Head-mounted display with efficient heat dissipation system

Abstract

The invention relates to a head-mounted display with an efficient heat dissipation system, which comprises a display main body, the display main body is provided with a heat dissipation channel which sequentially passes through a display module and a mainboard module, the heat dissipation channel is provided with an air inlet and an air outlet, and air enters the display main body through the air inlet and is discharged to the outside of the display main body through the air outlet; a heat dissipation module for accelerating air flow is arranged in the heat dissipation channel; the display body further comprises a heat conduction assembly connected with the mainboard module, and the heat conduction assembly is provided with a plurality of heat dissipation faces which are arranged at intervals. The heat dissipation channel can dissipate heat of the display module and the mainboard module at the same time, and heat generated by the display module and the mainboard module is discharged outwards through air flow formed by matching the heat dissipation channel with the heat dissipation module; the heat conduction assembly abuts against a heating source of the mainboard module, and heat is conducted outwards through the multiple heat dissipation faces in sequence. Secondary heat dissipation is realized; due to the arrangement of a plurality of heat dissipation surfaces, the effective heat dissipation surface area is increased; and heat is uniformly distributed on a two-dimensional plane, so that the heat is effectively transferred.

Description

Technical Field

[0001] The present invention relates to the technical field of head mounted displays, and more particularly to a head mounted display with an efficient heat dissipation system. Background Art

[0002] Head-mounted display (HMD), also known as head display, can achieve different effects such as virtual reality (VR), augmented reality (AR), and mixed reality (MR) by sending optical signals to the eyes through various head displays.

[0003] During operation, the head-mounted display not only needs to process complex image and video data, but also needs to support high-speed computing and interaction with external devices, which will cause the device to generate a lot of heat during operation. In addition, the internal structure of the head-mounted display usually integrates a variety of modules with different functions, such as lens modules, motherboard control modules, display modules, etc. These modules are compactly arranged and close to each other. When the device is running, each module will generate heat. Due to limited space, the heat is easy to accumulate inside and is difficult to dissipate naturally, which will cause the overall temperature of the device to rise, affecting the performance and service life of the device.

[0004] At present, some head-mounted displays use passive heat dissipation methods, such as setting up fin-type heat sinks or graphite heat sinks, etc., to conduct heat by increasing the heat dissipation area. However, the heat dissipation efficiency of this method is relatively low, and for high-performance head-mounted displays, it is often difficult to meet the heat dissipation requirements. Some head-mounted displays also use active heat dissipation technology, such as adding fans to accelerate air flow and improve heat dissipation efficiency. However, it also brings new problems, such as noise problems caused by high temperature and high fan power, and the problem of increased equipment weight caused by setting up fans.

[0005] The Chinese patent with publication number CN210348058U discloses a virtual reality head-mounted display device, in which a heat sink is covered above the chipset in the PCB assembly, and a heat dissipation hole corresponding to the heat sink is provided on the top side of the shell. The heat generated by the chipset is dissipated outward through the heat dissipation hole by conduction of the heat sink. However, the heat dissipation efficiency of this heat transfer method is relatively low, and it is often difficult to meet the heat dissipation requirements for high-performance head-mounted displays; and the heat sink is also connected to the lens barrel bracket, transferring heat to the lens barrel bracket to assist in heat dissipation, which easily leads to an increase in body temperature.

[0006] The Chinese patent with publication number CN109445100A discloses a head-mounted display, and the disclosed structure uses a cooling fan to accelerate the air flow inside the head-mounted display to dissipate heat. However, as the number of electronic components inside the head-mounted display increases and the performance is enhanced, the heat generated also increases; the power of the cooling fan also needs to be gradually increased, which is prone to generate noise. Summary of the invention

[0007] The technical problem to be solved by the present invention is to provide a head mounted display with an efficient heat dissipation system in view of the above-mentioned defects of the prior art.

[0008] The technical solution adopted by the present invention to solve its technical problem is:

[0009] A head mounted display with an efficient heat dissipation system is constructed, comprising a display body, wherein the display body is provided with a heat dissipation channel which passes through a display module and a main board module in sequence, wherein the heat dissipation channel has an air inlet and an air outlet, wherein air enters the interior of the display body through the air inlet and is discharged to the exterior of the display body through the air outlet; a heat dissipation module for accelerating air flow is arranged in the heat dissipation channel; the display body further comprises a heat conduction component connected to the main board module, wherein the heat conduction component has a plurality of heat dissipation surfaces spaced apart from each other, so that the heat generated by the main board module is transferred to the exterior of the display body after passing through the plurality of heat dissipation surfaces in sequence.

[0010] As an improvement of the head mounted display, the heat dissipation channels pass through the heat conducting components and cooperate with each other to achieve heat dissipation.

[0011] As an improvement of the head-mounted display, the heat-conducting component includes a first heat sink, a second heat sink and a third heat sink, which are sequentially distributed from the inside to the outside, and the heat dissipation surface includes the first heat sink surface, the second heat sink surface and the third heat sink surface.

[0012] As an improvement of the head mounted display, the third heat sink is at least partially exposed outside the display body.

[0013] As an improvement of the head-mounted display, the heat-conducting component also includes a first heat-conducting member, a second heat-conducting member and a third heat-conducting member, the two ends of the first heat-conducting member are respectively connected to the mainboard module and the first heat sink, the first heat sink is connected to the second heat sink through the second heat-conducting member, and the two ends of the third heat-conducting member are respectively connected to the second heat sink and the third heat sink.

[0014] As an improvement of the head mounted display, it further includes a shielding cover connected to the mainboard module, and the first heat sink has the same shape as the shielding cover. The shielding cover covers the first heat sink and the first heat conductor and is connected to the second heat conductor.

[0015] As an improvement of the head-mounted display, the first heat sink, the shielding cover and the third heat sink are respectively provided with a first through hole, a second through hole and a third through hole, and the heat dissipation channel passes through the first through hole, the second through hole and the third through hole in sequence and is connected to the outside of the display body.

[0016] As an improvement of the head mounted display, the heat dissipation channel penetrates the third heat sink along the thickness direction, and at least two second heat sinks are provided, which are respectively connected to two ends of the third heat sink, and the two second heat sinks are respectively located on both sides of the heat dissipation channel.

[0017] As an improvement of the head mounted display, the display module is a dual module structure corresponding to both eyes, and two heat dissipation channels are provided, passing through the modules on both sides respectively and overlapping and connecting at the air outlet.

[0018] As an improvement of the head-mounted display, the display body includes a front shell, a middle frame and a rear shell, the heat dissipation channel has a first channel and a second channel, the first channel passes through the display module and the mainboard module in sequence, and its air inlet is located in the rear shell; the second channel is connected to the first channel, and the connection is close to the mainboard module, and the air inlet of the second channel is located in the middle frame.

[0019] As an improvement of the head-mounted display, the second heat sink is located in the front shell, and the second heat sink and the heat dissipation module cover the bottom of the inner wall of the front shell; the front shell has an outer side surface, and the third heat sink is in contact with the outer side surface and covers it.

[0020] The beneficial effect of the present invention is that the heat dissipation channel is set to pass through the display module and the mainboard module in sequence, so that the heat dissipation treatment of the two can be performed simultaneously, that is, the heat generated by the display module and the mainboard module is discharged outward through the air flow formed by the heat dissipation module in the heat dissipation channel. At the same time, the heat conduction component is in contact with the heat source of the mainboard module, and the heat generated by the mainboard module is transferred to the heat conduction component, and through the multiple heat dissipation surfaces of the heat conduction component, the heat can be effectively exported to the external environment in sequence; thereby achieving secondary heat dissipation treatment of the mainboard module.

[0021] In addition, due to the setting of multiple heat dissipation surfaces, the effective heat dissipation surface area is increased; the heat generated by the motherboard module will be distributed on multiple heat dissipation surfaces during the heat dissipation process, and the heat will be evenly distributed on a two-dimensional plane, thereby effectively transferring the heat, and finally the surface heat will be taken away by the external cooling medium (i.e., air). In this way, the heat dissipation of the display module and the motherboard module can be quickly realized, and the purpose of quickly dissipating the heat points can be achieved, so that the relevant components can work at the temperature they are subjected to.

[0022] Due to the effective improvement of heat dissipation performance, the heat dissipation module can adopt relatively small power and quiet or normal power; to solve the problem of existing head-mounted displays adding high-power heat dissipation modules to further improve the heat dissipation effect, resulting in high noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work:

[0024] Figure 1 This is one of the three-dimensional structural schematic diagrams of the head-mounted display with a high-efficiency heat dissipation system provided by the present invention;

[0025] Figure 2 This is the second schematic diagram of the three-dimensional structure of the head mounted display with a high-efficiency heat dissipation system provided by the present invention;

[0026] Figure 3 It is one of the heat dissipation channel circuit diagrams of the head mounted display with a high efficiency heat dissipation system provided by the present invention;

[0027] Figure 4 The present invention Figure 3 A in the enlarged view;

[0028] Figure 5 It is a structural schematic diagram of a head mounted display with a high efficiency heat dissipation system provided by the present invention;

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of the front shell of the head mounted display with a high-efficiency heat dissipation system provided by the present invention;

[0030] Figure 7 It is one of the exploded views of the partial structure of the head mounted display with a high efficiency heat dissipation system provided by the present invention;

[0031] Figure 8 This is the second exploded view of the partial structure of the head mounted display with a high efficiency heat dissipation system provided by the present invention;

[0032] Fig. 9 It is an overall exploded schematic diagram of a head mounted display with a high efficiency heat dissipation system provided by the present invention;

[0033] Fig.10 This is the second heat dissipation channel circuit diagram of the head mounted display with a high-efficiency heat dissipation system provided by the present invention.

[0034] In the figure: 1. display body; 11. display module; 12. main board module; 13. front shell; 14. middle frame; 15. back shell; 2. heat dissipation channel; 21. air inlet; 22. air outlet; 23. first channel; 24. second channel; 3. heat dissipation module; 31. sealing foam layer; 32. sealing silicone layer; 4. thermal conductive component; 41. first heat sink; 42. second heat sink; 43. third heat sink; 44. first thermal conductive member; 45. second thermal conductive member; 46. third thermal conductive member; 5. shielding cover. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the following will be described clearly and completely in combination with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are partial embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present invention.

[0036] A head mounted display with an efficient heat dissipation system according to a preferred embodiment of the present invention is as follows: Figure 1 and Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, it includes a display body 1, and the display body 1 is provided with a heat dissipation channel 2 that passes through the display module 11 and the main board module 12 in sequence. The heat dissipation channel 2 has an air inlet 21 and an air outlet 22. Air enters the display body 1 through the air inlet 21 and is discharged to the outside of the display body 1 through the air outlet 22; a heat dissipation module 3 for accelerating air flow is arranged in the heat dissipation channel 2; the display body 1 also includes a heat conduction component 4 connected to the main board module 12, and the heat conduction component 4 has a plurality of heat dissipation surfaces spaced apart from each other, so that the heat generated by the main board module 12 is transferred to the outside of the display body 1 after passing through the plurality of heat dissipation surfaces in sequence.

[0037] Specifically, the heat dissipation module 3 is a heat dissipation fan; the heat dissipation channel 2 passes through the display module 11 and the mainboard module 12 in sequence, and has an air inlet 21 and an air outlet 22. When the heat dissipation module 3 is working, the air in the heat dissipation channel 2 will be discharged from the air outlet 22 to form an air flow. Since the heat dissipation channel 2 passes through the display module 11 and the mainboard module 12 in sequence, it can dissipate heat for both at the same time, that is, the heat generated by the display module 11 and the mainboard module 12 is discharged outward through the air. At the same time, the heat conduction component 4 is in contact with the heat source of the mainboard module 12, and the heat generated by the mainboard module 12 is transferred to the heat conduction component 4, and through the multiple heat dissipation surfaces of the heat conduction component 4, the heat can be effectively exported to the external environment in sequence; thereby achieving secondary heat dissipation treatment of the mainboard module 12; and due to the setting of multiple heat dissipation surfaces, the effective heat dissipation surface area is increased; the heat generated by the mainboard module 12 will be distributed on multiple heat dissipation surfaces during the heat dissipation process, and the heat will be evenly distributed on a two-dimensional plane, thereby effectively transferring the heat, and finally the surface heat will be taken away by the external cooling medium (i.e., air). The display module 11 and the mainboard module 12 can then be quickly cooled to dissipate heat points, thereby allowing the relevant components to operate at the required temperature. Due to the effective improvement in heat dissipation performance, the heat dissipation module 3 can be relatively small and silent or normal in power, thereby solving the problem of the existing head mounted display adding a high-power heat dissipation module 3 to further improve the heat dissipation effect, which results in high noise.

[0038] It should be noted that Figure 3 , Figure 4 and Fig.10 The red lines in the figure are schematic diagrams of the heat dissipation channels.

[0039] In some embodiments of the present application, the heat dissipation channel 2 passes through the heat conducting component 4 and cooperates with each other to achieve heat dissipation. Specifically, when the head mounted display is working, the air in the heat dissipation channel 2 will be driven by the heat dissipation module 3, flow into the air inlet 21 and pass through the display module 11 and the main board module 12 in sequence. Since the heat dissipation channel 2 passes through the heat conducting component 4, the air will cooperate with part or all of the heat dissipation surface of the heat conducting component 4 during the flow process to perform heat exchange. The heat conducting component 4 is in close contact with the heat source of the main board module 12, so the heat generated by the main board module 12 will be quickly transferred to the heat conducting component 4. As the air flows in the heat dissipation channel 2, the heat will be taken away by the air and discharged to the external environment through the air outlet 22, so as to achieve simultaneous heat dissipation of the display module 11 and the main board module 12. By cooperating with the heat dissipation channel 2 and the heat dissipation surface, while the heat dissipation surface transfers and exports the heat to the external environment, the heat transferred to the heat dissipation surface can also be taken away by the air flowing in the heat dissipation channel 2 and discharged after passing through the air outlet 22; the heat dissipation speed of the heat dissipation surface is improved, the overall heat dissipation effect is further improved, and the purpose of efficient heat dissipation is achieved.

[0040] In some embodiments of the present application, Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, the heat conducting component 4 includes and is sequentially distributed from the inside to the outside with a first heat sink 41, a second heat sink 42 and a third heat sink 43, and the heat dissipation surface includes the surface of the first heat sink 41, the surface of the second heat sink 42 and the surface of the third heat sink 43. Specifically, through the first heat sink 41, the second heat sink 42 and the third heat sink 43 sequentially distributed from the inside to the outside, the surfaces of the three heat sinks are used as the three heat dissipation surfaces of the heat conducting component 4, and the heat generated by the mainboard module 12 is sequentially exported to the outside through multiple heat dissipation surfaces, so that the heat can be evenly distributed on the heat dissipation surface, and finally exported to the external ambient air through the third heat sink 43 to complete the heat dissipation; through the setting of multiple layers of heat sinks, the heat dissipation area is increased, so that the heat can be dissipated to the external environment faster, avoiding local overheating. The improvement of heat dissipation efficiency effectively controls the temperature inside the device, avoiding the performance degradation and shortened service life of the device caused by excessive temperature. Effective heat dissipation treatment ensures the stability and reliability of the device under long-term high-load operation.

[0041] Furthermore, a portion of the third heat sink 43 is exposed outside the display body 1. Specifically, one side of the third heat sink 43 is exposed outside the display body 1, so as to facilitate heat exchange with an external cooling medium (such as air).

[0042] It should be noted that the first heat sink 41 is a graphite sheet; the second heat sink 42 is made of copper foil; the third heat sink 43 is made of metal, which can be specifically made of copper, silver, aluminum, titanium, nickel, tungsten-copper alloy or stainless steel.

[0043] In other embodiments, the material of the third heat sink 43 can also be set to natural graphite or artificial graphite according to actual needs.

[0044] In some embodiments of the present application, the heat conducting assembly 4 further includes a first heat conducting member 44, a second heat conducting member 45 and a third heat conducting member 46, the two ends of the first heat conducting member 44 are respectively connected to the mainboard module 12 and the first heat sink 41, the first heat sink 41 is connected to the second heat sink 42 through the second heat conducting member 45, and the two ends of the third heat conducting member 46 are respectively connected to the second heat sink 42 and the third heat sink 43. Specifically, the first heat sink 41 and the mainboard module 12 are connected for heat conduction through the first heat conducting member 44; the second heat sink 42 and the first heat sink 41 are connected through the second heat conducting member 45; and the third heat sink 43 and the second heat sink 42 are connected through the third heat conducting member 46. The first heat conducting member 44, the second heat conducting member 45 and the third heat conducting member 46 act as a bridge, ensuring that heat can be effectively transferred from the mainboard module 12 to the first heat sink 41, the second heat sink 42 and the third heat sink 43, and the heat is exported to the external environment through the third heat sink 43.

[0045] It should be noted that the first heat-conducting member 44 is a heat-conducting silicone sheet; the second heat-conducting member 45 is a heat-conducting graphite foam; and the third heat-conducting member 46 is also a heat-conducting silicone sheet.

[0046] In some embodiments of the present application, a shielding cover 5 connected to the mainboard module 12 is also included, and the first heat sink 41 has the same shape as the shielding cover 5, and the shielding cover 5 covers the first heat sink 41 and the first heat conductor 44, and is connected to the second heat conductor 45. Specifically, the shielding cover 5 is arranged on the mainboard module 12 to shield the influence of external electromagnetic waves on the internal circuit and the electromagnetic waves generated inside from radiating outward. The first heat sink 41 has the same shape as the shielding cover 5, covers the first heat sink 41 and the first heat conductor 44, and is connected to the second heat conductor 45. So that heat can be transferred from the mainboard module 12 to the first heat sink 41 through the first heat conductor 44, and then further heat conduction is carried out through the shielding cover 5 and the second heat conductor 45, thereby achieving effective management of heat. Since the first heat sink 41 has the same shape as the shielding cover 5, the first heat sink 41 located in the shielding cover 5 is set to the maximum size that can be designed to ensure that the effective heat dissipation surface area can be maximized, further improving the heat dispersion effect.

[0047] In some embodiments of the present application, the first heat sink 41, the shielding cover 5 and the third heat sink 43 are respectively provided with a first through hole, a second through hole and a third through hole, and the heat dissipation channel 2 passes through the first through hole, the second through hole and the third through hole in sequence and is connected to the outside of the display body 1. Specifically, the heat dissipation channel 2 passes through the display module 11 and the main board module 12 in sequence to form an air flow path. When the heat dissipation channel 2 passes through the first heat sink 41, the heat generated by the main board module 12 is first absorbed and dispersed by the first heat sink 41; the shielding cover 5 not only plays the role of electromagnetic shielding, but also helps to further conduct heat; the shielding cover 5 transfers the heat of the first heat sink 41 to the third heat sink 43 through the second heat sink 42, and conducts the heat to the external environment through the large area heat dissipation surface of the third heat sink 43. At the same time, since the heat dissipation channel 2 passes through the first heat sink 41, the shielding cover 5 and the third heat sink 43 in sequence, the air flow in the heat dissipation channel 2 can directly take the heat on the first heat sink 41, the shielding cover 5 and the third heat sink 43 out to the external environment, realizing multi-level conduction of heat and improving heat dissipation efficiency. Furthermore, the design that the heat dissipation channel 2 passes through the first heat sink 41, the shielding cover 5 and the third heat sink 43 makes the entire heat dissipation system compact in structure and does not occupy too much space, thus meeting the design requirements of the head mounted display.

[0048] In some embodiments of the present application, the heat dissipation channel 2 penetrates the third heat sink 43 along the thickness direction, two second heat sinks 42 are provided, respectively connected to two ends of the third heat sink 43 , and the two second heat sinks are respectively located on both sides of the heat dissipation channel 2 .

[0049] Specifically, in the heat dissipation system of the head mounted display, two second heat sinks 42 are provided, and the two second heat sinks 42 are closely matched with the two ends of the third heat sink 43 respectively. The heat of the first heat sink 41 will be first transferred to the two second heat sinks 42, and then further conducted to the two ends of the third heat sink 43 in contact with the second heat sink 42. At the same time, the heat dissipation channel 2 is configured to pass through the middle of the third heat sink 43, and the air flow driven by the heat dissipation module 3 is utilized. Therefore, the heat on the third heat sink 43 can be heat exchanged with the external air for heat dissipation, and can also be efficiently taken away from the third heat sink 43 through the air flow channel of the heat dissipation channel 2, and finally discharged from the display body 1 through the air outlet 22.

[0050] In addition, since the heat of the two second heat sinks 42 is transferred to the two ends of the third heat sink 43, the heat dissipation channel 2 passes through the middle of the third heat sink 43, so that the temperature of the third heat sink 43 is high at both ends and relatively low in the middle. The air flow of the heat dissipation channel 2 can make the heat at the two ends of the third heat sink 43 gradually transferred to the middle and taken out, further improving the heat dissipation effect of the third heat sink 43.

[0051] In some embodiments of the present application, the display module 11 is a dual-module structure corresponding to both eyes, and two heat dissipation channels 2 are provided, which pass through the modules on both sides respectively and overlap and communicate at the air outlet 22. Specifically. The display module 11 adopts a dual-module structure corresponding to both eyes, that is, the head-mounted display includes two independent display modules, each responsible for the image display of one eye. To match it, the heat dissipation system is also provided with two heat dissipation channels 2, which pass through the two display modules respectively. The two heat dissipation channels 2 overlap and communicate at the air outlet 22 to form a unified heat dissipation outlet, ensuring that both display modules can be fully cooled and preventing overheating from adversely affecting the display effect and device performance. By configuring heat dissipation channels 2 for the two display modules respectively and merging them at the air outlet 22, the heat generated by the display module and the mainboard module 12 can be more effectively discharged, significantly improving the heat dissipation efficiency. It ensures that the display module 11 can still maintain stable performance under long-term operation, avoiding the decline of display effect due to overheating.

[0052] In some embodiments of the present application, the display body 1 includes a front shell 13, a middle frame 14 and a rear shell 15, and the heat dissipation channel 2 has a first channel 23 and a second channel 24. The first channel 23 passes through the display module 11 and the main board module 12 in sequence, and its air inlet 21 is located at the rear shell 15; the second channel 24 is connected to the first channel 23, and the connection is close to the main board module 12, and the air inlet 21 of the second channel 24 is located at the middle frame 14. Specifically, the front shell 13, the middle frame 14 and the rear shell 15 together constitute the external frame and internal support structure of the head-mounted display; through the cooperation of the first channel 23 and the second channel 24, a single heat dissipation channel 2 has two air inlets 21, and the two air inlets 21 are respectively arranged on the middle frame 14 and the rear shell 15, which helps to introduce cold air from multiple directions to improve the efficiency and effect of heat dissipation. The connection between the second channel 24 and the first channel 23 is arranged near the mainboard module 12. Since the mainboard module 12 is the main heat source, the cold air can directly contact the mainboard module 12 and the surrounding heat sources, thereby more effectively absorbing and taking away the heat. This not only optimizes the heat dissipation path, but also enables the heat to be discharged faster through the heat dissipation channel 2, effectively reducing the accumulation of heat inside the display, and further improving the heat dissipation efficiency.

[0053] In some embodiments of the present application, the second heat sink 42 is located in the front shell 13, and the second heat sink 42 and the heat dissipation module 3 cover the bottom of the inner wall of the front shell 13; the front shell 13 has an outer side surface, and the third heat sink 43 is attached to and covers the outer side surface. Specifically, since the two second heat sinks 42 and the heat dissipation module 3 cover the bottom of the inner wall of the front shell 13, the second heat sink 42 is set to the maximum designable area; at the same time, the third heat sink 43 is attached to and covers the outer side surface of the front shell 13, and as the outer side surface cover of the front shell 13, the third heat sink 43 is also set to the maximum designable area without losing aesthetics; combined with the design of the first heat sink 41, the heat dissipation area of ​​the three heat dissipation surfaces of the heat conductive component 4 is greatly increased, so that the heat is more dispersed on the three heat dissipation surfaces, avoiding local accumulation of heat, and further improving the heat dissipation effect.

[0054] In some other embodiments, the heat dissipation module 3 is provided with a sealing foam layer 31 and a sealing silicone layer 32 on opposite sides. Specifically, the main function of the sealing foam layer 31 is to enhance the sealing between the heat dissipation module 3 and the heat dissipation channel 2. Since the internal space of the head mounted display is compact, the design of the heat dissipation channel 2 must be as efficient as possible; the sealing foam layer 31 uses its high elasticity and compressibility to closely fit the surface of the heat dissipation module 3 and the heat dissipation channel 2, effectively reducing air leakage; when the heat dissipation module 3 is running, more air is guided to be discharged through the heat dissipation channel 2 instead of escaping from the gap, thereby significantly improving the heat dissipation efficiency. The sealing silicone layer 32 plays a greater role in shock absorption, sound insulation and further sealing; the heat dissipation module 3 will generate vibration and noise when working. If these vibrations and noises are not controlled, they will directly affect the user's wearing comfort. The sealing silicone layer 32 uses its high viscosity and elasticity to closely connect the heat dissipation module 3 and the surrounding structure, effectively absorb the vibration of the heat dissipation module 3, and reduce the noise level. Not only does it improve the stability of the heat dissipation system, but it also significantly improves the user's wearing experience.

[0055] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. A head mounted display with an efficient heat dissipation system, characterized in that , including a display body, the display body is provided with a heat dissipation channel which passes through the display module and the main board module in sequence, the heat dissipation channel has an air inlet and an air outlet, air enters the interior of the display body through the air inlet, and is discharged to the outside of the display body through the air outlet; a heat dissipation module for accelerating air flow is arranged in the heat dissipation channel; the display body also includes a heat conduction component connected to the main board module, the heat conduction component has a plurality of heat dissipation surfaces spaced apart from each other, and the heat generated by the main board module is transferred to the outside of the display body after passing through the plurality of heat dissipation surfaces in sequence.

2. The head mounted display with a high efficiency heat dissipation system according to claim 1, characterized in that: The heat dissipation channels pass through the heat conduction components and cooperate with each other to achieve heat dissipation.

3. The head mounted display with a high efficiency heat dissipation system according to claim 1, characterized in that: The heat conduction component includes a first heat sink, a second heat sink and a third heat sink which are sequentially distributed from the inside to the outside, and the heat dissipation surface includes a surface of the first heat sink, a surface of the second heat sink and a surface of the third heat sink.

4. The head mounted display with a high efficiency heat dissipation system according to claim 3, characterized in that: The third heat sink is at least partially exposed outside the display body.

5. The head mounted display with a high efficiency heat dissipation system according to claim 3, characterized in that: The heat-conducting component also includes a first heat-conducting member, a second heat-conducting member and a third heat-conducting member, two ends of the first heat-conducting member are respectively connected to the mainboard module and the first heat sink, the first heat sink is connected to the second heat sink through the second heat-conducting member, and two ends of the third heat-conducting member are respectively connected to the second heat sink and the third heat sink.

6. The head mounted display with a high efficiency heat dissipation system according to claim 5, characterized in that: It also includes a shielding cover connected to the mainboard module, and the first heat sink has the same shape as the shielding cover. The shielding cover covers the first heat sink and the first heat conductor and is connected to the second heat conductor.

7. The head mounted display with a high efficiency heat dissipation system according to claim 6, characterized in that: The first heat sink, the shielding cover and the third heat sink are respectively provided with a first through hole, a second through hole and a third through hole, and the heat dissipation channel passes through the first through hole, the second through hole and the third through hole in sequence and is connected to the outside of the display body.

8. The head mounted display with a high efficiency heat dissipation system according to claim 3, characterized in that: The heat dissipation channel penetrates the third heat sink along the thickness direction. There are at least two second heat sinks, which are respectively connected to two ends of the third heat sink. The two second heat sinks are respectively located on both sides of the heat dissipation channel.

9. The head mounted display with a high efficiency heat dissipation system according to any one of claims 1 to 8, characterized in that: The display module is a dual-module structure corresponding to both eyes, and two heat dissipation channels are provided, passing through the modules on both sides respectively, and overlapping and communicating at the air outlet.

10. The head mounted display with a high efficiency heat dissipation system according to any one of claims 3 to 8, characterized in that: The display body includes a front shell, a middle frame and a rear shell, and the heat dissipation channel has a first channel and a second channel. The first channel passes through the display module and the mainboard module in sequence, and its air inlet is located in the rear shell; the second channel is connected to the first channel, and the connection is close to the mainboard module, and the air inlet of the second channel is located in the middle frame.

11. The head mounted display with a high efficiency heat dissipation system according to claim 10, characterized in that: The second heat sink is located in the front shell, and the second heat sink and the heat dissipation module cover the bottom of the inner wall of the front shell; the front shell has an outer side surface, and the third heat sink is in contact with and covers the outer side surface.

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