Four-in-one lamp bead for outdoor display

Abstract

The invention relates to the technical field of photoelectricity, and discloses a four-in-one lamp bead for outdoor display, which comprises a substrate, the substrate is provided with a first surface and a second surface and is provided with a through hole penetrating through the substrate, the first surface is provided with a metal circuit, the metal circuit comprises four functional areas, and the four functional areas are arranged on the first surface. The functional area comprises a die bonding area and a wire bonding area, the second surface is provided with a plurality of pins, and the pins are connected with the metal circuit through the through holes; the bowl cup layer comprises a plurality of hollow bowl cups, the bowl cup layer is fixed on the first surface of the substrate, and the arrangement positions of the hollow bowl cups are in one-to-one correspondence with the arrangement positions of the functional areas; the chips comprise a green chip, a red chip and a blue chip which are arranged in the die bonding area; and the sealing glue layer is arranged on the chip and is used for filling the hollow bowl cup. The four-in-one lamp bead for outdoor display is good in air tightness.

Description

Technical Field

[0001] The invention relates to the field of optoelectronic technology, and in particular to a four-in-one lamp bead for outdoor display. Background Art

[0002] The existing TOP LED device uses a TOP stamping injection molding bracket as a bracket. The bracket is divided into two sides, the front side is composed of PPA and the metal part after stamping as the functional area of ​​the lamp bead. The PPA part is formed into a bowl by injection molding to protect the functional area. The back side is composed of PPA and pins. The pins are formed by bending. The front functional area uses silver glue or insulating glue to fix the chip in the functional area, and then the bonding wires are welded to the chip electrodes and the functional area to form an electrical connection between the chip and the functional area. The bracket is sealed with glue through a dispensing process, and then blanked into RGB three-primary color lamp beads. The above-mentioned RGB three-primary color lamp beads not only have poor heat dissipation capacity, which affects the life of the lamp beads, but also have the problem that water vapor easily invades the inside of the lamp beads through the pin position when the outdoor humidity is heavy, thereby increasing the probability of failure. At the same time, due to the height difference of the lamp bead pins, there is an uneven problem when the lamp beads are mounted, resulting in poor display effects. In addition, the current outdoor lamp beads are all single-lamp structures, which are inefficient in the lamp bead manufacturing process and the client display manufacturing process, wasting time and cost. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a four-in-one lamp bead for outdoor display, which has good air tightness.

[0004] In order to solve the above technical problems, the present invention provides a four-in-one lamp bead for outdoor display, a substrate, the substrate having a first surface and a second surface and provided with a through hole penetrating the substrate, a metal circuit is provided on the first surface, the metal circuit includes four functional areas, the functional areas include a die-bonding area and a wire-bonding area, a plurality of pins are provided on the second surface, and the pins are connected to the metal circuit through the through hole;

[0005] A bowl and cup layer, wherein the bowl and cup layer comprises a plurality of hollow bowl and cups, and the bowl and cup layer is fixed on the first surface of the substrate, and the arrangement positions of the hollow bowl and cups correspond one to one with the arrangement positions of the functional areas;

[0006] Chips, including a green chip, a red chip and a blue chip arranged in the die-bonding area, wherein the green chip, the red chip and the blue chip are connected to the wire bonding area through bonding wires;

[0007] A sealing layer is disposed on the chip and fills the hollow cup.

[0008] In some embodiments, the substrate is a BT substrate, the bowl and cup layer is a BT resin bowl and cup layer, and the substrate and the bowl and cup layer are bonded together by polypropylene glue.

[0009] In some embodiments, the bowl layer is made by the following method:

[0010] providing a substrate layer;

[0011] Holes are opened on the substrate layer to form a hollow bowl, and the location of the hollow bowl corresponds to the location of the functional area.

[0012] In some embodiments, the metal line is formed by an etching process, and nickel and silver are electroplated on the metal line.

[0013] In some embodiments, the second surface of the substrate is coated with two different colors of ink.

[0014] In some embodiments, the red chip is disposed between the green chip and the blue chip.

[0015] In some embodiments, the die bonding area includes a green chip die bonding area, a red chip die bonding area, and a blue chip die bonding area, and the wire bonding area includes a positive electrode wire bonding area and a negative electrode wire bonding area disposed on both sides of the die bonding area.

[0016] In some embodiments, the red chip is fixed to the red chip bonding area by conductive bonding glue, the blue chip is fixed to the blue chip bonding area by insulating bonding glue, and the green chip is fixed to the green chip bonding area by insulating bonding glue.

[0017] In some embodiments, the pins are planar pins.

[0018] In some embodiments, leads are provided between adjacent functional areas.

[0019] The implementation of the present invention has the following beneficial effects:

[0020] The four-in-one lamp bead for outdoor display provided by the present invention has a pressed cup structure, which improves the overall air tightness, while improving the efficiency of the lamp bead and reducing defects in the manufacturing process. The pin positions on the back of the lamp bead are flat, reducing the impact of unevenness on the display effect during patching. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of the four-in-one lamp bead for outdoor display provided by the present invention from a top view angle;

[0022] Figure 2 A schematic structural diagram of a longitudinal section of a four-in-one lamp bead for outdoor display provided by the present invention;

[0023] Figure 3 A schematic structural diagram of the first surface of a substrate of a four-in-one lamp bead for outdoor display provided by the present invention;

[0024] Figure 4 A schematic structural diagram of the second surface of the substrate of the four-in-one lamp bead for outdoor display provided by the present invention;

[0025] Figure 5 A schematic diagram of the structure of the bowl and cup layer of the four-in-one lamp bead for outdoor display provided by the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0032] In the present invention, "preferred" and "better" are only used to describe implementation methods or embodiments with better effects, and it should be understood that they do not constitute a limitation on the scope of protection of the present invention. In the present invention, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features. In the present invention, when involving numerical ranges, unless otherwise specified, the two endpoints of the numerical range are included.

[0033] To solve the above problems, the present invention provides a four-in-one lamp bead for outdoor display, such as Figure 1 to Figure 5 As shown, including:

[0034] A substrate 100, wherein the substrate 100 has a first surface and a second surface and is provided with a through hole 130 penetrating the substrate 100, wherein a metal circuit is provided on the first surface, wherein the metal circuit includes four functional areas 110, wherein the functional areas 110 include a die-bonding area 111 and a wire bonding area 112, and wherein a plurality of pins 120 are provided on the second surface, wherein the pins 120 are connected to the metal circuit through the through hole 130;

[0035] A bowl and cup layer 200, wherein the bowl and cup layer 200 comprises a plurality of hollow bowl and cups 210, and the bowl and cup layer 200 is fixed on the first surface of the substrate 100, and the arrangement positions of the hollow bowl and cups 210 correspond one to one with the arrangement positions of the functional areas 110;

[0036] Chips, including a green chip 310, a red chip 320 and a blue chip 330 disposed in the die-bonding area 111, wherein the green chip 310, the red chip 320 and the blue chip 330 are connected to the wire bonding area 112 via bonding wires 500;

[0037] The sealing layer 400 is disposed on the chip and fills the hollow cup 210 .

[0038] The four-in-one lamp bead for outdoor display provided by the present invention has a pressed cup structure, which improves the overall air tightness, while improving the efficiency of the lamp bead and reducing defects in the manufacturing process. The pin positions on the back of the lamp bead are flat, reducing the impact of unevenness on the display effect during patching.

[0039] In some embodiments, the substrate 100 is a BT substrate 100, the bowl layer 200 is a BT resin bowl layer 200, and the substrate 100 and the bowl layer 200 are bonded by polypropylene glue, which can improve the stability and reliability of the lamp beads. The good sealing between the substrate 100 and the bowl layer 200 and the excellent insulation and heat resistance can ensure the safe operation of the lamp beads in harsh environments such as high temperature and high humidity. Among them, the BT substrate 100 and the BT resin bowl layer 200 have excellent insulation and heat resistance, and can maintain stable electrical properties under high temperature environments. Moreover, it is easy to form and process, and can be made into various shapes and sizes as needed. Polypropylene glue has good bonding strength and durability, which can ensure a firm connection between the substrate 100 and the bowl layer 200. It has a wide temperature resistance range and can maintain stable bonding performance under high or low temperature environments. The substrate 100 and the bowl layer 200 bonded by polypropylene glue have excellent sealing performance, which can prevent impurities such as moisture and dust from entering the interior of the lamp beads.

[0040] Furthermore, in some embodiments, the bowl layer 200 is made by the following method:

[0041] providing a substrate layer;

[0042] A hole is opened on the base material layer to form a hollow cup 210 , and the location of the hollow cup 210 corresponds to the location of the functional area 110 .

[0043] Preferably, the substrate layer is a BT resin layer.

[0044] In some embodiments, the metal circuit is formed by an etching process, and nickel and silver are electroplated on the metal circuit. First, the etching process can accurately control the width, spacing and shape of the metal circuit; second, the metal circuit formed by the etching process has a strong bonding force with the substrate 100 and is not easy to fall off or break; third, nickel and silver have good corrosion resistance and oxidation resistance, which can protect the metal circuit from corrosion and oxidation in the environment, and the electroplating layer can form a dense protective layer to prevent harmful substances such as moisture and oxygen from directly contacting the metal circuit. The above settings improve the reliability of the lamp beads.

[0045] In some embodiments, two different colors of ink are coated on the second surface of the substrate 100. Preferably, the ink portion on the back of the BT substrate 100 is green ink on one side and white ink on the other side, so as to facilitate the identification of the polarity of the lamp beads.

[0046] In some embodiments, the red chip 320 is disposed between the green chip 310 and the blue chip 330. The red chip 320 is disposed in the middle to prevent the conductive die-bonding adhesive of the red light chip from touching the cup wall and creeping glue, causing a short circuit of the lamp bead.

[0047] In some embodiments, the die-bonding region 111 includes a green die-bonding region, a red die-bonding region, and a blue die-bonding region, and the wire bonding region 112 includes a positive electrode wire bonding region 112 and a negative electrode wire bonding region 112 disposed on both sides of the die-bonding region 111. In some embodiments, a lead 113 is disposed between adjacent functional regions 110.

[0048] In some embodiments, the red chip 320 is fixed to the red chip bonding area by a conductive bonding adhesive, the blue chip 330 is fixed to the blue chip bonding area by an insulating bonding adhesive, and the green chip 310 is fixed to the green chip bonding area by an insulating bonding adhesive. Among them, the conductive bonding adhesive can form a conductive path after curing to ensure the electrical connection between the red chip 320 and the substrate 100 or other electronic components, thereby meeting its functional requirements. The blue and green chips 310 do not need to be directly conductively connected to the substrate 100 or other electronic components. The use of insulating bonding adhesive can avoid electrical interference and ensure the normal operation of the chip. By fixing chips of different colors with conductive and insulating bonding adhesives respectively, the layout design of the circuit board can be optimized, making the connection between each chip more reasonable and efficient.

[0049] In some embodiments, the pins 120 are planar pins, and the pin positions on the back of the lamp beads are flat, which reduces the impact of unevenness on the display effect during patching.

[0050] In some embodiments, the sealing layer 400 is an epoxy resin sealing layer, which is disposed on the chip and fills the hollow cup 210. The epoxy resin sealing layer can form a strong protective layer after curing, providing good sealing for the chip. This can not only prevent impurities such as moisture and dust from entering the interior of the lamp bead, but also isolate the chip from the external environment, improving its moisture resistance, moisture resistance, dust resistance and other properties.

[0051] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0052] The above is a preferred embodiment of the invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the invention. These improvements and modifications are also considered to be within the scope of protection of the invention.

Claims

1. A four-in-one lamp bead for outdoor display, characterized in that: include: A substrate, the substrate having a first surface and a second surface and provided with a through hole penetrating the substrate, a metal circuit is provided on the first surface, the metal circuit includes four functional areas, the functional areas include a die-bonding area and a wire bonding area, and a plurality of pins are provided on the second surface, the pins are connected to the metal circuit through the through hole; A bowl and cup layer, wherein the bowl and cup layer comprises a plurality of hollow bowl and cups, and the bowl and cup layer is fixed on the first surface of the substrate, and the arrangement positions of the hollow bowl and cups correspond one to one with the arrangement positions of the functional areas; Chips, including a green chip, a red chip and a blue chip arranged in the die-bonding area, wherein the green chip, the red chip and the blue chip are connected to the wire bonding area through bonding wires; A sealing layer is disposed on the chip and fills the hollow cup.

2. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The substrate is a BT substrate, the bowl and cup layer is a BT resin bowl and cup layer, and the substrate and the bowl and cup layer are bonded together by polypropylene glue.

3. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The bowl and cup layer is prepared by the following method: providing a substrate layer; Holes are opened on the substrate layer to form a hollow bowl, and the location of the hollow bowl corresponds to the location of the functional area.

4. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The metal circuit is formed by an etching process, and nickel and silver are electroplated on the metal circuit.

5. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The second surface of the substrate is coated with two different color inks.

6. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The red chip is arranged between the green chip and the blue chip.

7. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The die-bonding region includes a green chip die-bonding region, a red chip die-bonding region, and a blue chip die-bonding region, and the wire bonding region includes a positive electrode wire bonding region and a negative electrode wire bonding region disposed on both sides of the die-bonding region.

8. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The red chip is fixed to the red chip bonding area by conductive bonding adhesive, the blue chip is fixed to the blue chip bonding area by insulating bonding adhesive, and the green chip is fixed to the green chip bonding area by insulating bonding adhesive.

9. The four-in-one lamp bead for outdoor display according to claim 1, characterized in that: The pins are planar pins.

10. The method for preparing a four-in-one lamp bead for outdoor display according to claim 1, characterized in that: Lead wires are arranged between adjacent functional areas.

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