Semiconductor cooler, infrared thermal camouflage system and control system and method of infrared thermal camouflage system

Abstract

The invention discloses a semiconductor cooler, an infrared thermal camouflage system and a control system and method thereof.The semiconductor cooler comprises a first substrate, a second substrate and a plurality of PN junctions arranged between the first substrate and the second substrate, first thermistors are installed at the joints of the PN junctions and the first substrate, and second thermistors are installed at the joints of the PN junctions and the second substrate; according to the system and the method, thermal camouflage under a complex infrared background can be realized, the structure is simple, and the response speed is relatively high.

Description

Technical Field

[0001] The invention belongs to the field of infrared thermal camouflage, and relates to a semiconductor refrigerator, an infrared thermal camouflage system, and a control system and method thereof. Background Art

[0002] Since the heating object continuously releases heat to the radiation background, the thermal detector can detect the existence of the object based on the thermal signal of the heating object. Thermal camouflage for thermal radiation signals can be divided into thermal stealth and thermal illusion. The thermal stealth effect is to hide the thermal radiation signal of the heating device so that the thermal detector cannot detect the existence of the signal, thereby achieving thermal stealth of the heating device. The thermal illusion effect is to create a virtual thermal radiation signal so that the thermal detector mistakes the heating object for other equipment. Thermal camouflage of thermal signals has a wide range of applications both in military and civilian applications. At present, thermal camouflage equipment has problems such as large auxiliary equipment, slow response speed, and inability to adapt to complex infrared backgrounds. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a semiconductor refrigerator, an infrared thermal camouflage system and a control system and method thereof. The system and method can achieve thermal camouflage under complex infrared backgrounds, and have a simple structure and a fast response speed.

[0004] To achieve the above-mentioned purpose, the present invention discloses a semiconductor refrigerator, comprising a first substrate, a second substrate and a plurality of PN junctions arranged between the first substrate and the second substrate, wherein a first thermistor is installed at the connection between the PN junction and the first substrate, and a second thermistor is installed at the connection between the PN junction and the second substrate.

[0005] The invention discloses an infrared thermal camouflage system based on thermoelectric effect, comprising a circuit substrate and a semiconductor refrigerator array. The semiconductor refrigerator array is composed of a plurality of semiconductor refrigerators and the semiconductor refrigerator array is located on the circuit substrate.

[0006] The further improvement of the infrared thermal camouflage system based on the thermoelectric effect of the present invention is:

[0007] Furthermore, a water-cooling radiator is provided at the bottom of the circuit substrate, and a water-cooling inlet and a water-cooling outlet are provided on the water-cooling radiator.

[0008] Furthermore, each semiconductor refrigerator is connected to the circuit substrate via thermally conductive silica gel or silicone grease.

[0009] Furthermore, a heat sink is provided in the water-cooled radiator, and the heat sink is connected to the circuit substrate.

[0010] The present invention discloses a control system of an infrared thermal camouflage system, comprising a power supply, a first DC-DC converter, a main control chip and a control module, wherein each control module comprises a transformer and a temperature collector, one control module corresponds to a semiconductor refrigerator, the output end of the power supply is connected to the input end of the first DC-DC converter, the output end of the first DC-DC converter is connected to the input end of the transformer, the output end of the transformer is connected to the power interface of the semiconductor refrigerator, the output end of the first thermistor and the output end of the second thermistor are connected to the input end of the temperature collector, the output end of the temperature collector is connected to the input end of the main control chip, and the output end of the main control chip is connected to the control end of the transformer.

[0011] The control system of the infrared thermal camouflage system of the present invention is further improved in that:

[0012] Furthermore, it also includes a second DC-DC converter, the output end of the power supply is connected to the input end of the second DC-DC converter, and the output end of the second DC-DC converter is connected to the power interface of the main control chip.

[0013] Furthermore, a water-cooling radiator is provided at the bottom of the circuit substrate, and a water-cooling inlet and a water-cooling outlet are provided on the water-cooling radiator.

[0014] Furthermore, each semiconductor refrigerator is connected to the circuit substrate via thermally conductive silica gel or silicone grease.

[0015] The invention discloses a control method for an infrared thermal camouflage system, comprising:

[0016] The temperature signals of the front and back sides of the semiconductor refrigerator are obtained through a temperature collector;

[0017] Calculate the voltage information to be provided to the semiconductor refrigerator according to the manually input signal and the temperature signal;

[0018] The voltage information provided to each semiconductor refrigerator as required controls the operation of the transformer corresponding to each semiconductor refrigerator.

[0019] The present invention has the following beneficial effects:

[0020] The semiconductor refrigerator, infrared thermal camouflage system and control system and method described in the present invention require huge control equipment and auxiliary cooling systems during specific operation, and have problems such as slow temperature response and easy exposure, and cannot adapt to complex infrared backgrounds. The present invention makes full use of the miniaturization and rapidity of semiconductor refrigerators, and realizes thermal camouflage for complex thermal signals through array arrangement. Compared with the prior art, the present invention can greatly improve the success rate of camouflaging complex thermal signals, and has the advantages of simple structure, fast response and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0022] Figure 1 It is a structural diagram of the semiconductor refrigerator in the present invention;

[0023] Figure 2 It is a structural diagram of the infrared thermal camouflage system of the present invention;

[0024] Figure 3 It is a structural diagram of the control system in the present invention.

[0025] Among them, 1 is the first interface, 2 is the second interface, 3 is the third interface, 4 is the fourth interface, 5 is the fifth interface, and 6 is the sixth interface. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that the terms “include” and “comprises” indicate the presence of described features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or collections thereof.

[0028] It should also be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0029] It should be further understood that the term "and / or" used in the present specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes these combinations. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present invention generally indicates that the associated objects are in an "or" relationship.

[0030] It should be understood that, although the terms first, second, third, etc. may be used to describe preset ranges, etc. in the embodiments of the present invention, these preset ranges should not be limited to these terms. These terms are only used to distinguish preset ranges from each other. For example, without departing from the scope of the embodiments of the present invention, the first preset range may also be referred to as the second preset range, and similarly, the second preset range may also be referred to as the first preset range.

[0031] The word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can usually be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] Various structural schematic diagrams of the embodiments disclosed in the present invention are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may additionally design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0034] Embodiment 1

[0035] refer to Figure 1 The semiconductor cooler includes a first substrate, a second substrate and a plurality of PN junctions arranged between the first substrate and the second substrate, wherein a first thermistor is installed at the connection between the PN junction and the first substrate, and a second thermistor is installed at the connection between the PN junction and the second substrate, wherein the first substrate serves as a hot surface and the second substrate serves as a cold surface.

[0036] Embodiment 2

[0037] like Figure 2 As shown, the infrared thermal camouflage system based on thermoelectric effect of the present invention includes a circuit substrate and a semiconductor refrigerator array, wherein the semiconductor refrigerator array is composed of several semiconductor refrigerators described in embodiment 1, wherein the semiconductor refrigerator includes a first substrate, a second substrate and several PN junctions arranged between the first substrate and the second substrate, wherein a first thermistor is installed at the connection between the PN junction and the first substrate, and a second thermistor is installed at the connection between the PN junction and the second substrate, wherein the first substrate serves as a hot surface and the second substrate serves as a cold surface, wherein the first interface 1 and the second interface 2 are connected to the first thermistor, the third interface 3 and the fourth interface 4 are connected to the second hot surface resistor, and the fifth interface 5 and the sixth interface 6 are connected to the power interface of the semiconductor refrigerator.

[0038] The semiconductor refrigerator array is located on a circuit substrate. A water-cooled radiator is arranged at the bottom of the circuit substrate for dissipating heat from the semiconductor refrigerator. A heat sink is arranged in the water-cooled radiator. The heat sink is connected to the circuit substrate to enhance heat dissipation efficiency. In addition, a water-cooled inlet and a water-cooled outlet are provided on the water-cooled radiator.

[0039] Specifically, each semiconductor refrigerator is connected to the circuit substrate via thermally conductive silica gel or silicone grease.

[0040] Embodiment 3

[0041] refer to Figure 3 The control system of the infrared thermal camouflage system of the present invention includes a power supply, a first DC-DC converter, a second DC-DC converter, a main control chip and a control module, wherein each control module includes a transformer, a temperature collector and a semiconductor refrigerator, the output end of the power supply is connected to the input end of the first DC-DC converter and the input end of the second DC-DC converter, the output end of the first DC-DC converter is connected to the input end of the transformer, the output end of the transformer is connected to the power interface of the semiconductor refrigerator, the output end of the first thermistor and the output end of the second thermistor are connected to the input end of the temperature collector, the output end of the temperature collector is connected to the input end of the main control chip, the output end of the main control chip is connected to the control end of the transformer, and the output end of the second DC-DC converter is connected to the power interface of the main control chip.

[0042] like Figure 3As shown, the required working state (cooling or heating) and the required heating or cooling capacity of each semiconductor refrigerator are manually input into the main control chip through a computer or other means. The temperature collector obtains the temperature signals of the front and back sides of the semiconductor refrigerator and transmits them to the main control chip. The main control chip calculates the voltage value to be provided to the semiconductor refrigerator based on the manually input signal and the collected temperature signal, and controls the transformer to provide the voltage value to the semiconductor refrigerator.

[0043] It should be noted that each semiconductor refrigerator can be controlled independently, that is, each semiconductor refrigerator has an independent transformer, and the main control chip can drive each transformer separately to realize the three states of stopping, heating and cooling of each semiconductor refrigerator. The transformer can switch the cooling and heating working states by converting the direction of the current (after the semiconductor refrigerator is powered on, one side is the hot side and will heat up, and the other side is the cold side and will become cold. After changing the direction of the current, the hot and cold sides will swap). If the measured temperature is higher than a threshold, the power supply to the corresponding semiconductor refrigerator is cut off to prevent damage to the equipment due to excessive temperature. Since the temperature on the front and back of the semiconductor refrigerator changes in real time, Figure 3 The semiconductor cooler array and the temperature sensors arranged on the front and back of each semiconductor cooler constitute a working module, and the remaining parts constitute a control module, which can be integrated on a circuit board.

[0044] Embodiment 4

[0045] The present invention provides a control method for an infrared thermal camouflage system, which is implemented based on the control system of the infrared thermal camouflage system. The control system of the infrared thermal camouflage system includes a power supply, a first DC-DC converter, a second DC-DC converter, a main control chip and a control module, wherein each control module includes a transformer, a temperature collector and a semiconductor refrigerator, the output end of the power supply is connected to the input end of the first DC-DC converter and the input end of the second DC-DC converter, the output end of the first DC-DC converter is connected to the input end of the transformer, the output end of the transformer is connected to the power interface of the semiconductor refrigerator, the output end of the first thermistor and the output end of the second thermistor are connected to the input end of the temperature collector, the output end of the temperature collector is connected to the input end of the main control chip, the output end of the main control chip is connected to the control end of the transformer, and the output end of the second DC-DC converter is connected to the power interface of the main control chip.

[0046] Specifically, the control method of the infrared thermal camouflage system includes the following steps:

[0047] The temperature signals of the front and back sides of the semiconductor refrigerator are obtained through a temperature collector;

[0048] Calculate the voltage information to be provided to the semiconductor refrigerator according to the manually input signal and the temperature signal;

[0049] The voltage information provided to each semiconductor refrigerator as required controls the operation of the transformer corresponding to each semiconductor refrigerator.

[0050] The division of modules in the embodiments of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation. In addition, each functional module in each embodiment of the present application may be integrated into a processor, or may exist physically separately, or two or more modules may be integrated into one module. The above-mentioned integrated modules may be implemented in the form of hardware or in the form of software functional modules.

[0051] Embodiment 5

[0052] A computer device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the control method of the infrared thermal camouflage system are implemented, for example, including: obtaining temperature signals of the front and back sides of the semiconductor refrigerator through a temperature collector; calculating the voltage information required to be provided to the semiconductor refrigerator according to the manually input signal and the temperature signal; and controlling the operation of the transformer corresponding to each semiconductor refrigerator according to the voltage information required to be provided to each semiconductor refrigerator. The memory may include a memory, such as a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk memory, etc. The processor, the network interface, and the memory are interconnected through an internal bus, and the internal bus may be an industrial standard architecture bus, a peripheral component interconnection standard bus, an extended industrial standard architecture bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The memory is used to store programs. Specifically, the program may include a program code, and the program code includes computer operation instructions. The memory may include a memory and a non-volatile memory, and provide instructions and data to the processor.

[0053] Embodiment 6

[0054] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the control method of the infrared thermal camouflage system are implemented, for example, including: obtaining the temperature signal of the front and back sides of the semiconductor refrigerator through a temperature collector; calculating the voltage information that needs to be provided to the semiconductor refrigerator according to the manually input signal and the temperature signal; controlling the operation of the transformer corresponding to each semiconductor refrigerator according to the voltage information that needs to be provided to each semiconductor refrigerator. Specifically, the computer-readable storage medium includes, but is not limited to, volatile memory and / or non-volatile memory. The volatile memory may include random access memory (RAM) and / or cache memory (cache), etc. The non-volatile memory may include read-only memory (ROM), hard disk, flash memory, optical disk, magnetic disk, etc.

[0055] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0056] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0057] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0058] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0059] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and disclosure of the invention. This application is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed by the present invention. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0060] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0061] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any way. Any simple modification, change and equivalent structural change made to the above embodiment based on the technical essence of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor refrigerator, characterized in that: The invention comprises a first substrate, a second substrate and a plurality of PN junctions arranged between the first substrate and the second substrate, wherein a first thermistor is installed at the connection between the PN junction and the first substrate, and a second thermistor is installed at the connection between the PN junction and the second substrate.

2. An infrared thermal camouflage system based on thermoelectric effect, characterized in that: It comprises a circuit substrate and a semiconductor refrigerator array, wherein the semiconductor refrigerator array is composed of several semiconductor refrigerators as claimed in claim 1, and the semiconductor refrigerator array is located on the circuit substrate.

3. The infrared thermal camouflage system based on thermoelectric effect according to claim 2 is characterized in that: A water cooling radiator is arranged at the bottom of the circuit substrate, and a water cooling inlet and a water cooling outlet are arranged on the water cooling radiator.

4. The infrared thermal camouflage system based on thermoelectric effect according to claim 2 is characterized in that: Each semiconductor refrigerator is connected to the circuit substrate through thermally conductive silica gel or silicone grease.

5. The infrared thermal camouflage system based on thermoelectric effect according to claim 2 is characterized in that: A heat sink is arranged in the water cooling radiator, and the heat sink is connected to the circuit substrate.

6. A control system for the infrared thermal camouflage system according to claim 2, characterized in that: It includes a power supply, a first DC-DC converter, a main control chip and a control module, wherein each control module includes a transformer and a temperature collector, one control module corresponds to one semiconductor refrigerator, the output end of the power supply is connected to the input end of the first DC-DC converter, the output end of the first DC-DC converter is connected to the input end of the transformer, the output end of the transformer is connected to the power interface of the semiconductor refrigerator, the output end of the first thermistor and the output end of the second thermistor are connected to the input end of the temperature collector, the output end of the temperature collector is connected to the input end of the main control chip, and the output end of the main control chip is connected to the control end of the transformer.

7. The control system of the infrared thermal camouflage system according to claim 6, characterized in that: It also includes a second DC-DC converter, the output end of the power supply is connected to the input end of the second DC-DC converter, and the output end of the second DC-DC converter is connected to the power interface of the main control chip.

8. The control system of the infrared thermal camouflage system according to claim 6, characterized in that: A water cooling radiator is arranged at the bottom of the circuit substrate, and a water cooling inlet and a water cooling outlet are arranged on the water cooling radiator.

9. The control system of the infrared thermal camouflage system according to claim 6, characterized in that: Each semiconductor refrigerator is connected to the circuit substrate through thermally conductive silica gel or silicone grease.

10. A control method for an infrared thermal camouflage system, characterized in that: The control system based on the infrared thermal camouflage system according to claim 6 comprises: The temperature signals of the front and back sides of the semiconductor refrigerator are obtained through a temperature collector; Calculate the voltage information to be provided to the semiconductor refrigerator according to the manually input signal and the temperature signal; The voltage information provided to each semiconductor refrigerator as required controls the operation of the transformer corresponding to each semiconductor refrigerator.

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