A composite polishing device and method for sealing surfaces

Abstract

A composite polishing apparatus and method for sealing surfaces are disclosed. The apparatus includes an electrolyte tank containing electrolyte; a polishing platform movably disposed within the electrolyte; at least one material carrier plate movably disposed within the electrolyte, and the material carrier plate is positioned opposite to the polishing platform; and an electrolytic processing power supply, the positive and negative terminals of which are electrically connected to the material carrier plate and the polishing platform, respectively. During processing, the sealing surface of the workpiece loaded on the material carrier plate is brought into contact with the polishing platform, and the material carrier plate and the polishing platform are driven to rotate opposite each other. Simultaneously, the electrolytic processing power supply is turned on to conduct the circuit and polish the sealing surface of the workpiece. This invention also discloses a composite polishing method for sealing surfaces. This invention achieves high processing accuracy, good processing flexibility, and a stable and controllable processing process.

Description

Technical Field

[0001] This invention relates to the field of precision machining technology, specifically to a composite polishing apparatus and method for sealing surfaces. Background Technology

[0002] With the rapid development of modern industry, the operating environments for sealing surfaces are becoming increasingly demanding, including high temperature, low temperature, high pressure, high vacuum, large size, and micro size. Furthermore, the emergence of sealing problems involving various flammable, explosive, toxic, and highly corrosive media, as well as media containing suspended particles such as mud and sand, places higher demands on sealing surfaces. Therefore, the processing quality of the sealing surface determines the service life and sealing performance of the sealing component, and consequently directly affects the stability, reliability, and service life of the sealing system.

[0003] Excellent machining processes are an effective means to ensure the machining accuracy and surface quality of sealing surfaces. Currently, the main machining methods for sealing surfaces include grinding, lapping, and electrochemical polishing. Among these, grinding can basically meet the machining accuracy and surface quality requirements of sealing surfaces. However, when machining difficult-to-cut and high-temperature resistant materials, the grinding heat generated will concentrate in the machining area, affecting the machining quality of the sealing surface. Lapping uses grinding tools and free abrasives to apply a certain pressure to the workpiece surface and remove protrusions through relative motion, thereby improving the surface accuracy and reducing the surface roughness of the sealing surface. However, for machining large or small sealing surfaces, it suffers from low machining efficiency and poor surface quality stability. Electrochemical polishing relies on the principle of electrochemical anodic dissolution to remove material and achieve a smooth workpiece surface. Electrochemical polishing is characterized by its independence from the mechanical properties of the workpiece material, burr-free processing, good surface quality, absence of recast layers and microcracks, and suitability for precision machining of sealing surfaces. However, there are many uncontrollable factors in the electrochemical polishing process, which can easily lead to uneven removal of material from the processed surface and introduce new errors that affect the machining accuracy of the sealing surface, making it difficult to obtain the ideal polishing effect. Summary of the Invention

[0004] Therefore, the purpose of this invention is to provide a composite polishing device and method for sealing surfaces with high processing accuracy, good processing flexibility, and stable and controllable processing.

[0005] The present invention achieves the above-mentioned objectives through the following technical solutions.

[0006] In a first aspect, the present invention provides a composite polishing apparatus for sealing surfaces, comprising: an electrolyte tank containing an electrolyte; a polishing platform movably disposed within the electrolyte tank; at least one material carrier plate movably disposed within the electrolyte tank, and the material carrier plate being disposed opposite to the polishing platform; and an electrolytic processing power supply, the positive and negative terminals of which are electrically connected to the material carrier plate and the polishing platform, respectively. During processing, the sealing surface of the workpiece to be processed, loaded on the material carrier plate, is brought into contact with the polishing platform, and the material carrier plate and the polishing platform are driven to rotate opposite each other, while the electrolytic processing power supply is turned on to conduct the circuit and polish the sealing surface of the workpiece.

[0007] In some embodiments, a magnetic field generating component is also included, which includes an N-pole magnet, an S-pole magnet, and a magnetic field excitation source. The N-pole magnet and the S-pole magnet are respectively disposed on opposite sides outside the electrolyte tank. The positive and negative poles of the magnetic field excitation source are electrically connected to the N-pole magnet and the S-pole magnet, respectively. During processing, the magnetic field excitation source is turned on to generate a magnetic field in the electrolyte tank.

[0008] In some embodiments, the magnetic field generating component further includes a magnetic field regulator; during processing, the magnetic field regulator is used to adjust the direction and magnitude of the magnetic field.

[0009] In some embodiments, the electrolyte contains magnetic abrasive particles.

[0010] In some embodiments, the tray contains at least one of the workpieces.

[0011] In some embodiments, the tray has a groove, at least one workpiece is disposed in the groove, the workpiece has a cavity, and the groove and the cavity are filled with paraffin wax.

[0012] In some embodiments, the polishing platform includes a rotating platform and a polishing pad fixed on the rotating platform, wherein the polishing pad and the rotating platform are provided with communicating spiral grooves.

[0013] In some embodiments, an electrolyte circulation pipeline is also included, one end of which is connected to the bottom of the electrolyte tank, and the other end of which is provided with a nozzle. A pump, a flow meter, and a pressure gauge are also provided on the electrolyte circulation pipeline.

[0014] Secondly, the present invention provides a method for composite polishing of sealing surfaces, comprising the following steps:

[0015] S1, load the workpiece into the loading tray, and fill the groove of the loading tray and the cavity of the workpiece with paraffin wax and smooth it.

[0016] S2, place the workpiece with the sealing surface to be processed facing down above the polishing pad, and start the liquid pump to make the electrolyte flow steadily into the electrolyte tank;

[0017] S3, connect the positive and negative terminals of the electrolytic processing power supply to the material carrier and the rotating platform respectively;

[0018] S4, turn on the magnetic field excitation source to generate a magnetic field in the electrolyte, and adjust the direction of the magnetic field by the magnetic field controller so that the direction of the magnetic field is perpendicular to the flow direction of the electrolyte;

[0019] S5 drives the material carrier and the rotating platform respectively to make the workpiece and the polishing pad rotate in opposite directions, while driving the material carrier to move closer to the rotating platform so that the workpiece and the polishing pad are in contact and do not separate.

[0020] S6 turns on the electrolytic machining power supply to conduct the circuit, and polishes the sealing surface of the workpiece through the combined action of the polishing pad, electrolyte, and magnetic field.

[0021] In some embodiments, in step S6, the magnetic field strength can be adjusted by a magnetic field controller; after step S6, the following steps are also included: after the polishing process is completed, the electrolytic processing power supply, magnetic field excitation source, liquid pump and drive of the loading tray and rotating platform are turned off, the loading tray is reset, and the paraffin on the loading tray and workpiece is removed by low-temperature heating, so that the workpiece can be removed and cleaned.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: By setting a polishing platform and a material carrier plate that can rotate in opposite directions in the electrolyte tank, and connecting the material carrier plate and the polishing platform to the positive and negative terminals of the electrolytic processing power supply respectively, electrochemical-mechanical composite polishing processing of the sealing surface of the workpiece loaded on the material carrier plate can be realized, and the sealing surface can be guaranteed to be smooth, sharp-edged, and burr-free, ensuring the processing quality and dimensional accuracy of the sealing surface; at the same time, by setting a magnetic field generating device outside the electrolyte tank, a magnetic field can be generated in the electrolyte, and under the action of the magnetic field, electrochemical polishing processing and grinding processing to remove the passivation film on the workpiece surface can be carried out alternately and continuously, so as to achieve the effect of smoothing the surface and further improving the processing quality. Attached Figure Description

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the structure of a composite polishing device for sealing surfaces according to the present invention;

[0025] Figure 2 This is a partial schematic diagram of a composite polishing device for sealing surfaces according to the present invention;

[0026] Figure 3 This is a partially enlarged schematic diagram of a composite polishing device for sealing surfaces according to the present invention;

[0027] Figure 4 This is a schematic diagram of a composite polishing device for sealing surfaces according to the present invention, in which a material carrier plate is loaded with multiple workpieces;

[0028] Figure 5 This is a schematic diagram of a workpiece cavity filled with paraffin wax in a composite polishing device for sealing surfaces according to the present invention.

[0029] Figure 6 This is a schematic diagram of a sealing surface composite polishing processing device of the present invention, which is used simultaneously for multiple material trays;

[0030] Figure 7 This is a schematic diagram of a ring-shaped workpiece in a composite polishing device for sealing surfaces according to the present invention;

[0031] Figure 8 This is a schematic diagram of a spiral workpiece in a composite polishing device for sealing surfaces according to the present invention;

[0032] Figure 9 This is a schematic diagram of a gradually expanding workpiece in a sealing surface composite polishing device according to the present invention;

[0033] Figure 10 This is a schematic diagram of a cross-array workpiece in a composite polishing device for sealing surfaces according to the present invention;

[0034] Figure 11 This is a flowchart of a composite polishing process for a sealing surface according to the present invention. Detailed Implementation

[0035] To better understand the present invention, various aspects of the invention will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of embodiments of the invention and are not intended to limit the scope of the invention in any way. It should be noted that in this specification, the terms first, second, third, etc., are used only to distinguish one feature from another and do not imply any limitation on the features.

[0036] It should also be understood that the terms “comprising,” “including,” “having,” “containing,” and / or “comprising”, when used in this specification, indicate the presence of the stated features, elements, and / or components, but do not exclude the presence or addition of one or more other features, elements, components, and / or combinations thereof.

[0037] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0038] With the rapid development of modern industry, the operating environment of seals is becoming increasingly demanding, and the requirements for the sealing surfaces of these seals are also becoming more stringent. The processing quality of the sealing surface determines the service life and sealing performance of the seal, which in turn directly affects the stability, reliability, and service life of the sealing system. Existing sealing surface processing technologies, such as grinding, lapping, and electrochemical polishing, are insufficient to simultaneously meet the requirements of high processing precision, good processing flexibility, and stable and controllable processing, especially polishing processes. Figure 7 The ring-shaped workpiece shown, such as Figure 8 The spiral workpiece shown, such as Figure 9 The gradually expanding workpiece shown, such as Figure 10 When working with seals in structural forms such as cross-array workpieces, it is imperative to seek a new polishing device and polishing method that meets the requirements of high processing accuracy, good processing flexibility, and stable and controllable processing.

[0039] Please see Figures 1 to 6 This invention provides a composite polishing device for sealing surfaces. The device includes an electrolyte circulation pipeline, a magnetic field generating component, an electrolyte tank 6, a polishing platform, at least one material carrier 2, and an electrolytic processing power supply 7. The electrolyte circulation pipeline is located outside the electrolyte tank 6, providing a stable supply of electrolyte 11 and facilitating its circulation. The polishing platform is positioned opposite to at least one material carrier 2 and is located within the electrolyte tank 6 containing the electrolyte 11. The polishing platform and material carrier 2 can be driven independently and rotate in opposite directions, allowing for the mechanical polishing of the sealing surface of the workpiece 1 mounted on the material carrier 2. The electrolytic processing power supply 7 is located outside the electrolyte tank 6, with its positive and negative terminals electrically connected to the material carrier 2 and the polishing platform, respectively. It generates an electrochemical reaction on the workpiece 1 and is used for electrochemical polishing. The magnetic field generating component is located outside the electrolyte tank 6 and generates a magnetic field within the electrolyte 11 to assist in the polishing of the workpiece 1.

[0040] This invention, through the installation of a counter-rotating polishing platform and a material carrier within an electrolyte tank, with the material carrier and polishing platform connected to the positive and negative terminals of the electrolytic processing power supply respectively, enables electrochemical-mechanical composite polishing of the sealing surface of a workpiece mounted on the material carrier. This ensures a smooth, sharp, and burr-free sealing surface, guaranteeing processing quality and dimensional accuracy. Simultaneously, by installing a magnetic field generator outside the electrolyte tank, a magnetic field is generated within the electrolyte. Under the influence of this magnetic field, electrochemical polishing and grinding (removing the passivation film from the workpiece surface) can be performed alternately and continuously, achieving a smooth surface finish and further improving processing quality.

[0041] Specifically, the electrolyte circulation pipeline includes a circulation pipe, one end of which is connected to the bottom of the electrolyte tank 6, and the other end of which is fixedly equipped with a nozzle 13, which is higher than the electrolyte 11 liquid level in the electrolyte tank 6. At the same time, a pump 8, a flow meter 9 and a pressure gauge 10 are installed on the circulation pipe to facilitate the extraction of electrolyte 11 from the electrolyte tank 6 and the spraying of electrolyte 11 from the nozzle 13 into the electrolyte tank 6, thereby enabling the electrolyte 11 to have a certain flow rate and a certain circulation frequency in the electrolyte tank 6.

[0042] More preferably, an agitator 14 is installed at the bottom of the electrolyte tank 6 and near the inlet of the circulation pipe. The agitator 14 can not only prevent the polishing products 17 from depositing and clogging the inlet of the circulation pipe, but also accelerate the flow and circulation of the electrolyte 11.

[0043] Furthermore, the positive and negative terminals of the electrolytic processing power supply 7 are electrically connected to the material carrier 2 and the polishing platform, respectively, and both the material carrier 2 and the polishing platform can be placed in the electrolyte 11 of the electrolyte tank 6. Meanwhile, the material carrier 2 has a groove, the depth of which is slightly less than the height of the workpiece 1. Multiple workpieces 1 of the same or different specifications with sealing surfaces to be processed are loaded in this groove. Each workpiece 1 has a cavity, and paraffin wax is filled in the groove of the material carrier 2 and the cavity of the workpiece 1, and the paraffin wax is smoothed out. The polishing platform includes a polishing pad 3 and a rotating platform 4. The polishing pad 3 is positioned opposite to the workpiece 1 on the material carrier 2, and the polishing pad 3 is fixedly mounted on the rotating platform 4.

[0044] This invention, through filling and smoothing the grooves of the loading tray and the cavity of the workpiece with paraffin wax, provides support for the workpiece's sealing surface, ensuring its close contact with the polishing pad during processing. This effectively reduces vibrations caused by unevenness in the sealing surface, particularly noticeable for small-sized sealing surfaces, thus improving the stability and controllability of the processing. Furthermore, electrochemical polishing can result in a spike effect (high electric field strength at protrusions on the workpiece, leading to strong electrochemical dissolution of the material). Filling the cavity with paraffin wax effectively reduces stray current electrochemical corrosion of the sharp edges on the sealing surface, ensuring a smooth, burr-free surface. Additionally, the magnetic abrasive particles in the electrolyte generate a small amount of grinding heat during polishing as they scrape away the passivation film on the workpiece surface. This heat melts a small amount of paraffin wax into the polishing zone, providing lubrication to the polishing pad and the workpiece surface. Therefore, this invention not only enhances the stability and controllability of the sealing surface polishing process but also ensures a smooth, burr-free surface.

[0045] Furthermore, the magnetic field generating assembly includes an N-pole magnet, an S-pole magnet, a magnetic field excitation source 5, and a magnetic field controller 10. The N-pole magnet and the S-pole magnet are respectively fixedly mounted on opposite sides of the electrolyte tank 6. The positive and negative poles of the magnetic field excitation source 5 are electrically connected to the N-pole magnet and the S-pole magnet, respectively, to generate a magnetic field within the electrolyte 11. Simultaneously, a magnetic field controller 10 is installed on the line between the magnetic field excitation source 5 and the S-pole magnet to adjust the direction and magnitude of the magnetic field. More preferably, suspended magnetic abrasive particles 15 are provided within the electrolyte 11, which facilitates microscopic leveling of the workpiece surface.

[0046] This invention, through the installation of a magnetic field generating component outside the electrolyte tank, enables a composite polishing process combining electrochemical polishing and mechanical polishing assisted by a magnetic field. Specifically, under the influence of the magnetic field, electrochemical polishing and grinding (removing the passivation film from the workpiece surface) can be performed alternately and continuously to achieve a smooth surface finish. In particular, this invention utilizes a magnetic field controller to adjust the magnetic field direction so that it is perpendicular to the electrolyte flow direction. This causes the electrolyte to flow faster towards the polishing zone under the influence of the Lorentz force, achieving electrolyte circulation and renewal. Furthermore, the more complex ionic trajectories of the ions in the electrolyte under the Lorentz force help reduce the influence of concentration polarization, accelerate the electrochemical reaction process in the polishing zone, and improve material removal rate. Simultaneously, the suspended magnetic abrasive particles in the electrolyte also flow faster towards the polishing zone under the influence of the magnetic field, allowing more abrasive particles to participate in the polishing process simultaneously. This shortens the processing time required to achieve the same surface roughness, improving processing efficiency. When a certain pressure is applied to the workpiece, the free magnetic abrasive particles roll, scrape, and squeeze on the processed surface. The passivation film generated on the micro-protrusions of the processed surface is quickly scraped off, exposing new metal atoms for anodic dissolution. This process rapidly removes the material from the micro-protrusions, quickly reducing surface roughness. Meanwhile, the passivation film in the depressions of the processed surface is not easily removed by abrasive particles, thus hindering the electrochemical reaction and protecting the surface. This achieves a micro-leveling effect, thereby improving the processing quality of the sealing surface. Furthermore, the magnetic field strength can be adjusted using a magnetic field controller. When the magnetic field is too weak, the driving effect on the electrolyte and magnetic abrasive particles is not strong. The magnetic field strength can be dynamically adjusted according to actual processing needs to achieve efficient composite polishing. In other words, the embodiments of this invention can ensure the high processing accuracy and efficiency of electrochemical mechanical composite polishing while significantly improving the processing quality of the sealing surface.

[0047] More preferably, both the polishing pad 3 and the rotating platform 4 are provided with spiral grooves 18 extending outward from the center, and the spiral grooves 18 on the polishing pad 3 are connected to the spiral grooves 18 on the rotating platform 4. In this embodiment of the invention, due to the inclusion of a magnetic field generating component, the electrolyte flow direction is unidirectional and the renewal speed is limited under the influence of the magnetic field, leading to abrasive accumulation in the polishing zone and easily causing scratches and burns on the processed surface. By providing interconnected spiral grooves on the polishing pad and the rotating platform, when the workpiece sealing surface moves to the spiral groove, not only can the processing products in the composite polishing process be removed more quickly, but the abrasive particles accumulated in the polishing zone can also fall back into the electrolyte tank, thereby strengthening the electrolyte renewal in the polishing zone, effectively ensuring the consistency and repeatability of the processing state, reducing processing errors, and significantly improving the consistency of the composite polishing process. Simultaneously, a small amount of electrolyte in the spiral groove participates in the electrochemical reaction, which further smooths and polishes the processed surface, further reducing surface roughness. Therefore, this embodiment of the invention can both ensure the stability and controllability of the composite polishing process and shorten the processing steps, improving processing flexibility.

[0048] More preferably, multiple material carriers 2 are provided on the polishing pad 3, which can be used to process multiple workpieces of the same or different specifications at the same time, significantly improving processing efficiency. At the same time, for workpieces of different specifications and processing requirements of different workpiece sealing surfaces, the material carriers of different specifications of workpieces can be controlled separately and different polishing speeds can be selected, thereby meeting the finishing requirements of sealing surfaces of multiple types and specifications of workpieces, significantly improving processing capacity and processing flexibility. That is, the embodiment of the present invention can not only significantly improve the processing efficiency of workpiece sealing surfaces, but also improve processing capacity and processing flexibility by individually controlling the polishing speed of the material carriers.

[0049] The present invention also provides a method for composite polishing of sealing surfaces, comprising the following steps:

[0050] S1, the workpiece 1 is loaded into the material tray 2, and the groove of the material tray 2 and the cavity of the workpiece 1 are filled with paraffin wax and smoothed.

[0051] It should be noted that multiple workpieces 1 of the same or different specifications can be loaded in the same loading tray 2, but the workpieces 1 of the same or different specifications have the same sealing surface processing quality requirements; of course, multiple loading trays 2 can be set up, and workpieces 1 of different specifications can be loaded in different loading trays 2. Different sealing surface processing quality requirements can be achieved by controlling the polishing processing speed of each loading tray 2 individually.

[0052] S2, place the workpiece 1 with the sealing surface to be processed facing down above the polishing pad 3, and start the liquid pump 8 to ensure that the electrolyte 11 flows steadily into the electrolyte tank 6. At this time, when the electrolyte 11 in the electrolyte tank 6 reaches a certain liquid level, the material carrier 2 and the workpiece 1 on the material carrier 2 can be placed in the electrolyte 11, and the polishing pad 3 on the rotating platform 4 can also be placed in the electrolyte 11; at the same time, the electrolyte 11 has a certain flow rate and circulation frequency between the workpiece 1 and the polishing pad 3.

[0053] S3, connect the positive and negative terminals of the electrolytic machining power supply 7 to the material carrier 2 and the rotating platform 4, respectively. At this time, the workpiece 1 and the polishing pad 3 are connected to the positive and negative terminals of the electrolytic machining power supply 7, respectively.

[0054] S4, the magnetic field excitation source 5 is turned on to generate a magnetic field in the electrolyte 11, and the magnetic field direction is adjusted by the magnetic field controller 10 so that the magnetic field direction is perpendicular to the flow direction of the electrolyte 11. At this time, the electrolyte 11 is accelerated to the polishing processing area between the workpiece 1 and the polishing pad 3 under the Lorentz force, which can realize the circulation and renewal of the electrolyte 11. Moreover, the ions in the electrolyte 11 move more complexly under the action of the Lorentz force, which can effectively reduce the influence of concentration polarization, promote the electrochemical dissolution of materials in the polishing processing area, and improve the material removal rate.

[0055] S5, drive the material carrier 2 and the rotating platform 4 respectively to make the workpiece 1 and the polishing pad 3 rotate in opposite directions, and at the same time drive the material carrier 2 to move closer to the rotating platform 4 so that the workpiece 1 and the polishing pad 3 are in contact and do not separate.

[0056] It should be noted that the rotation of the loading tray 2 and the rotating platform 4 is controlled separately. That is, the rotation directions of the loading tray 2 and the rotating platform 4 can be opposite and their rotation speeds can be inconsistent. For example, the rotating platform 4 rotates counterclockwise at a second rotation speed, the first loading tray and its loaded workpiece rotate clockwise at a first rotation speed, and the second loading tray and its loaded workpiece rotate clockwise at a third rotation speed.

[0057] S6, the electrolytic machining power supply 7 is turned on to conduct the circuit, and the sealing surface of the workpiece 1 is polished through the combined action of the polishing pad 3, electrolyte 11, and magnetic field. At this time, the workpiece 1 rotates with the material carrier 2, causing the passivating electrolyte 11 to flow into the polishing area and form a closed loop. Under the action of electrolytic machining, a thin passivation film is formed on the surface of the workpiece 1. At the same time, under the action of the magnetic field, the magnetic abrasive particles 15 suspended in the electrolyte 11 are accelerated to the polishing area, so that more magnetic abrasive particles 15 participate in the polishing process at the same time. When the workpiece 1 is subjected to a certain pressure and pressed against the polishing pad 3, the free magnetic abrasive particles 15 will quickly scrape off the passivation film generated on the micro-protrusions of the processing surface, so that new metal atoms are constantly exposed on the processing surface for anodic dissolution. The passivation film in the depressions of the processing surface is not easily removed by the magnetic abrasive particles 15, and the electrochemical reaction is hindered. Thus, the effects of micro-leveling, high processing accuracy, high processing efficiency, and high processing quality can be achieved.

[0058] It should be noted that during polishing, the magnetic field size can be dynamically adjusted by the magnetic field controller 10 according to the actual processing needs to achieve efficient composite polishing.

[0059] S7. After polishing is completed, turn off the electrolytic processing power supply 7, magnetic field excitation source 5, liquid pump 8, and stop driving the material tray 2 and rotating platform 4. At the same time, reset the material tray 2 and remove the paraffin wax on the material tray 2 and workpiece 1 by low-temperature heating, so that the workpiece 1 can be removed and cleaned.

[0060] In this embodiment of the invention, the workpiece and polishing pad of the sealing surface to be processed are connected to the positive and negative terminals of the electrolytic machining power supply, respectively. The workpiece and polishing pad rotate in opposite directions, causing the passivating electrolyte to flow into the polishing zone, forming a closed loop and generating an electrochemical reaction. Under the action of electrolytic machining, a thin passivation film is formed on the surface of the workpiece. At the same time, by adjusting the direction of the magnetic field to be perpendicular to the direction of electrolyte flow, the electrolyte is accelerated to flow into the polishing zone under the action of Lorentz force, so that the electrolyte is circulated and renewed, further accelerating the anodic dissolution process. Meanwhile, the electrolyte contains suspended magnetic abrasive particles, which enter the polishing zone under the action of the magnetic field to scrape off the passivation film formed by electrolysis on the surface of the processed surface, so that new metal atoms are continuously exposed on the surface of the processed surface for continued electrolysis. This can improve the micro-leveling effect of the processed surface, and the polished sealing surface can maintain a smooth and sharp edge without burrs, significantly improving the processing quality of the sealing surface.

[0061] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A composite polishing device for sealing surfaces, characterized in that, include: An electrolyte tank (6) contains an electrolyte (11), and the electrolyte (11) contains magnetic abrasive particles. A polishing platform is movably disposed within the electrolyte tank (6); At least one material carrier (2) is movably disposed within the electrolyte tank (6), and the material carrier (2) is disposed opposite to the polishing platform; An electrolytic machining power supply (7) is provided, wherein the positive and negative terminals of the electrolytic machining power supply (7) are electrically connected to the material carrier (2) and the polishing platform, respectively. A magnetic field generating component, comprising an N-pole magnet, an S-pole magnet, a magnetic field regulator (10), and a magnetic field excitation source (5), wherein the N-pole magnet and the S-pole magnet are respectively disposed on opposite sides outside the electrolyte tank (6), and the positive and negative poles of the magnetic field excitation source (5) are electrically connected to the N-pole magnet and the S-pole magnet, respectively. During processing, the sealing surface of the workpiece (1) loaded on the material tray (2) is brought into contact with the polishing platform, and the material tray (2) and the polishing platform are driven to rotate the workpiece (1) and the polishing platform in opposite directions. At the same time, the magnetic field excitation source (5) is turned on to generate a magnetic field in the electrolyte tank (6) and the electrolytic processing power supply (7) is turned on to conduct the circuit and polish the sealing surface of the workpiece (1). The magnetic field controller (10) is used to adjust the direction and magnitude of the magnetic field.

2. The sealing surface composite polishing processing device according to claim 1, characterized in that, The loading tray (2) contains at least one of the workpieces (1).

3. The sealing surface composite polishing processing device according to claim 2, characterized in that, The material tray (2) is provided with a groove, and at least one of the workpieces (1) is provided in the groove. The workpiece (1) has a cavity, and the groove and the cavity are provided with paraffin wax.

4. The composite polishing apparatus for sealing surfaces according to claim 3, characterized in that, The polishing platform includes a rotating platform (4) and a polishing pad (3) fixed on the rotating platform (4). The polishing pad (3) and the rotating platform (4) are provided with a communicating spiral groove (18).

5. The sealing surface composite polishing apparatus according to any one of claims 1-4, characterized in that, It also includes an electrolyte circulation pipeline, one end of which is connected to the bottom of the electrolyte tank (6), and the other end of which is provided with a nozzle (13). The electrolyte circulation pipeline is provided with a pump (8), a flow meter (9) and a pressure gauge (12).

6. A processing method for a composite polishing apparatus for sealing surfaces as described in any one of claims 1-5, characterized in that, Includes the following steps: S1, load the workpiece (1) into the loading tray (2), and fill the groove of the loading tray (2) and the cavity of the workpiece (1) with paraffin wax and smooth it. S2, place the workpiece (1) with the sealing surface to be processed facing down above the polishing pad (3), and start the liquid pump (8) to make the electrolyte (11) flow steadily into the electrolyte tank (6); S3, connect the positive and negative terminals of the electrolytic processing power supply (7) to the material carrier (2) and the rotating platform (4) respectively; S4, turn on the magnetic field excitation source (5) to generate a magnetic field in the electrolyte (11), and adjust the direction of the magnetic field by the magnetic field controller (10) so that the direction of the magnetic field is perpendicular to the flow direction of the electrolyte (11); S5, drive the material carrier (2) and the rotating platform (4) respectively to make the workpiece (1) and the polishing pad (3) rotate in opposite directions, and at the same time drive the material carrier (2) to approach the rotating platform (4) so ​​that the workpiece (1) and the polishing pad (3) are in contact and do not separate; S6, turn on the electrolytic machining power supply (7) to conduct the circuit, and polish the sealing surface of the workpiece (1) through the combined action of the polishing pad (3), electrolyte (11) and magnetic field.

7. The processing method according to claim 6, characterized in that, In step S6, the magnetic field strength can be adjusted by the magnetic field regulator (10); after step S6, the following steps are also included: After polishing is completed, turn off the electrolytic processing power supply (7), magnetic field excitation source (5), liquid pump (8) and stop driving the material tray (2) and rotating platform (4). At the same time, reset the material tray (2) and heat it at low temperature to remove the paraffin on the material tray (2) and workpiece (1) so that the workpiece (1) can be removed and cleaned.

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