Solder paste temperature returning machine for electronic component production

Abstract

The invention relates to a solder paste temperature returning machine for electronic component production, and belongs to the technical field of solder paste temperature returning devices. The solder paste temperature returning machine for electronic element production comprises a machine body, evenly-distributed containing grooves are formed in the top of the machine body, a cover plate used for shielding the containing grooves is arranged at the top of the machine body, a control table is arranged on one side of the machine body, and heat dissipation cavities are formed in the two sides of the machine body; by arranging the driving assembly, the solder paste bottle can be driven to rotate and heat in the process that the solder paste bottle is placed in the containing groove for temperature returning and heating, the heating uniformity is improved, meanwhile, the protrusions can be limited in the heating process, and the situation that the temperature returning effect of the solder paste is poor due to insufficient heating time is avoided; and water adhered to the surface of the solder paste bottle in the refrigeration process can be uniformly collected, and the situation that water is accumulated in the containing groove to affect follow-up use due to the fact that water vapor cannot be formed and discharged in the uncovering process due to the low heating temperature is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of solder paste reheating devices, and in particular to a solder paste reheating machine for electronic component production. Background Art

[0002] Solder paste is used in the field of electronic product processing. For example, solder paste is a key welding material in the SMT surface mounting process. Solder paste is mainly a paste-like stable mixture composed of alloy solder powder, flux carrier, etc. It plays the role of bonding components and promoting solder wetting, eliminating oxides, trace impurities and adsorption layers, protecting the surface from re-oxidation, and forming a strong metallurgical bond in surface mounting technology. Solder paste products need to be refrigerated at 3-7°C. Before use, they cannot be opened after being taken out of the refrigerator. They need to be placed in a solder paste warming machine for a certain period of time to allow the temperature of the solder paste to return to room temperature before use.

[0003] After searching, a Chinese patent disclosed a solder paste reheating machine (Announcement No. CN207982494U). This patented technology uses a timer to control the reheating time of the solder paste bottle. Before the reheating time reaches the timed time, the solder paste bottle cannot be taken out of the cavity, thereby avoiding the problem of insufficient reheating of the solder paste. However, there are differences in the distance between the solder paste bottle and the heating source when it is placed in the cavity. This method will cause uneven reheating effects at different positions of the solder paste bottle. Therefore, a person skilled in the art provides a solder paste reheating machine for electronic component production to solve the problems raised in the above background technology. Summary of the invention

[0004] Based on this, it is necessary to provide a solder paste reheating machine for electronic component production in view of the difference in the distance between the solder paste bottle stationary inside the cavity and the heating source. This method will cause uneven reheating effects at different positions of the solder paste bottle.

[0005] A solder paste reheating machine for electronic component production, comprising:

[0006] A machine body, wherein evenly distributed placement grooves are provided on the top of the machine body, a cover plate for covering the placement grooves is provided on the top of the machine body, a control console is provided on one side of the machine body, heat dissipation cavities are provided on both sides of the machine body, two symmetrically distributed connecting cavities are provided inside the machine body, a fan is provided inside the connecting cavity, a ventilation groove connected to the connecting cavity is provided on the surface of the machine body, an electric heating pipe located on the side of the fan away from the ventilation groove is provided inside the connecting cavity, and a protrusion is fixedly connected to the surface of the cover plate;

[0007] An auxiliary component, the auxiliary component is arranged inside the machine body, and the auxiliary component is used to reduce the influence of moisture during the reheating process;

[0008] A driving component, which is disposed inside the machine body and can make the solder paste be heated more evenly during the temperature recovery process;

[0009] In which, the driving component includes a placement table rotatably connected to the placement groove, a motor is arranged inside the body, the output shaft of the motor is fixedly connected to the first sprocket, and a rotating wheel coaxially arranged with the placement table is arranged inside the body, one of the rotating wheels is fixedly connected to the surface of the second sprocket, the surface of the first sprocket is arranged with a first chain, the second sprocket is transmission-connected to the first sprocket through the first chain, a third sprocket is arranged on the surface of the rotating wheel, and the surfaces of the two third sprockets are transmission-connected with the second chain, the top of the rotating wheel is fixedly connected to a turntable, and the top of the turntable is eccentrically fixedly connected to a lever for driving the placement table to rotate.

[0010] In one embodiment, the bottom of the placement table is fixedly connected to a mounting shell, the lower end of the mounting shell passes through a placement groove and is fixedly connected to a connecting shell, the inner top wall of the mounting shell is fixedly connected to an electromagnet, the inner wall of the mounting shell is slidably connected to an adsorption plate, the bottom of the adsorption plate is fixedly connected to an adjustment column, the lower end of the adjustment column passes through the mounting shell and is fixedly connected to a slide plate slidably connected to the inner wall of the connecting shell.

[0011] In one embodiment, a second spring is fixedly connected to the top of the slide plate, the upper end of the second spring is fixedly connected to the bottom of the mounting shell, a trigger rod is fixedly connected to the surface of the slide plate, the other end of the trigger rod passes through the connecting shell, and can contact the trigger rod during the rotation of the lever.

[0012] In one embodiment, the driving assembly also includes a connecting block fixedly connected to the top of the body, a card slot is provided on the surface of the connecting block, an adjustment cavity is provided inside the connecting block, a sliding plate is slidably connected to the inner wall of the adjustment cavity, and a third spring is fixedly connected between one side of the sliding plate and the inner wall of the adjustment cavity.

[0013] In one of the embodiments, the protrusion extends to the interior of the adjacent slot, the other side of the sliding plate is fixedly connected to a limiting rod, and the other end of the limiting rod penetrates into the interior of the slot.

[0014] In one of the embodiments, the interior of the regulating chamber is filled with hydraulic oil, and a guide tube is provided on the surface of the connecting block, one end of the guide tube is connected to the regulating chamber, and the other end of the guide tube is connected to the interior of the mounting shell.

[0015] In one embodiment, the auxiliary component includes a connecting hole opened on the surface of the body and connected to the adjacent placement groove, the inner wall of the connecting hole is provided with an installation cavity, and the interior of the body is provided with two collecting cavities respectively located under the two heat dissipation cavities.

[0016] In one of the embodiments, a mounting plate is provided inside the mounting cavity, a mounting block fixedly connected to the inner wall of the mounting cavity is fixedly connected to the surface of the mounting plate, a mounting column is fixedly connected to the side of the mounting plate close to the placement groove, a sealing ring is slidably connected to the surface of the mounting column, the outer side of the sealing ring is in contact with the inner wall of the mounting cavity, a through groove is opened on the surface of the mounting column, and a first spring is fixedly connected between the surface of the sealing ring and the inner wall of the mounting plate.

[0017] In one of the embodiments, the inner wall of the through groove is fixedly connected with evenly distributed partitions, and the inner wall of the through groove is fixedly connected with four groups of staggeredly distributed conduits, the angle between the conduits and the partitions is ninety degrees, the conduits pass through several partitions in sequence and are fixedly connected to the inner wall of the through groove, and the upper surface of the conduits is provided with evenly distributed collection holes.

[0018] In one of the embodiments, two adjacent conduits are connected by evenly distributed installation pipes, the bottom of one of the conduits is connected by evenly distributed exhaust pipes, and the other end of the exhaust pipe passes through the machine body and the heat dissipation cavity in sequence and is connected to the collection cavity.

[0019] The solder paste reheating machine for the production of the above-mentioned electronic components can drive the solder paste bottle to rotate and heat when the solder paste bottle is placed in the placement slot for reheating by setting a driving component, thereby improving uniform heating. At the same time, the protrusion can be limited during the heating process to avoid poor solder paste reheating effect caused by insufficient heating time, and the water adhering to the surface of the solder paste bottle during refrigeration can be reduced and collected uniformly, avoiding the situation where water vapor cannot be formed and discharged during the opening process due to the low heating temperature, resulting in water accumulation in the placement slot affecting subsequent use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 It is a partial cross-sectional view of the present invention;

[0023] Figure 3 It is a partial schematic diagram of the driving assembly of the present invention;

[0024] Figure 4 This is a schematic diagram of the distribution of the installation shell, the connection shell, the electromagnet, and the adsorption plate of the present invention;

[0025] Figure 5 It is a schematic diagram of the distribution of the limit rod, the sliding plate and the adjustment cavity of the present invention;

[0026] Figure 6 This is a schematic diagram of the distribution of the fan and the electric heating pipe of the present invention;

[0027] Figure 7 It is a partial schematic diagram of the auxiliary component of the present invention.

[0028] Reference numerals:

[0029] 100, body; 110, cover plate; 120, placement slot; 130, heat dissipation cavity; 140, fan; 160, electric heating pipe; 200, control console; 300, auxiliary component; 310, connection hole; 320, installation cavity; 330, collection cavity; 3201, installation plate; 3202, installation block; 3203, partition; 3204, installation column; 3205, through groove; 3206, first spring; 3207, sealing ring; 3208, conduit; 3209, collection hole; 3210, discharge pipe; 400, drive component; 41 0. Motor; 420. First chain; 430. Second chain; 440. Rotating wheel; 450. Turntable; 460. Lever; 470. Placement table; 4701. Mounting shell; 4702. Electromagnet; 4703. Adsorption plate; 4704. Adjustment column; 4705. Second spring; 4706. Connecting shell; 4707. Slide plate; 4708. Trigger rod; 480. Guide tube; 490. Connecting block; 4901. Adjustment chamber; 4902. Slot; 4903. Limit rod; 4904. Sliding plate; 4905. Third spring. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0035] Combine the following Figure 1-Figure 7 The invention discloses a solder paste reheating machine for producing electronic components.

[0036] like Figure 1-Figure 7 As shown, in one embodiment, a solder paste reheating machine for electronic component production includes:

[0037] A machine body 100, wherein evenly distributed placement grooves 120 are provided on the top of the machine body 100, a cover plate 110 for shielding the placement grooves 120 is provided on the top of the machine body 100, a console 200 is provided on one side of the machine body 100, heat dissipation cavities 130 are provided on both sides of the machine body 100, two symmetrically distributed connecting cavities are provided inside the machine body 100, a fan 140 is provided inside the connecting cavity, a ventilation groove connected to the connecting cavity is provided on the surface of the machine body 100, an electric heating pipe 160 located on the side of the fan 140 away from the ventilation groove is provided inside the connecting cavity, and a protrusion is fixedly connected to the surface of the cover plate 110;

[0038] An auxiliary component 300, the auxiliary component 300 is disposed inside the body 100, and the auxiliary component 300 is used to reduce the influence of moisture during the reheating process;

[0039] A driving assembly 400, wherein the driving assembly 400 is disposed inside the body 100, and the driving assembly 400 can make the solder paste be heated more evenly during the temperature recovery process;

[0040] The driving assembly 400 includes a placement table 470 rotatably connected to the placement groove 120, a motor 410 is arranged inside the body 100, and the output shaft of the motor 410 is fixedly connected to the first sprocket, and a rotating wheel 440 coaxially arranged with the placement table 470 is arranged inside the body 100, and a second sprocket is fixedly connected to the surface of one of the rotating wheels 440, and a first chain 420 is arranged on the surface of the first sprocket, and the second sprocket is connected to the first sprocket through the first chain 420. A third sprocket is arranged on the surface of the rotating wheel 440, and the surfaces of the two third sprockets are connected to the second chain 430 in a transmission manner, and a rotating disk 450 is fixedly connected to the top of the rotating wheel 440, and a lever 460 for driving the placement table 470 to rotate is eccentrically fixedly connected to the top of the rotating disk 450;

[0041] By starting the motor 410, the first chain 420 can be used to drive the rotating wheel 440 connected thereto to rotate through the first sprocket, the first chain 420 and the second sprocket. In this process, the second chain 430 and the third sprocket can be used to drive the remaining rotating wheels 440 to rotate synchronously, thereby reducing the use cost. The rotating wheel 440 can be driven to rotate synchronously with the rotating disk 450 and the lever 460 connected thereto under the rotation of the rotating wheel 440.

[0042] The solder paste that needs to be reheated is placed on the placement table 470 inside the placement groove 120, and then the cover 110 is closed, and the fan 140 and the electric heating tube 160 are started to form a heated airflow to be introduced into the interior of the placement groove 120 to reheat the solder paste, wherein a time relay is provided inside the control console 200 to time the heating time.

[0043] like Figure 1-Figure 5 As shown, the bottom of the placement table 470 is fixedly connected to a mounting shell 4701, the lower end of the mounting shell 4701 passes through the placement groove 120 and is fixedly connected to a connecting shell 4706, the inner top wall of the mounting shell 4701 is fixedly connected to an electromagnet 4702, the inner wall of the mounting shell 4701 is slidably connected to an adsorption plate 4703, the bottom of the adsorption plate 4703 is fixedly connected to an adjusting column 4704, the lower end of the adjusting column 4704 passes through the mounting shell 4701 and is fixedly connected to a slide plate 4707 slidably connected to the inner wall of the connecting shell 4706.

[0044] A second spring 4705 is fixedly connected to the top of the slide plate 4707, and the upper end of the second spring 4705 is fixedly connected to the bottom of the mounting shell 4701. A trigger rod 4708 is fixedly connected to the surface of the slide plate 4707, and the other end of the trigger rod 4708 passes through the connecting shell 4706, and the lever 460 can contact the trigger rod 4708 during rotation.

[0045] Among them, the adsorption plate 4703 is an iron metal material component, and can also be composed of other materials that can be adsorbed after the electromagnet 4702 generates magnetic force, and there is no specific limitation here.

[0046] Under normal conditions, the second spring 4705 can drive the bottom of the slide plate 4707 to fit with the bottom of the connecting shell 4706. Figure 4 At this time, under the rotation of the turntable 450, the trigger rod 4708 can be pushed to rotate through the lever 460, which can then drive the connecting shell 4706 and the mounting shell 4701 to rotate the placement table 470, so as to achieve the effect of driving the solder paste can placed on the placement table 470 to rotate, so that the heated air flow can be evenly heated when passing through.

[0047] By starting the electromagnet 4702, the adsorption plate 4703 can be adsorbed, which can drive the adjustment column 4704 to move upward synchronously. In this process, the slide plate 4707 can be driven to squeeze the second spring 4705 and drive the trigger rod 4708 to move upward synchronously. In this state, the lever 460 cannot contact the trigger rod 4708 during rotation, thereby not driving the placement table 470 to rotate, making it convenient for the staff to take and place the solder paste can.

[0048] like Figure 1-Figure 5As shown, the driving assembly 400 also includes a connecting block 490 fixedly connected to the top of the body 100, a card slot 4902 is provided on the surface of the connecting block 490, an adjusting cavity 4901 is provided inside the connecting block 490, a sliding plate 4904 is slidably connected to the inner wall of the adjusting cavity 4901, and a third spring 4905 is fixedly connected between one side of the sliding plate 4904 and the inner wall of the adjusting cavity 4901.

[0049] The protrusion extends to the interior of the adjacent slot 4902 , and the other side of the sliding plate 4904 is fixedly connected to a limiting rod 4903 , and the other end of the limiting rod 4903 penetrates into the interior of the slot 4902 .

[0050] The interior of the regulating chamber 4901 is filled with hydraulic oil. A guide tube 480 is provided on the surface of the connecting block 490 . One end of the guide tube 480 is connected to the regulating chamber 4901 , and the other end of the guide tube 480 is connected to the interior of the mounting shell 4701 .

[0051] After closing the cover 110, the protrusion can be inserted into the interior of the card slot 4902. At this time, the electromagnet 4702 is powered off and loses its magnetic force, and the time relay starts timing. After the electromagnet 4702 is powered off, the bottom of the slide plate 4707 can be driven to fit with the bottom of the connecting shell 4706 under the action of the second spring 4705. During this process, the adsorption plate 4703 can squeeze the hydraulic oil stored in the installation shell 4701, and the squeezed hydraulic oil is injected into the interior of the adjustment chamber 4901 through the guide tube 480, thereby pushing the sliding plate 4904 to slide along the inner wall of the adjustment chamber 4901 and stretching the third spring 4905, and at the same time driving the limiting rod 4903 to extend from the inside of the adjustment chamber 4901 and insert into the interior of the card slot 4902. At this time, the limiting rod 4903 can be located above the protrusion, thereby achieving the effect of limiting the cover 110. For details, see the attached Figure 2 and attached Figure 5 , thereby avoiding the situation where the cover 110 can be opened before the heating time is up. The electromagnet 4702 will not be started until the heating time reaches the time preset by the time relay. After the electromagnet 4702 is energized, the adsorption plate 4703 moves up, increasing the space between the bottom of the adsorption plate 4703 and the inside of the mounting shell 4701. At this time, the third spring 4905 drives the sliding plate 4904 and the limit rod 4903 to reset, so that the hydraulic oil stored in the adjusting chamber 4901 can be guided back to the internal storage of the mounting shell 4701.

[0052] like Figure 6 and Figure 7As shown, the auxiliary component 300 includes a connecting hole 310 opened on the surface of the body 100 and connected to the adjacent placement groove 120, the inner wall of the connecting hole 310 is provided with an installation cavity 320, and the interior of the body 100 is provided with two collecting cavities 330 respectively located below the two heat dissipation cavities 130.

[0053] A mounting plate 3201 is provided inside the mounting cavity 320, and a mounting block 3202 fixedly connected to the inner wall of the mounting cavity 320 is fixedly connected to the surface of the mounting plate 3201, and a mounting column 3204 is fixedly connected to the side of the mounting plate 3201 close to the placement groove 120, and a sealing ring 3207 is slidably connected to the surface of the mounting column 3204, and the outer side of the sealing ring 3207 contacts the inner wall of the mounting cavity 320, and a through groove 3205 is opened on the surface of the mounting column 3204, and a first spring 3206 is fixedly connected between the surface of the sealing ring 3207 and the inner wall of the mounting plate 3201.

[0054] The inner wall of the through groove 3205 is fixedly connected with evenly distributed partitions 3203, and the inner wall of the through groove 3205 is fixedly connected with four groups of staggeredly distributed conduits 3208, the angle between the conduits 3208 and the partitions 3203 is ninety degrees, the conduits 3208 pass through several partitions 3203 in sequence and are fixedly connected to the inner wall of the through groove 3205, and the upper surface of the conduits 3208 is provided with evenly distributed collecting holes 3209.

[0055] Two adjacent conduits 3208 are connected by evenly distributed installation pipes, and the bottom of one of the conduits 3208 is connected by evenly distributed exhaust pipes 3210 , and the other end of the exhaust pipe 3210 passes through the body 100 and the heat dissipation cavity 130 in sequence and is connected to the collection cavity 330 .

[0056] Solder paste cans are usually stored in refrigerators for refrigeration. During the refrigeration process, water mist or frost is easily formed on the surface of the solder paste cans. During the rewarming process, the moisture will slowly drip as the temperature increases. This is because the temperature is not very high during the rewarming process and the moisture cannot form water vapor. As the number of solder paste cans that rewarm increases, more water will accumulate inside the placement slot 120. Although part of the water will be discharged along the exhaust pipe in the traditional method of using hot air for rewarming, after the heating is stopped, part of the water will drip back into the placement slot 120 along the pipe, or will cause damage to the device after staying in the pipe for a long time.

[0057] The water formed during the heating process of the device can be gradually brought into the interior of the connecting hole 310 under the action of the airflow, and as the heating proceeds, the gas inside the placement groove 120 gradually increases, which can increase the air pressure inside the placement groove 120, thereby overcoming the elastic force of the first spring 3206 and driving the sealing ring 3207 to slide along the surface of the mounting column 3204 until it moves to the middle of the position where the through groove 3205 is opened. At this time, the airflow and moisture can enter between the partitions 3203 and enter the interior of the conduit 3208 through the collecting hole 3209, and be discharged through the collecting hole 3209 on the other side of the sealing ring 3207. In this process, the contact area between the moisture and the inner wall of the conduit 3208 is large, and a large amount of moisture will adhere to the interior of the conduit 3208 and finally be discharged through the discharge pipe 3210. Moreover, since the discharge pipe 3210 is partially located inside the heat dissipation cavity 130, it can fully dissipate heat. Since the temperature of the discharged airflow is higher than that of the discharge pipe 3210 and the conduit 3208, a temperature difference is formed, so that the moisture can be better collected and introduced into the interior of the collection cavity 330 for unified cleaning.

[0058] Working principle: the solder paste that needs to be reheated is placed on the placement table 470 inside the placement groove 120, and then the cover 110 is closed, and the fan 140 and the electric heating tube 160 are started to form a heated airflow to be introduced into the interior of the placement groove 120 to reheat the solder paste. By starting the motor 410, the rotating wheel 440 connected thereto can be driven to rotate through the first sprocket, the first chain 420 and the second sprocket under the action of the first chain 420. In this process, the remaining rotating wheels 440 can be driven to rotate synchronously under the joint action of the second chain 430 and the third sprocket, thereby reducing the cost of use. The rotation of the rotating wheel 440 can drive the turntable 450 and the lever 460 connected thereto to rotate synchronously, and the rotation of the turntable 450 can push the trigger through the lever 460. The trigger rod 4708 rotates, which in turn can drive the connecting shell 4706 and the mounting shell 4701 to rotate the placement table 470, so as to achieve the effect of driving the solder paste can placed on the placement table 470 to rotate, so that the heated air flow can evenly reheat it when passing through, until the preset reheating time is reached, the electromagnet 4702 is energized to adsorb the adsorption plate 4703, which can drive the adjustment column 4704 to move up synchronously. In this process, it can drive the slide plate 4707 to squeeze the second spring 4705 and drive the trigger rod 4708 to move up synchronously. In this state, the lever 460 cannot contact the trigger rod 4708 during its rotation, thereby not driving the placement table 470 to rotate, making it convenient for the staff to take and place the solder paste can, and release the limit on the protrusion to facilitate opening the cover 110.

[0059] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A solder paste reheating machine for electronic component production, characterized in that: include: A machine body (100), wherein the top of the machine body (100) is provided with evenly distributed placement grooves (120), the top of the machine body (100) is provided with a cover plate (110) for covering the placement grooves (120), a control console (200) is provided on one side of the machine body (100), heat dissipation cavities (130) are provided on both sides of the machine body (100), two symmetrically distributed connecting cavities are provided inside the machine body (100), a fan (140) is provided inside the connecting cavity, a ventilation groove connected to the connecting cavity is provided on the surface of the machine body (100), an electric heating pipe (160) is provided inside the connecting cavity and is located on a side of the fan (140) away from the ventilation groove, and a protrusion is fixedly connected to the surface of the cover plate (110); An auxiliary component (300), the auxiliary component (300) being arranged inside the machine body (100), and the auxiliary component (300) being used to reduce the influence of moisture during the reheating process; A driving component (400), the driving component (400) being arranged inside the body (100), and the driving component (400) being capable of making the solder paste be heated more evenly during the temperature recovery process; The driving assembly (400) comprises a placement table (470) rotatably connected to the placement groove (120); a motor (410) is arranged inside the body (100); an output shaft of the motor (410) is fixedly connected to a first sprocket; a rotating wheel (440) coaxially arranged with the placement table (470) is arranged inside the body (100); a second sprocket is fixedly connected to the surface of one of the rotating wheels (440); a first chain (420) is arranged on the surface of the first sprocket; the second sprocket is transmission-connected to the first sprocket via the first chain (420); a third sprocket is arranged on the surface of the rotating wheel (440); the surfaces of the two third sprockets are transmission-connected to the second chain (430); a rotating disc (450) is fixedly connected to the top of the rotating wheel (440); a lever (460) for driving the placement table (470) to rotate is eccentrically fixedly connected to the top of the rotating disc (450).

2. The solder paste reheating machine for electronic component production according to claim 1, characterized in that: The bottom of the placement table (470) is fixedly connected to a mounting shell (4701), the lower end of the mounting shell (4701) passes through a placement groove (120) and is fixedly connected to a connecting shell (4706), the inner top wall of the mounting shell (4701) is fixedly connected to an electromagnet (4702), the inner wall of the mounting shell (4701) is slidably connected to an adsorption plate (4703), the bottom of the adsorption plate (4703) is fixedly connected to an adjustment column (4704), the lower end of the adjustment column (4704) passes through the mounting shell (4701) and is fixedly connected to a slide plate (4707) slidably connected to the inner wall of the connecting shell (4706).

3. The solder paste reheating machine for electronic component production according to claim 2, characterized in that: The top of the slide plate (4707) is fixedly connected to a second spring (4705), the upper end of the second spring (4705) is fixedly connected to the bottom of the mounting shell (4701), the surface of the slide plate (4707) is fixedly connected to a trigger rod (4708), the other end of the trigger rod (4708) passes through the connecting shell (4706), and the lever (460) can contact the trigger rod (4708) during rotation.

4. The solder paste reheating machine for electronic component production according to claim 3, characterized in that: The driving assembly (400) further comprises a connecting block (490) fixedly connected to the top of the machine body (100), a slot (4902) being provided on the surface of the connecting block (490), an adjusting cavity (4901) being provided inside the connecting block (490), a sliding plate (4904) being slidably connected to the inner wall of the adjusting cavity (4901), and a third spring (4905) being fixedly connected between one side of the sliding plate (4904) and the inner wall of the adjusting cavity (4901).

5. The solder paste reheating machine for electronic component production according to claim 4, characterized in that: The protrusion extends to the inside of the adjacent slot (4902), and the other side of the sliding plate (4904) is fixedly connected to a limiting rod (4903), and the other end of the limiting rod (4903) penetrates into the inside of the slot (4902).

6. The solder paste reheating machine for electronic component production according to claim 5, characterized in that: The interior of the regulating chamber (4901) is filled with hydraulic oil, and a guide tube (480) is provided on the surface of the connecting block (490), one end of the guide tube (480) is connected to the regulating chamber (4901), and the other end of the guide tube (480) is connected to the interior of the mounting shell (4701).

7. The solder paste reheating machine for electronic component production according to claim 1, characterized in that: The auxiliary component (300) comprises a connection hole (310) opened on the surface of the body (100) and connected to the adjacent placement groove (120); an installation cavity (320) is opened on the inner wall of the connection hole (310); and two collecting cavities (330) are opened inside the body (100) and are respectively located below the two heat dissipation cavities (130).

8. The solder paste reheating machine for electronic component production according to claim 7, characterized in that: A mounting plate (3201) is provided inside the mounting cavity (320), and a mounting block (3202) fixedly connected to the inner wall of the mounting cavity (320) is fixedly connected to the surface of the mounting plate (3201), and a mounting column (3204) is fixedly connected to the side of the mounting plate (3201) close to the placement groove (120), and a sealing ring (3207) is slidably connected to the surface of the mounting column (3204), and the outer side of the sealing ring (3207) is in contact with the inner wall of the mounting cavity (320), and a through groove (3205) is provided on the surface of the mounting column (3204), and a first spring (3206) is fixedly connected between the surface of the sealing ring (3207) and the inner wall of the mounting plate (3201).

9. The solder paste reheating machine for electronic component production according to claim 8, characterized in that: The inner wall of the through groove (3205) is fixedly connected with evenly distributed partitions (3203), and the inner wall of the through groove (3205) is fixedly connected with four groups of staggeredly distributed conduits (3208), the angle between the conduits (3208) and the partitions (3203) is ninety degrees, the conduits (3208) sequentially penetrate several partitions (3203) and are fixedly connected with the inner wall of the through groove (3205), and the upper surface of the conduits (3208) is provided with evenly distributed collecting holes (3209).

10. The solder paste reheating machine for electronic component production according to claim 9, characterized in that: Two adjacent conduits (3208) are connected by evenly distributed installation pipes, and the bottom of one of the conduits (3208) is connected by evenly distributed exhaust pipes (3210), and the other end of the exhaust pipe (3210) passes through the machine body (100) and the heat dissipation cavity (130) in sequence and is connected to the collection cavity (330).

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