Special drawers and refrigerator

Abstract

This application provides a dedicated drawer and refrigerator. The dedicated drawer includes a sealed cavity, a drawer, a duct foam, and a semiconductor refrigeration module. The top of the duct foam is concave to form a hot-end air duct, and the bottom is concave to form a cold-end air duct. The semiconductor refrigeration module includes a semiconductor refrigeration chip, a cold-end aluminum block, and a hot-end aluminum block. The cold-end aluminum block is fixed inside the cold-end air duct, and the hot-end aluminum block is fixed inside the hot-end air duct. The semiconductor refrigeration chip is located between the cold-end and hot-end aluminum blocks. The drawer is refrigerated by the semiconductor refrigeration module, achieving a true sealed state without exchanging cold air with the refrigerator compartment. This solves the problems of complex temperature and humidity control structures in existing dedicated drawers, temperature fluctuations being easily affected by factors such as defrosting in the refrigerator refrigeration system, difficulty in achieving constant temperature and humidity, and odor transfer between the drawer and the refrigerator compartment. Furthermore, by utilizing the characteristic that the cold and hot ends of the semiconductor module can switch according to the direction of current input, the drawer can be switched from refrigeration to warm storage, which can be used to store tropical fruits or defrost meat.

Description

Technical Field

[0001] This application relates to the field of household appliance technology, and more specifically to a dedicated drawer and refrigerator. Background Technology

[0002] As people's demands for healthy and high-quality food increase, the types of food and their storage needs are becoming increasingly diverse. This demand for a refined storage environment necessitates refrigerator design that utilizes scientifically designed partitioned storage and professional preservation technologies to provide an optimal preservation environment for various types of food. Existing high-end refrigerators not only offer larger storage space but also cleverly incorporate dedicated drawers with independent temperature and humidity control functions to meet the personalized storage needs of different foods.

[0003] High-end refrigerators typically employ advanced temperature and humidity control technologies in their dedicated drawer compartments. These drawers are usually equipped with sensors that monitor and adjust the temperature and humidity levels inside in real time to ensure food is stored optimally. However, in terms of cooling methods, most dedicated drawers do not have independent cooling circulation capabilities; instead, they rely on the circulation of cold air between the drawer and the main refrigerator compartment. This means that although the drawer has a temperature and humidity control system inside, its cooling effect is still affected and limited by the overall refrigerator cooling system.

[0004] Because most existing dedicated drawer compartments cannot achieve independent cooling circulation and rely on the cold air from the refrigerator compartment for circulation, a relatively complex structure is needed to address the unevenness of cold air circulation in order to achieve temperature and humidity control inside the drawer, increasing manufacturing costs and maintenance difficulty. Secondly, the periodic defrosting operation of the refrigerator's cooling system causes significant fluctuations in the temperature and humidity environment inside the drawer, making it particularly difficult to achieve constant temperature and humidity. Furthermore, due to the non-independent cold air circulation, odors can easily cross-contaminate between the dedicated drawer compartment and the refrigerator compartment, affecting the pure flavor and storage quality of food. Summary of the Invention

[0005] To address the problems of existing related technologies, such as increased manufacturing costs and maintenance difficulties due to the fact that most existing dedicated drawers cannot achieve independent cooling circulation and need to rely on the cold air in the refrigerator compartment for circulation, as well as the difficulty in achieving constant temperature and humidity and the easy occurrence of odor transfer between the dedicated drawers and the refrigerator compartment.

[0006] This application provides a dedicated drawer, including: a sealed cavity and a drawer slidably disposed in the sealed cavity, wherein the front of the sealed cavity forms an open dedicated drawer storage space, and when the drawer is closed, the dedicated drawer storage space is completely sealed;

[0007] It also includes a duct foam and a semiconductor cooling module, wherein the duct foam covers the top of the sealed cavity and the semiconductor cooling module is embedded in the duct foam;

[0008] The top of the air duct foam is concave to form a hot end air duct, and the bottom is concave to form a cold end air duct.

[0009] The semiconductor cooling module includes: a semiconductor cooling chip, a cold-end aluminum block, and a hot-end aluminum block;

[0010] The cold-end aluminum block is fixed inside the cold-end air duct, the hot-end aluminum block is fixed inside the hot-end air duct, and the semiconductor cooling chip is disposed between the cold-end aluminum block and the hot-end aluminum block.

[0011] In one feasible implementation, the semiconductor cooling module further includes: connecting the aluminum block and the insulating foam;

[0012] The cold-end aluminum block and the hot-end aluminum block are fixedly connected by the connecting aluminum block, which is embedded in the thermal insulation foam. The cold-end aluminum block and the hot-end aluminum block are respectively located on both sides of the thermal insulation foam.

[0013] In one feasible implementation, the thermoelectric cooler is connected to an external power source, and the current input direction of the external power source is reversible.

[0014] In one feasible implementation, a through hole is provided in the middle of the hot end air duct;

[0015] The stepped surface of the thermal insulation foam fits into the stepped surface of the through hole, and the thickness of the thermal insulation foam is consistent with the depth of the through hole, so as to seal the cold end air duct and the hot end air duct.

[0016] In one feasible implementation, a fixing screw post is provided at the top of the sealing cavity below the through hole;

[0017] The fixing screw post is inserted into the semiconductor refrigeration module, and the semiconductor refrigeration module is fixed to the top of the sealing cavity by the fixing screw post.

[0018] In one feasible implementation, the dedicated area drawer further includes a dedicated area cover that snaps onto the top of the sealed cavity;

[0019] The special zone cover plate compresses the air duct foam, sealing the cold end air duct with the sealing cavity and the hot end air duct with the special zone cover plate.

[0020] In one feasible implementation, a cold end return air inlet is provided at the rear of the top surface of the sealed cavity, and a cold end supply air inlet is provided in the middle.

[0021] The special zone drawer also includes a cold end fan, which is located at the front section of the cold end air duct near the cold end return air inlet, while the cold end aluminum block is located in the middle section of the cold end air duct and the cold end air outlet is located at the rear section of the cold end air duct.

[0022] In one feasible implementation, the top of the special zone cover plate is provided with an upwardly protruding boss;

[0023] The front of the boss is provided with a hot end air inlet and the rear is provided with a hot end air outlet. The hot end air inlet extends to the top of the hot end aluminum block and the hot end air outlet is located on the rear side of the hot end aluminum block.

[0024] In one feasible implementation, a first limiting rib is provided at the interface between the top surface of the sealing cavity and the foam of the air duct, and a second limiting rib is provided at the bottom of the special zone cover plate;

[0025] The first limiting rib and the second limiting rib are fitted together, and the air duct foam is fixed between the sealing cavity and the special area cover plate by the first limiting rib and the second limiting rib.

[0026] This application also provides a refrigerator, comprising: a refrigerator liner and a dedicated drawer as described above disposed within the refrigerator liner.

[0027] As can be seen from the above, this application provides a dedicated drawer and refrigerator. The drawer is cooled by a semiconductor refrigeration module, achieving a true sealed state without exchanging cold air with the refrigerator compartment. This solves the problems of complex temperature and humidity control structures in existing dedicated drawers, temperature fluctuations being easily affected by factors such as defrosting in the refrigerator refrigeration system, difficulty in achieving constant temperature and humidity, and cross-contamination of odors between food in the drawer and the refrigerator compartment. Furthermore, by utilizing the characteristic that the cold and hot ends of the semiconductor module can switch according to the direction of current input, the function of the drawer can be switched from refrigeration to warm storage, for storing tropical fruits or defrosting meat, etc. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the implementation of the invention and, together with the description, serve to explain the principles of the embodiments of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0029] Figure 1 This is a schematic diagram of the structure of the drawer cover of the special area opened, as shown in the embodiment of this application;

[0030] Figure 2 This is an exploded view of the drawer in the special zone, as shown in the embodiments of this application;

[0031] Figure 3 This is a schematic diagram of the structure of the top of the sealing cavity shown in an embodiment of this application;

[0032] Figure 4This is a schematic diagram of the structure of the top of the air duct foam shown in the embodiments of this application;

[0033] Figure 5 This is a schematic diagram of the structure for fixing the air duct foam and the semiconductor cooling module, as shown in the embodiments of this application;

[0034] Figure 6 This is a schematic diagram of the structure of the bottom of the air duct foam shown in an embodiment of this application;

[0035] Figure 7 This is an exploded view of the semiconductor cooling module shown in an embodiment of this application;

[0036] Figure 8 This is a schematic diagram of the structure of a semiconductor cooling module shown in an embodiment of this application;

[0037] Figure 9 This is a cross-sectional view of the side of the special zone drawer shown in the embodiment of this application;

[0038] Figure 10 This is a schematic diagram of the structure of the top of the special zone drawer shown in the embodiment of this application;

[0039] Figure 11 This is a schematic diagram of the structure of a refrigerator shown in an embodiment of this application.

[0040] Explanation of icon numbers:

[0041] 100 - Refrigerator; 1 - Inner cabinet; 2 - Dedicated drawer;

[0042] 21-Sealed cavity; 22-Drawer; 23-Cold end fan; 24-Air duct foam; 25-Semiconductor refrigeration module; 26-Dedicated area cover;

[0043] 211-Cold end return air inlet; 212-Cold end air outlet; 213-Fixing screw post; 214-First limiting rib; 241-Hot end air duct; 242-Cold end air duct; 243-Through hole; 251-Semiconductor cooling chip; 252-Cold end aluminum block; 253-Hot end aluminum block; 254-Connecting aluminum block; 255-Insulating foam; 261-Boss; 262-Hot end air inlet; 263-Hot end air outlet; 264-Second limiting rib. Detailed Implementation

[0044] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the embodiments of the invention will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a full understanding of how embodiments of the invention are carried out.

[0045] In modern life, with the diversification of food types and the increasing sophistication of storage needs, high-end refrigerators are designed with dedicated drawers featuring independent temperature and humidity control to meet the preservation requirements of different foods. However, most dedicated drawers on the market currently rely on the circulation of cold air within the refrigerator compartment rather than independent cooling. This leads to a more complex internal control structure and significant temperature and humidity fluctuations due to factors such as defrosting in the refrigerator's cooling system, making it difficult to achieve constant temperature and humidity. Furthermore, there are technical issues such as odor transfer between the dedicated drawer and the refrigerator compartment. These problems not only increase manufacturing costs and maintenance difficulty but also affect the preservation of food and the user experience.

[0046] To address these issues, this application provides a dedicated drawer 2, referring to... Figures 1-10 As shown, it includes: a sealed cavity 21 and a drawer 22 slidably disposed within the sealed cavity 21. The front of the sealed cavity 21 forms an open storage space for the dedicated drawer 2. When the drawer 22 is closed, the storage space of the dedicated drawer 2 is completely sealed. The sealed cavity 21 is open at the front to allow for the sliding installation of the drawer 22. When the drawer 22 is fully pushed in and closed, the sealed cavity 21 and the drawer 22 together form a completely sealed storage space, effectively isolating external air and odors.

[0047] The special zone drawer also includes a duct foam 24 and a semiconductor cooling module 25. The duct foam 24 covers the top of the sealed cavity 21, and the semiconductor cooling module 25 is embedded in the duct foam 24. The top of the duct foam 24 is concave to form a hot end duct 241, and the bottom is concave to form a cold end duct 242.

[0048] The duct foam 24 covers the top of the sealed cavity 21, serving as thermal insulation. The top of the duct foam 24 is concave to form the hot-end duct 241, and the bottom is concave to form the cold-end duct 242. These two ducts help guide the flow of hot and cold air, improving cooling efficiency.

[0049] The semiconductor cooling module 25 includes: a semiconductor cooling chip 251, a cold-end aluminum block 252, and a hot-end aluminum block 253; the cold-end aluminum block 252 is fixed in the cold-end air duct 242, the hot-end aluminum block 253 is fixed in the hot-end air duct 241, and the semiconductor cooling chip 251 is disposed between the cold-end aluminum block 252 and the hot-end aluminum block 253.

[0050] This embodiment of the application achieves independent cooling function for the dedicated drawer 2 by combining a semiconductor cooling module 25 with air duct foam 24. When the semiconductor cooling chip 251 is powered on, its cold end absorbs heat and its hot end releases heat, transferring the heat to the air in the cold-end air duct 242 and hot-end air duct 241 via the cold-end aluminum block 252 and hot-end aluminum block 253, respectively. The cold air in the cold-end air duct 242 enters the storage space of the dedicated drawer 2 through natural or forced convection, providing a cooling effect for the food; while the hot air in the hot-end air duct 241 is exhausted to the outside of the dedicated drawer 2 through the heat dissipation system, achieving separation and circulation of cold and hot air. This design avoids the complexity of cold air circulation in traditional refrigerator compartments, reduces temperature and humidity fluctuations, and achieves a constant temperature and humidity effect.

[0051] This embodiment of the application implements independent cooling function for the dedicated drawer 2, avoiding the complexity of cold air circulation in traditional refrigerator compartments and improving cooling efficiency and stability. By combining the semiconductor cooling module 25 with the air duct foam 24, a constant temperature and humidity effect is achieved within the dedicated drawer 2, extending the shelf life of food. The completely sealed storage space formed by the sealed cavity 21 and drawer 22 effectively isolates external air and odors, ensuring the freshness and purity of food. At the same time, it simplifies the structure of the refrigeration system, reducing manufacturing costs and maintenance difficulty.

[0052] In some embodiments of this application, the semiconductor cooling module 25 further includes: a connecting aluminum block 254 and a heat insulation foam 255; the cold end aluminum block 252 and the hot end aluminum block 253 are fixedly connected by the connecting aluminum block 254, the connecting aluminum block 254 is embedded in the heat insulation foam 255, and the cold end aluminum block 252 and the hot end aluminum block 253 are respectively disposed on both sides of the heat insulation foam 255.

[0053] The connecting aluminum block 254 ensures a stable connection between the cold-end aluminum block 252 and the hot-end aluminum block 253, and also serves as a heat conduction path. The connecting aluminum block 254 is embedded in the heat-insulating foam 255, effectively separating the cold-end aluminum block 252 and the hot-end aluminum block 253, preventing direct heat transfer, and optimizing the heat conduction path.

[0054] The function of the insulating foam 255 is to further isolate the heat transfer between the cold-end aluminum block 252 and the hot-end aluminum block 253, thereby improving cooling efficiency, reducing energy loss, and ensuring the stability and high efficiency of the cooling system. At the same time, it also protects the thermoelectric cooler 251 from external environmental influences, extending its service life.

[0055] This embodiment further optimizes the structure of the refrigeration system by adding a connecting aluminum block 254 and thermal insulation foam 255 to the original semiconductor refrigeration module 25. The connecting aluminum block 254 ensures a stable connection between the cold end aluminum block 252 and the hot end aluminum block 253, and the effective isolation of the thermal insulation foam 255 achieves complete separation of the cold and hot ends, which not only improves refrigeration efficiency and reduces energy loss, but also ensures the stability and reliability of the refrigeration system.

[0056] During the cooling process, after the semiconductor cooling chip 251 is energized, the cold-end aluminum block 252 absorbs heat, and the hot-end aluminum block 253 releases heat. Through the heat conduction effect of the connecting aluminum blocks 254, the cold-end aluminum block 252 transfers the cooling energy to the air in the dedicated drawer storage space, achieving the cooling effect; while the hot-end aluminum block 253 transfers the heat to the air in the hot-end air duct 241 isolated by the heat insulation foam 255, and exhausts it to the outside of the dedicated drawer 2 through the heat dissipation system.

[0057] In some embodiments of this application, the semiconductor cooling chip 251 is connected to an external power supply, and the current input direction of the external power supply is reversible.

[0058] The power supply setting in this embodiment is based on the core principle of semiconductor refrigeration—the Peltier effect, a unique thermoelectric effect.

[0059] The Peltier effect is based on the fact that when a direct current is applied to a thermocouple pair composed of N-type (electron-rich) and P-type (electron-deficient) semiconductor materials, in addition to the unavoidable Joule heating, heat absorption and heat release phenomena occur at the junctions of the thermocouples, respectively. The key to this phenomenon lies in the direction of the current: when the current flows in one direction, one junction absorbs heat (becoming the cold junction), and the other junction releases heat (becoming the hot junction); conversely, when the current direction is reversed, the heat-absorbing and heat-releasing junctions are exchanged accordingly.

[0060] Based on this principle, this embodiment achieves flexible switching between cooling and heating modes for the semiconductor refrigeration chip 251 by controlling the direction of current input from the external power supply. In the application scenario of the dedicated drawer 2, this means that the temperature environment inside the drawer can be dynamically adjusted according to the needs of the stored items, ensuring just the right temperature control for both fresh food requiring refrigeration and specific medicines or reagents requiring insulation.

[0061] Traditional refrigerators or refrigeration equipment often use fixed refrigeration systems, which cannot be flexibly adjusted according to the different needs of stored items. This not only leads to energy waste but may also affect the quality and shelf life of stored items. This embodiment solves the problem of inflexible refrigeration system adjustment by introducing an external power source with reversible current, combined with the Peltier effect of the semiconductor cooling chip. Specifically, this embodiment utilizes the characteristic that the cold-end aluminum block 252 and the hot-end aluminum block 253 of the semiconductor module 2 can switch according to the direction of current input, allowing the drawer 22 to switch its function from refrigeration to warm storage, for storing tropical fruits or defrosting meat, etc.

[0062] In some embodiments of this application, a through hole 243 is provided in the middle of the hot end air duct 241; the stepped surface of the heat insulation foam 255 is in contact with the stepped surface of the through hole 243, and the thickness of the heat insulation foam 255 is consistent with the depth of the through hole 243, so as to seal the cold end air duct 242 and the hot end air duct 241.

[0063] The insulating foam 255 effectively prevents direct heat transfer from the hot-end air duct 241 to the cold-end air duct 242. Simultaneously, by ensuring a tight fit between the stepped surface of the insulating foam 255 and the stepped surface of the through-hole 243, and by matching its thickness with the depth of the through-hole, a complete seal is achieved between the hot and cold air ducts, preventing heat transfer caused by air leakage. Ensuring that the thickness of the insulating foam 255 matches the depth of the through-hole 243 not only achieves a sealing effect but also maintains structural compactness, which helps save space and improves the efficiency of the overall design.

[0064] In some embodiments of this application, a fixing screw post 213 is provided at the top of the sealing cavity 21 below the through hole 243; the fixing screw post 213 passes through the semiconductor cooling module 25, and the semiconductor cooling module 25 is fixed to the top of the sealing cavity 21 by the fixing screw post 213.

[0065] The fastening force provided by the fixing screw post 213 prevents the semiconductor cooling module 25 from loosening or shifting during operation, thereby ensuring the long-term reliability and performance stability of the cooling system. Furthermore, the strong fastening force provided by the fixing screw post 213 ensures a tight fit between the semiconductor cooling module 25 and the sealing cavity 21, thereby effectively preventing heat leakage and air flow, and improving the overall efficiency of the cooling system.

[0066] In some embodiments of this application, the dedicated drawer 2 further includes a dedicated cover plate 26 that snaps onto the top of the sealed cavity 21; the dedicated cover plate 26 compresses the air duct foam 24, thereby sealing the cold end air duct 242 with the sealed cavity 21 and the hot end air duct 241 with the dedicated cover plate 26.

[0067] The duct foam 24 is used to form the cold-end duct 242 and the hot-end duct 241. The internal structure of the duct foam 24 guides efficient airflow between the cold and hot ends. The cold-end duct 242 houses the cold-end aluminum block 252 and absorbs heat through thermal conduction; while the hot-end duct 241 houses the hot-end aluminum block 253 and is responsible for expelling the absorbed heat to the outside of the system through air convection. The use of the duct foam 24 not only improves heat dissipation efficiency but also ensures the stability and durability of the duct structure.

[0068] The dedicated zone cover 26 is fastened to the top of the sealing cavity 21. By applying moderate compression to the air duct foam 24, a tight seal is ensured between the cold-end air duct 242 and the sealing cavity 21, and between the hot-end air duct 241 and the dedicated zone cover 26. This effectively prevents air leakage, improves the overall sealing performance of the heat dissipation system, and further enhances heat dissipation efficiency. In this embodiment, the compression action of the dedicated zone cover 26 achieves a seamless connection between the cold-end air duct 242 and the hot-end air duct 241 and the sealing cavity 21, reducing energy loss during heat transfer. Simultaneously, the optimized structure of the air duct foam 24 improves the airflow path, resulting in more efficient and uniform heat dissipation.

[0069] In some embodiments of this application, a cold end return air inlet 211 is provided at the rear of the top surface of the sealed cavity 21, and a cold end air outlet 212 is provided in the middle; the special area drawer 2 also includes a cold end fan 23, which is located in the front section of the cold end air duct 242 near the cold end return air inlet 211, the cold end aluminum block 252 is located in the middle section of the cold end air duct 242, and the cold end air outlet 212 is located in the rear section of the cold end air duct 242.

[0070] The cold-end aluminum block 252 utilizes its high thermal conductivity to rapidly generate cooling capacity. The cold-end fan 23 blows the pre-cooled air and, through its own rotation, propels the air through the cold-end duct 242. The cold-end return air inlet 211 draws in the cold air passing through the sealed cavity 21, while the cold-end supply air inlet 212 delivers the cooled air into the sealed cavity 21.

[0071] When the semiconductor cooling module 25 is running, under the action of the cold end fan 23, the cold end circulating air first flows from the cold end air duct 242 through the cold end aluminum block 252, and continues to flow through the cold end air outlet 212 to send air downward to the sealed cavity 21 to cool the food. After that, the circulating air re-enters the cold end air duct 242 through the cold end return air outlet 211 to complete the cold end air circulation.

[0072] This embodiment achieves efficient heat dissipation and cooling of the heat source by combining the forced convection of the cold-end fan 23 and the efficient heat conduction of the cold-end aluminum block 252 through the cold-end air duct 242. Air is drawn back from the cold-end return air port 211, accelerated by the cold-end fan 23, cooled as it flows through the cold-end aluminum block 252, and finally evenly delivered into the sealed cavity 21 from the cold-end air supply port 212, forming a complete refrigeration cycle. This process not only improves refrigeration efficiency but also ensures the uniformity of heat dissipation, effectively extending the service life of the refrigeration system.

[0073] In some embodiments of this application, the top of the special zone cover plate 26 is provided with an upwardly protruding boss 261; the front part of the boss 261 is provided with a hot end air inlet 262 and the rear part is provided with a hot end air outlet 263. The hot end air inlet 262 extends to the top of the hot end aluminum block 253 and the hot end air outlet 263 is located on the rear side of the hot end aluminum block 253.

[0074] The boss 261 is used to adjust the layout, enabling the hot-end air inlet 262 and hot-end air outlet 263 to work efficiently, while also increasing structural strength. The hot-end air inlet 262 ensures that hot air can smoothly enter the hot-end air duct 241, providing the necessary conditions for the heat dissipation process. The hot-end air outlet 263 exhausts the dissipated hot air from the drawer 22. The hot-end aluminum block 253, as a key component for heat conduction, can quickly and evenly absorb and disperse heat in the dedicated area drawer 2, providing stable heat dissipation performance for the dedicated area drawer 2.

[0075] This embodiment achieves efficient heat dissipation for the dedicated area drawer 2 through the design of the boss 261 on the dedicated area cover 26 and the reasonable layout of the hot-end air inlet 262 and hot-end air outlet 263. Hot air enters through the hot-end air inlet 262, is cooled by the hot-end aluminum block 253, and finally exits the system through the hot-end air outlet 263. This process not only improves heat dissipation efficiency but also ensures the uniformity of heat dissipation, effectively avoiding local overheating. At the same time, the design of the boss 261 increases structural strength and improves the stability and reliability of the heat dissipation system.

[0076] In some embodiments of this application, a first limiting rib 214 is provided at the mating point between the top surface of the sealing cavity 21 and the air duct foam 24, and a second limiting rib 264 is provided at the bottom of the special area cover plate 26; the first limiting rib 214 and the second limiting rib 264 are fitted together, and the air duct foam 24 is fixed between the sealing cavity 21 and the special area cover plate 26 by the first limiting rib 214 and the second limiting rib 264.

[0077] The main function of the first limiting rib 214 and the second limiting rib 264 is to provide a physical locking mechanism to ensure that the air duct foam 24 is firmly clamped between the sealing cavity 21 and the special area cover plate 26, effectively preventing the air duct foam 24 from shifting or falling off during long-term use, thereby maintaining the stability and efficiency of the air circulation path.

[0078] This embodiment utilizes a complementary interlocking structure of the first limiting rib 214 and the second limiting rib 264. The shapes and dimensions of the first limiting rib 214 and the second limiting rib 264 are matched and interlocked to ensure a tight fit after the dedicated area cover 26 is installed, effectively clamping the air duct foam 24. This not only simplifies the installation process but also improves the overall stability and durability of the structure.

[0079] Another embodiment of this application provides a refrigerator 100, see reference to Figure 11 As shown, it includes: a box liner 1 and a special drawer 2, as described in any of the above embodiments, disposed within the box liner 1.

[0080] As can be seen from the above, this application provides a dedicated drawer and refrigerator. The drawer is refrigerated through a semiconductor refrigeration module, achieving a true sealed state without exchanging cold air with the refrigerator compartment. This solves the problems of complex temperature and humidity control structures in existing dedicated drawers, temperature fluctuations being easily affected by factors such as defrosting in the refrigerator refrigeration system, difficulty in achieving constant temperature and humidity, and odor transfer between the drawer and the refrigerator compartment. It also provides a refrigeration-heating conversion drawer, which utilizes the characteristic that the cold and hot ends of the semiconductor module can switch according to the direction of current input. The drawer can be switched from refrigeration to heating for storing tropical fruits or defrosting meat.

[0081] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

Claims

1. An enclave drawer characterized by, The application relates to a sealed cavity (21) and a drawer (22) slidingly arranged in the sealed cavity (21), wherein the front part of the sealed cavity (21) forms an open special-area drawer storage space which is completely sealed when the drawer (22) is closed. The application further comprises a wind channel foam (24) covering the top part of the sealed cavity (21) and a semiconductor refrigeration module (25) embedded in the wind channel foam (24). The top part of the wind channel foam (24) is concave to form a hot-end wind channel (241), and the bottom part is concave to form a cold-end wind channel (242). The semiconductor refrigeration module (25) comprises a semiconductor refrigeration sheet (251), a cold-end aluminum block (252) and a hot-end aluminum block (253). The cold-end aluminum block (252) is fixed in the cold-end wind channel (242), the hot-end aluminum block (253) is fixed in the hot-end wind channel (241), and the semiconductor refrigeration sheet (251) is arranged between the cold-end aluminum block (252) and the hot-end aluminum block (253). The semiconductor refrigeration module (25) further comprises a connecting aluminum block (254) and a heat insulation foam (255).

2. The enclave drawer of claim 1, wherein, The cold-end aluminum block (252) and the hot-end aluminum block (253) are fixedly connected through the connecting aluminum block (254), the connecting aluminum block (254) is embedded in the heat insulation foam (255), and the cold-end aluminum block (252) and the hot-end aluminum block (253) are arranged on the two sides of the heat insulation foam (255) respectively. An external power supply is connected to the semiconductor refrigeration sheet (251), and the current input direction of the external power supply is reversible.

3. The enclave drawer of claim 2, wherein, A through hole (243) is arranged in the middle part of the hot-end wind channel (241).

4. The enclave drawer of claim 2, wherein, The step surface of the heat insulation foam (255) is attached to the step surface of the through hole (243), and the thickness of the heat insulation foam (255) is consistent with the depth of the through hole (243), so that the cold-end wind channel (242) and the hot-end wind channel (241) are sealed. A fixing screw column (213) is arranged on the top part of the sealed cavity (21) below the through hole (243).

5. The enclave drawer of claim 4, wherein, The fixing screw column (213) penetrates into the semiconductor refrigeration module (25), and the semiconductor refrigeration module (25) is fixed on the top part of the sealed cavity (21) through the fixing screw column (213). The special-area drawer (2) further comprises a special-area cover plate (26) buckled on the top part of the sealed cavity (21).

6. The enclave drawer of claim 1, wherein, The special-area cover plate (26) extrudes the wind channel foam (24), so that the cold-end wind channel (242) and the sealed cavity (21) and the hot-end wind channel (241) and the special-area cover plate (26) are sealed. A cold-end return air outlet (211) is arranged on the rear part of the top surface of the sealed cavity (21), and a cold-end air supply outlet (212) is arranged on the middle part.

7. The enclave drawer of claim 1, wherein, The special-area drawer (2) further comprises a cold-end fan (23), the cold-end fan (23) is arranged in the front part of the cold-end wind channel (242) close to the cold-end return air outlet (211), the cold-end aluminum block (252) is arranged in the middle part of the cold-end wind channel (242), and the cold-end air supply outlet (212) is arranged in the rear part of the cold-end wind channel (242). ​ 8. The enclave drawer of claim 6, wherein, The special area cover plate (26) is provided with a boss (261) protruding upward on top thereof; The boss (261) is provided with a hot end air inlet (262) at the front portion and a hot end air outlet (263) at the rear portion, the hot end air inlet (262) extending to the top of the hot end aluminum block (253), and the hot end air outlet (263) being located at the rear side of the hot end aluminum block (253).

9. The enclave drawer of claim 6, wherein, The top surface of the sealing cavity (21) is provided with a first limiting rib (214) at the joint with the air duct foam (24), and the bottom of the special area cover plate (26) is provided with a second limiting rib (264); The first limiting rib (214) and the second limiting rib (264) are embedded, and the air duct foam (24) is fixed between the sealing cavity (21) and the special area cover plate (26) through the first limiting rib (214) and the second limiting rib (264).

10. A refrigerator characterized by comprising: Comprising: A box body (1) and a special area drawer (2) as claimed in any one of claims 1-9 arranged in the box body (1).

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