A LED structure for preventing side light leakage and packaging method thereof

Abstract

The present invention discloses an LED structure for preventing side light leakage, comprising a substrate, an LED chip arranged on the substrate, a blocking rubber ring arranged around the LED chip on the substrate, the blocking rubber ring enclosing a solid crystal cavity, the solid crystal cavity is filled with a transparent glue layer and the transparent glue layer covers the upper surface and side of the LED chip, the upper surface of the transparent glue layer is covered with a layer of fluorescent powder glue layer, the upper surface of the fluorescent powder glue layer is covered with a layer of sealing glue layer, and a packaging method for processing the LED structure is also provided. The present invention aims to overcome the shortcomings of the prior art and provide an LED structure for preventing side light leakage and a packaging method for an LED structure for preventing side light leakage, so as to avoid light leakage from the side of the chip, improve light output uniformity, and improve product quality.

Description

Technical Field

[0001] This invention specifically relates to an LED structure that prevents side light leakage, and an LED structure packaging method that prevents side light leakage. Background Technology

[0002] Light-emitting diodes (LEDs), as efficient, energy-saving, and long-life light sources, have been widely used in various lighting and display applications in recent years. Compared with traditional light sources, LEDs have advantages such as higher energy efficiency, longer lifespan, and smaller size. However, with the continuous advancement of LED technology, its application range is constantly expanding, and the requirements for LED performance are also increasing, especially in terms of light output quality, reliability, and cost control.

[0003] Side leakage is a common problem in LED packaging structures, referring to the phenomenon where light emitted from an LED chip is emitted outwards through the sides rather than the top. Side leakage not only reduces the effective luminous flux of the LED, leading to decreased light output efficiency, but can also affect the overall optical design of the luminaire, causing problems such as uneven light spots. Furthermore, in some special applications, such as automotive headlights or high-end displays, the presence of side leakage can severely impact the visual effect and user experience. Currently, LED powder coating is the preferred phosphor coating process due to its advantages of saving phosphor, high flexibility in phosphor ratio, uniform phosphor surface coverage, and the ability to achieve relatively uniform coverage even with a small amount of phosphor. However, because LED chips are relatively tall and difficult to reduce in size, and because the top surface and sides of the chip are perpendicular, directly applying powder to the LED chip using LED powder coating often results in a thin phosphor layer due to the need to ensure light output efficiency. Ultimately, the phosphor coating only covers the top surface and part of the sides of the chip, as shown in the attached image. Figure 1 As shown, an LED chip a2 is provided on the substrate a1, and a phosphor layer a3 is sprayed on the LED chip a2. The phosphor layer a3 can only cover part of the side of the LED chip a2, which causes the problem of blue light leakage from the side of the LED chip a2. Since the blue light leaking from the side of the chip is not evenly distributed, there will be a very obvious blue halo in the LED light output, which seriously affects the uniformity of LED light output.

[0004] This invention was developed precisely because of the aforementioned shortcomings. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide an LED structure that prevents side light leakage, as well as an LED structure packaging method that prevents side light leakage, in order to avoid light leakage from the side of the chip, improve light emission uniformity, and improve product quality.

[0006] This invention is achieved through the following technical solution:

[0007] This invention provides an LED structure that prevents side light leakage, including a substrate, an LED chip disposed on the substrate, a blocking rubber ring disposed around the LED chip on the substrate, the blocking rubber ring forming a die bonding cavity, the die bonding cavity being filled with a transparent adhesive layer covering the upper surface and side surface of the LED chip, the upper surface of the transparent adhesive layer being covered with a phosphor adhesive layer, and the upper surface of the phosphor adhesive layer being covered with a sealing adhesive layer.

[0008] In the LED structure for preventing side light leakage described above, the blocking rubber ring is made of high-reflectivity white glue, the height of the blocking rubber ring is H1, and the height of the LED chip is H2. Therefore, H1 ≤ H2, and...

[0009] As described above, in the LED structure that prevents side light leakage, the blocking rubber ring has a light-guiding slope that gradually slopes outward from bottom to top on the side wall near the LED chip.

[0010] This invention also provides an LED structure packaging method for preventing side leakage light, which is used in the aforementioned LED structure for preventing side leakage light, and includes the following steps:

[0011] S1. A ring of high-reflectivity white glue is set on the substrate to form a blocking glue ring, the blocking glue ring surrounds at least one die bonding cavity, and an LED chip is set on the substrate and in the die bonding cavity.

[0012] S2. Apply adhesive to the upper surface and sides of the LED chip, spray transparent adhesive, and make a preform.

[0013] S3. Place the preform in an oven for low-temperature baking, causing the transparent adhesive on the surface of the LED chip to flow to the side and the transparent adhesive on the side of the LED chip to flow to the contact blocking ring, and the transparent adhesive is initially shaped and forms a transparent adhesive layer.

[0014] S4. Spray phosphor adhesive onto the top of the die bonding cavity, so that the phosphor adhesive covers the entire transparent adhesive layer, forming a phosphor adhesive layer on top of the transparent adhesive layer.

[0015] S5. Apply encapsulating adhesive to the top of the substrate, so that the encapsulating adhesive covers the entire barrier ring, forming a sealing layer on the top of the substrate.

[0016] The LED structure packaging method for preventing side light leakage as described above further includes the following steps after step S1 and before step S2:

[0017] S1-1. Spray a reflective coating onto the surface of the blocking rubber ring, at least onto the upper surface of the blocking rubber ring and the side of the blocking rubber ring closest to the LED chip.

[0018] As described above, the LED structure packaging method for preventing side light leakage includes the following steps in step S2: making the thickness of the transparent adhesive on the side of the LED chip less than or equal to the height of the blocking adhesive ring; and step S3 includes the following sub-steps.

[0019] S31. Place the preform in an oven and bake at a temperature of 40-60℃ for 10-20 minutes. This makes the transparent adhesive fluid, causing the transparent adhesive on the upper surface of the LED chip to flow to the side and the transparent adhesive on the side of the LED chip to flow to the contact blocking ring. Due to the surface tension of the transparent adhesive fluid and the adhesion between the transparent adhesive and the LED chip, a curved transition surface is formed between the transparent adhesive on the upper surface and the side of the LED chip.

[0020] S32. Place the preform in an oven and bake at a temperature of 80-140℃ for 5-20 minutes, causing the transparent adhesive to lose its fluidity and form an incompletely cured transparent adhesive layer with high viscosity.

[0021] The LED structure packaging method for preventing side light leakage as described above further includes the following steps after step S4 and before step S5:

[0022] S4-1. Heating and curing: The blank is heated at a temperature of 120-160℃ for 30-60 minutes. Heating the blank after the phosphor spraying process in step S4 allows the phosphor adhesive to be initially cured, preventing the phosphor from moving significantly in subsequent steps due to the fluidity of the adhesive layer and thus preventing problems with inconsistent light output.

[0023] As described above, the LED structure packaging method for preventing side light leakage involves arranging various LED chips on the substrate. In step S1, mounting points for mounting LED chips are first determined on the substrate, LED chips are mounted at the mounting points, and high-reflectivity white glue is placed in the gaps between the mounting points, so that the high-reflectivity white glue surrounds each LED chip to form multiple die-bonding cavities.

[0024] As described above, the LED structure packaging method for preventing side light leakage further includes a dammed rubber ring on the substrate that can surround all LED chips; in step S1, a high-reflectivity white glue is provided inside the dammed rubber ring, and the high-reflectivity white glue fills the inside of the dammed rubber ring.

[0025] In the LED structure packaging method for preventing side light leakage as described above, in step S1, before applying the high-reflectivity white adhesive, a connecting groove is first opened on the substrate, and the connecting groove is set between two adjacent mounting points.

[0026] Compared with the prior art, the present invention has the following advantages:

[0027] The LED structure for preventing side light leakage of the present invention includes a blocking ring made of high-reflectivity white adhesive, which surrounds a die-bonding area. A uniform transparent adhesive layer is formed in the die-bonding area using the encapsulation method of the present invention. This allows light emitted from the side of the chip to be reflected and refracted within the transparent adhesive layer and then transmitted through its upper surface. A smooth transition is formed on the upper surface of the transparent adhesive layer, ensuring uniform transmitted light. A phosphor adhesive layer covers the transparent adhesive layer, covering the entire transparent adhesive layer. This allows blue light emitted from the front to be absorbed by the phosphor on the upper surface of the chip, and light emitted from the side of the chip to be absorbed by the phosphor on the transparent adhesive layer on the chip's side, ultimately achieving uniform light emission, improving product performance, and significantly enhancing product quality. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a traditional LED packaging structure;

[0029] Figure 2 This is a cross-sectional schematic diagram of the LED structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the steps of the LED structure packaging method for preventing side light leakage according to the present invention. Figure 1 ;

[0031] Figure 4 yes Figure 3 The following diagram illustrates the steps of an LED structure packaging method to prevent side light leakage. Figure 2 ;

[0032] Figure 5 This is a schematic diagram of the steps of the LED structure packaging method in Embodiment 2;

[0033] Figure 6 This is a cross-sectional schematic diagram of the LED structure in Embodiment 3. Detailed Implementation

[0034] The invention will be further described below with reference to the accompanying drawings:

[0035] The orientations described in this invention specification, such as "up," "down," "left," "right," "front," and "back," are based on the orientations in the accompanying drawings and are intended to facilitate the description of the relationships between the various components. They do not indicate the unique or absolute positional relationships between the various components, but are merely one embodiment of the invention and are not a limitation on its implementation.

[0036] Example 1

[0037] This invention provides an LED structure that prevents side light leakage, such as... Figure 2 As shown, the device includes a substrate 1, an LED chip 2 disposed on the substrate 1, and a blocking adhesive ring 3 surrounding the LED chip 2 on the substrate 1. The blocking adhesive ring 3 forms a die-bonding cavity 30, which is filled with a transparent adhesive layer 4 covering the upper surface and sides of the LED chip 2. The upper surface of the transparent adhesive layer 4 is covered with a phosphor adhesive layer 5, and the upper surface of the phosphor adhesive layer 5 is covered with a sealant layer 6. The blocking adhesive ring 3 is a high-reflectivity white adhesive, which can be an A / B two-component high-temperature curing silicone resin. Here, A and B refer to two components in a two-component adhesive system. The components are the same. Glue A can be a common epoxy resin, containing resin, fillers, plasticizers, etc., which provides the main physical and chemical properties of the colloid, such as hardness, light transmittance, and heat resistance. Glue B uses a common curing agent, containing chemicals that can initiate or accelerate the curing reaction, such as amines or other types of curing accelerators and catalysts. When mixed with Glue A, it undergoes a cross-linking reaction, causing the entire system to change from a liquid to a solid state. The AB component mixture is white and has high light reflectivity. The height of the blocking ring 3 is H1, and the height of the LED chip 2 is H2; therefore, H1 ≤ H2. That is, the height of the blocking ring 3 is not less than half the height of the LED chip, and preferably, the thickness of the transparent adhesive layer 4 is also not less than half the height of the LED chip. With the above structure, the light from the side of the LED chip 2 can be blocked by the blocking ring 3, reflected and refracted within the die-bonding cavity 30 and transmitted through the surface of the transparent adhesive layer 4. At the same time, preferably, the upper surface of the transparent adhesive layer 4 is made into a curved and smooth transition surface 41 to avoid the formation of uneven brightness rings on the side of the LED chip, making the light output of the entire LED structure more uniform.

[0038] like Figure 3 and Figure 4 As shown, an LED structure packaging method for preventing side leakage of light, applied to the above-mentioned LED structure, includes the following steps:

[0039] S1. A ring of high-reflectivity white glue is set on the substrate 1 to form a blocking glue ring 3. The blocking glue ring 3 surrounds at least one die bonding cavity 30. The LED chip 2 is set on the substrate 1 and in the die bonding cavity 30. In this step, the order of setting the blocking glue ring 3 and setting the LED chip 2 is not limited. The LED chip 2 can be set first and then the blocking glue ring 3 can be set first and then the LED chip 2 can be set.

[0040] S2. Spray adhesive onto the upper surface and side of LED chip 2, apply transparent adhesive to form a preform. Preferably, ensure that the thickness of the transparent adhesive does not exceed the height of the blocking adhesive ring 3, and that the height of the transparent adhesive is not less than half the thickness of the chip, so as to ensure that the thickness of the transparent adhesive after it is evenly distributed is appropriate.

[0041] S3. Place the preform in an oven for low-temperature baking, causing the transparent adhesive on the upper surface of the LED chip 2 to flow to the side and the transparent adhesive on the side of the LED chip 2 to flow to the contact blocking ring 3, and the transparent adhesive is initially shaped and forms a transparent adhesive layer 4.

[0042] S4. Spray phosphor adhesive onto the die bonding cavity 30, so that the phosphor adhesive covers the entire transparent adhesive layer 4, and form a phosphor adhesive layer 5 on top of the transparent adhesive layer 4. It is suitable to spray the entire transparent adhesive layer 4 with phosphor, or even the sprayed area is larger than the area of ​​the transparent adhesive layer 4, to avoid the local overflow of light from the LED chip 2. This allows the blue light emitted from the front of the LED chip 2 to be absorbed by the phosphor on the chip's surface, and the light emitted from the side of the LED chip 2 to be absorbed by the phosphor on the transparent adhesive on the chip's side, thereby improving the uniformity of light emission.

[0043] S5. Apply encapsulating adhesive to the top of substrate 1, so that the encapsulating adhesive covers the entire barrier ring 3, forming an encapsulating adhesive layer on the top of substrate 1.

[0044] Furthermore, compared to traditional packaging technologies, the packaging method of this embodiment is different. Traditional packaging technologies use transparent adhesive to completely cover the chip. Because the amount of adhesive used to cover the chip is relatively large, a dispensing method is generally used. This results in uneven adhesive thickness on the chip surface, making it difficult to control the thickness at different locations. Too little adhesive leads to poor uniformity, while too much adhesive results in a very thick adhesive layer on the chip surface, making it difficult for the phosphor to dissipate heat and affecting its lifespan. At the same time, the surface of the dispensing planar adhesive layer and the sealant are parallel, which makes it easy for light to reflect back and forth within the adhesive and difficult to dissipate. The packaging method of this embodiment can form a thinner and more uniform adhesive layer. In particular, the transparent adhesive layer 4 can form a smooth transition of uneven positions, which is conducive to forming a more uniform light source with a wider light emission angle.

[0045] In a preferred embodiment, after step S1 and before step S2, the following steps are further included:

[0046] S1-1, as shown Figure 2 As shown, a reflective coating is sprayed on the surface of the blocking ring 3. The reflective coating is sprayed on at least the upper surface of the blocking ring 3 and the side of the blocking ring 3 near the LED chip 2. The reflective coating can be a titanium dioxide coating or an aluminum oxide coating, so that the blocking ring 3 has good reflective performance at least on the side, thereby improving the efficiency of light reflection from the side of the LED chip 2 and transmission through the transparent adhesive layer 4.

[0047] In a preferred embodiment, in step S2, the thickness of the transparent adhesive on the side of the LED chip 2 is less than or equal to the height of the blocking adhesive ring 3, and step S3 includes the following sub-steps;

[0048] S31. The preform is placed in an oven and baked at a temperature of 40-60℃ for 10-20 minutes. This allows the transparent adhesive to become fluid, causing the transparent adhesive on the upper surface of the LED chip 2 to flow to the sides, and the transparent adhesive on the sides of the LED chip 2 to flow to the contact blocking ring 3. Due to the surface tension of the transparent adhesive fluid and the adhesion between the transparent adhesive and the LED chip 2, a curved transition surface 41 is formed between the upper surface and the sides of the LED chip 2. During this process, the fluidity of the transparent adhesive increases due to the increased temperature. The transparent adhesive on the upper surface of the LED chip 2 can overcome the surface tension at the chip edge and flow to both sides of the chip, causing the adhesive thickness on the upper surface of the LED chip 2 to gradually decrease to a thinner state. In this embodiment, the adhesive thickness on the upper surface of the LED chip 2 gradually approaches 50 μm. In order to make the phosphor adhesive layer above the transparent adhesive layer as close as possible to the LED chip 2, even when the transparent adhesive layer still has local fluidity, the phosphor in the phosphor adhesive layer settles down to be close to the LED chip 2, greatly improving the downward heat dissipation performance of the phosphor layer. Meanwhile, the thickness of the transparent adhesive layer is controlled to be slightly less than the thickness of the blocking adhesive ring 3 and greater than half the thickness of the LED chip 2, so that after the transparent adhesive layer is leveled, a smooth and curved transition surface 41 is formed on its upper surface due to surface tension. This is a key structure that leads to more uniform light emission from the side of the LED chip 2 in the later stages.

[0049] S32. Place the preform in an oven and bake at a temperature of 80-140℃ for 5-20 minutes. This causes the transparent adhesive to lose its fluidity and form an incompletely cured transparent adhesive layer with high viscosity. Under high temperature conditions, the transparent adhesive layer will first lose its fluidity and initially set. At the same time, the adhesive inside will be in a highly viscous jelly-like state in an incompletely cured state, with a viscosity generally exceeding 50,000 mPa·s.

[0050] As a preferred embodiment, in step S3, centrifugation is used to replace the original low-temperature baking process. After the preform is made, the preform is centrifuged. The centrifugation process causes the transparent adhesive on the upper surface of the LED chip 2 to flow to the side and the transparent adhesive on the side of the LED chip 2 to flow to the contact blocking ring 3.

[0051] In a preferred embodiment, after step S4 and before step S5, the following steps are also included:

[0052] S4-1. Heat curing: Heat the blank at a temperature of 120-160℃ for 30-60 minutes.

[0053] Example 2

[0054] This embodiment provides an LED structure packaging method to prevent side light leakage. The difference from Embodiment 1 is that multiple LED chips 2 are arranged on the substrate 1, such as... Figure 5 As shown, the substrate 1 has pads 11 for connecting circuits, and mounting points 12 are pre-defined on the substrate 1. These mounting points 12 are virtual markers and do not represent the specific structure of the substrate 1. The substrate 1 also has a surrounding adhesive ring 7 that surrounds all LED chips 2. In step S1, connecting grooves 13 are first formed on the substrate 1. The connecting grooves 13 are positioned between two adjacent mounting points. In this embodiment, the connecting grooves 13 are crisscrossed to form a grid. In practical applications, they can be curved, as long as the connecting grooves 13 can surround each LED chip 2. The connecting grooves 13 improve the stability of the high-reflectivity white adhesive connection and further prevent side light leakage. In this embodiment, mounting points 12 for mounting LED chips 2 are first determined on the substrate 1. LED chips 2 are then mounted on mounting points 12, and high-reflectivity white adhesive is placed in the gaps between the mounting points, filling the inner side of the surrounding adhesive ring 7, thus forming multiple die-bonding cavities 30 around each LED chip 2. Subsequently, a transparent adhesive layer and a phosphor adhesive layer are formed in the die-bonding cavity 30, while the sealing adhesive layer 6 covers the entire inner side of the dam ring 7.

[0055] Specifically, in this embodiment, the various LED chips 2 arranged on the substrate 1 include warm white chips and cool white chips, which are arranged alternately. Each chip is controlled separately through its own circuit to achieve a dimming effect. The structure of reflective white glue, transparent glue layer and phosphor layer ensures that each LED chip 2 will not have side light leakage and cause cross-color phenomenon, thereby improving the controllability and stability of dimming.

[0056] Example 3

[0057] An LED structure that prevents side light leakage, differing from Embodiment 1 in that, as Figure 6 As shown, the blocking ring 3 has a light-guiding slope 31 that gradually slopes outward from bottom to top on one side wall near the LED chip 2. This increases the efficiency of uniform reflection of light emitted from the side of the LED chip 2 upward. The process of forming the light-guiding slope 31 on the blocking ring 3 includes, but is not limited to, the following methods: pre-forming a blocking ring 3 of a specific shape on the substrate by setting a mold and applying adhesive; coating the inclined light-guiding slope 31 with adhesive; cutting the light-guiding slope 31 by cutting material after pre-forming the blocking ring 3, etc. Numerous methods are not listed here.

[0058] The above descriptions are merely embodiments of the present invention, and common knowledge regarding specific structures and characteristics is not elaborated upon here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of the present invention, and these should also be considered within the scope of protection of the present invention. These modifications and improvements will not affect the effectiveness of the present invention or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An LED structure for preventing side light leakage, characterized in that: The invention comprises a substrate (1), an LED chip (2) is arranged on the substrate (1), a blocking rubber ring (3) is arranged on the substrate (1) and surrounds the LED chip (2), the blocking rubber ring (3) encloses a crystal-fixing cavity (30), the crystal-fixing cavity (30) is filled with a transparent rubber layer (4) and the transparent rubber layer (4) covers the upper surface and side surfaces of the LED chip (2), the upper surface of the transparent rubber layer (4) is covered with a layer of fluorescent powder glue layer (5), and the upper surface of the fluorescent powder glue layer (5) is covered with a layer of sealing glue layer (6).

2. The LED structure for preventing side light leakage according to claim 1, characterized in that: The blocking rubber ring (3) is a highly reflective white rubber, the height of the blocking rubber ring (3) is H1, the height of the LED chip (2) is H2, then H1≤H2, and 3. The LED structure for preventing side light leakage according to claim 1, characterized in that: The blocking rubber ring (3) is provided with a light guiding inclined surface (31) which is gradually inclined outward from bottom to top on a side wall close to the LED chip (2).

4. A method for packaging an LED structure with side light leakage prevention, the method being used to package the LED structure with side light leakage prevention according to claim 1, characterized in that: The following steps are involved: S1. A circle of highly reflective white glue is arranged on the substrate (1) to form a blocking glue ring (3), wherein the blocking glue ring (3) encloses at least one crystal-fixing cavity (30), and an LED chip (2) is arranged on the substrate (1) and in the crystal-fixing cavity (30); S2, spraying glue on the upper surface and side surfaces of the LED chip (2), spraying transparent glue, and forming a prefabricated blank; S3, placing the preform in an oven for low-temperature baking, or subjecting the preform to a centrifugal process, so that the transparent glue on the upper surface of the LED chip (2) flows to the side, and the transparent glue on the side of the LED chip (2) flows to the contact blocking rubber ring (3), and the transparent glue is initially shaped to form a transparent glue layer (4); S4, spraying fluorescent powder glue on the top of the crystal bonding cavity (30), so that the fluorescent powder glue covers the entire transparent glue layer (4), and forming a fluorescent powder glue layer (5) on the transparent glue layer (4); S5. Coating a packaging adhesive on the substrate (1) so that the packaging adhesive covers the entire barrier rubber ring (3), thereby forming a sealing adhesive layer (6) on the substrate (1).

5. The LED structure packaging method for preventing side light leakage according to claim 4, characterized in that: After step S1 and before step S2, the following steps are also included: S1-1, spraying a reflective coating on the surface of the blocking rubber ring (3), spraying the reflective coating on at least the upper surface of the blocking rubber ring (3) and on one side of the blocking rubber ring (3) close to the LED chip (2).

6. The LED structure packaging method for preventing side light leakage according to claim 5, characterized in that: In step S2, the thickness of the transparent adhesive on the side of the LED chip (2) is made less than or equal to the height of the blocking adhesive ring (3), and step S3 includes the following sub-steps: S31, placing the prefabricated blank in an oven and baking it at a temperature of 40-60° C. for a time of 10-20 minutes, so that the transparent glue has fluidity, causing the transparent glue on the upper surface of the LED chip (2) to flow toward the side, and the transparent glue on the side of the LED chip (2) to flow to the contact blocking rubber ring (3), and due to the surface tension of the transparent glue fluid and the adhesion between the transparent glue and the LED chip (2), the transparent glue between the upper surface and the side of the LED chip (2) forms a curved transition surface; S32, placing the preform in an oven for baking at a temperature of 80-140° C. for a time of 5-20 min, so that the transparent adhesive loses fluidity, forming an incompletely cured and highly viscous transparent adhesive layer (4).

7. The LED structure packaging method for preventing side light leakage according to claim 6, characterized in that: After step S4 and before step S5, the following steps are also included: S4-1. Heating and curing: heating the blank at a temperature of 120-160°C for a heating time of 30 min-60 min.

8. The LED structure packaging method for preventing side light leakage according to claim 6, characterized in that: A plurality of LED chips (2) are arranged on the substrate (1); in step S1, firstly, mounting points for mounting the LED chips (2) are determined on the substrate (1), the LED chips (2) are mounted on the mounting points, and highly reflective white glue is provided in the gaps between the mounting points, so that the highly reflective white glue surrounds each LED chip (2) to form a plurality of crystal-fixing cavities (30).

9. The LED structure packaging method for preventing side light leakage according to claim 8, characterized in that: The substrate (1) is also provided with a dam rubber ring capable of surrounding all LED chips (2); in step S1, a highly reflective white glue is arranged inside the dam rubber ring, and the highly reflective white glue is filled inside the dam rubber ring.

10. The LED structure packaging method for preventing side light leakage according to claim 8, characterized in that: In step S1, before setting the high-reflective white glue, a connection groove is first opened on the substrate (1), and the connection groove is set between two adjacent installation points.

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