Method and equipment for detecting wafer cassette before cleaning

Abstract

The invention provides a method and equipment for detecting a wafer box before cleaning, and the method comprises the steps: collecting an internal image of the wafer box before the wafer box is cleaned; judging whether the wafer box is in an abnormal state or not based on the internal image of the wafer box; and when the wafer box is judged not to be in the abnormal state, transferring the wafer box to wafer box cleaning equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing technology, and in particular to a detection method and equipment before wafer box cleaning. Background Art

[0002] As materials for manufacturing integrated circuits, wafers are usually very fragile and susceptible to physical and chemical damage. In the field of wafer manufacturing, front-opening wafer transfer boxes (FOUPs) are usually used in large quantities to load wafers for safe storage, transportation and handling of wafers. Due to the particularity of wafer application requirements, the wafer manufacturing field also has strict standards for the cleanliness and humidity of wafer carriers, such as FOUPs. Therefore, after each use, the FOUP (which may also be referred to as a wafer box in this disclosure) needs to be cleaned.

[0003] FOUPs usually have a long service life, and during long-term use, there is a high probability that parts will age, deform, or be missing. During the cleaning process of a FOUP with these abnormalities, parts are likely to fall off, which not only makes it impossible to clean the FOUP thoroughly, but also may cause contamination and damage to the wafer box cleaning equipment. These abnormalities may even cause the wafer box after cleaning to have an adverse effect on the quality of the wafers it carries. Summary of the invention

[0004] The present disclosure provides a detection method and equipment for wafer box before cleaning; the abnormal conditions of the wafer box can be detected in time before cleaning, so as to avoid the abnormal wafer box from causing pollution and damage to the wafer box cleaning equipment, and reduce the adverse effects of the wafer box on the wafer quality.

[0005] The technical solution of the present disclosure is achieved as follows: In a first aspect, the present disclosure provides a detection device before wafer box cleaning, the detection device comprising: an inspection chamber for housing wafer cassettes; A photographing device housed in the inspection chamber, the photographing device being configured to extend into the interior of the wafer box and capture an internal image of the wafer box; a determination section configured to determine whether the wafer box is in an abnormal state based on the internal image of the wafer box; The transfer part is configured to transfer the wafer box to a wafer box cleaning device when the wafer box is determined not to be in an abnormal state.

[0006] In a second aspect, the present disclosure provides a detection method before wafer box cleaning, the detection method comprising: Before the wafer box is cleaned, capturing an internal image of the wafer box; determining whether the wafer box is in an abnormal state based on the internal image of the wafer box; When the wafer box is determined not to be in an abnormal state, the wafer box is transferred to a wafer box cleaning device.

[0007] The present disclosure provides a detection method and equipment before cleaning a wafer box; before cleaning the wafer box, an internal image of the wafer box is collected and based on the image, it is determined whether the wafer box is abnormal; when it is determined that the wafer box is not in an abnormal state, the wafer box is transferred to a cleaning device for cleaning, so that the abnormality of the wafer box can be detected in time before cleaning, thereby avoiding contamination and damage to the wafer box cleaning equipment by the abnormal wafer box, and reducing the adverse effects of the wafer box on the wafer quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A front view schematic diagram of a wafer box provided by the present invention.

[0009] Figure 2 A schematic diagram of an exploded view of a wafer box provided in the present invention.

[0010] Figure 3 A schematic diagram of a wafer holder provided by the present invention.

[0011] Figure 4 A schematic diagram of the composition of a wafer box pre-cleaning inspection device provided by the present invention.

[0012] Figure 5 This is a schematic diagram of the captured image of the sealing strip provided by the present invention when it is deformed and bent.

[0013] Figure 6 A schematic diagram of a captured image of a sealing strip provided by the present invention when the corners are warped.

[0014] Figure 7 A schematic diagram of the captured images of the shelf provided in the present invention when it is in a bent state.

[0015] Figure 8 A schematic diagram of the collected images when the shelf provided by the present invention is damaged.

[0016] Fig. 9 This is a captured image showing that the heat sink on the left side of the wafer box provided by the present invention is missing.

[0017] Fig.10 A schematic diagram of an abnormal state of the fingers of the wafer holder provided by the present invention.

[0018] Fig.11 A schematic diagram of an abnormal state of wafers in a wafer box provided by the present invention.

[0019] Fig.12 A schematic diagram of the composition of another wafer box pre-cleaning inspection device provided by the present invention.

[0020] Fig.13 A schematic flow chart of a wafer box pre-cleaning inspection method provided in the present invention. DETAILED DESCRIPTION

[0021] The technical solutions in the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings in the present disclosure.

[0022] Figure 1 FIG. 1 is a front view schematic diagram of a wafer box (FOUP) 110. Figure 1 As shown, the wafer box 110 includes a door 111 and a shell 113. The door 111 is coupled to the shell 113 and forms a closed internal space. The door 111 can be coupled to the shell 113 by mechanically latching or suction fitting in a corresponding opening of the shell 113; or alternatively, the door 111 can be coupled to the shell 113 on one of the top, bottom, or either side of the corresponding opening of the shell 113 (e.g., via a hinge). In at least one example, the door of the wafer box can be coupled to the shell of the wafer box on the bottom opening of the shell.

[0023] Figure 2 FIG. 1 is a schematic diagram of an exemplary wafer box 110. Figure 2 In the embodiment, the door 111 is removed (eg, opened) and separated from the housing 113. Figure 2 As shown in FIG. 1 , the housing 113 defines an interior space 117 of the wafer cassette 110 in which substrates may be stored.

[0024] The housing 113 may include an opening 119 that may be closed by a door 111 coupled to the housing 113. For example, the door 111 may be coupled to the housing 113 by fitting the door 111 into the opening 119 of the housing 113. In at least one example, one or more of the door 111 and the housing 113 may include a locking mechanism (not shown) to prevent inadvertent opening or removal of the door 111. In at least another example, the opening of the housing 113 may be at the bottom of the housing.

[0025] like Figure 2 As shown in FIG. 1 , the housing 113 may further include a first sidewall 114, a second sidewall 116, a rear wall 118, and a top wall 120 and a bottom wall 122. In some examples, the first sidewall 114 may be opposite and parallel to the second sidewall 116, separated by the top wall 120 and the bottom wall 122.

[0026] The top wall 120 and the bottom wall 122 each extend between the first side wall 114 and the second side wall 116. In some examples, the top wall 120 may be opposite and parallel to the bottom wall 122, separated by the first side wall 114 and the second side wall 116. The bottom wall 122 includes an edge 124A extending along the front opening 119. The edge 124A also extends between the first side wall 114 and the second side wall 116 of the housing 113. The first side wall 114 includes an edge 124B extending along the front opening 119. The edge 124B of the first side wall 114 also extends between the top wall 120 and the bottom wall 122 of the housing 113. In some examples, the front edges 124A and 124B are perpendicular to each other and define the front opening 119.

[0027] The wafer box 110 may include an equipment connector (also referred to as an "automation flange") 126 on the top wall 120 of the housing 113. In some examples, the equipment connector 126 may include one or more handles (not shown) to allow a user (e.g., a technician, etc.) to manually move the wafer box 110.

[0028] Wafer box 110 may further include a plurality of shelves 115 for holding wafers in interior space 117. In some examples, interior space 117 includes the inner walls / surfaces of walls 114, 116, 118, 120, and / or 122. The portion of shelf 115 on the inner surface of second side wall 116 is Figure 2 The shelves 115 on the inner surfaces of the walls 114 and 116 may be configured to cooperatively hold wafers (not shown) within the interior space 117. For example, adjacent shelves 115 may form and / or define slots to hold wafers of a specific size (e.g., 300 mm wafers, etc.).

[0029] In some examples, when the door 111 of the wafer box 110 is opened, a cleaning fluid can be supplied to the interior space 117 to reduce the external environment (e.g., gas, particles, moisture, etc.) from entering the wafer box 110 through the front opening 119. For example, the supplied cleaning fluid can flow out of the interior space 117 through the front opening 119, thereby reducing any gas or substance from flowing inwardly into the interior space 117 through the front opening 119. The cleaning fluid can be a liquid or an inert gas, such as nitrogen. The cleaning fluid can also be clean dry air (CDA) or ultra-clean dry air (xCDA). The cleaning fluid can further be any gas used to condition the wafer or any other suitable gas.

[0030] In some examples, the bottom wall 122 of the wafer box 110 includes cleaning ports (112A, 112B, 112C) for supplying cleaning fluid into the interior space 117. In some examples, one or more of the cleaning ports (112A, 112B, 112C) can be configured as an inlet cleaning port or an outlet cleaning port. That is, the cleaning ports (112A, 112B, 112C) can allow, for example, a cleaning fluid (e.g., nitrogen) to flow into the wafer box 110, and can also allow the cleaning fluid to flow out of the wafer box 110. In some examples, the inlet / outlet cleaning ports can be disposed on the side wall of the wafer box 110.

[0031] In addition to the above structure, in some examples, a wafer retainer 130 is provided at the door 111 of the wafer box 110, such as Figure 3 As shown, the retainer 130 includes a plurality of retainer fingers 131 for enclosing wafers, which engage with the wafers in the wafer box 110 to bias them securely in the narrow grooves formed and / or defined by the shelf 115 in the wafer box 110, thereby protecting the wafers from chipping, pitting and / or wear.

[0032] For the above wafer box 110, if the parts are aged, deformed or missing after long-term use, it is easy to cause the parts to fall off, deform, or be damaged during the cleaning process, which not only makes the FOUP unable to be cleaned thoroughly, but also may cause pollution and damage to the wafer box cleaning equipment. In order to avoid the above situation, it is necessary to detect the abnormality of the wafer box 110 before cleaning. In combination with the above exemplary wafer box 110, see Figure 4 , which shows a wafer box cleaning detection device 40 provided by the present disclosure, comprising: An inspection chamber 41 for accommodating a wafer box 110; A photographing device 42 housed in the inspection room, wherein the photographing device 42 is configured to extend into the interior of the wafer box 110 and capture an internal image of the wafer box; A determination section 43 is configured to determine whether the wafer box 110 is in an abnormal state based on the internal image of the wafer box 110; The transfer part 44 is configured to transfer the wafer box 110 to a wafer box cleaning device when the wafer box 110 is determined not to be in an abnormal state.

[0033] In the present disclosure, the detection equipment 40 can be used as a front-end process equipment of the wafer box cleaning equipment. For example, the detection equipment 40 can be set at the loading port of the wafer box cleaning equipment. After the wafer box to be cleaned is placed on the loading port of the cleaning equipment, it is first inspected by the detection equipment 40. When the detection result indicates that the wafer box to be cleaned is not in an abnormal state, it is transferred to the wafer box cleaning equipment through the transfer part 44.

[0034] In addition, the detection device 40 can also be used as a part of the wafer box cleaning equipment. For example, in the wafer box cleaning equipment, it usually includes a cleaning chamber that can accommodate the wafer box and perform a cleaning process. The detection device 40 can be arranged between the loading port and the cleaning chamber. When it is detected that the wafer box is not in an abnormal state, the wafer box can be transferred to the cleaning chamber to perform the cleaning process.

[0035] In some examples, the transfer portion 44 can be implemented as a robotic arm capable of holding or stably clamping a wafer box, which can not only transfer the wafer box from the loading port of the wafer box cleaning equipment to the inspection chamber 41, but also move the wafer box out of the inspection chamber 41 and transfer it to the wafer box cleaning equipment.

[0036] In some examples, the inspection chamber 41 has an internal space 411 to accommodate the wafer box moved in by the transfer part 44, and a shooting device 42 is also arranged in the internal space 411. The shooting device 42 can be implemented as a camera with an image sensor, such as an industrial camera, a CCD camera, etc.

[0037] In addition, the photographing device 42 also has a bracket that enables the camera to move freely in the internal space 411, such as a three-axis or five-axis linkage bracket. The camera is fixed on the bracket so that the camera can move and turn with multiple degrees of freedom in the internal space 411. Corresponding to the wafer box being placed in a manner facing the mouth during cleaning, the wafer box 110 is also placed in a manner facing the mouth in the inspection chamber 41, that is, the door 111 of the wafer box is opened and the front opening 119 is not in a closed state. In this case, the camera in the photographing device 42 can extend into the internal space 117 of the wafer box based on the movement and turning of the bracket, and obtain the internal image of the wafer box through the camera.

[0038] In addition, the bracket is not limited to the above-mentioned form, and for example, it may also include: a rotating table for holding the camera; a motor connected to the rotating table to rotate the rotating table; and a stop mechanism that stops the rotating table at an arbitrary angle.

[0039] In some examples, the determination part 43 may be implemented as a processor that performs data processing by running or executing instructions, programs, code sets or instruction sets. The processor may be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). In addition, the processor may integrate a central processing unit (CPU), a graphics processing unit (GPU), a neural network processor (NPU), and a baseband chip, etc. One or a combination of several. In addition, the processor can use various interfaces and lines to connect various devices or devices inside and outside the entire detection device 40, such as the processor can be connected to the camera in the shooting device 42 to obtain the internal image of the wafer box captured by the camera. The processor can also be connected to the transfer part 44 to transmit a transfer instruction to the transfer part 44. The processor can also be connected to other devices outside the detection device 40, which will not be described in detail in this disclosure.

[0040] Specifically, after receiving the internal image of the wafer box, the processor determines whether the wafer box is in an abnormal state by running or executing instructions, programs, code sets or instruction sets, and when it is determined that it is not an abnormal state, it sends an instruction to the transfer part 44 to instruct the transfer part 44 to move the wafer to be tested out of the inspection chamber 41 and transfer it to the wafer box cleaning equipment.

[0041] according to Figure 4 The detection equipment 40 shown, before the wafer box is cleaned, collects the internal image of the wafer box and determines whether the wafer box is abnormal based on the image. When it is determined that the wafer box is not in an abnormal state, the wafer box is transferred to the cleaning equipment for cleaning. The abnormality of the wafer box can be detected in time before cleaning, thereby avoiding contamination and damage to the wafer box cleaning equipment by the abnormal wafer box, and reducing the adverse effects of the wafer box on the wafer quality.

[0042] for Figure 4 In some possible implementations of the technical solution shown, the determination section 43 is configured to compare the internal image of the wafer box with a set standard image, and determine whether the wafer box is in an abnormal state based on the comparison result.

[0043] In this implementation, the standard image can be an internal image of a wafer box in a normal and usable state, that is, an internal image of a wafer box without abnormal conditions such as aging, deformation or missing of accessories. After receiving the internal image of the wafer box transmitted by the shooting device 42, the judgment part 43 compares the internal image of the wafer box with the standard image. If the two are consistent, it can be said that there are no abnormal conditions such as aging, deformation or missing of accessories inside the wafer box, that is, the wafer box is not in an abnormal state, and the subsequent cleaning process can be performed. If the two are inconsistent, it means that there is a high possibility that the wafer box has an abnormal condition. In this case, the wafer box will not be transferred to the cleaning equipment to perform the cleaning process.

[0044] In some examples, if the internal image of the wafer box is inconsistent with the standard image, the wafer box can be further manually inspected to ultimately determine whether it is an abnormal state, and based on the final conclusion, determine whether to transfer the wafer box to the cleaning equipment to perform subsequent cleaning processes.

[0045] In some examples, the standard image may be taken from the interior of a new wafer cassette that has not been used.

[0046] for Figure 4 In some possible implementations of the technical solution shown, the determination part 43 is configured as follows: Acquire a captured image of a target component from an internal image of the wafer box; Compare the acquired image of each target component with the standard image corresponding to each target component; When the acquired images of all target components are consistent with the corresponding standard images, it is determined that the wafer box is not in an abnormal state; When the captured image of at least one target component among all the target components is inconsistent with the corresponding standard image, the wafer box is determined to be in an abnormal state.

[0047] For the above implementation, Figure 2Taking the internal structure of the wafer box shown as an example, since the internal space 117 of the wafer box includes the inner walls / surfaces of walls 114, 116, 118, 120 and / or 122, as well as accessories such as the shelf 115 and the wafer retainer (Retainer) 130 composed of multiple fingers 131, the camera of the shooting device 42 cannot clearly display the images of these parts and accessories in a single shot image. Therefore, the camera of the shooting device 42 can capture multiple internal images, each of which corresponds to at least one target component. For example, the target component may include the inner wall or surface of the internal space 117 of the wafer box, and may also include various accessories in the internal space 117, and may also include parts such as sealing strips and rubber strips used to seal the internal space 117. Accordingly, the standard image may also include standard images of various components inside the wafer box in a normal and usable state.

[0048] The determination part 43 compares the acquired image of each target component with the corresponding standard image of each target component. If the acquired images of all target components are consistent with the corresponding standard images, it can indicate that there are no abnormal conditions such as aging, deformation, damage or missing of accessories inside the wafer box, that is, the wafer box is not in an abnormal state and the subsequent cleaning process can be performed.

[0049] If the captured image of at least one target component among all target components is inconsistent with the corresponding standard image, it can be indicated that there is a high possibility that the at least one target component inconsistent with the standard image is abnormal. In this case, the wafer box will not be transferred to the cleaning equipment to perform the cleaning process. In some examples, if there is a target component inconsistent with the standard image, the wafer box can also be further manually inspected to finally determine whether it is an abnormal state, and determine whether to transfer the wafer box to the cleaning equipment to perform a subsequent cleaning process based on the final determination.

[0050] For the above implementation, in some examples, the target component includes at least one of a sealing strip inside the wafer box, a shelf disposed on the side wall of the wafer box, a heat sink disposed on the rear wall of the wafer box, and a wafer holder disposed at the door panel of the wafer box. Corresponding to these target components, when an abnormal situation occurs, the exemplary images collected are as follows: Figures 5 to 11 shown.

[0051] Taking the sealing strip as an example, the sealing strip under normal conditions should remain straight and in close contact with the bottom of the sealing strip at the corners without any gaps. Figure 5 and Figure 6 Two exemplary abnormal states of the sealing strip are shown respectively, wherein: Figure 5 The image captured when the sealing strip is deformed and bent is shown. Figure 6The captured image shows the state where the corners of the sealing strip are warped.

[0052] Taking the shelf arranged on the side wall of the wafer box to form a slot as an example, the shelf in a normal state should also remain horizontal and straight, and be complete without defects such as damage or pits. Figure 7 and Figure 8 Two exemplary abnormal states of the shelf are shown respectively, wherein: Figure 7 The captured image is shown when the shelf is bent. In this state, if the wafer enters the wafer box, the placement position of the wafer will change, causing scratches during the placement and removal process. Figure 8 The captured image when the shelf is damaged is shown, and defects such as pits or damage appear at the position indicated by the white arrow.

[0053] Taking the heat sink disposed on the rear wall of the wafer box as an example, under normal conditions, heat sinks are disposed on both sides. Fig. 9 The middle shows an acquired image in which the heat sink on the left is missing.

[0054] Taking a wafer retainer as an example, in a normal state, the fingers 131 on both sides are arranged in pairs at equal distances, and the heights of the same pair of fingers 131 are the same. Fig.10 The abnormal state of the wafer holder fingers is shown. Fig.10 In the figure, the fingers indicated by the white arrows are bent, which will cause the wafers to break when bonding.

[0055] In addition, under normal conditions, there should be no wafers inside the wafer box before cleaning. Fig.11 A schematic diagram showing an abnormal state of wafers in a wafer box.

[0056] As described in the above technical solution and its implementation, when the determination part 43 determines that the wafer box is in an abnormal state, the wafer box determined to be in an abnormal state can also be manually inspected to finally determine whether it is in an abnormal state. Based on this, in some possible implementations, such as Fig.12 As shown, the detection device 40 further includes: an alarm part 45 and a display part 46; The alarm part 45 is configured to issue an alarm message to prompt a recheck of the wafer box when the wafer box is determined to be in an abnormal state; The display portion 46 is configured to display an internal image of the wafer box when the wafer box is determined to be in an abnormal state; The transfer part 44 is further configured to move the wafer box out of the inspection chamber 41 when the wafer box is determined to be in an abnormal state.

[0057] In combination with the aforementioned technical solution and its implementation method, when a wafer box is determined to be in an abnormal state by the determination part 43, manual inspection is required to finally determine whether the wafer box is in an abnormal state. In this case, the transfer part 44 moves the wafer box out of the inspection room 41, and issues an alarm message through the alarm part 45 to notify the inspector to perform a manual inspection on the wafer box. In some examples, the alarm message can be in the form of a sound alarm, such as a buzzer, a siren, or a pre-recorded voice warning message, or it can be a visual alarm, such as flashing a light of a specific color (such as red) or displaying the alarm message on a display screen, or it can be an alarm message sent to an electronic device at the inspector's workplace via a network, etc. This disclosure does not elaborate on this.

[0058] After receiving the warning information, the inspector can make a judgment by viewing the internal image of the wafer box displayed on the display part 46, or can make a judgment by physically moving the wafer box out of the inspection room 41, using the internal image as an aid in the judgment. In some examples, the display part 46 can be implemented as an LCD or LED display to display the internal image of the wafer box.

[0059] In some possible implementations, the transfer portion 44 is further configured to transfer the wafer box to an overhead traveling device when the wafer box is determined to be in an abnormal state.

[0060] For the above implementation, specifically, when the location of the inspector is far from the cleaning equipment, the wafer box determined to be in an abnormal state can also be transferred to the inspector through the overhead crane device. Then, after the wafer box is moved out of the inspection room 41 by the transfer part 44, it is further transferred to the overhead crane device through the transfer part 44, and the overhead crane device transports the wafer box to the location of the inspector for manual inspection and confirmation by the inspector.

[0061] It should be noted that, based on the above implementation, after the wafer box is determined to be not in an abnormal state based on manual inspection, the wafer box can still be transferred to the wafer box cleaning equipment through the transfer part 44 for cleaning process. If the wafer box is determined to be in an abnormal state based on manual inspection, the transfer part 44 transfers the next wafer box from the loading port to the inspection chamber 41 for inspection. The specific inspection process is the same as the above solution and will not be repeated here.

[0062] Based on the same inventive concept as the above technical solution, see Fig.13 , which shows a detection method for a wafer box before cleaning provided by the present disclosure, which can be applied to the wafer box detection device described in the above technical solution, and the detection method includes: S1301: before the wafer box is cleaned, an internal image of the wafer box is collected; S1302: determining whether the wafer box is in an abnormal state based on the internal image of the wafer box; S1303: When the wafer box is determined not to be in an abnormal state, the wafer box is transferred to a wafer box cleaning device.

[0063] In some examples, determining whether the wafer box is in an abnormal state based on the internal image of the wafer box includes: The internal image of the wafer box is compared with a set standard image, and it is determined whether the wafer box is in an abnormal state according to the comparison result.

[0064] In some examples, comparing the internal image of the wafer box with a set standard image, and determining whether the wafer box is in an abnormal state according to the comparison result, includes: Acquire a captured image of a target component from an internal image of the wafer box; Compare the acquired image of each target component with the standard image corresponding to each target component; When the acquired images of all target components are consistent with the corresponding standard images, it is determined that the wafer box is not in an abnormal state; When the captured image of at least one target component among all the target components is inconsistent with the corresponding standard image, the wafer box is determined to be in an abnormal state.

[0065] In some examples, when the wafer box is determined to be in an abnormal state, the detection method further includes: moving the wafer box out of the inspection chamber; Sending an alarm message to prompt a re-inspection of the wafer box; and displaying an internal image of the wafer box; In some examples, when the wafer box is determined to be in an abnormal state, the detection method further includes: The wafer box is transferred to an overhead crane device.

[0066] For the above technical solutions and examples thereof, their specific implementation methods and details can all be found in the corresponding descriptions of the components in the aforementioned wafer box detection equipment 40, and the present disclosure will not elaborate on them.

[0067] The present disclosure also provides a computer-readable storage medium storing at least one instruction, wherein the at least one instruction is used to be executed by a processor to implement the wafer box pre-cleaning detection method as described in the above embodiments.

[0068] The present disclosure also provides a computer program product, which includes computer instructions stored in a computer-readable storage medium; a processor of a computing device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computing device executes to implement the wafer box pre-cleaning inspection method described in the above-mentioned embodiments.

[0069] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the present disclosure can be implemented using hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein communication media include any media that facilitates the transmission of computer programs from one place to another. Storage media can be any available media that can be accessed by a general or special-purpose computer.

[0070] It should be noted that the technical solutions described in the present disclosure can be combined arbitrarily without conflict.

[0071] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A wafer box pre-cleaning inspection device, characterized in that: The detection equipment comprises: an inspection chamber for housing wafer cassettes; A photographing device housed in the inspection chamber, the photographing device being configured to extend into the interior of the wafer box and capture an internal image of the wafer box; a determination section configured to determine whether the wafer box is in an abnormal state based on the internal image of the wafer box; The transfer part is configured to transfer the wafer box to a wafer box cleaning device when the wafer box is determined not to be in an abnormal state.

2. The detection device according to claim 1, characterized in that: The determination section is configured to compare the internal image of the wafer box with a set standard image, and determine whether the wafer box is in an abnormal state according to the comparison result.

3. The detection device according to claim 2, characterized in that: The determination part is configured to: Acquire a captured image of a target component from an internal image of the wafer box; Compare the acquired image of each target component with the standard image corresponding to each target component; When the acquired images of all target components are consistent with the corresponding standard images, it is determined that the wafer box is not in an abnormal state; When the captured image of at least one target component among all the target components is inconsistent with the corresponding standard image, the wafer box is determined to be in an abnormal state.

4. The detection device according to claim 3, characterized in that: The target component includes at least one of a sealing strip inside the wafer box, a shelf arranged on a side wall of the wafer box, a heat sink arranged on a rear wall of the wafer box, and a wafer holder arranged at a door panel of the wafer box.

5. The detection device according to any one of claims 1 to 4, characterized in that: The detection device also includes: an alarm part and a display part; The alarm part is configured to issue an alarm message to prompt a re-inspection of the wafer box when the wafer box is determined to be in an abnormal state; The display portion is configured to display an internal image of the wafer box when the wafer box is determined to be in an abnormal state; The transfer part is further configured to move the wafer box out of the inspection chamber when the wafer box is determined to be in an abnormal state.

6. The detection device according to any one of claims 1 to 4, characterized in that: The transfer part is further configured to transfer the wafer box to an overhead traveling device when the wafer box is determined to be in an abnormal state.

7. A method for detecting a wafer box before cleaning, characterized in that: The detection method comprises: Before the wafer box is cleaned, capturing an internal image of the wafer box; determining whether the wafer box is in an abnormal state based on the internal image of the wafer box; When the wafer box is determined not to be in an abnormal state, the wafer box is transferred to a wafer box cleaning device.

8. The detection method according to claim 7, characterized in that: The determining whether the wafer box is in an abnormal state based on the internal image of the wafer box includes: The internal image of the wafer box is compared with a set standard image, and it is determined whether the wafer box is in an abnormal state according to the comparison result.

9. The detection method according to claim 8, characterized in that: The step of comparing the internal image of the wafer box with a set standard image and determining whether the wafer box is in an abnormal state according to the comparison result includes: Acquire a captured image of a target component from an internal image of the wafer box; Compare the acquired image of each target component with the standard image corresponding to each target component; When the acquired images of all target components are consistent with the corresponding standard images, it is determined that the wafer box is not in an abnormal state; When the captured image of at least one target component among all the target components is inconsistent with the corresponding standard image, the wafer box is determined to be in an abnormal state.

10. The detection method according to any one of claims 7 to 9, characterized in that: When the wafer box is determined to be in an abnormal state, the detection method further includes: moving the wafer box out of the inspection chamber; Sending an alarm message to prompt a re-inspection of the wafer box; And display the internal image of the wafer box.

11. The detection method according to any one of claims 7 to 9, characterized in that: When the wafer box is determined to be in an abnormal state, the detection method further includes: The wafer box is transferred to an overhead crane device.

Images