Cooler, battery pack and electric equipment

Abstract

The embodiment of the invention provides a cooler, a battery pack and electric equipment, and relates to the technical field of battery packs, the cooler comprises an evaporation heat exchange layer, a condensation module and two flexible base layers, the two flexible base layers are arranged on the two opposite sides of the evaporation heat exchange layer respectively, the condensation module is located at one end of the evaporation heat exchange layer, and the condensation module is provided with a condensation chamber; the condensation chamber is used for being filled with a cooling working medium, the condensation chamber communicates with the evaporation heat exchange layer so that the cooling working medium can enter the evaporation heat exchange layer, the evaporation heat exchange layer is used for conducting heat exchange with a part to be subjected to heat exchange so that the cooling working medium can be evaporated into a gas state, and the gas-state cooling working medium is used for entering the condensation chamber; and the gaseous cooling working medium entering the condensation chamber is condensed into a liquid state, so that the weight of the cooler is effectively reduced while the cooling effect of the cooler on the battery unit is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of battery packs, and in particular to a cooler, a battery pack and an electrical device. Background Art

[0002] At present, the main heat dissipation methods for battery packs include air cooling, liquid cooling, direct cooling, heat pipe cooling and semiconductor cooling. Among them, direct cooling and heat pipe cooling based on the principle of phase change evaporation are more widely used because of their higher heat transfer efficiency and higher heat transfer coefficient.

[0003] Among them, direct cooling uses a stamped brazed plate cooler for cooling, and heat pipe cooling uses metal materials such as high heat transfer copper tubes as shell materials for cooling. This results in both direct cooling and heat pipe cooling increasing the weight of the battery pack and limiting the energy density of the battery pack. Summary of the invention

[0004] The embodiments of the present application provide a cooler, a battery pack, and an electrical device to achieve the effect of reducing the weight of the cooler while ensuring the cooling effect.

[0005] A first aspect of an embodiment of the present application provides a cooler, comprising an evaporative heat exchange layer, a condensation module and two flexible base layers, wherein the two flexible base layers are arranged on opposite sides of the evaporative heat exchange layer, the condensation module is located at one end of the evaporative heat exchange layer, the condensation module has a condensation chamber, the condensation chamber is used to fill a cooling medium, the condensation chamber is connected to the evaporative heat exchange layer so that the cooling medium enters the evaporative heat exchange layer, the evaporative heat exchange layer is used to exchange heat with a heat-exchanged component so that the cooling medium evaporates into a gaseous state, the gaseous cooling medium is used to enter the condensation chamber, and the condensation module is configured to condense the gaseous cooling medium entering the condensation chamber into a liquid state.

[0006] In some possible designs, the condensation module further includes a driving component, and the driving component is configured to drive the cooling medium in the condensation chamber to enter the evaporation heat exchange layer.

[0007] In some possible designs, the driving component includes a first piezoelectric film, which is laid on an inner wall of the condensation chamber. The first piezoelectric film is configured to deform when energized to reduce the space in the condensation chamber, so as to drive the cooling medium into the evaporation heat exchange layer.

[0008] In some possible designs, the first piezoelectric film is located at the top of the condensation chamber, and the first piezoelectric film includes a first diaphragm, a second diaphragm and a third diaphragm. The first diaphragm and the third diaphragm are arranged on opposite sides of the second diaphragm, and the first diaphragm and the third diaphragm are inclined so that the cooling medium condensed on the surface of the first diaphragm and the third diaphragm flows toward the second diaphragm.

[0009] In some possible designs, the driving component also includes a second piezoelectric film, which is laid on the bottom of the condensation chamber, and the first piezoelectric film and the second piezoelectric film are configured to deform in a direction close to each other when energized.

[0010] In some possible designs, the condensation module also includes a refrigeration component, and the refrigeration component is provided on the side of the first piezoelectric film and the second piezoelectric film facing away from each other. The refrigeration component is configured to perform heat exchange with the cooling medium when power is turned on, so that the cooling medium condenses into a liquid state.

[0011] In some possible designs, the evaporative heat exchange layer is a capillary structure layer.

[0012] In some possible designs, a main channel is provided in the evaporative heat exchange layer, the main channel is communicated with the liquid outlet of the condensation chamber, and the extension direction of the main channel is the same as the extension direction of the evaporative heat exchange layer.

[0013] In some possible designs, the main channel is located in the middle of the evaporation heat exchange layer, and multiple first branch channels are arranged on both sides of the extension direction of the main channel. The diameter of the first branch channels is smaller than the diameter of the main channel, and the first branch channels extend toward the edge of the evaporation heat exchange layer.

[0014] In some possible designs, a plurality of second branch flow channels are disposed on the first branch flow channel, and a diameter of the second branch flow channel is smaller than a diameter of the first branch flow channel.

[0015] In some possible designs, at least one air chamber is further included, which is located between the two flexible base layers. The extension direction of the air chamber is the same as the extension direction of the evaporative heat exchange layer. The air chamber is located on the outside of the evaporative heat exchange layer and is connected to the evaporative heat exchange layer. The end of the air chamber is connected to the air inlet of the condensation chamber so that the gaseous cooling medium enters the condensation chamber.

[0016] In some possible designs, an air chamber is disposed on each side of the evaporative heat exchange layer.

[0017] In some possible designs, the air chamber includes a first side wall and a second side wall that are arranged opposite to each other, the first side wall is adjacent to the evaporation heat exchange layer, the height of the first side wall is less than the thickness of the evaporation heat exchange layer, the first side wall is connected to one of the two flexible base layers, and the second side wall is correspondingly sealed and connected to the two flexible base layers.

[0018] In some possible designs, two condensation modules are provided and are disposed at two opposite ends of the evaporation heat exchange layer, and the two ends of the air chamber are correspondingly connected to the two condensation modules.

[0019] In some possible designs, the condensation module is provided with an injection hole connected to the condensation chamber, the injection hole is used to inject the cooling medium into the condensation chamber, and the injection hole is provided with an injection plug for controlling the opening and closing of the liquid inlet of the injection hole.

[0020] A second aspect of an embodiment of the present application provides a battery pack, comprising a battery cell and a cooler as described in any one of the first aspects, wherein the cooler is used to cool the battery cell.

[0021] A third aspect of an embodiment of the present application provides an electrical device, comprising a device body and the battery pack described in the second aspect, wherein the battery pack is used to supply power to the device body.

[0022] In the cooler, battery pack and electrical equipment provided in the embodiments of the present application, the cooler is provided with an evaporative heat exchange layer, a flexible base layer and a condensation module. The flexible base layer is arranged on two opposite sides of the evaporative heat exchange layer for protection and to prevent leakage of the cooling medium. The condensation module is arranged at the end of the evaporative heat exchange layer, and the condensation module has a condensation chamber. The cooling medium filled in the condensation chamber will enter the evaporative heat exchange layer. The evaporative heat exchange layer is used to exchange heat with the heat-exchanged component, so that the cooling medium absorbs heat and at least partially becomes gaseous. The gaseous cooling medium will flow back into the condensation chamber, and the condensation module can cool the gaseous cooling medium entering the condensation chamber, so that it condenses into a liquid and enters the evaporative heat exchange layer again to absorb heat, thereby effectively dissipating heat for the heat-exchanged component through the phase change of the cooling medium, and a cooling circulation system can be formed by itself, and the structure is relatively simple. At the same time, the flexible base layer has strong adaptability, which helps to buffer the pressure of the battery pack. In addition, compared with the traditional cooler, after using the flexible base layer in the present application, the overall thickness is reduced, the weight is greatly reduced, and the density of the entire battery pack is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0024] Figure 1A schematic diagram of the exploded structure of a cooler provided in an embodiment of the present application;

[0025] Figure 2 A top view of a cooler provided in an embodiment of the present application;

[0026] Figure 3 A cross-sectional view of a cooler provided in an embodiment of the present application;

[0027] Figure 4 for Figure 3 A partial enlarged view of the cooler in FIG.

[0028] Figure 5 A schematic diagram of the connection structure between the condensation module and the evaporative heat exchange layer in the cooler provided in an embodiment of the present application;

[0029] Figure 6 A schematic diagram of the structure of a condensing module in a cooler provided in an embodiment of the present application;

[0030] Figure 7 A schematic diagram of a partial structure of a condensing module in a cooler provided in an embodiment of the present application;

[0031] Figure 8 A schematic diagram of the structure of the evaporative heat exchange layer in the cooler provided in an embodiment of the present application.

[0032] Reference numerals:

[0033] 100-flexible base layer;

[0034] 200 - evaporation heat exchange layer; 210 - main flow channel; 220 - first branch flow channel; 230 - second branch flow channel;

[0035] 300-condensation module; 310-condensation chamber; 311-liquid outlet; 312-air inlet; 320-first piezoelectric film; 330-second piezoelectric film; 340-refrigeration element; 350-liquid injection hole;

[0036] 400-air chamber;

[0037] 500-Filling plug.

[0038] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0040] Glossary:

[0041] Battery pack: A device that combines multiple battery cells together and forms an integral whole through electrical connections and mechanical structures. It generally includes battery cells, battery management system, thermal management system, safety protection device and other structures.

[0042] Capillary structure: A structure that uses capillary action to transport liquids. Capillary action refers to the phenomenon that liquids move spontaneously in small channels or pores due to surface tension and adhesion. Capillary structures can be formed by structures such as capillaries and porous materials.

[0043] With the development of science and technology, people have higher and higher requirements for new energy vehicles. High energy density and high-power fast charging have become the mainstream direction of future development of battery packs. However, high-power fast charging will inevitably bring about the problem of excessive temperature rise of the battery cell, which requires efficient heat dissipation to solve.

[0044] At present, the main heat dissipation methods for battery packs include air cooling, liquid cooling, direct cooling, heat pipe cooling and semiconductor cooling. Among them, direct cooling and heat pipe cooling based on the principle of phase change evaporation have higher heat transfer efficiency and heat transfer coefficient and are widely used.

[0045] Both direct cooling and heat pipe cooling use metal materials as raw materials. Direct cooling uses stamped brazed plate coolers, but stamped brazed plate coolers have a certain weight, which will increase the weight of the battery pack and limit the energy density. In addition, since the cold plate refrigerant is shared with the air conditioning system, the power consumption of the compressor will increase when cooling is required. At the same time, the stamped brazed cold plate as a separate component needs to be integrated with the tray, which requires additional processing steps and will also increase costs. In addition, the refrigerant has a high working pressure and relatively high energy consumption. Although heat pipe cooling has low energy consumption, it has a slow response, and its cooling capacity is related to its size. There are many restrictions. If you want to be light, the cooling capacity will be limited, making it difficult to meet the needs of high heat exchange.

[0046] In this regard, the embodiments of the present application provide a cooler, a battery pack and an electrical device. The cooler uses a flexible base layer to support, protect and seal the evaporative heat exchange layer. The flexible base layer is lightweight, flexible and deformable, and has strong adaptability. The condensation module has a condensation chamber. The cooling medium in the condensation chamber can flow between the condensation chamber and the evaporative heat exchange layer, and effectively absorbs the heat of the heat exchange component through phase change, thereby achieving lightweight cooler while also having good cooling capacity.

[0047] In addition, after the cooler provided in the embodiment of the present application is applied to a battery pack, the battery pack can be applied to electrical equipment, including but not limited to equipment that requires the use of a battery pack in the fields of industrial automation, automotive electronics, renewable energy, communication equipment, medical equipment, aerospace, lighting systems, etc., which are not limited by the embodiment of the present application.

[0048] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0049] See also Figure 1 and Figure 2 As shown, in some embodiments, the cooler includes an evaporative heat exchange layer 200 , a condensation module 300 , and two flexible base layers 100 .

[0050] The two flexible base layers 100 are disposed on opposite sides of the evaporation heat exchange layer 200 . The flexible base layers 100 are used to support, protect and seal the evaporation heat exchange layer 200 to prevent leakage of the cooling medium flowing through the evaporation heat exchange layer 200 .

[0051] It is understandable that the flexible base layer 100 may be a flexible film as long as it has certain corrosion resistance and ductility and is not easily broken or damaged during use. The present embodiment does not limit its specific material.

[0052] The condensation module 300 is located at one end of the evaporation heat exchange layer 200. The condensation module 300 has a condensation chamber 310. The condensation chamber 310 is used to fill the cooling medium. The condensation chamber 310 is connected to the evaporation heat exchange layer 200 so that the cooling medium enters the evaporation heat exchange layer 200. The evaporation heat exchange layer 200 is used to exchange heat with the heat exchange component to be exchanged so that the cooling medium absorbs heat and evaporates into a gaseous state. The gaseous cooling medium in the evaporation heat exchange layer 200 will enter the condensation chamber 310. The condensation module 300 will condense the gaseous cooling medium entering the condensation chamber 310 into a liquid state, and then the liquid cooling medium enters the evaporation heat exchange layer 200 again to absorb heat, thereby circulating the heat dissipation of the heat exchange component to be exchanged, effectively reducing the temperature of the heat exchange component.

[0053] Among them, the cooling medium is a phase change medium. Since the working pressure of the cooler provided in this embodiment is low, the requirements for the cooling medium are not high, which may include but are not limited to ethanol, water, acetone, etc. The use of these cooling mediums can effectively reduce the cost of the cooler.

[0054] The condensation module 300 may also be integrated between two flexible base layers 100, and protected by the flexible base layer 100, and the flexible base layer 100 may also be used to prevent the cooling medium between the condensation module 300 and the evaporation heat exchange layer 200 from overflowing. Of course, the condensation module 300 may not be integrated between the two flexible base layers 100, but the flexible base layer 100 may only cover the evaporation heat exchange layer 200, and the condensation module 300 may be directly connected to the ends of the flexible base layer 100 and the evaporation heat exchange layer 200, which is not limited in this embodiment.

[0055] It is understandable that the condensation module 300 needs to be filled with a cooling medium and the cooling medium needs to be cooled, and it needs to have a certain degree of support. Therefore, the base material of the condensation module 300 can be made of a ceramic base, polyethylene plastic, or other material with corrosion resistance and a certain ability to maintain shape. This embodiment does not limit it here.

[0056] When in use, the condensation module 300 will cool the cooling medium in the condensation chamber 310 to condense it into a liquid state, and then the liquid condensed medium enters the evaporation heat exchange layer 200, and the evaporation heat exchange layer 200 is generally used to contact the heat exchange part, such as the battery cell in the battery pack. At this time, the liquid cooling medium will exchange heat with the battery cell to reduce the temperature of the battery cell. At the same time, the temperature of the cooling medium rises and evaporates into a gaseous state. The gaseous cooling medium returns to the condensation chamber 310 for cooling again. This embodiment uses phase change evaporation heat exchange. Compared with traditional convection heat exchange, the heat exchange coefficient is large and the heat exchange efficiency is high, which can effectively cool the heat exchange part. At the same time, this embodiment uses a flexible base layer 100 as a carrier. The flexible base layer 100 has strong adaptability and helps to buffer the pressure of the battery pack. In addition, compared with the traditional cooler, after using the flexible base layer 100 in this application, the overall thickness is reduced, the weight is greatly reduced, and the density of the battery pack is greatly improved.

[0057] In some embodiments, the evaporative heat exchange layer 200 is a porous capillary structure layer, which can use the capillary action to allow the liquid coolant to flow and spread rapidly in the evaporative heat exchange layer 200, thereby effectively dissipating the heat from the heat exchange component.

[0058] Exemplarily, the evaporation heat exchange layer 200 may be made of a composite three-dimensional porous material, such as a polymer of polyethylene, polypropylene, polyimide, or graphene-coated carbon nanotube aerogel, etc. As long as the pores can form a capillary structure, this embodiment is not limited thereto.

[0059] These composite three-dimensional porous materials are nano-microporous materials. The evaporation heat exchange layer 200 made of this material can allow the cooling medium to diffuse and expand to form a liquid film, which helps to improve the heat exchange effect. In addition, the composite three-dimensional porous material is made of a flexible evaporation heat exchange layer 200, which can be assembled with the flexible base film by hot pressing or bonding, and the connection is relatively simple. At the same time, because both the flexible base film and the flexible base film are flexible, the applicability can be effectively improved.

[0060] During use, the cooling medium diffuses in the evaporative heat exchange layer 200 and spreads as a liquid film, which not only allows the cooling medium to flow quickly, but also effectively improves the heat exchange capacity, thereby quickly cooling the heat exchange component. At the same time, the evaporative heat exchange layer 200 made of the composite three-dimensional porous material can also serve as a gas evacuation channel, allowing the gaseous cooling medium to smoothly return to the condensation chamber 310.

[0061] It is understandable that the evaporation heat exchange layer 200 may also be made of other materials as long as it can form a capillary structure, and this embodiment does not limit it.

[0062] In some embodiments, see Figure 5 , Figure 6 As shown, the condensation module 300 further includes a driving component, which is used to drive the cooling medium in the condensation chamber 310 to enter the evaporation heat exchange layer 200 .

[0063] After adding the driving component, while the liquid coolant is actively diffused through capillary action, the driving component can also drive the liquid coolant to diffuse passively, thereby effectively improving the diffusion rate of the coolant in the evaporative heat exchange layer 200, avoiding the problem of insufficient coolant replenishment in the evaporative heat exchange layer 200 due to the small amount of coolant transport, causing the formed liquid film to be evaporated, thereby effectively improving the heat exchange effect.

[0064] Furthermore, the driving assembly includes a first piezoelectric film 320, which is laid on an inner wall of the condensation chamber 310, wherein a battery can be built into the cooler to power the first piezoelectric film 320. In order to reduce the volume of the cooler, the battery can be not built into the cooler, but the power can be directly connected to an external power source through a wire, which can be selected according to actual conditions, and this embodiment does not limit it here.

[0065] When the cooler is in use, the power supply supplies power to the first piezoelectric film 320, causing the first piezoelectric film 320 to deform toward the condensation chamber 310, thereby reducing the space in the condensation chamber 310. When the power is cut off, the first piezoelectric film 320 returns to its round shape. By repeatedly turning the power on and off, it can play a role similar to that of a micro water pump, thereby driving the cooling medium to quickly enter the evaporation heat exchange layer 200.

[0066] The first piezoelectric film 320 may be disposed on any inner side surface of the condensation chamber 310 , which is not limited in this embodiment.

[0067] Exemplarily, the first piezoelectric film 320 is located at the top of the condensation chamber 310, and the first piezoelectric film 320 includes a first diaphragm, a second diaphragm and a third diaphragm. The first diaphragm and the third diaphragm are arranged on opposite sides of the second diaphragm, and the first diaphragm and the third diaphragm are inclined so that the cooling medium condensed on the surface of the first diaphragm and the third diaphragm flows toward the second diaphragm to quickly drip into the condensation chamber 310 and then enter the evaporation heat exchange layer 200.

[0068] Exemplarily, the first piezoelectric film 320 has a gathering portion at the liquid outlet 311 of the condensation chamber 310, and other portions are inclined toward the gathering portion so that the liquid condensed on the first piezoelectric film 320 flows toward the gathering portion, so that the liquid cooling medium gathers at the entrance of the main channel 210, making it easier for the cooling medium to enter the main channel 210.

[0069] In some embodiments, the driving assembly further includes a second piezoelectric film 330 , which is laid on the bottom of the condensation chamber 310 . When power is supplied to the first piezoelectric film 320 and the second piezoelectric film 330 , they deform toward each other.

[0070] During use, the first piezoelectric film 320 and the second piezoelectric film 330 can be deformed synchronously for extrusion, thereby improving the ability to drive the liquid working medium to move toward the evaporation heat exchange layer 200, thereby further accelerating the movement rate of the cooling working medium and improving the cooling effect.

[0071] It is understandable that piezoelectric films may also be provided on other inner walls of the condensation chamber 310 , and this embodiment is merely an example and not intended to limit the present invention.

[0072] In some embodiments, the condensation module 300 further includes a refrigeration element 340 , and a refrigeration element 340 is provided on the side of the first piezoelectric film 320 and the second piezoelectric film 330 facing away from each other. The refrigeration element 340 is used to perform heat exchange with the cooling medium when powered on, so that the cooling medium is condensed into liquid.

[0073] Similarly, a battery can be built into the cooler to power the cooling element 340. In order to reduce the size of the cooler, the battery can also be not built into the cooler, but directly powered by an external power supply through a wire, which can be selected according to actual conditions and is not limited in this embodiment.

[0074] Among them, see Figure 1As shown, the condensation module 300 can be a strip structure made of ceramic-based materials, the interior of which is hollow to form a condensation chamber 310, and the refrigeration component 340 is supported by the main structure of the condensation module 300. Its refrigeration surface is in contact with the first piezoelectric film 320 or the second piezoelectric film 330, which can effectively cool the cooling medium.

[0075] Among them, the cooling element 340 can be a TEC cooling sheet (Thermoelectric Cooler). The TEC cooling sheet is also called a thermoelectric cooling sheet or a Peltier cooling sheet. It is a semiconductor device that uses the Peltier effect for cooling. The Peltier effect refers to the phenomenon of heat absorption or heat release when an electric current passes through the junction of two different conductive materials, thereby achieving a cooling or heating function. This embodiment uses a TEC cooling sheet for cooling. Since the TEC cooling sheet has no mechanical moving parts, it will not generate operating noise. At the same time, the failure rate is low, no refrigerant is required, it is more environmentally friendly, and the response speed is fast and the weight is light, which helps to further improve the reliability of the cooler and assist in further reducing the weight of the cooler.

[0076] It is understandable that the refrigeration element 340 may also be other refrigeration-capable semiconductor refrigeration plates or other structures, as long as they can meet the use requirements of the cooler and condense the cooling medium from gas to liquid. This embodiment does not limit it here.

[0077] In some embodiments, see Figure 3 , Figure 4 and Figure 8 As shown, a main channel 210 is provided in the evaporative heat exchange layer 200, and the main channel 210 is connected with the liquid outlet 311 of the condensing chamber 310, that is, the liquid outlet 311 can be opposite to and connected with the main channel 210, and the extension direction of the main channel 210 is the same as the extension direction of the evaporative heat exchange layer 200, so that a rapid diffusion path is provided for the cooling medium through the main channel 210, thereby reducing the resistance of the cooling medium entering the evaporative heat exchange layer 200.

[0078] Furthermore, the second diaphragm can be arranged opposite to the main channel 210 , that is, the liquid cooling medium dripping from the second diaphragm to the bottom of the condensation chamber 310 is in the same straight line as the main channel 210 , thereby further increasing the speed at which the cooling medium enters the evaporative heat exchange layer 200 .

[0079] In some embodiments, the main channel 210 is located in the middle of the evaporative heat exchange layer 200, and multiple first branch channels 220 are arranged on both sides of the extension direction of the main channel 210. The diameter of the first branch channel 220 is smaller than the diameter of the main channel 210, and the first branch channel 220 extends toward the edge of the evaporative heat exchange layer 200.

[0080] Among them, the first branch channel 220 can be set on both sides of the main channel 210, and the extension direction of the first branch channel 220 can be parallel to each other or at a certain angle, as long as they all extend in the direction close to the edge of the evaporative heat exchange layer 200. In this way, the first branch channel 220 can assist in accelerating the diffusion of the cooling medium in the evaporative heat exchange layer 200, thereby improving the heat exchange effect.

[0081] Furthermore, a plurality of second branch channels 230 are disposed on the first branch channel 220 , and a diameter of the second branch channel 230 is smaller than a diameter of the first branch channel 220 .

[0082] Specifically, the second branch channel 230 can be set at any position of the first branch channel 220, and multiple second branch channels 230 can extend in different directions as long as they extend toward the edge of the evaporative heat exchange layer 200. The diameter of the first branch channel 220 is smaller than the diameter of the main channel 210, and the diameter of the second branch channel 230 is smaller than the diameter of the first branch channel 220. The whole can form a bionic leaf vein structure, reduce the flow resistance of the cooling medium when it flows between the main channel 210, the first branch channel 220, and the second branch channel 230, and improve the diffusion speed.

[0083] It is understandable that the diameter of the first branch channel 220 is smaller than the specific value of the diameter of the main channel 210, and the diameter of the second branch channel 230 is smaller than the specific value of the diameter of the first branch channel 220. Both can be designed according to actual conditions and are not limited in this embodiment.

[0084] In addition, the above embodiment is only an example of the setting method of the main channel 210 and the branch channel, rather than limiting it. A fourth branch channel can be added to the second branch channel 230, and the diameter of the fourth branch channel is smaller than the diameter of the second branch channel 230, and so on. That is, the diameter of the branch channel decreases gradually and is closed at the end of the branch channel. The number of branch channels can be determined according to the size of the evaporation heat exchange layer 200, and this embodiment limits it here.

[0085] In some embodiments, the main channel 210 and the first branch channel 220 and the second branch channel 230 all have walls formed by composite three-dimensional porous materials. When the cooling medium flows through the main channel 210 and the first branch channel 220 and the second branch channel 230, it can automatically diffuse through its walls into the entire evaporative heat exchange layer 200, thereby spreading to form a liquid film.

[0086] In some embodiments, see Figure 3 and Figure 4As shown, the cooler also includes at least one air chamber 400, which is located between two flexible base layers 100. The extension direction of the air chamber 400 is the same as the extension direction of the evaporative heat exchange layer 200. The air chamber 400 is located on the outside of the evaporative heat exchange layer 200 and is connected to the evaporative heat exchange layer 200. The end of the air chamber 400 is connected to the air inlet 312 of the condensation chamber 310 so that the gaseous cooling medium enters the condensation chamber 310, that is, the condensation chamber 310 extends along the width direction of the evaporative heat exchange layer 200, and its air inlet 312 is set at the end and connected to the end of the air chamber 400, while the liquid inlet is set in the middle and connected to the main channel 210.

[0087] The air chamber 400 may be opened on the side close to the evaporation heat exchange layer 200 to allow the gas in the evaporation heat exchange layer 200 to enter the air chamber 400, or it may be opened in other ways as long as the gas can enter the air chamber 400 and the speed of the gas entering the condensation chamber 310 can be increased.

[0088] Exemplarily, the air chamber 400 includes a first side wall and a second side wall that are oppositely arranged, the first side wall is adjacent to the evaporation heat exchange layer 200, the height of the first side wall is less than the thickness of the evaporation heat exchange layer 200, the first side wall is connected to one of the two flexible base layers 100, and the second side wall is correspondingly sealed and connected to the two flexible base layers 100.

[0089] The first side wall and the second side wall of the air chamber 400 may be made of a material having a certain corrosion resistance, such as plastics such as PTFE, which is not limited in this embodiment.

[0090] Among them, the air chamber 400 can be formed by only the first side wall and the second side wall, and a certain gap is reserved between the first side wall and the second side wall to form a gas channel. Of course, it can also include a bottom wall and / or a top wall, which is not limited in this embodiment.

[0091] In addition, during processing, 3D printing or other methods may be used to directly form the air chamber 400 on the upper or lower base film. Of course, it may also be connected by bonding or other methods, which is not limited in this embodiment.

[0092] Since the evaporation heat exchange layer 200 is a capillary structure layer, the gaseous cooling medium can directly enter the air chamber 400 through the pores on the capillary structure layer after reaching the edge of the evaporation heat exchange layer 200, thereby quickly moving toward the condensation chamber 310 through the air chamber 400.

[0093] In addition, in order to further improve the gas reflux effect, an air chamber 400 may be provided on both sides of the evaporative heat exchange layer 200 , and the gaseous cooling medium on both sides of the main channel 210 may quickly enter the air chamber 400 .

[0094] Of course, in order to improve the condensation effect, a condensation module 300 can also be set at both ends of the evaporative heat exchange layer 200, that is, the condensation module 300 and the air chamber 400 can be enclosed to form an annular structure, and the evaporative heat exchange layer 200 is located in the annular structure. The two ends of the air chamber 400 are connected to the air inlets 312 of the two condensation modules 300, and the gaseous cooling medium entering the air chamber 400 can enter the corresponding condensation chamber 310 nearby for condensation, thereby effectively improving the flow rate of the cooling medium and improving the heat dissipation effect of the heat dissipation component.

[0095] In some embodiments, see Figure 7 As shown, the condensation module 300 is provided with an injection hole 350 connected to the condensation chamber 310, the injection hole 350 is used to inject cooling medium into the condensation chamber 310, and the injection hole 350 is provided with an injection plug 500 for controlling the opening and closing of the liquid inlet of the injection hole 350.

[0096] It is understandable that the injection hole 350 can be opened at the end of the condensation chamber 310 or other positions, and this embodiment does not limit it here. The injection plug 500 can be used to seal the injection hole 350 to prevent the cooling medium from flowing out of the injection hole 350 during use.

[0097] When in use, the condensation chamber 310 can be vacuumed through the injection hole 350, and then a phase change medium such as water can be injected as a cooling medium. Finally, the injection plug 500 can be connected to the injection hole 350, so as to facilitate the filling or replacement of the cooling medium.

[0098] In order to facilitate understanding of the working principle of the cooler provided in the embodiment of the present application, the working principle of the cooler is described again below:

[0099] When the cooler is working, the cooling medium will spontaneously diffuse and spread into the evaporation heat exchange layer 200 through capillary force. At the same time, current is passed through the piezoelectric film, and the first piezoelectric film 320 and the second piezoelectric film 330 shrink and deform to squeeze the cooling medium, which is equivalent to a micro water pump. The cooling medium enters the liquid channel under the action of the first piezoelectric film 320 and the second piezoelectric film 330, and is transported and diffused into the evaporation heat exchange layer 200 in the liquid channel under the combined action of pressure difference and capillary force. The evaporation heat exchange layer 200 has a porous micro-nano structure, which is conducive to the rapid diffusion of the cooling medium. The cooling medium diffuses and spreads into a micron-level liquid film in the evaporation heat exchange layer 200. After absorbing heat, the liquid film will quickly evaporate into a gas state, and then gather in the gas chamber 400 in the evaporation heat exchange layer 200. Due to the pressure difference, it spontaneously enters the condensation chamber 310. After power is turned on, the TEC refrigeration plate in the condensation chamber 310 reduces the wall temperature of the condensation chamber 310. The steam encounters the low-temperature wall and quickly condenses into a liquid state. The liquid cooling medium gathers at the entrance of the main channel 210, and then enters the main channel 210 through the first piezoelectric film 320 and the second piezoelectric film 330. This cycle is repeated, and the heat is continuously taken away by the evaporation and condensation of the cooling medium.

[0100] An embodiment of the present application also provides a battery pack, including a shell and the cooler in the above embodiment. Of course, the battery pack also includes at least one battery cell. The cooler and the battery cell are both located in the shell, and the cooler is used to cool the battery cell.

[0101] It is understandable that the battery pack also includes other components such as a battery management system, which is well known to those skilled in the art and will not be described in detail in this embodiment.

[0102] An embodiment of the present application also provides an electrical device, including a device body and the battery pack in the above embodiment, wherein the battery pack is used to supply power to the device body.

[0103] Among them, the electrical equipment in this embodiment includes but is not limited to equipment that requires the use of battery packs in the fields of industrial automation, automotive electronics, renewable energy, communication equipment, medical equipment, aerospace, lighting systems, etc., and the embodiments of this application do not limit them here.

[0104] Finally, it should be noted that those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the application content disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application, is not limited to the precise structure described above and shown in the drawings, and can be modified and changed in various ways without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A cooler, characterized in that: The invention comprises an evaporative heat exchange layer (200), a condensation module (300) and two flexible base layers (100), wherein the two flexible base layers (100) are arranged on opposite sides of the evaporative heat exchange layer (200), the condensation module (300) is located at one end of the evaporative heat exchange layer (200), the condensation module (300) has a condensation chamber (310), the condensation chamber (310) is used to fill a cooling medium, the condensation chamber (310) is connected with the evaporative heat exchange layer (200), so that the cooling medium enters the evaporative heat exchange layer (200), the evaporative heat exchange layer (200) is used to exchange heat with a heat exchange component, so that the cooling medium evaporates into a gaseous state, the gaseous cooling medium is used to enter the condensation chamber (310), and the condensation module (300) is configured to condense the gaseous cooling medium entering the condensation chamber (310) into a liquid state.

2. The cooler according to claim 1, characterized in that The condensation module (300) further comprises a driving component, wherein the driving component is configured to drive the cooling medium in the condensation chamber (310) to enter the evaporation heat exchange layer (200).

3. The cooler according to claim 2, characterized in that The driving component comprises a first piezoelectric film (320), wherein the first piezoelectric film (320) is laid on an inner wall of the condensation chamber (310), and the first piezoelectric film (320) is configured to deform when energized to reduce the space in the condensation chamber (310), so as to drive the cooling medium to enter the evaporation heat exchange layer (200).

4. The cooler according to claim 3, characterized in that The first piezoelectric film (320) is located at the top of the condensation chamber (310), and the first piezoelectric film (320) comprises a first diaphragm (321), a second diaphragm (322) and a third diaphragm (323). The first diaphragm (321) and the third diaphragm (323) are arranged on two opposite sides of the second diaphragm (322), and the first diaphragm (321) and the third diaphragm (323) are arranged at an angle so that the cooling medium condensed on the surfaces of the first diaphragm (321) and the third diaphragm (323) flows toward the second diaphragm (322).

5. The cooler according to claim 3, characterized in that The driving component also includes a second piezoelectric film (330), which is laid on the bottom of the condensation chamber (310), and the first piezoelectric film (320) and the second piezoelectric film (330) are configured to deform in a direction close to each other when energized.

6. The cooler according to claim 5, characterized in that The condensation module (300) further comprises a refrigeration element (340), and the refrigeration element (340) is disposed on the side of the first piezoelectric film (320) and the second piezoelectric film (330) facing away from each other. The refrigeration element (340) is configured to perform heat exchange with the cooling medium when powered on, so that the cooling medium is condensed into a liquid state.

7. The cooler according to any one of claims 1 to 6, characterized in that: The evaporative heat exchange layer (200) is a capillary structure layer.

8. The cooler according to any one of claim 7, characterized in that: A main channel (210) is provided in the evaporation heat exchange layer (200), the main channel (210) is connected to the liquid outlet (311) of the condensation chamber (310), and the extension direction of the main channel (210) is the same as the extension direction of the evaporation heat exchange layer (200).

9. The cooler according to claim 8, characterized in that The main channel (210) is located in the middle of the evaporative heat exchange layer (200), and a plurality of first branch channels (220) are arranged on both sides of the extension direction of the main channel (210), the diameter of the first branch channels (220) is smaller than the diameter of the main channel (210), and the first branch channels (220) extend toward the edge of the evaporative heat exchange layer (200).

10. The cooler according to claim 9, characterized in that A plurality of second branch flow channels (230) are arranged on the first branch flow channel (220), and the diameter of the second branch flow channel (230) is smaller than the diameter of the first branch flow channel (220).

11. The cooler according to any one of claims 1 to 6, characterized in that: The invention also comprises at least one air chamber (400), wherein the air chamber (400) is located between the two flexible base layers (100), the extension direction of the air chamber (400) is the same as the extension direction of the evaporative heat exchange layer (200), the air chamber (400) is located outside the evaporative heat exchange layer (200) and is in communication with the evaporative heat exchange layer (200), and the end of the air chamber (400) is connected to the air inlet (312) of the condensation chamber (310) so that the gaseous cooling medium enters the condensation chamber (310).

12. The cooler according to claim 11, characterized in that An air chamber (400) is disposed on each side of the evaporative heat exchange layer (200).

13. The cooler according to claim 11, characterized in that The air chamber (400) comprises a first side wall and a second side wall which are arranged opposite to each other, the first side wall being adjacent to the evaporation heat exchange layer (200), the height of the first side wall being smaller than the thickness of the evaporation heat exchange layer (200), the first side wall being connected to one of the two flexible base layers (100), and the second side wall being correspondingly sealed and connected to the two flexible base layers (100).

14. The cooler according to claim 11, characterized in that Two condensation modules (300) are provided and are disposed at two opposite ends of the evaporation heat exchange layer (200), and the two ends of the air chamber (400) are correspondingly connected to the two condensation modules (300).

15. The cooler according to any one of claims 1 to 6, characterized in that: The condensation module (300) is provided with a liquid injection hole (350) connected to the condensation chamber (310), the liquid injection hole (350) is used to inject the cooling medium into the condensation chamber (310), and the liquid injection hole (350) is provided with a liquid injection plug (500) for controlling the opening and closing of the liquid inlet of the liquid injection hole (350).

16. A battery pack, characterized in that: It comprises a battery cell and the cooler according to any one of claims 1 to 15, wherein the cooler is used to cool the battery cell.

17. An electrical equipment, characterized in that: It comprises a device body and the battery pack as claimed in claim 16, wherein the battery pack is used to supply power to the device body.

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