A method for adding protective layer to mechanical blind and buried via pressing structure based on drilling grouping

Abstract

The present invention discloses a method for adding a protective layer to a mechanical blind buried hole pressing structure based on drilling grouping, comprising the following steps: S1. Given the composition of a mechanical blind buried hole pressing structure; S2. Given all the drill holes that need to be processed in the mechanical blind buried hole pressing structure, as well as the copper layer that each drill hole needs to connect and the substrate layer that penetrates; S3. Cycle all the drill holes and group them by parallel layers; S4. Cycle out the circuit layer at the same starting point or the circuit layer at the end point of the drilling hole, and build a protective layer for the layer with less drilling conduction; S5. Cycle the conductive circuit layer of each drilling hole, read the pressing structure, find the top surface or bottom surface corresponding to the circuit, and fill the missing layer with a protective layer. The present invention can quickly determine the sequence of circuit and drilling production, and add a protective layer to protect the pressing process, providing convenient conditions for engineers' operations.

Description

Technical Field

[0001] The invention relates to the field of mechanical blind buried hole pressing, and in particular to a method for adding a protective layer to a mechanical blind buried hole pressing structure based on drilling grouping. Background Art

[0002] In the mechanical blind buried hole pressing structure, there are many drilling levels, and different layers are connected. During production, the production line can only produce two sides at the same time. For this type of multi-layer board, some lines can be produced in parallel, and some lines are produced in series. This type is that the inner layer is made and then pressed on the outer layer; the drilling will not be done at one time, and the layer with less conduction will be drilled first, and the layer with more conduction will be drilled later; because it needs to be drilled multiple times, the through parts need to be glued together before drilling, so this board needs to be pressed multiple times to achieve the finished product effect, so the circuit will not be made at one time;

[0003] For the circuit layers with the same starting point or end point, when the current circuit layer is finally produced, the current circuit layer will be produced only after the drilling holes with more conduction are produced. Therefore, when the drilling layer with less conduction is produced, a protective layer needs to be made to protect the copper foil of the current layer so that the copper foil of the current layer will not be etched away by the etching tank. Or, if one side of the upper and lower copper foils of a core board needs to be produced first and the other side needs to be produced later, then the circuit produced later needs to add a protective layer;

[0004] However, the relationship between layers is relatively complex. In fact, during the production process, it is difficult to directly determine the sequence of line and drilling production, which brings a lot of trouble to engineers. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for adding a protective layer to a mechanical blind buried hole pressing structure based on drilling grouping, which can quickly determine the sequence of line and drilling production, and add a protective layer to protect the pressing process, providing convenient conditions for engineers' operations.

[0006] The object of the present invention is achieved through the following technical solution: A method for adding a protective layer to a mechanical blind buried hole press-fit structure based on drilling grouping, comprising the following steps:

[0007] The following steps are involved:

[0008] S1. The composition of a given mechanical blind buried hole pressing structure: the mechanical blind buried hole pressing structure comprises a plurality of core boards pressed sequentially from top to bottom, any two adjacent core boards are fixed by an adhesive, each core board comprises a substrate layer and copper skin layers located on the upper and lower surfaces of the substrate layer, and each copper skin layer is a circuit layer of the pressing structure;

[0009] S2. In a given mechanical blind buried hole pressing structure, all the drill holes that need to be processed, and the copper layer and substrate layer that each drill hole needs to connect to;

[0010] S3. loop all the drilling holes, group them by parallel level, obtain drilling holes of different orders, and process the drilling holes and corresponding circuit layers from high to low order during processing;

[0011] S4. Circulate the circuit layers with the same starting point or end point of the drilling, and build a protective layer for the layer with less conduction of the drilling; because the order is from high to low, the protective film is added to the layer with less conduction to avoid damage after processing;

[0012] S5. Cycle the conductive circuit layer of each drilled hole. For the drilled holes that penetrate more than two core boards, read the pressed structure, find the top and bottom surfaces of the corresponding circuit layers, and fill the missing layers with protective layers.

[0013] The beneficial effects of the present invention are as follows: the present invention can sort the production sequence of the circuits and drilling holes of the board, judge and generate the actual production logic through digital logical classification, store the arranged circuit drilling holes in a specified format, store the multi-dimensional presentation method in a digital type, and add a protective layer to protect the pressing process, thereby packaging the rules in the form of software to reduce the operating cost of each engineer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a flow chart of the method of the present invention;

[0015] Figure 2 It is a schematic diagram of the pressed structure of twenty layers;

[0016] Figure 3 This is a schematic diagram of the first pressing structure;

[0017] Figure 4 Schematic diagram of the second pressing structure;

[0018] Figure 5 It is a schematic diagram of the third pressing structure;

[0019] Figure 6 This is a schematic diagram of the fourth pressing structure. DETAILED DESCRIPTION

[0020] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0021] like Figure 1 As shown, a method for adding a protective layer to a mechanical blind buried hole pressing structure based on drilling grouping includes the following steps:

[0022] S1. The composition of a given mechanical blind buried hole pressing structure: the mechanical blind buried hole pressing structure comprises a plurality of core boards pressed sequentially from top to bottom, any two adjacent core boards are fixed by an adhesive, and each core board comprises a substrate layer and copper skin layers located on the upper and lower surfaces of the substrate layer;

[0023] In mechanical multi-level blind buried vias, there is too much data and too many variables in the correlation between layers. It is troublesome and easy to make mistakes when engineers manually handle the relationship between layers. Figure 2 As shown in the figure, a twenty-layer laminated structure diagram is given to more intuitively understand the correlation and complexity between layers;

[0024] Figure 2 In the table, Copper represents the copper layer (circuit layer) and is represented by yellow. Core represents the substrate layer and is represented by dark blue. Pp represents the adhesive and is represented by light blue. Drl represents drilling. A single drl represents a through-hole layer (connecting all circuit layers). The number after it represents the number of circuits to the number of layers (for example, drl3-6 means drilling through the 3rd to the 6th layer). The black lines on the table represent drilling.

[0025] l represents the line, and the number after l represents the level. The data listed below are all developed based on this compression structure;

[0026] From this picture we can see that the actual drilling and wiring are connected vertically.

[0027] A core board in this picture represents copper-core-copper. It is equivalent to adding copper on both sides of the substrate to form a core board. The copper of the core board and the substrate are integrated, which will be used later. From this picture, we need to know that the circuit is the way to conduct current in any area of ​​the plane, and the drilling is the way to conduct current between planes.

[0028] S2. In a given mechanical blind buried hole pressing structure, all the drill holes that need to be processed, and the copper skin layer that each drill hole needs to connect; a circuit layer is made in each drill hole to achieve electrical connection between the copper skin layers;

[0029] S3. loop all the drilling holes and group them by parallel level;

[0030] S301. Loop to find the drilling holes that connect the most copper layers as the first-order drilling holes; Figure 2 As shown, first-order drilling: 'drl';

[0031] S302. Cycle the remaining boreholes outside the first-stage boreholes, and add all the boreholes included in the first-stage boreholes to the pre-selected set of the second-stage boreholes;

[0032] The method of determining whether a drill hole is included in the first-order drill hole is as follows: if all copper layers connected by any drill hole are connected by the first-order drill hole, the drill hole is considered to be included in the first-order drill hole;

[0033] S303. From the pre-selected set of k-th order drilling holes, find the drilling holes that connect the copper layer the most and the drilling holes in the parallel layer;

[0034] Among them, the parallel layer drilling of the drilling holes connecting the most copper skin layers is determined as follows: first, the drilling holes connecting the most copper skin layers are taken as reference drilling holes. For any drilling hole in the pre-selected set of k-th order drilling holes, if the copper skin layers connected between the drilling hole and the reference drilling hole do not intersect, then the drilling hole is the parallel layer drilling hole connecting the most copper skin layers.

[0035] When there are multiple parallel layer drill holes, determine whether there is an inclusion relationship between the parallel layer drill holes, where the inclusion relationship means that all copper layers connected by one parallel layer drill hole are connected by the other parallel layer drill holes;

[0036] If there is no inclusion relationship, the drill holes that connect the most copper layers and the drill holes in the parallel layers are taken as the k-th order drill holes, and the remaining drill holes are added to the candidate set of the k+1-th order drill holes;

[0037] If there is an inclusion relationship, first, in the pre-selected set of k-th order drilling holes, the drilling holes with the most connected copper layers and the drilling holes in the parallel layers are added to the pre-selected set of k+1-th order drilling holes; then, among the parallel layer drilling holes with an inclusion relationship, the drilling holes with fewer connected copper layers are added to the pre-selected set of k+1-th order drilling holes, and the remaining drilling holes in the pre-selected set of k-th order drilling holes are the k-th order drilling holes;

[0038] S304. When k=2,3,…, repeat step S303;

[0039] When the number of copper layers connected by all the holes in the pre-selected set of k+1-order holes is the same, all the holes in the pre-selected set of k+1-order holes are taken as the last-order holes, i.e., k+1-order holes, and the drilling grouping ends;

[0040] like Figure 2 As shown, when k=2, the boreholes added to the pre-selected set of the second-order boreholes are: 'drl1-2', 'drl3-20', 'drl3-6', 'drl7-10', 'drl11-20', 'drl9-10', 'drl5-6', 'drl11-12', 'drl13-20', 'drl13-14', 'drl15-16', 'drl19-20';

[0041] Among them, the drill hole with the most connected copper layers is 'drl3-20', and its parallel layer drill hole is only 'drl1-2', so 'drl1-2' and 'drl3-20' are second-order drill holes; the remaining drill holes 'drl3-6', 'drl7-10', 'drl11-20', 'drl9-10', 'drl5-6', 'drl11-12', 'drl13-20', 'drl13-14', 'drl15-16', 'drl19-20' are added to the k+1th order, that is, the third-order drill hole pre-selection set;

[0042] When k=3, the hole with the most connected copper layers is 'drl11-20', and its parallel layer holes are 'drl3-6', 'drl7-10', 'drl9-10', 'drl5-6'; first connect the remaining holes 'drl11-12', 'drl13-20', 'drl13-14', 'drl15-16', 'drl19-20' is added to the pre-selected set of the k+1th order, that is, the 4th order drilling holes; then, since 'drl3-6' and 'drl5-6' have an inclusion relationship, the drilling hole 'drl5-6' with fewer connected copper layers is added to the 4th order drilling pre-selected set; then, since 'drl7-10' and 'drl9-10' have an inclusion relationship, the drilling hole 'drl9-10' with fewer connected copper layers is added to the 4th order drilling pre-selected set. At this time, the remaining 'drl3-6', 'drl7-10', and 'drl11-20' in the 3rd order drilling pre-selected set are the third order drilling holes;

[0043] When k=4, the drill hole that connects the most copper layers is 'drl13-20', and its parallel layer drill holes are 'drl9-10', 'drl5-6', 'drl11-12', and there is no inclusion relationship between them, so 'drl9-10', 'drl5-6', 'drl11-12', 'drl13-20' are fourth-order drill holes; the remaining 'drl13-14', 'drl15-16', 'drl19-20' are added to the k+1th order, that is, the 5th order drill hole pre-selection set. At this time, since all the drill holes in the 5th order drill hole pre-selection set connect the same number of copper layers, all the drill holes in the 5th order drill hole pre-selection set are taken as the last order drill holes, that is, the 5th order drill holes, and the drilling grouping ends.

[0044] Store all these drill holes in a list. Figure 2 Taking the pressed structure as an example, the result is the first-order drilling: ['drl']

[0045] Second stage drilling: ['drl1-2', 'drl3-20']

[0046] Third-order drilling: ['drl3-6', 'drl7-10', 'drl11-20']

[0047] Fourth-order drilling: ['drl9-10', 'drl5-6', 'drl11-12', 'drl13-20']

[0048] Fifth-order drilling: ['drl13-14', 'drl15-16', 'drl19-20']

[0049] S4. Circulate the circuit layers with the same starting point or end point of the drilling, and build a protective layer on the layer with less drilling conduction (the layer with less drilling connection copper skin layer);

[0050] First, loop all the circuit layers from the starting point of the drilling to the end point of the drilling, and store all the circuit layers that have been penetrated into the corresponding drilling holes;

[0051] Secondly, loop through the layers with the same starting and ending points. When encountering the same starting or ending point, use the protection layer to replace the corresponding layer with less conduction, and name it as the current layer in front and the corresponding layer in the back, such as the l1-l2 layer in the drl1-2 layer;

[0052] The final results are as follows:

[0053] This represents the circuit layer through which the hole is drilled. The first part is the drilling name, and the second part is the circuit layer through which the hole is drilled. 'drl': ['l1', 'l2', 'l3', 'l4', 'l5','l6', 'l7', 'l8', 'l9', 'l10', 'l11', 'l12', 'l13', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20'],

[0054] 'drl1-2': ['l1-l2', 'l2'],

[0055] 'drl3-6': ['l3-l6', ​​'l4', 'l5', 'l6'],

[0056] 'drl9-10': ['l9', 'l10-l9'],

[0057] 'drl5-6': ['l5', 'l6-l5'],

[0058] 'drl7-10': ['l7', 'l8', 'l9', 'l10'],

[0059] 'drl11-12': ['l11-l12', 'l12'],

[0060] 'drl3-20': ['l3', 'l4', 'l5', 'l6', 'l7', 'l8', 'l9', 'l10', 'l11', 'l12', 'l13', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20-l3'],

[0061] 'drl13-14': ['l13-l14', 'l14'], 'drl11-20': ['l11', 'l12', 'l13', 'l14','l15', 'l16', 'l17', 'l18', 'l19', 'l20-l11'],

[0062] 'drl13-20': ['l13', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20-l13'], 'drl15-16': ['l15', 'l16'],

[0063] 'drl19-20': ['l19', 'l20-l19']

[0064] S5. Loop through the conductive circuit layer of each drilled hole, read the pressed structure, find the top surface or bottom surface corresponding to the circuit, and fill the missing layer with a protective layer.

[0065] First, loop all the circuit layers in each drill hole corresponding to the laminated structure. The upper layer of the substrate in the laminated structure is the top surface, and the lower layer of the substrate is the bottom surface. Use the code to find the dielectric layer of the core, and then find the layers above and below it. Next, find the single layer in the corresponding drill hole, and add a protective film to the missing layer;

[0066] Since the copper and the substrate on the upper and lower sides of a substrate are a whole, but when grouped, the two sides are not in the same production level, which involves that the circuit layer facing inward needs to be produced in the previous level process, and the circuit layer facing outward needs to be produced in the next level process. Therefore, there will be a single layer at this position, and the other layer that needs to be produced in the next level needs to be protected by the film to protect the copper skin from damage.

[0067] The final effect is as follows:

[0068] <h2 style=";text-align:left;direction:ltr">'drl': ['l1', 'l2', 'l3', 'l4', 'l5', 'l6', 'l7', 'l8', 'l9', 'l10', 'l11', 'l12', 'l13', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0069] <h2 style=";text-align:left;direction:ltr"> 'drl1-2': ['l1-l2', 'l2'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0070] <h2 style=";text-align:left;direction:ltr"> 'drl3-6': ['l3-l6', ​​'l3-l4', 'l4', 'l5', 'l6-l5', 'l6'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0071] <h2 style=";text-align:left;direction:ltr"> 'drl9-10': ['l9', 'l10-l9'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0072] <h2 style=";text-align:left;direction:ltr"> 'drl5-6': ['l5', 'l6-l5'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0073] <h2 style=";text-align:left;direction:ltr"> 'drl7-10': ['l7', 'l7-l8', 'l8', 'l9', 'l10-l9', 'l10'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0074] <h2 style=";text-align:left;direction:ltr"> 'drl11-12': ['l11-l12', 'l12'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0075] <h2 style=";text-align:left;direction:ltr"> 'drl3-20': ['l3', 'l3-l4', 'l4', 'l5', 'l6', 'l7', 'l8', 'l9', 'l10', 'l11', 'l12', 'l13', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20-l19', 'l20-l3'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0076] <h2 style=";text-align:left;direction:ltr"> 'drl13-14': ['l13-l14', 'l14'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0077] <h2 style=";text-align:left;direction:ltr"> 'drl11-20': ['l11', 'l11-l12', 'l12', 'l13', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20-l19', 'l20-l11'],<h2 style=";text-align:left;direction:ltr"> <h2 style=";text-align:left;direction:ltr">

[0078] 'drl13-20': ['l13', 'l13-l14', 'l14', 'l15', 'l16', 'l17', 'l18', 'l19', 'l20-l19', 'l20-l13'],

[0079] 'drl15-16': ['l15', 'l16'],

[0080] 'drl19-20': ['l19', 'l20-l19']

[0081] In the embodiment of the present application, the required data is the first and third data. Finally, the data class graph structure we implemented is

[0082] The first pressing structure ~ the fourth pressing structure is as follows Figure 3~Figure 6 As shown; after the fifth structure is completed, the complete pressed structure is achieved.

[0083] The above is a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

Claims

1. A method for adding a protective layer to a mechanical blind buried hole press-fit structure based on drilling grouping, characterized in that: The following steps are involved: S1. The composition of a given mechanical blind buried hole pressing structure: the mechanical blind buried hole pressing structure comprises a plurality of core boards pressed sequentially from top to bottom, any two adjacent core boards are fixed by an adhesive, each core board comprises a substrate layer and copper skin layers located on the upper and lower surfaces of the substrate layer, and each copper skin layer is a circuit layer of the pressing structure; S2. In a given mechanical blind buried hole pressing structure, all the drill holes that need to be processed, and the copper layer and substrate layer that each drill hole needs to connect to; S3. loop all the drilling holes, group them by parallel level, obtain drilling holes of different orders, and process the drilling holes and corresponding circuit layers from high to low order during processing; S4. loop out the circuit layers with the same starting point or end point of the drilling, and build a protective layer for the layer with less drilling conduction; S5. Cycle the conductive circuit layer of each drilled hole. For the drilled holes that penetrate more than two core boards, read the pressed structure, find the top and bottom surfaces of the corresponding circuit layers, and fill the missing layers with protective layers.

2. The method for adding a protective layer to a mechanical blind and buried via pressing structure based on drilling grouping according to claim 1, characterized in that: The base material layer and the copper layers on the upper and lower surfaces of each core board are an integrated structure.

3. The method for adding a protective layer to a mechanical blind and buried via pressing structure based on drilling grouping according to claim 1, characterized in that: The step S3 comprises: S301. Loop to find the drilling holes that connect the most copper layers as the first-order drilling holes; S302. Cycle the remaining boreholes outside the first-stage boreholes, and add all the boreholes included in the first-stage boreholes to the pre-selected set of the second-stage boreholes; The method of determining whether a drill hole is included in the first-order drill hole is as follows: if all copper layers connected by any drill hole are connected by the first-order drill hole, the drill hole is considered to be included in the first-order drill hole; S303. From the pre-selected set of k-th order drilling holes, find the drilling holes that connect the copper layer the most and the drilling holes in the parallel layer; Among them, the parallel layer drilling of the drilling holes connecting the most copper skin layers is determined as follows: first, the drilling holes connecting the most copper skin layers are taken as reference drilling holes. For any drilling hole in the pre-selected set of k-th order drilling holes, if the copper skin layers connected between the drilling hole and the reference drilling hole do not intersect, then the drilling hole is the parallel layer drilling hole connecting the most copper skin layers. When there are multiple parallel layer drill holes, determine whether there is an inclusion relationship between the parallel layer drill holes, where the inclusion relationship means that all copper layers connected by one parallel layer drill hole are connected by the other parallel layer drill holes; If there is no inclusion relationship, the drill holes that connect the most copper layers and the drill holes in the parallel layers are taken as the k-th order drill holes, and the remaining drill holes are added to the candidate set of the k+1-th order drill holes; If there is an inclusion relationship, first, in the pre-selected set of k-th order drilling holes, the drilling holes with the most connected copper layers and the drilling holes in the parallel layers are added to the pre-selected set of k+1-th order drilling holes; then, among the parallel layer drilling holes with an inclusion relationship, the drilling holes with fewer connected copper layers are added to the pre-selected set of k+1-th order drilling holes, and the remaining drilling holes in the pre-selected set of k-th order drilling holes are the k-th order drilling holes; S304. When k=2,3,…, repeat step S303; When the number of copper layers connected by all the holes in the pre-selected set of k+1-order holes is the same, all the holes in the pre-selected set of k+1-order holes are taken as the last-order holes, i.e., k+1-order holes, and the drilling grouping ends; During actual processing, the processing is carried out from high to low according to the drilling order.

4. The method for adding a protective layer to a mechanical blind and buried via pressing structure based on drilling grouping according to claim 1, characterized in that: The step S4 comprises: S401. Circulate all the circuit layers from the drilling start point to the copper layers at the drilling end point, and store all the connected copper layers into the corresponding drilling holes; S402. Circularly drill the layers with the same starting point and end point. When encountering the same starting point or end point, add a protective layer to the uppermost copper layer and the lowermost copper layer connected by the drill holes that penetrate fewer circuit layers. The protective layer uses a protective film.

5. The method for adding a protective layer to a mechanical blind and buried via pressing structure based on drilling grouping according to claim 1, characterized in that: The step S5 comprises: For the drilled holes that penetrate more than two core boards, all the copper layers in each drilled hole are circulated corresponding to the pressed structure to find the top copper layer and the bottom copper layer of the pressed structure, and it is determined whether the top copper layer and the bottom copper layer of the pressed structure are missing the protective layer. If the protective layer is missing, the missing protective layer is added.

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