A vapor chamber with micro-protrusions for efficient heat dissipation, manufacturing method, and heat dissipation system

Abstract

The present invention provides a high-efficiency heat dissipation vapor chamber with micro-protrusions and a manufacturing method thereof. The vapor chamber comprises a housing consisting of a micro-protrusion cover plate and a base plate, a first flat screen and a first spiral woven screen sintered with the cover plate, a second flat screen and a second spiral woven screen sintered with the base plate, a powder ring connecting the first and second flat screens, and support columns. The vapor chamber cover plate and base plate are both made of JCC material, ensuring that the plates do not sag after diffusion welding. The spiral woven screen and flat screen composite wick are sintered as a single piece and then laser-cut. This method effectively secures the spiral woven screen in place within the flat screen, preventing interference between the spiral woven screen and the copper columns. The base plate is provided with welded fins, and the entire heat dissipation system is also equipped with a centrifugal fan. The vapor chamber of the present invention has high thermal conductivity, low thermal resistance, and resistance to gravity, and can quickly transfer heat from the CPU to the heat dissipation fins for dissipation.

Description

Technical Field

[0001] The present invention relates to the field of chip heat dissipation, and in particular to a high-efficiency heat dissipation vapor chamber with micro-protrusions and a manufacturing method thereof. Background Art

[0002] With the rapid development of the Internet industry, laptops and other communication devices are developing towards being lighter, thinner and smaller. However, the increase in chip power causes the chips of laptops and other communication devices to generate a larger heat flux density when they are running, resulting in excessive chip temperatures, loss of frequency and overclocking. Therefore, heat dissipation becomes particularly important.

[0003] Traditional laptops and other communication devices use multiple flattened heat pipes to dissipate heat from chips through a segmented composite liquid-wick structure. However, the performance improvement space for this cooling solution has gradually reached its peak. Currently, some gaming laptops use heat spreaders for heat dissipation. However, the width of the condensing end of thin and light laptops and other communication devices is limited, making it difficult to design an efficient heat spreader. However, with the development of the Internet and the increase in chip power, the research and development of efficient heat spreaders suitable for thin and light laptops and electronic equipment has become a focus. Summary of the Invention

[0004] In order to improve multiple technical problems, the present invention provides a heat spreader with micro-protrusions and an efficient heat dissipation method. From the perspective of heat dissipation, the heat spreader with micro-protrusions and an efficient heat dissipation method has high thermal conductivity and low thermal resistance. The heat of the chip can be transferred to the heat dissipation fins and dissipated in a short time, so that the high-power chip can meet the working range.

[0005] A heat spreader with micro-protrusions and high efficiency heat dissipation, comprising a shell consisting of a cover plate with micro-protrusions and a bottom plate, a support column as a support, a heat source CPU, heat dissipation fins, a heat dissipation fan and an internal liquid absorption core;

[0006] The internal liquid-absorbing core comprises: a first plane screen and a first spiral woven screen sintered together with the cover plate, a second plane screen and a second spiral woven screen sintered together with the bottom plate, and a powder ring connected to the first plane screen and the second plane screen;

[0007] The working fluid inside the heat spreader is deionized water. When the heat source CPU is working, the heat is transferred to the second flat screen and the second spiral woven mesh at the evaporation end through heat conduction. The deionized water around the second flat screen and the second spiral woven mesh evaporates and absorbs heat to become gas. The gas flows to the condensation end under the action of pressure. Under the action of the cooling fan, the cooling fins and micro-protrusions perform forced convection heat exchange with the air to reduce the temperature of the cover and the bottom plate. At this time, the gas releases heat and liquefies into liquid. Part of the liquid flows to the cover liquid absorption core under the action of gravity, and the other part flows to the cover liquid absorption core. The liquid flows to the evaporation end under the capillary force of the spiral woven mesh and the flat screen. The working fluid at the bottom plate flows into the cover plate through the powder ring at the evaporation end for further heat exchange, thereby forming a gas-liquid cycle.

[0008] The width of the flat screen at the condensation end is 8 mm.

[0009] The first flat wire mesh adopts a 100-mesh wire mesh structure, the first spiral woven mesh is woven with a mixed wire diameter of 0.04mm and 0.05mm, and the width and height are 1.1mm and 0.19mm respectively; the second flat wire mesh adopts a 300-mesh + 100-mesh two-layer wire mesh structure, and the second spiral woven mesh is woven with a wire diameter of 0.04mm, and the width and height are 2mm and 0.24mm respectively; the wire diameter of the 300-mesh wire mesh is 0.03mm, and the wire diameter of the 100-mesh wire is 0.05mm.

[0010] The first and second planar wire meshes at the evaporation end are provided with sintered copper powder.

[0011] The diameter of the support column is 2 mm, and the distance between the center of the support column and the two ends of the flat screen at the condensation end is 3 mm.

[0012] The bottom plate has a thickness of 0.25 mm, the base plate of the cover plate has a thickness of 0.25 mm, the convex thickness of the cover plate has a thickness of 0.35 mm, and the materials used are JCC materials.

[0013] A method for manufacturing a heat spreader with micro-protrusions and high efficiency heat dissipation, comprising the following steps:

[0014] a) Processing cover plate, base plate and heat dissipation fins;

[0015] b) placing the spiral braided mesh into the groove of the annealing graphite mold for annealing and cooling to room temperature;

[0016] c) integrally sintering the flat wire mesh and the copper powder;

[0017] d) placing the spiral woven mesh into the groove of the first welded mesh graphite mold and sintering it with the copper powder composite flat wire mesh to form an integrated liquid wick;

[0018] e) After sintering, it is cut into the required shape by laser;

[0019] f) The one-piece sintered wire mesh is fixed on the bottom plate and the cover plate;

[0020] g) placing the support column in the circular groove of the second welded mesh graphite mold, pressing it onto the cover plate with the integral sintered wick, and placing it for resistance welding to sinter;

[0021] h) The bottom plate and the integrated sintered liquid wick are sintered by resistance welding of two rectangular graphite blocks;

[0022] i) Place the powder ring on some copper columns and rivet the upper and lower cover plates together;

[0023] j) placing the riveted soaking plate under the first diffusion welding graphite mold and the second diffusion welding graphite mold to weld them into one;

[0024] k) Weld the liquid filling port of the vapor chamber into one piece, anneal it, and then perform the first vacuuming process to make the vacuum degree inside the vapor chamber reach 30Pa~40Pa;

[0025] l) The second degassing process uses a 120°C hotplate to heat the vapor chamber, causing the non-condensable gas inside the vapor chamber to accumulate in the liquid injection tube. The liquid injection tube is then precisely cut to further reduce the non-condensable gas inside the vapor chamber, so that the vacuum inside the vapor chamber reaches 0.01Pa to 0.001Pa;

[0026] m) Seal and weld the cut portion of the injection tube connected to the soaking plate;

[0027] n) Solder the heat spreader and the heat sink fins.

[0028] The specific steps of steps d) and e) are as follows:

[0029] Step 1: Cut the flat wire mesh into a square shape and place it on the square graphite. Use the first welded mesh graphite mold with grooves to clamp and fix the annealed spiral woven mesh and press it on the square flat wire mesh. Place it in a vacuum sintering furnace with the flat wire mesh underneath the woven mesh. Before heating, evacuate the inner cavity of the sintering furnace and then fill it with a protective gas of 95% N2 and 5% H2. Then heat it to 900℃ and hold it at this temperature for 1 hour.

[0030] Step 2: After sintering, the woven mesh and the flat wire mesh are slightly melted at the contact position at high temperature and connected together. After cooling, the square graphite, flat wire mesh, first spiral woven mesh and first welded mesh graphite mold are placed integrally in the aluminum profile fixture fixed under the laser. The laser route is set in the laser system and the mesh is laser cut to form an integral sintered liquid-absorbing core.

[0031] The depth of the second groove of the first welded mesh graphite mold and the first groove of the second welded mesh graphite mold are both H. The method to determine the value of H is as follows:

[0032] The resistance welding pressure is set to P, the surface area of the base plate is A, and the pressure on the base plate is: F = P·A

[0033] The thickness of the bottom plate or cover plate is L0. Under the action of resistance welding pressure, the bottom plate is compressed by △L.

[0034] According to the knowledge of material mechanics, in order to reflect the degree of axial deformation of the tension and compression rods, the linear strain ε is defined as:

[0035]

[0036] According to Hooke's law, the linear strain ε of the axial section is proportional to the normal stress σ on the section, that is,

[0037]

[0038] From, here pressure P=σ, then

[0039]

[0040] According to the above formulas (1), (2), and (3), we can get:

[0041]

[0042] Assume the thickness of the spiral mesh is H 1， In order to avoid the capillary effect of the spiral mesh, the depth H of the strip groove should be:

[0043] H=△L+H1

[0044] The second diffusion welding graphite mold is provided with a groove, and the depth of the groove is 1 mm.

[0045] Avoid interference with the micro-protrusions with the cover plate.

[0046] Compared with the prior art, the present invention has the following beneficial effects:

[0047] The present invention provides a vapor chamber with micro-protrusions for efficient heat dissipation and a manufacturing method. Compared with existing technologies, the vapor chamber and heat dissipation system have the following advantages:

[0048] (1) A heat spreader with micro-protrusions and high efficiency heat dissipation is proposed. A cover plate and a base plate are both made of a flat wire mesh, a spiral woven mesh and copper powder. The integrated composite structure liquid absorption core design can effectively solve the problem of gas-liquid reflux in the narrow space inside the evaporation end of the heat spreader, and greatly improve the thermal conductivity of the heat spreader.

[0049] (2) The heat spreader has micro-bumps for efficient heat dissipation. Fins are welded on one side of the heat spreader and small micro-bumps are provided on the other side. The fins and micro-bumps effectively help cool the heat spreader, causing the gas at the evaporation end of the heat spreader to quickly liquefy into liquid, thereby speeding up the gas-liquid phase change and reflux speed of the heat spreader, and further improving the thermal conductivity of the heat spreader.

[0050] (3) The manufacturing method of the heat spreader with micro-protrusions and high efficiency heat dissipation proposed a method for manufacturing an integrated sintered liquid wick and a calculation method for grooving the graphite mold, which can effectively ensure the good capillary performance of the internal liquid wick. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 This is an overall exploded view of the heat sink and heat dissipation system according to an embodiment of the present invention.

[0052] Figure 2 This is an exploded view of a heat sink according to an embodiment of the present invention.

[0053] Figure 3 It is a three-dimensional diagram of an embodiment provided by the present invention having a microstructured cover.

[0054] Figure 4 This is an embodiment provided by the present invention Figure 3 A partial enlarged view.

[0055] Figure 5 This is a schematic diagram of the material of the present invention causing slight deformation when subjected to bending moment;

[0056] Figure 6 This is an embodiment of the present invention provided by the flat wire mesh and the spiral woven mesh placed in the graphite mold blasting attempt.

[0057] Figure 7 This is a three-dimensional view of the laser-cut, one-piece sintered wick provided in an embodiment of the present invention.

[0058] Figure 8 This is a view of the first welded mesh graphite mold according to an embodiment of the present invention.

[0059] Figure 9 This is a view of a fixed aluminum profile according to an embodiment of the present invention.

[0060] Figure 10 This is an exploded view of the sintering of the bottom plate, the integrated sintered liquid absorbent core and the support column according to the embodiment of the present invention.

[0061] Figure 11 This is a view of the second graphite mold according to an embodiment of the present invention.

[0062] Figure 12 This is a three-dimensional view of the second plane wire mesh, the second spiral woven mesh support column, and the powder ring and the base plate sintered together in an embodiment provided by the present invention.

[0063] Figure 13 This is an embodiment provided by the present invention Figure 12 A partial enlarged view of point B.

[0064] Figure 14 This is a three-dimensional view of the embodiment provided by the present invention, in which the first plane screen, the first spiral woven screen and the cover plate are sintered into one.

[0065] Figure 15 The invention provides an embodiment in which a flat wire mesh and a spirally woven mesh are sintered into an integrated sintered liquid absorbent core.

[0066] Figure 16 This is an explosive view of the diffusion welding of the heat sink provided in the embodiment of the present invention.

[0067] Figure 17 This is a view of an annealed graphite mold according to an embodiment of the present invention.

[0068] Figure 18 This is a view of the second diffusion welding graphite mold provided by the present invention.

[0069] Figure 19 This is a view of the specific positions of the evaporation end and the condensation end of the heat spreader provided by the present invention.

[0070] Figure 20 1 is a microscope view of a spiral woven mesh and a flat wire mesh according to an embodiment of the present invention.

[0071] Figure 21 This is a microscope view of a flat wire mesh and a flat wire mesh composite copper powder provided by an embodiment of the present invention.

[0072] The specific markings in the figure are as follows:

[0073] 101. Cover plate, 102. First flat screen, 103. First spiral woven screen, 104. Powder ring, 105. Support column, 106. Second spiral woven screen, 107. Second flat screen, 108. Bottom plate, 109. CPU, 1010. Heat sink fins, 1011. Cooling fan, 201. Square graphite, 202. Square flat screen, 203. First welded mesh graphite mold, 204. Aluminum profile fixing device, 2 05, laser head, 206, second welding mesh graphite mold, 207, first diffusion welding graphite mold, 208, second diffusion welding graphite mold, 209, annealing graphite mold, 301, aluminum profile fixing device mounting hole, 302, integrated sintered liquid wick, 303, evaporation end, 304, condensation end, 401, circular groove, 402, micro-protrusion, 403 substrate, 501, first strip groove, 502 second strip groove, 601, groove DETAILED DESCRIPTION

[0074] The present invention is described in detail below with reference to the embodiments and accompanying drawings. However, it should be understood that the embodiments and accompanying drawings are merely exemplary descriptions of the present invention and do not constitute any limitation on the scope of protection of the present invention. All reasonable variations and combinations within the scope of the inventive concept of the present invention fall within the scope of protection of the present invention.

[0075] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting the present invention. The terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In addition, unless otherwise expressly specified and limited, the terms "disposed", "installed", "connected", and "connected" should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrally connected; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium, or they can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0076] The present invention will be further described below with reference to the accompanying drawings.

[0077] Example 1

[0078] like Figure 1 and Figure 2 As shown, a micro-protrusion high-efficiency heat dissipation vapor chamber comprises a shell composed of a cover plate 101 with micro-protrusions 402 and a bottom plate 108, a support column 105 as a support, a heat source CPU 109, heat dissipation fins 1010 and a heat dissipation fan 1011 and an internal liquid wick; the internal liquid wick structure comprises a sintered cover plate as shown in FIG. Figure 20 a first flat screen 102 and a first spirally woven screen 103, a second flat screen 107 and a second spirally woven screen 106 sintered together with the bottom plate, and a powder ring 104 connected to the first flat screen 102 and the second flat screen 107;

[0079] The working medium inside the heat plate is deionized water. When the heat source CPU109 is working, the heat generated is transferred to the heat source through heat conduction. Figure 19As shown, the second plane screen 107 and the second spiral woven mesh 106 are at the evaporation end 303. The deionized water around the second plane screen 107 and the second spiral woven mesh 106 evaporates and absorbs heat to become gas. The gas flows to the condensation end 304 under the action of pressure. Under the action of the cooling fan 1011, the cooling fins 1011 and the micro-protrusions 402 perform forced convection heat exchange with the air to reduce the temperature of the cover plate and the bottom plate. At this time, the gas releases heat and liquefies into liquid. Part of the liquid flows to the liquid absorption core with the cover plate 101 under the action of gravity, and the other part flows to the liquid absorption core of the cover plate 108. The liquid flows to the evaporation end 303 under the capillary force of the spiral woven mesh and the plane screen. The working medium at the bottom plate flows into the cover plate 101 through the powder ring at the evaporation end 303 for further heat exchange, thereby forming a gas-liquid cycle.

[0080] The spiral woven mesh has a large axial capillary force, which can effectively bring the working medium from one side to the other side, and the flat screen can diffuse the working medium to the surrounding areas. Therefore, the composite liquid absorbent core of the flat screen and the spiral woven mesh can well solve the problem of quickly bringing the liquid to the evaporation end 303 in the narrow flow channel of the condensation end 304; the 300-mesh flat screen has a smaller aperture, and the 100-mesh flat screen has a larger aperture. The knot of the 300-mesh and 100-mesh double-layer mesh forms a V-shaped aperture shape, which is conducive to bubble separation, and the diameter of the bottom plate 108 is in contact with the heat source. The second flat screen 107 adopts a 300-mesh + 100-mesh two-layer screen structure. The permeability of the 100-mesh flat screen is higher than that of the 300-mesh flat screen, and the gas channel is larger, the gas resistance is smaller, and the gas flow rate is faster, which is conducive to reducing thermal resistance. Therefore, the first flat screen 102 only uses a 100-mesh flat screen, the wire diameter of the 300-mesh wire mesh is 0.03mm, and the wire diameter of the 100-mesh wire mesh is 0.05mm. The first spiral braided mesh 103 is made of mixed wire diameters of 0.04mm and 0.05mm, with a width and height of 1.1mm and 0.19mm respectively. The second spiral braided mesh 106 is made of wire diameters of 0.04mm, with a width and height of 2mm and 0.24mm respectively. Due to limited space, there is no powder ring distribution at the condensation end 304. There is sintered copper powder on the flat wire mesh at the evaporation end 303. Figure 21 .

[0081] like Figure 3 and Figure 4 As shown, the bottom plate 108 has a thickness of 0.25 mm, the base plate of the cover plate 101 has a thickness of 0.25 mm, and the micro protrusion 402 of the cover plate 101 has a thickness of 0.35 mm, and all are made of JCC material.

[0082] When the vapor chamber is placed in a diffusion welding furnace and the upper and lower covers are welded, the gas inside the vapor chamber will flow out from the interior of the vapor chamber after being heated, causing the internal air pressure to decrease. Due to the difference in air pressure between the interior of the vapor chamber and the outside air pressure, a uniform load is generated on the upper and lower covers of the vapor chamber, so the plate will generate a bending moment Me ,like Figure 5 As shown, the material will produce a small deformation when subjected to bending moment, and the deformation curvature formula is:

[0083]

[0084] Where: ρ is the radius of the material after bending, and E is the elastic modulus.

[0085] Assume that the cross section of the heat spreader cover and bottom plate is rectangular, with thickness h and width b. z The formula is:

[0086]

[0087] JCC material has alloy elements added to oxygen-free copper C1020, which increases the complexity of the alloy's lattice structure. Therefore, the hardness and elastic modulus of JCC material are higher than those of oxygen-free copper C1020. Assuming that the shape and size of the plate are the same, the above formula M e and I z Similarly, the larger the elastic modulus E, the larger the radius ρ after material deformation, and the less obvious the deformation. Therefore, in the case of thinner plates, JCC material is less likely to be dented after diffusion welding than oxygen-free copper C1020 material.

[0088] Example 2 The present invention further provides a method for manufacturing a heat sink with micro-protrusions and high efficiency heat dissipation, the steps of which are as follows:

[0089] a) Processing the cover plate 101, the base plate 108, and the heat dissipation fins 1010;

[0090] b) Place the spiral braided mesh into the Figure 17 Annealing is performed in the groove of the annealing graphite mold 209 and cooled to room temperature;

[0091] c) integrally sintering the flat wire mesh and the copper powder;

[0092] d) placing the spiral woven mesh into the groove of the first welded mesh graphite mold 203 and sintering it with the copper powder composite flat wire mesh to form an integrated liquid wick;

[0093] e) After sintering, it is cut into the required shape by laser;

[0094] f) An integrally sintered wire mesh is fixed on the bottom plate 108 and the cover plate 101;

[0095] g) Place the support column 105 in the circular groove 401 of the second graphite mold 206 and press it on the cover plate with the integrated sintered wick, and place it for resistance welding to sinter, as shown in FIG. Figure 10 ;

[0096] h) The bottom plate 101 and the integrated sintered liquid wick are sintered by resistance welding using two rectangular graphite blocks;

[0097] i) Place the powder ring on some copper columns and rivet the upper and lower cover plates together;

[0098] j) The riveted heat sink is placed under the first diffusion welding graphite mold 207 and the second diffusion welding graphite mold 208 and welded into one piece. Figure 16 ;

[0099] k) Weld the liquid filling port of the vapor chamber into one piece, anneal it, and then perform the first vacuuming process to make the vacuum degree inside the vapor chamber reach 30Pa~40Pa;

[0100] l) The second degassing process uses a 120°C hotplate to heat the vapor chamber, causing the non-condensable gas inside the vapor chamber to accumulate in the liquid injection tube. The liquid injection tube is then precisely cut to further reduce the non-condensable gas inside the vapor chamber, so that the vacuum inside the vapor chamber reaches 0.01Pa to 0.001Pa;

[0101] m) Seal and weld the cut portion of the injection tube connected to the soaking plate;

[0102] n) Soldering the heat spreader and the heat sink fins 204.

[0103] like Figure 6 、 Figure 7 As shown, the specific steps of steps d) and e) are as follows:

[0104] Step 1: Cut the flat screen 202 into a square shape and place it on the square graphite 201. Figure 8 The first welded mesh graphite mold 203 with grooves shown clamps and secures the annealed spiral woven mesh 103. It then presses the square flat mesh 202 onto the mesh. The mesh is then placed in a vacuum sintering furnace, with the flat mesh underneath the woven mesh. Before heating, the furnace is evacuated and then filled with a protective gas of 95% N2 and 5% H2. The temperature is then raised to 900°C and held constant for one hour.

[0105] Step 2: The sintered woven mesh and the flat screen mesh are slightly melted at the contact position at high temperature and connected together. After cooling, the square graphite 201, the square flat screen mesh 202, the spiral woven mesh 103 and the first welding mesh graphite mold 203 are placed together under the laser and fixed as shown in the figure. Figure 9 The aluminum profile fixing device 204 is shown, and a laser route is set in the laser system to perform laser cutting, and finally form an integrated sintered liquid absorbent core 302, as shown in FIG. Figure 15 shown.

[0106] according to Figure 8 and Figure 11As shown, the depth of the second groove 502 of the first welding mesh graphite mold 203 and the first groove 501 of the second welding mesh graphite mold 206 are both H. The method for determining the value of H is as follows:

[0107] The resistance welding pressure is set to P, the surface area of the base plate is A, and the pressure on the base plate is: F = P·A

[0108] The thickness of the bottom plate 101 or the cover plate 108 is L0. Under the resistance welding pressure, the bottom plate is compressed by △L.

[0109] According to the knowledge of material mechanics, in order to reflect the degree of axial deformation of the tension and compression rods, the linear strain ε is defined as:

[0110]

[0111] According to Hooke's law, the linear strain ε of the axial section is proportional to the normal stress σ on the section, that is:

[0112]

[0113] From, here pressure P=σ, then:

[0114]

[0115] According to the above formulas (1), (2), and (3), we can get:

[0116]

[0117] Assume the thickness of the spiral mesh is H 1， In order to avoid the capillary effect of the spiral mesh, the depth H of the strip groove should be:

[0118] H=△L+H1

[0119] like Figure 18 As shown, the second diffusion welding graphite mold 208 is provided with a groove 601 , and the depth of the groove 601 is 1 mm to avoid interference with the micro protrusion 402 of the cover plate 101 .

[0120] The above embodiments are merely preferred embodiments of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of protection of the present invention are within the scope of protection of the present invention. It should be noted that improvements and modifications that can be made by a person skilled in the art without departing from the principles of the present invention are also considered to be within the scope of protection of the present invention.

Claims

1. A heat spreader with micro-protrusions and high efficiency heat dissipation, characterized in that: The housing comprises a cover plate (101) and a bottom plate (108), a support column (105) as a support, a heat source CPU (109), heat dissipation fins (1010), a heat dissipation fan (1011) and an internal liquid absorption core; the cover plate (101) is provided with a micro-protrusion (402); The internal liquid-absorbing core comprises: a first plane screen (102) and a first spiral woven screen (103) sintered together with the cover plate (101), a second plane screen (107) and a second spiral woven screen (106) sintered together with the bottom plate (108), and a powder ring (104) connected to the first plane screen (102) and the second plane screen (107); the width of the plane screen at the condensation end (304) is 8 mm; the first plane screen (102) adopts a 100-mesh screen structure, and the first spiral woven screen (103) adopts a The width and height of the mixed braided wires of 0.04 mm and 0.05 mm are 1.1 mm and 0.19 mm respectively, the second plane screen (107) adopts a two-layer screen structure of 300 mesh and 100 mesh, the second spiral braided screen (106) adopts a 0.04 mm wire diameter and has a width and height of 2 mm and 0.24 mm respectively, the 300 mesh screen has a wire diameter of 0.03 mm, and the 100 mesh screen has a wire diameter of 0.05 mm; the first plane screen (102) and the second plane screen (107) at the evaporation end (303) have sintered copper powder; The working medium inside the heat spreader is deionized water. When the heat source CPU (109) is working, the heat generated is transferred to the second plane screen (107) and the second spiral woven mesh (106) at the evaporation end (303) by heat conduction. The deionized water around the second plane screen (107) and the second spiral woven mesh (106) evaporates and absorbs heat to become gas. The gas flows to the condensation end (304) under the action of the heat dissipation fan (1011). Under the action of the heat dissipation fan (1011), the heat dissipation fins (1010) and the micro-protrusions (402) Forced convection heat exchange is performed with the air to reduce the temperature of the cover plate and the bottom plate. At this time, the gas releases heat and liquefies into liquid. Part of the liquid flows to the internal liquid absorption core of the cover plate (101) under the action of gravity, and the other part flows to the internal liquid absorption core of the bottom plate (108). The liquid flows to the evaporation end (303) under the capillary force of the spiral woven mesh and the flat wire mesh. The working medium at the bottom plate (108) flows into the cover plate (101) through the powder ring at the evaporation end (303) for further heat exchange, thereby forming a gas-liquid cycle.

2. The high-efficiency heat dissipation vapor chamber with micro-protrusions according to claim 1, characterized in that: The support column (105) has a diameter of 2 mm.

3. The heat sink with micro-protrusions and high efficiency heat dissipation according to claim 1, characterized in that: The bottom plate (108) has a thickness of 0.25 mm, the base plate (403) of the cover plate (101) has a thickness of 0.25 mm, and the micro-protrusion (402) of the cover plate (101) has a thickness of 0.35 mm.

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