Precise regeneration method of 8-inch chip manufacturing etching machine LAM quartz part

Abstract

The invention relates to the field of precision regeneration methods, in particular to a precision regeneration method for an LAM quartz part of an 8-inch chip manufacturing etching machine, which comprises the following steps: S1, laser equipment inspection, S2, machine setting, S3, quartz part placement, S4, laser cleaning, and S5, quartz part precision regeneration completion. The laser cleaning technology is a non-contact cleaning method, high-energy laser beams are used for irradiating the surface of an object to be cleaned, extremely high selectivity is achieved, laser with different wavelengths can be selected for cleaning according to different pollutants, the size and the shape of the laser beams can be accurately controlled, and the cleaning efficiency is improved. Compared with a traditional chemical cleaning method, the laser cleaning technology can achieve high-precision cleaning, and compared with a traditional chemical cleaning method, the laser cleaning technology does not need to use any chemical reagent, so that pollution to the environment is reduced, and the safety risk in the cleaning process is reduced.

Description

Technical Field

[0001] The invention relates to the field of precision regeneration methods, and in particular to a precision regeneration method for LAM quartz components of an 8-inch chip manufacturing etching machine. Background Art

[0002] The surface of quartz parts is generally cleaned by soaking in HF / HNO3=55% / 68% solution for 3s and then taking out to check whether the surface auxiliary materials are completely removed. If removed, rinse with pure water; if not removed, repeat the soaking action until the attachments are completely removed. HF / HNO3=55% / 68% solution, although the solution is highly efficient in the process of removing surface auxiliary materials, its shortcomings cannot be ignored.

[0003] First, the solution is highly corrosive, causing trace corrosion on the surface of components, which shortens the service life of components. Although trace corrosion may seem insignificant, long-term accumulation will increase the roughness of the component surface, affecting the precision and fit of the components. For precision instruments or high-end manufacturing fields, this corrosion may directly lead to product failure and cause huge economic losses.

[0004] Secondly, the solution is a strong acid, and the subsequent treatment cost is high. Strict protective measures are required during the storage, transportation and use of strong acid solutions, including special containers, corrosion-resistant pipes and protective equipment, which will increase the operating costs of the enterprise, and the cost of waste liquid treatment is also high;

[0005] Finally, the solution is highly corrosive and poses a risk to operators. The solution is highly corrosive and once it comes into direct contact with the skin, eyes, etc., it can cause severe chemical burns, posing a great safety hazard to operators at work.

[0006] Therefore, in view of the fact that the above-mentioned traditional cleaning methods are highly corrosive, causing trace corrosion to the surface of components, and at the same time have high post-processing costs and are dangerous to operators, a precise regeneration method for the LAM quartz components of the 8-inch chip manufacturing etching machine can be designed. Summary of the invention

[0007] In order to overcome the problem that traditional cleaning methods are highly corrosive, causing trace corrosion to the surface of components, and at the same time, the cost of subsequent processing is high and there are dangerous factors for operators.

[0008] The technical solution of the present invention is: a precise regeneration method for LAM quartz components of an 8-inch chip manufacturing etching machine, comprising the following steps:

[0009] S1: The staff shall inspect the appearance of the testing instrument to ensure that there is no abnormality in the appearance of the testing instrument, the output cable is not damaged, and there is no dust inside and outside the cleaning head protective lens;

[0010] S2: Turn on the machine → set the language, and select the appropriate cleaning mode according to the material, contamination degree and cleaning requirements of the quartz parts;

[0011] S3: Place the quartz component steadily on the turntable of the cleaning instrument. The technician carefully aligns the area to be cleaned with the cleaning head and places it close to the cleaning head so that the laser beam can fully act on the target area. Then the technician adjusts the position and angle of the cleaning head to ensure that the distance between the cleaning head and the quartz component is accurately controlled at 160mm.

[0012] S4: After confirming that the settings are correct, start the cleaning instrument and begin the precise regeneration process of the quartz parts. The laser cleaning technology will use a high-energy laser beam to irradiate the surface of the quartz parts. Through the thermal effect, mechanical impact effect, acoustic vibration effect, photochemical effect and plasma effect of the laser, the paint, oil stains and oxides on the surface of the quartz parts are removed to restore the original finish of the quartz parts.

[0013] S5: After cleaning, turn off the instrument and wait for the parts to cool down naturally. After the parts have completely cooled down, carefully remove the parts from the turntable and turn off the power of the instrument. The LAM quartz parts of the 8-inch chip manufacturing etching machine have completed precision regeneration.

[0014] Preferably, the thermal effect generated during laser cleaning causes the surface material to rapidly increase in temperature after absorbing laser energy, causing the contaminants to expand due to the heat and generate thermal stress. When this thermal stress exceeds the adhesion between the contaminants and the substrate, the contaminants will detach from the substrate surface.

[0015] Preferably, the mechanical shock generated during laser cleaning concentrates energy on the contaminants in a very short time, causing the contaminants to evaporate quickly or generate high-pressure gas, and the shock wave formed by the high-pressure gas can mechanically peel off the contaminants.

[0016] Preferably, the high temperature generated on the surface of the material by the acoustic vibrations produced during laser cleaning causes the material to expand and generate acoustic waves, which propagate within the material and help separate the contaminants from the substrate.

[0017] Preferably, the photochemical effect produced during laser cleaning causes the pollutants to undergo a photochemical reaction under the irradiation of laser light of a specific wavelength to generate volatile substances, thereby achieving cleaning.

[0018] Preferably, the plasma effect generated during laser cleaning allows the high energy density of the laser to instantly vaporize the surface material to form plasma, and the shock wave generated by the plasma expansion can effectively remove pollutants.

[0019] As a preferred embodiment, the process parameters of laser cleaning are: laser wavelength: 550nm; laser power: 80KW; pulse frequency: 20KHZ; scanning speed: 30m / s; working distance: 160mm.

[0020] Beneficial effects of the present invention:

[0021] The laser cleaning technology of the present invention is a non-contact cleaning method, which mainly utilizes a high-energy laser beam to irradiate the surface of the object to be cleaned;

[0022] Laser cleaning technology is highly selective. It can select lasers of different wavelengths for cleaning different pollutants. Different substances have different absorption characteristics of light. Therefore, by adjusting the wavelength and power of the laser, the energy can be precisely focused on the target pollutant without causing significant damage to the substrate. This selectivity makes laser cleaning technology particularly suitable for application scenarios that have strict requirements on the surface quality of the substrate.

[0023] The size and shape of the laser beam can be precisely controlled, allowing laser cleaning technology to achieve high-precision cleaning. In the fields of precision manufacturing and microelectronics, tiny contaminants may have a significant impact on the performance of the product. Laser cleaning technology can accurately remove these tiny contaminants by adjusting the focus and scanning path of the laser beam without damaging the surrounding material structure;

[0024] Compared with traditional chemical cleaning methods, laser cleaning technology does not require the use of any chemical reagents. This not only reduces pollution to the environment, but also reduces safety risks during the cleaning process. At the same time, it avoids possible corrosion or contamination of the substrate by chemical reagents, ensuring the surface quality of the material after cleaning. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the embodiments.

[0026] The present invention provides an embodiment: a precision regeneration method for LAM quartz components of an 8-inch chip manufacturing etching machine, comprising the following steps:

[0027] S1: The staff shall inspect the appearance of the testing instrument to ensure that there is no abnormality in the appearance of the testing instrument, the output cable is not damaged, and there is no dust inside and outside the cleaning head protective lens;

[0028] S2: Turn on the machine → set the language, select the appropriate cleaning mode according to the material, contamination degree and cleaning requirements of the quartz parts, and set the machine parameters: laser wavelength: 550nm; laser power: 80KW; pulse frequency: 20KHZ; scanning speed: 30m / s; working distance: 160mm;

[0029] S3: Place the quartz component steadily on the turntable of the cleaning instrument. The technician carefully aligns the area to be cleaned with the cleaning head and places it close to the cleaning head so that the laser beam can fully act on the target area. Then the technician adjusts the position and angle of the cleaning head to ensure that the distance between the cleaning head and the quartz component is accurately controlled at 160mm.

[0030] S4: After confirming that the settings are correct, start the cleaning instrument and begin the precise regeneration process of the quartz parts. The laser cleaning technology will use a high-energy laser beam to irradiate the surface of the quartz parts. Through the thermal effect, mechanical impact effect, acoustic vibration effect, photochemical effect and plasma effect of the laser, the paint, oil stains and oxides on the surface of the quartz parts are removed to restore the original finish of the quartz parts.

[0031] S5: After cleaning, turn off the instrument and wait for the parts to cool down naturally. After the parts have completely cooled down, carefully remove the parts from the turntable and turn off the power of the instrument. The LAM quartz parts of the 8-inch chip manufacturing etching machine have completed precision regeneration.

[0032] The thermal effect produced during laser cleaning is that the temperature of the surface material rises rapidly after absorbing the laser energy, causing the contaminants to expand due to the heat and generate thermal stress. When this thermal stress exceeds the adhesion between the contaminants and the substrate, the contaminants will detach from the substrate surface.

[0033] The mechanical shock generated during laser cleaning concentrates energy on the contaminants in a very short period of time, causing the contaminants to evaporate quickly or generate high-pressure gas. The shock wave formed by this high-pressure gas can mechanically peel off the contaminants.

[0034] The high temperatures generated on the material surface by the acoustic vibrations produced during laser cleaning cause the material to expand and generate acoustic waves, which propagate within the material and help separate contaminants from the substrate.

[0035] The photochemical effect produced during laser cleaning causes pollutants to undergo a photochemical reaction under the irradiation of lasers of a specific wavelength, generating volatile substances, thereby achieving cleaning.

[0036] The plasma effect produced during laser cleaning allows the high energy density of the laser to instantly vaporize the surface material to form plasma. The shock wave generated by the expansion of the plasma can effectively remove pollutants.

[0037] The embodiment provides a precise regeneration method for the LAM quartz parts of an 8-inch chip manufacturing etching machine, which can quickly heat up and peel off pollutants on the outside of the quartz parts in a short time, improve the cleaning efficiency, and accurately control the cleaning area of ​​the quartz parts to avoid damage to surrounding materials and achieve precise cleaning. No harmful chemicals or residues will be generated during the laser cleaning of the quartz parts, which is environmentally friendly, does not require direct contact with the material surface, and avoids the physical damage that may be caused by traditional cleaning methods.

Claims

The precision regeneration method of LAM quartz parts of 1.8-inch chip manufacturing etching machine is characterized by: The steps include: S1: The staff shall inspect the appearance of the testing instrument to ensure that there is no abnormality in the appearance of the testing instrument, the output cable is not damaged, and there is no dust inside and outside the cleaning head protective lens; S2: Turn on the machine → set the language, and select the appropriate cleaning mode according to the material, contamination degree and cleaning requirements of the quartz parts; S3: Place the quartz component steadily on the turntable of the cleaning instrument. The technician carefully aligns the area to be cleaned with the cleaning head and places it close to the cleaning head so that the laser beam can fully act on the target area. Then the technician adjusts the position and angle of the cleaning head to ensure that the distance between the cleaning head and the quartz component is accurately controlled at 160mm. S4: After confirming that the settings are correct, start the cleaning instrument and begin the precise regeneration process of the quartz parts. The laser cleaning technology will use a high-energy laser beam to irradiate the surface of the quartz parts. Through the thermal effect, mechanical impact effect, acoustic vibration effect, photochemical effect and plasma effect of the laser, the paint, oil stains and oxides on the surface of the quartz parts are removed to restore the original finish of the quartz parts. S5: After cleaning, turn off the instrument and wait for the parts to cool down naturally. After the parts have completely cooled down, carefully remove the parts from the turntable and turn off the power of the instrument. The LAM quartz parts of the 8-inch chip manufacturing etching machine have completed precision regeneration.

2. The precise regeneration method for LAM quartz parts of an 8-inch chip manufacturing etching machine according to claim 1, characterized in that: The thermal effect produced during laser cleaning is that the temperature of the surface material rises rapidly after absorbing the laser energy, causing the contaminants to expand due to the heat and generate thermal stress. When this thermal stress exceeds the adhesion between the contaminants and the substrate, the contaminants will detach from the substrate surface.

3. The precise regeneration method for LAM quartz parts of an 8-inch chip manufacturing etching machine according to claim 1, characterized in that: The mechanical shock generated during laser cleaning concentrates energy on the contaminants in a very short period of time, causing the contaminants to evaporate quickly or generate high-pressure gas. The shock wave formed by this high-pressure gas can mechanically peel off the contaminants.

4. The precise regeneration method for LAM quartz parts of an 8-inch chip manufacturing etching machine according to claim 1, characterized in that: The high temperatures generated on the material surface by the acoustic vibrations produced during laser cleaning cause the material to expand and generate acoustic waves, which propagate within the material and help separate contaminants from the substrate.

5. The precise regeneration method for LAM quartz parts of an 8-inch chip manufacturing etching machine according to claim 1, characterized in that: The photochemical effect produced during laser cleaning causes pollutants to undergo a photochemical reaction under the irradiation of lasers of a specific wavelength, generating volatile substances, thereby achieving cleaning.

6. The precise regeneration method for LAM quartz parts of an 8-inch chip manufacturing etching machine according to claim 1, characterized in that: The plasma effect produced during laser cleaning allows the high energy density of the laser to instantly vaporize the surface material to form plasma. The shock wave generated by the expansion of the plasma can effectively remove pollutants.

7. The precise regeneration method for LAM quartz parts of an 8-inch chip manufacturing etching machine according to claim 1, characterized in that: Laser cleaning process parameters: laser wavelength: 550nm; laser power: 80KW; pulse frequency: 20KHZ; scanning speed: 30m / s; working distance: 160mm.