Inverter heat dissipation structure and design method thereof

Abstract

The invention discloses an inverter heat dissipation structure and a design method thereof. The inverter heat dissipation structure comprises a fan, a radiator and a fan box. The height of the fan box is greater than that of the radiator, so that the fan box is connected with one side of the radiator through an inclined top plate; the fan is installed in the fan box, the area, corresponding to the fan, of the top plate is a flow guide area, and heat dissipation holes are formed in the area, outside the flow guide area, of the top plate. The design method is used for designing the heat dissipation structure of the inverter. The fan has the beneficial effects that on the premise that the air volume needed by a main area is not reduced, loss airflow caused by inclination of the top plate is efficiently utilized, the working efficiency of the fan is improved, noise is reduced, and the nearby heat source area can be cooled.

Description

Technical Field

[0001] The present application relates to the technical field of inverters, and in particular to an inverter heat dissipation structure and a design method thereof. Background Art

[0002] With the continuous development of the electronics industry, the size of electronic equipment is constantly decreasing, but the power consumption is gradually increasing. In order to solve the heat dissipation problem of the equipment, fans and radiators are increasingly used in the heat dissipation of electronic equipment. At the same time, due to factors such as structure, noise, EMC and safety regulations, fans are generally fixed in the fan box.

[0003] In the inverter, due to the high power consumption of the inverter, a fan with a relatively large air volume is required for cooling. Fans with a large air volume are generally taller. If a radiator of the same height is configured, the heat dissipation efficiency of the radiator will be seriously reduced and the pressure loss of the flow channel will be increased. Therefore, the conventional practice is to tilt the top plate of the fan box at a certain angle to keep the outlet height of the fan box consistent with the height of the radiator.

[0004] However, in actual use, it was found that tilting the top plate not only reduces the working efficiency of the fan, but also forms vortices near the top plate of the fan box, thereby causing a loss of fan air volume and preventing the fan from operating in the high-efficiency zone. In severe cases, the fan noise may increase. Summary of the invention

[0005] One of the objectives of the present application is to provide an inverter heat dissipation structure that can solve at least one defect in the above-mentioned background technology.

[0006] Another object of the present application is to provide a design method for an inverter heat dissipation structure that can solve at least one defect in the above-mentioned background technology.

[0007] In order to achieve at least one of the above-mentioned purposes, the technical solution adopted in the present application is: an inverter heat dissipation structure, comprising a fan, a radiator and a fan box; the height of the fan box is greater than the height of the radiator, so that the fan box is connected to one side of the radiator through an inclined top plate; the fan is installed on the fan box, the area of ​​the top plate corresponding to the fan is a guide area, and the top plate is provided with heat dissipation holes in the area outside the guide area.

[0008] Preferably, the guide area is rectangular, and the heat dissipation holes are arranged in two heat dissipation areas on both sides of the guide area along the width direction of the top plate.

[0009] Preferably, the guide area is rectangular, and the heat dissipation holes are arranged in two heat dissipation areas on both sides of the guide area along the width direction of the top plate, and in the heat dissipation area on the upper side of the guide area along the height direction of the top plate.

[0010] Preferably, a single heat dissipation hole is provided in a single heat dissipation area, and the area of ​​the heat dissipation hole is greater than 50% of the area of ​​the single-side area.

[0011] Preferably, the distance from the edge of the heat dissipation hole close to the guide area to the guide area is 5% to 10% of the width of the guide area, and the distance from the edge of each heat dissipation hole to the edge of the top plate is greater than or equal to the thickness of the top plate.

[0012] Preferably, a plurality of the heat dissipation holes are arranged in an arranged manner in a single heat dissipation area, and the total area of ​​all the heat dissipation holes is greater than 30% of the area of ​​a single side area.

[0013] Preferably, the plurality of heat dissipation holes are arranged in at least one group; the distance from the edge of each heat dissipation hole to the edge of the top plate and to the edge of the guide area is greater than or equal to the thickness of the top plate; the edge spacing between two adjacent groups of heat dissipation holes is greater than or equal to the thickness of the top plate.

[0014] A design method for an inverter heat dissipation structure includes the following design steps: selecting an inclination angle of a top plate according to the structural dimensions and installation dimensions of a radiator and a fan; projecting the fan onto the top plate after the selected inclination angle, thereby dividing a guide area; and opening heat dissipation holes that meet the structural strength requirements of the top plate in other areas of the top plate according to the divided guide areas.

[0015] Preferably, the calculation formula of the inclination angle K of the top plate is: K=arctan[(ZS) / (LBH)];

[0016] Where Z represents the distance between the fan and the radiator, S represents the distance from the fin of the radiator to the edge of the substrate, L represents the height of the fan, B represents the thickness of the radiator substrate, and H represents the height of the fin of the radiator;

[0017] When selecting the inclination angle of the top plate, the value of Z is adjusted so that the inclination angle K of the top plate is within the range of 45° to 90°.

[0018] Preferably, the specific division of the guide area includes the following process: projecting the fan hub onto the top plate to obtain an elliptical first projection surface; increasing the major axis of the first projection surface by 20% to 50% and using it as the diameter to draw a circle around the center of the first projection surface to obtain a second projection surface; drawing tangents to the second projection surface along the width and height directions of the top plate, and the intersection area of ​​the tangents is the guide area.

[0019] Compared with the prior art, the beneficial effects of this application are:

[0020] The present application can make efficient use of the lost airflow caused by the tilt of the top plate without reducing the air volume required in the main area, which not only increases the working efficiency of the fan and reduces noise, but also can cool the nearby heat source area. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the internal structure of the inverter in this application.

[0022] Figure 2 It is a partial schematic diagram of the fan delivering heat dissipation airflow to the heat sink in the present application.

[0023] Figure 3 This is a schematic structural diagram of one example of opening a single heat dissipation hole in a single-side area in the present application.

[0024] Figure 4 This is a schematic structural diagram of another example of opening a single heat dissipation hole in a single-side area in the present application.

[0025] Figure 5 This is a structural schematic diagram of one example of opening multiple heat dissipation holes in a single-side area in this application.

[0026] Figure 6 This is a schematic structural diagram of another example of opening multiple heat dissipation holes in a single-side area in the present application.

[0027] Figure 7 The figure is a schematic diagram of the design process of the inverter heat dissipation structure in this application.

[0028] In the figure: a fan box 100 , a top plate 110 , a guide area 111 , a heat dissipation hole 112 , a first projection surface 121 , an offset projection surface 122 , a second projection surface 123 , a fan 200 , a heat sink 300 , a base plate 310 , fins 320 , and a power board 400 . DETAILED DESCRIPTION

[0029] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0030] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0031] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0032] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0034] The terms "including" and "having" and any variations thereof in the specification and claims of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0035] In order to facilitate understanding of the technical solution of the present application, the heat dissipation structure of a conventional inverter is briefly described below. Figure 1 and Figure 2 As shown, the conventional inverter heat dissipation structure includes a fan 200, a radiator 300 and a fan box 100. When selecting the fan 200 and the radiator 300, in most cases, it is impossible to achieve that the two have equal heights, and according to the heat dissipation efficiency of the two, the height of the fan 200 is generally higher than that of the radiator 300. In order to ensure that the heat dissipation airflow output by the fan 200 can be mainly concentrated in the area corresponding to the fins 320 of the radiator 300, it is necessary to connect the fan box 100 for mounting the fan 200 with the base plate 310 of the radiator 300 through an inclined top plate 110, so that the top plate 110 can form a guide channel to achieve the purpose of guiding most of the heat dissipation airflow output by the fan 200 to the position of the fins 320 of the radiator 300.

[0036] However, the airflow output by the fan 200 directly facing the top plate 110 (corresponding to Figure 2 From the analysis of the thick dotted line in the middle, it can be seen that the inclined top plate 110 will guide part of the airflow downward, and will also guide part of the airflow upward. Since there will be a gap between the fan 200 and the fan box 100 during installation, especially in the top area of ​​the fan box 100; the gap in the top area will cause the airflow directed upward by the top plate 110 to flow back to the inlet area of ​​the fan 200, thereby forming a local airflow circulation area. The local airflow circulation area will disturb the normal operation of the fan 200 to reduce the working efficiency of the fan 200, and will also increase the working noise of the fan 200. Therefore, the technical solution of the present application is to optimize the heat dissipation efficiency of the fan 200 by structurally designing the top plate 110.

[0037] One aspect of the present application provides an inverter heat dissipation structure, such as Figure 1 As shown, one preferred embodiment includes a fan 200, a heat sink 300 and a fan box 100. The height of the fan box 100 is greater than the height of the heat sink 300, so that the fan box 100 is connected to one side of the heat sink 300 through an inclined top plate 110. The fan 200 is installed on the fan box 100, and the area of ​​the top plate 110 corresponding to the fan 200 is a guide area 111, and the top plate 110 is provided with heat dissipation holes 112 in the area outside the guide area 111.

[0038] It is understandable that the guide area 111 on the top plate 110 mainly guides the airflow blown toward the top plate 110 by the fan 200. The airflow blown toward the top plate 110 by the fan 200 can be regarded as a concentrated airflow column. When the airflow column contacts the top plate 110, due to the obstruction of the top plate 110, the flow rate of the airflow in the airflow column will be reduced and dispersed in all directions along the edge of the airflow column. At this time, the flow rate of the lower area of ​​the airflow column close to the radiator 300 is much lower than the flow rate of the airflow blown toward the part of the radiator 300 by the fan 200. Then, according to the Bernoulli principle, it can be known that the airflow in the lower part of the airflow column will flow downward toward the radiator 300 under pressure. For the airflow that is dispersed in the upper part of the airflow column and along the width direction of the top plate 110, it can flow out through the heat dissipation holes 112 opened in the area of ​​the top plate 110 except the guide area 111, thereby avoiding the formation of a local airflow circulation area. Therefore, the airflow loss caused by the tilt of the top plate 110 can be efficiently utilized without reducing the air volume required in the main area, which not only increases the working efficiency of the fan 200 but also reduces the working noise of the fan 200.

[0039] At the same time, those skilled in the art should know that the function of the radiator 300 is to transfer the heat generated by the power board 400 in the inverter during operation from the inside to the outside, and then dissipate the heat under the action of the heat dissipation airflow of the fan 200. Specifically, the radiator 300 includes a substrate 310 and fins 320; one side of the substrate 310 is used to install the power board 400, and the other side of the substrate 310 is used to install the fins 320. During the operation of the power board 400, the substrate 310 can absorb the heat generated by the power board 400 and transfer it to the fins 320. In the technical solution of the present application, due to the opening of the heat dissipation holes 112, part of the airflow generated by the fan 200 can be output along the heat dissipation holes 112 to the area of ​​the power board 400, and then the heat source area formed by the power board 400 can be dissipated.

[0040] It should be noted that in order for the airflow overflowing from the heat dissipation hole 112 to the power board 400 area to stably dissipate heat for the power board 400, corresponding guide holes may also be opened on the side of the inverter case opposite to the heat dissipation hole 112, thereby forming a heat dissipation channel between the heat dissipation hole 112 and the guide holes.

[0041] In this embodiment, Figure 1As shown, the number of fans 200 used for heat dissipation of the inverter is generally multiple, and the multiple fans 200 can be arranged at equal intervals along the width direction of the top plate 110. In this way, the top plate 110 can be divided into multiple local areas corresponding to the fans 200 along the width direction. A guide area 111 corresponding to the fan 200 is provided in each local area, and a heat dissipation hole 112 is provided in the remaining area of ​​each local area except the guide area 111, thereby ensuring that all fans 200 can improve work efficiency as much as possible and reduce noise while keeping the air volume unchanged.

[0042] It is understandable that the specific shape of the flow guide area 111 can be rectangular or elliptical. Figures 3 to 6 As shown, in this embodiment, the specific shape of the guide area 111 is preferably a rectangle.

[0043] It should be known that the fan 200 used for inverter heat dissipation generally adopts an axial flow fan, that is, the cross-sectional shape of the airflow blown by the fan 200 should be circular in theory. Since the top plate 110 is inclined to the airflow direction of the fan 200, the contact area between the airflow blown by the fan 200 and the top plate 110 should be elliptical in theory. However, the airflow of the fan 200 during actual operation is affected by various factors, such as interference from adjacent fans 200, etc., which makes the cross-sectional shape of the airflow deviate from the theoretical shape. Therefore, in this embodiment, the guide area 111 is set to a rectangle to increase the guide area.

[0044] In this embodiment, when the heat dissipation holes 112 are opened on the top plate 110, an excessively large opening area will reduce the airflow flowing through the radiator 300 to increase the thermal risk of the inverter, and may also affect the structural strength of the top plate 110; therefore, the opening size and opening position of the heat dissipation holes 112 can be designed according to the specific area of ​​the top plate 110 where the guide area 111 is located. Specifically, if Figures 3 to 6 As shown, the guide area 111 of the top plate 110 corresponding to the fan 200 is generally located in the middle and lower areas of the top plate 110. Then, there are mainly two ways to limit the specific setting area of ​​the heat dissipation hole 112 based on the specific position of the guide area 111, which will be described in detail below.

[0045] Structure 1: Figures 3 to 6 As shown, if the top plate 110 is located in the upper area of ​​the guide area 111, the structural strength requirement of the top plate 110 can be met when the heat dissipation holes 112 are opened; then for the entire top plate 110, the heat dissipation holes 112 can be set in two heat dissipation areas on both sides of the guide area 111 along the wide bandwidth direction of the top plate 110, and the heat dissipation area on the upper side of the guide area 111 along the height direction of the top plate 110.

[0046] Structure 2: If the upper area of ​​the top plate 110 located in the guide area 111 cannot meet the structural strength requirements of the top plate 110 when the heat dissipation holes 112 are opened; then the heat dissipation holes 112 will not be opened in the upper area of ​​the top plate 110 located in the guide area 111; at this time, for the entire top plate 110, the heat dissipation holes 112 are set in two heat dissipation areas on both sides of the guide area 111 along the width direction of the top plate 110.

[0047] It is understandable that both of the above structures can meet the requirements of this application, and can be selected according to the specific installation structure of the top plate 110 and the fan 200. Whether the heat dissipation holes 112 meet the structural strength requirements of the top plate 110 is also related to the opening form of the heat dissipation holes 112, which will be described in detail below.

[0048] In this embodiment, there are many specific ways to open the heat dissipation hole 112, which will be described in detail below through two specific examples.

[0049] Example 1: Figure 3 and Figure 4 As shown, a single heat dissipation hole 112 is provided in a single heat dissipation area, and the area of ​​the heat dissipation hole 112 is greater than 50% of the area of ​​the single-side area.

[0050] Specifically, the design requirement for the heat dissipation holes 112 is to increase the area of ​​the heat dissipation holes 112 as much as possible under the premise of ensuring the structural strength of the top plate 110. For the above-mentioned example 1, in order to ensure the structural strength of the top plate 110, it is necessary to ensure that the distance F between the edge of the heat dissipation hole 112 close to the guide area 111 and the guide area 111 is 5% to 10% of the width of the guide area 111, thereby avoiding the structural degradation caused by the hollowing of the heat dissipation holes 112 affecting the guide area 111; at the same time, the distance from the edge of each heat dissipation hole 112 to the edge of the top plate 110 is greater than or equal to the thickness of the top plate 110.

[0051] It is understandable that if Figure 3 and Figure 4 As shown, taking the heat dissipation holes 112 on both sides of the guide area 111 along the width direction of the top plate 110 as an example, the distance from the edge of the heat dissipation hole 112 to the edge of the top plate 110 mainly includes the spacing P1 in the width direction of the top plate 110 and the spacing P2 in the height direction of the top plate 110. When designing the heat dissipation hole 112, it is necessary to simultaneously meet the requirement that both P1 and P2 are greater than or equal to the thickness of the top plate 110; if not, the form of opening a single heat dissipation hole 112 on one side is abandoned, and the following example 2 of the heat dissipation hole 112 opening form is selected.

[0052] It should be noted that, for the heat dissipation holes 112 opened in the upper area of ​​the guide area 111 in the aforementioned structure 2, it is necessary to satisfy P2 that is greater than twice the thickness of the sheet metal; that is, the distance from the edge of the heat dissipation hole 112 located in the upper area of ​​the guide area 111 to the upper edge of the top plate 110 and the upper edge of the guide area 111 must be greater than the thickness of the top plate 110; if this cannot be satisfied, the structure 2 cannot be set up, and only the aforementioned structure 1 can be used.

[0053] Example 2: Figure 5 and Figure 6 As shown, a plurality of heat dissipation holes 112 arranged in an array are arranged in a single heat dissipation area, and the total area of ​​all the heat dissipation holes 112 is greater than 30% of the area of ​​the single side area.

[0054] Specifically, for the above-mentioned example 2, in order to ensure the structural strength of the top plate 110, the multiple heat dissipation holes 112 are arranged in at least one group; the distance from the edge of each heat dissipation hole 112 to the edge of the top plate 110 and to the edge of the guide area 111 is greater than or equal to the thickness of the top plate 110; the edge spacing between two adjacent groups of heat dissipation holes 112 is greater than or equal to the thickness of the top plate 110.

[0055] It is understandable that the area of ​​the heat dissipation hole 112 in Example 2 is much smaller than that of the heat dissipation hole 112 in Example 1, so the multiple heat dissipation holes 112 in Example 2 can form a dense heat dissipation structure, and the hollow structure formed by a single heat dissipation hole 112 has a limited degree of reduction in the strength of the top plate 110, and will be further weakened by the connection area between adjacent heat dissipation holes 112. Therefore, in Example 2, there is no need to perform an offset design for the spacing distance between the heat dissipation hole 112 and the guide area 111, and it is only necessary to include a spacing greater than or equal to the thickness of the top plate 110.

[0056] In this embodiment, there are many specific structural shapes of the heat dissipation holes 112 that can achieve the above heat dissipation function, such as Figures 3 to 6 As shown, ellipse, circle and polygon etc. can be used. For the above example 1, as Figure 3 and Figure 4 As shown, since the number of heat dissipation holes 112 on one side is one, in order to increase the area of ​​the heat dissipation holes 112 as much as possible, the shape of the heat dissipation holes 112 is preferably rectangular or elliptical. Figure 5 and Figure 6 As shown, in order to ensure that the plurality of heat dissipation holes 112 are evenly distributed, the shape of the heat dissipation holes 112 is preferably circular or regular polygonal.

[0057] It is understandable that the shapes of the heat dissipation holes 112 in different areas may be the same or different; and the shape design of the heat dissipation holes 112 may be any combination as long as the structural strength of the top plate 110 is met.

[0058] Another aspect of the present application provides a design method for an inverter heat dissipation structure, such as Figure 7 As shown, the design includes the following steps: the inclination angle of the top plate 110 is selected according to the structural dimensions and installation dimensions of the radiator 300 and the fan 200. The fan 200 is projected on the top plate 110 after the selected inclination angle, thereby dividing the guide area 111. According to the divided guide area 111, heat dissipation holes 112 that meet the structural strength requirements of the top plate 110 are opened in other areas of the top plate 110.

[0059] It is understandable that the guide area 111 is mainly obtained by projecting the structural dimensions of the fan 200, and the specific position of the guide area 111 on the top plate 110 is affected by the inclination angle of the top plate 110, so the inclination angle of the top plate 110 needs to be determined before dividing the guide area 111. The inclination angle of the top plate 110 is mainly affected by the structural dimensions and installation dimensions of the fan 200 and the radiator 300; therefore, the inclination angle of the top plate 110 can be selected according to the structural dimensions and installation dimensions of the fan 200 and the radiator 300.

[0060] Specifically, Figure 2 As shown, the height of the fan 200 is L, the thickness of the fan 200 is W, the distance between the fan 200 and the radiator 300 is Z, the height of the fin 320 of the radiator 300 is H, the thickness of the substrate 310 of the radiator 300 is B, and the distance from the fin 320 of the radiator 300 to the edge of the substrate 310 is S.

[0061] From the above geometric dimensions, it can be obtained that: tanK = (ZS) / (LHB); then the calculation formula for the inclination angle K of the top plate 110 is: K = arctan[(ZS) / (LBH)].

[0062] According to the experience of those skilled in the art, the value of the inclination angle K of the top plate 110 is generally within the range of 45° to 90°; if the inclination angle K is lower than 45°, the working efficiency of the fan 200 will be greatly reduced. Therefore, when the structural dimensions of the fan 200 and the radiator 300 have been selected as fixed values, the inclination angle K of the top plate 110 is adjusted and selected by adjusting the value of the distance Z between the fan 200 and the radiator 300. It should be noted that the value of the distance Z between the fan 200 and the radiator 300 is generally Z=(1~3)W.

[0063] In this embodiment, the specific division of the guide area 111 includes the following process: the hub of the fan 200 is projected onto the top plate 110 to obtain an elliptical first projection surface 121 (such as Figures 3 to 6The solid line elliptical area shown in FIG. 1 ). The long axis of the first projection surface 121 is increased by 20% to 50% and a circle is drawn around the center of the first projection surface 121 as the diameter to obtain the second projection surface 123 (as shown in FIG. Figures 3 to 6 The solid circle area shown in FIG. 1 ). A tangent line is drawn to the second projection surface 123 along the width direction and the height direction of the top plate 110, and the intersection area of ​​the tangent line is the guide area 111 (as shown in FIG. Figures 3 to 6 The dot-dash area shown in ).

[0064] It is understandable that there are many specific implementations for increasing the long axis of the first projection surface 121 by 20% to 50%. For example, the long axis of the first projection surface 121 can be directly increased in length; or the first projection surface 121 can be offset by an offset distance of 10% to 25% of the long axis of the first projection surface 121, thereby obtaining an elliptical offset projection surface 122 (such as Figures 3 to 6 Then, taking the major axis of the offset projection surface 122 as the diameter, a circle is drawn around its own center to obtain the desired second projection surface 123.

[0065] It should be known that when the fan 200 is projected onto the top plate 110, the outer contour of the fan 200 may also be used for projection. However, considering that the outer contour of the fan 200 is affected by the spiral structure of the blades and is not necessarily a complete circle, the structure obtained by projection may be discontinuous. The hub of the fan 200 is a complete circular structure, and the shape of its projection on the top plate 110 will inevitably be a complete ellipse, so in this embodiment, the hub of the fan 200 is preferably used for projection. Since the cross-sectional size of the airflow path generated by the fan 200 is larger than the hub size, in order to ensure that most of the airflow generated by the fan 200 can be diverted to the area of ​​the radiator 300, the first projection surface 121 needs to be offset; the specific offset size is related to the blade size of the fan 200, and technicians in this field can choose it according to actual needs, and only need to ensure that more than 85% of the airflow output by the fan 200 that is blocked by the top plate 110 is located in the diversion area 111.

[0066] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. An inverter heat dissipation structure, comprising a fan, a radiator and a fan box; the height of the fan box is greater than the height of the radiator, so that the fan box is connected to one side of the radiator through an inclined top plate; characterized in that: The fan is installed on the fan box, the area of ​​the top plate corresponding to the fan is a guide area, and the top plate is provided with heat dissipation holes in an area outside the guide area.

2. The inverter heat dissipation structure according to claim 1, characterized in that: The guide area is rectangular, and the heat dissipation holes are arranged in two heat dissipation areas on both sides of the guide area along the width direction of the top plate.

3. The inverter heat dissipation structure according to claim 1, characterized in that: The guide area is rectangular, and the heat dissipation holes are arranged in two heat dissipation areas on both sides of the guide area along the width direction of the top plate, and in the heat dissipation area on the upper side of the guide area along the height direction of the top plate.

4. The inverter heat dissipation structure according to claim 2 or 3, characterized in that: A single heat dissipation hole is arranged in a single heat dissipation area, and the area of ​​the heat dissipation hole is greater than 50% of the area of ​​the single-side area.

5. The inverter heat dissipation structure according to claim 4, characterized in that: The distance from the edge of the heat dissipation hole close to the guide area to the guide area is 5% to 10% of the width of the guide area, and the distance from the edge of each heat dissipation hole to the edge of the top plate is greater than or equal to the thickness of the top plate.

6. The inverter heat dissipation structure according to claim 2 or 3, characterized in that: A plurality of heat dissipation holes are arranged in an array in a single heat dissipation area, and the total area of ​​all the heat dissipation holes is greater than 30% of the area of ​​a single side area.

7. The inverter heat dissipation structure according to claim 6, characterized in that: The plurality of heat dissipation holes are arranged in at least one group; the distance from the edge of each heat dissipation hole to the edge of the top plate and to the edge of the guide area is greater than or equal to the thickness of the top plate; the edge spacing between two adjacent groups of heat dissipation holes is greater than or equal to the thickness of the top plate.

8. A method for designing an inverter heat dissipation structure according to any one of claims 1 to 7, characterized in that: The design steps include: The tilt angle of the top plate is selected according to the structural dimensions and installation dimensions of the radiator and fan; Project the fan profile on the top plate after the selected tilt angle, and then divide the guide area; According to the divided diversion areas, heat dissipation holes that meet the structural strength requirements of the top plate are opened in other areas of the top plate.

9. The design method of the inverter heat dissipation structure according to claim 8, characterized in that: The calculation of the inclination angle K of the top plate is: K = arctan [(ZS) / (LBH)]; Where Z represents the distance between the fan and the radiator, S represents the distance from the fin of the radiator to the edge of the substrate, L represents the height of the fan, B represents the thickness of the radiator substrate, and H represents the height of the fin of the radiator; When selecting the inclination angle of the top plate, the value of Z is adjusted so that the inclination angle K of the top plate is within the range of 45° to 90°.

10. The design method of the inverter heat dissipation structure according to claim 8, characterized in that: The specific division of the diversion area includes the following processes: Projecting the fan hub onto the top plate to obtain an elliptical first projection surface; The long axis of the first projection surface is increased by 20% to 50% and a circle is drawn around the center of the first projection surface as the diameter to obtain a second projection surface; Tangents are drawn along the width and height directions of the top plate on the second projection surface, and the intersection area of ​​the tangents is the guide area.

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