Radar device, movable platform, and method for assembling radar device

Abstract

The invention discloses a radar device, a movable platform and an assembling method of the radar device. The radar device comprises a shell, a transmitting module and a receiving module. The shell comprises a first face and a second face which are opposite, the shell is provided with a first cavity and a second cavity which penetrate through the first face and the second face, and the first cavity and the second cavity are arranged side by side. And the transmitting module is accommodated in the first cavity, and the transmitting module is used for transmitting an optical signal to the outside of the radar device. And the receiving module is accommodated in the second cavity, and the receiving module is used for receiving the optical signal reflected by the object. According to the radar device, the transmitting module and the receiving module are installed on the same shell, so that the number of the shells is reduced, the assembling and adjusting steps between the receiving module and the transmitting module are reduced, the assembling and adjusting tolerance of the receiving module and the transmitting module is reduced, the total optical tolerance of the radar device is reduced, and the cost of the radar device is reduced. On one hand, the adjustment efficiency of the radar device is improved, and on the other hand, the adjustment precision of the radar device is improved, so that the detection precision of the radar device is improved.

Description

Technical Field

[0001] The present application relates to the field of radar technology, and in particular to a radar device, a movable platform, and an assembly method of the radar device. Background Art

[0002] The movable platform can be equipped with a radar device to detect targets. The radar device can transmit light signals to the outside through a transmitting module, receive light signals reflected by objects through a receiving module, and obtain the distance or other information of the object after processing by the radar device.

[0003] However, the multiple modules of the radar device need to be adjusted multiple times, among which the transmitting module and the receiving module require higher precision adjustment. The more times of adjustment, the greater the total optical tolerance caused by tolerance superposition. After multiple modules are installed, the tolerance of the radar device will be superimposed, resulting in lower detection accuracy of the radar device. Summary of the invention

[0004] The present application provides a radar device, a movable platform and an assembling method of the radar device.

[0005] In a first aspect, the radar device provided by the present application includes a housing, a transmitting module and a receiving module. The housing includes a first surface and a second surface opposite to each other, and the housing is provided with a first cavity and a second cavity penetrating the first surface and the second surface, and the first cavity and the second cavity are arranged side by side. The transmitting module is accommodated in the first cavity, and the transmitting module is used to transmit an optical signal to the outside of the radar device. The receiving module is accommodated in the second cavity, and the receiving module is used to receive the optical signal reflected back by an object.

[0006] In some embodiments, the transmitting module includes a first circuit board, a first chip and a first lens. The first circuit board is mounted on the side where the first surface of the housing is located and covers the first cavity. The first chip is mounted on the side of the first circuit board facing the first cavity, and the first chip is used to transmit an optical signal. The first lens is at least partially mounted in the first cavity and aligned with the first chip.

[0007] In some embodiments, a first flange portion is disposed on an outer side wall of the first lens, and the first flange portion abuts against the second surface.

[0008] In some embodiments, the far-field pointing direction of the optical signal modulated by the first lens is less than or equal to 0.5°.

[0009] In some embodiments, the collimation angle of the optical signal modulated by the first lens is less than or equal to 0.6°.

[0010] In some embodiments, a divergence angle of the optical signal modulated by the first lens is greater than or equal to 24° and less than or equal to 26°.

[0011] In some embodiments, the housing further includes a third surface connecting the first surface and the second surface. The radar device further includes a shielding cover, which is mounted on the third surface and / or the first circuit board and covers at least a portion of the first circuit board.

[0012] In some embodiments, the radar device further includes a fixing plate mounted on a side of the first circuit board facing away from the first cavity.

[0013] In some embodiments, the fixing plate is a hard plate for reinforcing the first circuit board.

[0014] In some embodiments, a heat dissipation structure is disposed on the fixing plate, and the heat dissipation structure is used to dissipate heat on the first circuit board.

[0015] In some embodiments, a connection structure is provided on the fixing plate, and the connection structure is used to connect to an external device.

[0016] In some embodiments, the radar device further comprises a flexible wire, wherein the flexible wire comprises a first connection end and a second connection end, wherein the first connection end is engaged and connected to the first circuit board, and the second connection end is used to connect to a main control board of the radar device.

[0017] In some embodiments, the first lens comprises a first lens barrel and a first lens group. The first lens barrel is installed in the first cavity; the first lens group comprises at least two lenses, and the first lens group is accommodated in the first lens barrel.

[0018] In some embodiments, the first chip is configured to emit at least one of a 4-line laser beam, an 8-line laser beam, a 16-line laser beam, a 32-line laser beam, a 64-line laser beam, a 96-line laser beam, and a 128-line laser beam.

[0019] In some embodiments, the receiving module includes a second circuit board, a second chip and a second lens. The second circuit board is mounted on the side where the first surface of the housing is located and covers the second cavity. The second chip is mounted on the side of the second circuit board facing the second cavity, and the second chip is used to receive the optical signal reflected by the object to measure the distance. The second lens is mounted in the second cavity and aligned with the second chip.

[0020] In some embodiments, a second flange portion is provided on an outer side wall of the second lens, and the second flange portion abuts against the second surface.

[0021] In some embodiments, the offset between the optical axis of the second lens and the center of the second chip is less than 300 μm.

[0022] In some embodiments, the second lens comprises: a second lens barrel and a second lens group. The second lens barrel is installed in the second cavity. The second lens group comprises at least two lenses. The second lens group is accommodated in the second lens barrel.

[0023] In some embodiments, the transmitting module includes a first chip, and the receiving module includes a second chip.

[0024] In some embodiments, the angle between the extension direction of the first chip and the extension direction of the second chip is less than or equal to 1°.

[0025] In some embodiments, there is a preset baseline length between the first chip and the second chip, and the offset between the actual baseline length between the first chip and the second chip and the preset baseline length is less than or equal to 300 μm.

[0026] In some embodiments, the transmitting module includes a first circuit board. The first circuit board is mounted on the side where the first surface of the housing is located and covers the first cavity. The receiving module includes a second circuit board. The second circuit board is mounted on the side where the first surface of the housing is located and covers the second cavity. The radar device also includes a shielding cover, which is mounted on the housing and / or the circuit board and covers at least part of the first circuit board; in the transmission direction of the optical signal, the second circuit board is farther away from the second surface than the first circuit board.

[0027] In a second aspect, the present application provides a movable platform. The movable platform comprises a movable platform body and a radar device as described in any one of the above embodiments. The radar device is installed on the movable platform body.

[0028] In some embodiments, the movable platform includes at least one of an aircraft, a vehicle, a robot, a ship, a camera, and a mobile phone.

[0029] In the third aspect, the present application provides an assembly method of a radar device. The assembly method includes: providing a shell, the shell includes a first surface and a second surface opposite to each other, the shell is provided with a first cavity and a second cavity penetrating the first surface and the second surface, the first cavity and the second cavity are arranged side by side; a first circuit board with a first chip installed and a second circuit board with a second chip installed are both installed on the side where the first surface of the shell is located, and cover the first cavity and the second cavity respectively, and make the relative position between the first chip and the second chip meet the preset range; and an active alignment process is used to install the first lens and the second lens in the first cavity and the second cavity respectively, and align the first lens with the first chip, and align the second lens with the second chip.

[0030] In some embodiments, the first circuit board with the first chip mounted on it and the second circuit board with the second chip mounted on it are both mounted on the side where the first surface of the shell is located, and cover the first cavity and the second cavity respectively, and make the relative position between the first chip and the second chip meet the preset range, including: fixing one of the first circuit board with the first chip mounted on it and the second circuit board with the second chip mounted on it on the side where the first surface of the shell is located, and covering the first cavity or the second cavity; attaching the other of the first circuit board with the first chip mounted on it and the second circuit board with the second chip mounted on it to the side where the first surface is located, and covering the second cavity or the first cavity; adjusting the position of the other of the first circuit board with the first chip mounted on it and the second circuit board with the second chip mounted on it with reference to the chip on the first circuit board and the second circuit board fixed first, and monitoring the relative position between the first chip and the second chip by an image acquisition device; and when the relative position meets the preset range, stopping the adjustment and fixing the other of the first circuit board with the first chip mounted on it and the second circuit board with the second chip mounted on it to the side where the first surface of the shell is located.

[0031] In some embodiments, the preset range includes an angle between an extension direction of the first chip and an extension direction of the second chip being less than or equal to 1°; and a preset baseline length between the first chip and the second chip, and an offset between an actual baseline length between the first chip and the second chip and the preset baseline length being less than or equal to 300 μm.

[0032] In some embodiments, the active alignment process is used to install the first lens and the second lens in the first cavity and the second cavity respectively, and the first lens is aligned with the first chip, and the second lens is aligned with the second chip, including: installing one of the first lens and the second lens in the first cavity or the second cavity using the active alignment process, and fully curing to align one of the first lens and the second lens with the first chip or the second chip; installing the other of the first lens and the second lens in the second cavity or the first cavity using the active alignment process, and semi-curing; and adjusting the other of the first lens and the second lens using the active alignment process with the fully cured one of the first lens and the second lens as a reference, until the other of the first lens and the second lens is aligned with the second chip or the first chip and then fully cured.

[0033] In some embodiments, the active alignment process is used to install the first lens and the second lens in the first cavity and the second cavity respectively, and the first lens is aligned with the first chip, and the second lens is aligned with the second chip, including: installing the first lens in the first cavity using an active alignment process, and fully curing to align one of the first lens and the second lens with the first chip; installing the second lens in the second cavity using an active alignment process, and semi-curing; and using the first lens as a reference, adjusting the second lens using an active alignment process until the second lens is aligned with the second chip and then fully curing.

[0034] In some embodiments, the active alignment process is used to install the first lens in the first cavity, and full curing is performed to align one of the first lens and the second lens with the first chip, including: placing the first lens in the first cavity; adjusting the position of the first lens in the first cavity by an active alignment process, and using a first detection system to detect the far-field pointing direction, collimation angle and divergence angle of the light signal emitted by the first lens; when the far-field pointing direction, the collimation angle and the divergence angle respectively satisfy a preset first range, a preset second range and a preset third range, stopping adjusting the position of the first lens in the first cavity, and applying glue to fully cure the connection between the first lens and the shell.

[0035] In some embodiments, the preset first range is less than or equal to 0.5°, the preset second range is less than or equal to 0.6°, and the preset third range is less than or equal to 24° and less than or equal to 26°.

[0036] In some embodiments, the method of installing the second lens in the second cavity using an active alignment process and semi-curing includes: placing the second lens in the second cavity; adjusting the position of the second lens in the second cavity using an active alignment process, and detecting the offset between the optical axis of the second lens and the center of the second chip and the modulation transfer function value of the second lens; when the offset and the modulation transfer function value of the second lens respectively satisfy a preset fourth range and a preset fifth range, stopping adjusting the position of the second lens in the second cavity, and semi-curing the connection between the second lens and the shell by dispensing glue.

[0037] In some embodiments, the preset fourth range is less than or equal to 300 μm, and the preset fifth range is greater than or equal to 0.55.

[0038] In some embodiments, the second lens is adjusted with the first lens as a reference through an active alignment process until the second lens is aligned with the second chip and then fully cured, including: translationally adjusting the second lens mount in a two-dimensional plane perpendicular to its optical axis until the light signal emitted by the first chip and reflected back by the object converges to a predetermined area of ​​the second chip, and then spot-curing the connection between the second lens and the shell.

[0039] In the radar device, movable platform and assembly method of the radar device of the present application, the radar device reduces the number of shells by installing the transmitting module and the receiving module on the same shell, thereby reducing the assembly and adjustment steps between the receiving module and the transmitting module, thereby reducing the assembly and adjustment tolerance of the receiving module and the transmitting module, and reducing the total optical tolerance of the radar device. On the one hand, the assembly and adjustment efficiency of the radar device is improved, and on the other hand, the assembly and adjustment accuracy of the radar device is improved, thereby improving the detection accuracy of the radar device.

[0040] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0042] Figure 1 is a three-dimensional schematic diagram of a radar device according to some embodiments of the present application;

[0043] Figure 2 yes Figure 1 A schematic plan view of the radar device shown;

[0044] Figure 3yes Figure 1 A schematic cross-sectional view of a radar device is shown;

[0045] Figure 4 is a schematic diagram of the working of an image acquisition device in some embodiments of the present application;

[0046] Figure 5 is a three-dimensional schematic diagram of a movable platform in some embodiments of the present application;

[0047] Figure 6 It is a flowchart of the assembly method of the radar device of the present application;

[0048] Figure 7 It is a flowchart of the assembly method of the radar device of the present application;

[0049] Figure 8 It is a flowchart of the assembly method of the radar device of the present application;

[0050] Fig. 9 It is a flowchart of the assembly method of the radar device of the present application;

[0051] Fig.10 It is a flowchart of the assembly method of the radar device of the present application;

[0052] Fig.11 It is a flowchart of the assembly method of the radar device of the present application;

[0053] Fig.12 It is a flowchart of the assembly method of the radar device of the present application.

[0054] Description of main component numbers:

[0055] Movable platform 1000; radar device 100; shell 10; first surface 101; second surface 102; third surface 103; first cavity 11; second cavity 12; transmitting module 30; first circuit board 31; first chip 33; first lens 35; first flange 351; first lens barrel 353; first lens group 355; receiving module 50; second circuit board 51; second chip 53; second lens 55; second flange 551; second lens barrel 553; second lens group 555; shielding cover 70; fixing plate 80; soft wire 90; first connecting end 91; second connecting end 93; image acquisition device 200. DETAILED DESCRIPTION

[0056] In the description of the present application, some of the disclosed contents have been shown in the accompanying drawings accordingly, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The contents described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0057] In the description of the present application, many different contents or examples are disclosed to realize different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application.

[0058] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0059] In the description of the present application, it should be understood that the terms used to indicate orientation or positional relationships (such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc.) are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and facilitating the understanding of the corresponding embodiments, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms used to indicate orientation or positional relationships cannot be understood as limitations on the present application.

[0060] In the description of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0061] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0062] See also Figure 1 The radar device 100 provided in the present application includes a housing 10, a transmitting module 30 and a receiving module 50. The housing 10 includes a first surface 101 and a second surface 102 opposite to each other. The housing 10 is provided with a first cavity 11 and a second cavity 12 penetrating the first surface 101 and the second surface 102, and the first cavity 11 and the second cavity 12 are arranged side by side. The transmitting module 30 is accommodated in the first cavity 11, and the transmitting module 30 is used to transmit an optical signal to the outside of the radar device 100. The receiving module 50 is accommodated in the second cavity 12, and the receiving module 50 is used to receive the optical signal reflected back by the object.

[0063] Specifically, the housing 10 is a structure that accommodates the components of the radar device 100. The housing 10 can protect other components and has a certain degree of waterproof performance to prevent external fluid from flowing into the housing 10. Other components include but are not limited to the transmitting module 30 and the receiving module 50. The cross-sectional shape of the housing 10 can be, but is not limited to, circular, elliptical, rectangular or other polygonal shapes. The material of the housing 10 can be plastic or metal. In the case where the material of the housing 10 is plastic, the housing 10 has good insulation performance, low cost, and light weight. In the case where the material of the housing 10 is metal, the housing 10 has high strength, good wear resistance, and long service life. In the present application, the length direction of the housing 10 is the length direction of the radar device 100, the width direction of the housing 10 is the width direction of the radar device 100, and the height direction of the housing 10 is the height direction of the radar device 100. Among them, the first surface 101 and the second surface 102 are the opposite sides of the housing 10 in the length direction.

[0064] The first cavity 11 is used to accommodate the emission module 30. In the projection plane perpendicular to the length direction, the shape of the cross section of the first cavity 11 can be rectangular, circular or other shapes. Preferably, the shape and size of the first cavity 11 match the outer contour of the emission module 30, so that the emission module 30 can be accommodated in the first cavity 11 and is not easy to shift, avoiding displacement or loosening. The first cavity 11 also has a positioning effect, so that the emission module 30 can be quickly positioned and the adjustment efficiency is improved. There is also a certain gap between the first cavity 11 and the emission module 30, which facilitates the adjustment of the emission module 30 and improves the adjustment accuracy of the emission module 30.

[0065] The second cavity 12 is used to accommodate the receiving module 50. In the projection plane perpendicular to the length direction, the shape of the cross section of the second cavity 12 can be rectangular, circular or other shapes. Preferably, the shape and size of the second cavity 12 match the outer contour of the receiving module 50, so that the receiving module 50 can be accommodated in the second cavity 12 and is not easy to shift, avoiding displacement or loosening. The second cavity 12 also has a positioning effect, so that the receiving module 50 can be quickly positioned and the adjustment efficiency is improved. There is also a certain gap between the second cavity 12 and the receiving module 50, which facilitates the adjustment of the receiving module 50 and improves the adjustment accuracy of the receiving module 50.

[0066] The first cavity 11 and the second cavity 12 are arranged side by side, that is, the center line of the first cavity 11 and the center line of the second cavity 12 are arranged in parallel. In an embodiment of the present application, the first cavity 11 and the second cavity 12 are arranged side by side in the height direction. In other embodiments of the present application, the first cavity 11 and the second cavity 12 can be arranged side by side in the length direction, side by side in the width direction, or side by side in other directions. The side-by-side arrangement allows the first cavity 11 and the second cavity 12 to form a stacked structure, which saves space in the housing 10 on the one hand, and allows the transmitting module 30 accommodated in the first cavity 11 and the receiving module 50 accommodated in the second cavity 12 to be compactly arranged.

[0067] The first cavity 11 and the second cavity 12 are both arranged in the same shell 10, that is, the receiving module 50 and the transmitting module 30 are both accommodated in the same shell 10. Compared with the receiving module and the transmitting module being accommodated in different shells, accommodating them in the same shell 10 does not require the installation and adjustment steps between different shells 10. Therefore, the tolerance formed by the installation and adjustment between different shells 10 can be eliminated, thereby reducing the total optical tolerance of the radar device 100.

[0068] The transmitting module 30 transmits a light signal (transmitted light signal) to the outside of the radar device 100. The light signal will be reflected when it encounters an object. The receiving module 50 is used to capture and receive the light signal (received light signal) reflected back by the object. The radar device 100 can extract the information of the object after processing the transmitted light signal and the received light signal. The signal processing process includes but is not limited to signal amplification, signal filtering, obtaining the time difference between the transmitted light signal and the received light signal, obtaining the phase difference between the transmitted light signal and the received light signal, or obtaining the frequency difference between the transmitted light signal and the received light signal, etc. The information of the object includes but is not limited to the position and speed of the object. The signal processing process can be completed by the receiving module 50 or by other modules in the radar device 100.

[0069] Among them, the type of radar device 100 of the present application is not limited. In the embodiment where the radar device 100 is a laser radar, the laser radar can be classified according to the measurement method to include time of flight (Time of Flight, ToF) radar and frequency modulated continuous wave (Frequency Modulated Continuous Wave, FMCW) radar. Time of flight radar obtains the distance information of the object by measuring the time difference between the light signal emitted by the transmitting module 30 and the light signal reflected by the object received by the receiving module 50. The time of flight radar has the advantages of fast response speed and high detection accuracy; the frequency modulated continuous wave radar linearly modulates the light signal emitted by the transmitting module 30, and the light signal reflected by the object received by the receiving module 50 is coherently beat with the reference light to obtain the frequency difference, thereby indirectly obtaining the distance information of the object. The frequency modulated continuous wave radar has the advantages of being able to directly measure speed information and strong anti-interference.

[0070] In the radar device 100, the movable platform 1000 and the assembly method of the radar device 100 of the present application, the radar device 100 reduces the number of shells 10 by installing the transmitting module 30 and the receiving module 50 on the same shell 10, thereby reducing the installation and adjustment steps between the receiving module 50 and the transmitting module 30, thereby reducing the tolerance of the installation and adjustment of the receiving module 50 and the transmitting module 30, and reducing the total optical tolerance of the radar device 100. On the one hand, the installation and adjustment efficiency of the radar device 100 is improved, and on the other hand, the installation and adjustment accuracy of the radar device 100 is improved, thereby improving the detection accuracy of the radar device 100.

[0071] See also Figures 1 to 3 In some embodiments, the transmitting module 30 includes a first circuit board 31, a first chip 33 and a first lens 35. The first circuit board 31 is mounted on the side where the first surface 101 of the housing 10 is located, and covers the first cavity 11. The first chip 33 is mounted on the side of the first circuit board 31 facing the first cavity 11, and the first chip 33 is used to transmit an optical signal. The first lens 35 is at least partially mounted in the first cavity 11 and aligned with the first chip 33.

[0072] Specifically, the first circuit board 31 is installed on the side where the first surface 101 of the housing 10 is located, that is, the first circuit board 31 and the housing 10 are two different structures. In one example, the first circuit board 31 and the housing 10 can be combined together in a detachable connection manner, and the detachable connection manner includes but is not limited to a snap connection or a threaded connection. In another example, the first circuit board 31 and the housing 10 can be combined together in a non-detachable connection manner, and the non-detachable connection manner includes but is not limited to bonding or welding.

[0073] Further, the first circuit board 31 is fixed to the first surface 101 of the housing 10 by screws. In this way, on the one hand, the first circuit board 31 and the housing 10 can be firmly connected and not easily displaced, and the optical signal emitted by the first chip 33 is not easily offset. On the other hand, screw locking is a detachable connection method, and the first circuit board 31 is easy to disassemble and repair, which can reduce the scrap rate of the first circuit board 31. In addition, in the present application, the transmitting module 30 uses the first circuit board 31, and the receiving module 50 uses the second circuit board 51. Compared with the transmitting module 30 and the receiving module 50 sharing the same circuit board, the total volume of the circuit board can be reduced, the space occupied by the radar device 100 can be reduced, and the cost of the radar device 100 can be reduced. The first circuit board 31 covers the first cavity 11, which can avoid the leakage of the optical signal and avoid interference with other components. The first chip 33 is installed on the side of the first circuit board 31 facing the first cavity 11, so that the optical signal emitted by the first chip 33 can pass through the first cavity 11 and the first lens 35 to the outside of the radar device 100.

[0074] The first lens 35 is used to modulate the optical signal emitted by the first chip 33 and guide it to the outside of the radar device 100. The first lens 35 may include one lens or multiple lenses. The modulation of the optical signal by the first lens 35 includes but is not limited to range modulation, intensity modulation, frequency modulation, phase modulation, amplitude modulation, etc. of the optical signal. For example, the range modulation of the optical signal includes but is not limited to focusing the optical signal, diverging the optical signal, etc. Among them, in the embodiment where the first lens 35 includes multiple lenses, the modulation contents of the multiple lenses may be different.

[0075] The first lens 35 is at least partially installed in the first cavity 11, and the first cavity 11 can accommodate part of the first lens 35, so that the first lens 35 is not easily displaced, and displacement or loosening is avoided. The first lens 35 is aligned with the first chip 33, that is, the deviation between the optical axis of the first lens 35 and the center of the first chip 33 is less than a predetermined range. The predetermined range is not limited in the present application, and preferably, the optical axis of the first lens 35 coincides with the center of the first chip 33. In some embodiments, a first flange portion 351 is provided on the outer side wall of the first lens 35, and the first flange portion 351 is in contact with the second surface 102 and connected to the second surface 102 by adhesive. The first flange 351 protrudes and extends from the outer side wall of the first lens 35 in a direction away from the outer side wall. The side of the first flange 351 close to the second surface 102 contacts the second surface 102. Therefore, the contact area between the flange and the housing 10 is relatively large. On the one hand, it can provide a stable support for the first lens 35 to prevent the first lens 35 from being displaced or loosened due to vibration or other external forces. On the other hand, the flange can help the first lens 35 to be quickly positioned and fixed, thereby improving the installation efficiency of the first lens 35. In addition, the flange increases the surface area of ​​the first lens 35, which can improve the heat dissipation efficiency of the first lens 35, prevent the first lens 35 from overheating, and thus ensure the stability of the operation of the emission module 30.

[0076] Among them, the first flange portion 351 is connected to the second surface 102 by adhesive. Since the volume of the first lens 35 is relatively small compared to the shell 10 and the first circuit board 31, the size of the adhesive dispensed each time is small and the amount of adhesive used is small. In this way, the deformation risk of the connection between the first flange portion 351 and the second surface 102 can be reduced, thereby reducing the risk of the first lens 35 offset relative to the shell 10, thereby ensuring the detection accuracy of the radar device 100.

[0077] See also Figures 1 to 3 In some embodiments, the far-field pointing angle of the optical signal modulated by the first lens 35 is less than or equal to 0.5°.

[0078] Specifically, the far-field pointing is the propagation direction of the light signal after the light signal moves away from the first chip 33. The far-field pointing characterizes the degree of collimation of the light signal, that is, the ability of the light beam to remain parallel during propagation. The far-field pointing of the light signal modulated by the first lens 35 can be 0.05°, 0.1°, 0.15°, 0.18°, 0.2°, 0.25°, 0.3°, 0.34°, 0.4° or 0.5°. If the far-field pointing of the light signal modulated by the first lens 35 is greater than 0.5°, the degree of divergence of the light signal in the far field is too large, and the intensity of the light signal decreases during propagation, affecting the detection distance and signal quality of the radar device 100. The far-field pointing of the light signal modulated by the first lens 35 is less than or equal to 0.5°, which can reduce the dispersion of the light signal energy and ensure the signal strength of the light signal, thereby improving the detection distance and signal quality.

[0079] See also Figures 1 to 3 In some embodiments, the collimation angle of the optical signal modulated by the first lens 35 is less than or equal to 0.6°.

[0080] Specifically, the collimation angle of the optical signal is the divergence angle of the optical signal in the far field, that is, the angle at which the optical signal diverges outward from the central axis. The collimation angle characterizes the degree of focus or divergence of the optical signal. The collimation angle of the optical signal modulated by the first lens 35 can be 0.05°, 0.1°, 0.15°, 0.18°, 0.2°, 0.25°, 0.3°, 0.34°, 0.5° or 0.6°. If the collimation angle of the optical signal modulated by the first lens 35 is greater than 0.6°, the optical signal has a high degree of divergence during propagation, the optical signal has a poor degree of focus, and the optical signal is easily affected by environmental factors (such as air flow and temperature changes), resulting in the propagation direction of the optical signal easily drifting, affecting the detection accuracy of the radar device 100. When the collimation angle of the light signal modulated by the first lens 35 is less than or equal to 0.6°, the light signal has a small divergence during propagation, a good focusing degree, and a propagation direction of the light signal is not prone to drift, thereby ensuring the detection accuracy of the radar device 100.

[0081] See also Figures 1 to 3 In some embodiments, the divergence angle of the light signal modulated by the first lens 35 is 25°±1°, that is, greater than or equal to 24° and less than or equal to 26°.

[0082] Specifically, the divergence angle of the optical signal is a parameter that describes the degree to which the optical signal diverges from the center of the optical signal. The divergence angle characterizes the quality of the optical signal. The divergence angle of the optical signal modulated by the first lens 35 can be 24°, 24.2°, 24.45°, 24.88°, 25°, 25.25°, 25.3°, 25.34°, 25.5° or 26°. If the divergence angle of the optical signal modulated by the first lens 35 is less than 24°, the energy of the optical signal is too concentrated, which on the one hand limits the propagation range of the optical signal, and on the other hand is prone to excessive radiation in some areas radiated by the optical signal, which is easy to cause damage to objects in the area; if the divergence angle of the optical signal modulated by the first lens 35 is greater than 26°, the energy of the optical signal is too divergent, and the optical signal is easily interfered by other stray signals in the environment. The divergence angle of the optical signal modulated by the first lens 35 is greater than or equal to 24° and less than or equal to 26°, which can ensure that the energy of the optical signal is moderate. On the one hand, it ensures the propagation range of the optical signal, and on the other hand, it is not easy to generate excessive radiation in some areas radiated by the optical signal, thereby avoiding damage to objects in the area and is not easily interfered by other stray signals in the environment.

[0083] See also Figures 1 to 3In some embodiments, the housing 10 further includes a third surface 103 connecting the first surface 101 and the second surface 102. The radar device 100 further includes a shielding cover 70, which is mounted on the third surface 103 and / or the first circuit board 31 and covers at least a portion of the first circuit board 31.

[0084] Specifically, in one embodiment, the shielding cover 70 is mounted on the third surface 103 and the first circuit board 31; in another embodiment, the shielding cover 70 is mounted on the third surface 103; in yet another embodiment, the shielding cover 70 is mounted on the first circuit board 31. In the embodiment of the present application, the shielding cover 70 is bent to form a first portion and a second portion, wherein the second portion is connected to the first circuit board 31.

[0085] On the one hand, the shielding cover 70 can block external electromagnetic waves and prevent external electromagnetic waves from interfering with the first circuit board 31 and the components (such as the first chip 33) on the first circuit board 31. On the other hand, since the energy of the optical signal emitted by the first chip 33 is relatively large, the shielding cover 70 can reduce the electromagnetic radiation of the first circuit board 31 itself to the outside world and prevent the optical signal emitted by the first chip 33 from affecting other components of the radar device 100.

[0086] See also Figures 1 to 3 In some embodiments, the radar device 100 further includes a fixing plate 80 , which is mounted on a side of the first circuit board 31 that is away from the first cavity 11 .

[0087] Specifically, in one example, the fixing plate 80 and the first circuit board 31 can be connected together in a detachable connection manner, and the detachable connection manner includes but is not limited to a snap connection or a threaded connection. In another example, the fixing plate 80 and the first circuit board 31 can be connected together in a non-detachable connection manner, and the non-detachable connection manner includes but is not limited to bonding or welding. Further, the fixing plate 80 is screwed to the side of the first circuit board 31 away from the first cavity 11. In this way, on the one hand, the fixing plate 80 and the first circuit board 31 can be firmly connected and not easily displaced. On the other hand, screw locking is a detachable connection method, and the fixing plate 80 is easy to disassemble and repair, which can reduce the scrap rate of the fixing plate 80. The fixing plate 80 can prevent the erosion of dust, moisture and other environmental factors on the first circuit board 31, thereby extending the service life of the first circuit board 31.

[0088] See also Figures 1 to 3 In some embodiments, the fixing plate 80 is a hard plate used to strengthen the first circuit board 31 .

[0089] Specifically, the material of the fixing plate 80 may be plastic or metal. When the material of the fixing plate 80 is plastic, the fixing plate 80 has good insulation performance, low cost, and light weight. When the material of the fixing plate 80 is metal, the fixing plate 80 has high strength, good wear resistance, and long service life. The fixing plate 80 can block part of the external force, preventing the first circuit board 31 from deforming and displacing when subjected to external force, thereby ensuring the stability of the position of the first chip 33 and ensuring the detection accuracy of the radar device 100.

[0090] See also Figures 1 to 3 In some embodiments, a heat dissipation structure is provided on the fixing plate 80, and the heat dissipation structure is used to dissipate the heat on the first circuit board 31. The heat dissipation structure can improve the heat dissipation efficiency of the first circuit board 31 and avoid overheating of the first circuit board 31, thereby ensuring the stability of the operation of the transmitting module 30.

[0091] See also Figures 1 to 3 In some embodiments, a connection structure is provided on the fixing plate 80, and the connection structure is used to connect with an external device. The connection structure can simplify the installation and maintenance process of the circuit board and improve the installation efficiency of the first circuit board 31.

[0092] See also Figure 2 In some embodiments, the radar device 100 further includes a flexible wire 90. The flexible wire 90 includes a first connection end 91 and a second connection end 93. The first connection end 91 is engaged with the first circuit board 31, and the second connection end 93 is used to connect to the main control board of the radar device 100.

[0093] Specifically, the soft wire 90 can connect the first circuit board 31 and the main control board to realize the main control board to control the first circuit board 31. In addition, the soft wire 90 can also connect the second circuit board 51 and the main control board to realize the main control board to control the second circuit board 51. The soft wire 90 can connect the first circuit board 31 and the second circuit board 51 to realize the interaction between the first circuit board 31 and the second circuit board 51. The snap connection is a detachable connection mode. The first connection end 91 is snap-connected with the first circuit board 31, which is convenient for the removal and installation of the soft wire 90.

[0094] See also Figure 2 In some embodiments, the first lens 35 includes a first lens barrel 353 and a first lens group 355. The first lens barrel 353 is installed in the first cavity 11; the first lens group 355 includes at least two lenses. The first lens group 355 is accommodated in the first lens barrel 353, and the modulation transfer function value of the first lens group 355 is greater than or equal to 0.55.

[0095] Specifically, the first lens group 355 is accommodated in the first lens barrel 353, so that the first lens barrel 353 can provide an accommodation space for the first lens, so that the first lens group 355 is not easily displaced or loosened. The shape of the lens can be circular, elliptical, triangular, quadrilateral or other polygons. The material of the lens is not limited in the present application. In the embodiment where the material of the lens is glass, the lens made of glass has a small temperature drift and can also form a clear image at extremely high temperatures, which can improve the resolution accuracy of the radar device 100; the lens made of plastic has a low cost and can reduce the cost of the radar device 100. The materials of the multiple lenses of the first lens group 355 can be the same, or they can all be different, or they can be partially different.

[0096] The modulation transfer function (MTF) value of the first lens group 355 represents the transmission capability of the emission module 30 where the first lens group 355 is located for the contrast of different spatial frequencies. The modulation transfer function value is between 0 and 1, and can measure the ratio of the contrast of the output image to the contrast of the input image. The modulation transfer function value of the first lens group 355 can be 0.55, 0.61, 0.68, 0.73, 0.75, 0.81, 0.85, 0.93, 0.95 or 1. If the modulation transfer function value of the first lens group 355 is less than 0.55, the ability of the first lens group 355 to transmit image details is weak, the ratio of the contrast of the output image to the contrast of the input image is too small, the contrast of the image is not obvious, and it is easy to cause the details such as the edge and texture of the image to be blurred, the image resolution is insufficient, and the image quality is reduced.

[0097] If the modulation transfer function value of the first lens group 355 is greater than or equal to 0.55, the first lens group 355 has a high ability to transmit image details, a high ratio of the contrast of the output image to the contrast of the input image, obvious light and dark contrast of the image, clear details such as image edges and textures, high image resolution, and high image quality.

[0098] See also Figure 1 In some embodiments, the first chip 33 is used to emit at least one of a 4-line laser beam, an 8-line laser beam, a 16-line laser beam, a 32-line laser beam, a 64-line laser beam, a 96-line laser beam, and a 128-line laser beam.

[0099] Specifically, the first chip 33 can emit laser beams with different line numbers to adapt to different detection environments. The line number is the number of optical signals that the radar device 100 can simultaneously transmit and receive. Low-line laser beams (such as 4-line laser beams or 8-line laser beams) have low cost and high sensitivity, and are suitable for near-field detection by the radar device 100; high-line laser beams (such as 64-line laser beams or 128-line laser beams) have a wide field of view and densely collected data, and are suitable for far-field detection by the radar device 100.

[0100] See also Figure 2 In some embodiments, the receiving module 50 includes a second circuit board 51, a second chip 53 and a second lens 55. The second circuit board 51 is installed on the side where the first surface 101 of the housing 10 is located, and covers the second cavity 12. The second chip 53 is installed on the side of the second circuit board 51 facing the second cavity 12, and the second chip 53 is used to receive the optical signal reflected by the object to measure the distance. The second lens 55 is installed in the second cavity 12 and aligned with the second chip 53.

[0101] The second circuit board 51 is installed on the side where the first surface 101 of the housing 10 is located, that is, the second circuit board 51 and the housing 10 are two different structures. In one example, the second circuit board 51 and the housing 10 can be combined together in a detachable connection manner, and the detachable connection manner includes but is not limited to a snap connection or a threaded connection. In another example, the second circuit board 51 and the housing 10 can be combined together in a non-detachable connection manner, and the non-detachable connection manner includes but is not limited to bonding or welding.

[0102] Further, the second circuit board 51 is fixed to the first surface 101 of the housing 10 by screws. In this way, on the one hand, the second circuit board 51 and the housing 10 can be firmly connected and not easily displaced, and the optical signal emitted by the second chip 53 can be ensured not to be easily offset. On the other hand, screw locking is a detachable connection method, and the second circuit board 51 is easy to disassemble and repair, which can reduce the scrap rate of the second circuit board 51. In addition, in the present application, the transmitting module 30 uses the second circuit board 51, and the receiving module 50 uses the second circuit board 51. Compared with the transmitting module 30 and the receiving module 50 sharing the same circuit board, the total volume of the circuit board can be reduced, the space occupied by the radar device 100 can be reduced, and the cost of the radar device 100 can be reduced. The second circuit board 51 covers the second cavity 12, which can avoid the leakage of the optical signal and avoid interference with other components. The second chip 53 is installed on the side of the second circuit board 51 facing the second cavity 12, so that the optical signal emitted by the second chip 53 can pass through the second cavity 12 and the second lens 55 to the outside of the radar device 100.

[0103] The second lens 55 is used to modulate the reflected optical signal and guide it to the second chip 53. The second lens 55 may include one lens or multiple lenses. The modulation of the optical signal by the second lens 55 includes but is not limited to the range modulation, intensity modulation, frequency modulation, phase modulation, amplitude modulation, etc. of the optical signal. For example, the range modulation of the optical signal includes but is not limited to focusing the optical signal, diverging the optical signal, etc. Among them, in the embodiment where the second lens 55 includes multiple lenses, the modulation contents of the multiple lenses may be different.

[0104] The second lens 55 is at least partially installed in the second cavity 12, and the second cavity 12 can accommodate part of the second lens 55, so that the second lens 55 is not easily displaced, and displacement or loosening is avoided. The second lens 55 is aligned with the second chip 53, that is, the deviation between the optical axis of the second lens 55 and the center of the second chip 53 is less than a predetermined range. The predetermined range is not limited in the present application, and preferably, the optical axis of the second lens 55 coincides with the center of the second chip 53. In some embodiments, a second flange portion 551 is provided on the outer side wall of the second lens 55, and the second flange portion 551 is in contact with the second surface 102 and connected to the second surface 102 by adhesive. The second flange 551 protrudes and extends from the outer side wall of the second lens 55 in a direction away from the outer side wall, and the side of the second flange 551 close to the second surface 102 contacts the second surface 102, so the contact area between the flange and the housing 10 is relatively large. On the one hand, it can provide a stable support for the second lens 55 to prevent the second lens 55 from being displaced or loosened due to vibration or other external forces. On the other hand, the flange can help the second lens 55 to be quickly positioned and fixed, thereby improving the installation efficiency of the second lens 55. In addition, the flange increases the surface area of ​​the second lens 55, which can improve the heat dissipation efficiency of the second lens 55, prevent the second lens 55 from overheating, and thus ensure the stability of the operation of the emission module 30.

[0105] Among them, the second flange portion 551 is connected to the second surface 102 by adhesive. Since the volume of the second lens 55 is relatively small compared to the shell 10 and the second circuit board 51, the size of the adhesive dispensed each time is small and the amount of adhesive used is small. In this way, the deformation risk of the connection between the second flange portion 551 and the second surface 102 can be reduced, thereby reducing the risk of the second lens 55 shifting relative to the shell 10, thereby ensuring the detection accuracy of the radar device 100.

[0106] See also Figure 2 and Figure 4 In some embodiments, the offset between the optical axis of the second lens 55 and the center of the second chip 53 is less than or equal to 300 μm.

[0107] Specifically, the offset between the optical axis of the second lens 55 and the center of the second chip 53 is the minimum distance from the center of the second chip 53 to the optical axis of the second lens 55, which represents the alignment accuracy between the optical axis of the second lens 55 and the center of the second chip 53. The offset between the optical axis of the second lens 55 and the center of the second chip 53 can be 0μm, 140μm, 150μm, 180μm, 200μm, 210μm, 240μm, 270μm, 290μm or 300μm. If the offset between the optical axis of the second lens 55 and the center of the second chip 53 is greater than 300μm, the distance between the optical axis of the second lens 55 and the center of the second chip 53 is too large, the alignment accuracy is low, and the optical signal reflected by the object is difficult to be accurately received by the second chip 53, thereby causing optical signal loss and distortion, affecting the detection accuracy of the radar device 100.

[0108] If the offset between the optical axis of the second lens 55 and the center of the second chip 53 is less than or equal to 300 μm, the distance between the optical axis of the second lens 55 and the center of the second chip 53 is small, the alignment accuracy is high, the light signal reflected by the object can be accurately received by the second chip 53, and the loss and distortion of the light signal are small, thereby ensuring the detection accuracy of the radar device 100.

[0109] See also Figure 2 and Figure 4 In some embodiments, the second lens 55 includes: a second lens barrel 553 and a second lens group 555. The second lens barrel 553 is installed in the second cavity 12. The second lens group 555 includes at least two lenses. The second lens group 555 is accommodated in the second lens barrel 553, and the modulation transfer function value of the second lens group 555 is greater than or equal to 0.55.

[0110] Specifically, the second lens group 555 is accommodated in the second lens barrel 553, so that the second lens barrel 553 can provide an accommodation space for the second lens, so that the second lens group 555 is not easily displaced or loosened. The shape of the lens can be circular, elliptical, triangular, quadrilateral or other polygons. The material of the lens is not limited in the present application. In the embodiment where the material of the lens is glass, the lens made of glass has a small temperature drift and can also form a clear image at extremely high temperatures, which can improve the resolution accuracy of the radar device 100; the lens made of plastic has a low cost and can reduce the cost of the radar device 100. The materials of the multiple lenses of the second lens group 555 can be the same, or they can all be different, or they can be partially different.

[0111] The modulation transfer function value of the second lens group 555 represents the transmission capability of the receiving module 50 where the second lens group 555 is located for the contrast of different spatial frequencies. The modulation transfer function value is between 0 and 1, and can measure the ratio of the contrast of the output image to the contrast of the input image. The modulation transfer function value of the second lens group 555 can be 0.55, 0.61, 0.68, 0.73, 0.75, 0.81, 0.85, 0.93, 0.95 or 1. If the modulation transfer function value of the second lens group 555 is less than 0.55, the second lens group 555 has a weak ability to transmit image details, the ratio of the contrast of the output image to the contrast of the input image is too small, the contrast of the image is not obvious, and it is easy to cause the details such as the edge and texture of the image to be blurred, the image resolution is insufficient, and the image quality is reduced.

[0112] If the modulation transfer function value of the second lens group 555 is greater than or equal to 0.55, the second lens group 555 has a high ability to transmit image details, a high ratio of the contrast of the output image to the contrast of the input image, obvious light and dark contrast of the image, clear details such as image edges and textures, high image resolution, and high image quality.

[0113] See also Figure 2 In some embodiments, the transmitting module 30 includes a first chip 33 , and the receiving module 50 includes a second chip 53 .

[0114] Specifically, the optical signal emitted by the first chip 33 is modulated by the first lens 35 and then emitted to the outside of the radar device 100. After being reflected by the object, the optical signal is modulated by the second lens 55 and then received by the second chip 53, thereby realizing optical detection of the radar device 100.

[0115] In some embodiments, the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 is less than or equal to 1°.

[0116] Specifically, the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 refers to the angle between the axes of the first chip 33 and the second chip 53. The angle represents the degree of alignment of the optical axes of the first chip 33 and the second chip 53 to ensure that the transmitted and received optical signals can be accurately aligned.

[0117] The angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 can be 0.1°, 0.2°, 0.3°, 0.4°, 0.5°, 0.6°, 0.7°, 0.8°, 0.9° or 1°. If the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 is greater than 1°, the alignment of the optical signal emitted by the transmitting module 30 and the optical signal reflected by the object received by the receiving module 50 is inaccurate, the optical signal reflected by the object is difficult to be accurately received by the second chip 53, the loss of the optical signal during the transmission process increases, resulting in a decrease in the intensity and quality of the optical signal.

[0118] If the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 is less than or equal to 1°, the optical signal emitted by the transmitting module 30 and the optical signal reflected by the object received by the receiving module 50 are accurately aligned, the optical signal reflected by the object can be accurately received by the second chip 53, and the loss of the optical signal during transmission is small, thereby ensuring the strength and quality of the optical signal reflected by the object received by the receiving module 50.

[0119] See also Figure 2 and Figure 4 In some embodiments, there is a preset baseline length between the first chip 33 and the second chip 53, and the offset between the actual baseline length and the preset baseline length between the first chip 33 and the second chip 53 is less than or equal to 300 μm.

[0120] Specifically, the actual baseline length between the first chip 33 and the second chip 53 is the length between the center of the first chip 33 and the center of the second chip 53. The offset between the actual baseline length between the first chip 33 and the second chip 53 and the preset baseline length may be 10 μm, 140 μm, 150 μm, 180 μm, 200 μm, 210 μm, 240 μm, 270 μm, 290 μm or 300 μm. If the offset between the actual baseline length between the first chip 33 and the second chip 53 and the preset baseline length is greater than 300 μm, the offset is too large, which may result in low detection accuracy of the radar device 100.

[0121] The offset between the actual baseline length and the preset baseline length between the first chip 33 and the second chip 53 is less than or equal to 300 μm. The small offset can ensure high detection accuracy of the radar device 100 .

[0122] See also Figure 2 and Figure 3In some embodiments, the transmitting module 30 includes a first circuit board 31. The first circuit board 31 is mounted on the side where the first surface 101 of the housing 10 is located, and covers the first cavity 11. The receiving module 50 includes a second circuit board 51. The second circuit board 51 is mounted on the side where the first surface 101 of the housing 10 is located, and covers the second cavity 12. The radar device 100 also includes a shielding cover 70, which is mounted on the housing 10 and / or the circuit board and covers at least part of the first circuit board 31; in the transmission direction of the optical signal, the second circuit board 51 is farther away from the second surface 102 than the first circuit board 31.

[0123] Specifically, the first circuit board 31 covers the first cavity 11, which can prevent the optical signal emitted by the first chip 33 from being affected by the outside world. The second circuit board 51 covers the second cavity 12, which can prevent the optical signal reflected by the object and received by the receiving module 50 from being affected by the outside world. The shielding cover 70 covers at least part of the first circuit board 31, which can reduce the influence of the optical signal emitted by the first chip 33 on the outside world and the receiving module 50. In this way, in the transmission direction of the optical signal, the optical signal emitted by the first chip 33 is emitted from the first cavity 11 to the outside, and is partially reflected by the object and returned to the second cavity 12 to be received by the receiving module 50.

[0124] See also Figure 1 , Figure 2 and Figure 5 The present application provides a movable platform 1000. The movable platform 1000 includes a movable platform 1000 body and a radar device 100 of any one of the above embodiments. The radar device 100 is installed on the movable platform 1000 body.

[0125] The movable platform 1000 of the present application is equipped with a radar device 100. The radar device 100 reduces the number of housings 10 by installing the transmitting module 30 and the receiving module 50 on the same housing 10, thereby reducing the installation and adjustment steps between the receiving module 50 and the transmitting module 30, thereby reducing the tolerance of the installation and adjustment of the receiving module 50 and the transmitting module 30, and reducing the total optical tolerance of the radar device 100. On the one hand, the installation and adjustment efficiency of the radar device 100 is improved, and on the other hand, the installation and adjustment accuracy of the radar device 100 is improved, thereby improving the detection accuracy of the radar device 100. In some embodiments, the movable platform 1000 includes at least one of an aircraft, a vehicle, a robot, a ship, a camera, and a mobile phone. The movable platform 1000 can be loaded with one or more radar devices 100, thereby realizing the detection of different movable platforms 1000 under different environments and requirements.

[0126] See also Figure 1 , Figure 2 and Figure 6 , the present application provides an assembly method of a radar device 100. The assembly method comprises:

[0127] 01: Provide a housing 10, the housing 10 comprises a first surface 101 and a second surface 102 opposite to each other, the housing 10 is provided with a first cavity 11 and a second cavity 12 penetrating the first surface 101 and the second surface 102, and the first cavity 11 and the second cavity 12 are arranged side by side;

[0128] 03: The first circuit board 31 with the first chip 33 mounted thereon and the second circuit board 51 with the second chip 53 mounted thereon are mounted on the side where the first surface 101 of the housing 10 is located, and cover the first cavity 11 and the second cavity 12 respectively, and make the relative position between the first chip 33 and the second chip 53 meet the preset range; and

[0129] 05: The first lens 35 and the second lens 55 are respectively installed in the first cavity 11 and the second cavity 12 by using an active alignment process, and the first lens 35 is aligned with the first chip 33, and the second lens 55 is aligned with the second chip 53.

[0130] Specifically, the active alignment (AA) process can determine the relative position and posture of each optical element of the internal radar device 100. The optical elements include but are not limited to the first lens 35, the second lens 55, the first chip 33 and the second chip 53. During the assembly process, the active alignment process detects and adjusts the state of the optical element that has not yet completed the alignment (the relative position and posture with other elements) in real time through the first detection system to ensure that the optical element reaches the best relative position and posture. The active alignment process can effectively reduce the assembly tolerance and improve the consistency and reliability of the radar device 100. However, although the assembly tolerance of the active alignment process is very small, in the existing radar device adjustment scheme, since the shell of the transmitting module and the shell of the receiving module are independent of each other, they need to be separated separately for adjustment. The more times of adjustment, the greater the total optical tolerance caused by the superposition of tolerances, which greatly affects the performance of the radar device. Performance includes indicators such as detection distance, detection accuracy, and field of view angle range. Furthermore, the prior art adjustment scheme at least includes active alignment of the transmitting lens of the transmitting module and the transmitting chip of the transmitting module, active alignment of the receiving lens of the receiving module and the receiving chip of the receiving module, active alignment of the receiving lens of the receiving module and the transmitting chip of the transmitting module, and active alignment of the shell of the transmitting module and the shell of the receiving module (i.e., the relative joint adjustment step of the receiving module and the transmitting module). Therefore, in order to effectively improve the adjustment accuracy and adjustment efficiency, the present application proposes an assembly method of a radar device 100. The assembly method of the radar device 100 of the present application can be applied to any embodiment of the radar device 100, and therefore, it also has the beneficial effects of any radar device 100. Among them, the receiving module 50 and the transmitting module 30 of the present application are both accommodated in the same shell 10, so there is no need for the active alignment step of the shell, and there is no tolerance caused by the relative joint adjustment of the receiving module and the transmitting module.

[0131] In the method of 01, the first cavity 11 and the second cavity 12 are both arranged in the same shell 10, that is, the receiving module 50 and the transmitting module 30 are both accommodated in the same shell 10. Compared with the receiving module 50 and the transmitting module 30 being accommodated in different shells 10, accommodating them in the same shell 10 does not require the adjustment steps between different shells 10, thereby reducing the steps of the assembly method of the radar device 100. As a result, the tolerance formed by the adjustment between different shells 10 can be eliminated, thereby reducing the total optical tolerance of the radar device 100 and improving the assembly accuracy of the assembly method of the radar device 100.

[0132] In the method of 03, the installation and adjustment process can be to first fix the first circuit board 31, and then adjust the position of the second circuit board 51 installed with the second chip 53 with reference to the first chip 33 on the first circuit board 31, or to first fix the second circuit board 51, and then adjust the position of the first circuit board 31 installed with the first chip 33 with reference to the second chip 53 on the second circuit board 51.

[0133] Among them, in the assembly process of methods 03 and 05, the element used to adjust the position of the radar device 100 is a device provided by the equipment of the active alignment process, which is collectively referred to as an adjustment device in this application, and the adjustment device includes but is not limited to a mobile platform, a rotation adjustment device, an automatic locking system or a mechanical arm, etc. Further, the adjustment devices of different elements of the mobile radar device 100 can be the same or different.

[0134] The adjustment device includes six-dimensional adjustment for the position adjustment of the component. The six-dimensional adjustment includes the adjustment of six degrees of freedom, and the six degrees of freedom include three translation dimensions (X, Y, Z axis) and three rotation dimensions (rotation around X, Y, Z axis). The translation dimension adjustment can make the component change its position precisely along the three coordinate axis directions in space, and the rotation adjustment (pitch) around the X axis is for the adjustment device to adjust the angle of the component up and down, the rotation adjustment (yaw) around the Y axis is for the adjustment device to adjust the left and right rotation angle of the component, and the rotation adjustment (roll) around the Z axis is for the adjustment device to adjust the forward and backward tilt angle of the component. In this way, it can be achieved that the relative position between the first chip 33 and the second chip 53 meets the preset range, the first lens 35 is aligned with the first chip 33, and the second lens 55 is aligned with the second chip 53.

[0135] The assembly method of the radar device 100 of the present application reduces the number of shells 10 by installing the transmitting module 30 and the receiving module 50 on the same shell 10, thereby reducing the installation and adjustment steps of the radar device 100, reducing the tolerance superposition in the active alignment process, and thus reducing the total optical tolerance in the active alignment process. On the one hand, the installation and adjustment efficiency of the radar device 100 is improved, and on the other hand, the installation and adjustment accuracy of the radar device 100 is improved, thereby improving the detection accuracy of the radar device 100.

[0136] See also Figure 1 , Figure 2 and Figure 7 In some embodiments, the first circuit board 31 with the first chip 33 installed and the second circuit board 51 with the second chip 53 installed are both installed on the side where the first surface 101 of the housing 10 is located, and cover the first cavity 11 and the second cavity 12 respectively, and make the relative position between the first chip 33 and the second chip 53 meet the preset range, including:

[0137] 031: One of the first circuit board 31 with the first chip 33 mounted thereon and the second circuit board 51 with the second chip 53 mounted thereon is fixedly mounted on the side where the first surface 101 of the housing 10 is located, and covers the first cavity 11 or the second cavity 12;

[0138] 033: attach the other of the first circuit board 31 on which the first chip 33 is mounted and the second circuit board 51 on which the second chip 53 is mounted to the side where the first surface 101 is located, and cover the second cavity 12 or the first cavity 11;

[0139] 035: Taking the chip on one of the first circuit board 31 and the second circuit board 51 fixed first as a reference, adjusting the position of the other of the first circuit board 31 on which the first chip 33 is mounted and the second circuit board 51 on which the second chip 53 is mounted, and monitoring the relative position between the first chip 33 and the second chip 53 by the image acquisition device 200; and

[0140] 037: When the relative position meets the preset range, stop adjusting and fix the other of the first circuit board 31 with the first chip 33 installed and the second circuit board 51 with the second chip 53 installed to the side where the first surface 101 of the shell 10 is located.

[0141] Specifically, in one embodiment, in method 031, the adjustment device fixes the first circuit board 31 installed with the first chip 33 on the side of the first surface 101 of the shell 10, and covers the first cavity 11. The installation method of the adjustment device can be a detachable connection or a non-detachable connection. In the present application, the first circuit board 31 is screwed to the shell 10 by screws. For example, during the screw locking process, the adjustment device can be a six-axis automatic screw locking robot. The six-axis automatic screw locking robot can automatically complete the screw locking work and reduce labor costs.

[0142] In the method of 033, with the position of the first chip 33 on the first circuit board 31 as a reference, the adjustment device adjusts the position of the second circuit board 51 on which the second chip 53 is installed, thereby adjusting the relative position of the second chip 53 relative to the first chip 33, so as to ensure that the first chip 33 and the second chip 53 meet the preset range. Among them, the image acquisition device 200 monitors the relative position between the first chip 33 and the second chip 53 in real time. The image acquisition device 200 of the present application is a charge coupled device (CCD) camera. The CCD camera can capture high-resolution images of the first chip 33 and the second chip 53, so as to accurately determine the relative position between the first chip 33 and the second chip 53, and ensure that the position of the first chip 33, the position of the second chip 53 and the relative position between the first chip 33 and the second chip 53 meet the preset range. But it is not limited to the distance between the center of the first chip 33 and the center of the second chip 53, the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53, the baseline length between the first chip 33 and the second chip 53, etc. In the method of 037, when the relative position satisfies the preset range, the adjustment device stops adjusting and fixes the second circuit board 51 with the second chip 53 mounted on the side of the first surface 101 of the shell 10 and covers the second cavity 12.

[0143] In another embodiment, in the method of 031, the adjustment device fixes the second circuit board 51 with the second chip 53 installed on the side of the first surface 101 of the housing 10, and covers the second cavity 12. The installation method of the adjustment device can be a detachable connection or a non-detachable connection. In the present application, the second circuit board 51 is locked with the housing 10 by screws; in the method of 033, with the position of the second chip 53 on the second circuit board 51 as a reference, the adjustment device adjusts the position of the first circuit board 31 with the first chip 33 installed, thereby adjusting the relative position of the first chip 33 relative to the second chip 53 to ensure that the first chip 33 and the second chip 53 meet the preset range. Among them, the image acquisition device 200 monitors the relative position between the first chip 33 and the second chip 53 in real time; in the method of 037, when the relative position meets the preset range, the adjustment device stops adjusting and fixes the first circuit board 31 with the first chip 33 installed on the side of the first surface 101 of the housing 10, and covers the first cavity 11.

[0144] The image acquisition device 200 detects the relative positions of the first chip 33 and the second chip 53 in real time to ensure that the first chip 33 and the second chip 53 meet the preset range. The receiving lens and the transmitting lens use the adjustment device provided by the active alignment process to ensure efficiency, without the need to develop new equipment, thereby reducing costs.

[0145] See also Figure 1 , Figure 2 and Figure 4 In some embodiments, the preset range includes an angle between an extension direction of the first chip 33 and an extension direction of the second chip 53 that is less than or equal to 1°; and a preset baseline length between the first chip 33 and the second chip 53, and an offset between an actual baseline length and a preset baseline length between the first chip 33 and the second chip 53 that is less than or equal to 300 μm.

[0146] Specifically, in the assembly method of the radar device 100, the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 may be 0.1°, 0.2°, 0.3°, 0.4°, 0.5°, 0.6°, 0.7°, 0.8°, 0.9° or 1°. If the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 is greater than 1°, the alignment of the optical signal emitted by the transmitting module 30 and the optical signal reflected by the object received by the receiving module 50 is inaccurate, the optical signal reflected by the object is difficult to be accurately received by the second chip 53, the loss of the optical signal during the transmission process increases, resulting in a decrease in the intensity and quality of the optical signal. If the angle between the extension direction of the first chip 33 and the extension direction of the second chip 53 is less than or equal to 1°, the optical signal emitted by the transmitting module 30 and the optical signal reflected by the object received by the receiving module 50 are accurately aligned, the optical signal reflected by the object can be accurately received by the second chip 53, and the loss of the optical signal during transmission is small, thereby ensuring the strength and quality of the optical signal reflected by the object received by the receiving module 50.

[0147] In the assembly method of the radar device 100, the actual baseline length between the first chip 33 and the second chip 53 is the length between the center of the first chip 33 and the center of the second chip 53, and the offset between the actual baseline length between the first chip 33 and the second chip 53 and the preset baseline length can be 10μm, 140μm, 150μm, 180μm, 200μm, 210μm, 240μm, 270μm, 290μm or 300μm. If the offset between the actual baseline length between the first chip 33 and the second chip 53 and the preset baseline length is greater than 300μm, the offset is too large, which may cause the detection accuracy of the radar device 100 to be low. The offset between the actual baseline length between the first chip 33 and the second chip 53 and the preset baseline length is less than or equal to 300μm, and the small offset can ensure the high detection accuracy of the radar device 100.

[0148] See also Figure 1 , Figure 2 and Figure 8In some embodiments, an active alignment process is used to install the first lens 35 and the second lens 55 in the first cavity 11 and the second cavity 12, respectively, and the first lens 35 is aligned with the first chip 33, and the second lens 55 is aligned with the second chip 53, including:

[0149] 051: Install one of the first lens 35 and the second lens 55 in the first cavity 11 or the second cavity 12 by using an active alignment process, and perform full curing to align one of the first lens 35 and the second lens 55 with the first chip 33 or the second chip 53;

[0150] 053: Using an active alignment process to install the other of the first lens 35 and the second lens 55 in the second cavity 12 or the first cavity 11, and semi-curing; and

[0151] 055: With the fully cured one of the first lens 35 and the second lens 55 as a reference, an active alignment process is used to adjust the other of the first lens 35 and the second lens 55 until the other of the first lens 35 and the second lens 55 is aligned with the second chip 53 or the first chip 33 and then fully cured.

[0152] Specifically, an active alignment process is used to install the first lens 35 and the second lens 55 in the first cavity 11 and the second cavity 12 respectively, and the first lens 35 is aligned with the first chip 33, and the second lens 55 is aligned with the second chip 53. A total of three active alignment processes will be performed, namely 051, 053 and 055.

[0153] In one embodiment, the first active alignment process uses the first chip 33 as a reference to align the first lens 35 with the first chip 33, the second active alignment process uses the second chip 53 as a reference to align the second lens 55 with the second chip 53 for the first time, and the third active alignment process uses the first lens 35 as a reference to align the second lens 55 with the second chip 53 for the second time. The 0511 method, 0531 method, and 0551 method described below are embodiments of this invention.

[0154] In another embodiment, the first active alignment process uses the second chip 53 as a reference to align the second lens 55 and the second chip 53, the second active alignment process uses the first chip 33 as a reference to align the first lens 35 and the first chip 33 for the first time, and the third active alignment process uses the second lens 55 as a reference to align the first lens 35 and the first chip 33 for the second time.

[0155] In the method of 051, an adjusting device (such as a holder) clamps and fixes the bottom of one of the first lens 35 and the second lens 55. When one of the first circuit board 31 with the first chip 33 and the second circuit board 51 with the second chip 53 is screwed to the housing 10, the adjusting device partially places the first lens 35 into the first cavity 11 with the center of the first chip 33 or the second chip 53 as a reference, and adjusts the relative position of the first lens 35 and the first chip 33 so that the first lens 35 is aligned with the first chip 33, or the adjusting device partially places the second lens 55 into the second cavity 12, and adjusts the relative position of the second lens 55 and the second chip 53 so that the second lens 55 is aligned with the second chip 53. In this process, the first detection system of the active alignment process detects the relative position of the first lens 35 and the first chip 33 in real time, or detects the relative position of the second lens 55 and the second chip 53 in real time, and the adjustment device continuously adjusts the relative position of the lens (one of the first lens 35 and the second lens 55) and the chip (one of the first chip 33 and the second chip 53) according to the detection result of the first detection system, so that the optical axis of the first lens 35 and the second lens 55 and the center deviation of the first chip 33 and the second chip 53 are less than the predetermined range, thereby completing the alignment. After alignment, the device for dispensing glue in the active alignment process dispenses glue at the place where one of the first flange part 351 and the second flange part 551 contacts the second surface 102, and ultraviolet (UV) curing is performed after dispensing. In this way, the alignment of one of the first lens 35 and the second lens 55 with one of the first chip 33 and the second chip 53, and the fixation of one of the first lens 35 and the second lens 55 can be achieved.

[0156] In the method of 053, the adjusting device clamps and fixes the bottom of the lens (one of the first lens 35 and the second lens 55) that is not aligned in the method of 051, and uses the center of the chip (one of the first chip 33 and the second chip 53) that is not aligned as a reference. The adjusting device adjusts the relative position of the lens and the chip that are not aligned in the method of 051, so that the lens and the chip that are not aligned are aligned. In this process, the first detection system detects the relative position of the lens and the chip that are not aligned in real time, and the adjusting device continuously adjusts the relative position of the lens and the chip that are not aligned according to the detection result of the first detection system, so that the deviation between the optical axis of the lens that are not aligned and the center of the chip that are not aligned is less than a predetermined range, thereby completing the alignment. The device used for dispensing glue in the post-alignment active alignment process dispenses glue at the place where the flange part (one of the first flange part 351 and the second flange part 551) of the lens that is not aligned and the second surface 102 are in conflict, and ultraviolet semi-curing is performed after dispensing. In this way, the first alignment of the optical axis of the lens that is not aligned and the chip that are not aligned can be achieved.

[0157] In the method of 055, the lens aligned in the method of 051 is used as a reference (one of the first lens 35 and the second lens 55), and the relative position of the lens and the chip after the first alignment in the method of 053 is adjusted so that the lens and the chip after the first alignment are aligned again. In this process, the first detection system detects the relative position of the lens and the chip after the first alignment in real time, and the adjustment device continuously adjusts the relative position of the lens and the chip after the first alignment according to the detection result of the first detection system, so that the optical axis of the lens after the first alignment and the center deviation of the chip after the first alignment are less than a predetermined range, thereby completing the alignment. The device used for dispensing glue in the active alignment process after alignment dispenses glue at the place where the flange part and the second surface 102 of the lens after the first alignment are in conflict, and ultraviolet curing is performed after dispensing. In this way, the second alignment of the lens and the chip after the first alignment can be achieved, and the lens after the two alignments can be fixed.

[0158] See also Figure 1 , Figure 2 and Fig. 9 In some embodiments, an active alignment process is used to install the first lens 35 and the second lens 55 in the first cavity 11 and the second cavity 12, respectively, and the first lens 35 is aligned with the first chip 33, and the second lens 55 is aligned with the second chip 53, including:

[0159] 0511: The first lens 35 is installed in the first cavity 11 by using an active alignment process, and fully cured so that one of the first lens 35 and the second lens 55 is aligned with the first chip 33;

[0160] 0531: Install the second lens 55 in the second cavity 12 by using an active alignment process, and perform semi-curing; and

[0161] 0551: With the first lens 35 as a reference, the second lens 55 is adjusted by using an active alignment process until the second lens 55 is aligned with the second chip 53 and then fully cured.

[0162] Specifically, in the method of 0511, the adjusting device clamps and fixes the bottom of the first lens 35. When the first circuit board 31 provided with the first chip 33 and the housing 10 are screwed, the adjusting device partially places the first lens 35 into the first cavity 11 with the center of the first chip 33 as a reference, and adjusts the relative position of the first lens 35 and the first chip 33 so that the first lens 35 is aligned with the first chip 33. In this process, the first detection system provided by the active alignment process detects the relative position of the first lens 35 and the first chip 33 in real time, and the adjusting device continuously adjusts the relative position of the first lens 35 and the first chip 33 according to the detection result of the first detection system, so that the deviation between the optical axis of the first lens 35 and the center of the first chip 33 is less than a predetermined range, thereby completing the alignment. After alignment, the device used for dispensing glue in the active alignment process dispenses glue at the place where the first flange portion 351 and the second surface 102 are in conflict, and ultraviolet curing is performed after dispensing. In this way, the alignment of the first lens 35 and the first chip 33 and the fixation of the first lens 35 can be achieved.

[0163] In the method of 0531, the adjusting device clamps and fixes the bottom of the second lens 55. When the second circuit board 51 provided with the second chip 53 and the housing 10 are screwed, the adjusting device adjusts the relative position of the second lens 55 and the second chip 53 with the center of the second chip 53 as a reference, so that the second lens 55 is aligned with the second chip 53. In this process, the first detection system detects the relative position of the second lens 55 and the second chip 53 in real time, and the adjusting device continuously adjusts the relative position of the second lens 55 and the second chip 53 according to the detection result of the first detection system, so that the deviation between the optical axis of the second lens 55 and the center of the second chip 53 is less than a predetermined range, thereby completing the alignment. The device used for dispensing glue in the active alignment process after alignment dispenses glue at the place where the second flange 551 and the second surface 102 are in conflict, and ultraviolet semi-curing is performed after dispensing. In this way, the first alignment of the second lens 55 and the second chip 53 can be achieved, wherein the semi-cured glue is not completely cured, so the adjusting device can continue to adjust the position of the second lens 55, and the alignment of the second lens 55 and the second chip 53 is further achieved through the method of 0551.

[0164] In the method of 0551, with the first lens 35 as a reference, the adjustment device adjusts the relative position of the second lens 55 and the second chip 53 so that the second lens 55 is aligned with the second chip 53. In this process, the first detection system detects the relative position of the second lens 55 and the second chip 53 in real time. The adjustment device continuously adjusts the relative position of the second lens 55 and the second chip 53 according to the detection result of the first detection system, so that the deviation between the optical axis of the second lens 55 and the center of the second chip 53 is less than a predetermined range, thereby completing the alignment. The device used for dispensing in the active alignment process after alignment dispenses glue at the place where the second flange portion 551 and the second surface 102 are in conflict, and ultraviolet curing is performed after dispensing. In this way, the second alignment of the second lens 55 and the second chip 53 and the fixation of the second lens 55 can be achieved.

[0165] See also Figure 1 , Figure 2 and Fig.10 In some embodiments, the first lens 35 is installed in the first cavity 11 by an active alignment process and fully cured so that one of the first lens 35 and the second lens 55 is aligned with the first chip 33, including:

[0166] 05111: placing the first lens 35 in the first cavity 11;

[0167] 05113: using an active alignment process to adjust the position of the first lens 35 in the first cavity 11, and using a first detection system to detect the far-field direction, collimation angle and divergence angle of the optical signal emitted by the first lens 35; and

[0168] 05115: When the far-field pointing direction, collimation angle and divergence angle respectively meet the preset first range, the preset second range and the preset third range, stop adjusting the position of the first lens 35 in the first cavity 11, and glue the connection between the first lens 35 and the shell 10 to fully cure.

[0169] Specifically, alignment in this application includes that the far-field direction, collimation angle and divergence angle of the optical signal emitted by the first lens 35 meet the preset first range, preset second range and preset third range respectively. In other embodiments of this application, alignment can be other conditions.

[0170] In the methods of 0511 and 05113, the first detection system arranges three sets of detection devices at three angles of 0°, +12° and -12° of the first detection system, and each set of detection devices is a combination of a lens and a detector. In other embodiments of the present application, the arrangement angle of the first detection system and the number of detection devices can be other schemes. The first detection system determines the far-field pointing, collimation angle and divergence angle of the light signal by detecting the width and position of the light spot displayed on the detector by the light signal emitted by the first lens 35. In this process, the adjustment device adjusts the position of the first lens 35 in the first cavity 11 by the far-field pointing, collimation angle and divergence angle of the light signal; in the method of 0515, when the far-field pointing, collimation angle and divergence angle meet the preset first range, the preset second range and the preset third range respectively, the adjustment device stops adjusting the position of the first lens 35 in the first cavity 11, and the glue dispensing device dispenses glue to fully cure the connection between the first lens 35 and the housing 10. In this way, the method can realize the alignment of the first lens 35 and the first chip 33, and ensure that the light signal emitted by the first lens 35 meets the accuracy requirements.

[0171] See also Figure 1 , Figure 2 and Figure 4 In some embodiments, the preset first range is less than or equal to 0.5°, the preset second range is less than or equal to 0.6°, and the preset third range is less than or equal to 24° and less than or equal to 26° (ie, 25°±1°).

[0172] Specifically, the preset first range is the range of the far-field pointing of the optical signal modulated by the first lens 35, and the preset first range can be 0.05°, 0.1°, 0.15°, 0.18°, 0.2°, 0.25°, 0.3°, 0.34°, 0.4° or 0.5°. If the preset first range is greater than 0.5°, the optical signal diverges too much in the far field, and the intensity of the optical signal decreases during propagation, affecting the detection distance and signal quality of the radar device 100. The preset first range can reduce the dispersion of the optical signal energy, ensure the signal strength of the optical signal, and thus improve the detection distance and signal quality.

[0173] The preset second range is the range of the collimation angle of the optical signal modulated by the first lens 35, and the preset second range can be 0.05°, 0.1°, 0.15°, 0.18°, 0.2°, 0.25°, 0.3°, 0.34°, 0.5° or 0.6°. If the preset second range is greater than 0.6°, the optical signal has a high degree of divergence during propagation, the focusing degree of the optical signal is poor, and the optical signal is easily affected by environmental factors (such as air flow and temperature changes), resulting in the propagation direction of the optical signal easily drifting, affecting the detection accuracy of the radar device 100. If the preset second range is less than or equal to 0.6°, the optical signal has a small degree of divergence during propagation, the focusing degree of the optical signal is good, and the propagation direction of the optical signal is not easy to drift, thereby ensuring the detection accuracy of the radar device 100.

[0174] The preset third range is the range of the divergence angle of the optical signal modulated by the first lens 35, and the preset third range can be 24°, 24.2°, 24.45°, 24.88°, 25°, 25.25°, 25.3°, 25.34°, 25.5° or 26°. If the divergence angle of the optical signal modulated by the first lens 35 is less than 24°, the energy of the optical signal is too concentrated, which limits the propagation range of the optical signal on the one hand, and easily generates excessive radiation in the partial area radiated by the optical signal on the other hand, which easily causes damage to objects in the area; if the preset third range is greater than 26°, the energy of the optical signal is too divergent, and the optical signal is easily interfered by other stray signals in the environment. The preset third range is 25°±1°, which can ensure that the energy of the optical signal is moderate, ensure the propagation range of the optical signal on the one hand, and not easily generate excessive radiation in the partial area radiated by the optical signal on the other hand, thus avoiding damage to objects in the area, and not easily being interfered by other stray signals in the environment.

[0175] See also Figure 1 , Figure 2 and Fig.11 In some embodiments, the second lens 55 is installed in the second cavity 12 by an active alignment process and semi-cured, including:

[0176] 05311: Place the second lens 55 in the second cavity 12;

[0177] 05313: Use active alignment process to adjust the position of the second lens 55 in the second cavity 12, and detect the offset between the optical axis of the second lens 55 and the center of the second chip 53 and the modulation transfer function value of the second lens 55;

[0178] 05315: When the offset and the modulation transfer function value of the second lens 55 satisfy the preset fourth range and the preset fifth range respectively, stop adjusting the position of the second lens 55 in the second cavity 12, and apply glue to semi-cured the connection between the second lens 55 and the shell 10.

[0179] Specifically, in the method of 05311, the adjustment device clamps and fixes the second lens 55, and accommodates the second lens 55 in the second cavity 12, so that the second lens 55 and the second cavity 12 achieve basic alignment, and the adjustment device clamps and fixes the second lens 55, and can automatically adjust the second lens 55 in six dimensions. In the method of 05313, the equipment of the active alignment process uses the specific pattern or feature on the calibration target, and adjusts the focus and direction of the laser signal through the telemeter, so that the specific pattern or feature on the calibration target can be received by the second lens 55 and modulated to the second chip 53 to form an actual image point, and the detection system determines the relative eccentricity of the lens according to the deviation between the actual image point and the theoretical image point, that is, the detection system determines the offset between the optical axis of the second lens 55 and the center of the second chip 53, and performs modulation transfer function value detection on the second lens 55 through five detection points of the second chip 53, wherein the modulation transfer function values ​​of the five monitoring points differ by no more than 10%. The five detection points include the center of the second chip 53 and four points at the edge of the second chip 53.

[0180] During the detection process, the adjustment device performs six-dimensional adjustment on the second lens 55 according to the offset between the optical axis of the second lens 55 and the center of the second chip 53 and the modulation transfer function value of the second lens 55, until the offset and the modulation transfer function value of the second lens 55 respectively meet the preset fourth range and the preset fifth range. In the method of 05315, when the offset and the modulation transfer function value of the second lens 55 respectively meet the preset fourth range and the preset fifth range, the adjustment device stops adjusting the position of the second lens 55 in the second cavity 12, and the glue dispensing device semi-solidifies the connection between the second lens 55 and the housing 10 by glue dispensing, thereby achieving the first alignment of the second lens 55 and the second chip 53.

[0181] See also Figure 1 , Figure 2 and Figure 4 In some embodiments, the preset fourth range is less than or equal to 300 μm, and the preset fifth range is greater than or equal to 0.55.

[0182] Specifically, the preset fourth range is the offset between the optical axis of the second lens 55 and the center of the second chip 53, which characterizes the alignment accuracy between the optical axis of the second lens 55 and the center of the second chip 53. The preset fourth range may be 0 μm, 140 μm, 150 μm, 180 μm, 200 μm, 210 μm, 240 μm, 270 μm, 290 μm or 300 μm. If the preset fourth range is greater than 300 μm, the distance between the optical axis of the second lens 55 and the center of the second chip 53 is too large, the alignment accuracy is low, and the optical signal reflected by the object is difficult to be accurately received by the second chip 53, thereby causing optical signal loss and distortion, affecting the detection accuracy of the radar device 100. If the preset fourth range is less than or equal to 300 μm, the distance between the optical axis of the second lens 55 and the center of the second chip 53 is small, the alignment accuracy is high, the optical signal reflected by the object can be accurately received by the second chip 53, and the optical signal loss and distortion are less, thereby ensuring the detection accuracy of the radar device 100.

[0183] The preset fifth range is the modulation transfer function value of the second lens group 555, which characterizes the transmission capability of the receiving module 50 where the second lens group 555 is located for the contrast of different spatial frequencies. The preset fifth range is between 0 and 1, and can measure the ratio of the contrast of the output image to the contrast of the input image. The preset fifth range can be 0.55, 0.61, 0.68, 0.73, 0.75, 0.81, 0.85, 0.93, 0.95 or 1. If the preset fifth range is less than 0.55, the second lens group 555 has a weak ability to transmit image details, the ratio of the contrast of the output image to the contrast of the input image is too small, the contrast of the image is not obvious, and it is easy to cause the details such as the edge and texture of the image to be blurred, the image resolution is insufficient, and the image quality is reduced. If the preset fifth range is greater than or equal to 0.55, the second lens group 555 has a high ability to transmit image details, a high ratio of the contrast of the output image to the contrast of the input image, obvious contrast between light and dark in the image, clear details such as image edges and textures, high image resolution, and high image quality.

[0184] See also Figure 1 , Figure 2 and Fig.12 In some embodiments, the second lens 55 is adjusted by an active alignment process with the first lens 35 as a reference until the second lens 55 is aligned with the second chip 53 and then fully cured, including:

[0185] 05511: The second lens 55 is adjusted to translate in a two-dimensional plane perpendicular to its optical axis until the optical signal emitted by the first chip 33 and reflected by the object converges to a predetermined area of ​​the second chip 53, and then the connection between the second lens 55 and the housing 10 is fully cured by applying glue.

[0186] Specifically, in the method of 05511, the adjustment device only performs two-dimensional translation adjustment on the second lens 55 in the X and Y directions to ensure that the optical signal emitted by the first chip 33 and reflected by the object converges to the predetermined area of ​​the second chip 53. In this application, the predetermined area is the 597*48 area of ​​the second chip 53. In this way, the second lens 55 and the second chip 53 can be further aligned on the basis of the method of 0531, thereby improving the alignment efficiency and the alignment accuracy.

[0187] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments of the present application without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A radar device (100), characterized in that: include: A shell (10) comprises a first surface (101) and a second surface (102) opposite to each other, the shell (10) being provided with a first cavity (11) and a second cavity (12) penetrating the first surface (101) and the second surface (102), the first cavity (11) and the second cavity (12) being arranged side by side; a transmitting module (30) accommodated in the first cavity (11), the transmitting module (30) being used to transmit an optical signal toward the outside of the radar device (100); and A receiving module (50) is accommodated in the second cavity (12), and the receiving module (50) is used to receive the optical signal reflected back by the object.

2. The radar device (100) according to claim 1, characterized in that The transmitting module (30) comprises: A first circuit board (31) is mounted on a side of the housing (10) where the first surface (101) is located, and covers the first cavity (11); a first chip (33), mounted on a side of the first circuit board (31) facing the first cavity (11), the first chip (33) being used to transmit an optical signal; and A first lens (35) is at least partially installed in the first cavity (11) and is aligned with the first chip (33).

3. The radar device (100) according to claim 2, characterized in that: A first flange portion (351) is provided on the outer side wall of the first lens (35), and the first flange portion (351) abuts against the second surface (102).

4. The radar device (100) according to claim 2, characterized in that: The far-field pointing direction of the optical signal modulated by the first lens (35) is less than or equal to 0.5°; and / or, The collimation angle of the optical signal modulated by the first lens (35) is less than or equal to 0.6°; and / or, The divergence angle of the optical signal modulated by the first lens (35) is greater than or equal to 24° and less than or equal to 26°.

5. The radar device (100) according to claim 2, characterized in that: The housing (10) further comprises a third surface (103) connecting the first surface (101) and the second surface (102); the radar device (100) further comprises: A shielding cover (70), the shielding cover (70) is installed on the third surface (103) and / or the first circuit board (31), and covers at least a portion of the first circuit board (31).

6. The radar device (100) according to claim 2, characterized in that: Also includes: A fixing plate (80), the fixing plate (80) being mounted on a side of the first circuit board (31) facing away from the first cavity (11).

7. The radar device (100) according to claim 6, characterized in that: The fixing plate (80) is a hard plate, used to strengthen the first circuit board (31); and / or, The fixing plate (80) is provided with a heat dissipation structure, and the heat dissipation structure is used to dissipate heat on the first circuit board (31); and / or, The fixing plate (80) is provided with a connection structure, and the connection structure is used to connect with external equipment.

8. The radar device (100) according to claim 2, characterized in that: Also includes: A flexible wire (90), the flexible wire (90) comprising a first connection end (91) and a second connection end (93), the first connection end (91) being snap-connected to the first circuit board (31), and the second connection end (93) being used to connect to a main control board of the radar device (100).

9. The radar device (100) according to claim 2, characterized in that: The first lens (35) comprises: A first lens barrel (353) is installed in the first cavity (11); and The first lens group (355) includes at least two lenses, and the first lens group (355) is accommodated in the first lens barrel (353).

10. The radar device (100) according to claim 2, characterized in that: The first chip (33) is used to emit at least one of 4-line laser beams, 8-line laser beams, 16-line laser beams, 32-line laser beams, 64-line laser beams, 96-line laser beams and 128-line laser beams.

11. The radar device (100) according to any one of claims 1 to 10, characterized in that: The receiving module (50) comprises: A second circuit board (51) is mounted on the side of the housing (10) where the first surface (101) is located, and covers the second cavity (12); a second chip (53), mounted on a side of the second circuit board (51) facing the second cavity (12), the second chip (53) being used to receive the optical signal reflected by the object to measure the distance; and A second lens (55) is installed in the second cavity (12) and aligned with the second chip (53).

12. The radar device (100) according to claim 11, characterized in that: A second flange portion (551) is provided on the outer side wall of the second lens (55), and the second flange portion (551) abuts against the second surface (102).

13. The radar device (100) according to claim 11, characterized in that: The offset between the optical axis of the second lens (55) and the center of the second chip (53) is less than or equal to 300 μm.

14. The radar device (100) according to claim 11, characterized in that: The second lens (55) comprises: A second lens barrel (553) is installed in the second cavity (12); and The second lens group (555) includes at least two lenses, and the second lens group (555) is accommodated in the second lens barrel (553).

15. The radar device (100) according to claim 1, characterized in that The transmitting module (30) includes a first chip (33), and the receiving module (50) includes a second chip (53); The angle between the extension direction of the first chip (33) and the extension direction of the second chip (53) is less than or equal to 1°; and / or, There is a preset baseline length between the first chip (33) and the second chip (53), and the offset between the actual baseline length between the first chip (33) and the second chip (53) and the preset baseline length is less than or equal to 300 μm.

16. The radar device (100) according to claim 1, characterized in that The transmitting module (30) comprises a first circuit board (31), the first circuit board (31) being mounted on a side of the housing (10) where the first surface (101) is located, and covering the first cavity (11); the receiving module (50) comprises a second circuit board (51), the second circuit board (51) being mounted on a side of the housing (10) where the first surface (101) is located, and covering the second cavity (12); the radar device (100) further comprises a shielding cover (70), the shielding cover (70) being mounted on the housing (10) and / or the circuit board, and covering at least a portion of the first circuit board (31); in the transmission direction of the optical signal, the second circuit board (51) is further away from the second surface (102) than the first circuit board (31).

17. A movable platform (1000), characterized in that: include: A movable platform (1000) body; and The radar device (100) according to any one of claims 1 to 16, wherein the radar device (100) is installed on the movable platform (1000) body.

18. The movable platform (1000) according to claim 17, characterized in that: The movable platform (1000) includes at least one of an aircraft, a vehicle, a robot, a ship, a camera, and a mobile phone.

19. A method for assembling a radar device (100), characterized in that: include: A shell (10) is provided, the shell (10) comprising a first surface (101) and a second surface (102) opposite to each other, the shell (10) being provided with a first cavity (11) and a second cavity (12) penetrating the first surface (101) and the second surface (102), the first cavity (11) and the second cavity (12) being arranged side by side; A first circuit board (31) mounted with a first chip (33) and a second circuit board (51) mounted with a second chip (53) are mounted on the side of the housing (10) where the first surface (101) is located, respectively covering the first cavity (11) and the second cavity (12), and making the relative position between the first chip (33) and the second chip (53) satisfy a preset range; and An active alignment process is used to install a first lens (35) and a second lens (55) in the first cavity (11) and the second cavity (12) respectively, and the first lens (35) is aligned with the first chip (33), and the second lens (55) is aligned with the second chip (53).

20. The assembly method according to claim 19, characterized in that: The method comprises installing a first circuit board (31) on which a first chip (33) is mounted and a second circuit board (51) on which a second chip (53) is mounted on a side where the first surface (101) of the housing (10) is located, and covering the first cavity (11) and the second cavity (12) respectively, and making the relative position between the first chip (33) and the second chip (53) satisfy a preset range, comprising: One of a first circuit board (31) mounted with a first chip (33) and a second circuit board (51) mounted with a second chip (53) is fixedly mounted on a side of the housing (10) where the first surface (101) is located, and covers the first cavity (11) or the second cavity (12); The other of a first circuit board (31) on which a first chip (33) is mounted and a second circuit board (51) on which a second chip (53) is mounted is attached to the side where the first surface (101) is located, and covers the second cavity (12) or the first cavity (11); Using the chip on one of the first circuit board (31) and the second circuit board (51) fixed first as a reference, adjusting the position of the other of the first circuit board (31) on which the first chip (33) is mounted and the second circuit board (51) on which the second chip (53) is mounted, and monitoring the relative position between the first chip (33) and the second chip (53) by means of an image acquisition device (200); and When the relative position satisfies the preset range, the adjustment is stopped and the other of the first circuit board (31) on which the first chip (33) is mounted and the second circuit board (51) on which the second chip (53) is mounted is fixed to the side where the first surface (101) of the housing (10) is located.

21. The assembly method according to claim 20, characterized in that: The preset range includes: The angle between the extension direction of the first chip (33) and the extension direction of the second chip (53) is less than or equal to 1°; There is a preset baseline length between the first chip (33) and the second chip (53), and the actual baseline length between the first chip (33) and the second chip (53) is a deviation of the preset baseline length that is less than or equal to 300 μm.

22. The assembly method according to claim 19, characterized in that: The method adopts an active alignment process to install the first lens (35) and the second lens (55) in the first cavity (11) and the second cavity (12) respectively, and aligns the first lens (35) with the first chip (33), and aligns the second lens (55) with the second chip (53), comprising: Using an active alignment process to install one of the first lens (35) and the second lens (55) in the first cavity (11) or the second cavity (12), and performing full curing to align one of the first lens (35) and the second lens (55) with the first chip (33) or the second chip (53); Using an active alignment process to install the other of the first lens (35) and the second lens (55) in the second cavity (12) or the first cavity (11), and perform semi-curing; and Taking the fully cured one of the first lens (35) and the second lens (55) as a reference, an active alignment process is used to adjust the other of the first lens (35) and the second lens (55) until the other of the first lens (35) and the second lens (55) is aligned with the second chip (53) or the first chip (33) and then fully cured.

23. The assembly method according to claim 19, characterized in that: The method adopts an active alignment process to install the first lens (35) and the second lens (55) in the first cavity (11) and the second cavity (12) respectively, and aligns the first lens (35) with the first chip (33), and aligns the second lens (55) with the second chip (53), comprising: The first lens (35) is installed in the first cavity (11) by using an active alignment process, and fully cured so that one of the first lens (35) and the second lens (55) is aligned with the first chip (33); The second lens (55) is installed in the second cavity (12) by using an active alignment process, and semi-cured; and Taking the first lens (35) as a reference, the second lens (55) is adjusted by using an active alignment process until the second lens (55) is aligned with the second chip (53) and then fully cured.

24. The assembly method according to claim 23, characterized in that: The method of installing the first lens (35) in the first cavity (11) by using an active alignment process and performing full curing so that one of the first lens (35) and the second lens (55) is aligned with the first chip (33) comprises: The first lens (35) is accommodated in the first cavity (11); An active alignment process is used to adjust the position of the first lens (35) in the first cavity (11), and a first detection system is used to detect the far-field direction, collimation angle and divergence angle of the optical signal emitted by the first lens (35); When the far-field pointing direction, the collimation angle and the divergence angle respectively satisfy a preset first range, a preset second range and a preset third range, the adjustment of the position of the first lens (35) in the first cavity (11) is stopped, and the connection between the first lens (35) and the housing (10) is fully cured by applying glue.

25. The assembly method according to claim 24, characterized in that: The preset first range is less than 0.5°, the preset second range is less than or equal to 0.6°, and the preset third range is less than or equal to 24° and less than or equal to 26°.

26. The assembly method according to claim 23, characterized in that: The method of installing the second lens (55) in the second cavity (12) by using an active alignment process and semi-curing the same comprises: The second lens (55) is accommodated in the second cavity (12); An active alignment process is used to adjust the position of the second lens (55) in the second cavity (12), and the offset between the optical axis of the second lens (55) and the center of the second chip (53) and the modulation transfer function value of the second lens (55) are detected; When the offset and the modulation transfer function value of the second lens (55) satisfy a preset fourth range and a preset fifth range respectively, the adjustment of the position of the second lens (55) in the second cavity (12) is stopped, and the connection between the second lens (55) and the housing (10) is semi-cured by applying glue.

27. The assembly method according to claim 26, characterized in that: The preset fourth range is less than or equal to 300 μm, and the preset fifth range is greater than or equal to 0.

55.

28. The assembly method according to claim 23, characterized in that: The method uses the first lens (35) as a reference, uses an active alignment process to adjust the second lens (55) until the second lens (55) is aligned with the second chip (53), and then performs full curing, including: The second lens (55) seat is translated and adjusted in a two-dimensional plane perpendicular to its optical axis until the optical signal emitted by the first chip (33) and reflected back by the object converges to a predetermined area of ​​the second chip (53), and then the connection between the second lens (55) and the housing (10) is fully cured by glue.

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