Micro LED virtual pixel module detection equipment

Abstract

The invention discloses Micro LED virtual pixel module detection equipment, which relates to the technical field of semiconductor display and comprises a detection table, a moving frame, a pair of detection mechanisms and a displacement mechanism, the moving frame is arranged on the detection table, the two detection mechanisms are arranged on the moving frame in a sliding mode through sliding rods, the displacement mechanism is arranged on the moving frame and used for driving the two detection mechanisms to synchronously move on the moving frame, and lamp bead detection of a micro LED lamp bead circuit board can be rapidly completed. According to the design, the detection time of a single circuit board is greatly shortened, the overall detection efficiency is improved, and the design is particularly key to Micro LED products produced on a large scale.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor displays, and more specifically, to a Micro LED virtual pixel module detection device. Background Art

[0002] With the rapid development of display technology, light-emitting diode (LED) technology, especially micron-scale MicroLED technology, as a representative of the new generation of display technology, is gradually showing its huge application potential. MicroLED has become a research hotspot and a key direction for commercial applications in the future display field due to its self-luminous display characteristics, design without backlight, and advantages such as higher brightness, better luminous efficiency and lower power consumption compared to traditional organic light-emitting diode (OLED) technology.

[0003] Specifically, due to their tiny size (micrometer level), MicroLED lamp beads have problems such as difficulty in transfer, large transfer volume, and difficulty in accurate identification of transfer equipment during the manufacturing process. These problems directly lead to a significant reduction in the yield of MicroLED products. Therefore, how to effectively and efficiently identify whether the brightness of MicroLED lamp beads is qualified has become the key to improving the quality control level of MicroLED products and accelerating their commercialization process.

[0004] Based on this, we provide a Micro LED virtual pixel module detection device. Summary of the invention

[0005] In order to solve the problems raised in the above background technology, the present invention provides a Micro LED virtual pixel module detection device, which can quickly complete the lamp bead detection of the Micro LED lamp bead circuit board. This design greatly shortens the detection time of a single circuit board and improves the overall detection efficiency, which is particularly critical for large-scale production of Micro LED products.

[0006] The present invention provides a Micro LED virtual pixel module detection device that adopts the following technical solution:

[0007] A Micro LED virtual pixel module detection device comprises a detection platform, a mobile frame, a pair of detection mechanisms and a displacement mechanism; the mobile frame is arranged on the detection platform, the two detection mechanisms are slidably arranged on the mobile frame through a sliding rod, and the displacement mechanism is arranged on the mobile frame, and is used to drive the two detection mechanisms to move synchronously on the mobile frame; wherein the displacement mechanism comprises a driving shaft, a driven shaft, a fixed rod, a transmission belt 1 and a transmission belt 2; the driving shaft and the driven shaft are both rotatably arranged on the top of the mobile frame, a driving gear is arranged in the middle of the driving shaft, a driven gear is arranged in the middle of the driven shaft, the driving gear is meshed and connected with the driven gear, and a motor for driving the driving shaft to rotate is arranged on the mobile frame; the fixed rod is fixedly arranged on the mobile frame, one set of the transmission belt is arranged between the fixed rod and the driving shaft, and the second set of the transmission belt is arranged between the fixed rod and the driven shaft; the first transmission belt cooperates with the second transmission belt to make the two detection mechanisms move synchronously on the detection platform.

[0008] Preferably, the detection mechanism includes a transverse sleeve, a driving member and a detection camera; the transverse sleeve is arranged between two sliding bars, the detection camera is slidably arranged on the side of the transverse sleeve, and the driving member is arranged in the transverse sleeve to drive the detection camera to move on the transverse sleeve; the top of one transverse sleeve is fixedly connected to the middle part of transmission belt one, and the top of the other transverse sleeve is fixedly connected to the middle part of transmission belt two.

[0009] Preferably, an electric push rod 1 is installed at the bottom of the detection table, the mobile frame is slidably arranged on the detection table, and the support legs of the mobile frame are arranged at the bottom of the detection table, and the output end of the electric push rod 1 is connected to the support legs of the mobile frame through a connecting plate.

[0010] Preferably, a placement frame is provided on the top of the testing table for placing the Micro LED lamp bead circuit board.

[0011] Preferably, a second electric push rod is provided on the side of the detection platform, and the output end of the second electric push rod is connected to the placement frame for pushing the placement frame out of the detection platform.

[0012] Preferably, a movable plate is placed inside the placement frame through a clamp, a wedge block 1 is provided at the bottom of the movable plate, and a wedge block 2 is provided on the top of the detection table. When the placement frame moves, the wedge block 1 contacts the wedge block 2 to make the movable plate move up in the placement frame.

[0013] In summary, the present invention includes the following beneficial technical effects:

[0014] 1. The motor drives the driving shaft to rotate, thereby the transmission belt 1 is transmitted, and at the same time, the driving gear on the driving shaft drives the driven gear to rotate, thereby the driven shaft rotates, and the rotation of the driven shaft causes the transmission belt 2 to transmit. The driving shaft and the driven shaft rotate in opposite directions, thereby the transmission belt 1 and the transmission belt 2 respectively drive the corresponding detection mechanisms to move closer to each other, and the two detection mechanisms synchronously detect the Micro LED lamp bead circuit board to obtain the image information of the Micro LED lamp bead circuit board. Through this structural design, the lamp bead detection of the Micro LED lamp bead circuit board can be completed quickly. This design greatly shortens the detection time of a single circuit board and improves the overall detection efficiency, which is particularly critical for large-scale production of Micro LED products.

[0015] 2. By periodically moving the detection camera on the horizontal sleeve, a row of Micro LED lamp beads can be inspected. By cooperating with the displacement mechanism, the two detection cameras can synchronously complete the lamp bead detection of the Micro LED lamp bead circuit board, which greatly shortens the detection time of a single circuit board. When the two detection cameras detect the center point of the circuit board, a reset detection will be performed and the circuit board will be inspected for the second time. Through this structural design, the brightness status of each lamp bead can be evaluated more comprehensively and accurately. This redundant design helps to reduce missed detections and misjudgments, and can improve the reliability of the detection results to a certain extent.

[0016] 3. The preparation method of Micro LED virtual pixel module significantly improves the efficiency of Micro LED chip transfer and packaging. The laser peeling and mass transfer technology are used to ensure the accuracy of chip transfer and the stability after packaging. The virtual pixel array with RGGB arrangement is used to improve the display resolution and color saturation. The cost of module preparation is reduced by optimizing process steps and reducing material waste, solving the problems of difficulty and high cost in the preparation of virtual pixel modules.

[0017] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a structural schematic diagram of a Micro LED virtual pixel module detection device in an embodiment of the present invention;

[0019] Figure 2 2 is a schematic diagram of the structure of the other side of a Micro LED virtual pixel module detection device in an embodiment of the present invention;

[0020] Figure 3 1 is a schematic diagram of the bottom structure of a Micro LED virtual pixel module detection device in an embodiment of the present invention;

[0021] Figure 4 yes Figure 1 The enlarged structural diagram at A in the middle;

[0022] Figure 5 1 is a schematic diagram of the internal structure of a Micro LED virtual pixel module detection device in an embodiment of the present invention;

[0023] Figure 6 is a schematic diagram of the structure of the moving plate in the placement frame in an embodiment of the present invention;

[0024] Figure 7 is a schematic diagram of the structure of the moving plate on the top of the placement frame in an embodiment of the present invention;

[0025] Figure 8 is a schematic structural diagram of a Micro LED virtual pixel module in an embodiment of the present invention;

[0026] Fig. 9 is a schematic diagram of a module interface of a Micro LED virtual pixel module in an embodiment of the present invention;

[0027] Fig.10 This is a process flow chart of preparing a Micro LED virtual pixel module in an embodiment of the present invention.

[0028] Explanation of the accompanying drawings: 1. Inspection table; 2. Moving frame; 3. Inspection mechanism; 300. Horizontal sleeve; 301. Inspection camera; 4. Displacement mechanism; 400. Driving shaft; 401. Driven shaft; 402. Fixed rod; 403. Transmission belt one; 404. Transmission belt two; 405. Driving gear; 406. Driven gear; 407. Motor; 5. Electric push rod one; 6. Placing frame; 7. Electric push rod two; 8. Moving plate; 9. Wedge block one; 10. Wedge block two. DETAILED DESCRIPTION

[0029] The following is combined with Figures 1 to 10 The present invention is described in further detail.

[0030] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0031] Embodiment 1

[0032] The embodiment of the present invention discloses a Micro LED virtual pixel module detection device. Figures 1 to 7 A Micro LED virtual pixel module detection device includes a detection platform 1, a mobile frame 2, a pair of detection mechanisms 3 and a displacement mechanism 4; the mobile frame 2 is arranged on the detection platform 1, two detection mechanisms 3 are slidably arranged on the mobile frame 2 through a slide bar, and the displacement mechanism 4 is arranged on the mobile frame 2, and is used to drive the two detection mechanisms 3 to move synchronously on the mobile frame 2; wherein the displacement mechanism 4 includes a driving shaft 400, a driven shaft 401, a fixed rod 402, a transmission belt 1 403 and a transmission belt 2 404; the driving shaft 400 and the driven shaft 401 are both rotatably arranged on the top of the mobile frame 2, and a driving gear 405 is arranged in the middle of the driving shaft 400 A driven gear 406 is provided in the middle of the driven shaft 401, and the driving gear 405 is meshed and connected with the driven gear 406. A motor 407 for driving the driving shaft 400 to rotate is provided on the mobile frame 2. The motor 407 is a servo motor, which is controlled by the PLC controller program and can rotate forward and backward; the fixed rod 402 is fixedly set on the mobile frame 2, the transmission belt 1 403 is sleeved between the fixed rod 402 and the driving shaft 400, and the transmission belt 2 404 is sleeved between the fixed rod 402 and the driven shaft 401; the transmission belt 1 403 cooperates with the transmission belt 2 404 to make the two detection mechanisms 3 move synchronously on the detection platform 1.

[0033] Specifically, the shaft wheel on the fixed rod 402 connected to the transmission belt 1 403 and the transmission belt 2 404 is rotatably connected to the fixed rod 402, the shaft wheel on the driving shaft 400 connected to the transmission belt 1 403 is fixedly connected to the driving shaft 400, and the shaft wheel on the driven shaft 401 connected to the transmission belt 2 404 is fixedly connected to the driven shaft 401.

[0034] The Micro LED lamp bead circuit board is placed on the top of the detection table 1, and the Micro LED lamp bead circuit board is made to emit light continuously, and then the active shaft 400 is driven to rotate by the motor 407, thereby the transmission belt 1 403 is transmitted, and at the same time, the active gear 405 on the active shaft 400 drives the driven gear 406 to rotate, thereby the driven shaft 401 rotates, and the rotation of the driven shaft 401 causes the transmission belt 2 404 to transmit, and the active shaft 400 and the driven shaft 401 rotate in opposite directions, thereby the transmission belt 1 403 and the transmission belt 2 404 respectively drive the corresponding detection mechanisms 3 to move closer to each other, and the two detection mechanisms 3 synchronously detect the Micro LED lamp bead circuit board to obtain the image information of the Micro LED lamp bead circuit board. Through this structural design, the lamp bead detection of the Micro LED lamp bead circuit board can be quickly completed. This design greatly shortens the detection time of a single circuit board and improves the overall detection efficiency, which is particularly critical for large-scale production of Micro LED products.

[0035] like Figure 1and Figure 2 As shown, the detection mechanism 3 includes a transverse sleeve 300, a driving member and a detection camera 301; the transverse sleeve 300 is sleeved between two sliding bars, the detection camera 301 is slidably set on the side of the transverse sleeve 300, and the driving member is set in the transverse sleeve 300 to drive the detection camera 301 to move on the transverse sleeve 300; the top of one transverse sleeve 300 is fixedly connected to the middle part of the transmission belt 1 403, and the top of the other transverse sleeve 300 is fixedly connected to the middle part of the transmission belt 2 404.

[0036] Specifically, the interior of the horizontal sleeve 300 is rotatably connected with a lead screw, and the upper portion of the horizontal sleeve 300 is equipped with a servo motor for driving the lead screw to rotate. The middle thread of the lead screw is equipped with a slide plate, and the detection camera 301 is assembled on the slide plate.

[0037] Specifically, the detection camera 301 is a high-resolution camera.

[0038] The detection mechanism 3 is used by periodically moving the detection camera 301 on the horizontal sleeve 300 to detect a row of Micro LED lamp beads. By cooperating with the displacement mechanism 4, the two detection cameras 301 can synchronously complete the lamp bead detection of the Micro LED lamp bead circuit board, which greatly shortens the detection time of a single circuit board. Moreover, when the two detection cameras 301 detect the center point of the circuit board, a reset detection will be performed and the circuit board will be inspected for the second time. Through this structural design, the brightness status of each lamp bead can be evaluated more comprehensively and accurately. In addition, this redundant design helps to reduce missed detections and misjudgments, and can improve the reliability of the detection results to a certain extent.

[0039] Embodiment 2

[0040] This embodiment is further optimized on the basis of the above embodiment, and the same parts as the above technical solution will not be repeated here. Figure 5 As shown, in order to better realize the present invention, the following setting method is particularly adopted: in this embodiment, the bottom of the detection table 1 is equipped with an electric push rod 5, the mobile frame 2 is slidably set on the detection table 1, and the support legs of the mobile frame 2 are arranged at the bottom of the detection table 1, and the output end of the electric push rod 5 is connected to the support legs of the mobile frame 2 through a connecting plate.

[0041] Specifically, the movable frame 2 can be pushed by the electric push rod 5 to move up and down, thereby adjusting the position between the detection camera 301 and the circuit board.

[0042] like Figure 5 , Figure 6 and Figure 7As shown, a placement frame 6 is provided on the top of the inspection table 1 for placing the Micro LED lamp bead circuit board. By providing the placement frame 6, it can be ensured that the initial inspection point of the Micro LED lamp bead circuit board is aligned with the two inspection cameras 301.

[0043] like Figure 5 As shown, an electric push rod 2 7 is provided on the side of the testing platform 1, and the output end of the electric push rod 2 7 is connected to the placement frame 6, which is used to push the placement frame 6 out of the testing platform 1. This design makes it convenient for the staff to place the Micro LED lamp bead circuit board.

[0044] like Figure 6 and Figure 7 As shown, a movable plate 8 is placed inside the placement frame 6 through a clamp, a wedge 1 9 is provided at the bottom of the movable plate 8, and a wedge 2 10 is provided on the top of the detection table 1. When the placement frame 6 moves, the wedge 1 9 contacts the wedge 2 10 to make the movable plate 8 move up in the placement frame 6.

[0045] When the placement frame 6 moves out of the inspection table 1, the wedge block 1 9 at the bottom of the movable plate 8 can contact the wedge block 2 10, so that the wedge block 2 10 lifts the wedge block 1 9, so that the movable plate 8 lifts the circuit board in the placement frame 6, thereby facilitating the staff to take and put in the circuit board.

[0046] Specifically, the control method of the present invention is controlled by a controller, and the control circuit of the controller can be realized by simple programming by technicians in this field, and the control method and circuit connection are not explained in detail here.

[0047] Embodiment 3

[0048] A method for preparing a Micro LED virtual pixel module comprises the following steps:

[0049] S1. Select appropriate red, green and blue Micro LED chips (COW, Chip On Wafer); prepare sapphire substrate as a carrier for chip transfer; prepare transfer glue for temporary bonding between chip and carrier; prepare PCB substrate as the basis for circuit connection; prepare packaging glue, driving capacitors, resistors, driving ICs, simple transformers, floating connectors and other electronic components;

[0050] S2. Mount capacitors, resistors, driver ICs, simple transformers, floating connectors and other electronic components on the driving surface of the PCB substrate to form a circuit connection network;

[0051] S3, performing a bumping process on the PCB substrate, preparing bumping bumps on the PAD position of the connecting device by electroplating or chemical deposition, etc., for subsequent electrical connection with the Micro LED chip;

[0052] S4, temporarily bonding the sapphire substrate coated with the transfer adhesive to the red, green, and blue Micro LED chips respectively to form three independent bonding bodies;

[0053] S5. Use laser lift-off technology to separate the bonded red, green and blue Micro LED chips from the original wafer and transfer them to the sapphire substrate;

[0054] S6. Using mass transfer technology, the red, green, and blue chips on the sapphire substrate that has completed laser peeling are orderly transferred to another sapphire substrate coated with transfer glue to form a virtual pixel array in RGGB (red, green, blue, and green) arrangement;

[0055] S7, after the welding is completed, the temporarily bonded sapphire substrate is removed by mechanical stripping;

[0056] S8. After removing the sapphire wafer, use chemical or physical methods to clean the remaining transfer glue to ensure the cleanliness of the chip surface;

[0057] S9, using surface coating technology, a protective film is covered on the display surface of the glass substrate, and the Micro LED display chip is encapsulated inside to protect the chip from the influence of the external environment;

[0058] S10. Conduct electrical and optical performance tests on the packaged Micro LED virtual pixel module to ensure that the module performance meets the design requirements.

[0059] Through automated and refined process steps, the efficiency of Micro LED chip transfer and packaging has been significantly improved. The use of laser peeling and mass transfer technology has ensured the accuracy of chip transfer and stability after packaging. The display resolution and color saturation have been improved through the RGGB arrangement of virtual pixel arrays. By optimizing process steps and reducing material waste, the cost of module preparation has been reduced, solving the problems of difficulty and high cost in preparing virtual pixel modules.

[0060] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0061] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0062] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0065] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0066] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A Micro LED virtual pixel module detection device, characterized in that: include: A detection platform (1), a movable frame (2), a pair of detection mechanisms (3) and a displacement mechanism (4); The mobile frame (2) is arranged on the detection platform (1), the two detection mechanisms (3) are slidably arranged on the mobile frame (2) via a slide rod, and the displacement mechanism (4) is arranged on the mobile frame (2) and is used to drive the two detection mechanisms (3) to move synchronously on the mobile frame (2); Wherein, the displacement mechanism (4) comprises: A driving shaft (400), a driven shaft (401), a fixed rod (402), a transmission belt 1 (403) and a transmission belt 2 (404); The driving shaft (400) and the driven shaft (401) are both rotatably arranged on the top of the moving frame (2); a driving gear (405) is arranged in the middle of the driving shaft (400); a driven gear (406) is arranged in the middle of the driven shaft (401); the driving gear (405) is meshedly connected with the driven gear (406); and a motor (407) for driving the driving shaft (400) to rotate is arranged on the moving frame (2); The fixed rod (402) is fixedly arranged on the moving frame (2), the transmission belt 1 (403) is sleeved between the fixed rod (402) and the driving shaft (400), and the transmission belt 2 (404) is sleeved between the fixed rod (402) and the driven shaft (401); The transmission belt 1 (403) cooperates with the transmission belt 2 (404) to enable the two detection mechanisms (3) to move synchronously on the detection platform (1).

2. The Micro LED virtual pixel module detection device according to claim 1, characterized in that: The detection mechanism (3) comprises: A horizontal sleeve (300), a driving member and a detection camera (301); The transverse sleeve (300) is sleeved between the two sliding bars, the detection camera (301) is slidably arranged on the side of the transverse sleeve (300), and the driving member is arranged in the transverse sleeve (300) and is used to drive the detection camera (301) to move on the transverse sleeve (300); The top of one transverse sleeve (300) is fixedly connected to the middle of transmission belt one (403), and the top of the other transverse sleeve (300) is fixedly connected to the middle of transmission belt two (404).

3. The Micro LED virtual pixel module detection device according to claim 1, characterized in that: The bottom of the detection platform (1) is equipped with an electric push rod (5), the mobile frame (2) is slidably arranged on the detection platform (1), and the support legs of the mobile frame (2) are arranged at the bottom of the detection platform (1), and the output end of the electric push rod (5) is connected to the support legs of the mobile frame (2) through a connecting plate.

4. The Micro LED virtual pixel module detection device according to claim 1, characterized in that: A placement frame (6) is provided on the top of the testing platform (1) for placing the Micro LED lamp bead circuit board.

5. The Micro LED virtual pixel module detection device according to claim 4, characterized in that: A second electric push rod (7) is arranged on the side of the detection platform (1), and the output end of the second electric push rod (7) is connected to the placement frame (6) for pushing the placement frame (6) out of the detection platform (1).

6. The Micro LED virtual pixel module detection device according to claim 5, characterized in that: A movable plate (8) is placed inside the placement frame (6) via a clamp, a wedge block 1 (9) is arranged at the bottom of the movable plate (8), and a wedge block 2 (10) is arranged at the top of the detection platform (1). When the placement frame (6) moves, the wedge block 1 (9) contacts the wedge block 2 (10) so that the movable plate (8) moves upward inside the placement frame (6).

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