Electroplating jig for single IC (integrated circuit) packaging chip

Abstract

The invention discloses an electroplating jig for a single IC (integrated circuit) packaging chip, which solves the electroplating problem of a cut single chip, ensures the plating quality of the single chip after being electroplated again, and improves the product yield. The jig comprises a jig plate; each set of jig positioning mechanism comprises four sets of telescopic ejector block structures, each set of telescopic ejector block structures comprises ejector blocks, at least one set of linear springs and a fixing block, the four sets of ejector blocks are arranged in a pairwise opposite side mode to form discontinuous four edges of a quadrangle, and a product containing cavity is formed in the center area of the four sets of ejector blocks. The product placing cavity is used for placing a single IC chip; the multiple sets of jig positioning mechanisms are arranged on one surface of the jig plate in an array mode.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing jigs, and in particular to a single IC package chip electroplating jig. Background Art

[0002] With the rapid development of semiconductors, electronic products are becoming more and more popular, and at the same time, competition is becoming increasingly fierce. Only good quality and yield can ensure development and growth. After QFN products are cut into single pieces, there are abnormalities in the chip coating. The existing technology cannot be used for rework and tin electroplating, which seriously affects the product yield. Summary of the invention

[0003] In view of the above problems, the present invention provides a single IC package chip electroplating jig, which solves the electroplating problem of a cut single chip, ensures the coating quality of the single chip after re-electroplating, and improves the product yield.

[0004] A single IC package chip electroplating fixture, characterized in that it comprises:

[0005] jig board;

[0006] and a plurality of sets of fixture positioning mechanisms, each set of fixture positioning mechanisms includes four sets of telescopic top block structures, each set of telescopic top block structures includes a top block, at least one set of linear springs, and a fixed block, the four sets of top blocks are arranged in pairs to form four discontinuous sides of a quadrilateral, the central area of ​​the four sets of top blocks is a product placement cavity, and the product placement cavity is used to place a single IC chip;

[0007] A plurality of fixture positioning mechanism arrays are arranged on one surface of the fixture plate.

[0008] It is further characterized by:

[0009] Each of the top blocks comprises an inner pressing surface and an outer driving surface, wherein the inner pressing surface is used to press the corresponding side pins of a single chip;

[0010] A guide slope inclined from the outside to the inside is provided on the surface of each top block away from the fixture plate, and the inner pressing surface is located in the relatively outer area of ​​the inner end of the pin slope, which allows a single chip to be easily placed along the guide slope in the product placement cavity formed by the inner pressing surfaces of the four groups of top blocks;

[0011] The inner pressing surface of each top block is provided with a top pin corresponding to the side pin position of a single IC chip, and the top pin is installed on the side pin to ensure stable and reliable pressing;

[0012] The four fixed blocks of each set of fixture positioning mechanism are respectively fixed to the surface of the fixture plate by fasteners and arranged in the outer area of ​​the corresponding top block. At least one set of linear springs is arranged between the fixed blocks and the top blocks, and the linear springs drive the top blocks to press inwards for operation;

[0013] A clamping space is reserved in the upper area of ​​the jig plate, so that the jig plate can be reliably connected to the cathode steel strip.

[0014] Preferably, each group of top blocks corresponds to at least two linear springs, which ensures uniform elastic force.

[0015] After adopting the above technical scheme, several groups of jig positioning mechanism arrays are arranged on one surface of the jig plate, and after a sufficient number of single IC chips with unqualified plating are gathered, they are filled into the product placement cavity of the corresponding jig positioning mechanism respectively. Since each jig positioning mechanism is formed by four top blocks and their corresponding linear springs and fixed blocks, the four top blocks can adjust the expansion and contraction amount according to the size of the product. Each top block is tightly connected to the side pins on the four sides of the chip through a linear spring to achieve the conductive effect of fixing the product. At the same time, one side of the entire jig plate is clamped on the cathode steel belt, and the chip's colloid side faces inward and the pins face inward. Under the transmission of the cathode steel belt, the entire jig plate and the corresponding several IC chips are driven to perform subsequent electroplating operations, which solves the electroplating problem of the cut single chip, ensures the plating quality of the single chip after re-electroplating, and improves the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the main view structure of the present invention;

[0017] Figure 2 is a side view of a single top block of the present invention;

[0018] Figure 3 It is a front view schematic diagram of a single set of fixture positioning mechanism clamping an IC chip of the present invention;

[0019] Figure 4 It is a partial schematic diagram of positioning an IC chip with a single top block of the present invention;

[0020] Figure 5 The schematic diagram of the main view of the cathode steel strip clamping the entire jig plate;

[0021] The names corresponding to the serial numbers in the figure are as follows:

[0022] Ejector block 1, inner pressing surface 101, outer driving surface 102, guiding inclined surface 103, linear spring 2, fixing block 3, ejector pin 4, product placement cavity 5;

[0023] The fixture plate 10 , the clamping space 11 , the fixture positioning mechanism 20 , the telescopic top block structure 30 , the IC chip 40 , the side pins 41 , and the cathode steel strip 50 . DETAILED DESCRIPTION

[0024] A single IC package chip electroplating fixture, see Figure 1 , which includes a fixture plate 10, and a plurality of sets of fixture positioning mechanisms 20;

[0025] Each set of fixture positioning mechanism 20 includes four sets of telescopic top block structures 30, each set of telescopic top block structures 30 includes a top block 1, at least one set of linear springs 2, and a fixed block 3, the four sets of top blocks 1 are arranged in pairs to form four discontinuous sides of a quadrilateral, and the central area of ​​the four sets of top blocks 1 is a product placement cavity 5, and the product placement cavity 5 is used to place a single IC chip 40;

[0026] The fixture plate 10 is arranged vertically, and a plurality of sets of fixture positioning mechanisms 20 are arranged in an array on the front end surface of the fixture plate 10 .

[0027] In specific implementation: each top block 1 includes an inner pressing surface 101 and an outer driving surface 102, wherein the inner pressing surface 101 is used to press the corresponding side pins 41 of a single IC chip 40;

[0028] The front surface of each top block 1 is provided with a guiding inclined surface 103 inclined from the outside to the inside, and the inner pressing surface 101 is located at the relatively outer area of ​​the inner end of the pin inclined surface 103, which allows a single IC chip 40 to be easily placed along the guiding inclined surface 103 in the product placement cavity 5 formed by the inner pressing surfaces 101 of the four groups of top blocks 1;

[0029] The inner pressing surface 101 of each top block 1 is provided with a top pin 4 at a position corresponding to the side pin 41 of a single IC chip 40, and the top pin 4 is mounted on the side pin 41 to ensure stable and reliable pressing;

[0030] The four fixed blocks 3 of each set of fixture positioning mechanism 30 are respectively fixed to the front elevation of the fixture plate 10 by fasteners and arranged in the outer area of ​​the corresponding top block 1. Two sets of linear springs 2 are arranged between the fixed blocks 3 and the top block 1. One end of each set of linear springs 2 is also sleeved on the outer convex shaft. The outer driving surface 102 of the top block is convex to form an outer convex shaft (not shown in the figure). The linear springs 2 drive the top block 1 to press inward for operation.

[0031] A clamping space 11 is reserved in the upper area of ​​the jig plate 10 , so that the jig plate 10 can be reliably connected to the cathode steel belt 50 .

[0032] During specific implementation, the entire fixture is made of 316 stainless steel (conductive and corrosion-resistant). The top blocks on all four sides of each fixture positioning mechanism 30 are movable and are pushed inward by linear springs. The inner wall of each top block is provided with top pins with the same number as the side pins of the IC chip 40. The top pins are in contact with the side of the side pins 41 of a single IC chip 40 to achieve the purpose of conductivity of a single product.

[0033] Its working principle is as follows: several groups of jig positioning mechanism arrays are arranged on one surface of the jig plate, and after a sufficient number of single IC chips with unqualified plating are gathered, they are filled into the product placement cavity of the corresponding jig positioning mechanism respectively. Since each jig positioning mechanism is composed of four top blocks and their corresponding linear springs and fixed blocks, the four top blocks can adjust the expansion and contraction amount according to the size of the product. Each top block is tightly connected to the side pins on the four sides of the chip through a linear spring to achieve the conductive effect of fixing the product. At the same time, one side of the entire jig plate is clamped on the cathode steel belt, with the chip's colloid facing inward and the pins facing inward. Under the transmission of the cathode steel belt, the entire jig plate and the corresponding several IC chips are driven for subsequent electroplating operations, which solves the electroplating problem of the cut single chip, ensures the plating quality of the single chip after re-electroplating, and improves the product yield. The electroplating jig corresponding to the single IC chip can share the same electroplating equipment with the entire product to achieve the purpose of electroplating a single product.

[0034] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0035] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A single IC package chip electroplating fixture, characterized in that: It includes: jig board; and a plurality of sets of fixture positioning mechanisms, each set of fixture positioning mechanisms includes four sets of telescopic top block structures, each set of telescopic top block structures includes a top block, at least one set of linear springs, and a fixed block, the four sets of top blocks are arranged in pairs to form four discontinuous sides of a quadrilateral, the central area of ​​the four sets of top blocks is a product placement cavity, and the product placement cavity is used to place a single IC chip; A plurality of fixture positioning mechanism arrays are arranged on one surface of the fixture plate.

2. The single IC package chip electroplating fixture according to claim 1, characterized in that: Each of the top blocks comprises an inner pressing surface and an outer driving surface, wherein the inner pressing surface is used for pressing the corresponding side pins of a single chip.

3. The single IC package chip electroplating fixture according to claim 2, characterized in that: The surface of each top block away from the jig plate is provided with a guiding slope inclined from the outside to the inside, and the inner pressing surface is located in the relatively outer area of ​​the inner end of the pin slope, which allows a single chip to be easily placed along the guiding slope in the product placement cavity formed by the inner pressing surfaces of the four groups of top blocks.

4. The single IC package chip electroplating fixture according to claim 2, characterized in that: The inner pressing surface of each top block is provided with a top pin corresponding to the side pin position of a single IC chip, and the top pin is mounted on the side pin.

5. The single IC package chip electroplating fixture according to claim 1, characterized in that: The four fixed blocks of each set of fixture positioning mechanism are respectively fixed to the surface of the fixture plate by fasteners and arranged in the outer area of ​​the corresponding top block. At least one set of linear springs is arranged between the fixed blocks and the top blocks, and the linear springs drive the top blocks to press inward.

6. The single IC package chip electroplating fixture according to claim 2, characterized in that: A clamping space is reserved in the upper area of ​​the fixture plate.

7. The single IC package chip electroplating fixture according to claim 5, characterized in that: The number of linear springs corresponding to each group of top blocks is at least two.

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