Method and device for improving processing efficiency of ultra-high-speed scanning galvanometer

Abstract

The invention provides a method and device for improving the processing efficiency of an ultra-high-speed scanning galvanometer, and belongs to the technical field of ultra-high-speed scanning galvanometers, and the method comprises the steps: S1, importing a to-be-processed pattern of a sample, a scanning interval, a focal length of a field lens and a processing breadth of the field lens into a system, and enabling the system to carry out the path planning according to the comparison of different processing angles of the sample; s2, the sample digital model is imported into system control software of a galvanometer, and the sample digital model carrying processing path information is generated by selecting the outer contour of the sample or positioning features on the sample in the software; s3, placing and fixing a sample; and S4, the galvanometer carries out path-optimized galvanometer processing on the sample according to the set laser processing parameters. The method has the beneficial effects that a series of processes of visual positioning, algorithm optimization and sample pose adjustment are designed, and the efficient machining effect is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of ultra-high-speed scanning galvanometers, and relates to a method and a device for improving the processing efficiency of ultra-high-speed scanning galvanometers. Background Art

[0002] The ultra-high-speed scanning galvanometer realizes ultra-high-speed scanning of the light spot by rotating the polygonal prism in the galvanometer at high speed, and the scanning speed can exceed 100 meters per second. Due to the principle of the ultra-high-speed scanning galvanometer, its processing method is to scan parallel lines in a fixed direction, and high-speed scanning can only be obtained in this fixed direction (i.e., the fast axis direction). In the jumping direction of the parallel lines (i.e., the slow axis direction), it is controlled by the reflective plane mirror, and the movement mode and speed of the lens are similar to those of ordinary scanning galvanometers.

[0003] The parallel line processing method of the ultra-high-speed scanning galvanometer results in its processing efficiency having obvious directionality. The characteristic shape of the workpiece to be processed and the scanning path planning will directly affect the processing efficiency. The existing technology lacks means to improve the processing efficiency of the ultra-high-speed scanning galvanometer. The processing path planning method and processing device of the ultra-high-speed scanning galvanometer have great room for improvement. Summary of the invention

[0004] The purpose of the present invention is to address the above-mentioned problems existing in the prior art and to propose a method and device for improving the processing efficiency of ultra-high-speed scanning galvanometers.

[0005] The purpose of the present invention can be achieved by the following technical solutions: A method for improving the processing efficiency of ultra-high-speed scanning galvanometers, comprising the steps of:

[0006] S1: The sample to be processed, the scanning distance, and the focal length of the field mirror are introduced into the system. The system performs path planning based on the inherent processing method of the galvanometer and the relative processing posture of the sample and the galvanometer. The number of scanning lines required for the galvanometer processing pattern is determined by N. L =W / H+1 calculation, the software makes a judgment and records N L The angle combination of the galvanometer and the object at the minimum value obtains the optimal path, where W is the width of the pattern to be processed by the galvanometer in the current scanning posture, and H is the scanning spacing;

[0007] S2: Import the sample digital model into the system control software of the galvanometer, generate the digital model of the graphics to be processed containing the optimization path information by selecting the outer contour of the sample or the positioning features on the sample in the software, define the relative position relationship between the position of the graphics to be processed and the sample positioning information, clarify the position relationship between the processed graphics position and the sample to be processed, and generate the sample digital model carrying the processing path information;

[0008] S3: Place and fix the sample on the processing platform;

[0009] S4: By visually identifying the positioning information of the sample and combining it with the calculated optimization path, the sample is moved to the optimized position to be processed through the platform, and the galvanometer processes the sample according to the set laser processing parameters.

[0010] In the above-mentioned method for improving the processing efficiency of an ultra-high-speed scanning galvanometer, in step S3, the sample is installed with the surface to be processed facing upward, and the sample positioning information is identified by a visual camera to obtain the current position and placement posture of the sample, and the collected positioning information is compared with the previously generated digital model to obtain the optimized processing sample position of the galvanometer and the offset of the current sample position.

[0011] In the above-mentioned method for improving the processing efficiency of ultra-high-speed scanning galvanometer, in step S4, the system moves the sample according to the calculated position offset, moves the sample to the optimized position to be processed, adjusts the relative angle between the galvanometer and the sample, and then performs galvanometer processing of the optimized path.

[0012] In the above-mentioned method for improving the processing efficiency of ultra-high-speed scanning galvanometer, in step S5, when the area of ​​the sample to be processed is larger than the single processing format of the field lens, the displacement platform will move the object. After processing one area, the sample platform will carry the sample to the next processing position for processing until all areas that need to be processed are processed.

[0013] In the above-mentioned method for improving the processing efficiency of ultra-high-speed scanning galvanometer, in step S5, when the sample pattern to be processed requires the platform to rotate or translate to achieve a large-format processing or a pattern where the scanning track intersects, the displacement platform will move the object, and the displacement platform will carry the sample to rotate or translate during the laser processing process to complete the processing of a specific pattern.

[0014] A device for improving the processing efficiency of an ultra-high-speed scanning galvanometer is also provided, comprising:

[0015] Lasers;

[0016] An ultra-high-speed scanning galvanometer assembly, which has a light inlet and a light outlet, and the laser is aligned with the light inlet;

[0017] a processing table, which is aligned with the light outlet;

[0018] An adjusting component is connected to the processing table and can drive the processing table to move relative to the ultra-high-speed scanning galvanometer component.

[0019] In the above-mentioned device for improving the processing efficiency of an ultra-high-speed scanning galvanometer, the adjustment component includes a rotating table, the processing table is connected to the rotating table, and the rotating table can drive the processing table to rotate relative to the ultra-high-speed scanning galvanometer component.

[0020] In the above-mentioned device for improving the processing efficiency of the ultra-high-speed scanning galvanometer, the adjustment component also includes a plane slide, the rotating table is connected to the plane slide, and the plane slide can drive the rotating table to move relative to the ultra-high-speed scanning galvanometer assembly.

[0021] In the above-mentioned device for improving the processing efficiency of an ultra-high-speed scanning galvanometer, the ultra-high-speed scanning galvanometer assembly includes a polygonal prism, a plane mirror and a field mirror, the polygonal prism is provided with a first reflection surface and a second reflection surface, the first reflection surface and the second reflection surface are symmetrical up and down, the laser is aimed at the first reflection surface, the plane mirror is provided with a third reflection surface, the laser emitted by the laser enters from the light inlet, is reflected by the first reflection surface, the second reflection surface and the third reflection surface in sequence, and passes through the field mirror to be emitted from the light outlet.

[0022] In the above-mentioned device for improving the processing efficiency of the ultra-high-speed scanning galvanometer, it also includes a visual camera and a control system. The visual camera is used to obtain the positioning characteristics of the sample. The visual camera is electrically connected to the adjustment component through the control system and controls the adjustment component through the control system to drive the sample to move relative to the ultra-high-speed scanning galvanometer component.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. Design a series of processes of visual positioning - algorithm optimization - sample posture adjustment, obtain the contour information of samples in any posture through visual recognition, match and locate the optimized scanning path with the sample contour by combining the optimization algorithm with vision, and realize the sample and galvanometer processing posture and position adjustment through the rotation of the sample stage and the XY plane movement function to obtain efficient processing effect.

[0025] 2. The adjustment component is connected to the processing table and can drive the processing table to move relative to the ultra-high-speed scanning galvanometer component. By directly adjusting the position and angle of the workpiece relative to the ultra-high-speed scanning galvanometer component, the workpiece can meet the optimal path for parallel line processing in one direction. For workpieces that need to be processed in parallel lines in multiple directions, no manual intervention is required.

[0026] 3. The rotating table can drive the processing table to rotate relative to the ultra-high-speed scanning galvanometer assembly, thereby adjusting the angle of the workpiece relative to the ultra-high-speed scanning galvanometer assembly.

[0027] 4. The plane slide can drive the rotating table to move relative to the ultra-high-speed scanning galvanometer assembly, thereby adjusting the position of the workpiece relative to the ultra-high-speed scanning galvanometer assembly.

[0028] 5. Use a visual camera to photograph the sample and identify the sample positioning information to obtain the sample placement angle and current position. Compare the collected positioning information with the previously generated digital model to obtain the galvanometer optimized processing sample position and the offset of the current sample position. The control system moves the sample according to the calculated position offset, moves the sample to the optimized position to be processed, and adjusts the relative angle between the galvanometer and the sample by adjusting the component, thereby performing galvanometer processing of the optimized path. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic structural diagram of the ultra-high-speed scanning galvanometer assembly of the present invention.

[0030] Figure 2 This is a working principle diagram of the ultra-high-speed scanning galvanometer processing process of the present invention.

[0031] Figure 3 It is a calculation diagram of step S1 of the present invention.

[0032] Figure 4 This is a before and after comparison diagram of a single-direction optimized scanning path of the present invention.

[0033] Figure 5 This is a before and after comparison diagram of another single-direction optimized scanning path of the present invention.

[0034] Figure 6 This is a working principle diagram of improving the processing efficiency of ultra-high-speed scanning galvanometers according to the present invention.

[0035] Figure 7 It is a schematic diagram of the structure of the device for improving the processing efficiency of ultra-high-speed scanning galvanometer according to the present invention.

[0036] In the figure, 1. Laser; 2. Plane mirror; 3. Field lens; 4. Ultra-high-speed scanning galvanometer; 5. Polygonal prism; 6. Processing table; 7. Rotating table; 8. Plane slide; 9. Visual camera. DETAILED DESCRIPTION

[0037] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0038] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0039] In addition, in the present invention, descriptions such as "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0042] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0043] Regarding the processing materials, the present invention is mainly used for the processing of inhomogeneous ceramic-based composite materials, resin-based composite materials, and metal-based composite materials; at the same time, it is also suitable for the processing of homogeneous inorganic materials and organic materials.

[0044] Regarding machinable features, the present invention can be used for large-area depth-controlled machining, and can also be used for through-cutting machining, including but not limited to curved surfaces, planes, grooves, square holes, through holes, and blind hole machining.

[0045] like Figure 1-Figure 3 , Figure 6 As shown, a method for improving the processing efficiency of ultra-high-speed scanning galvanometer includes the following steps:

[0046] S1: The sample to be processed, the scanning distance, and the focal length of the field mirror are introduced into the system. The system performs path planning based on the inherent processing method of the galvanometer and the relative processing posture of the sample and the galvanometer. The number of scanning lines required for the galvanometer processing pattern is determined by N. L=W / H+1 calculation, the software makes a judgment and records N L The angle combination of the galvanometer and the object at the minimum value obtains the optimal path, where W is the width of the pattern to be processed by the galvanometer in the current scanning posture, and H is the scanning spacing;

[0047] S2: Import the sample digital model into the system control software of the galvanometer, generate the digital model of the graphics to be processed containing the optimization path information by selecting the outer contour of the sample or the positioning features on the sample in the software, define the relative position relationship between the position of the graphics to be processed and the sample positioning information, clarify the position relationship between the processed graphics position and the sample to be processed, and generate the sample digital model carrying the processing path information;

[0048] S3: Place and fix the sample on the processing platform;

[0049] S4: By visually identifying the positioning information of the sample and combining it with the calculated optimization path, the sample is moved to the optimized position to be processed through the platform, and the galvanometer processes the sample according to the set laser processing parameters.

[0050] On the basis of the above implementation, in step S3, the sample is installed with the surface to be processed facing upward, and the sample positioning information is identified by a visual camera to obtain the current position and placement posture of the sample, and the collected positioning information is compared with the previously generated digital model to obtain the offset of the processed sample position and the current sample position after the galvanometer is optimized.

[0051] Based on the above implementation, in step S4, the system moves the sample according to the calculated position offset, moves the sample to the optimized position to be processed, adjusts the relative angle between the galvanometer and the sample, and then performs galvanometer processing of the optimized path.

[0052] In this embodiment, a series of processes of visual positioning-algorithm optimization-sample posture adjustment are designed, and the contour information of the sample in any posture is obtained through visual recognition. The optimized scanning path is matched and positioned with the sample contour by combining the optimization algorithm with vision. The rotation and XY plane movement functions of the sample stage can realize the sample and galvanometer processing posture and position adjustment, and obtain efficient processing effects.

[0053] Furthermore, if Figure 4 As shown, as one of the preferred methods, in step S5, when the area of ​​the sample to be processed is larger than the single processing format of the field lens, the displacement platform will move the object. After processing one area, the sample platform will carry the sample to the next processing position for processing until all areas that need to be processed are processed.

[0054] Furthermore, if Figure 5As shown, as one of the preferred methods, in step S5, when the sample pattern to be processed requires the platform to rotate or translate to achieve a large-format processing or a pattern where the scanning track intersects, the displacement platform will move the object, and the displacement platform will carry the sample to rotate or translate during the laser processing to complete the processing of the specific pattern.

[0055] like Figure 7 As shown, a device for improving the processing efficiency of an ultra-high-speed scanning galvanometer includes: a laser 1, an ultra-high-speed scanning galvanometer 4 component, a processing table 6 and an adjustment component.

[0056] The ultra-high-speed scanning galvanometer 4 component has a light inlet (not marked in the figure) and a light outlet (not marked in the figure), and the laser 1 is aligned with the light inlet.

[0057] The processing platform 6 is aligned with the light outlet.

[0058] The adjustment component is connected to the processing table 6 and can drive the processing table 6 to move relative to the ultra-high-speed scanning galvanometer 4 component.

[0059] In this embodiment, the adjustment component is connected to the processing table 6 and can drive the processing table 6 to move relative to the ultra-high-speed scanning galvanometer 4 component. By directly adjusting the position and angle of the workpiece relative to the ultra-high-speed scanning galvanometer 4 component, the workpiece can meet the optimal path for parallel line processing in one direction. Even if the workpiece needs to be processed in multiple directions, no manual intervention is required.

[0060] On the basis of the above implementation, the adjustment component includes a rotating table 7, the processing table 6 is connected to the rotating table 7, and the rotating table 7 can drive the processing table 6 to rotate relative to the ultra-high-speed scanning galvanometer 4 component.

[0061] In this embodiment, the rotating table 7 can drive the processing table 6 to rotate relative to the ultra-high-speed scanning galvanometer 4 assembly, thereby adjusting the angle of the workpiece relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0062] On the basis of the above implementation, the adjustment component further includes a planar slide 8, the rotating table 7 is connected to the planar slide 8, and the planar slide 8 can drive the rotating table 7 to move relative to the ultra-high-speed scanning galvanometer 4 component.

[0063] In this embodiment, the planar slide 8 can drive the rotating table 7 to move relative to the ultra-high-speed scanning galvanometer 4 assembly, thereby adjusting the position of the workpiece relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0064] On the basis of the above-mentioned embodiment, the ultra-high-speed scanning galvanometer 4 component includes a polygonal prism 5, a plane mirror 2 and a field lens 3. The polygonal prism 5 is provided with a first reflection surface (not marked in the figure) and a second reflection surface (not marked in the figure). The first reflection surface and the second reflection surface are symmetrical up and down. The laser 1 is aligned with the first reflection surface. The plane mirror 2 is provided with a third reflection surface (not marked in the figure). The laser emitted by the laser 1 enters from the light inlet, is reflected by the first reflection surface, the second reflection surface and the third reflection surface in turn, and passes through the field lens 3 to be emitted from the light outlet.

[0065] In this embodiment, the laser light emitted by the laser 1 enters from the light inlet, is reflected by the first reflection surface, the second reflection surface and the third reflection surface in sequence, passes through the field lens 3, and is emitted from the light outlet.

[0066] On the basis of the above embodiment, it also includes a visual camera 9 and a control system (not shown in the figure), wherein the visual camera 9 is used to obtain the positioning characteristics of the sample, and the visual camera 9 is electrically connected to the adjustment component through the control system and controls the adjustment component through the control system to drive the sample to move relative to the ultra-high-speed scanning galvanometer 4 component.

[0067] In this embodiment, the sample is photographed by the visual camera 9 to identify the sample positioning information, thereby obtaining the placement angle and current position of the sample, and the collected positioning information is compared with the previously generated digital model to obtain the offset of the processed sample position after galvanometer optimization and the current sample position. The control system moves the sample according to the calculated position offset, moves the sample to the optimized position to be processed, and adjusts the relative angle between the galvanometer and the sample by adjusting the component, thereby performing galvanometer processing of the optimized path.

Claims

1. A method for improving the processing efficiency of an ultra-high-speed scanning galvanometer, characterized in that: Includes steps: S1: The sample to be processed, the scanning distance, and the focal length of the field mirror are introduced into the system. The system performs path planning based on the inherent processing method of the galvanometer and the relative processing posture of the sample and the galvanometer. The number of scanning lines required for the galvanometer processing pattern is determined by N. L =W / H+1 calculation, the software makes a judgment and records N L The angle combination of the galvanometer and the object at the minimum value obtains the optimal path, where W is the width of the pattern to be processed by the galvanometer in the current scanning posture, and H is the scanning spacing; S2: Import the sample digital model into the system control software of the galvanometer, generate the digital model of the graphics to be processed containing the optimization path information by selecting the outer contour of the sample or the positioning features on the sample in the software, define the relative position relationship between the position of the graphics to be processed and the sample positioning information, clarify the position relationship between the processed graphics position and the sample to be processed, and generate the sample digital model carrying the processing path information; S3: Place and fix the sample on the processing platform; S4: By visually identifying the positioning information of the sample and combining it with the calculated optimization path, the sample is moved to the optimized position to be processed through the platform, and the galvanometer processes the sample according to the set laser processing parameters.

2. A method for improving the processing efficiency of an ultra-high-speed scanning galvanometer according to claim 1, characterized in that: In step S3, the sample is installed with the surface to be processed facing upward, and the sample positioning information is identified by a visual camera to obtain the current position and placement posture of the sample. The collected positioning information is compared with the previously generated digital model to obtain the processing sample position after galvanometer optimization and the offset of the current sample position.

3. A method for improving the processing efficiency of an ultra-high-speed scanning galvanometer according to claim 2, characterized in that: In step S4, the system moves the sample according to the calculated position offset, moves the sample to the optimized position to be processed, adjusts the relative angle between the galvanometer and the sample, and then performs galvanometer processing of the optimized path.

4. A method for improving the processing efficiency of an ultra-high-speed scanning galvanometer according to claim 1, characterized in that: In step S5, when the area of ​​the sample to be processed is larger than the single processing format of the field lens, the displacement platform will move the object. After processing one area, the sample platform will carry the sample to the next processing position for processing until all areas to be processed are completed.

5. The method for improving the processing efficiency of an ultra-high-speed scanning galvanometer according to claim 1, characterized in that: In step S5, when the sample pattern to be processed requires the platform to rotate or translate to achieve a large-format processing or a pattern where the scanning track intersects, the displacement platform will move the object, and the displacement platform will carry the sample to rotate or translate during the laser processing to complete the processing of the specific pattern.

6. A device for improving the processing efficiency of ultra-high-speed scanning galvanometer, characterized in that: include: Lasers; An ultra-high-speed scanning galvanometer assembly, which has a light inlet and a light outlet, and the laser is aligned with the light inlet; The adjusting assembly is aligned with the light exit port and is used for placing the sample and for driving the sample to move relative to the ultra-high-speed scanning galvanometer assembly.

7. The device for improving the processing efficiency of ultra-high-speed scanning galvanometer according to claim 6, characterized in that: The adjustment component includes a rotating platform, and the rotating platform is used to drive the sample to rotate relative to the ultra-high-speed scanning galvanometer component.

8. The device for improving the processing efficiency of ultra-high-speed scanning galvanometer according to claim 7, characterized in that: The adjustment component also includes a planar slide, the rotating table is connected to the planar slide, and the planar slide can drive the rotating table to move relative to the ultra-high-speed scanning galvanometer component.

9. The device for improving the processing efficiency of ultra-high-speed scanning galvanometer according to claim 6, characterized in that: The ultra-high-speed scanning galvanometer assembly includes a polygonal prism, a plane mirror and a field mirror. The polygonal prism is provided with a first reflection surface and a second reflection surface. The first reflection surface and the second reflection surface are symmetrical up and down. The laser is aligned with the first reflection surface. The plane mirror is provided with a third reflection surface. The laser emitted by the laser enters from the light inlet, is reflected by the first reflection surface, the second reflection surface and the third reflection surface in sequence, passes through the field mirror, and is emitted from the light outlet.

10. The device for improving the processing efficiency of ultra-high-speed scanning galvanometer according to claim 6, characterized in that: It also includes a visual camera and a control system. The visual camera is used to obtain sample positioning features. The visual camera is electrically connected to the adjustment component through the control system and controls the adjustment component through the control system to drive the sample to move relative to the ultra-high-speed scanning galvanometer component.

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