection cavity 420 and the substrate 110, and the first through hole 421 connects the air-cooled convection cavity 420 and the outside of the housing 400. In this way, after the cold airflow rotates in the air-cooled convection cavity 420 and exchanges heat with the chip 100 and the liquid-cooled heat exchange cavity 210, it can flow out through the first through hole 421 to the outside of the housing 400 (i.e., the outside of the chip heat sink), thereby forming an air duct from the air-cooled convection cavity 420 to the outside of the chip heat sink.

[0092] After the first through hole 421 is set, during the cooling process of the chip 100, the cold air flows out from the second cold end 322 of the second vortex tube 320, swirls in the air-cooled convection cavity 420, and gradually flows from the upper part of the air-cooled convection cavity 420 to the lower part of the air-cooled convection cavity 420. After exchanging heat with the chip 100, the cold air flows out of the chip heat sink through the first through hole 421.

[0093] In this way, after the cold airflow is output from the second cold end 322 of the second vortex tube 320, it absorbs the heat of the chip 100 and the liquefaction cooling cavity 220 in the air-cooled convection cavity 420, and then flows out to the outside of the housing 400 through the first through hole 421, thereby carrying the heat of the chip 100 and the liquefaction cooling cavity 220 to the outside of the chip heat sink, achieving the purpose of heat dissipation for the chip 100.

[0094] Furthermore, such as Figure 4 As shown, in an optional implementation, the housing 400 further includes a second housing space 430 disposed on the side of the substrate 110 away from the chip 100. Thus, by filling the second housing space 430 with cold air, heat can be dissipated from the chip 100, the substrate 110, and the solder joints between the chip 100 and the substrate 110 on the side of the substrate 110 away from the chip 100 using the cold airflow.

[0095] Furthermore, such as Figure 4 As shown, in one optional implementation, the chip heat sink further includes a housing backplate 431 disposed on the side of the substrate 110 away from the chip 100. The second housing space 430 is formed by the housing backplate 431 and the substrate 110. In one optional implementation, a through hole is provided between the housing backplate 431 and the substrate 110 to allow the second housing space 430 to communicate with the outside of the chip heat sink, thereby exchanging airflow during heat dissipation.

[0096] It should be noted that, in order to guide the cold airflow into the second housing space 430, in an optional implementation, the surface of the substrate 110 has a second through hole 111 for connecting the air-cooled convection cavity 420 and the second housing space 430. In this way, the cold airflow can be exchanged between the air-cooled convection cavity 420 and the second housing space 430 through the second through hole 111.

[0097] This application also provides a computer device, including a chip and a chip heat sink as described above.

[0098] While the embodiments disclosed above are described in this application, this application is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this application; therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. A chip heat sink, characterized in that, include: A liquid-cooled heat exchange chamber is disposed on the surface of the chip. The liquid-cooled heat exchange chamber is filled with coolant for absorbing the heat generated by the chip. The liquid-cooled heat exchange chamber includes a first inlet for inputting the coolant and a first outlet for outputting the coolant. An evaporation phase change chamber, connected to the liquid-cooled heat exchange chamber, includes a second liquid inlet and a second liquid outlet. The second liquid inlet receives coolant from the first liquid outlet of the liquid-cooled heat exchange chamber, and the second liquid outlet transfers the coolant stored in the evaporation phase change chamber to the first liquid inlet of the liquid-cooled heat exchange chamber. A liquefaction cooling chamber is provided between the liquid-cooled heat exchange chamber and the evaporation phase change chamber; The first vortex tube includes a first hot end that provides a hot gas flow of the first compressed gas and a first cold end that provides a cold gas flow of the first compressed gas, wherein the first hot end extends to the evaporation phase change chamber and vaporizes a portion of the coolant from the liquid-cooled heat exchange chamber, and the first cold end extends to the liquefaction cooling chamber. An air-cooled convection cavity surrounds the liquid-cooled heat exchange cavity, the liquefaction cooling cavity, and the chip; The second vortex tube includes a second hot end that provides a hot gas flow of the second compressed gas and a second cold end that provides a cold gas flow of the second compressed gas, wherein the second hot end extends to the evaporation phase change cavity and vaporizes a portion of the coolant from the liquid-cooled heat exchange cavity, and the second cold end extends to the air-cooled convection cavity.

2. The chip heat sink as described in claim 1, characterized in that, Also includes: The first liquid cooling channel connects the second liquid outlet of the evaporation phase change chamber to the first liquid inlet of the liquid cooling heat exchange chamber; The second liquid cooling channel connects the first liquid outlet of the liquid cooling heat exchange chamber to the second liquid inlet of the evaporation phase change chamber.

3. The chip heat sink as described in claim 2, characterized in that, The second liquid cooling channel includes: A check valve is installed at the second inlet of the evaporation phase change chamber connected to the second liquid cooling channel to prevent coolant backflow.

4. The chip heat sink as described in claim 1, characterized in that, The inner surface of the liquefaction cooling chamber is provided with a first heat dissipation fin; The outer surface of the liquid-cooled heat exchange cavity is provided with a second heat dissipation fin; The materials of the first heat dissipation fin and the second heat dissipation fin include aluminum or copper.

5. The chip heat sink according to claim 1, characterized in that, Also includes: case; The housing has a first housing space and an air-cooled convection cavity; The evaporation phase change cavity and the first hot end are disposed in the first housing space.

6. The chip heat sink according to claim 5, characterized in that, The second cold end of the second vortex tube is located in the side region of the air-cooled convection cavity, providing cold airflow to the side and bottom of the air-cooled convection cavity; A first through hole is provided between the air-cooled convection cavity and the substrate where the chip is located, and the first through hole connects the air-cooled convection cavity and the outside of the housing.

7. The chip heat sink as described in claim 6, characterized in that, Also includes: A backplate is disposed on the side of the substrate where the chip is located away from the chip; the backplate has a second housing space. The surface of the substrate has a second through hole for connecting the air-cooled convection cavity and the second housing space.

8. The chip heat sink as described in claim 1, characterized in that, Also includes: A first gas inlet is provided in the first vortex tube for inputting a first compressed gas into the first vortex tube. The second gas inlet is located in the second vortex tube and is used to input the second compressed gas into the second vortex tube.

9. The chip heat sink as described in claim 1, characterized in that, The boiling point of the coolant is 40 to 50 degrees Celsius; The first compressed gas and the second compressed gas are gases that do not condense or frost when at -60 degrees Celsius; The materials of the first vortex tube and the second vortex tube include stainless steel or copper.

10. A computer device, characterized in that, Includes the chip heat sink as described in any one of claims 1-9.

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