Power device and motor control system

Abstract

The invention discloses a power device and a motor control system, the power device comprises a circuit board, a plurality of upper bridge arm switching devices and a plurality of lower bridge arm switching devices, the upper bridge arm switching devices and the lower bridge arm switching devices are embedded in the circuit board, second ends of the upper bridge arm switching devices are electrically connected with a first circuit layer, and first ends of the lower bridge arm switching devices are electrically connected with the first circuit layer. The second end of the upper bridge arm switching device and the first end of the lower bridge arm switching device are arranged on the side, close to the first circuit layer, of the switching device, so that only one first circuit layer is needed to be connected with the second end of the upper bridge arm switching device and the first end of the lower bridge arm switching device at the same time; the first circuit layer is prevented from realizing cross-layer arrangement by using the via holes, so that the structural complexity of the power device is reduced, heat dissipation of the power device is facilitated, and meanwhile, the complexity of a production process of the power device is reduced.

Description

Technical Field

[0001] The present application belongs to the field of power electronics technology, and in particular, relates to a power device and a motor control system. Background Art

[0002] The power module includes a power conversion topology composed of several power semiconductor switching devices, which can realize bidirectional conversion from DC to AC.

[0003] With the development and maturity of SIC-MOS / IGBT technology, power modules based on SIC-MOS / IGBT design have been widely used in the field of electric vehicles. In particular, embedding power semiconductor chips in printed circuit boards (PCBs) has become a more preferred design solution for power modules. However, due to the structural limitations of the power semiconductor switching devices themselves, the circuit used to transmit alternating current needs to be connected across layers through vias in the PCB to connect the input and output ends of each power semiconductor switching device, resulting in a complex structure inside the PCB and increasing the complexity of the production process. Summary of the invention

[0004] The purpose of the present application is to provide a power device and a motor control system, aiming to solve the problem of complex internal structure of traditional embedded power modules.

[0005] A first aspect of an embodiment of the present application provides a power device, comprising: a circuit board, comprising a first circuit layer; and a plurality of upper bridge arm switching devices and a plurality of lower bridge arm switching devices buried in the circuit board, the second end of the upper bridge arm switching device being electrically connected to the first circuit layer, the first end of the lower bridge arm switching device being electrically connected to the first circuit layer, the second end of the upper bridge arm switching device being located on a side of the upper bridge arm switching device close to the first circuit layer, and the first end of the lower bridge arm switching device being located on a side of the lower bridge arm switching device close to the first circuit layer.

[0006] In one embodiment, the upper bridge arm switch device and the lower bridge arm switch device are both located on the same side of the first circuit layer.

[0007] In one embodiment, the first end and the second end of the upper bridge arm switch device are respectively located on two opposite sides of the upper bridge arm switch device, and the first end and the second end of the lower bridge arm switch device are respectively located on two opposite sides of the lower bridge arm switch device.

[0008] In one embodiment, the circuit board further includes a second circuit layer, the second circuit layer includes a positive wiring, and the positive wiring is used to be electrically connected to the first end of the upper bridge arm switching device.

[0009] In one embodiment, the second circuit layer is located on a side of the upper bridge arm switch device away from the first circuit layer, and the upper bridge arm switch device and the lower bridge arm switch device are arranged in sequence between the first circuit layer and the second circuit layer along a direction parallel to the first circuit layer.

[0010] In one embodiment, the circuit board further includes a third circuit layer, the third circuit layer includes a negative electrode wiring, and the negative electrode wiring is used to be electrically connected to the second end of the lower bridge arm switching device.

[0011] In one embodiment, the third circuit layer is located on a side of the lower bridge arm switch device away from the first circuit layer.

[0012] In one embodiment, the control electrode and the second end of the upper bridge arm switch device are located on the same side, and the control electrode and the second end of the lower bridge arm switch device are located on the same side.

[0013] In one embodiment, the first circuit layer includes a plurality of AC wirings, and one of the AC wirings is electrically connected to the second end of at least one of the upper bridge arm switching devices and the first end of at least one of the lower bridge arm switching devices.

[0014] A second aspect of an embodiment of the present application provides a motor control system, including: a power device as described above.

[0015] Compared with the prior art, the embodiments of the present application have the following beneficial effects: by setting the second end of the upper bridge arm switching device and the first end of the lower bridge arm switching device on the side of the switching device close to the first circuit layer, only one first circuit layer is needed to be connected to the second end of the upper bridge arm switching device and the first end of the lower bridge arm switching device at the same time, avoiding the use of vias to achieve cross-layer setting of the first circuit layer, thereby reducing the structural complexity of the power device, facilitating the heat dissipation of the power device, and at the same time reducing the complexity of the power device production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a power device provided in one embodiment of the present application;

[0017] Figure 2 Another schematic diagram of the structure of a power device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0020] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] Figure 1 A schematic diagram of the structure of a power device provided in an embodiment of the present application is shown. For the sake of convenience, only the parts related to the present embodiment are shown, which are described in detail as follows:

[0023] A power device includes: a circuit board 100 and a plurality of upper bridge arm switch devices 200 and a plurality of lower bridge arm switch devices 300 embedded in the circuit board 100.

[0024] The circuit board 100 includes a first circuit layer 110. The second end of the upper bridge arm switch device 200 is electrically connected to the first circuit layer 110, the first end of the lower bridge arm switch device 300 is electrically connected to the first circuit layer 110, the second end of the upper bridge arm switch device 200 is located on a side of the upper bridge arm switch device 200 close to the first circuit layer 110, and the first end of the lower bridge arm switch device 300 is located on a side of the lower bridge arm switch device 300 close to the first circuit layer 110.

[0025] It can be understood that by setting the second end of the upper bridge arm switch device 200 and the first end of the lower bridge arm switch device 300 on the side of the switch device close to the first circuit layer 110, only one first circuit layer 110 is required to be connected to the second end of the upper bridge arm switch device 200 and the first end of the lower bridge arm switch device 300 at the same time, avoiding the first circuit layer 110 from using vias to achieve cross-layer setting, thereby reducing the structural complexity of the power device, facilitating the heat dissipation of the power device, and at the same time, reducing the complexity of the power device production process.

[0026] The upper bridge arm switch device 200 specifically refers to a switch device for the upper bridge arm in a half-bridge circuit / full-bridge circuit, and the upper bridge arm can be controlled by controlling the on and off of the upper bridge arm switch device 200. The lower bridge arm switch device 300 specifically refers to a switch device for the lower bridge arm in a half-bridge circuit / full-bridge circuit, and the lower bridge arm can be controlled by controlling the on and off of the lower bridge arm switch device 300.

[0027] Exemplarily, when the upper bridge arm switch device 200 and the lower bridge arm switch device 300 are applied to a half-bridge circuit, the power device includes only one upper bridge arm switch device 200 and one lower bridge arm switch device 300. When the upper bridge arm switch device 200 and the lower bridge arm switch device 300 are applied to a full-bridge circuit, the power device may include at least two upper bridge arm switch devices 200 and two lower bridge arm switch devices 300. When the upper bridge arm switch device 200 and the lower bridge arm switch device 300 are applied to a three-phase inverter circuit, the power device may include at least three upper bridge arm switch devices 200 and three lower bridge arm switch devices 300. The number of upper bridge arm switch devices 200 and lower bridge arm switch devices 300 in the power device can be set according to actual needs.

[0028] Specifically, when two upper arm switch devices 200 and two lower arm switch devices 300 form a full bridge circuit, by controlling the on and off of each upper arm switch device 200 and each lower arm switch device 300, in conjunction with other circuits and devices, the direct current at the first end of the upper arm switch device 200 and the second end of the lower arm switch device 300 can be inverted, thereby generating corresponding alternating current in the first circuit layer 110, or the alternating current in the first circuit layer 110 can be rectified to generate corresponding direct current at the first end of the upper arm switch device 200 and the second end of the lower arm switch device 300. The specific application of the upper arm switch device 200 and the lower arm switch device 300 can be configured according to actual needs, and will not be described in detail in this embodiment.

[0029] In some embodiments, multiple upper arm switch devices 200 or multiple lower arm switch devices 300 may be connected in parallel to achieve current shunting. The number of upper arm switch devices 200 and lower arm switch devices 300 may be set according to the specific circuit.

[0030] The upper arm switch device 200 and the lower arm switch device 300 may specifically include at least one of an N-type MOS tube, a P-type MOS tube, an IGBT tube and a triode.

[0031] In some embodiments, the upper bridge arm switch device 200 includes a first N-type MOS transistor, and the lower bridge arm switch device 300 includes a second N-type MOS transistor.

[0032] Among them, the drain of the first N-type MOS transistor is the first end of the upper bridge arm switch device 200, the source of the first N-type MOS transistor is the second end of the upper bridge arm switch device 200, and the gate of the first N-type MOS transistor is the control electrode of the upper bridge arm switch device 200. The drain of the second N-type MOS transistor is the first end of the lower bridge arm switch device 300, the source of the second N-type MOS transistor is the second end of the lower bridge arm switch device 300, and the gate of the second N-type MOS transistor is the control electrode of the lower bridge arm switch device 300. The source of the first N-type MOS transistor and the drain of the second N-type MOS transistor are both electrically connected to the first circuit layer 110.

[0033] In some embodiments, the gate of the first N-type MOS tube and the gate of the second N-type MOS tube are both located on the same side as the source. Specifically, the gate of the first N-type MOS tube is located on a side of the first N-type MOS tube away from the first circuit layer 110, and the gate of the second N-type MOS tube is located on a side of the second N-type MOS tube close to the first circuit layer 110.

[0034] In some embodiments, including the first circuit layer 110, the circuit board 100 includes several circuit layers, which can be located inside the circuit board 100 or on the surface of the circuit board 100, and the circuit layers are isolated and connected by dielectric layers. The circuit layer includes wiring formed by conductive materials such as copper foil. The material of the dielectric layer includes silicon oxide (SiO2), silicon nitride (SiNx) and silicon carbide (SiC), etc.

[0035] In one embodiment, if Figure 2 As shown, the upper arm switch device 200 and the lower arm switch device 300 are both located on the same side of the first circuit layer 110. Thus, the longitudinal space occupied by the upper arm switch device 200 and the lower arm switch device 300 in the thickness direction of the circuit board 100 can be reduced.

[0036] Exemplarily, when the first circuit layer 110 is arranged horizontally, the upper arm switching device 200 and the lower arm switching device 300 are both located at the lower side of the first circuit layer 110 .

[0037] In one embodiment, the upper bridge arm switch device 200 and the lower bridge arm switch device 300 may also be respectively located on opposite sides of the first circuit layer 110. When the thickness of the circuit board 100 is sufficient, the upper bridge arm switch device 200 and the lower bridge arm switch device 300 are respectively located on opposite sides of the first circuit layer 110, which can reduce the area occupied by the circuit board 100.

[0038] In one embodiment, the first end and the second end of the upper arm switch device 200 are respectively located on two opposite sides of the upper arm switch device 200 , and the first end and the second end of the lower arm switch device 300 are respectively located on two opposite sides of the lower arm switch device 300 .

[0039] It should be noted that the upper arm switch device 200 and the lower arm switch device 300 are both switch devices, and the first end and the second end of the switch device usually need to be connected to two circuit layers with different voltages.

[0040] By respectively arranging the first end and the second end of the upper bridge arm switching device 200 and the first end and the second end of the lower bridge arm switching device 300 on both sides of the switching device, it can be understood that the first end and the second end of the switching device can be directly electrically connected to the circuit layers located on both sides of the switching device, respectively, thereby reducing the wiring of the circuit layer and the design and manufacturing difficulty of the connection structure between the circuit layer and the switching device.

[0041] Exemplarily, when the upper bridge arm switch device 200 includes a first N-type MOS transistor and the lower bridge arm switch device 300 includes a second N-type MOS transistor, the source of the first N-type MOS transistor is located on a side of the first N-type MOS transistor close to the first circuit layer 110, and the drain of the first N-type MOS transistor is located on a side of the first N-type MOS transistor away from the first circuit layer 110. The drain of the second N-type MOS transistor is located on a side of the second N-type MOS transistor close to the first circuit layer 110, and the source of the second N-type MOS transistor is located on a side of the second N-type MOS transistor away from the first circuit layer 110.

[0042] In one embodiment, the control electrode of the upper arm switch device 200 and the second end of the upper arm switch device 200 are located on the same side, and the control electrode of the lower arm switch device 300 and the second end of the lower arm switch device 300 are located on the same side.

[0043] The control electrode of the upper bridge arm switch device 200 and the control electrode of the lower bridge arm switch device 300 can be directly connected to the control circuit 400 located on the circuit board 100 through corresponding leads to obtain control signals.

[0044] In one embodiment, the circuit board 100 further includes a second circuit layer 120 , and the second circuit layer 120 includes a positive wiring, and the positive wiring is used to be electrically connected to the first end of the upper bridge arm switching device 200 .

[0045] It should be noted that the positive electrode wiring may be connected to the positive electrode of a DC power source, so as to provide a positive voltage to the first end of each upper arm switch device 200 .

[0046] In one embodiment, the second circuit layer 120 is located on a side of the upper bridge arm switching device 200 away from the first circuit layer 110, and the upper bridge arm switching device 200 and the lower bridge arm switching device 300 are arranged in sequence between the first circuit layer 110 and the second circuit layer 120 along a direction parallel to the first circuit layer 110.

[0047] When the first end and the second end of the upper arm switch device 200 are respectively located on two opposite sides of the upper arm switch device 200, by setting the second circuit layer 120 on a side of the upper arm switch device 200 away from the first circuit layer 110, it is possible to facilitate the connection between the second circuit layer 120 and the first end of the upper arm switch device 200, thereby reducing the design difficulty and manufacturing difficulty of the positive wiring of the second circuit layer 120 and the connection structure between the second circuit layer 120 and the upper arm switch device 200.

[0048] In one embodiment, the circuit board 100 further includes a third circuit layer 130 , and the third circuit layer 130 includes a negative wiring, and the negative wiring is used to be electrically connected to the second end of the lower bridge arm switching device 300 .

[0049] It should be noted that the negative electrode wiring may be connected to the negative electrode of the DC power supply to provide a negative voltage to the second end of each lower bridge arm switch device 300. In some embodiments, the negative electrode wiring may also be grounded.

[0050] In one embodiment, the third circuit layer 130 is located on a side of the lower bridge arm switching device 300 away from the first circuit layer 110 .

[0051] When the first end and the second end of the lower arm switch device 300 are respectively located on two opposite sides of the lower arm switch device 300, by setting the third circuit layer 130 on a side of the lower arm switch device 300 away from the first circuit layer 110, it is possible to facilitate the connection between the third circuit layer 130 and the second end of the lower arm switch device 300, thereby reducing the design difficulty and manufacturing difficulty of the negative wiring of the third circuit layer 130 and the connection structure between the third circuit layer 130 and the lower arm switch device 300.

[0052] In one embodiment, the third circuit layer 130 is located on a side of the second circuit layer 120 away from the first circuit layer 110 .

[0053] In one embodiment, the orthographic projection of the positive wiring on the third circuit layer 130 overlaps orthogonally with the negative wiring.

[0054] It should be noted that due to the large voltage difference between the positive wiring and the negative wiring, when the second circuit layer 120 is located on the side of the upper bridge arm switching device 200 away from the first circuit layer 110, and the third circuit layer 130 is located on the side of the lower bridge arm switching device 300 away from the first circuit layer 110, the distance between the positive wiring and the negative wiring is relatively close. By orthogonally overlapping the positive wiring on the third circuit layer 130 with the negative wiring, the parasitic inductance of the power device can be greatly optimized.

[0055] In one embodiment, the first circuit layer 110 includes a plurality of AC wirings, one AC wiring being electrically connected to the second end of at least one upper arm switching device 200 and the first end of at least one lower arm switching device 300 .

[0056] In the case of only one pair of upper arm switch devices 200 and lower arm switch devices 300, only one AC wiring may be included, and in the case of two pairs of upper arm switch devices 200 and lower arm switch devices 300 forming a full bridge circuit, two AC wirings may be included. The number of AC wirings may be set according to the specific circuit.

[0057] In the case where a plurality of upper arm switching devices 200 are connected in parallel and / or a plurality of lower arm switching devices 300 are connected in parallel, one AC wiring may be electrically connected to the plurality of upper arm switching devices 200 and / or the plurality of lower arm switching devices 300 .

[0058] By controlling the on and off of the connected upper bridge arm switch device 200 and the lower bridge arm switch device 300, voltage inversion can be achieved, and direct current can be converted into alternating current and output through alternating current wiring.

[0059] In one embodiment, the power device includes six circuit layers arranged in sequence from top to bottom.

[0060] The first circuit layer 110 is specifically located at the fifth layer, the second circuit layer 120 is located at the second layer, and the third circuit layer 130 is located at the first layer. It can be understood that the remaining circuit layers can be used to transmit other electrical signals, which is not limited in this embodiment.

[0061] Each upper bridge arm switch device 200 and each lower bridge arm switch device 300 are located between the first circuit layer 110 and the second circuit layer 120 , and each upper bridge arm switch device 200 and each lower bridge arm switch device 300 are arranged in the same layer.

[0062] The first end of the upper arm switch device 200 is located at the upper side of the upper arm switch device 200 and is electrically connected to the second circuit layer 120, and the second end of the upper arm switch device 200 is located at the lower side of the upper arm switch device 200 and is electrically connected to the first circuit layer 110. The upper arm switch device 200 is forwardly arranged in the circuit board 100.

[0063] The first end of the lower arm switch device 300 is located at the lower side of the lower arm switch device 300 and is electrically connected to the first circuit layer 110, and the second end of the lower arm switch device 300 is located at the upper side of the lower arm switch device 300 and is electrically connected to the third circuit layer 130. The lower arm switch device 300 is reversely arranged in the circuit board 100.

[0064] An embodiment of the present application provides a motor control system, including: a power device as described in any of the above embodiments.

[0065] Motor control systems can be applied to electric vehicles.

[0066] Since the motor control system has the technical features of the power device of any of the above embodiments, the motor control system has the same beneficial effects as the power device of any of the above embodiments, and this embodiment will not be described in detail.

[0067] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0068] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0069] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A power device, characterized in that: include: A circuit board comprising a first circuit layer; and A plurality of upper bridge arm switching devices and a plurality of lower bridge arm switching devices are buried in the circuit board, the second end of the upper bridge arm switching device is electrically connected to the first circuit layer, the first end of the lower bridge arm switching device is electrically connected to the first circuit layer, the second end of the upper bridge arm switching device is located on a side of the upper bridge arm switching device close to the first circuit layer, and the first end of the lower bridge arm switching device is located on a side of the lower bridge arm switching device close to the first circuit layer.

2. The power device according to claim 1, characterized in that: The upper bridge arm switching device and the lower bridge arm switching device are both located on the same side of the first circuit layer.

3. The power device according to claim 2, characterized in that: The first end and the second end of the upper bridge arm switch device are respectively located on two opposite sides of the upper bridge arm switch device, and the first end and the second end of the lower bridge arm switch device are respectively located on two opposite sides of the lower bridge arm switch device.

4. The power device according to any one of claims 1 to 3, characterized in that: The circuit board further includes a second circuit layer, wherein the second circuit layer includes a positive wiring, and the positive wiring is used to be electrically connected to the first end of the upper bridge arm switching device.

5. The power device according to claim 4, characterized in that: The second circuit layer is located on a side of the upper bridge arm switch device away from the first circuit layer, and the upper bridge arm switch device and the lower bridge arm switch device are sequentially arranged between the first circuit layer and the second circuit layer along a direction parallel to the first circuit layer.

6. The power device according to claim 4, characterized in that: The circuit board further includes a third circuit layer, wherein the third circuit layer includes a negative electrode wiring, and the negative electrode wiring is used to be electrically connected to the second end of the lower bridge arm switching device.

7. The power device according to claim 6, characterized in that: The third circuit layer is located on a side of the lower bridge arm switch device away from the first circuit layer.

8. The power device according to any one of claims 1 to 3, characterized in that: The control electrode of the upper bridge arm switch device and the second end are located on the same side, and the control electrode of the lower bridge arm switch device and the second end are located on the same side.

9. The power device according to any one of claims 1 to 3, characterized in that: The first circuit layer includes a plurality of AC wirings, one of the AC wirings being electrically connected to a second end of at least one of the upper bridge arm switching devices and a first end of at least one of the lower bridge arm switching devices.

10. A motor control system, characterized in that: include: A power device as claimed in any one of claims 1 to 9.

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