Multi-channel water-guided laser processing equipment and multi-channel water-guided laser processing method

Abstract

The invention discloses a multi-channel water-jet guided laser processing device and method, and belongs to the technical field of water-jet guided laser processing. According to the technical scheme, the method comprises the steps that a workpiece is fixed to a workbench, and the workbench is fixed to a machine tool base; a plurality of movement mechanisms are fixed to a machine tool base; correspondingly connecting the water-guided laser processing heads of the plurality of processing passages with each movement mechanism; the movement mechanism drives the water-jet-guided laser machining head to move in the X direction, the Y direction and the Z direction which are perpendicular in pairs, and / or the movement mechanism drives the water-jet-guided laser machining head to rotate so as to adjust the water-jet-guided laser machining head to reach the machining feature position of the workpiece; and the plurality of movement mechanisms drive the plurality of water-jet-guided laser processing heads to be distributed in the same plane in the circumferential direction of the rotating direction of the workpiece. The water-jet-guided laser machining device is applied to part machining, solves the technical problems of low machining efficiency and poor machining quality of existing single-channel water-jet-guided laser machining, and has the characteristics that the machining efficiency can be multiplied, and part deformation in the machining process can be reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of water-conducting laser processing, and in particular relates to a multi-channel water-conducting laser processing device and method. Background Art

[0002] Water-guided laser technology can be used for precision cutting and drilling of metals, ceramics, composite materials, and semiconductor materials, and is widely used. Its characteristic is that the laser energy is transmitted to the surface of the workpiece through a water jet as thin as a hair, and the workpiece material is ablated to achieve processing. Water-guided laser is a precision processing technology that uses a pulsed laser, usually with a power of 100-400W. The laser is coupled to a high-pressure water beam through an optical fiber or a reflector, and the water beam is directly aimed at the part to be processed during the processing.

[0003] A processing passage in the present invention refers to a system capable of forming a water beam system carrying a laser, which at least includes a laser light source, a set of optical fiber components or optical lens groups for transmitting lasers, a light-water coupling processing head, and also includes high-pressure water and auxiliary gas supply systems. A processing passage only forms a water beam carrying a laser, and can only process one feature object at the same time, such as a hole or a slit. Densely grouped hole parts, such as the combustion chamber and cone of an aircraft engine, have tens of thousands of holes on a single part. If the existing single-channel water-conducting laser machine tool is used to process them one by one in sequence, the processing time for each part will take 1-4 months, which is very inefficient. In addition, during the processing of a single processing passage, due to the redistribution of the stress field of the part, the part will deform in real time, which may cause shape and position deviations in subsequent processing, resulting in a decrease in the yield rate. Symmetrical processing can effectively reduce the deformation of parts during processing.

[0004] Chinese patent (CN113634880B) discloses a multi-beam water-guided laser processing device and processing system, which couples multiple lasers into the same water beam through the same focusing lens. According to the definition of the processing path in this scheme, although there are multiple laser light sources, there is still only one processing path; Chinese patent (CN113618232A) discloses a dual-beam coupled water-guided processing head device and processing method, which uses two laser light sources and couples the two laser beams into the same water beam through a beam-combining lens group, but in essence there is only one processing path. Summary of the invention

[0005] The details of one or more embodiments of the present invention are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent.

[0006] The present invention provides a multi-channel water-conducting laser processing device and method, which solves the technical problems of low processing efficiency and poor processing quality in existing single-channel water-conducting laser processing, has the characteristics of doubling the processing efficiency and helping to reduce the deformation of parts during the processing.

[0007] On one hand, the present invention discloses a multi-channel water-conducting laser processing method, comprising: fixing a workpiece on a workbench, and fixing the workbench on a machine tool base; fixing a plurality of motion mechanisms on the machine tool base; connecting a plurality of water-conducting laser processing heads of processing channels to each motion mechanism; the motion mechanism drives the water-conducting laser processing head to move in three directions X, Y, and Z that are perpendicular to each other, and / or the motion mechanism drives the water-conducting laser processing head to rotate to adjust the water-conducting laser processing head to reach the processing feature of the workpiece; and the plurality of motion mechanisms drives the plurality of water-conducting laser processing heads to be distributed in the same plane along the circumferential direction of the rotation direction of the workpiece; when the processing features of the workpiece are symmetrically distributed, the plurality of motion mechanisms drive the plurality of water-conducting laser processing heads to process each processing feature of the workpiece at the same time.

[0008] In some of the embodiments, when the processing features of the workpiece are asymmetrically distributed, each motion mechanism drives each water-conducting laser processing head to process each processing feature of the workpiece respectively.

[0009] In some of the embodiments, it also includes: using offline programming software or manual programming to assign the processing features on the workpiece to different processing paths, forming a processing program including processing posture, motion trajectory, and processing parameters, downloading the processing program to the control system, and driving each motion mechanism and processing path to process the workpiece simultaneously.

[0010] On the other hand, the present invention discloses a multi-channel water-conducting laser processing device, which is used in the multi-channel water-conducting laser processing method of any of the above technical solutions, including: a machine tool base; a workbench, which is used to fix the workpiece and is installed on the machine tool base, and the workbench drives the workpiece to rotate; a plurality of motion mechanisms, which are installed on the machine tool base; a plurality of processing channels, each processing channel corresponds to a water-conducting laser processing head, and each water-conducting laser processing head is correspondingly installed on a motion mechanism; the plurality of water-conducting laser processing heads are circumferentially distributed along the rotation direction of the workpiece under the drive of the motion mechanism and are located in the same plane.

[0011] In some embodiments, the processing path includes: a laser, an auxiliary machine and a water-conducting laser processing head; the laser is connected to the water-conducting laser processing head through a transmission optical fiber, and the auxiliary machine is connected to the water-conducting laser processing head through an air pipe and a water pipe.

[0012] In some of the embodiments, a control system is also included, and the control system is electrically connected to the laser, the auxiliary machine and the motion mechanism.

[0013] In some embodiments, the motion mechanism includes: a motion mechanism X-axis, a motion mechanism Y-axis, and a motion mechanism Z-axis, and the motion mechanism X-axis, the motion mechanism Y-axis, and the motion mechanism Z-axis are perpendicular to each other.

[0014] In some of the embodiments, when the workpiece is vertically mounted on a machine tool base, each motion mechanism includes: a motion mechanism X-axis, a motion mechanism Y-axis, and a motion mechanism Z-axis; the motion mechanism Y-axis is horizontally mounted on the machine tool base, the motion mechanism Z-axis is vertically mounted on the motion mechanism Y-axis, the motion mechanism X-axis is mounted on the motion mechanism Z-axis, and is perpendicular to the motion mechanism Z-axis and the motion mechanism Y-axis.

[0015] In some of the embodiments, when the workpiece is installed vertically, each motion mechanism further includes: a motion mechanism A axis connected to the motion mechanism X axis, and a motion mechanism B axis connected to the motion mechanism A axis, and the workpiece is installed on the motion mechanism B axis; the motion mechanism A axis is rotatably connected to the motion mechanism X axis, and the motion mechanism B axis can rotate within a certain angle range around the connection between the motion mechanism B axis and the motion mechanism A axis.

[0016] In some of the embodiments, when the workpiece is installed horizontally, the motion mechanism includes: a plurality of motion mechanism X-axes, a motion mechanism Y-axes, and a plurality of motion mechanism Z-axes; the motion mechanism Y-axis is horizontally installed on the machine tool base, and the workbench is installed on the motion mechanism Y-axis; the motion mechanism X-axis is horizontally installed on the machine tool base, and the motion mechanism Z-axis is vertically installed on the motion mechanism X-axis; the workpiece is installed on the motion mechanism Z-axis.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention provides a multi-channel water-conducting laser processing device and method. By reasonably arranging more water-conducting laser processing channels on one device, that is, multiple water beams carrying lasers, combined with a special machine tool structure and control method, it is possible to realize simultaneous processing of multiple different features of the same part, and to achieve a geometric increase in processing efficiency without increasing the laser power and changing the process parameters of a single channel. At the same time, simultaneous symmetrical processing of multiple channels can significantly reduce part processing deformation and improve processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 A schematic diagram of the main components of a vertical two-channel water-conducting laser processing device provided by an embodiment of the present invention;

[0021] Figure 2A schematic diagram of the main components of a horizontal two-channel water-conducting laser processing device provided by an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of the composition principle of a water-conducting laser processing path provided by an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of the water-guided laser processing principle provided by an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of the layout of a 2-channel water-conducting laser processing head provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of the layout of another 2-channel water-conducting laser processing head provided by an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of the layout of a 3-channel water-conducting laser processing head provided by an embodiment of the present invention;

[0027] Figure 8 A schematic diagram of the layout of another 3-channel water-conducting laser processing head provided by an embodiment of the present invention;

[0028] Fig. 9 A schematic diagram of the layout of a 4-channel water-guided laser processing head provided in an embodiment of the present invention;

[0029] Fig.10 A multi-channel water-conducting laser processing flow chart provided by an embodiment of the present invention;

[0030] Description of the drawings: 1. Machine tool base; 2. Workbench; 301. X-axis of the motion mechanism; 302. Y-axis of the motion mechanism; 303. Z-axis of the motion mechanism; 304. A-axis of the motion mechanism; 305. B-axis of the motion mechanism; 401. Water-guided laser processing head; 402. Laser; 403. Auxiliary machine; 404. Transmission optical fiber; 405. Air pipe; 406. Water pipe; 5. Control system; 6. Workpiece. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0032] Obviously, the drawings described below are only some examples or embodiments of the present invention. For ordinary technicians in this field, the present invention can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed by the present invention, some changes in design, manufacturing or production based on the technical content disclosed by the present invention are just conventional technical means, and should not be understood as insufficient content disclosed by the present invention.

[0033] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in the present invention may be combined with other embodiments without conflict.

[0034] Unless otherwise defined, the technical terms or scientific terms involved in the present invention shall have the usual meanings understood by persons with ordinary skills in the technical field to which the present invention belongs. The words "one", "a", "a", "the" and the like involved in the present invention do not indicate a quantity limitation and may indicate the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in the present invention are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device including a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in the present invention are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in the present invention refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" may indicate: A exists alone, A and B exist at the same time, and B exists alone. The character “ / ” generally indicates that the previous and next associated objects are in an “or” relationship.

[0035] On one hand, the present invention discloses a multi-channel water-conducting laser processing method, comprising: fixing a workpiece 6 on a workbench 2, and fixing the workbench 2 on a machine tool base 1; fixing a plurality of motion mechanisms on the machine tool base 1; connecting a plurality of water-conducting laser processing heads 401 of processing channels to each motion mechanism; the motion mechanism drives the water-conducting laser processing head 401 to move in three directions X, Y, and Z that are perpendicular to each other, and / or the motion mechanism drives the water-conducting laser processing head 401 to rotate to adjust the water-conducting laser processing head 401 to reach the processing feature of the workpiece 6; and the plurality of motion mechanisms drive the plurality of water-conducting laser processing heads 401 to be distributed in the same plane along the circumferential direction of the rotation direction of the workpiece 6; when the processing features of the workpiece 6 are symmetrically distributed, the plurality of motion mechanisms drive the plurality of water-conducting laser processing heads 401 to process the processing features of the workpiece 6 at the same time; when the processing features of the workpiece 6 are asymmetrically distributed, each motion mechanism drives each water-conducting laser processing head 401 to process each processing feature of the workpiece 6 respectively.

[0036] The above-mentioned multi-channel water-conducting laser processing method can realize simultaneous processing of multiple different features of the same part by reasonably arranging more water-conducting laser processing channels on one device, that is, multiple water beams carrying lasers, combined with a special machine tool structure and control method. Without increasing the power of the laser 402 and without changing the process parameters of a single channel, the processing efficiency can be increased geometrically. At the same time, the simultaneous symmetrical processing of multiple channels can significantly reduce the processing deformation of the parts and improve the processing quality.

[0037] In some embodiments, the method further includes: using off-line programming software or manual programming to assign processing features on the workpiece 6 to different processing paths, forming a processing program including processing postures, motion trajectories, and processing parameters, downloading the processing program to the control system 5, and driving each motion mechanism and processing path to process the workpiece 6 simultaneously. The specific process of the multi-path water-conducting laser processing method is as follows: Fig.10 shown.

[0038] The embodiment of the present invention also provides a multi-channel water-conducting laser processing device. Figure 1 , 2As shown, the multi-channel water-conducting laser processing equipment at least includes: a machine tool base 1; a workbench 2, which is used to fix the workpiece 6 and is installed on the machine tool base 1, and the workbench 2 drives the workpiece 6 to rotate; a plurality of motion mechanisms, which are installed on the machine tool base 1; a plurality of processing channels, each processing channel corresponds to a water-conducting laser processing head 401, and each water-conducting laser processing head 401 is correspondingly installed on a motion mechanism; the plurality of water-conducting laser processing heads 401 are circumferentially distributed along the rotation direction of the workpiece 6 and are located in the same plane under the drive of the motion mechanism. The multi-channel water-conducting laser processing equipment has a plurality of water-conducting laser processing channels in one device, such as 2, 3, 4, etc. Each channel has an independent motion mechanism, which can realize the spatial posture and motion trajectory of the water-conducting laser processing head 401. The motion mechanisms of the plurality of channels are installed on the same machine tool platform and have a common positioning reference. Compared with the existing single-channel processing, the processing efficiency can be doubled. When processing multiple channels, a symmetrical layout is adopted, which helps to reduce the deformation of parts during the processing process. In the process of processing the workpiece 6 using the above-mentioned equipment, only one clamping and positioning is required, and no disassembly is required in the middle.

[0039] like Figure 3 As shown, the processing passage includes: a laser 402, an auxiliary machine 403 and a water-conducting laser processing head 401; the laser 402 is connected to the water-conducting laser processing head 401 through a transmission optical fiber 404, and the auxiliary machine 403 is connected to the water-conducting laser processing head 401 through an air pipe 405 and a water pipe 406. Among them, the laser 402 is connected to the water-conducting laser processing head 401 through a transmission optical fiber 404, and the transmission optical fiber 404 here can also be replaced by a reflector group. The auxiliary machine 403 is a device that provides high-pressure water, compressed air, and He, and is connected to the water-conducting laser processing head 401 through a water pipe 406 and an air pipe 405. When working, the water-conducting laser processing head 401 sprays a water beam carrying a laser to process the workpiece 6. The laser 402 can be configured in multiple sets, or a single laser 402 can be used to output to multiple passages by using an optical gate for splitting light; the auxiliary machine 403 can be configured in multiple sets, or a single set of auxiliary machines 403 can be used to output water and air to multiple passages by using valves.

[0040] In some embodiments, a control system 5 is also included, and the control system 5 is electrically connected to the laser 402, the auxiliary machine 403 and the motion mechanism. The control system 5 is mainly composed of a PLC, an industrial computer, a motion control system 5CNC, etc. Among them, the PLC is the main control. The power supply and control circuit of the machine tool motion mechanism are connected to the motion control system 5CNC in the control system 5 through an integrated cable, and the water-guided laser processing head 401 is also connected to the PLC of the control system 5 through an integrated cable. The above-mentioned equipment adopts a control system 5 for centralized control and collaborative work. Optionally, CAM software is used to plan processing tasks for multiple channels in different regions, and symmetrical processing is preferred to reduce part deformation.

[0041] Water-guided laser processing technology is usually used for precision drilling and cutting. Its principle is as follows Figure 4 As shown, the laser is converged by a focusing lens, passes through a glass window into a sealed water chamber and is aimed at a nozzle with a diameter of 40-100 μm at the lower part of the sealed water chamber. High-pressure water is ejected through the nozzle to form a water beam. The laser entering the water beam is totally reflected at the interface between water and air. The laser energy is transferred to the workpiece 6, and the light energy is converted into heat energy to form a high-temperature plasma, which ablates the material to form a processing area, thereby realizing material removal processing for drilling, cutting, chamfering, grooving, thinning, etc.

[0042] In some embodiments, the motion mechanism includes: a motion mechanism X-axis 301 , a motion mechanism Y-axis 302 , and a motion mechanism Z-axis 303 , and the motion mechanism X-axis 301 , the motion mechanism Y-axis 302 , and the motion mechanism Z-axis 303 are perpendicular to each other.

[0043] Continue as Figure 1 As shown, when the workpiece 6 is vertically mounted on the machine tool base 1, each motion mechanism includes: a motion mechanism X-axis 301, a motion mechanism Y-axis 302, and a motion mechanism Z-axis 303; the motion mechanism Y-axis 302 is horizontally mounted on the machine tool base 1, the motion mechanism Z-axis 303 is vertically mounted on the motion mechanism Y-axis 302, and the motion mechanism X-axis 301 is mounted on the motion mechanism Z-axis 303, and is perpendicular to the motion mechanism Z-axis 303 and the motion mechanism Y-axis 302. Further, each motion mechanism also includes: a motion mechanism A-axis 304 connected to the motion mechanism X-axis 301, and a motion mechanism B-axis 305 connected to the motion mechanism A-axis 304, and the workpiece 6 is mounted on the motion mechanism B-axis 305; the motion mechanism A-axis 304 is rotatably connected to the motion mechanism X-axis 301, and the motion mechanism B-axis 305 can rotate around the connection between the motion mechanism B-axis 305 and the motion mechanism A-axis 304 within a certain angle range.

[0044] As one of the typical embodiments, Figure 1 It is a schematic diagram of the composition of a vertical 2-channel water-conducting laser processing equipment, where the workpiece 6 is horizontally fixed on a rotating table 2 and rotates in a horizontal plane. Its structural characteristics are that each water-conducting laser processing channel has an independent motion mechanism, which can independently control the posture and motion trajectory of the channel, and at the same time, multiple channels are centrally controlled by a control system 5. In order to achieve a unified positioning reference, the two motion mechanisms and the table 2 are fixed on a machine tool base 1, so as to achieve the consistency of the machine tool reference coordinates.

[0045] The first channel water-conducting laser processing head 401 is mounted on a two-dimensional swing head. The swing head has two rotation axes, namely the first channel motion mechanism A axis 304 and the first channel motion mechanism B axis 305, which rotate around the X axis and the Y axis respectively, providing the first channel water-conducting laser processing head 401 with a highly flexible spatial posture realization capability. This capability is indispensable when processing large-angle or special-shaped holes. For example, the group holes in the combustion chamber of an aircraft engine have different angles and need to adjust the posture in real time.

[0046] The motion mechanism also has three linear axes, namely the first channel motion mechanism Y axis 302, the first channel motion mechanism Z axis 303, and the first channel motion mechanism X axis 301, and the above-mentioned A and B rotating swing heads are installed on the first channel motion mechanism X axis 301.

[0047] The second passage is similar to the first passage, and the motion mechanism has two rotation axes, namely, the second passage motion mechanism B axis 305, the second passage motion mechanism A axis 304, and three linear axes, namely, the second passage motion mechanism Z axis 303, the second passage motion mechanism X axis 301, and the second passage motion mechanism Y axis 302. The second passage water-guided laser processing head 401 is installed on the above motion mechanism. The workpiece 6 is fixed on the rotary table 2.

[0048] The control system 5 is mainly composed of PLC, industrial computer, motion control system 5CNC, etc. Among them, PLC is the main control. The power supply and control circuit of the machine tool motion mechanism are connected to the motion control system CNC in the control system 5 through an integrated cable, and the water-conducting laser processing head 401 is also connected to the PLC of the control system 5 through an integrated cable. The first channel laser 402, the second channel laser 402, the first channel auxiliary machine 403, and the second channel auxiliary machine 403 are connected to the PLC of the control system 5 through control cables.

[0049] The vertical 2-channel water-guided laser processing equipment includes a rotary table 2 with a total of 11 motion axes. Depending on the processing object, the equipment control system 5 has two modes. The first mode is that all motion axes are connected to a single motion control system 5CNC, and any 5-axis linkage can be achieved during processing. The second mode is that two sets of motion axes are respectively connected to a motion control system 5CNC, each of which can achieve 5-axis linkage, and both sets of motion control systems 5CNC are centrally controlled by PLC.

[0050] For example, when processing the air film holes in the combustion chamber, since the angles of each row of holes are the same, as long as the initial angles are aligned, each motion mechanism only needs two linear axes to interpolate to complete the circular hole trajectory during the processing, and only four linear axes are involved in the linkage at the same time. In this case, the first control mode can be used. If the angles of the holes are different, or even special-shaped holes, the second control mode needs to be used. The specific method to be used needs to be determined according to the processing characteristics.

[0051] Continue as Figure 2 As shown, when the workpiece 6 is installed horizontally, the motion mechanism includes: a plurality of motion mechanism X-axes 301, a motion mechanism Y-axes 302, and a plurality of motion mechanism Z-axes 303; the motion mechanism Y-axes 302 are horizontally installed on the machine tool base 1, and the workbench 2 is installed on the motion mechanism Y-axis 302; the motion mechanism X-axis 301 is horizontally installed on the machine tool base 1, and the motion mechanism Z-axis 303 is vertically installed on the motion mechanism X-axis 301; the workpiece 6 is installed on the motion mechanism Z-axis 303.

[0052] As a typical embodiment, Figure 2 A schematic diagram of the structure of a horizontal two-channel water-conducting laser processing equipment is given. The workpiece 6 is fixed on a vertically placed rotating table 2. Its control method is similar to that of the vertical two-channel water-conducting laser processing equipment. When used for cutting processing, the two-channel water-conducting laser processing heads 401 are respectively aligned with the two ends of the same cutting track on the workpiece 6 under the support of three moving axes, and the fixed position does not move, and the rotating table 2 rotates to achieve high-efficiency slicing processing. When used for drilling processing, the workpiece 6 does not need to rotate continuously, but stops when the position to be processed is turned to the corresponding position of the processing head, and then turns to the next position after processing.

[0053] It should be noted that the configuration of the motion mechanism is not limited to Figure 1 , Figure 2 The form shown can also be configured as an industrial robot, a gantry machine tool, etc.

[0054] The spatial layout of multiple processing heads can be as follows: When there are two channels, the attached Figure 5 , 6 The layout of Figure 5 There are two processing paths with the workpiece 6 as the center and symmetrically distributed at 180°; Figure 6 The two processing channels are distributed at 90°. When there are three channels, the attached Figure 7 The layout of Figure 7 There are three processing paths with workpiece 6 as the center and 120° symmetrical distribution. Figure 8 The three processing channels are distributed at 90°. When there are four channels, the attached Fig. 9 In the arrangement mode, the four processing paths are symmetrically distributed at 90° with the workpiece 6 as the center.

[0055] During operation, the spatial relationship between each water-conducting laser processing path and the workpiece 6 and the machine tool can have multiple layouts. Typical:

[0056] The workpiece 6 is installed horizontally (corresponding to the vertical type of machining), and is in the horizontal plane with each machining path;

[0057] The workpiece 6 is installed vertically (corresponding to the horizontal type of machining), and is in the vertical plane with each machining passage;

[0058] The workpiece 6 is installed at a certain angle to the ground, and the workpiece 6 and each processing channel are in the same plane and at the same angle to the ground.

[0059] The above typical spatial positions cannot cover all states, but only the case where the processing features of the workpiece 6 are symmetrically distributed. When the processing features of the workpiece 6 are not symmetrically distributed, each processing channel independently completes its own processing task. In this processing process, it is necessary to prevent the motion mechanism from interfering.

[0060] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A multi-channel water-conducting laser processing method, characterized in that: include: Fixing the workpiece on a workbench, and fixing the workbench on a machine tool base; Fixing a plurality of motion mechanisms on the machine tool base; The water-conducting laser processing heads of the plurality of processing paths are connected to each of the motion mechanisms; the motion mechanisms drive the water-conducting laser processing heads to move in three directions, X, Y, and Z, which are perpendicular to each other, and / or the motion mechanisms drive the water-conducting laser processing heads to rotate so as to adjust the water-conducting laser processing heads to reach the processing features of the workpiece; and the plurality of motion mechanisms drive the plurality of water-conducting laser processing heads to be distributed in the same plane along the circumferential direction of the rotation direction of the workpiece; When the processing features of the workpiece are symmetrically distributed, a plurality of the motion mechanisms drive a plurality of the water-conducting laser processing heads to process the processing features of the workpiece simultaneously.

2. The multi-channel water-conducting laser processing method according to claim 1, characterized in that: When the processing features of the workpiece are distributed asymmetrically, each of the motion mechanisms drives each of the water-conducting laser processing heads to process each of the processing features of the workpiece respectively.

3. The multi-channel water-conducting laser processing method according to claim 1, characterized in that: Also includes: Offline programming software or manual programming is used to assign the processing features on the workpiece to different processing paths, respectively, to form a processing program including processing posture, motion trajectory, and processing parameters. The processing program is downloaded to the control system to drive each of the motion mechanisms and the processing paths to process the workpiece simultaneously.

4. A multi-channel water-conducting laser processing device, characterized in that: The multi-channel water-conducting laser processing method according to any one of claims 1 to 3 comprises: Machine tool base; A workbench, used to fix the workpiece and installed on the machine tool base, the workbench drives the workpiece to rotate; A plurality of motion mechanisms are installed on the machine tool base; A plurality of processing passages, each of which corresponds to a water-conducting laser processing head, and each of which is mounted on a corresponding motion mechanism; driven by the motion mechanism, the plurality of water-conducting laser processing heads are circumferentially distributed along the rotation direction of the workpiece and are located in the same plane.

5. The multi-channel water-conducting laser processing equipment according to claim 4, characterized in that: The processing path includes: a laser, an auxiliary machine and the water-conducting laser processing head; the laser is connected to the water-conducting laser processing head through a transmission optical fiber, and the auxiliary machine is connected to the water-conducting laser processing head through an air pipe and a water pipe.

6. The multi-channel water-conducting laser processing equipment according to claim 5, characterized in that: It also includes a control system, which is electrically connected to the laser, the auxiliary machine and the motion mechanism.

7. The multi-channel water-conducting laser processing equipment according to claim 4, characterized in that: The motion mechanism comprises: a motion mechanism X-axis, a motion mechanism Y-axis, and a motion mechanism Z-axis, and the motion mechanism X-axis, the motion mechanism Y-axis, and the motion mechanism Z-axis are perpendicular to each other.

8. The multi-channel water-conducting laser processing equipment according to claim 7, characterized in that: When the workpiece is vertically mounted on the machine tool base, each of the motion mechanisms includes: the motion mechanism X-axis, the motion mechanism Y-axis, and the motion mechanism Z-axis; the motion mechanism Y-axis is horizontally mounted on the machine tool base, the motion mechanism Z-axis is vertically mounted on the motion mechanism Y-axis, the motion mechanism X-axis is mounted on the motion mechanism Z-axis, and is perpendicular to the motion mechanism Z-axis and the motion mechanism Y-axis.

9. The multi-channel water-conducting laser processing equipment according to claim 8, characterized in that: When the workpiece is installed vertically, each of the motion mechanisms further includes: an A-axis of the motion mechanism connected to the X-axis of the motion mechanism, and a B-axis of the motion mechanism connected to the A-axis of the motion mechanism, and the workpiece is installed on the B-axis of the motion mechanism; the A-axis of the motion mechanism is rotatably connected to the X-axis of the motion mechanism, and the B-axis of the motion mechanism can rotate within a certain angle range around the connection between the B-axis of the motion mechanism and the A-axis of the motion mechanism.

10. The multi-channel water-conducting laser processing equipment according to claim 7, characterized in that: When the workpiece is installed horizontally, the motion mechanism includes: a plurality of motion mechanism X-axes, a plurality of motion mechanism Y-axes, and a plurality of motion mechanism Z-axes; the motion mechanism Y-axis is installed horizontally on the machine tool base, and the workbench is installed on the motion mechanism Y-axis; the motion mechanism X-axis is installed horizontally on the machine tool base, and the motion mechanism Z-axis is installed vertically on the motion mechanism X-axis; the workpiece is installed on the motion mechanism Z-axis.

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