Non-destructive grinding method and grinding device for CCGA device welding column

Abstract

The invention discloses a CCGA device welding column nondestructive grinding method and device, and relates to the technical field of high-reliability electronic packaging material production, and the method comprises the following steps: S1, using a clamping assembly to fix a to-be-trimmed CCGA welding column, and enabling the assembly to ensure that the CCGA welding column is stable and immovable in the processing process; s2, a fixed-height backing ring is arranged on the clamping assembly so as to set the target height to which the CCGA welding column needs to be ground to be flat; s3, abrasive paper is used for polishing the part, exceeding the height of the fixed-height backing ring, of the CCGA welding column, and it is guaranteed that the surface of the top of the CCGA welding column is flat and consistent; s4, the clamping assembly with the fixed-height backing ring is installed on a grinding tool, one end, which is ground to be flat, of the CCGA welding column is accurately positioned through the tool, and grinding continues till the preset length is reached; s5, after the grinding process is completed, the CCGA welding column is taken down, and quality inspection and screening are carried out; according to the grinding device, it is guaranteed that the CCGA welding column is firmly and accurately fixed during grinding, the CCGA welding column is prevented from moving or rotating in the treatment process, and therefore the grinding quality is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of high-reliability electronic packaging material production, and in particular to a non-destructive grinding method and a grinding device for a CCGA device solder column. Background Art

[0002] Coplanarity has always been a hot topic of great concern in CCGA device packaging, and the height consistency of CCGA solder columns is one of the most direct reasons affecting the coplanarity of CCGA device solder columns. The industry requires the coplanarity of CCGA solder columns to be no more than 100μm after CCGA column planting, but it will still cause defects such as cold soldering and cracking, affecting the reliability of CCGA solder column connection and even causing CCGA device function failure. Therefore, the height consistency of CCGA solder columns has become a major issue facing CCGA solder column manufacturers. Currently, the existing CCGA solder column flattening process solutions mostly use a fixture to hard clamp the CCGA solder column in a rigid hole that is about 0.2mm larger than its diameter, and use manual sandpaper grinding or planetary mechanical grinding to achieve CCGA solder column flattening. Because the diameter of the limiting hole is too large (a small hole diameter will cause assembly difficulties), the verticality of the CCGA solder column deteriorates, affecting the quality of the CCGA solder column; the above defects are problems that need to be urgently solved by technical personnel in this field. Summary of the invention

[0003] In order to overcome the deficiencies in the background technology, the present invention discloses a non-destructive grinding method and a grinding device for CCGA device solder pillars, aiming to solve the problem in the prior art that CCGA solder pillars are difficult to grind and are easily damaged during grinding.

[0004] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0005] A non-destructive grinding method and grinding device for a CCGA device solder column comprises the following steps:

[0006] S1. Fix the CCGA welding column to be trimmed using a clamping assembly;

[0007] S2. Place a height setting ring on the top of the clamping assembly to set the target height to which the CCGA solder column needs to be ground;

[0008] S3. Use sandpaper to grind the part of CCGA welding column that exceeds the height of the fixed height pad ring to ensure that the top surface of CCGA welding column is flat and uniform;

[0009] S4, installing the clamping assembly on the grinding tool, accurately positioning one end of the ground CCGA welding column by the grinding tool, and grinding the other end of the CCGA welding column to reach a predetermined length;

[0010] S5. After the grinding process is completed, the CCGA welding column is removed and quality inspection and screening are carried out.

[0011] Preferably, the clamping assembly includes a plurality of clamping bars arranged in parallel, wherein a plurality of arc grooves are provided on opposite sides of two adjacent clamping bars at intervals, and the two corresponding arc grooves together realize a firm clamping of the CCGA welding column; two locking shafts are respectively passed through the two ends of the clamping bars, and are used to enable the clamping bars to clamp the CCGA welding column; among the clamping bars located on both sides, one of the clamping bars is provided with a countersunk hole at a position corresponding to the locking shaft, and the other clamping bar is provided with a threaded hole at a position corresponding to the locking shaft, and one end of the locking shaft is threadedly connected to the threaded hole; the remaining clamping bars are provided with through holes at positions corresponding to the locking shafts.

[0012] Preferably, a spring is sleeved between the locking shaft body corresponding to two adjacent clamping strips, and a recess is provided at the position of the clamping strip corresponding to the spring.

[0013] Preferably, a groove is provided on the side of the clamping strip corresponding to the arc-shaped groove, and a tightening belt which can be adapted to the arc-shaped groove is provided in the groove.

[0014] Preferably, the grinding tool comprises a fixed frame, and the clamping assembly is fixed to the bottom of the fixed frame; a cover plate with threaded holes is connected to the top of the fixed frame; the cover plate is threadedly connected to an adjusting stud, and the bottom end of the adjusting stud is rotatably connected to a positioning plate.

[0015] Preferably, a self-adhesive sticker is provided on one end of the positioning plate away from the adjusting stud.

[0016] Preferably, the clamping assembly is connected to the fixing frame by countersunk screws or by magnetic attraction of permanent magnets.

[0017] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects:

[0018] 1. The present invention discloses a non-destructive grinding method and grinding device for a CCGA device solder column, which has a simple structure and operation method; the clamping assembly is composed of a plurality of parallel clamping bars, and a plurality of arc grooves are provided on the side of the clamping bar, and the corresponding arc grooves on two adjacent clamping bars are used in conjunction. This design ensures that the CCGA solder column is firmly and accurately fixed during grinding, preventing the CCGA solder column from displacement or rotation during the processing process, thereby ensuring the quality of grinding, and effectively protecting the CCGA solder column from external force damage during the entire grinding process, reducing the possibility of product damage due to improper operation, thereby achieving the purpose of non-destructive grinding of the CCGA solder column.

[0019] 2. Precise height control, with a height setting ring placed on the top of the clamping assembly. This sets the target height to which the CCGA solder column needs to be ground, ensuring that all CCGA solder columns can reach a consistent height standard after grinding.

[0020] 3. The grinding tool consists of a fixed frame with a mounting slot, a cover plate connected by threads on the top, and an adjustment stud that is rotatably connected to the positioning plate at the bottom. A self-adhesive layer is provided on the side of the positioning plate away from the adjustment stud. This design allows the user to fine-tune the position of the positioning plate by rotating the adjustment stud, achieving fine adjustment of the final length of the CCGA weld column, and improving flexibility and adaptability during the grinding process.

[0021] 4. One side of the positioning plate is equipped with a self-adhesive layer. This self-adhesive layer can provide additional stability during the grinding operation, preventing the CCGA welding column from sliding or shifting, further enhancing the safety and reliability of the entire process.

[0022] 5. A groove is provided on the side of the clamping bar corresponding to the arc groove, and a tightening belt that can adapt to the corresponding arc groove is provided in the groove. When two adjacent clamping bars approach each other, the two tightening belts adaptively hug the CCGA welding column under the pushing action of the arc groove, which ensures the reliability of clamping the CCGA welding column on the one hand and prevents hard extrusion from damaging the CCGA welding column on the other hand. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the structure of the clamping assembly;

[0024] Figure 2 It is a schematic diagram of the structure of the grinding tool;

[0025] Figure 3 It is a schematic diagram of the three-dimensional structure of the grinding tool;

[0026] Figure 4 is a schematic diagram of the structure of the clamping strip;

[0027] Figure 5 It is a schematic diagram of the connection structure between the locking shaft and the clamping strip.

[0028] In the figure: 1. Clamping assembly; 1-1. Clamping strip; 1-2. Arc groove; 1-3. Locking shaft; 1-4. Spring; 1-5. Tightening belt; 2. Height-fixing ring; 3. Grinding tool; 3-1. Fixed frame; 3-2. Cover plate; 3-3. Adjusting stud; 3-4. Positioning plate. DETAILED DESCRIPTION

[0029] The present invention can be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", etc. indicating directions or positional relationships, they only correspond to the drawings of the present application for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction.

[0030] Embodiment 1:

[0031] Combined with Figures 1 to 5 A non-destructive grinding method and a grinding device for a CCGA device solder column include the following steps:

[0032] Step S1: fixing the clamping assembly 1;

[0033] The clamping assembly 1 is the basis of the entire grinding process, and includes a plurality of clamping bars 1-1 arranged in parallel, wherein a plurality of arc grooves 1-2 are arranged on opposite sides of two adjacent clamping bars 1-1, and the two corresponding arc grooves 1-2 together realize the stable clamping of the CCGA welding column. Such a design not only improves the firmness of the CCGA welding column fixation, but also ensures the position accuracy of the CCGA welding column during the grinding process.

[0034] Specifically, both ends of the clamping strip 1-1 are penetrated by a locking shaft 1-2 for clamping the CCGA welding column; one of the clamping strips 1-1 located on both sides is provided with a countersunk hole at a position corresponding to the locking shaft 1-2, and the other is provided with a threaded hole at a position corresponding to the locking shaft 1-2, one end of the locking shaft 1-2 is threadedly connected to the threaded hole, and the remaining clamping strips 1-1 are provided with through holes at positions corresponding to the locking shafts 1-2.

[0035] When in use, first loosen the two locking shafts 1-2, then place the CCGA welding column in the arc groove 1-2 between two adjacent clamping strips 1-1, and then tighten the locking shaft 1-2, the locking shaft 1-2 squeezes the clamping strip 1-1, so that the clamping strip 1-1 clamps the CCGA welding column.

[0036] It should be noted that the locking shaft 1-2 needs to be stably matched with the through hole of the corresponding clamping strip 1-1. The locking shaft 1-2 needs to ensure the alignment of the clamping strip 1-1 while locking the clamping strip 1-1, thereby ensuring the flatness of the entire clamping assembly 1 and avoiding interference with subsequent grinding operations.

[0037] Step S2: Setting of the height-fixing ring 2;

[0038] A height setting ring 2 is placed on the top of the clamping assembly 1 to set the target height to which the CCGA solder column needs to be ground.

[0039] Step S3: sanding;

[0040] Use sandpaper to finely grind the CCGA solder column portion that is higher than the height setting ring 2 until the top surface of all CCGA solder columns becomes flat and uniform. This step is critical to ensure the quality of subsequent processes.

[0041] Step S4: application of grinding tool 3;

[0042] The clamping assembly 1 is mounted on the grinding fixture 3, and one end of the ground CCGA welding column is accurately positioned by the grinding fixture 3, and the other end of the CCGA welding column is ground to reach a predetermined length.

[0043] Specifically, the grinding tool 3 includes a fixed frame 3-1, and the clamping assembly 1 is fixed to the bottom of the fixed frame 3-1; the top of the fixed frame 3-1 is connected to a cover plate 3-2 with threaded holes; the cover plate 3-2 is threadedly connected to an adjusting stud 3-3, and the bottom end of the adjusting stud 3-3 is rotatably connected to a positioning plate 3-4. By adjusting the stud 3-3, the position of the positioning plate 3-4 can be fine-tuned, thereby accurately controlling the final length of the CCGA welding column.

[0044] That is, when grinding the other end of the CCGA welding column, first use the positioning plate 3-4 to locate the movement of the CCGA welding column that has been smoothed by sandpaper to prevent accidental axial movement of the CCGA welding column during the grinding process; thereby effectively ensuring the grinding accuracy of the CCGA welding column.

[0045] Furthermore, a self-adhesive layer is provided on a side of the positioning plate 3 - 4 away from the adjusting stud 3 - 3 , which is used to temporarily fix the CCGA welding column during the flattening period.

[0046] Step S5: inspection and selection;

[0047] The final step is to inspect and sort the ground CCGA solder columns to ensure that each product meets the established standards.

[0048] Embodiment 2:

[0049] Combined with Figures 4-5 A non-destructive grinding method and grinding device for a CCGA device solder column, based on Example 1, a spring 1-4 is sleeved between the locking shaft 1-3 corresponding to two adjacent clamping strips 1-1, and a recessed groove is provided at the position of the clamping strip 1-1 corresponding to the spring 1-4.

[0050] After the CCGA welding column is ground, the locking shaft 1-3 can be loosened. At this time, the two adjacent clamping strips 1-1 can automatically move away from each other under the action of the spring 1-4, thereby loosening the CCGA welding column to facilitate the assembly of the next batch of CCGA welding columns.

[0051] It is worth noting that since springs 1 - 4 are provided between two adjacent clamping strips 1 - 1 , the overall clamping force can be made uniform, thereby preventing some CCGA welding columns from being over-clamped while other CCGA welding columns are still not clamped.

[0052] Furthermore, a groove is provided on the side of the clamping strip 1-1 corresponding to the arc groove 1-2, and a tightening belt 1-5 which can be adapted to the arc groove 1-2 is provided in the groove, and the tightening belt 1-5 can be a copper belt.

[0053] The tightening band 1-5 is located in the arc groove 1-2 and its length is less than the arc length of the arc groove 1-2. In the process of two adjacent clamping strips 1-1 approaching each other, the two tightening bands 1-5 adaptively clamp the CCGA welding column under the push of the arc groove 1-2, which on the one hand ensures the reliability of the CCGA welding column clamping, and on the other hand prevents hard extrusion from damaging the CCGA welding column.

[0054] It should be noted that the tightening band 1 - 5 is located in the groove of the clamping strip 1 - 1 , so two adjacent clamping strips 1 - 1 will not directly conflict with each other, thereby enabling all CCGA welding columns on the clamping strip 1 - 1 to be adaptively clamped.

[0055] It is also worth noting that since the two tightening belts 1-5 can adaptively clamp the CCGA welding column, the problem of the CCGA welding column being unable to be firmly fixed due to the different locking forces of the two locking shafts 1-3 can be effectively avoided. At the same time, the problem of excessive clamping of the CCGA welding column causing damage to the CCGA welding column is avoided, which greatly reduces the operating difficulty of the operator.

[0056] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and it is intended that all changes that fall within the meaning and scope of equivalent elements are included in the present invention.

Claims

1. A non-destructive grinding method for a CCGA device solder column, characterized in that: Follow these steps: S1. Fix the CCGA welding column to be trimmed using the clamping assembly (1); S2, placing a height setting ring (2) on the top of the clamping assembly (1) to set the target height to which the CCGA welding column needs to be ground; S3. Use sandpaper to grind the part of the CCGA welding column that exceeds the height of the height setting ring (2) to ensure that the top surface of the CCGA welding column is flat and uniform; S4, installing the clamping assembly (1) on the grinding tool (3), accurately positioning one end of the ground CCGA welding column by the grinding tool (3), and grinding the other end of the CCGA welding column to reach a predetermined length; S5. After the grinding process is completed, the CCGA welding column is removed and quality inspection and screening are carried out.

2. The grinding device used in the non-destructive grinding method for solder posts of CCGA devices as claimed in claim 1 is characterized in that: The clamping assembly (1) comprises: A plurality of clamping bars (1-1) arranged in parallel, wherein a plurality of arc grooves (1-2) are provided at intervals on opposite sides of two adjacent clamping bars (1-1), and the two corresponding arc grooves (1-2) together realize stable clamping of the CCGA welding column; Two locking shafts (1-3) are respectively passed through two ends of the clamping bar (1-1) and are used to enable the clamping bar (1-1) to clamp the CCGA welding column; Among the clamping strips (1-1) located on both sides, one of the clamping strips (1-1) is provided with a countersunk hole at a position corresponding to the locking shaft (1-3), and the other clamping strip (1-1) is provided with a threaded hole at a position corresponding to the locking shaft (1-3), and one end of the locking shaft (1-3) is threadedly connected to the threaded hole; The remaining clamping strips (1-1) are provided with through holes at positions corresponding to the locking shafts (1-3).

3. The grinding device used in the non-destructive grinding method for solder posts of CCGA devices as claimed in claim 2 is characterized by: A spring (1-4) is sleeved between the shaft body of the locking shaft (1-3) and corresponds to two adjacent clamping strips (1-1), and a recess is provided on the clamping strip (1-1) at a position corresponding to the spring (1-4).

4. The grinding device used in the non-destructive grinding method for CCGA device solder column according to claim 2 or 3, characterized in that: The side of the clamping strip (1-1) corresponding to the arc-shaped groove (1-2) is provided with a groove, and the groove is provided with a tightening belt (1-5) that can be adapted to the arc-shaped groove (1-2) corresponding to the arc-shaped groove (1-2).

5. The grinding device used in the non-destructive grinding method for solder posts of CCGA devices according to claim 1 is characterized in that: The grinding tool (3) comprises a fixed frame (3-1), and the clamping assembly (1) is fixed to the bottom of the fixed frame (3-1); a cover plate (3-2) with threaded holes is connected to the top of the fixed frame (3-1); the cover plate (3-2) is threadedly connected to an adjusting stud (3-3), and the bottom end of the adjusting stud (3-3) is rotatably connected to a positioning plate (3-4).

6. The grinding device used in the non-destructive grinding method for solder posts of CCGA devices as claimed in claim 5, characterized in that: An end of the positioning plate (3-4) facing away from the adjusting stud (3-3) is provided with a self-adhesive sticker.

7. The grinding device used in the non-destructive grinding method for solder posts of CCGA devices as claimed in claim 5, characterized in that: The clamping assembly (1) and the fixing frame (3-1) are connected via countersunk screws or via magnetic attraction of permanent magnets.

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