Wafer defect detection equipment for semiconductor production

Abstract

The invention discloses wafer defect detection equipment for semiconductor production, relates to the field of wafer detection, and solves the problem that the wafer clamping force is too large when an existing detection device turns over a wafer, the wafer defect detection equipment comprises a detection platform and a supporting plate, a mounting disc is arranged on the outer side of the supporting plate, an L-shaped support is arranged on the outer side of the mounting disc, and the L-shaped support is arranged on the outer side of the mounting disc. An infrared detector is mounted at one end of the L-shaped bracket, a mounting frame is mounted at the top of the detection platform, a detection box is mounted at the top of the mounting frame, and a transparent placement plate is arranged on the inner side of the detection box; the detection mechanism is used for carrying out double-sided detection on the wafer on the transparent placing plate, and the detection mechanism is mounted on the inner side of the detection box; through the detection mechanism, the top and the bottom of the wafer can be detected without overturning the wafer, contact with the wafer during detection is reduced, the problem that the clamping force of a traditional detection device on the wafer is too large is solved, wafer damage is prevented, and therefore the safe and multi-face detection effect is achieved.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection, and in particular to a wafer defect detection device for semiconductor production. Background Art

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually made of high-purity single-crystal silicon and are in the shape of round slices. They are mainly used to manufacture integrated circuits and other microelectronic devices. They are extremely thin slices cut from high-purity single-crystal silicon ingots. The manufacturing process includes heating the silica ore in an electric arc furnace to reduce it to form crude silicon, which is then purified and distilled into high-purity polysilicon. Finally, the polysilicon is melted and doped with silicon crystal seeds through the Czochralski method, and then slowly pulled out to form a cylindrical single-crystal silicon rod, which is then sliced, ground and polished to obtain the final wafer.

[0003] As the cornerstone of semiconductor manufacturing, wafer surface defects can have a significant impact on chip manufacturing and final product performance. Common types of wafer defects include particle defects, scratch defects, bubble defects, cracks and fractures, lattice defects, etc., which require the use of testing equipment to inspect wafers. When existing testing equipment is used to inspect large-size wafers, single-sided testing cannot ensure the comprehensiveness of wafer defect detection. A robotic arm or two symmetrical clamps are required to flip the wafer over. However, the material of the wafer is relatively brittle. If the clamping force is too large, the outer side of the wafer will be damaged, resulting in low safety. Summary of the invention

[0004] The object of the present invention is to provide a wafer defect detection device for semiconductor production to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A wafer defect detection device for semiconductor production, comprising: a detection platform and a support plate fixedly mounted on the top of the detection platform, a mounting disk is arranged on the outer side of the support plate, an L-shaped bracket is arranged on the outer side of the mounting disk, an infrared detector is fixedly mounted on the end of the L-shaped bracket away from the mounting disk, a mounting frame is fixedly mounted on the top of the detection platform, a detection box is fixed on the top of the mounting frame, and a transparent placement plate is arranged on the inner side of the detection box; further comprising: a detection mechanism for double-sided detection of the wafer on the transparent placement plate, the detection mechanism is mounted on the inner side of the detection box; a distance adjustment mechanism for automatically aligning the infrared detector with the transparent placement plate, the distance adjustment mechanism is mounted on the outer side of the mounting disk; a discharging mechanism for feeding and discharging the wafer in the detection box, the discharging mechanism is mounted on the inner side of the detection box.

[0006] Preferably, the detection mechanism includes two rotating rods symmetrically mounted on the inner side of the detection box, two symmetrically distributed toothed belts are provided on the inner side of the detection box, two first gears symmetrically matched with the two toothed belts are fixedly mounted on the outer side of the rotating rod, a belt is fixedly mounted between the two toothed belts, a detection hole is opened on the outer side of the belt, the top and bottom of the detection box are both open structures, the transparent placement plate is located on the inner side of the belt, a toothed ring is fixedly mounted on the side of the mounting plate close to the detection box, one end of the rotating rod extends to the outer side of the detection box, a second gear matched with the toothed ring is fixedly mounted on the end of the rotating rod close to the mounting plate, a rotating drum is fixedly mounted on the side of the mounting plate close to the support plate, the rotating drum is rotatably mounted on the outer side of the support plate, a driving motor is fixedly mounted on the side of the support plate away from the mounting plate, and matching transmission gears are fixedly mounted on the output end of the driving motor and the outer side of the rotating drum.

[0007] Preferably, the distance adjusting mechanism includes a slider fixedly mounted on the side of the L-shaped bracket close to the mounting plate, a sliding cavity for limiting the sliding of the slider is opened on the outer side of the mounting plate, a spring is fixedly mounted between the inner side of the sliding cavity and the outer side of the slider, a pulley is fixedly mounted on the side of the L-shaped bracket away from the slider, a support ring is fixedly mounted on the side of the support plate close to the mounting plate, the outer side of the pulley is in contact with the outer side of the support ring, and two symmetrically distributed arc-shaped protrusions are fixedly mounted on the outer side of the support ring, and the maximum distance between the two arc-shaped protrusions is greater than the width of the detection box.

[0008] Preferably, the discharging mechanism includes two L-shaped plates symmetrically fixedly installed on the side of the detection box away from the mounting disk, a feed port is opened on the side of the detection box close to the L-shaped plate, a screw is rotatably installed between the end of the L-shaped plate away from the detection box and the inner side of the detection box, a fixing ring is fixedly installed on the outer side of the transparent placement plate, two moving blocks respectively matched with the two screws are fixedly installed on the top of the fixing ring, a third gear is fixedly installed on one end of the screw close to the left side of the detection box, a first arc rack and a second arc rack matched with the third gear are fixedly installed on the outer side of the mounting disk, the first arc rack is an inner arc rack, and the second arc rack is an outer arc rack, a synchronous belt is installed between the two screws through a sprocket drive, and the synchronous belt is located on the side of the detection box close to the mounting disk.

[0009] Preferably, a support rod is fixedly mounted on one side of the detection box close to the mounting plate, one end of the support rod passes through the mounting plate, and one end of the support rod away from the detection box is fixedly connected to the outer side of the support plate.

[0010] Preferably, four pressure strips distributed in a rectangular array are fixedly mounted on the inner side of the detection box, and the outer sides of the pressure strips are in contact with the outer side of the toothed belt.

[0011] Preferably, a guide rod is fixedly mounted on the inner side of the sliding cavity of the mounting plate, and the guide rod slides through the sliding block.

[0012] Preferably, two symmetrically distributed mounting rods are fixedly mounted on one side of the L-shaped bracket close to the mounting plate, a sliding ball is rotatably mounted on the outer side of the mounting rod, and a long groove is opened on the outer side of the mounting plate for the sliding ball to slide in a limited position.

[0013] Preferably, two symmetrically distributed baffles are fixedly mounted on the inner side of the detection box, and a sleeve for rotatably mounting the screw rod is fixedly mounted on the outer side of the baffle.

[0014] Preferably, an elastic stopper is slidably mounted on the inner side of the sleeve, and one end of the elastic stopper close to the screw rod is a hemispherical structure, and a plurality of spherical grooves symmetrically distributed in the center are formed on the outer side of the screw rod.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention can place the wafer on a transparent placement plate through a detection mechanism, so that the infrared detector detects the wafer, and after detecting the top of the wafer, the infrared detector can be moved to the bottom of the wafer, so that the infrared detector detects the bottom of the wafer. There is no need to turn the wafer over, which reduces the contact with the wafer during detection, solves the problem of excessive wafer clamping force of traditional detection devices, prevents wafer damage, and achieves a safe and multi-faceted detection effect.

[0016] The present invention uses a distance adjustment mechanism, when the mounting plate drives the infrared detector to move, the pulley can move from the support ring to the arc-shaped protrusion, so that the infrared detector avoids the detection box, and when the detection end of the infrared detector is aligned with the wafer, the pulley is returned to the support ring, and the detection end of the infrared detector can be close to the wafer again, thereby improving the accuracy of wafer detection.

[0017] The present invention uses a discharging mechanism, which can make the first arc-shaped rack contact with the third gear on the screw rod after the infrared detector has completed the detection of the top and bottom of the wafer, and move the transparent placement plate out of the detection box through the two screw rods, so that the staff can take out the wafer conveniently, and when the second arc-shaped rack contacts the third gear, the transparent placement plate is put back into the detection box, so as to facilitate the continuous detection of multiple wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2It is a schematic diagram of the detection box and the belt structure in the present invention; Figure 3 It is a schematic diagram of the structure of the mounting plate and the gear ring in the present invention; Figure 4 It is a schematic diagram of the support plate and the rotating drum structure in the present invention; Figure 5 It is a schematic diagram of the L-shaped bracket and the slider structure in the present invention; Figure 6 It is a schematic diagram of the structure of the pulley and the support ring in the present invention; Figure 7 It is a schematic diagram of the structure of the fixing ring and the baffle in the present invention; Figure 8 It is a schematic diagram of the structure of the third gear and the first arc-shaped rack in the present invention.

[0019] In the figure: 1. detection platform; 2. support plate; 3. mounting plate; 4. L-shaped bracket; 5. infrared detector; 6. mounting frame; 7. detection box; 8. transparent placement plate; 9. rotating rod; 10. toothed belt; 11. first gear; 12. belt; 13. gear ring; 14. second gear; 15. rotating drum; 16. driving motor; 17. transmission gear; 18. slider; 19. spring; 20. pulley; 21. support ring; 22. arc-shaped protrusion; 23. L-shaped plate; 24. screw; 25. fixing ring; 26. moving block; 27. third gear; 28. first arc-shaped rack; 29. ​​second arc-shaped rack; 30. synchronous belt; 31. support rod; 32. pressure strip; 33. guide rod; 34. mounting rod; 35. sliding ball; 36. baffle; 37. sleeve; 38. elastic block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figure 1-Figure 8, a wafer defect detection device for semiconductor production shown in the figure includes a detection platform 1 and a support plate 2 fixedly installed on the top of the detection platform 1, a mounting plate 3 is arranged on the outer side of the support plate 2, an L-shaped bracket 4 is arranged on the outer side of the mounting plate 3, an infrared detector 5 is fixedly installed on the end of the L-shaped bracket 4 away from the mounting plate 3, which is used to detect defects on the wafer, and when the mounting plate 3 rotates, the infrared detector 5 can be driven to rotate through the L-shaped bracket 4, a mounting frame 6 is fixedly installed on the top of the detection platform 1, a detection box 7 is fixed on the top of the mounting frame 6, a support rod 31 is fixedly installed on the side of the detection box 7 close to the mounting plate 3, one end of the support rod 31 passes through the mounting plate 3, and the end of the support rod 31 away from the detection box 7 is fixedly connected to the outer side of the support plate 2, a transparent placement plate 8 is arranged on the inner side of the detection box 7 for placing wafers, and the transparent placement plate 8 is made of high-transmittance glass, so that the infrared detector 5 can detect defects on the wafer through the transparent placement plate 8; it also includes: a detection mechanism, which is used to detect both sides of the wafer on the transparent placement plate 8, and the detection mechanism is installed on the inner side of the detection box 7; The detection mechanism includes two rotating rods 9 symmetrically mounted on the inner side of the detection box 7, two symmetrically distributed toothed belts 10 are arranged on the inner side of the detection box 7, four pressure strips 32 distributed in a rectangular array are fixedly mounted on the inner side of the detection box 7, the outer side of the pressure strip 32 contacts the outer side of the toothed belt 10, and provides positioning for the installation of the toothed belt 10, two first gears 11 symmetrically matched with the two toothed belts 10 are fixedly mounted on the outer side of the rotating rod 9, when the two rotating rods 9 rotate, the two toothed belts 10 can be driven to rotate synchronously by the first gear 11, a belt 12 is fixedly mounted between the two toothed belts 10, the toothed belt 10 can drive the belt 12 to rotate synchronously, a detection hole is opened on the outer side of the belt 12, the top and bottom of the detection box 7 are both open structures, the transparent placement plate 8 is located on the inner side of the belt 12, when the detection end of the infrared detector 5 is aligned with the detection hole of the belt 12, the wafer on the transparent placement plate 8 can be detected, and the mounting plate 3 is close to the detection A gear ring 13 is fixedly installed on one side of the test box 7, and one end of the rotating rod 9 extends to the outside of the test box 7. A second gear 14 matching with the gear ring 13 is fixedly installed on one end of the rotating rod 9 close to the mounting plate 3. When the mounting plate 3 rotates, the second gear 14 can be driven to rotate by the gear ring 13, so that the second gear 14 drives the rotating rod 9 to rotate, and the detection hole on the belt 12 can be moved from the top of the detection box 7 to the bottom of the detection box 7, and the infrared detector 5 can perform defect detection on the wafer from below without turning the wafer over. A rotating drum 15 is fixedly installed on one side of the mounting plate 3 close to the supporting plate 2, and the rotating drum 15 is rotatably installed on the outside of the supporting plate 2. A driving motor 16 is fixedly installed on the side of the supporting plate 2 away from the mounting plate 3. The output end of the driving motor 16 and the outside of the rotating drum 15 are fixedly installed with matching transmission gears 17, so that the driving motor 16 can drive the rotating drum 15 to rotate through two transmission gears 17, so that the rotating drum 15 drives the mounting plate 3 to rotate intermittently.

[0022] Example 2: Please refer to Figure 4-Figure 6 , this embodiment further explains the first embodiment. The distance adjustment mechanism shown in the figure includes a slider 18 fixedly installed on the side of the L-shaped bracket 4 close to the mounting plate 3. A sliding cavity is opened on the outer side of the mounting plate 3 for the slider 18 to slide in a limited position. A spring 19 is fixedly installed between the inner side of the sliding cavity and the outer side of the slider 18. A guide rod 33 is fixedly installed on the inner side of the sliding cavity of the mounting plate 3. The guide rod 33 slides through the slider 18, so that when the L-shaped bracket 4 moves, it can drive the slider 18 to move along the outer side of the guide rod 33 and the inner side of the sliding cavity and compress the spring 19. The guide rod 33 is located on the inner side of the spring 19, which can provide auxiliary support for the spring 19 to prevent the spring 19 from tilting. A pulley 20 is fixedly installed on the side of the L-shaped bracket 4 away from the slider 18, and a support ring 21 is fixedly installed on the side of the support plate 2 close to the mounting plate 3. The outer side of the pulley 20 contacts the outer side of the support ring 21, so that when the mounting plate 3 rotates, the pulley 20 on the L-shaped bracket 4 can be driven along the outer side of the support ring 21 When the pulley 20 moves from the outer side of the support ring 21 to the outer side of the arc-shaped protrusion 22, the pulley 20 can push the L-shaped bracket 4 to move, so that the L-shaped bracket 4 drives the infrared detector 5 away from the detection box 7, which is convenient for the infrared detector 5 to move, and when the pulley 20 contacts the support ring 21 again, the infrared detector 5 can be aligned with the bottom of the detection platform 1. Two symmetrically distributed mounting rods 34 are fixedly installed on the side of the L-shaped bracket 4 close to the mounting plate 3. A sliding ball 35 is rotatably installed on the outer side of the mounting rod 34. A long groove for limiting the sliding of the sliding ball 35 is opened on the outer side of the mounting plate 3. When the L-shaped bracket 4 moves, the sliding ball 35 can be driven by the mounting rod 34 to move along the long groove on the mounting plate 3, so that the sliding ball 35 can provide auxiliary pulling force for the L-shaped bracket 4, thereby improving the supporting force of the L-shaped bracket 4 on the infrared detector 5.

[0023] Example 3: Please refer to Figure 2-Figure 8, this embodiment further explains other embodiments, the discharging mechanism shown in the figure includes two L-shaped plates 23 symmetrically fixedly installed on the side of the detection box 7 away from the mounting plate 3, and a feeding port is opened on the side of the detection box 7 close to the L-shaped plate 23 for taking out and putting in the transparent placement plate 8. A screw 24 is rotatably installed between the end of the L-shaped plate 23 away from the detection box 7 and the inner side of the detection box 7, and a fixing ring 25 is fixedly installed on the outer side of the transparent placement plate 8. Two moving blocks 26 respectively matched with the two screws 24 are fixedly installed on the top of the fixing ring 25. When the two When the screw 24 rotates, the fixed ring 25 can be driven to enter or move out of the detection box 7 through the moving block 26. A third gear 27 is fixedly installed at one end of the screw 24 near the left side of the detection box 7. A first arc rack 28 and a second arc rack 29 matched with the third gear 27 are fixedly installed on the outer side of the mounting plate 3. The first arc rack 28 is an inner arc rack, and the second arc rack 29 is an outer arc rack. When the mounting plate 3 rotates, the first arc rack 28 and the second arc rack 29 can be driven to perform circular motion synchronously. When the first arc rack 28 and the second arc rack 29 are When the third gear 27 is in contact, the first gear 11 can be driven to rotate clockwise, so that the screw 24 can move the fixed ring 25 out of the detection box 7 through the moving block 26. When the second arc-shaped rack 29 is in contact with the third gear 27, the screw 24 can move the fixed ring 25 into the detection box 7 through the moving block 26. A synchronous belt 30 is installed between the two screws 24 through a sprocket drive. The synchronous belt 30 is a transmission chain in the prior art. When the screw 24 equipped with the third gear 27 rotates, the other screw 24 can be driven to rotate synchronously through the synchronous belt 30. The synchronous belt 30 is located on the side of the detection box 7 close to the mounting plate 3, and two symmetrically distributed baffles 36 are fixedly installed on the inner side of the detection box 7, and a sleeve 37 for rotatably installing the screw 24 is fixedly installed on the outer side of the baffle 36 to provide support for the screw 24, and an elastic stop block 38 is slidably installed on the inner side of the sleeve 37. The end of the elastic stop block 38 close to the screw 24 is a hemispherical structure, and a plurality of spherical grooves symmetrically distributed on the outer side of the screw 24 are provided. The elasticity of the elastic stop block 38 can be used to provide positioning for the stopped screw 24 to prevent the third gear 27 from rotating.

[0024] Working principle: First, the staff places the wafer to be tested on the transparent placement plate 8, starts the drive motor 16, and drives the drive motor 16 to rotate the drum 15 through the two transmission gears 17, and the drum 15 drives the mounting plate 3 to rotate, so that the mounting plate 3 drives the infrared detector 5 on the L-shaped bracket 4 to make a circular motion. At the same time, the pulley 20 of the L-shaped bracket 4 moves along the outer side of the arc-shaped protrusion 22. When the infrared detector 5 moves from the left side of the detection box 7 to the top of the detection box 7, the pulley 20 can move from the arc-shaped protrusion 22 to the support ring 21, and use the elasticity of the spring 19 to push the slider 18 to move along the sliding cavity on the mounting plate 3 and the outer side of the guide rod 33. The slider 18 drives the L-shaped bracket 4 to move synchronously, so that the pulley 20 and the support ring 2 1, the detection end of the infrared detector 5 can be close to the top of the detection box 7. At the same time, the mounting plate 3 drives the second gear 14 to rotate through the gear ring 13, so that the second gear 14 drives the rotating rod 9 to rotate. The rotating rod 9 drives the two toothed belts 10 to rotate synchronously through the two first gears 11. The two toothed belts 10 drive the belt 12 to move synchronously, so that the detection hole on the belt 12 moves to the top of the detection box 7 and is aligned with the detection end of the infrared detector 5. At the same time, the mounting plate 3 drives the second arc-shaped rack 29 to rotate synchronously with the first arc-shaped rack 28, and makes the second arc-shaped rack 29 contact with the third gear 27. The third gear 27 drives the corresponding screw 24 to rotate, so that the screw 24 drives another screw 24 to rotate synchronously through the synchronous belt 30. The two screws 24 can drive the fixing ring 25 to move through the moving block 26, so that the transparent placement plate 8 on the fixing ring 25 moves and enters the detection box 7, thereby, the infrared detector 5 can detect the wafer on the transparent placement plate 8 through the detection hole on the belt 12, and then, the infrared detector 5 completes the detection of the top of the wafer, and the drive motor 16 is started again to move the detection hole on the belt 12 to the bottom of the wafer, and the infrared detector 5 can detect the bottom of the wafer through the transparent placement plate 8. At the same time, the pulley 20 moves from the outside of the support ring 21 to the outside of another arc-shaped protrusion 22, and the pulley 20 can push the L-shaped bracket 4 to move, and the L-shaped bracket 4 drives the slider 18 to move along the outside of the guide rod 33 and the inside of the sliding cavity, and The spring 19 is compressed so that the L-shaped bracket 4 drives the infrared detector 5 away from the detection box 7. The rebound force of the spring 19 is used to move the pulley 20 away from the arc-shaped protrusion 22. The pulley 20 can contact the outer side of the support ring 21 again, and the infrared detector 5 can be aligned directly below the detection platform 1. Finally, the drive motor 16 is started again, and the mounting plate 3 drives the first arc-shaped rack 28 to contact the third gear 27, so that the third gear 27 rotates counterclockwise, and the screw 24 can move the wafer on the transparent placement plate 8 out of the detection box 7 through the moving block 26 and the fixing ring 25. The staff can take out the wafer after detection. There is no need to turn the wafer over during this process, thereby achieving a safe and multi-sided detection effect, which is convenient for continuous detection of multiple wafers.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer defect detection device for semiconductor production, characterized in that: include: A detection platform (1) and a support plate (2), wherein a mounting plate (3) is arranged on the outer side of the support plate (2), an L-shaped bracket (4) is arranged on the outer side of the mounting plate (3), an infrared detector (5) is mounted on one end of the L-shaped bracket (4), a mounting frame (6) is mounted on the top of the detection platform (1), a detection box (7) is mounted on the top of the mounting frame (6), and a transparent placement plate (8) is arranged on the inner side of the detection box (7); Also includes: A detection mechanism, used for detecting both sides of the wafer on the transparent placement plate (8), the detection mechanism being installed on the inner side of the detection box (7); A distance adjustment mechanism, used for automatically aligning the infrared detector (5) and the transparent placement plate (8), the distance adjustment mechanism being mounted on the outside of the mounting plate (3); The material discharging mechanism is used for delivering and discharging wafers in the detection box (7), and the material discharging mechanism is installed on the inner side of the detection box (7).

2. The semiconductor wafer defect detection device according to claim 1, characterized in that: The detection mechanism comprises two rotating rods (9) rotatably mounted on the inner side of the detection box (7), two toothed belts (10) are arranged on the inner side of the detection box (7), two first gears (11) respectively matched with the two toothed belts (10) are arranged on the outer side of the rotating rod (9), a belt (12) is arranged between the two toothed belts (10), and a detection hole is opened on the outer side of the belt (12), a toothed ring (13) is arranged on one side of the mounting plate (3), a second gear (14) matched with the toothed ring (13) is arranged on one end of the rotating rod (9), a rotating drum (15) is arranged on one side of the mounting plate (3), the rotating drum (15) is rotatably mounted on the outer side of the support plate (2), a driving motor (16) is arranged on one side of the support plate (2), and a matching transmission gear (17) is arranged on the output end of the driving motor (16) and the outer side of the rotating drum (15).

3. The semiconductor wafer defect detection device according to claim 2, characterized in that: The distance adjustment mechanism comprises a slider (18) mounted on one side of the L-shaped bracket (4); a sliding cavity for limiting the sliding movement of the slider (18) is provided on the outer side of the mounting plate (3); a spring (19) is installed between the inner side of the sliding cavity and the outer side of the slider (18); a pulley (20) is installed on one side of the L-shaped bracket (4); a support ring (21) is installed on one side of the support plate (2); the outer side of the pulley (20) contacts the outer side of the support ring (21); and two arc-shaped protrusions (22) are installed on the outer side of the support ring (21).

4. The semiconductor wafer defect detection device according to claim 3, characterized in that: The discharging mechanism comprises two L-shaped plates (23) mounted on one side of the detection box (7); a screw rod (24) is rotatably mounted between one end of the L-shaped plate (23) and the inner side of the detection box (7); a fixing ring (25) is mounted on the outer side of the transparent placement plate (8); two moving blocks (26) respectively matched with the two screw rods (24) are mounted on the top of the fixing ring (25); a third gear (27) is mounted on one end of the screw rod (24) close to the left side of the detection box (7); a first arc-shaped rack (28) and a second arc-shaped rack (29) matched with the third gear (27) are mounted on the outer side of the mounting plate (3); the first arc-shaped rack (28) is an inner arc rack, and the second arc-shaped rack (29) is an outer arc rack; and a synchronous belt (30) is rotatably mounted between the two screw rods (24).

5. The semiconductor wafer defect detection device according to claim 1, characterized in that: A support rod (31) is installed on one side of the detection box (7), and one end of the support rod (31) away from the detection box (7) is connected to the outer side of the support plate (2).

6. The semiconductor wafer defect detection device according to claim 2, characterized in that: Four pressure strips (32) are installed on the inner side of the detection box (7), and the outer sides of the pressure strips (32) are in contact with the outer side of the toothed belt (10).

7. The semiconductor wafer defect detection device according to claim 3, characterized in that: A guide rod (33) is installed inside the sliding cavity of the installation plate (3), and the guide rod (33) slides through the sliding block (18).

8. The semiconductor wafer defect detection device according to claim 3, characterized in that: Two mounting rods (34) are mounted on one side of the L-shaped bracket (4), a sliding ball (35) is rotatably mounted on the outer side of the mounting rod (34), and a long groove for limiting the sliding of the sliding ball (35) is provided on the outer side of the mounting plate (3).

9. The semiconductor wafer defect detection device according to claim 4, characterized in that: Two baffles (36) are installed on the inner side of the detection box (7), and a sleeve (37) for rotatably mounting the screw rod (24) is installed on the outer side of the baffle (36).

10. The semiconductor wafer defect detection device according to claim 9, characterized in that: An elastic stopper (38) is slidably mounted on the inner side of the sleeve (37), one end of the elastic stopper (38) is a hemispherical structure, and a plurality of spherical grooves are formed on the outer side of the screw rod (24).

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