Multifunctional wafer arm

Abstract

The invention discloses a multifunctional wafer arm, and relates to the technical field of material taking arms, the multifunctional wafer arm comprises a linear gear motor module, one side of the linear gear motor module is in sliding connection with a sliding seat, and a servo motor II can drive a material taking arm with a groove to perform telescopic motion towards one side far away from a moving frame after working; the movable frame can stretch out and draw back away from one side of the material taking arm with the groove after the telescopic air cylinder works, and the movable frame can be matched with the lifting of the linear gear motor module to complete the work of sheet sweeping; when the wafer taking edge of the material taking arm containing the groove is retracted to the end part of the telescopic main plate, the wafer body can be in contact with the two close ends of the two wafer calibration blocks, so that a centering slight clamping effect is completed; and the first optical fiber sensor arranged between the two wafer calibration blocks can detect whether the wafer taking work is completed or not after the material taking arm containing the groove telescopically takes the wafer, so that the situation of missing taking is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of material fetching arms, in particular to a multifunctional wafer arm. Background Art

[0002] In the existing technical solutions, the wafer arm usually plays the role of grabbing and placing the wafer. For the centering of the wafer, one is to set an additional mechanism on the wafer box to pre-position and center all the wafers in the wafer box, or use the wafer arm to transfer the wafer to a special alignment device for centering. After the alignment is completed, the wafer is taken away by the wafer arm.

[0003] At the same time, in the existing technical solutions, since the wafers may be tilted, missed or even offset when placed in the wafer box, if the wafer is taken out at this time, the arm will not be able to take the wafer, and it will be necessary to take the wafer out again after returning to the work station, wasting time. If the wafer is skewed, it will cause the wafer to break, increasing costs and even causing equipment shutdown.

[0004] For wafer scanning, the existing solution is to set up an additional scanning mechanism at the location of the wafer placement box on the equipment, which requires additional space and an additional lifting system.

[0005] For this purpose, a multifunctional wafer arm is proposed. Summary of the invention

[0006] 1. Technical issues to be solved

[0007] In view of the deficiencies in the prior art, the present invention provides a multifunctional wafer arm to solve the problems raised in the above-mentioned background technology.

[0008] (II) Technical solution

[0009] To achieve the above object, the present invention provides the following technical solution: a multifunctional wafer arm, comprising a linear reduction motor module, a slide seat is slidably connected to one side of the linear reduction motor module, a rotating mechanism is arranged on the side of the slide seat away from the linear reduction motor module, a transmission mechanism is connected to the top of the rotating mechanism, and a material picking detection mechanism is arranged on the top of the transmission mechanism;

[0010] The rotating mechanism comprises a fixed frame, one side of the fixed frame is fixedly connected to the slide seat, a servo motor 1 is installed on the internal top of the fixed frame, the transmission mechanism comprises a transmission column, a rotating platform is fixed on the top of the transmission column, the output end of the servo motor 1 is fixedly connected to the rotating platform through a coupling, a start-stop sensor and an anti-collision block are respectively fixed on one side of the top of the fixed frame, and an induction sheet is fixed on one end of the side wall of the rotating platform;

[0011] The material picking detection mechanism includes a telescopic mainboard, a material picking arm containing a groove is slidably connected to one side of the top of the telescopic mainboard, a wafer body is embedded in the interior of the material picking arm containing the groove, a moving frame is slidably connected to the other side of the top of the telescopic mainboard, and a second optical fiber sensor is installed on the moving frame. Wafer calibration blocks are arranged at both ends of the top of the telescopic mainboard close to the wafer body, and a first optical fiber sensor is arranged between the wafer calibration blocks. A second servo motor is arranged at the bottom of the telescopic mainboard located at the position of the material picking arm containing the groove, the material picking arm containing the groove is fixedly connected to the driving block on the material picking arm containing the groove, and a telescopic cylinder is fixed to the side wall of the bottom of the telescopic mainboard close to the moving frame.

[0012] Preferably, the level of the top of the sensor sheet is below the top horizontal line in the anti-collision block, and the horizontal line of the sensor sheet is parallel to the horizontal line of the start-stop sensor.

[0013] Preferably, the horizontal line of the top of the wafer body is below the horizontal line of the bottom of the optical fiber sensor.

[0014] Preferably, the top of the transmission column is fixedly connected to the bottom of the telescopic main board, and the telescopic end of the telescopic cylinder is fixedly connected to an end close to the moving frame.

[0015] Preferably, a fan is installed at the inner bottom end of the fixed frame located below the servo motor.

[0016] Preferably, a mounting back plate is fixed to a side of the linear reduction motor module away from the slide seat.

[0017] (III) Beneficial effects

[0018] Compared with the prior art, the present invention provides a multifunctional wafer arm, which has the following beneficial effects:

[0019] After the linear reduction motor module works, it drives the slide to move up and down. The slide can drive the material picking and detection mechanism to move up and down through the rotating mechanism and the transmission mechanism, so that the grooved material picking arm and the mobile frame can make the driving action required for lifting and lowering during the film picking and detection.

[0020] After the servo motor is working, it drives the rotating platform to rotate, and the rotating platform drives the telescopic main board to rotate through the transmission column, so that the grooved material picking arm and the mobile frame switch directions in the sheet picking and detection working modes;

[0021] After the servo motor 2 is working, it can drive the grooved material picking arm to telescopically move to the side away from the mobile frame, and cooperate with the lifting of the linear reduction motor module to complete the film picking work. After the telescopic cylinder works, the mobile frame can telescopically move away from the side of the grooved material picking arm, and cooperate with the lifting of the linear reduction motor module to complete the film sweeping work;

[0022] When the grooved material picking arm retracts to the end of the telescopic main board while picking up the wafer, the wafer body and the two wafer calibration blocks can touch each other at both ends to complete a slight clamping effect for centering, and an optical fiber sensor is arranged between the two wafer calibration blocks to detect whether the grooved material picking arm has completed the wafer picking work after telescopic picking, to avoid missing wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the linear reduction motor module and the slide structure of the present invention;

[0025] Figure 3 It is a schematic diagram of the connection structure between the rotating mechanism, the transmission mechanism and the slide seat of the present invention;

[0026] Figure 4 It is a schematic diagram of the top view of the structure between the waferless transmission mechanism and the material taking and detecting mechanism of the present invention;

[0027] Figure 5 It is a bottom view structural diagram of the transmission mechanism and the material taking detection mechanism of the present invention;

[0028] Figure 6 It is a schematic diagram of the top view of the structure between the wafer transmission mechanism and the material taking and detecting mechanism of the present invention;

[0029] Figure 7 It is a schematic diagram of the enlarged structure of point A of the present invention;

[0030] Figure 8 It is a schematic diagram of the enlarged structure of point B of the present invention.

[0031] In the figure: 1. Linear reduction motor module; 2. Rotating mechanism; 21. Fixed frame; 22. Servo motor 1; 23. Anti-collision block; 24. Start-stop sensor; 25. Fan; 3. Transmission mechanism; 31. Transmission column; 32. Rotating platform; 33. Induction sheet; 4. Material picking detection mechanism; 41. Telescopic main board; 42. Servo motor 2; 43. Material picking arm with groove; 44. Wafer calibration block; 45. Optical fiber sensor 1; 46. Telescopic cylinder; 47. Moving frame; 48. Optical fiber sensor 2; 5. Wafer body; 6. Mounting back plate; 7. Slide seat. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] The present invention provides a technical solution, such as Figure 1-8 As shown, a multifunctional wafer arm comprises a linear reduction motor module 1, a slide seat 7 is slidably connected to one side of the linear reduction motor module 1, a rotating mechanism 2 is arranged on the side of the slide seat 7 away from the linear reduction motor module 1, a transmission mechanism 3 is connected to the top of the rotating mechanism 2, and a material taking detection mechanism 4 is arranged on the top of the transmission mechanism 3;

[0034] The rotating mechanism 2 includes a fixed frame 21, one side of the fixed frame 21 is fixedly connected to the slide 7, a servo motor 22 is installed at the top of the fixed frame 21, the transmission mechanism 3 includes a transmission column 31, a rotating platform 32 is fixed on the top of the transmission column 31, the output end of the servo motor 22 is fixedly connected to the rotating platform 32 through a coupling, a start-stop sensor 24 and an anti-collision block 23 are respectively fixed on one side of the top of the fixed frame 21, and a sensor sheet 33 is fixed on one end of the side wall of the rotating platform 32;

[0035] The material picking detection mechanism 4 includes a telescopic main board 41, and a grooved material picking arm 43 is slidably connected to one side of the top of the telescopic main board 41, and a wafer body 5 is embedded inside the grooved material picking arm 43. A moving frame 47 is slidably connected to the other side of the top of the telescopic main board 41, and an optical fiber sensor 48 is installed on the moving frame 47. Wafer calibration blocks 44 are arranged at both ends of the top of the telescopic main board 41 close to the wafer body 5, and an optical fiber sensor 45 is arranged between the wafer calibration blocks 44. A servo motor 42 is arranged at the bottom of the telescopic main board 41 where the grooved material picking arm 43 is located. The grooved material picking arm 43 is fixedly connected to the driving block on the grooved material picking arm 43, and a telescopic cylinder 46 is fixed to the side wall of the moving frame 47 at the bottom of the telescopic main board 41 close to the moving frame 47.

[0036] Specifically, the level of the top of the induction sheet 33 is located below the top horizontal line of the anti-collision block 23 , and the horizontal line of the induction sheet 33 is parallel to the horizontal line of the start-stop sensor 24 .

[0037] Specifically, the horizontal line of the top of the wafer body 5 is located below the horizontal line of the bottom of the optical fiber sensor 45, so that it is convenient to pass through the bottom thereof when rotating to avoid being blocked.

[0038] Specifically, the top of the transmission column 31 is fixedly connected to the bottom of the telescopic main board 41 , and the telescopic end of the telescopic cylinder 46 is fixedly connected to an end close to the moving frame 47 .

[0039] Specifically, a fan 25 is installed at the inner bottom of the fixed frame 21 below the servo motor 22 for dissipating the heat of the servo motor 22 .

[0040] Specifically, a mounting back plate 6 is fixed to a side of the linear reduction motor module 1 away from the slide 7 .

[0041] Working principle of this device:

[0042] Scanning detection:

[0043] After the servo motor 1 22 works, it drives the moving frame 47 to move to one side of the wafer box through the transmission mechanism 3. The rotation of the transmission column 31 and the rotating platform 32 drives the induction plate 33 to rotate. The induction plate 33 moves to the position of the start-stop sensor 24. After the start-stop sensor 24 detects, it sends a stop signal to the servo motor 1 22. After the telescopic cylinder 46 works, it drives the moving frame 47 to approach the optical fiber sensor 2 48 and insert it into the gap of the wafer box. The optical fiber sensor 2 48 detects whether there is a wafer body 5 above. If not, after the telescopic cylinder 46 retracts, the linear reduction motor module 1 works and drives the optical fiber sensor 2 48 to descend to the position of the next layer of the wafer box. The telescopic cylinder 46 drives the optical fiber sensor 2 48 to insert it below the layer where the wafer body 5 is placed to detect whether there is a wafer body 5. And so on, until the optical fiber sensor 2 48 detects that there is a wafer body 5 above, the optical fiber sensor 2 48 retracts, the material picking detection mechanism 4 turns, and the grooved material picking arm 43 faces the height.

[0044] Take the film:

[0045] After the servo motor 2 42 works, it drives the grooved material picking arm 43 to slide out on the telescopic main board 41 and insert it into the wafer box. After the linear reduction motor module 1 works, it rises and drives the grooved material picking arm 43 to rise, so that the grooved material picking arm 43 can lift the wafer body 5, and move the servo motor 2 42 after reversing and retracting to take the wafer body 5 out of the wafer box. When the grooved material picking arm 43 retracts to the end of the telescopic main board 41 while taking the wafer, the two ends of the wafer body 5 and the two wafer calibration blocks 44 are able to touch each other to complete the slight clamping effect of centering, and the optical fiber sensor 1 45 arranged between the two wafer calibration blocks 44 can detect whether the grooved material picking arm 43 has completed the wafer taking work after telescopic wafer taking, so as to avoid missing wafers.

[0046] The linear reduction motor module 1 and the servo motor 2 42 are both standard parts disclosed in the prior art and can be easily purchased on the market. Their working principles and detailed composition structures will not be described in detail in this application.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multifunctional wafer arm, characterized in that: The invention comprises a linear reduction motor module (1), one side of the linear reduction motor module (1) is slidably connected to a slide seat (7), a side of the slide seat (7) away from the linear reduction motor module (1) is provided with a rotating mechanism (2), the top of the rotating mechanism (2) is connected to a transmission mechanism (3), and the top of the transmission mechanism (3) is provided with a material taking detection mechanism (4); The rotating mechanism (2) comprises a fixed frame (21), one side of the fixed frame (21) is fixedly connected to the slide seat (7), a servo motor (22) is installed at the top of the fixed frame (21), the transmission mechanism (3) comprises a transmission column (31), a rotating platform (32) is fixed at the top of the transmission column (31), the output end of the servo motor (22) is fixedly connected to the rotating platform (32) through a coupling, a start-stop sensor (24) and an anti-collision block (23) are respectively fixed at one side of the top of the fixed frame (21), and a sensing sheet (33) is fixed at one end of the side wall of the rotating platform (32); The material picking detection mechanism (4) comprises a telescopic main board (41), a material picking arm (43) containing a groove is slidably connected to one side of the top of the telescopic main board (41), a wafer body (5) is embedded inside the material picking arm (43) containing a groove, a moving frame (47) is slidably connected to the other side of the top of the telescopic main board (41), a second optical fiber sensor (48) is installed on the moving frame (47), wafer calibration blocks (44) are arranged at both ends of the top of the telescopic main board (41) close to the wafer body (5), an optical fiber sensor (45) is arranged between the wafer calibration blocks (44), a servo motor (42) is arranged at the bottom of the telescopic main board (41) at the position of the material picking arm (43) containing a groove, the material picking arm (43) containing a groove is fixedly connected to a driving block on the material picking arm (43) containing a groove, and a telescopic cylinder (46) is fixed to the side wall of the bottom of the telescopic main board (41) close to the moving frame (47).

2. A multifunctional wafer arm according to claim 1, characterized in that: The level of the top of the sensing sheet (33) is below the top horizontal line of the anti-collision block (23), and the horizontal line of the sensing sheet (33) is parallel to the horizontal line of the start-stop sensor (24).

3. The multifunctional wafer arm according to claim 1, characterized in that: The horizontal line of the top of the wafer body (5) is located below the horizontal line of the bottom of the optical fiber sensor 1 (45).

4. The multifunctional wafer arm according to claim 1, characterized in that: The top of the transmission column (31) is fixedly connected to the bottom of the telescopic main board (41), and the telescopic end of the telescopic cylinder (46) is fixedly connected to an end close to the moving frame (47).

5. The multifunctional wafer arm according to claim 1, characterized in that: A fan (25) is installed at the inner bottom end of the fixed frame (21) located below the servo motor 1 (22).

6. The multifunctional wafer arm according to claim 1, characterized in that: A mounting back plate (6) is fixed to a side of the linear reduction motor module (1) away from the slide seat (7).

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